Electronic device

Abstract

The present disclosure provides an electronic device, comprising: a flexible circuit board and a conductive adhesive material; the flexible circuit board comprises: a first conductive layer, an adhesive layer and a cover layer, the first conductive layer has a top surface, a bottom surface and a first side edge, the bottom surface is parallel to the top surface, and the first side edge is connected between the top surface and the bottom surface, the adhesive layer is disposed on the top surface of the first conductive layer, the cover layer is disposed on the adhesive layer, the conductive adhesive material is disposed on the first conductive layer, and the first side edge is in contact with the conductive adhesive material.

Description

[0001] This application is a divisional application of a Chinese patent application with the application date of October 29, 2019, the application number of "201911036447.3", and the invention title of "Flexible Circuit Board and Display Device". Technical Field

[0002] The present disclosure relates to an electronic device, and particularly to an electronic device having a flexible circuit board. Background Art

[0003] Flexible circuit boards, such as flexible printed boards (FPCs), are widely used in electronic products including display panels, such as smartphones, tablet computers, laptop computers, monitors, and televisions. Flexible circuit boards can change their shapes according to the spatial design of electronic products. Under the trend of emphasizing thinness, lightness, and foldability in technological electronic products, the industry has high expectations for improving the performance of flexible circuit boards.

[0004] Although existing flexible circuit boards can generally meet their original intended uses, they still do not fully meet the requirements in all aspects. For example, external force folding makes stress easily concentrate on the bonding area of the flexible circuit board, resulting in phenomena such as circuit breakage, abnormal electrical signal transmission, or failure to achieve electrical connection.

[0005] Therefore, developing a structural design that can improve the reliability or quality of flexible circuit boards remains one of the topics that the industry is currently committed to researching. Summary of the Invention

[0006] According to some embodiments of the present disclosure, an electronic device is provided, including: a flexible circuit board and a conductive adhesive material; the flexible circuit board includes: a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer has a top surface, a bottom surface, and a first side edge. The bottom surface is parallel to the top surface, and the first side edge is connected between the top surface and the bottom surface. The adhesive layer is disposed on the top surface of the first conductive layer, the cover layer is disposed on the adhesive layer, the conductive adhesive material is disposed on the first conductive layer, and the first side edge is in contact with the conductive adhesive material.

[0007] According to some embodiments of the present disclosure, an electronic device is provided, including a flexible circuit board, a conductive adhesive material, and a display, and the display is disposed adjacent to the flexible circuit board. The flexible circuit board includes: a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer has a top surface, a bottom surface, and a first side edge. The bottom surface is parallel to the top surface, and the first side edge is connected between the top surface and the bottom surface. The adhesive layer is disposed on the top surface of the first conductive layer, the cover layer is disposed on the adhesive layer, the conductive adhesive material is disposed on the first conductive layer, and the first side edge is in contact with the conductive adhesive material. In addition, the display has a bonding area, a second conductive layer is disposed on the bonding area, and the first conductive layer is electrically connected to the second conductive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided in conjunction with the accompanying drawings, in which:

[0009] Figure 1A shows a schematic cross-sectional structure diagram of a flexible circuit board according to some embodiments of the present disclosure;

[0010] Figure 1B shows according to some embodiments of the present disclosure Figure 1A a schematic enlarged structure diagram of area E in;

[0011] Figure 2 shows a schematic cross-sectional structure diagram of a flexible circuit board according to some embodiments of the present disclosure;

[0012] Figure 3 shows a schematic cross-sectional structure diagram when the flexible circuit board is bonded to other electronic components according to some embodiments of the present disclosure;

[0013] Figure 4 shows a schematic cross-sectional structure diagram when the flexible circuit board is bonded to other electronic components according to some embodiments of the present disclosure;

[0014] Figures 5A to 5C shows a schematic structure diagram when the flexible circuit board in the display device is bonded to other electronic components according to some embodiments of the present disclosure.

[0015] SYMBOL DESCRIPTION

[0016] 10A, 10B Flexible circuit boards;

[0017] 100 Display;

[0018] 100B Bonding area;

[0019] 102 First conductive layer;

[0020] 102s Side edge;

[0021] 102t top surface;

[0022] 104 adhesive layer;

[0023] 104b bottom surface;

[0024] 104bs bottom;

[0025] 104s side;

[0026] 104t top surface;

[0027] 106 covering layer;

[0028] 106b bottom surface;

[0029] 106bs bottom;

[0030] 106s side;

[0031] 106t top surface;

[0032] 108 first substrate;

[0033] 108t top surface;

[0034] 108s side;

[0035] 110 adhesive material;

[0036] 202 second conductive layer;

[0037] 202s side;

[0038] 202t top surface;

[0039] 208 second substrate;

[0040] 208R recess;

[0041] 208s1 first side;

[0042] 208s2 second side;

[0043] 300 third substrate;

[0044] 1020 third conductive layer;

[0045] X first direction;

[0046] D1 distance;

[0047] D2 distance;

[0048] DP1, DP2, DP3 display device;

[0049] DU drive element;

[0050] Region E;

[0051] EL1 First extension line;

[0052] EL2 Second extension line;

[0053] P1 First intersection point;

[0054] P2 Second intersection point;

[0055] P3 Third intersection point;

[0056] θ1 First acute angle;

[0057] θ2 Second acute angle. Detailed implementation manners

[0058] The following provides a detailed description of the flexible circuit board and the display device according to the embodiments of the present disclosure. It should be understood that the following description provides many different embodiments or examples for implementing different aspects of some embodiments of the present disclosure. The specific elements and arrangements described below are only for simply and clearly describing some embodiments of the present disclosure. Of course, these are only for illustration and not limitations of the present disclosure. In addition, similar and / or corresponding reference numerals may be used in different embodiments to label similar and / or corresponding elements to clearly describe the present disclosure. However, the use of these similar and / or corresponding reference numerals is only for simply and clearly describing some embodiments of the present disclosure, and does not represent any relevance between the different embodiments and / or structures discussed.

[0059] It should be understood that the elements or devices in the drawings may exist in various forms well known to those skilled in the art. In addition, relative terms may be used in the embodiments, such as "lower" or "bottom" or "higher" or "top", to describe the relative relationship of one element in the drawing to another element. It can be understood that if the device in the drawing is flipped so that it is upside down, the element described on the "lower" side will become the element on the "higher" side. The embodiments of the present disclosure can be understood in conjunction with the drawings, and the drawings of the present disclosure are also regarded as part of the disclosure description. It should be understood that the drawings of the present disclosure are not drawn to scale. In fact, the dimensions of the elements may be arbitrarily enlarged or reduced to clearly show the features of the present disclosure.

[0060] Furthermore, when it is mentioned that a first material layer is on or above a second material layer, it may include the case where the first material layer is in direct contact with the second material layer or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, when the first material layer is directly on the second material layer, it means that the first material layer is in direct contact with the second material layer.

[0061] In addition, the elements or devices in the drawings may exist in various forms well known to those skilled in the art. In addition, it should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various elements, components, or parts, these elements, components, or parts should not be limited by these terms. These terms are only used to distinguish different elements, components, regions, layers, or parts. Therefore, a first element, component, region, layer, or part discussed below may be referred to as a second element, component, region, layer, or part without departing from the disclosure of the present disclosure.

[0062] In some embodiments of the present disclosure, terms related to joining and connecting, such as "connect" and "interconnect", unless otherwise defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, and other structures are provided between these two structures. And these terms related to joining and connecting may also include the cases where both structures are movable, or both structures are fixed.

[0063] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the technical field to which the present disclosure belongs. It can be understood that these terms, such as defining terms in a commonly used dictionary, should be interpreted as having a meaning consistent with the related technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the present disclosure.

[0064] According to some embodiments of the present disclosure, the provided flexible circuit board includes an adhesive layer design that extends and protrudes from the cover layer, which can reduce the stress concentration at the junction of the adhesive layer and the conductive layer when the external force is flexed, thereby improving the buffering ability of the flexible circuit board against external force flexure, or reducing the risk of wire layer breakage or damage. According to some embodiments of the present disclosure, the provided flexible circuit board may include a glue material covering the conductive layer or the cover layer, which can improve the buffering ability of the flexible circuit board against external force application, or enhance the protection effect on the flexible circuit board.

[0065] Please refer to Figure 1A , Figure 1A , which shows a schematic cross-sectional structure diagram of the flexible circuit board 10A according to some embodiments of the present disclosure. It should be understood that, for the sake of clarity, Figure 1A only a partial area or partial elements of the flexible circuit board 10A are drawn. Furthermore, according to some embodiments, additional features may be added to the flexible circuit board 10A described below.

[0066] As Figure 1AAs shown, according to some embodiments of the present disclosure, the flexible printed circuit board 10A may include a first conductive layer 102, an adhesive layer 104, and a cover layer 106. The first conductive layer 102 may be used to provide electrical connections between electronic components. In some embodiments, the first conductive layer 102 may extend along a first direction X. Specifically, according to some embodiments, the first direction X is the direction of the X-axis in the figure, and the normal direction (the Z-axis in the figure) refers to the direction perpendicular to the surface of the first conductive layer 102 in contact with the first substrate 108. According to some embodiments of the present disclosure, the "length direction" refers to the extending direction along the X-axis in the figure.

[0067] Furthermore, the first conductive layer 102 may have side edges 102s. In some embodiments, the side edges 102s of the first conductive layer 102 may have a non-flat inclined profile, where the non-flat inclined profile means that the next surface in the cross-sectional view has undulations or waves, and the extending direction of this surface is not parallel to the first direction X.

[0068] In some embodiments, the top surface 102t of a part of the first conductive layer 102 not covered by the adhesive layer 104 may be used as an area for bonding the flexible printed circuit board 10A to other electronic components.

[0069] In some embodiments, the material of the first conductive layer 102 may include a metal conductive material, a transparent conductive material, other suitable conductive materials, or a combination of the foregoing. In some embodiments, the foregoing metal conductive materials may include copper (Cu), silver (Ag), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), copper alloys, silver alloys, tin alloys, aluminum alloys, molybdenum alloys, tungsten alloys, gold alloys, chromium alloys, nickel alloys, platinum alloys, titanium alloys, other suitable conductive materials, or a combination of the foregoing, but not limited thereto. In some embodiments, the foregoing transparent conductive materials may include transparent conductive oxides (TCOs). For example, the transparent conductive oxides may include indium tin oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), or a combination of the foregoing, but not limited thereto.

[0070] In some embodiments, the adhesive layer 104 may be disposed on the first conductive layer 102, between the first conductive layer 102 and the cover layer 106. The adhesive layer 104 may be in contact with both the cover layer 106 and the first conductive layer 102, and may fix the cover layer 106 to the first conductive layer 102. Additionally, the adhesive layer 104 may have side edges 104s. As Figure 1A shown, in some embodiments, the side edges 104s of the adhesive layer 104 may have a non-flat, inclined profile. In some embodiments, the side edges 104s of the adhesive layer 104 do not align with the side edges 102s of the first conductive layer 102. In some embodiments, the side edges 104s of the adhesive layer 104 are recessed relative to the side edges 102s of the first conductive layer 102.

[0071] Continuing with the foregoing, the top surface 102t of a portion of the first conductive layer 102 may serve as a bonding region of the flexible circuit board 10A. Specifically, in some embodiments, a portion of the first conductive layer 102 that extends and protrudes beyond the side edges 104s of the adhesive layer 104 may serve as the bonding region of the flexible circuit board 10A. In some embodiments, in the normal direction of a surface of the first substrate 108 (e.g., the Z direction shown in the figure), the portion of the first conductive layer 102 that does not overlap with the adhesive layer 104 may serve as the aforementioned bonding region.

[0072] In some embodiments, the material of the adhesive layer 104 may include any suitable material with adhesiveness. In some embodiments, the material of the adhesive layer 104 may include photocurable adhesives, thermosetting adhesives, photo-thermosetting adhesives, other suitable materials, or combinations of the foregoing, but are not limited thereto. For example, in some embodiments, the adhesive layer 104 may include optical clear adhesives (OCA), optical clear resins (OCR), pressure sensitive adhesives (PSA), other suitable materials, or combinations of the foregoing, but are not limited thereto. In some embodiments, the material of the adhesive layer 104 may include epoxy resin.

[0073] In some embodiments, the adhesive layer 104 may be formed by a spin coating process, a laminating process, a printing process, other suitable methods, or combinations of the foregoing.

[0074] Additionally, according to some embodiments, the cover layer 106 may be disposed on the adhesive layer 104, and the cover layer 106 may have side edges 106s. As Figure 1AAs shown, in some embodiments, the side edge 106s of the cover layer 106 may have a non-flat inclined profile. In some embodiments, the side edge 106s of the cover layer 106 may be substantially aligned with the side edge 104s of the adhesive layer 104. In other words, in some embodiments, the side edge 104s and the side edge 106s may optionally be a continuous structure.

[0075] According to some embodiments, the bottom 104bs of the side edge 104s protrudes from the bottom 106bs of the side edge 106s in the first direction X. Compared with the structure where the side edge 104s of the adhesive layer 104 is flush with the side edge 106s of the cover layer 106, the foregoing configuration (the bottom 104bs protrudes from the bottom 106bs in the first direction X) can reduce the excessive stress concentration at the junction of the adhesive layer 104 and the first conductive layer 102 when flexed by an external force (for example, the bottom 104bs marked in the figure). Thereby, the buffering ability of the flexible circuit board 10A against external force flexure can be improved, or the risk of breakage or damage to the first conductive layer 102 can be reduced.

[0076] Specifically, according to some embodiments, the bottom 104bs of the side edge 104s protrudes from the bottom 106bs of the side edge 106s by a distance D1 in the first direction X. In other words, in some embodiments, in a direction substantially parallel to the top surface 102t of the first conductive layer 102 (for example, the X direction shown in the figure), there is a distance D1 between the bottom 104bs and the bottom 106bs. Specifically, according to some embodiments, the bottom 104bs refers to the junction of the bottom surface 104b of the adhesive layer 104 and the side edge 104s, and the bottom 106bs refers to the junction of the bottom surface 106b of the cover layer 106 and the side edge 106s.

[0077] In some embodiments, the range of the distance D1 is between 30 micrometers (μm) and 200 micrometers (μm) (i.e., 30μm ≤ distance D1 ≤ 200μm), or between 30μm and 150μm, or between 30μm and 100μm. For example, 40μm, 50μm, 60μm, 70μm, 80μm, or 90μm.

[0078] However, according to some embodiments, the range of the distance D1 can be appropriately adjusted according to the product design of the flexible circuit board 10A, or the distance D1 is greater than 0 and does not affect the electrical connection of the first conductive layer 102. It should be understood that according to the embodiments, by selecting an appropriate distance D1, the stress concentration at the junction of the adhesive layer 104 and the first conductive layer 102 during external force flexure can be reduced, and a good electrical connection between the first conductive layer 102 and other electronic components can be achieved.

[0079] In addition, according to some embodiments of the present disclosure, the thickness or length of each component, or the distance between each component, etc. can be measured using optical microscopy (OM), scanning electron microscope (SEM), alpha-step, ellipsometer, or other suitable means, but the present disclosure is not limited thereto. Specifically, in some embodiments, a cross-sectional image of the flexible circuit board 10 can be obtained using a scanning electron microscope, and the thickness or length of each component in the image, or the distance between each component, can be measured.

[0080] In some embodiments, the cover layer 106 may comprise a flexible material, for example, a plastic material or a ceramic material, but the present disclosure is not limited thereto. In one embodiment, the aforementioned plastic material may comprise polyimine (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR), other suitable materials, or a combination of the foregoing, but not limited thereto.

[0081] In some embodiments, the cover layer 106 can be formed by the aforementioned chemical vapor deposition process, spin coating process, laminating process, printing process, other suitable methods, or a combination of the foregoing.

[0082] In addition, according to some embodiments, the flexible circuit board 10A may further comprise a first substrate 108, the first substrate 108 may be disposed below the first conductive layer 102, and the first conductive layer 102 may be disposed between the adhesive layer 104 and the first substrate 108. Furthermore, the first substrate 108 may have a side edge 108s. In some embodiments, the side edge 108s of the first substrate 108 may have a non-planar inclined profile. In some embodiments, the side edge 108s of the first substrate 108 may be substantially aligned with the side edge 102s of the first conductive layer 102. In other words, in some embodiments, the side edge 108s and the side edge 102s may be a continuous structure.

[0083] In some embodiments, the first substrate 108 may comprise a flexible material, such as, for example, a plastic material or a ceramic material, but the present disclosure is not limited thereto. In one embodiment, the aforementioned plastic material may comprise polyimine (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR), other suitable materials, or combinations of the foregoing, but is not limited thereto.

[0084] In addition, as Figure 1A shown, according to some embodiments, the flexible circuit board 10A may further comprise an adhesive material 110, and the adhesive material 110 may be disposed on the first conductive layer 102, the adhesive layer 104, the cover layer 106, and the first substrate 108. In some embodiments, the adhesive material 110 may partially cover the cover layer 106. In some embodiments, the adhesive material 110 may partially cover the first conductive layer 102. In other words, in some embodiments, in the normal direction of the first substrate 108 (e.g., the Z direction shown in the figure), the adhesive material 110 and the cover layer 106 may partially overlap. In some embodiments, in the normal direction of the first substrate 108 (e.g., the Z direction shown in the figure), the adhesive material 110 and the first conductive layer 102 may partially overlap.

[0085] In some embodiments, the adhesive material 110 may cover the top surface 106t and the side edges 106s of a part of the cover layer 106, the side edges 104s of the adhesive layer 104, and the side edges 102s of the first conductive layer 102, and the adhesive material 110 may cover the top surface 102t of the part of the first conductive layer 102 that can serve as a bonding area.

[0086] It should be noted that, according to some embodiments, the adhesive material 110 covering the first conductive layer 102 or the cover layer 106 may slow down the stress concentration at the junction of the adhesive layer 104 and the first conductive layer 102, reduce the risk of fracture of the first conductive layer 102, or improve the buffering ability of the flexible circuit board 10A against external force application.

[0087] In some embodiments, the adhesive material 110 may include, for example, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), other suitable materials, or a combination thereof, but not limited thereto. Anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) may include a polymer substrate and conductive particles dispersed therein. In some embodiments, the material of the polymer substrate may include epoxy resin, but not limited thereto.

[0088] In some embodiments, the adhesive material 110 may be formed by the aforementioned spin coating process, lamination process, printing process, other suitable methods, or a combination thereof.

[0089] Next, please refer to Figure 1B , Figure 1B According to some embodiments of the present disclosure, Figure 1A Schematic diagram of the structure of region E in FIG. Figure 1B As shown, according to some embodiments, the first conductive layer 102 has a top surface 102t, the adhesive layer 104 has a top surface 104t, the top surface 102t and the side 104s of the adhesive layer 104 have a first intersection P1, the top surface 104t and the side 106s of the cover layer 106 have a second intersection P2, and the first extension line EL1 passes through the first intersection P1 and the second intersection P2, and a first acute angle θ1 is sandwiched between the first extension line EL1 and the second extension line EL2 in the first direction X. In detail, the second extension line EL2 is parallel to the first direction X.

[0090] In some embodiments, the first acute angle θ1 is in a range of 15 to 70 degrees (i.e., 15 degrees≦first acute angle θ1≦70 degrees), or in a range of 30 to 60 degrees, or in a range of 30 to 45 degrees, for example, 35 degrees, 40 degrees, 45 degrees, 50 degrees, or 55 degrees. It is worth noting that when the first acute angle θ1 is in a range of 15 to 70 degrees, the side 104s of the adhesive layer 104 may present an inclined profile, which will help the adhesive 110 to be discharged, wherein the discharge refers to helping the adhesive 110 to spread along the inclined profile.

[0091] Similarly, according to some embodiments, the top surface 106t of the cover layer 106 and the side edge 106s of the cover layer 106 have a third intersection point P3, the top surface 104t and the side edge 106s of the cover layer 106 have a second intersection point P2, and an extension line (for example, the first extension line EL1 shown in the figure) passes through the third intersection point P3 and the second intersection point P2, and a second acute angle θ2 may be formed between this extension line and a second extension line EL2 parallel to the first direction X. In another embodiment, the extension line passing through the first intersection point P1 and the second intersection point P2 may not necessarily be parallel to the extension line passing through the third intersection point P3 and the second intersection point P2. In other words, in another embodiment, the two inclined surfaces may not be parallel.

[0092] In some embodiments, the range of the second acute angle θ2 is between 15 degrees and 70 degrees (i.e., 15 degrees ≤ the second acute angle θ2 ≤ 70 degrees), or between 30 degrees and 60 degrees, or between 30 degrees and 45 degrees. For example, 35 degrees, 40 degrees, 45 degrees, 50 degrees, or 55 degrees. It should be noted that when the range of the second acute angle θ2 is between 15 degrees and 70 degrees, the side edge 106s of the cover layer 106 may present an inclined profile, which will help the degumming of the adhesive 110. The so-called degumming means that it helps the adhesive 110 to spread along the inclined profile.

[0093] In addition, according to some embodiments of the present disclosure, a cross-sectional image of the flexible circuit board 10A can be obtained using a scanning electron microscope, and the aforementioned first intersection point P1, second intersection point P2, and third intersection point P3 can be found, and the aforementioned first acute angle θ1 and second acute angle θ2 can be measured using an angle measuring instrument, but the present disclosure is not limited thereto.

[0094] Next, please refer to Figure 2 , Figure 2 which shows a schematic cross-sectional structure of a flexible circuit board 10B according to some other embodiments of the present disclosure. It should be understood that the same or similar components or elements as those in the previous text will be denoted by the same or similar reference numerals, and their materials, manufacturing methods, and functions are the same or similar to those described in the previous text, so this part will not be described in detail hereinafter.

[0095] Figure 2 The shown flexible circuit board 10B is substantially similar to Figure 1A the shown flexible circuit board 10A, and the difference is that in the flexible circuit board 10B, the side edge 106s of the cover layer 106 and the side edge 104s of the adhesive layer 104 are not aligned, and the side edge 102s of the first conductive layer 102 and the side edge 108s of the first substrate 108 are also not aligned. In other words, in some embodiments, the side edges 104s and 106s may be a discontinuous structure. In some embodiments, the side edges 102s and 108s may be a discontinuous structure.

[0096] Specifically, as Figure 2 shown, in some embodiments, the cover layer 106 does not cover the top surface 104t of a part of the adhesive layer 104. In some embodiments, the first conductive layer 102 does not cover the top surface 108t of a part of the first substrate 108. In addition, in some embodiments, the adhesive 110 may cover the top surface 106t and the side 106s of a part of the cover layer 106, the top surface 104t and the side 104s of a part of the adhesive layer 104, and the top surface 102t and the side 102s of a part of the first conductive layer 102. In some embodiments, the adhesive 110 may also cover a part of the first substrate 108, for example, cover a part of the top surface 108t.

[0097] Next, please refer to Figure 3 , Figure 3 which shows a schematic cross-sectional structure diagram when the flexible printed circuit board 10A is joined to other electronic components (not labeled) according to some embodiments of the present disclosure. As Figure 3 shown, in some embodiments, the flexible printed circuit board 10A can be at least partially joined to the second conductive layer 202 on the second substrate 208 by the adhesive 110.

[0098] It should be understood that Figure 3 the complete structure of the electronic component is not drawn in

[0099] As Figure 3 shown, in some embodiments, the second substrate 208 may have a recess 208R, and the second conductive layer 202 may be disposed in the recess 208R. In some embodiments, the second conductive layer 202 may extend from the first side 208s1 of the recess 208R and be spaced apart from the second side 208s2 of the recess 208R by a distance D2, where the distance D2 is the minimum distance along the first direction X from the side 202s of the second conductive layer 202 to the second side 208s2 of the recess 208R.

[0100] In some embodiments, the distance D2 ranges from 0.1 millimeter (mm) to 1 mm (i.e., 0.1 mm ≤ distance D2 ≤ 1 mm), or ranges from 0.3 mm to 0.7 mm. For example, 0.4 mm, 0.5 mm, or 0.6 mm. Specifically, according to some embodiments, the distance D2 is the minimum distance between the side 202s of the second conductive layer 202 and the second side 208Rs2 of the recess 208R.

[0101] In some embodiments, the adhesive material 110 may be disposed between the flexible circuit board 10A and the second substrate 208. Further, in some embodiments, the adhesive material 110 may be disposed between the bonding region of the first conductive layer 102 (e.g., the top surface 102t of a portion not covered by the adhesive layer 104) and the second conductive layer 202. In some embodiments, in the normal direction of the first substrate 108 (e.g., the Z direction shown in the figure), the first conductive layer 102 and the second conductive layer 202 at least partially overlap. In some embodiments, since the adhesive material 110 contains conductive particles, the first conductive layer 102 and the second conductive layer 202 can be electrically connected through the adhesive material 110. Specifically, in some embodiments, the first conductive layer 102, the second conductive layer 202, and the adhesive material 110 can be joined by a hot pressing process to achieve electrical connection.

[0102] In addition, in some embodiments, in the normal direction of the first substrate 108 (e.g., the Z direction shown in the figure), the second conductive layer 202 and the cover layer 106 at least partially overlap. In some embodiments, the adhesive material 110 may cover the top surface 102t and the side 102s of the first conductive layer 102.

[0103] According to some embodiments, the materials of the adhesive layer 104 and the adhesive material 110 may include epoxy resin, and the same base material may improve the bonding ability of the adhesive layer 104 and the adhesive material 110 after hot pressing.

[0104] In some embodiments, the material of the second substrate 208 may include glass, quartz, sapphire, ceramic, plastic, other suitable substrate materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, the material of the foregoing plastic substrate may include polyimine (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR), other suitable materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, the foregoing glass material may include silicon (Si), silicon carbide (SiC), gallium nitride (GaN), silicon dioxide (SiO2), other suitable materials, or a combination of the foregoing, but is not limited thereto. In addition, in some embodiments, the second substrate 208 may include a metal-glass fiber composite sheet or a metal-ceramic composite sheet, but is not limited thereto.

[0105] In some embodiments, the material of the second conductive layer 202 may include a metal conductive material, a transparent conductive material, or a combination of the foregoing. In some embodiments, the foregoing metal conductive material may include copper (Cu), silver (Ag), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), copper alloy, silver alloy, tin alloy, aluminum alloy, molybdenum alloy, tungsten alloy, gold alloy, chromium alloy, nickel alloy, platinum alloy, titanium alloy, other suitable conductive materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, the foregoing transparent conductive material may include a transparent conductive oxide (TCO). For example, the transparent conductive oxide may include indium tin oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), or a combination of the foregoing, but is not limited thereto.

[0106] Next, please refer to Figure 4 , Figure 4 which shows a schematic cross-sectional structure when the flexible circuit board 10A is joined to other electronic components (not shown) according to some other embodiments of the present disclosure. Figure 4 The illustrated embodiment is substantially similar to Figure 3 the illustrated embodiment, and the difference is that, in Figure 4 the illustrated embodiment, the second substrate 208 of the electronic component may not have the recess 208R. In other words, in some embodiments, the second substrate 208 may have a substantially flat surface, and the flexible circuit board 10A may be at least partially joined to the second conductive layer 202 disposed on such a second substrate 208 by the adhesive material 110.

[0107] As described above, according to some embodiments, the second substrate 208 may be a substrate in any suitable electronic component, and the second conductive layer 202 may be any conductive structure on this substrate, such as a wire, or a pad, etc., and the present disclosure is not limited thereto.

[0108] Next, please refer to Figures 5A to 5C , Figures 5A to 5C which shows a schematic structure when the flexible circuit board 10A in the display devices DP1, DP2, and DP3 is joined to other electronic components (e.g., the display 100) according to some embodiments of the present disclosure. It should be understood that Figures 5A to 5C only the state of the flexible circuit board 10A joined to the display 100 is schematically drawn, and for the detailed structure of the flexible circuit board 10A and the detailed structure when it is joined to the display 100, please refer to Figures 1A to 4 .

[0109] As shown in Figure 5AAs shown, according to some embodiments, the display device DP1 may include a flexible circuit board 10A and a display 100, and the display 100 may be disposed adjacent to the flexible circuit board 10A. According to some embodiments, the display 100 may include a liquid-crystal display (LCD), a light-emitting diode (LED) display, a fluorescence display, a phosphor display, other suitable displays, or a combination of the foregoing, but is not limited thereto. According to some embodiments, the light-emitting diode display may include an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QD-OLED) display, a mini light-emitting diode (mini LED) display, a micro light-emitting diodes (micro LED) display, or an arrangement combination of the foregoing, but is not limited thereto. The display 100 may also be a non-rectangular display, a flexible display, a stretchable display, or a part of a tiled display, which is not limited herein.

[0110] In addition, in some embodiments, the display 100 may have a bonding region 100B. In some embodiments, the bonding region 100B may be disposed in the peripheral region of the display 100. In some embodiments, the display 100 may include a third conductive layer 1020, and the third conductive layer 1020 may be disposed on the bonding region 100B. According to some embodiments, the material of the third conductive layer 1020 is similar to that of the second conductive layer 202 described in Figure 3 and Figure 4 and will not be repeated here.

[0111] In some embodiments, the first conductive layer 102 of the flexible circuit board 10A is electrically connected to the third conductive layer 1020 of the display 100. The connection manner of the first conductive layer 102 and the third conductive layer 1020 may refer to, for example, Figure 3 and Figure 4 the connection manner of the first conductive layer 102 and the second conductive layer 202 in. Specifically, according to some embodiments, an adhesive 110 (as shown in Figure 3 and Figure 4 ) may be disposed between the flexible circuit board 10A and the display 100, and the flexible circuit board 10A and the display 100 may be electrically connected by the adhesive 110.

[0112] As shown in Figure 5AAs shown, in some embodiments, the driving element DU may be disposed on the flexible circuit board 10A, and the driving element DU may be electrically connected to the third conductive layer 1020. The driving element DU may be used to control the switch of the display 100 or adjust other functions. In some embodiments, the driving element DU may include an active driving element, a passive driving element, or a combination of the foregoing. For example, the active driving element may include a thin-film transistor (TFT), but is not limited thereto. The foregoing thin-film transistor may include, for example, a switching transistor, a driving transistor, a reset transistor, or other thin-film transistors. Furthermore, the passive driving element may include an integrated circuit (IC) or a microchip, etc., but the present disclosure is not limited thereto.

[0113] Furthermore, as Figure 5B shown in the display device DP2, according to some embodiments, a third substrate 300 may be further included between the flexible circuit board 10A and the display 100. The third substrate 300 may be used to connect the flexible circuit board 10A and the display 100. Specifically, in some embodiments, the third substrate 300 may be joined to the bonding region 100B of the display 100. In some embodiments, the driving element DU may be disposed on the third substrate 300 and electrically connected to the display 100. Furthermore, the material of the third substrate 300 is similar to that of the foregoing second substrate 208, and will not be repeated herein.

[0114] In addition, as Figure 5C shown, according to some embodiments, the display device DP3 may include a plurality of flexible circuit boards 10A. In some embodiments, the display 100 may be electrically connected to the plurality of flexible circuit boards 10A. In some embodiments, the display 100 may be connected to the third substrate 300 through a flexible circuit board 10A, and the third substrate 300 may be further connected to another flexible circuit board 10A. In some embodiments, the driving element DU may be disposed on the third substrate 300 between two flexible circuit boards 10A and electrically connected to the display 100.

[0115] Continuing from the foregoing, Figures 5A to 5C Schematically illustrated is the aspect of the engagement between the flexible circuit board 10A and the display 100 in some embodiments, but the present disclosure is not limited thereto. According to some embodiments, according to different product requirements, the flexible circuit board 10A may be connected and engaged with the display 100 in any other suitable manner.

[0116] In summary, according to some embodiments of the present disclosure, the flexible circuit board includes an adhesive layer design that extends and protrudes from the cover layer, which can reduce the stress concentration at the junction of the adhesive layer and the conductive layer when the external force causes flexure, or can improve the buffering ability of the flexible circuit board against external force flexure, or can reduce the risk of the wire layer breaking or being damaged. According to other embodiments of the present disclosure, the flexible circuit board may include a glue material covering the conductive layer or the cover layer, which can improve the buffering ability of the flexible circuit board against external force application, or enhance the protection effect on the flexible circuit board.

[0117] Although the embodiments of the present disclosure have been disclosed above, it should be understood that any person skilled in the art can make changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure. As long as the features between the embodiments of the present disclosure do not violate the inventive spirit or conflict with each other, they can be arbitrarily combined and used. In addition, the protection scope of the present disclosure is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosure of the present disclosure. As long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein, they can be used according to the present disclosure. Therefore, the protection scope of the present disclosure includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. Additionally, each claim constitutes an individual embodiment, and the protection scope of the present disclosure also includes the combination of each claim and embodiment. The protection scope of the present disclosure shall be defined by the appended claims.

Claims

1. An electronic device, characterized in that, Comprising: A flexible printed circuit board, comprising: A first substrate having a first side edge; A first conductive layer disposed on the first substrate and having a top surface, a bottom surface, and a second side edge, the bottom surface being parallel to the top surface, and the second side edge being connected between the top surface and the bottom surface; An adhesive layer disposed on the top surface of the first conductive layer and having a third side edge; and A cover layer disposed on the adhesive layer and having a fourth side edge; and A conductive adhesive material disposed on the first conductive layer; Wherein the second side edge of the first conductive layer is in contact with the conductive adhesive material, Wherein a first distance between a bottom end point of the first side edge of the first substrate and a bottom end point of the second side edge of the first conductive layer is greater than zero, a second distance between a bottom end point of the third side edge of the adhesive layer and a bottom end point of the fourth side edge of the cover layer is greater than zero, and the first distance is different from the second distance.

2. The electronic device according to claim 1, wherein, The first substrate has a surface, the first conductive layer is disposed on the surface, and the conductive adhesive material is in contact with the surface.

3. The electronic device according to claim 2, wherein Further comprising a second substrate and a second conductive layer, the second conductive layer is disposed on the second substrate, and at least a part of the conductive adhesive material is disposed between the first side edge of the first substrate and the second conductive layer.

4. The electronic device according to claim 1, wherein The first conductive layer is recessed relative to the first substrate.

5. The electronic device according to claim 1, wherein Further comprising a display, the conductive adhesive material is disposed between the first conductive layer and the display.

6. The electronic device according to claim 1, wherein Wherein the conductive adhesive material is in contact with the fourth side edge of the cover layer.

7. The electronic device according to claim 1, wherein Wherein the second side edge of the first conductive layer has a non-flat inclined profile.

8. An electronic device, characterized in that, Comprising: A flexible printed circuit board, comprising: A first substrate having a first side edge; A first conductive layer disposed on the first substrate and having a top surface, a bottom surface, and a second side edge, the bottom surface being parallel to the top surface, and the second side edge being connected between the top surface and the bottom surface; An adhesive layer disposed on the top surface of the first conductive layer and having a third side edge; and A cover layer disposed on the adhesive layer and having a fourth side edge; A conductive adhesive material disposed on the first conductive layer, wherein the second side edge of the first conductive layer is in contact with the conductive adhesive material, Wherein a first distance between a bottom end point of the first side edge of the first substrate and a bottom end point of the second side edge of the first conductive layer is greater than zero, a second distance between a bottom end point of the third side edge of the adhesive layer and a bottom end point of the fourth side edge of the cover layer is greater than zero, and the first distance is different from the second distance; and A display disposed adjacent to the flexible printed circuit board, the display having a bonding area, wherein a second conductive layer is disposed on the bonding area; wherein the first conductive layer is electrically connected to the second conductive layer.

9. The electronic device according to claim 8, wherein The first conductive layer and the second conductive layer are electrically connected through the conductive adhesive material.

10. The electronic device according to claim 9, wherein The conductive adhesive material contains conductive particles.

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