A semiconductor laser obstacle removal device onboard a multi-rotor UAV

Abstract

The invention relates to a semiconductor laser obstacle clearing device carried by a multi-rotor unmanned aerial vehicle, comprising a body, a bracket, an obstacle clearing device, a mobile device and a shock absorbing mechanism, wherein the obstacle clearing device comprises a semiconductor laser, the semiconductor laser is arranged on the mobile device, the mobile device is arranged on a lower horizontal plate, and the shock absorbing mechanism is arranged on the inner surface of the mobile device; the invention has the advantages that the semiconductor laser emits laser to clear the hanging objects on the clamping block transmission line, and due to the small size and long life of the semiconductor laser, the weight of the whole device is greatly reduced, which is convenient for the multi-rotor unmanned aerial vehicle to carry, so as to better locate and clear the hanging objects on the transmission line, and solves the problem that the unmanned aerial vehicle's flame spraying technology is easy to cause fire when cleaning the hanging objects on the overhead transmission line and the problem that the ground laser remote obstacle clearing technology is bulky and inconvenient to carry.

Description

Technical Field

[0001] The invention relates to a semiconductor laser obstacle clearing device carried by a multi-rotor unmanned aerial vehicle. Background Art

[0002] Overhead transmission lines are installed on the ground and are insulated by insulators and air. As overhead transmission lines are exposed to the atmosphere and my country's climate is dominated by monsoon climate, especially under severe weather conditions such as typhoons, various floating foreign objects often entangle the wires in transmission lines in various places. Foreign objects hanging on transmission lines are one of the important factors that cause transmission line tripping.

[0003] In recent years, with the continuous enhancement of comprehensive national strength and continuous breakthroughs and innovations in the field of laser high-tech, the online obstacle removal technology of power transmission lines has developed rapidly. The floating objects on the transmission line mountains are removed through the use of drone flame-spraying technology and ground laser remote obstacle removal technology. Although drone flame-spraying technology is convenient and fast, it is very easy to cause fires and there are certain safety hazards. The ground laser remote obstacle removal technology is too bulky and cannot move synchronously with the drone inspection system in time. It requires the cooperation of multiple people for moving, and the labor intensity is high, resulting in low obstacle removal efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor laser obstacle removal device onboard a multi-rotor UAV, which can effectively reduce the weight of the entire device, thereby achieving synchronous movement with the UAV.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: a multi-rotor unmanned aerial vehicle airborne semiconductor laser obstacle clearing device, including a body, a bracket, an obstacle clearing device, a mobile device and a shock absorbing mechanism, the body includes a high-definition camera, the bracket includes an upper horizontal plate, a lower horizontal plate and a connecting piece arranged between the upper horizontal plate and the lower horizontal plate, and the lower surface of the body is fixedly mounted on the upper surface of the upper horizontal plate; the obstacle clearing device includes a semiconductor laser, the semiconductor laser is arranged on the mobile device, the mobile device is arranged on the lower horizontal plate to drive the semiconductor laser to move, the semiconductor laser is used to clear the hanging objects captured by the high-definition camera, and the shock absorbing mechanism is arranged on the inner surface of the mobile device and shocks the movement of the obstacle clearing device.

[0006] Preferably, the moving device includes a fixed frame movably connected to the lower horizontal plate, and a driving component for driving the fixed frame to move on the lower horizontal plate, the driving component is arranged on the lower horizontal plate, and the outer surface of the semiconductor laser is fixedly mounted on the inner wall of the fixed frame.

[0007] Preferably, the drive assembly includes a screw, a motor and a threaded sleeve, the screw and the motor are both arranged on the lower horizontal plate, the threaded sleeve is arranged on the screw, the motor and the screw are both provided with a bevel gear, the two bevel gears are meshed together, and the fixing frame is arranged on the threaded sleeve.

[0008] Preferably, the lower horizontal plate is provided with a groove, and the two ends of the screw are fixedly mounted on the inner wall of the groove through a first bearing respectively, the outer surface of the threaded sleeve is slidably engaged with the inner wall of the groove, and a support block for fixing the motor is provided on the lower horizontal plate close to the inner surface of the groove, and a limit switch is fixedly mounted on the inner wall of the groove.

[0009] Preferably, limit plates are fixedly installed on the lower horizontal plate near both sides of the inner surface of the groove, and a sliding groove is provided on one side surface of the limit plate. A protrusion matching the sliding groove is provided on the fixed frame, and a plurality of fixed grooves are provided on the inner wall of the sliding groove. A ball is fixedly installed on the inner wall of the fixed groove through a second bearing, and the outer surface of the ball is against the protrusion.

[0010] Preferably, buffer pads are fixedly sleeved on both ends of the limiting plate.

[0011] Preferably, the shock absorbing mechanism includes a first support plate, a second support plate and a shock absorbing spring, one side of the first support plate is fixedly connected to the outer surface of the semiconductor laser, the second support plate is fixedly connected to the inner surface of the fixing frame, a support rod is fixedly connected to the first support plate, the shock absorbing spring is arranged on the support rod, and one end of the shock absorbing spring is abutted against the first support plate, and the other end of the shock absorbing spring is abutted against the second support plate, a slot is provided on the inner surface of the fixing frame, and one end of the support rod passes through the second support plate and is slidably engaged with the inner wall of the slot.

[0012] Preferably, a buffer block is fixedly connected to the inner wall of the slot, and the other end of the support rod is slidably connected to the buffer block.

[0013] Preferably, a laser power supply connected to a semiconductor laser is provided on the lower surface of the upper horizontal plate.

[0014] Preferably, the connecting member includes a reinforcing rod supporting the upper transverse plate, a fixing rod fixed to the lower transverse plate, and a connecting rod arranged between the reinforcing rod and the fixing rod, and the connecting member is an integrated structure.

[0015] In summary, the advantages of the present invention are as follows: the obstacle clearing device is set up, because the obstacle clearing device is set up as a semiconductor laser, and the semiconductor laser emits laser to clear the hanging objects on the clamp block transmission line. Due to the small size and long life of the semiconductor laser, the weight of the entire device is greatly reduced, which is convenient for multi-rotor drones to carry it, so as to better locate and clear the hanging objects on the transmission line, and solve the problem that the cleaning of hanging objects on overhead transmission lines by drone flame spraying technology is easy to cause fire and the problem that the ground laser remote obstacle clearing technology is bulky and inconvenient to carry. Secondly, the semiconductor laser is set on the mobile device, which can realize the semiconductor The free movement of the laser on the lower horizontal plate can locate the hanging objects on the transmission line, making it easier for the semiconductor laser to clean the hanging objects and improving the cleaning efficiency. The setting of the shock-absorbing mechanism means that when the mobile device drives the semiconductor laser to move, the vibration of the semiconductor laser and the mobile device is slowed down by the shock-absorbing mechanism, thereby achieving the effect of reducing the vibration of the semiconductor laser. Finally, the bracket is configured as an upper horizontal plate, a lower horizontal plate and a connecting piece arranged between the upper horizontal plate and the lower horizontal plate, which can realize the independent installation of the machine body and the obstacle removal device on the bracket, without spatial interference between the machine body and the obstacle removal device, and the entire device has a compact structure, which greatly improves the overall stability during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the accompanying drawings:

[0017] Figure 1 This is a schematic structural diagram of a semiconductor laser obstacle removal device mounted on a multi-rotor UAV of the present invention;

[0018] Figure 2 It is a schematic diagram of the structure of the bracket in the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the laser power supply on the bracket in the present invention;

[0020] Figure 4 It is a schematic diagram of the structure of the fixed frame on the mobile device in the present invention;

[0021] Figure 5 It is a structural schematic diagram of the lower horizontal plate in the present invention;

[0022] Figure 6 It is a structural schematic diagram of the limiting plate in the present invention;

[0023] Figure 7 It is a structural schematic diagram of the fixing frame in the present invention;

[0024] Figure 8 It is a schematic diagram of the structure of the shock absorbing mechanism in the fixing frame of the present invention.

[0025] Reference numerals:

[0026] 1 body, 2 bracket, 21 upper horizontal plate, 22 lower horizontal plate, 23 connecting piece, 3 laser power supply, 31 semiconductor laser, 4 fixing frame, 401 groove, 402 screw, 403 bevel gear, 404 support block, 405 motor, 406 threaded sleeve, 407 limit switch, 408 limit plate, 409 slide groove, 410 fixed groove, 411 ball, 412 buffer pad, 5 first support plate, 51 second support plate, 52 support rod, 53 shock-absorbing spring, 54 slot, 55 buffer block. DETAILED DESCRIPTION

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, a semiconductor laser obstacle clearing device onboard a multi-rotor UAV includes a body 1, a bracket 2, an obstacle clearing device, a mobile device and a shock absorbing mechanism, wherein the body 1 includes a high-definition camera, the bracket 2 includes an upper horizontal plate 21, a lower horizontal plate 22 and a connecting piece 23 arranged between the upper horizontal plate 21 and the lower horizontal plate 22, and the lower surface of the body 1 is fixedly mounted on the upper surface of the upper horizontal plate 21; the obstacle clearing device includes a semiconductor laser 31, the semiconductor laser 31 is arranged on the mobile device, the mobile device is arranged on the lower horizontal plate 22 and is used to drive the semiconductor laser 31 to move, the semiconductor laser 31 is used to clear the hanging objects captured by the high-definition camera, and the shock absorbing mechanism is arranged on the inner surface of the mobile device and shocks the movement of the obstacle clearing device.

[0028] By setting up the obstacle clearing device, since the obstacle clearing device is set as a semiconductor laser 31, the semiconductor laser 31 emits laser to clear the hanging objects on the clamp block transmission line. Due to the small size and long life of the semiconductor laser 31, the weight of the entire device is greatly reduced, which is convenient for multi-rotor drones to carry it, so as to better locate and clear the hanging objects on the transmission line, and solve the problem that the cleaning of hanging objects on the overhead transmission line by the drone flame spraying technology is easy to cause fire and the problem that the ground laser remote obstacle clearing technology is bulky and inconvenient to carry. Secondly, the semiconductor laser 31 is set on the mobile device, which can realize the free movement of the semiconductor laser 31 on the lower horizontal plate 22. The mobile device can be moved to locate the hanging objects on the transmission line, which is convenient for the semiconductor laser 31 to clean the hanging objects and improve the cleaning efficiency. The setting of the shock-absorbing mechanism means that when the mobile device drives the semiconductor laser 31 to move, the vibration of the semiconductor laser 31 and the mobile device is slowed down by the shock-absorbing mechanism, thereby achieving the effect of reducing the vibration of the semiconductor laser 31. Finally, the bracket 2 is set to an upper horizontal plate 21, a lower horizontal plate 22 and a connecting piece 23 arranged between the upper horizontal plate 21 and the lower horizontal plate 22, which can realize that the body 1 and the obstacle removal device are independently installed on the bracket 2, and there is no spatial interference between the body 1 and the obstacle removal device. In addition, the entire device has a compact structure, which greatly improves the overall stability during use.

[0029] The moving device includes a fixing frame 4 movably connected to the lower cross plate 22, and a driving component for driving the fixing frame 4 to move on the lower cross plate 22. The driving component is arranged on the lower cross plate 22. The outer surface of the semiconductor laser 31 is fixedly mounted on the inner wall of the fixing frame 4. The fixing frame 4 is driven to move on the lower cross plate 22 by the driving component, so that the automatic movement of the fixing frame 4 can be realized. The fixing frame 4 can play the function of fixing and supporting the semiconductor laser 31, thereby ensuring the stability of the fixing frame 4 during the movement.

[0030] The driving assembly includes a screw 402, a motor 405 and a threaded sleeve 406. The screw 402 and the motor 405 are both arranged on the lower cross plate 22, and the threaded sleeve 406 is arranged on the screw 402. A bevel gear 403 is provided on the motor 405 and the screw 402, and the two bevel gears 403 are meshed and matched. The fixed frame 4 is arranged on the threaded sleeve 406. In this embodiment, the rotation of the motor 405 drives one of the bevel gears 403 to rotate, and then drives the other bevel gear 403 to rotate to drive the screw 402 to rotate. The rotation of the screw 402 drives the threaded sleeve 406 to move on the screw 402, and the movement of the threaded sleeve 406 drives the fixed frame 4 to move. The overall structure is compact and the driving effect is good. Secondly, due to the meshing transmission of the bevel gears 403, the stability of the rotation of the screw 402 can be guaranteed. The lower cross plate 22 is provided with a groove 401, and the two ends of the screw 402 are divided into The outer surface of the threaded sleeve 406 is slidably engaged with the inner wall of the groove 401. A support block 404 for fixing the motor 405 is provided on the lower cross plate 22 close to the inner surface of the groove 401. A limit switch 407 is fixedly installed on the inner wall of the groove 401. The rotation of the screw rod 402 can increase the stability of the rotation of the screw rod 402 through the connection between the first bearing and the inner wall of the groove 401. The support block 404 can play a role of fixed support for the motor 405. The outer surface of the threaded sleeve 406 is slidably engaged with the inner wall of the groove 401 to ensure the straightness of the threaded sleeve 406 when moving. Secondly, the setting of the limit switch 407, when the threaded sleeve 406 moves to contact with the limit switch 407, the limit switch 407 controls the motor 405 to stop running, thereby driving the semiconductor laser 31 to stop moving, and then limiting the movement of the semiconductor laser 31.

[0031] The lower horizontal plate 22 near the inner surface of the groove 401 is respectively fixed with a limit plate 408, and a slide groove 409 is provided on one side surface of the limit plate 408. The fixed frame 4 is provided with a protrusion that matches the slide groove 409. The inner wall of the slide groove 409 is provided with a plurality of fixed grooves 410. The inner wall of the fixed groove 410 is fixedly installed with a ball 411 through a second bearing. The outer surface of the ball 411 is against the protrusion. The two limit plates 408 are fixedly installed on the lower horizontal plate 22 by fastening bolts. The movement of the fixed frame 4 The protrusions on both sides of the fixing frame 4 are driven to move along the slide groove 409 on the limit plate 408, and the balls 411 in the fixing groove 410 contact the outer surfaces of the protrusions on both sides of the fixing frame 4, thereby reducing the friction between the protrusions on both sides of the fixing frame 4 and the slide groove 409, and reducing the loss of the fixing frame 4. The two ends of the limit plate 408 are respectively fixedly sleeved with buffer pads 412. The buffer pads 412 prevent the fixing frame 4 from moving quickly on the limit plate 408, causing the fixing frame 4 to collide with the inner wall of the slide groove 409, and at the same time reduce the impact force generated when the fixing frame 4 moves.

[0032] The damping mechanism comprises a first support plate 5, a second support plate 51 and a damping spring 53. One side of the first support plate 5 is fixedly connected to the outer surface of the semiconductor laser 31. The second support plate 51 is fixedly connected to the inner surface of the fixing frame 4. A support rod 52 is fixedly connected to the first support plate 5. The damping spring 53 is arranged on the support rod 52, and one end of the damping spring 53 abuts against the first support plate 5, and the other end of the damping spring 53 abuts against the second support plate 51. A card slot 54 is provided on the inner surface of the fixing frame 4. One end of the support rod 52 penetrates the second support plate 51 and then slides and engages with the inner wall of the card slot 54. In this embodiment, the semiconductor laser 31 is fixedly connected to the first support plate 5. The vibration generated by the body laser 31 during the movement drives the first support plate 5 to shake, and the shaking of the first support plate 5 causes the shock-absorbing spring 53 to deform and generate elastic force. At the same time, the shaking of the first support plate 5 drives the support rod 52 to move up and down along the inner wall of the second support plate 51 and the inner wall of the slot 54 respectively. The inner wall of the slot 54 is fixedly connected with a buffer block 55, and the other end of the support rod 52 is slidably connected to the buffer block 55. In this embodiment, due to the movement of the support rod 52 in the slot 54 to squeeze the buffer block 55, the elastic force generated by the deformation of the buffer block 55 reduces the direct impact of the support rod 52 on the fixed frame 4, and prevents the shock-absorbing spring 53 from producing excessive deformation.

[0033] The lower surface of the upper horizontal plate 21 is provided with a laser power supply 3 connected to the semiconductor laser 31. In this embodiment, the laser power supply 3 provides power 3 for the semiconductor laser 31, which is convenient for the semiconductor laser 31 to output laser, thereby clearing the hanging objects on the transmission line. The connecting member 23 includes a reinforcing rod supporting the upper horizontal plate 21, a fixing rod fixed on the lower horizontal plate 22, and a connecting rod arranged between the reinforcing rod and the fixing rod. The connecting member 23 is an integrated structure, which can simplify the installation process of the connecting member 23 and improve the installation strength of the connecting member 23. Secondly, the reinforcing rod can play a certain supporting role on the upper horizontal plate 21 and can ensure the flatness of the installation of the upper horizontal plate 21. The connecting rod can be set with different structures according to different installation requirements to adapt to different installation requirements.

[0034] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A semiconductor laser obstacle removal device mounted on a multi-rotor drone, comprising a body and a bracket, wherein the body comprises a high-definition camera, and is characterized in that: It also includes an obstacle removal device, a moving device and a shock absorbing mechanism, wherein the bracket includes an upper horizontal plate, a lower horizontal plate and a connecting piece arranged between the upper horizontal plate and the lower horizontal plate, and the lower surface of the body is fixedly mounted on the upper surface of the upper horizontal plate; the obstacle removal device includes a semiconductor laser, which is arranged on the moving device, and the moving device is arranged on the lower horizontal plate to drive the semiconductor laser to move, and the semiconductor laser is used to remove the floating objects captured by the high-definition camera, and the shock absorbing mechanism is arranged on the inner surface of the moving device and shocks the movement of the obstacle removal device; the shock absorbing mechanism includes a first support A support plate, a second support plate and a shock-absorbing spring, one side of the first support plate is fixedly connected to the outer surface of the semiconductor laser, the second support plate is fixedly connected to the inner surface of the fixing frame, a support rod is fixedly connected to the first support plate, the shock-absorbing spring is arranged on the support rod, and one end of the shock-absorbing spring is against the first support plate, and the other end of the shock-absorbing spring is against the second support plate, a slot is provided on the inner surface of the fixing frame, one end of the support rod passes through the second support plate and is slidably engaged with the inner wall of the slot; a buffer block is fixedly connected to the inner wall of the slot, and the other end of the support rod is slidably connected to the buffer block.

2. The semiconductor laser obstacle removal device on a multi-rotor drone according to claim 1, characterized in that: The moving device includes a fixing frame movably connected to the lower horizontal plate, and a driving component for driving the fixing frame to move on the lower horizontal plate. The driving component is arranged on the lower horizontal plate, and the outer surface of the semiconductor laser is fixedly mounted on the inner wall of the fixing frame.

3. The semiconductor laser obstacle removal device on a multi-rotor drone according to claim 2, characterized in that: The driving assembly includes a screw, a motor and a threaded sleeve. The screw and the motor are both arranged on the lower horizontal plate. The threaded sleeve is arranged on the screw. A bevel gear is provided on the motor and the screw. The two bevel gears are meshed and matched. The fixing frame is arranged on the threaded sleeve.

4. The semiconductor laser obstacle removal device onboard a multi-rotor drone according to claim 3 is characterized in that: The lower horizontal plate is provided with a groove, and the two ends of the screw are fixedly mounted on the inner wall of the groove through the first bearing respectively. The outer surface of the threaded sleeve is slidably engaged with the inner wall of the groove. A support block for fixing the motor is provided on the lower horizontal plate close to the inner surface of the groove, and a limit switch is fixedly mounted on the inner wall of the groove.

5. The semiconductor laser obstacle removal device onboard a multi-rotor UAV according to claim 4, characterized in that: Limiting plates are fixedly installed on the lower horizontal plate near both sides of the inner surface of the groove, and a sliding groove is provided on one side surface of the limiting plate. A protrusion matching the sliding groove is provided on the fixing frame. A plurality of fixing grooves are provided on the inner wall of the sliding groove. A ball is fixedly installed on the inner wall of the fixing groove through a second bearing, and the outer surface of the ball is against the protrusion.

6. The semiconductor laser obstacle removal device on a multi-rotor drone according to claim 5, characterized in that: Buffer pads are fixedly sleeved on both ends of the limiting plate.

7. The semiconductor laser obstacle removal device on a multi-rotor drone according to claim 1, characterized in that: A laser power supply connected to the semiconductor laser is arranged on the lower surface of the upper horizontal plate.

8. The semiconductor laser obstacle removal device on a multi-rotor drone according to claim 1, characterized in that: The connecting member comprises a reinforcing rod supporting the upper transverse plate, a fixing rod fixed on the lower transverse plate, and a connecting rod arranged between the reinforcing rod and the fixing rod, and the connecting member is an integrated structure.

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