A backing plate, a cover plate and a lubricating heat dissipation adhesive

Abstract

The present invention provides a pad, a cover plate and a lubricating heat-dissipating adhesive, wherein the pad comprises a wood fiber board and facial paper attached to the upper and lower surfaces of the wood fiber board, an adhesive layer is arranged between the wood fiber board and the facial paper, the adhesive layer is an adhesive layer formed after the lubricating heat-dissipating adhesive is heated and cured, and the lubricating heat-dissipating adhesive comprises polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent. In the present invention, the lubricating heat-dissipating adhesive can not only ensure the bonding force between the facial paper and the wood fiber board, but also give full play to the overall heat dissipation and lubrication effect of the functional materials polyethylene oxide and polyethylene glycol. Therefore, when the pad prepared based on the lubricating heat-dissipating adhesive of the present invention is used for PCB drilling, the pad can effectively reduce the temperature of the drill needle, thereby reducing the wear of the drill bit and reducing the adhesion of drill cuttings to the drill needle, and the quality of the hole wall is significantly improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB drilling, and in particular to a backing plate, a cover plate and a lubricating and heat-dissipating adhesive. Technical Background

[0002] The prior art usually requires the use of adhesives when making cover plates and backing plates for drilling printed circuit boards (PCBs) with high heat dissipation characteristics. The adhesive itself is required to have good lubrication and heat dissipation effects, exert high heat dissipation characteristics during drilling, reduce the temperature of the drill bit, thereby reducing the wear of the drill bit and reducing the adhesion of drill chips to the drill bit, which is more conducive to chip removal, thereby improving the quality of the PCB drilling hole wall and enhancing the reliability of the circuit board.

[0003] The adhesives used in existing cover plates and pads mostly use water-based polyurethane, water-based acrylic, water-based epoxy resin, etc. as the main resin, and then add materials with heat dissipation function, such as polyethylene oxide, polyethylene glycol, etc. The main function of the main resin is to improve the bonding strength between the film and the substrate (paper substrate, metal substrate), and the amount added accounts for more than 30% of the solid content of the entire system. The main resin itself has no heat dissipation function, and its presence will greatly reduce the overall heat dissipation effect of the adhesive, making it difficult for the cover pad to effectively reduce the temperature of the drill bit, and it is unable to reduce the wear of the drill bit and reduce the adhesion of drill cuttings to the drill bit, and the improvement of the hole wall quality is not obvious.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a pad, a cover plate and a lubricating and heat-dissipating adhesive, aiming to solve the problem that the existing adhesive used to prepare the cover pad has poor heat dissipation effect, resulting in drill bit wear and poor drilling quality.

[0006] The technical solution of the present invention is as follows:

[0007] A pad includes a fiberboard and facial paper attached to the upper and lower surfaces of the fiberboard, an adhesive layer is provided between the fiberboard and the facial paper, the adhesive layer is an adhesive layer formed by heating and curing a lubricating and heat-dissipating adhesive, and the lubricating and heat-dissipating adhesive includes polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0008] The pad, wherein the lubricating heat dissipating adhesive comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of an aqueous amino coupling agent, 0.5-5 parts of a polyether surfactant and 100-150 parts of a hydrophilic solvent.

[0009] The pad, wherein the water-based amino coupling agent is one or more of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; and / or the hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone; and / or the polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether.

[0010] The pad, wherein the molecular weight of the polyethylene oxide is 10,000-500,000; and / or the molecular weight of the polyethylene glycol is 2,000-20,000.

[0011] A cover plate includes a substrate and an adhesive layer arranged on the substrate, wherein the adhesive layer is an adhesive layer formed by heating and curing a lubricating heat-dissipating adhesive, and the lubricating heat-dissipating adhesive includes polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0012] The cover plate, wherein the heat dissipation adhesive comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of an aqueous amino coupling agent, 0.5-5 parts of a polyether surfactant, and 100-150 parts of a hydrophilic solvent.

[0013] The cover plate, wherein the substrate is an aluminum sheet, an iron sheet, a phenolic plate, a urea-formaldehyde plate or a cold-punched plate.

[0014] A lubricating heat dissipating adhesive comprises polyethylene oxide, polyethylene glycol, a water-based amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0015] The lubricating heat dissipating adhesive comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of an aqueous amino coupling agent, 0.5-5 parts of a polyether surfactant and 100-150 parts of a hydrophilic solvent.

[0016] The lubricating and heat-dissipating adhesive, wherein the water-based amino coupling agent is one or more of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; and / or the hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone; and / or the polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether.

[0017] Beneficial effects: The present invention provides a pad, which includes a fiberboard and facial paper attached to the upper and lower surfaces of the fiberboard, an adhesive layer is arranged between the fiberboard and the facial paper, and the adhesive layer is an adhesive layer formed after the lubricating heat-dissipating adhesive is heated and cured, and the lubricating heat-dissipating adhesive includes polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent. The heat-dissipating adhesive provided by the present invention can not only ensure the bonding force between the facial paper and the fiberboard, but also give full play to the overall heat dissipation and lubrication effect of the functional materials polyethylene oxide and polyethylene glycol. Therefore, when the pad prepared based on the heat-dissipating adhesive of the present invention is used for PCB drilling, the pad can effectively reduce the temperature of the drill needle, thereby reducing the wear of the drill bit and reducing the adhesion of drill cuttings to the drill needle, and the quality of the hole wall is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The schematic diagram is a schematic diagram of the ring-opening reaction between the water-based amino coupling agent in the heat dissipation adhesive of the present invention and the epoxy group in the polyethylene oxide.

[0019] Figure 2 The present invention is a schematic structural diagram of a pad. DETAILED DESCRIPTION

[0020] The present invention provides a backing plate, a cover plate and a lubricating heat dissipation adhesive. To make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] The invention provides a lubricating heat dissipation adhesive, which comprises polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0022] The lubricating heat dissipating adhesive of the present invention uses polyethylene oxide with lubricating heat dissipating function as the main resin, adds a water-based amino coupling agent as a curing agent to improve its bonding strength, reduces the surface tension of the adhesive by adding a polyether surfactant to the formula, and further improves the heat dissipating effect of the adhesive by adding a functional resin polyethylene glycol to the formula. In the present invention, the polyethylene oxide is a polyoxyethylene (C 2 H 4 O) Linear polyether formed by ring-opening polymerization, the structural formula is -[-CH 2 ─CH 2 The crystallinity of existing polyethylene oxide can be as high as 95%, that is, the existing polyethylene oxide still contains a large number of epoxy groups that have not undergone polymerization ring-opening reaction. The present invention utilizes the non-crystallized part of polyethylene oxide. By adding a water-based amino coupling agent, the active hydrogen on the amino group in the water-based amino coupling agent can react with the epoxy group in polyethylene oxide during the heating process. Figure 1 The ring-opening reaction shown forms a three-dimensional network structure, so that it has better bonding properties after curing, ensuring that the lubricating heat-dissipating adhesive has excellent bonding strength to the surfaces of metal and non-metal materials.

[0023] Furthermore, the polyethylene oxide and polyethylene glycol in the lubricating heat dissipation adhesive of the present invention are both high heat dissipation functional materials with a suitable low melting point (50°C-70°C) and a relatively high thermal transition enthalpy (above 160J / g), and the melting point of polyethylene glycol (about 60°C) is lower than that of polyethylene oxide (about 65°C), and the thermal transition enthalpy of polyethylene glycol (about 190J / g) is higher than that of polyethylene oxide (about 165J / g). The resin system made of these two materials in the present invention has a higher heat dissipation driving force. Therefore, the lubricating heat dissipation adhesive provided by the present invention not only ensures better adhesion with the substrate, but also improves its overall lubrication and heat dissipation effect.

[0024] Furthermore, after adding a polyether surfactant to the lubricating heat dissipating adhesive, the surface tension of the lubricating heat dissipating adhesive can be effectively reduced, thereby solving the problem of shrinkage holes after the lubricating heat dissipating adhesive is coated.

[0025] In some embodiments, the lubricating heat dissipation adhesive includes 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of water-based amino coupling agent, 0.5-5 parts of polyether surfactant and 100-150 parts of hydrophilic solvent by weight. Within the formula range defined in this embodiment, the water-based amino coupling agent can fully react with the epoxy group in the polyethylene oxide to form a three-dimensional network structure molecule with better bonding properties, and the lubricating heat dissipation effect of the heat dissipation adhesive is optimal. In this embodiment, if the proportion of the polyethylene oxide is too low, the lubricating heat dissipation adhesive formed has insufficient bonding force on the substrate; if the proportion of the polyethylene oxide is too high, the heat dissipation effect of the lubricating heat dissipation adhesive will be relatively reduced. In this embodiment, if the proportion of polyethylene glycol is too low, the heat dissipation effect of the lubricating heat dissipation adhesive will be relatively reduced; if the proportion of polyethylene glycol is too high, the bonding force of the lubricating heat dissipation adhesive to the substrate will be reduced. In this embodiment, if the proportion of the water-based amino coupling agent is too low, the bonding force of the lubricating heat dissipating adhesive to the substrate will be reduced; if the proportion of the water-based amino coupling agent is too high, the water-based amino coupling agent will cause stratification problems. In this embodiment, if the proportion of the polyether surfactant is too low, shrinkage problems are likely to occur when applying the lubricating heat dissipating adhesive; if the proportion of the polyether surfactant is too high, the bonding force of the adhesive to the substrate is insufficient. In this embodiment, if the proportion of the hydrophilic solvent is too low, the viscosity of the lubricating heat dissipating adhesive is too high, resulting in difficulty in coating; if the proportion of the hydrophilic solvent is too high, the problem of difficulty in coating will also occur because the viscosity of the lubricating heat dissipating adhesive is too low.

[0026] In some embodiments, the aqueous amino coupling agent is 3-aminopropyltriethoxysilane (structural formula: ), 3-aminopropyltrimethoxysilane (structural formula: ) and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane (structural formula: ), but not limited thereto. In this embodiment, the amino group in the water-based amino coupling agent has at least two active hydrogens, and the two active hydrogens can respectively undergo a ring-opening reaction with two epoxy groups in a single polyethylene oxide, and the two active hydrogens can also respectively undergo a ring-opening reaction with single epoxy groups in two polyethylene oxides. Therefore, the water-based amino coupling agent and the polyethylene oxide can be cross-linked with each other after the ring-opening reaction, thereby forming a three-dimensional network structure with better bonding properties.

[0027] In some embodiments, the molecular weight of the polyethylene oxide is 10,000-500,000. In the polyethylene oxide molecular weight defined in this embodiment, the lower the molecular weight of the polyethylene oxide, the lower its melting point and the stronger the heat dissipation driving force. Therefore, in this embodiment, the molecular weight of the polyethylene oxide is preferably 10,000-100,000.

[0028] In some embodiments, the molecular weight of the polyethylene glycol is 2000-20000. Similarly, in the molecular weight of the polyethylene glycol defined in this embodiment, the lower the molecular weight of the polyethylene glycol, the lower its melting point and the stronger the heat dissipation driving force. Therefore, in this embodiment, the molecular weight of the polyethylene glycol is preferably 2000-8000.

[0029] In some embodiments, the hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone, but is not limited thereto, preferably water, or a mixture of water and ethanol.

[0030] In some embodiments, the polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether, but is not limited thereto.

[0031] In some embodiments, a method for preparing the lubricating heat dissipating adhesive as described above is also provided, comprising the steps of: dissolving 10-30 parts of polyethylene oxide in 70-90 parts of a hydrophilic solvent, and slowly stirring until completely dissolved; continuing to add 10-30 parts of polyethylene glycol, and stirring thoroughly to dissolve completely; then adding 0.2-5 parts of an aqueous amino coupling agent, and stirring thoroughly to dissolve completely; then adding 0.5-5 parts of a polyether surfactant, and stirring thoroughly to dissolve completely; filtering 1-2 times using a 40-120 mesh filter; standing to defoam for more than 12 hours; the liquid after standing to defoam is the final desired lubricating heat dissipating adhesive.

[0032] Based on the lubricating heat dissipating adhesive, the present invention also provides a pad, such as Figure 2 As shown, it includes a wood fiber board 10 and facial paper 20 attached to the upper and lower surfaces of the wood fiber board 10, an adhesive layer 30 is arranged between the wood fiber board 10 and the facial paper 20, and the adhesive layer 30 is an adhesive layer formed after the lubricating heat-dissipating adhesive is heated and cured. The lubricating heat-dissipating adhesive includes polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0033] The adhesive layer in this embodiment is formed by heating and curing the lubricating heat-dissipating adhesive. During the heating and curing process of the lubricating heat-dissipating adhesive, the active hydrogen on the amino group in the water-based amino coupling agent can react with the epoxy group in the polyethylene oxide. Figure 1The ring-opening reaction shown forms a three-dimensional network structure, so that it has better bonding properties after curing, and can firmly adhere the facial tissue to the wood fiber board; and in addition to the functional polyethylene oxide, the lubricating and heat-dissipating adhesive in this embodiment also contains polyethylene glycol with better lubrication and heat dissipation effect and a polyether surfactant that can reduce the surface tension of the adhesive. Therefore, when the lubricating and heat-dissipating adhesive is used to prepare a pad, the lubricating and heat-dissipating adhesive can not only ensure the bonding force between the facial tissue and the wood fiber board, but also give full play to the overall heat dissipation and lubrication effect of the functional materials polyethylene oxide and polyethylene glycol. In other words, when the pad provided by the present invention is used for PCB drilling, the pad can effectively reduce the temperature of the drill needle, thereby reducing the wear of the drill bit and reducing the adhesion of drill cuttings to the drill needle, and the quality of the hole wall is significantly improved.

[0034] Furthermore, if Figure 1 As shown, after the active hydrogen on the amino group in the water-based amino coupling agent undergoes a ring-opening reaction with the epoxy group in the polyethylene oxide, the three-dimensional network structure molecules formed will have hydrolyzable methoxy or ethoxy groups, which can be automatically hydrolyzed in the presence of water. Therefore, when the pad is used for PCB drilling, the trace amount of heat dissipation adhesive adhered to the hole wall can be easily hydrolyzed and removed during the wet processing of the hole wall such as copper deposition and electroplating, thereby improving the drilling efficiency.

[0035] In the present embodiment, the aqueous amino coupling agent is one or more of 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane and N-(2-aminoethyl)-3-aminopropyl methyl dimethoxysilane, but not limited thereto. The hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone, but not limited thereto. It is preferably water, or a mixture of water and ethanol. The molecular weight of the polyethylene oxide is 10,000-500,000, preferably 10,000-100,000 with a low molecular weight. The molecular weight of the polyethylene glycol is 2000-20000, preferably 2000-8000 with a low molecular weight. The polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether, but not limited thereto. The paper is one or more of release paper, titanium white paper, kraft paper, balanced paper and bleached wood pulp paper, but not limited thereto.

[0036] In some embodiments, a pad is also provided, which includes a fiberboard and facial paper attached to the upper and lower surfaces of the fiberboard, an adhesive layer is arranged between the fiberboard and the facial paper, and the adhesive layer is an adhesive layer formed after the lubricating and heat-dissipating adhesive is heated and cured. The lubricating and heat-dissipating adhesive includes 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of aqueous amino coupling agent, 0.5-5 parts of polyether surfactant and 100-150 parts of hydrophilic solvent by weight.

[0037] In some embodiments, a method for preparing a pad is also provided, which includes the steps of: first preparing a lubricating heat-dissipating adhesive with polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant, and a hydrophilic solvent; then coating the heat-dissipating adhesive on a face paper to obtain a coated face paper; after baking the coated face paper, the coated face paper is placed with the adhesive surface facing the fiberboard, and the coated face paper is respectively attached to the upper and lower surfaces of the fiberboard and subjected to a heat pressing treatment to obtain the pad.

[0038] In some embodiments, a cover plate is also provided, which includes a substrate and an adhesive layer arranged on the substrate, wherein the adhesive layer is an adhesive layer formed after the lubricating heat-dissipating adhesive is heated and cured, and the lubricating heat-dissipating adhesive includes polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent.

[0039] The adhesive layer in this embodiment is formed by heating and curing the lubricating heat-dissipating adhesive. During the heating and curing process of the lubricating heat-dissipating adhesive, the active hydrogen on the amino group in the water-based amino coupling agent can react with the epoxy group in the polyethylene oxide. Figure 1 The ring-opening reaction shown forms a three-dimensional network structure, so that it has better bonding properties after curing, and can firmly adhere the facial tissue to the wood fiber board; and in addition to the functional polyethylene oxide, the lubricating and heat-dissipating adhesive in this embodiment also contains polyethylene glycol with better lubrication and heat dissipation effect and a polyether surfactant that can reduce the surface tension of the adhesive. Therefore, when the lubricating and heat-dissipating adhesive is used to prepare a cover plate, the adhesive layer formed by the lubricating and heat-dissipating adhesive can be stably bonded to the substrate, and can also give full play to the overall heat dissipation and lubrication effect of the functional materials polyethylene oxide and polyethylene glycol. In other words, when the cover plate provided by the present invention is used for PCB drilling, the cover plate can effectively reduce the temperature of the drill needle, thereby reducing the wear of the drill bit and reducing the adhesion of drill cuttings to the drill needle, and the quality of the hole wall is significantly improved.

[0040] Furthermore, if Figure 1 As shown, after the active hydrogen on the amino group in the water-based amino coupling agent undergoes a ring-opening reaction with the epoxy group in the polyethylene oxide, the three-dimensional network structure molecules formed will have hydrolyzable methoxy or ethoxy groups, which can be automatically hydrolyzed in the presence of water. Therefore, when the cover plate is used for PCB drilling, the minimal lubrication heat dissipation adhesive adhered to the hole wall is easily hydrolyzed and removed during the wet processing of the hole wall such as copper deposition and electroplating, thereby improving the drilling efficiency.

[0041] In the present embodiment, the aqueous amino coupling agent is one or more of 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane and N-(2-aminoethyl)-3-aminopropyl methyl dimethoxysilane, but is not limited thereto. The hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone, but is not limited thereto. It is preferably water, or a mixture of water and ethanol. The molecular weight of the polyethylene oxide is 10,000-500,000, preferably 10,000-100,000 with a low molecular weight. The molecular weight of the polyethylene glycol is 2000-20000, preferably 2000-8000 with a low molecular weight. The polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether, but is not limited thereto. The substrate is an aluminum sheet, an iron sheet, a phenolic board, a urea-formaldehyde board or a cold-punched board, but is not limited thereto.

[0042] In some embodiments, a cover plate is also provided, which includes a substrate and an adhesive layer arranged on the substrate, wherein the adhesive layer is an adhesive layer formed after the lubricating heat-dissipating adhesive is heated and cured, and the lubricating heat-dissipating adhesive includes, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.2-5 parts of an aqueous amino coupling agent, 0.5-5 parts of a polyether surfactant, and 100-150 parts of a hydrophilic solvent.

[0043] In some embodiments, a method for preparing a cover plate is also provided, comprising the steps of: first preparing a lubricating heat-dissipating adhesive from polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant, and a hydrophilic solvent; then coating the heat-dissipating adhesive on a substrate and baking it to obtain the cover plate.

[0044] The present invention is further explained below by specific embodiments:

[0045] Example 1

[0046] 1. Preparation of adhesive:

[0047] Dissolve 10 kg of polyethylene oxide in 100 kg of water and stir slowly until it is completely dissolved;

[0048] Continue to add 30kg of polyethylene glycol and stir thoroughly to dissolve completely;

[0049] Then add 0.5 kg of aqueous amino coupling agent and stir thoroughly to dissolve completely;

[0050] Add 0.5 kg of castor oil polyoxyethylene ether and stir thoroughly to dissolve completely;

[0051] The mixture was filtered once using a 40-mesh filter and allowed to stand for 12 hours to defoam. The liquid after standing for defoaming was the lubricating and heat-dissipating adhesive with the final required viscosity of 800-1200 mPa·s and a solid content of 28-30%.

[0052] 2. Preparation of cover plate:

[0053] The adhesive was coated on an aluminum sheet and baked at 120° C. for 5 min to obtain a cover plate with a peel strength of 2.5 N / cm.

[0054] 3. Preparation of pad:

[0055] Applying the adhesive on one side of the facial paper to obtain the adhesive-coated facial paper;

[0056] After baking the adhesive-coated paper at 120° C. for 5 minutes, the adhesive-coated surface of the adhesive-coated paper was placed toward the fiberboard, and the adhesive-coated paper was pasted on the upper and lower surfaces of the fiberboard respectively and pressed at 65° C. for 30 minutes to obtain a pad with a peel strength of 3.2 N / cm.

[0057] Example 2

[0058] 1. Preparation of adhesive:

[0059] Dissolve 20 kg of polyethylene oxide in 100 kg of water and stir slowly until it is completely dissolved;

[0060] Continue to add 20kg of polyethylene glycol and stir thoroughly to dissolve completely;

[0061] Then add 1 kg of aqueous amino coupling agent and stir thoroughly to dissolve completely;

[0062] Add 1kg of castor oil polyoxyethylene ether and stir thoroughly to dissolve completely;

[0063] The mixture was filtered twice using a 120-mesh filter and allowed to stand for 14 hours to defoam. The liquid after standing for defoaming was the lubricating and heat-dissipating adhesive with the final required viscosity of 1400-1800 mPa·s and a solid content of 28-30%.

[0064] 2. Preparation of cover plate:

[0065] The adhesive was coated on an aluminum sheet and baked at 120° C. for 5 min to obtain a cover plate with a peel strength of 3.5 N / cm.

[0066] 3. Preparation of pad:

[0067] Applying the adhesive on one side of the facial paper to obtain the adhesive-coated facial paper;

[0068] After baking the adhesive-coated paper at 120° C. for 5 minutes, the adhesive-coated surface of the adhesive-coated paper was placed toward the fiberboard, and the adhesive-coated paper was pasted on the upper and lower surfaces of the fiberboard respectively and pressed at 65° C. for 30 minutes to obtain a pad with a peel strength of 4.4 N / cm.

[0069] Example 3

[0070] 1. Preparation of adhesive:

[0071] Dissolve 30 kg of polyethylene oxide in 100 kg of water and stir slowly until it is completely dissolved;

[0072] Continue to add 10kg of polyethylene glycol and stir thoroughly to dissolve completely;

[0073] Then add 2kg of aqueous amino coupling agent and stir thoroughly to dissolve completely;

[0074] Add 2kg of castor oil polyoxyethylene ether and stir thoroughly to dissolve completely;

[0075] The mixture was filtered twice using a 100-mesh filter and allowed to stand for 14 hours to defoam. The liquid after standing for defoaming was the lubricating and heat-dissipating adhesive with the final required viscosity of 3200-3600 mPa·s and a solid content of 28-30%.

[0076] 2. Preparation of cover plate:

[0077] The adhesive was coated on an aluminum sheet and baked at 120° C. for 5 min to obtain a cover plate with a peel strength of 6.5 N / cm.

[0078] 3. Preparation of pad:

[0079] Applying the adhesive on one side of the facial paper to obtain the adhesive-coated facial paper;

[0080] After baking the adhesive-coated paper at 120° C. for 5 minutes, the adhesive-coated surface of the adhesive-coated paper was placed toward the fiberboard, and the adhesive-coated paper was pasted on the upper and lower surfaces of the fiberboard respectively and pressed at 65° C. for 30 minutes to obtain a pad with a peel strength of 8.1 N / cm.

[0081] Example 4

[0082] 1. Preparation of adhesive:

[0083] Dissolve 10 kg of polyethylene oxide in 100 kg of water and stir slowly until it is completely dissolved;

[0084] Continue to add 10kg of polyethylene glycol and stir thoroughly to dissolve completely;

[0085] Then add 0.5 kg of aqueous amino coupling agent and stir thoroughly to dissolve completely;

[0086] Add 0.5 kg of castor oil polyoxyethylene ether and stir thoroughly to dissolve completely;

[0087] The mixture was filtered twice using a 100-mesh filter and allowed to stand for 14 hours to defoam. The liquid after standing for defoaming was the lubricating and heat-dissipating adhesive with the final required viscosity of 200-400 mPa·s and a solid content of 11-13%.

[0088] 2. Preparation of cover plate:

[0089] The adhesive was coated on an aluminum sheet and baked at 120° C. for 5 min to obtain a cover plate with a peel strength of 3.1 N / cm.

[0090] 3. Preparation of pad:

[0091] Applying the adhesive on one side of the facial paper to obtain the adhesive-coated facial paper;

[0092] After baking the adhesive-coated paper at 120° C. for 5 minutes, the adhesive-coated surface of the adhesive-coated paper was placed toward the fiberboard, and the adhesive-coated paper was pasted on the upper and lower surfaces of the fiberboard respectively and pressed at 65° C. for 30 minutes to obtain a pad with a peel strength of 3.9 N / cm.

[0093] Example 5

[0094] 1. Preparation of adhesive:

[0095] Dissolve 30 kg of polyethylene oxide in 100 kg of water and stir slowly until it is completely dissolved;

[0096] Continue to add 30kg of polyethylene glycol and stir thoroughly to dissolve completely;

[0097] Then add 3kg of aqueous amino coupling agent and stir thoroughly to dissolve completely;

[0098] Add 3kg of castor oil polyoxyethylene ether and stir thoroughly to dissolve completely;

[0099] The mixture was filtered twice using a 120-mesh filter and allowed to stand for 14 hours to defoam. The liquid after standing for defoaming was the lubricating and heat-dissipating adhesive with the final required viscosity of 3800-4000 mPa·s and a solid content of 37-39%.

[0100] 2. Preparation of cover plate:

[0101] The adhesive was coated on an aluminum sheet and baked at 120° C. for 5 min to obtain a cover plate with a peel strength of 3.3 N / cm.

[0102] 3. Preparation of pad:

[0103] Applying the adhesive on one side of the facial paper to obtain the adhesive-coated facial paper;

[0104] After baking the adhesive-coated paper at 120° C. for 5 minutes, the adhesive-coated surface of the adhesive-coated paper was placed toward the fiberboard, and the adhesive-coated paper was pasted on the upper and lower surfaces of the fiberboard respectively and pressed at 65° C. for 30 minutes to obtain a pad with a peel strength of 4.2 N / cm.

[0105] Example 6

[0106] The cover plate and the backing plate prepared in Examples 1-5, as well as the existing wood fiber board and the ordinary aluminum sheet, were matched with each other, and the drilling temperature was tested according to the following drilling scheme, and the PCB board after the drilling was electroplated, and the hole wall quality was tested, and the hole diameter and the wick were compared. The drilling equipment, materials and parameter settings are shown in Table 1:

[0107] Table 1

[0108]

[0109] The drilling plan and drilling test results are shown in Table 2:

[0110] Table 2

[0111]

[0112]

[0113] From the test results in Table 2, it can be seen that the hole wall quality (hole thickness, wick) is strongly correlated with the drilling temperature. The lower the drilling temperature, the smaller the hole wall thickness and wick. The cover pad made of the adhesive in the embodiment of the present invention has high heat dissipation characteristics, which can better reduce the temperature of the drill bit during the drilling process, thereby reducing the wear of the drill bit and reducing the adhesion of drill chips to the drill bit, which is more conducive to chip removal, thereby improving the quality of the PCB drilling hole wall (reducing the hole thickness and wick) and improving the reliability of the circuit board.

[0114] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A pad, characterized in that: It comprises a wood fiber board and facial paper attached to the upper and lower surfaces of the wood fiber board, an adhesive layer is arranged between the wood fiber board and the facial paper, the adhesive layer is a lubricating heat dissipating adhesive formed by heating and curing, and the lubricating heat dissipating adhesive comprises polyethylene oxide, polyethylene glycol, water-based amino coupling agent, polyether surfactant and hydrophilic solvent; The lubricating heat dissipating adhesive comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.5-3 parts of an aqueous amino coupling agent, 0.5-3 parts of a polyether surfactant, and 100 parts of a hydrophilic solvent; The water-based amino coupling agent is one or more of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; The hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone; and / or the polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether; The molecular weight of the polyethylene oxide is 10,000-500,000, and the molecular weight of the polyethylene glycol is 2,000-20,000; The amino groups in the water-based amino coupling agent undergo a ring-opening reaction with the epoxy groups in the non-crystallized part of the polyethylene oxide to form a three-dimensional network structure.

2. A cover plate, characterized in that: It comprises a substrate and an adhesive layer arranged on the substrate, wherein the adhesive layer is an adhesive layer formed by heating and curing a lubricating heat-dissipating adhesive, and the lubricating heat-dissipating adhesive comprises polyethylene oxide, polyethylene glycol, an aqueous amino coupling agent, a polyether surfactant and a hydrophilic solvent; The lubricating heat dissipating adhesive comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.5-3 parts of an aqueous amino coupling agent, 0.5-3 parts of a polyether surfactant, and 100 parts of a hydrophilic solvent; The water-based amino coupling agent is one or more of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; the substrate is an aluminum sheet, an iron sheet, a phenolic board, a urea-formaldehyde board or a cold-punched board.

3. A lubricating heat dissipation adhesive, characterized in that: Including polyethylene oxide, polyethylene glycol, water-based amino coupling agent, polyether surfactant and hydrophilic solvent; The composition comprises, by weight, 10-30 parts of polyethylene oxide, 10-30 parts of polyethylene glycol, 0.5-3 parts of an aqueous amino coupling agent, 0.5-3 parts of a polyether surfactant, and 100 parts of a hydrophilic solvent; The water-based amino coupling agent is one or more of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; The hydrophilic solvent is one or more of water, ethanol, propanol, tetrahydrofuran and acetone; and / or the polyether surfactant is one or more of hydrogenated castor oil polyoxyethylene ether, nonylphenol polyoxyethylene ether and stearic acid polyoxyethylene ether.

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