A high-power digital optical fiber repeater and base station

Abstract

The invention discloses a high-power digital optical fiber repeater and base station, wherein the repeater comprises a near-end machine, a far-end machine, a donor antenna, and a retransmission antenna, wherein the donor antenna is electromechanically connected to the near-end machine, the retransmission antenna is electromechanically connected to the far-end machine, and the near-end machine and the far-end machine are connected via optical fiber; the base station comprises a radio frequency remote module, a baseband processing unit and an antenna, wherein the antenna and the radio frequency remote module, and the radio frequency remote module and the baseband processing unit are all connected via optical fiber, and further comprises a cabinet, wherein the cabinet, the near-end machine, and the far-end machine all comprise a liquid cooling box, a bubble emitter, a bubble generator, a heat dissipation mechanism, and a collecting cover; the invention adopts an immersion liquid cooling method to dissipate heat and cool a near-end machine device or a far-end machine device, and a plurality of baseband processing units in the base station, thereby improving heat dissipation efficiency, meeting heat dissipation requirements, and improving service life.

Description

Technical Field

[0001] The invention belongs to the technical field of communication repeaters and base stations, and relates to a high-power digital optical fiber repeater and a base station. Background Art

[0002] Fiber optic repeater is a repeater that uses optical fiber to transmit signals. It uses the characteristics of low transmission loss, convenient wiring, and long-distance transmission. It can solve the problem of villages, towns, tourist areas, highways, etc. that cannot receive base station signals, as well as the signal coverage in large and super-large buildings. It is used in large high-rise regional buildings, communities, and other occasions with high requirements. Fiber optic repeater includes near-end machine and far-end machine, and a large number of electrical components are set in both the near-end machine and the far-end machine; especially in the field of 5G communication, the power consumption is very large, which is 2.5-4 times that of 4G communication. A large amount of heat will be generated in the near-end machine and the far-end machine of the fiber optic repeater. If the heat is not discharged in time, it will affect the service life of the near-end machine and the far-end machine. The existing fiber optic repeater is mostly naturally cooled by the outer shell, which has low heat dissipation efficiency and will still cause damage to its internal equipment; similarly, a large number of electrical components are also installed in the cabinet of the 5G communication base station, such as multiple BUUs, power supplies, etc. The multiple BUUs gathered will also generate a lot of heat when working, and the current air cooling method cannot meet its heat dissipation needs. Summary of the invention

[0003] In view of the above problems, the present invention proposes a high-power digital optical fiber repeater and base station, which well solve the problems in the prior art.

[0004] In order to achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: a high-power digital optical fiber repeater station, comprising a near-end machine, a far-end machine, a donor antenna, and a retransmission antenna, wherein the donor antenna is electromechanically connected to the near-end machine, the retransmission antenna is electromechanically connected to the far-end machine, the near-end machine and the far-end machine are connected via an optical fiber, and the near-end machine and the far-end machine both comprise:

[0005] A liquid cooling box is used to contain a cooling liquid, a proximal device or a distal device, wherein the liquid cooling box is filled with an insulating cooling liquid;

[0006] A bubble dispenser and a bubble generator are used to install a proximal device or a distal device, wherein the bubble dispenser is arranged at the bottom of the liquid cooling box, and the bubble generator can generate bubbles and transport them to the bubble dispenser, and the bubbles can rise along the surface of the proximal device or the distal device;

[0007] A heat dissipation mechanism is used to dissipate the heat in the liquid cooling box. The top of the liquid cooling box is connected to a heat dissipation pipe connected to the heat dissipation mechanism. The heat dissipation mechanism is connected to a connecting pipe that leads to the bottom of the liquid cooling box.

[0008] The collecting hood is used to collect the steam rising in the liquid cooling box. An air outlet is provided on one side of the collecting hood. The lower end of the collecting hood is connected to the top of the liquid cooling box. A collecting pipe is connected to the air outlet, and the collecting pipe is connected to the heat dissipation pipe.

[0009] Furthermore, the bubble emitter includes a base, a mounting seat integrally connected to the upper end of the base, a mounting groove opened on the mounting seat, and a first hose, a plurality of windows are opened on the bottom surface of the mounting groove, metal meshes are arranged in the windows, the first hose surrounds the outer bottom surface of the mounting groove, a plurality of air holes are opened on the first hose, and a plurality of vertical upward baffles are arranged on the opposite sides of the mounting groove.

[0010] Furthermore, the heat dissipation mechanism includes a heat dissipation box, a semiconductor refrigeration sheet arranged on a side of the heat dissipation box facing away from the liquid cooling box body, and a heat dissipation fan adjacent to the semiconductor refrigeration sheet and fixed on the heat dissipation box, the cooling surface of the semiconductor refrigeration sheet is in contact with the heat dissipation box, the heating surface of the semiconductor refrigeration sheet faces the heat dissipation fan, the heat dissipation pipe is connected to the top of the heat dissipation box, and the connecting pipe is connected to the bottom of the heat dissipation box.

[0011] Furthermore, a plurality of heat sinks which are parallel to each other and perpendicular to the semiconductor refrigeration plates are arranged in the heat dissipation box.

[0012] Furthermore, the bubble generator includes an air pump, a second hose connected to the air inlet of the air pump, and a third hose connected to the air outlet of the air pump. The second hose penetrates into one end of the heat dissipation pipe close to the heat dissipation box, and the third hose penetrates into the heat dissipation box and extends into the connecting pipe to connect with the first hose.

[0013] Furthermore, a plurality of heat dissipation fins are arranged on the heat dissipation pipe, and one end of the second hose extending into the heat dissipation pipe is fixed vertically downward by a support frame and extends to the top of the heat dissipation box.

[0014] Furthermore, a one-way valve is connected between the first hose and the third hose.

[0015] Furthermore, the air outlet is in an elongated strip shape, and a plurality of heat dissipation pipes are provided and are all connected to the collecting pipe.

[0016] The present invention also describes a base station, including a radio frequency remote module, a baseband processing unit and an antenna, wherein the antenna and the radio frequency remote module, and the radio frequency remote module and the baseband processing unit are connected via optical fibers, and further includes a cabinet, the liquid cooling box described in claim 1, the bubble dispenser, the bubble generator, the heat dissipation mechanism and the collection cover, wherein the liquid cooling box is installed inside the cabinet, a plurality of bubble dispensers are provided, and the baseband processing unit is installed in the bubble dispenser.

[0017] Furthermore, the heat dissipation mechanism is connected to an air outlet duct extending to the outside of the cabinet.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] In the present invention, an immersion liquid cooling method is used to dissipate heat and cool multiple baseband processing units in a near-end device or a far-end device or a base station, thereby improving the heat dissipation efficiency, meeting the heat dissipation requirements, and increasing the service life.

[0020] In the present invention, the bubble generator and the bubble diffuser can generate bubbles, and the number of bubbles is increased through the bubble diffuser, and then the bubbles rise along the surface of the proximal machine device or the distal machine device, while taking away the heat on the surface, so that the coolant near the surface of the proximal machine device or the distal machine device forms a turbulent zone, thereby improving the efficiency of heat dissipation; at the same time, the heat dissipation mechanism increases the cooling rate of the exhaust gas in the liquid cooling box, and can obtain gas with a lower temperature to enter the liquid cooling box, further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure inside the liquid cooling box of the present invention;

[0022] Figure 2 It is a structural schematic diagram of the bubble emitter in the present invention;

[0023] Figure 3 for Figure 2 AA section view in;

[0024] Figure 4 A top view of the liquid cooling box of the present invention;

[0025] Figure 5 for Figure 1 A magnified view of part B in FIG.

[0026] Figure 6 It is a schematic diagram of the connection between the second hose and the heat dissipation pipe of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure inside the cabinet of the base station in the present invention.

[0028] In the figure: 1-liquid cooling box; 2-cooling liquid; 3-heat dissipation pipe; 4-connecting pipe; 5-collecting cover; 6-air outlet; 7-collecting pipe; 8-base; 9-mounting seat; 10-mounting slot; 11-first hose; 12-metal mesh; 13-baffle; 14-heat dissipation box; 15-semiconductor refrigeration sheet; 16-cooling fan; 17-heat dissipation fin; 18-air pump; 19-second hose; 20-third hose; 21-heat dissipation fin; 22-support frame; 23-one-way valve; 24-cabinet; 25-air outlet pipe. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1 , Figure 4 As shown, a high-power digital optical fiber repeater described in the present invention includes a near-end machine, a far-end machine, a donor antenna, and a retransmission antenna. The donor antenna is electrically connected to the near-end machine, and the retransmission antenna is electrically connected to the far-end machine. The near-end machine and the far-end machine are connected through an optical fiber. The donor antenna receives a signal sent by a base station, and transmits it to the far-end machine after processing, and then transmits the signal to the retransmission antenna to transmit it to a mobile station. Conversely, the mobile station sends a signal to the retransmission antenna, and the retransmission antenna transmits the signal to the far-end machine. The far-end machine transmits the signal to the near-end machine through the optical fiber, and then transmits it to the base station through the donor antenna, thereby realizing communication interaction. The near-end machine and the far-end machine both include a liquid cooling box 1, a bubble emitter, a bubble generator, a heat dissipation mechanism, and a collection cover 5. The liquid cooling box 1 is composed of two shells, and a sealing strip is arranged between the two shells. The liquid cooling box 1 is filled with a cooling liquid 2. The bubble generator is installed on the outside of the liquid cooling box 1 to generate bubbles. The bubble emitter is fixed to the bottom of the liquid cooling box 1 by screws. The proximal machine device or the distal machine device can be installed in the bubble emitter. The bubbles generated by the bubble generator are transported to the bubble emitter, and the bubbles can rise along the surface of the proximal machine device or the distal machine device; the top of the liquid cooling box 1 is connected with a heat dissipation pipe 3 connected with the heat dissipation mechanism, and the heat dissipation mechanism is connected with a connecting pipe 4 that leads to the bottom of the liquid cooling box 1. An air outlet 6 is provided on one side of the collecting cover 5, and the lower end of the collecting cover 5 is connected with the top of the liquid cooling box 1. A collecting pipe 7 is connected to the air outlet 6, and the collecting pipe 7 is connected to the heat dissipation pipe 3; a plug interface connected to the proximal machine device or the distal machine device is provided on the side of the liquid cooling box 1, and a sealing strip and a sealant are provided at the connection between the plug interface and the liquid cooling box 1.

[0031] The above-mentioned proximal device and remote device are both composed of a motherboard, chips and electrical components, and a large amount of heat is generated when working. The coolant 2 in the liquid cooling box 1 is made of fluorinated liquid, which has good stability and chemical inertness; the coolant 2 immerses the bubble emitter, and the heat generated by the operation of the proximal device or the remote device is directly transferred to the coolant 2, and the coolant 2 absorbs the heat and evaporates. The heat is collected by the collection cover 5 along with the evaporated steam and enters the heat dissipation pipe 3, and is simultaneously conducted to the heat dissipation mechanism, cooling the steam and returning it to the liquid cooling box 1 through the connecting pipe 4, which can not only quickly cool down the device, but also quickly cool down the device. The evaporated steam can also obtain the coolant 2 with lower temperature, thereby reducing the temperature of the coolant 2 in the liquid-cooled box 1; furthermore, the bubble generator generates bubbles and transmits them to the bubble emitter, so that the number of bubbles increases and rises along the surface of the proximal device or the distal device, so that the bubbles with lower temperature quickly exchange heat with the surface of the proximal device or the distal device, thereby accelerating the heat exchange rate and improving the heat dissipation efficiency, and the turbulent zone generated by the rising bubbles can accelerate the dissipation of heat in the coolant 2; the present invention improves the heat dissipation efficiency of the proximal and distal devices in the repeater and increases their service life.

[0032] In the present invention, Figure 2 , Figure 3 As shown, the bubble emitter includes a base 8, a mounting seat 9 integrally connected to the upper end of the base 8, a mounting groove 10 provided on the mounting seat 9, and a first hose 11. Both sides of the mounting groove 10 are provided with slide grooves, and both sides of the proximal machine device or the distal machine device are installed in the slide grooves. A through hole is provided on the side of the mounting seat 9, and a through hole is provided on the proximal machine device or the distal machine device accordingly, and the proximal machine device and the mounting seat 9 are fixed by bolts. A plurality of windows are provided on the bottom surface of the mounting groove 10, and metal meshes 12 are provided in the windows. The first hose 11 is provided with a metal mesh 12 on the outer side of the mounting groove 10. The bottom surface is surrounded by a circle, and the first hose 11 is provided with a plurality of air holes; the first hose 11 receives the bubbles generated by the bubble generator, and blows them out through the air holes on the first hose 11, and passes through the metal mesh 12 to increase the number of bubbles; and the opposite sides of the mounting groove 10 are integrally provided with a plurality of vertically upward baffles 13, and the baffles 13 are located between adjacent windows. Bubbles are generated and rise between two adjacent baffles 13, so that the bubbles rise along the surfaces on both sides of the proximal device and the distal device, and continuously contact and collide with their surfaces, thereby realizing rapid heat exchange and improving heat dissipation efficiency.

[0033] In the present invention, Figure 1 and Figure 5As shown, the heat dissipation mechanism includes a heat dissipation box 14, a semiconductor refrigeration sheet 15 arranged on a side of the heat dissipation box 14 away from the liquid cooling box body 1, and a heat dissipation fan 16 adjacent to the semiconductor refrigeration sheet 15 and fixed on the heat dissipation box 14. The semiconductor refrigeration sheet 15 is connected to the side of the heat dissipation box 14 through thermal conductive silicone. The cooling surface of the semiconductor refrigeration sheet 15 fits the heat dissipation box 14, and the heating surface of the semiconductor refrigeration sheet 15 faces the heat dissipation fan 16. The heat dissipation pipe 3 is connected to the top of the heat dissipation box 14, and the connecting pipe 4 is connected to the bottom of the heat dissipation box 14; the cooling surface of the semiconductor refrigeration sheet 15 cools the heat dissipation box 14 to have a lower temperature. When the coolant 2 vapor enters the heat dissipation box 14 through the heat dissipation pipe 3, it will quickly cool down to become condensation and gather in the heat dissipation box 14, and exchange with the coolant 2 in the liquid cooling box body 1 through the connecting pipe 4, thereby reducing the temperature of the coolant 2 in the liquid cooling box body 1, realizing rapid cooling of the coolant 2, and improving the overall heat dissipation efficiency. The portion of the connecting pipe 4 extending into the heat sink 14 is provided with a through hole to facilitate the circulation of the coolant in the heat sink 14 into the liquid cooling box 1 .

[0034] Preferably, a plurality of heat sinks 17 which are parallel to each other and perpendicular to the semiconductor refrigeration fins 15 are arranged in the heat dissipation box 14 . The heat sinks 17 increase the heat exchange area of ​​the steam and improve the cooling efficiency of the steam.

[0035] In the present invention, Figure 1 , Figure 5 As shown, the bubble generator includes an air pump 18, a second hose 19 connected to the air inlet of the air pump 18, and a third hose 20 connected to the air outlet 6 of the air pump 18, the second hose 19 penetrates into the end of the heat dissipation pipe 3 close to the heat dissipation box 14, and the third hose 20 penetrates into the heat dissipation box 14 and extends to the connecting pipe 4 to be connected with the first hose 11; the air pump 18 draws air, and the air with lower temperature in the heat dissipation box 14 is drawn out through the second hose 19 and blown into the first hose 11 through the third hose 20, so that bubbles are continuously generated and blown into the bubble emitter; because the air pump 18 draws air, the circulation speed of the steam in the liquid cooling box 1 can be accelerated, the heat dissipation efficiency can be improved, and the pressure in the liquid cooling box 1 will not be changed, the stability of the entire system can be maintained, and the loss of the coolant 2 can also be prevented. The second hose 19 and the third hose 20 are coated with sealant at the positions where they penetrate into the heat dissipation pipe 3 and the heat dissipation box 14; and the connection between the collection cover 5 and the liquid cooling box 1, and the connection between the connecting pipe 4 and the liquid cooling box 1 are sealed, and sealant can be used specifically.

[0036] Preferably, the heat dissipation pipe 3 is provided with a plurality of heat dissipation fins 21, such as Figure 6As shown, one end of the second hose 19 extending to the heat dissipation pipe 3 is fixed vertically downward by a support frame 22 and extends to the top of the heat dissipation box 14; the heat dissipation fins 21 can further accelerate the heat dissipation of the steam passing through the heat dissipation pipe 3 and accelerate the overall heat dissipation rate; the port of the second hose 19 faces downward, which can prevent the second hose 19 from inhaling condensed coolant 2, thereby improving the service life and reliability of the air pump 18.

[0037] In the present invention, Figure 2 As shown, a one-way valve 23 is connected between the first hose 11 and the third hose 20. The one-way valve 23 can effectively prevent a portion of the coolant 2 from flowing back into the third hose 20, and can increase the pressure of air when it is discharged from the third hose 20, increase the pressure of bubbles discharged from the air holes of the first hose 11, and increase the rate of bubble generation.

[0038] In the present invention, the air outlet 6 is in an elongated shape, and the side of the collecting pipe 7 is also provided with an elongated opening, which is connected to the air outlet 6 by welding, thereby increasing the air outlet cross-sectional area and facilitating the discharge of steam. In addition, a plurality of heat dissipation pipes 3 are provided and are all connected to the collecting pipe 7, thereby increasing the heat dissipation area.

[0039] In the present invention, Figure 7 As shown, a base station is also described, including a radio frequency remote module, a baseband processing unit and an antenna. The antenna and the radio frequency remote module, as well as the radio frequency remote module and the baseband processing unit are connected by optical fibers. It also includes a cabinet 24, the above-mentioned liquid cooling box 1, the bubble dispenser, the bubble generator, the heat dissipation mechanism, the collection cover 5 and the mutual connection relationship. The liquid cooling box 1 is installed inside the cabinet 24. There are multiple bubble dispensers, and the baseband processing unit is installed in the bubble dispenser; so that the multiple baseband processing units in the base station also use the above-mentioned immersion liquid cooling method for heat dissipation, meet their heat dissipation requirements, and increase the service life of the base station. The cabinet 24 is also provided with a backup power supply, other relays and other electrical components required by the base station. The cabinet 24 is also provided with a heat dissipation window, cabinet 24, etc. Figure 7 Not shown in the figure, the working requirements of the base station and the cabinet 24 are met. These are all existing technologies and will not be repeated here.

[0040] Preferably, the heat dissipation mechanism is connected to an air outlet duct 25 extending to the outside of the cabinet 24, so that the hot air exhausted by the cooling fan 16 in the heat dissipation mechanism is discharged to the outside of the cabinet 24 along the air outlet duct 25, thereby avoiding the dissipated heat affecting the heat dissipation of other electrical components in the cabinet 24, thereby improving the reliability of the use of the cabinet 24.

[0041] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-power digital optical fiber repeater, comprising a near-end unit, a far-end unit, a donor antenna, and a retransmission antenna, wherein the donor antenna is electrically connected to the near-end unit, the retransmission antenna is electrically connected to the far-end unit, and the near-end unit and the far-end unit are connected via an optical fiber, characterized in that: The near-end machine and the far-end machine both include: A liquid cooling box is used to contain a cooling liquid, a proximal device or a distal device, wherein the liquid cooling box is filled with an insulating cooling liquid; A bubble dispenser and a bubble generator are used to install a proximal device or a distal device, wherein the bubble dispenser is arranged at the bottom of the liquid cooling box, and the bubble generator can generate bubbles and transport them to the bubble dispenser, and the bubbles can rise along the surface of the proximal device or the distal device; A heat dissipation mechanism is used to dissipate the heat in the liquid cooling box. The top of the liquid cooling box is connected to a heat dissipation pipe connected to the heat dissipation mechanism. The heat dissipation mechanism is connected to a connecting pipe that leads to the bottom of the liquid cooling box. A collecting hood is used to collect the steam rising in the liquid cooling box. An air outlet is provided on one side of the collecting hood. The lower end of the collecting hood is connected to the top of the liquid cooling box. A collecting pipe is connected to the air outlet. The collecting pipe is connected to the heat dissipation pipe. The bubble emitter includes a base, a mounting seat integrally connected to the upper end of the base, a mounting groove opened on the mounting seat, and a first hose. A plurality of windows are opened on the bottom surface of the mounting groove, and metal meshes are arranged in the windows. The first hose surrounds the outer bottom surface of the mounting groove, and a plurality of air holes are opened on the first hose. A plurality of vertical upward baffles are arranged on the opposite sides of the mounting groove.

2. The high-power digital optical fiber repeater according to claim 1, characterized in that: The heat dissipation mechanism includes a heat dissipation box, a semiconductor refrigeration sheet arranged on a side of the heat dissipation box facing away from the liquid cooling box body, and a heat dissipation fan adjacent to the semiconductor refrigeration sheet and fixed on the heat dissipation box. The cooling surface of the semiconductor refrigeration sheet is in contact with the heat dissipation box, and the heating surface of the semiconductor refrigeration sheet faces the heat dissipation fan. The heat dissipation pipe is connected to the top of the heat dissipation box, and the connecting pipe is connected to the bottom of the heat dissipation box.

3. The high-power digital optical fiber repeater according to claim 2, characterized in that: A plurality of heat sinks which are parallel to each other and perpendicular to the semiconductor refrigeration sheets are arranged in the heat sink.

4. The high-power digital optical fiber repeater according to claim 2, characterized in that: The bubble generator includes an air pump, a second hose connected to the air inlet of the air pump, and a third hose connected to the air outlet of the air pump. The second hose penetrates into one end of the heat dissipation pipe close to the heat dissipation box, and the third hose penetrates into the heat dissipation box and extends into the connecting pipe to connect with the first hose.

5. The high-power digital optical fiber repeater according to claim 4, characterized in that: The heat dissipation pipe is provided with a plurality of heat dissipation fins, and one end of the second hose extending into the heat dissipation pipe is fixed vertically downward by a support frame and extends to the top of the heat dissipation box.

6. The high-power digital optical fiber repeater according to claim 4, characterized in that: A one-way valve is connected between the first hose and the third hose.

7. The high-power digital optical fiber repeater according to claim 1, characterized in that: The air outlet is in a long strip shape, and a plurality of heat dissipation pipes are provided and are all connected to the collecting pipe.

8. A base station, comprising a radio remote module, a baseband processing unit and an antenna, wherein the antenna and the radio remote module, and the radio remote module and the baseband processing unit are connected via optical fibers, characterized in that: It also includes a cabinet, the liquid cooling box as described in claim 1, the bubble diffuser, the bubble generator, the heat dissipation mechanism and the collection cover, the liquid cooling box is installed inside the cabinet, a plurality of bubble diffusers are provided, and the baseband processing unit is installed in the bubble diffuser.

9. The base station according to claim 8, characterized in that: The heat dissipation mechanism is connected with an air outlet pipe extending to the outside of the cabinet.

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