A grinding liquid titration device, mechanism, system and grinding method

Abstract

The present invention relates to the field of semiconductor processing technology, and specifically to a grinding liquid titration device, mechanism, system and grinding method. The grinding liquid titration device includes a strip-shaped body, the interior of which is a cavity, at least one liquid inlet is provided on the top of the body, the bottom of the body is an opening and forms a liquid outlet, the inner side wall of the opening is an inclined surface, the inclined surface is an inward or outward inclined structure, and along the length direction of the body, one end is a fixed end and the other end is a swing end. When grinding a wafer, the inclined surface of the inner side wall of the opening with an inward or outward inclined structure can evenly scrape the grinding liquid in the groove on the surface of the grinding pad, avoiding diffusion to the edge of the grinding pad under the action of centrifugal force, so that the grinding liquid at the center and edge of the grinding pad is evenly distributed, reducing the difference in surface structure loss between the center and edge of the grinding pad, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, and in particular to a grinding liquid titration device, mechanism, system and grinding method. Background Art

[0002] In the semiconductor manufacturing process, chemical mechanical polishing is currently the most mature and effective polishing and flattening technology, and plays an extremely important role in related fields. Chemical mechanical polishing is a technology that uses chemical corrosion and mechanical force to polish and flatten silicon wafers or substrate materials during processing. Impurities or uneven structures on the surface of the wafer are removed through chemical reactions and physical mechanical forces for flattening.

[0003] In the prior art, the chemical polishing liquid is usually dropped directly onto the surface of the polishing pad to polish the wafer. When the polishing pad rotates at high speed, most of the polishing liquid dropped on the surface of the polishing pad diffuses to the periphery. After a certain period of use, the polishing liquid is unevenly distributed due to the difference in surface structure loss between the center and the edge of the polishing pad, resulting in an unstable polishing rate of the wafer during polishing, thereby reducing the product yield. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the grinding liquid is unevenly distributed when grinding the wafer, resulting in an unstable grinding rate and reducing the yield rate of the product.

[0005] In order to solve the above technical problems, the present invention provides a grinding liquid titration device, comprising:

[0006] The main body is in a strip shape with a cavity inside. At least one liquid inlet is provided on the top of the main body. The bottom of the main body is an opening and forms a liquid outlet. The inner wall of the opening is an inclined surface. The inclined surface is an inward or outward inclined structure, forming a shape similar to a scraper, which is suitable for squeezing the grinding liquid into the grinding pad to achieve uniform distribution of the grinding liquid, thereby reducing the wave pattern on the workpiece to be processed in the subsequent process. Along the length direction of the main body, one end is a fixed end and the other end is a swing end.

[0007] Furthermore, the grinding liquid titration device further comprises:

[0008] A baffle is arranged in the cavity, the baffle is at different distances from the inner walls on both sides of the cavity, and the bottom surface of the baffle is higher than the bottom surface of the main body.

[0009] Furthermore, in the grinding liquid titration device, a side of the bottom of the baffle plate that is farther from the inner wall of the cavity is an inclined surface, and the inclined surface is an inwardly inclined or outwardly inclined structure.

[0010] Furthermore, the grinding liquid titration device further comprises:

[0011] The side plate is mounted on the outer side wall of the main body at a side away from the baffle.

[0012] The present invention also provides a grinding liquid titration mechanism, comprising the grinding liquid titration device mentioned above.

[0013] Furthermore, the grinding liquid titration mechanism also includes:

[0014] A connecting component, one end of which is connected to the main body;

[0015] The driver is suitable for being installed on a workbench. The driver is connected to the end of the connecting component away from the main body, and is suitable for driving the main body to evenly scrape the grinding liquid on the surface of the grinding pad. The driver has a swinging state for driving the main body to scrape the surface of the grinding pad and a reset state for returning to the original position, and is suitable for driving the main body to move to a preset position.

[0016] Furthermore, in the grinding liquid titration mechanism, the connecting assembly comprises:

[0017] A clamp, mounted on the driver;

[0018] A first connecting rod, one end of which is rotatably connected to the clamp, and the other end of which is rotatably connected to the main body;

[0019] The second connecting rod has one end rotatably connected to the clamp and the other end rotatably connected to the main body. The first connecting rod, the second connecting rod, the main body and the clamp form a quadrilateral.

[0020] Furthermore, in this grinding liquid titration mechanism, the main body is further provided with a first connecting member and a second connecting member, the first connecting member is arranged at the side of the main body, and the second connecting member is arranged at the top of the main body;

[0021] The clamp is also provided with a third connecting piece, one end of the first connecting rod is rotatably connected to the first connecting piece, and the other end of the first connecting rod is rotatably connected to the third connecting piece;

[0022] The second connecting rod is composed of at least two connecting rod sections movably connected.

[0023] The present invention also provides a grinding liquid titration system, comprising the grinding liquid titration mechanism mentioned above.

[0024] Furthermore, the grinding liquid titration system further comprises:

[0025] Workbench;

[0026] A grinding pad is rotatably mounted on the workbench and is suitable for placing the workpiece to be processed, and the main body is placed on the grinding pad;

[0027] A grinder, one end of which is mounted on the workbench and the other end of which is suitable for grinding the workpiece to be processed;

[0028] A dresser, one end of which is mounted on the workbench and the other end of which is suitable for dressing the surface of the grinding pad;

[0029] A flusher is installed on the workbench at one end and is suitable for flushing the surface of the grinding pad at the other end. The flusher is located in the movement direction of the main body and is suitable for preventing the particle waste formed during the grinding process from flowing into the grinding pad and causing mechanical damage to the surface of the workpiece to be processed.

[0030] The present invention also provides a grinding method, which utilizes the above-mentioned grinding liquid titration system, comprising:

[0031] Equipment assembly: install the grinding pad, grinder, dresser, rinser and grinding liquid titration mechanism on the workbench;

[0032] Pre-flow: put the grinding pad in a static state and input grinding liquid into the main body for 3 to 10 seconds;

[0033] Scraping: Rotate the polishing pad, and the main body will scrape the polishing liquid evenly on the surface of the polishing pad;

[0034] Grinding: Start the grinder to grind the workpiece;

[0035] Rinse, start the rinser to rinse away the particles on the surface of the grinding pad.

[0036] The technical solution of the present invention has the following advantages:

[0037] 1. The grinding liquid titration device provided by the present invention comprises a strip-shaped main body, the interior of which is a cavity, at least one liquid inlet is arranged on the top of the main body, the bottom of the main body is an opening and forms a liquid outlet, the inner side wall of the opening is an inclined surface, and the inclined surface is an inward or outward inclined structure, along the length direction of the main body, one end is a fixed end and the other end is a swing end.

[0038] When grinding the wafer, the main body is placed on the surface of the grinding pad, and the grinding liquid is transported to the cavity of the main body from the liquid inlet, and is dripped on the surface of the grinding pad from the bottom liquid outlet to form a short accumulation. When the grinding pad rotates at high speed, one end of the main body is relatively fixed and the other end swings in the opposite direction of the rotation direction of the grinding pad. The inner side wall of the opening has an inward or outward inclined surface to form a shape similar to a scraper, which can evenly scrape and squeeze the grinding liquid into the groove on the surface of the grinding pad to avoid diffusion to the edge of the grinding pad under the action of centrifugal force, so that the grinding liquid at the center and edge of the grinding pad is evenly distributed, and the difference in surface structure loss between the center and edge of the grinding pad is reduced, so that the grinding rate of the wafer during grinding is more stable and the product yield is improved; by dripping at the liquid inlet, it is possible to avoid the generation of ripples on the surface of the grinding pad, thereby affecting the grinding of the wafer, and can also effectively control the amount of grinding liquid used, reduce the consumption of grinding liquid, save the cost of use, and has the advantages of simple structure and convenient operation.

[0039] 2. The grinding liquid titration device provided by the present invention also includes a baffle plate arranged in the main body cavity, the baffle plate is at different distances from the inner walls on both sides of the cavity, and the bottom surface of the baffle plate is higher than the bottom surface of the main body.

[0040] When the grinding liquid is dropped on the surface of the grinding pad, after the inner wall of the main body is scraped with the grinding liquid, the baffle in the main body cavity can scrape the grinding liquid again, thereby improving the scraping effect, making the grinding liquid distribution at the center and edge of the grinding pad more uniform, and reducing the difference in surface structure loss at the center and edge of the grinding pad, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0041] 3. In the grinding liquid titration device provided by the present invention, the side of the bottom of the baffle plate that is farther from the inner wall of the main cavity is an inclined surface, and the inclined surface is an inwardly inclined or outwardly inclined structure.

[0042] The inwardly or outwardly inclined inclined surface structure can gather the grinding liquid on the inclined surface when scraping the grinding liquid, thereby improving the scraping effect.

[0043] 4. The grinding liquid titration device provided by the present invention further comprises a side plate installed on the outer side wall of the main body on the side away from the baffle.

[0044] When the grinding liquid is scraped on the surface of the grinding pad, due to the high-speed rotation of the grinding pad, the grinding liquid on the surface of the grinding pad will diffuse to both sides along the inclined surface as the inner side wall of the main body and the bottom inclined surface of the baffle are scraped. The side plate of the outer wall of the main body can block the grinding liquid diffused to the edge of the grinding pad, reduce the flow of the grinding liquid out of the surface of the grinding pad, increase the retention time of the grinding liquid on the grinding pad, improve the scraping effect, reduce the consumption of the grinding liquid, save the use cost, and has the advantages of simple structure and convenient operation.

[0045] 5. The grinding liquid titration mechanism provided by the present invention includes a grinding liquid titration device, a connecting component and a driver. The driver is installed on a workbench. One end of the connecting component is connected to the main body, and the other end is connected to the driver. The driver is used to drive the main body to evenly scrape the grinding liquid on the surface of the grinding pad. The driver has a swinging state of driving the main body to scrape the surface of the grinding pad and a reset state of returning to the original position.

[0046] When grinding the wafer, the driver drives the main body to scrape the surface of the grinding pad to make the grinding liquid evenly distributed on the grinding pad, avoiding the grinding liquid from diffusing to the edge of the grinding pad due to centrifugal force, and making the grinding liquid evenly distributed at the center and edge of the grinding pad, thereby reducing the difference in surface structural loss between the center and edge of the grinding pad, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0047] 6. The grinding liquid titration mechanism provided by the present invention comprises a connecting assembly including a clamp, a first connecting rod and a second connecting rod, the clamp is installed on the driver, one end of the first connecting rod is rotatably connected to the clamp, and the other end is rotatably connected to the main body, one end of the second connecting rod is rotatably connected to the clamp, and the other end is rotatably connected to the main body, and the first connecting rod, the second connecting rod, the main body and the clamp enclose a quadrilateral.

[0048] By enclosing the first connecting rod, the second connecting rod, the main body and the clamp into a quadrilateral, when the driver drives the main body to scrape, the quadrilateral structure will be deformed, causing the position of the main body to change, so that the grinding liquid at different angles can be scraped, so that the grinding liquid on the grinding pad is evenly distributed, and the difference in surface structure loss between the center and the edge of the grinding pad is reduced, so that the grinding rate of the wafer during grinding is more stable, the product yield is improved, and it has the advantages of simple structure and convenient operation.

[0049] 7. The grinding liquid titration mechanism provided by the present invention has a main body further provided with a first connecting member and a second connecting member, the first connecting member is arranged on the side of the main body, the second connecting member is arranged on the top of the main body, and a third connecting member is also provided on the clamp, one end of the first connecting rod is rotatably connected to the first connecting member, and the other end is rotatably connected to the third connecting member, and the second connecting rod is at least two connecting rod sections movably connected.

[0050] At least two sections of movably connected second connecting rods form a polygon with the first connecting rod, the main body and the clamp. The first connecting rod is movably connected to one side of the main body and the clamp through the first connecting piece and the third connecting piece, and the second connecting rod is movably connected to the top of the main body and the clamp through the third connecting piece. When the driver drives the main body to scrape, the polygonal structure will be deformed, causing the position of the main body to change, so that the grinding liquid at different angles can be scraped, so that the grinding liquid on the grinding pad is evenly distributed, reducing the difference in surface structural loss between the center and the edge of the grinding pad, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0051] 8. The grinding liquid titration system provided by the present invention includes a grinding liquid titration mechanism, a workbench, a grinding pad, a grinder, a dresser and a rinser. The grinding pad is rotatably installed on the workbench and is suitable for placing the workpiece to be processed. The main body is placed on the grinding pad. One end of the grinder is installed on the workbench, and the other end is suitable for grinding the workpiece to be processed. One end of the dresser is installed on the workbench, and the other end is suitable for trimming the surface of the grinding pad. One end of the rinser is installed on the workbench, and the other end is suitable for rinsing the surface of the grinding pad. The rinser is located in the movement direction of the main body.

[0052] During operation, the grinding pad is rotated and installed on the workbench, and then the workpiece to be processed is placed on the grinding pad, one end of the grinder is installed on the workbench, and the other end is placed on the workpiece to be processed, and then the main body of the grinding liquid droplet mechanism is placed on the grinding pad, and the grinding liquid is dropped onto the grinding pad through the liquid inlet. When the grinding pad and the grinder rotate, the main body of the grinding liquid droplet mechanism scrapes the grinding liquid on the surface of the grinding pad evenly in the grooves on the surface, reducing the difference in surface structural loss between the center and the edge of the grinding pad, thereby making the grinding rate of the wafer during grinding more stable and improving the yield rate of the product. After the grinding liquid is evenly scraped, the surface of the grinding pad is trimmed with a dresser before the workpiece to be processed can be ground. After grinding is completed, the impurities on the surface of the grinding pad are rinsed clean by a rinser. Since the rinser is installed in the direction of movement of the main body, the main body can scrape out the rinsed impurities during rinsing to prevent impurities from flowing into the grinding device and causing mechanical damage to the surface of the workpiece to be processed.

[0053] 9. The grinding liquid titration method provided by the present invention utilizes the above-mentioned grinding liquid titration system and comprises the following steps:

[0054] Equipment assembly: install the grinding pad, grinder, dresser, rinser and grinding liquid titration mechanism on the workbench;

[0055] Pre-flow: put the grinding pad in a static state and input grinding liquid into the main body for 3 to 10 seconds;

[0056] Scraping: Rotate the polishing pad, and the main body will scrape the polishing liquid evenly on the surface of the polishing pad;

[0057] Grinding: Start the grinder to grind the workpiece;

[0058] Rinse, start the rinser to rinse away the particles on the surface of the grinding pad.

[0059] The grinding liquid on the surface of the grinding pad can be evenly scraped into the grooves on the surface, reducing the difference in surface structure loss between the center and the edge of the grinding pad, thereby making the grinding rate of the wafer more stable during grinding and improving the yield rate of the product. During rinsing, the main body can scrape out the washed impurities to prevent impurities from flowing into the grinding device and causing damage to the workpiece, thereby ensuring the yield rate of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0061] Figure 1 It is a schematic structural diagram of the grinding liquid titration device provided in Example 1 of the present invention;

[0062] Figure 2 A cross-sectional view of the grinding liquid titration device provided in Example 1 of the present invention;

[0063] Figure 3 A cross-sectional view of the grinding liquid titration device provided in Example 2 of the present invention;

[0064] Figure 4 It is a schematic structural diagram of the grinding liquid titration mechanism provided in Example 3 of the present invention;

[0065] Figure 5 This is a schematic diagram of the structure of the connecting components in the grinding liquid titration mechanism provided in Example 3 of the present invention;

[0066] Figure 6 A top view of the grinding liquid titration system provided in Example 4 of the present invention;

[0067] Figure 7 A side view of the grinding liquid titration system provided in Example 4 of the present invention;

[0068] Figure 8 A schematic cross-sectional view of a wafer before polishing in a polishing liquid titration system provided in Example 4 of the present invention;

[0069] Fig. 9It is a schematic cross-sectional view of a wafer after polishing in the polishing liquid titration system provided in Example 4 of the present invention.

[0070] Explanation of the reference numerals: 1. main body; 2. liquid inlet; 3. baffle; 4. side plate; 5. driver; 6. clamp; 7. first connecting rod; 8. second connecting rod; 9. first connecting member; 10. second connecting member; 11. third connecting member; 12. grinding pad; 13. workpiece to be processed; 14. grinder; 15. dresser; 16. rinser. DETAILED DESCRIPTION

[0071] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0072] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0073] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0074] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0075] Example 1

[0076] like Figure 1 , Figure 2 and Figure 4As shown, a grinding liquid titration device provided by the present invention includes a strip-shaped main body 1, the interior of which is a cavity, at least one liquid inlet 2 is provided on the top of the main body 1, the bottom of the main body 1 is an opening and forms a liquid outlet, the inner side wall of the opening is an inclined surface with an inwardly inclined structure, and along the length direction of the main body 1, one end of the main body 1 is relatively a fixed end and the other end is a swing end.

[0077] The present embodiment does not specifically limit the workpiece 13 to be processed. To comply with the actual situation, the workpiece 13 to be processed in the present embodiment is a wafer.

[0078] The present embodiment does not specifically limit the main body 1. To meet the actual situation, the main body 1 in the present embodiment adopts an arc-shaped strip structure, which is suitable for grinding 12-inch wafers. The length of the main body 1 is 280mm to 300mm, so that the grinding liquid distributed on the grinding pad 12 can cover the entire wafer. The arc shape matches the shape of the concentric grooves on the grinding pad 12. The length of the inner arc of the main body 1 is 572.5mm, and the width is ≤40mm. In order to prevent the main body 1 from interfering with other parts during operation, the size of the inner arc of the main body 1 is reduced, and the width of the main body 1 should be increased accordingly. The height of the main body 1 is ≤20mm, and the wall thickness of the main body 1 is 5mm. The main body 1 is made of metal or polymer material. In other embodiments, the main body 1 can also adopt a structure with an open rectangular or cylindrical cavity on the bottom surface, and the area formed by the contact between the cavity and the grinding pad 12 can achieve liquid sealing for the grinding liquid.

[0079] The present embodiment does not specifically limit the liquid outlet. To conform to the actual situation, four liquid inlets 2 are provided in the present embodiment. In other embodiments, the liquid inlets 2 can be set to 3 to 6. The spacing between the liquid inlets 2 along the length direction of the main body 1 increases gradually. The minimum spacing is set to 5 mm and the maximum spacing is set to 20 mm, so as to ensure that the dripped grinding liquid can be evenly distributed in the area of ​​wafer grinding on the grinding pad 12.

[0080] When grinding a wafer, the main body 1 is placed on the surface of the grinding pad 12, and the grinding liquid is transported from the liquid inlet 2 to the cavity of the main body 1 through the conveying pipeline, and is dripped on the surface of the grinding pad 12 from the bottom liquid outlet. The grinding liquid is a viscous liquid similar to water, which can form a short-term accumulation and retention in the cavity. When the grinding pad 12 rotates at a high speed, one end of the main body 1 is relatively fixed and the other end swings in the opposite direction of the rotation direction of the grinding pad 12. The inner side wall of the opening has an inclined surface with an inward-inclined structure, which can evenly scrape the grinding liquid in the groove on the surface of the grinding pad 12 to avoid diffusion to the edge position of the grinding pad 12 under the action of centrifugal force, so that the grinding liquid at the center and edge positions of the grinding pad 12 is evenly distributed, and the difference in surface structural loss between the center and edge of the grinding pad 12 is reduced, so that the grinding rate of the wafer during grinding is more stable, and the product yield is improved; by dripping through the liquid inlet 2, it is possible to avoid the generation of ripples on the surface of the grinding pad 12, thereby affecting the grinding of the wafer, and the amount of grinding liquid used can be effectively controlled, the consumption of grinding liquid is reduced, and the use cost is saved, which has the advantages of simple structure and convenient operation.

[0081] like Figure 2 As shown, an arc-shaped baffle 3 is arranged in the cavity of the main body 1. The curvature of the baffle 3 matches the shape of the main body 1. The thickness of the baffle 3 is set to different thicknesses according to the viscosity of the grinding liquid. In this embodiment, the thickness of the baffle 3 is 2 mm. The distances between the baffle 3 and the inner walls on both sides of the cavity are not equal, and the bottom surface of the baffle 3 is 0.5 mm higher than the bottom surface of the main body 1.

[0082] When the grinding liquid is dripped on the surface of the grinding pad 12, after the inner wall of the main body 1 is scraped with the grinding liquid, the baffle 3 in the cavity of the main body 1 can scrape the grinding liquid again, thereby improving the scraping effect, making the grinding liquid distribution at the center and edge positions of the grinding pad 12 more uniform, reducing the difference in surface structural loss at the center and edge of the grinding pad 12, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0083] In this embodiment, the side of the bottom of the baffle 3 farther from the inner wall of the cavity of the main body 1 is an inclined surface, and the inclined surface is an outward-inclined structure. The outward-inclined inclined surface structure is shaped like a scraper, and when the abrasive liquid is scraped, the abrasive liquid can be gathered on the inclined surface, thereby improving the scraping effect.

[0084] like Figure 4As shown, a side plate 4 is also installed on the outer side wall of one side of the inner arc of the main body 1. When the grinding liquid is scraped on the surface of the grinding pad 12, due to the high-speed rotation of the grinding pad 12, the grinding liquid on the surface of the grinding pad 12 will spread to both sides along the inclined surface along the scraping of the inner side wall of the main body 1 and the bottom inclined surface of the baffle 3, and the side plate 4 of the outer wall of the main body 1 can block the grinding liquid that spreads to the edge of the grinding pad 12, reduce the grinding liquid from flowing out of the surface of the grinding pad 12, increase the retention time of the grinding liquid on the grinding pad 12, improve the scraping effect, reduce the consumption of the grinding liquid, save the use cost, and have the advantages of simple structure and convenient operation.

[0085] Example 2

[0086] like Figure 3 As shown, the difference between this embodiment and embodiment 1 is that the bottom of the main body 1 is an opening and forms a liquid outlet, and the inner wall of the opening is an inclined surface with an outward-inclined structure. The inclined surface structure of the outward-inclined structure is shaped like a scraper. When the grinding liquid is scraped, the grinding liquid can be gathered on the inclined surface, thereby improving the scraping effect.

[0087] Example 3

[0088] like Figure 4 and Figure 5 As shown, a grinding liquid titration mechanism provided by the present invention adopts the grinding liquid titration device provided in Example 1, including a grinding liquid titration device, a connecting component and a driver 5. The driver 5 is installed on a workbench, one end of the connecting component is connected to the main body 1, and the other end is connected to the driver 5. The driver 5 is used to drive the main body 1 to evenly scrape the grinding liquid on the surface of the grinding pad 12. The driver 5 has a swinging state for driving the main body 1 to scrape the surface of the grinding pad 12 and a reset state for returning to the original position.

[0089] When grinding the wafer, the driver 5 drives the main body 1 to scrape the surface of the grinding pad 12, so that the grinding liquid is evenly distributed on the grinding pad 12, avoiding the grinding liquid from diffusing to the edge of the grinding pad 12 due to the centrifugal force, and making the grinding liquid at the center and edge of the grinding pad 12 evenly distributed, thereby reducing the difference in surface structural loss between the center and edge of the grinding pad 12, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0090] like Figure 5 As shown, the connecting assembly includes a clamp 6, a first connecting rod 7 and a second connecting rod 8. The clamp 6 is installed on the driver 5. One end of the first connecting rod 7 is rotatably connected to the clamp 6, and the other end is rotatably connected to the main body 1. One end of the second connecting rod 8 is rotatably connected to the clamp 6, and the other end is rotatably connected to the main body 1. The first connecting rod 7, the second connecting rod 8, the main body 1 and the clamp 6 enclose a quadrilateral.

[0091] By enclosing the first connecting rod 7, the second connecting rod 8, the main body 1 and the clamp 6 into a quadrilateral, when the driver 5 drives the main body 1 to scrape, the quadrilateral structure will be deformed, causing the position of the main body 1 to change, so that the grinding liquid at different angles can be scraped, so that the grinding liquid on the grinding pad 12 is evenly distributed, and the difference in surface structure loss between the center and the edge of the grinding pad 12 is reduced, so that the grinding rate of the wafer during grinding is more stable, and the product yield is improved. By adjusting the position of the clamp 6 on the driver 5, the pressure between the main body 1 and the grinding pad 12 is adjusted. In this embodiment, the contact pressure between the main body 1 and the grinding pad 12 is controlled between 0.1psi and 0.5psi, which can ensure that the area formed by the contact between the cavity of the main body 1 and the grinding pad 12 is liquid-sealed for the grinding liquid, and can also prevent the main body 1 and the grinding pad 12 from being too tightly fitted, affecting the movement of the grinding pad 12.

[0092] In this embodiment, the main body 1 is also provided with a first connecting member 9 and a second connecting member 10. The first connecting member 9 is arranged on the side of the main body 1, and the second connecting member 10 is arranged on the top of the main body 1. A third connecting member 11 is also provided on the clamp 6. One end of the first connecting rod 7 is rotatably connected to the first connecting member 9, and the other end is rotatably connected to the third connecting member 11. The second connecting rod 8 is a two-section connecting rod movably connected.

[0093] The two-section movably connected second connecting rod 8, the first connecting rod 7, the main body 1 and the clamp 6 form a polygon. The first connecting rod 7 is movably connected to one side of the main body 1 and the clamp 6 through the first connecting member 9 and the third connecting member 11. The second connecting rod 8 is movably connected to the top of the main body 1 and the clamp 6 through the third connecting member 11. When the driver 5 drives the main body 1 to scrape, the polygonal structure will be deformed, so that the position of the main body 1 will change, so that the grinding liquid at different angles can be scraped, and the grinding liquid on the grinding pad 12 is evenly distributed, which reduces the difference in surface structure loss between the center and the edge of the grinding pad 12, thereby making the grinding rate of the wafer during grinding more stable, improving the product yield, and having the advantages of simple structure and convenient operation.

[0094] In this embodiment, a controller is also provided, and motion parameters are input into the controller. The controller is respectively connected to the delivery pipeline and the driver 5 signals. The driver 5 drives the main body 1 to move to the required position of the polishing pad 12, and controls the delivery pipeline to output the required amount of polishing liquid at the corresponding position into the cavity of the main body 1, thereby ensuring that the polishing liquid can be more scientifically distributed on the polishing pad 12, reducing unnecessary waste of polishing liquid and saving the cost of use.

[0095] Example 4

[0096] like Figure 6 and Figure 7As shown, a grinding liquid titration system provided by the present invention adopts the grinding liquid titration mechanism provided in Example 3, including a grinding liquid titration mechanism, a workbench, a grinding pad 12, a grinder 14, a dresser 15 and a rinser 16. The grinding pad 12 is rotatably mounted on the workbench and is suitable for placing a wafer. The main body 1 is placed on the grinding pad 12. One end of the grinder 14 is mounted on the workbench, and the other end is suitable for grinding the wafer. One end of the dresser 15 is mounted on the workbench, and the other end is suitable for trimming the surface of the grinding pad 12. One end of the rinser 16 is mounted on the workbench, and the other end is suitable for rinsing the surface of the grinding pad 12. The rinser 16 is located in the movement direction of the main body 1.

[0097] During operation, the grinding pad 12 is rotated and mounted on the workbench, and then the wafer is placed on the grinding pad 12. One end of the grinder 14 is mounted on the workbench and the other end is placed on the wafer. Then the main body 1 of the grinding liquid droplet mechanism is placed on the grinding pad 12, and the grinding liquid is dropped onto the grinding pad 12 through the liquid inlet 2. When the grinding pad 12 and the grinder 14 rotate, the main body 1 of the grinding liquid droplet mechanism scrapes the grinding liquid on the surface of the grinding pad 12 evenly in the grooves on the surface, reducing the difference in surface structure loss between the center and the edge of the grinding pad 12, thereby making the grinding rate of the wafer during grinding more stable and improving the yield rate of the product. After the grinding liquid is evenly scraped, the surface of the grinding pad 12 is trimmed using the dresser 15, and then the wafer can be ground. After the grinding is completed, the rinser 16 uses ultra-clean water (UPW, Ultra Pure Water) or deionized water (DIW, De-Ionized Water) to rinse. Water) is used to rinse the impurities on the surface of the grinding pad 12. Since the rinser 16 is installed in the direction of movement of the main body 1, the main body 1 can scrape out the rinsed impurities during rinsing to prevent the impurities from flowing into the grinding device and causing damage to the wafer.

[0098] like Figure 8 and Fig. 9 As shown, by using this grinding liquid titration system, the wafer surface can be ground and polished more flatly.

[0099] Example 5

[0100] The present invention provides a grinding liquid titration method, which utilizes the grinding liquid titration system in Example 4 for grinding, and comprises the following steps:

[0101] S1: Install the grinding pad 12, the grinder 14, the dresser 15, the rinser 16 and the grinding liquid droplet mechanism on the workbench, place the wafer on the grinding pad 12, press the grinder 14 on the wafer, and set the grinding liquid droplet mechanism between the dresser 15 and the rinser 16, and adjust the pressure between the main body 1 and the grinding pad 12 so that the contact pressure is controlled between 0.1psi and 0.5psi;

[0102] S2: The polishing pad 12 is in a stationary state, and polishing liquid is input into the main body 1 to allow the polishing liquid to pre-flow on the polishing pad 12, and the duration is 3s to 10s;

[0103] S3: rotating the polishing pad 12, and the main body 1 evenly scrapes the polishing liquid onto the surface of the polishing pad 12;

[0104] S4: Start the grinder 14 to grind the workpiece 13;

[0105] S5: Start the rinser 16 to rinse the particles on the surface of the polishing pad 12.

[0106] This grinding liquid titration method can evenly scrape the grinding liquid on the surface of the grinding pad 12 into the grooves on the surface, reducing the difference in surface structure loss between the center and the edge of the grinding pad 12, thereby making the grinding rate of the wafer more stable during grinding and improving the product yield. During rinsing, the main body 1 can scrape out the washed impurities to prevent the impurities from flowing into the grinding device and causing damage to the workpiece 13, thereby ensuring the product yield.

[0107] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A grinding liquid titration device, characterized in that: include: A main body (1), the main body (1) is in a strip shape, the interior of which is a cavity, the top of the main body (1) is provided with at least one liquid inlet (2), the bottom of the main body (1) is an opening and forms a liquid outlet, the inner side wall of the opening is an inclined surface, the inclined surface is an inward or outward inclined structure, forming a shape similar to a scraper, suitable for squeezing the grinding liquid into the grinding pad (12) to achieve uniform distribution of the grinding liquid, thereby reducing the wave pattern on the workpiece to be processed in the subsequent process, along the length direction of the main body (1), one end is a fixed end and the other end is a swing end; A baffle (3), the baffle (3) being arranged in the cavity, the baffle (3) being at different distances from inner walls on both sides of the cavity, and the bottom surface of the baffle (3) being higher than the bottom surface of the main body (1).

2. The grinding liquid titration device according to claim 1, characterized in that: The side of the bottom of the baffle (3) that is farther from the inner wall of the cavity is an inclined surface, and the inclined surface is in an inwardly inclined or outwardly inclined structure.

3. The grinding liquid titration device according to claim 1 or 2, characterized in that: Also includes: A side plate (4) is mounted on an outer side wall of the main body (1) at a side away from the baffle (3).

4. A grinding liquid titration mechanism, characterized in that: The invention comprises the grinding liquid titration device according to any one of claims 1 to 3.

5. The grinding liquid titration mechanism according to claim 4, characterized in that: Also includes: A connecting component, one end of which is connected to the main body (1); The driver (5) is suitable for being installed on a workbench. The driver (5) is connected to an end of the connecting component away from the main body (1), and is suitable for driving the main body (1) to evenly scrape the grinding liquid on the surface of the grinding pad. The driver (5) has a swinging state for driving the main body (1) to scrape the surface of the grinding pad and a reset state for returning to an original position, and is suitable for driving the main body (1) to move to a preset position.

6. The grinding liquid titration mechanism according to claim 5, characterized in that: The connection component comprises: A clamp (6) mounted on the driver (5); A first connecting rod (7), one end of which is rotatably connected to the clamp (6), and the other end of which is rotatably connected to the main body (1); A second connecting rod (8) has one end rotatably connected to the clamp (6) and the other end rotatably connected to the main body (1); the first connecting rod (7), the second connecting rod (8), the main body (1) and the clamp (6) enclose a quadrilateral.

7. The grinding liquid titration mechanism according to claim 6, characterized in that: The main body (1) is further provided with a first connecting member (9) and a second connecting member (10), wherein the first connecting member (9) is arranged on the side of the main body (1), and the second connecting member (10) is arranged on the top of the main body (1); The clamp (6) is also provided with a third connecting piece (11); one end of the first connecting rod (7) is rotatably connected to the first connecting piece (9), and the other end is rotatably connected to the third connecting piece (11); The second connecting rod (8) is composed of at least two connecting rod sections movably connected.

8. A grinding liquid titration system, characterized in that: The invention comprises a grinding liquid titration mechanism as described in any one of claims 4 to 7.

9. The grinding liquid titration system according to claim 8, characterized in that: Also includes: Workbench; A grinding pad (12) is rotatably mounted on the workbench and is suitable for placing a workpiece (13) to be processed, and the main body (1) is placed on the grinding pad (12); A grinder (14), one end of which is mounted on the workbench and the other end of which is suitable for grinding the workpiece (13); A dresser (15), one end of which is mounted on the workbench and the other end of which is suitable for dressing the surface of the grinding pad (12); A flusher (16) is installed at one end on the workbench and is suitable for flushing the surface of the grinding pad (12) at the other end. The flusher (16) is located in the moving direction of the main body (1) and is suitable for preventing particle waste formed during the grinding process from flowing into the grinding pad (12) and causing mechanical damage to the surface of the workpiece to be processed.

10. A grinding method, using the grinding liquid titration system according to claim 8 or 9, characterized in that: include: Equipment assembly: installing the grinding pad (12), the grinder (14), the dresser (15), the rinser (16) and the grinding liquid titration mechanism on a workbench; Pre-flow: put the grinding pad (12) in a stationary state and input grinding liquid into the main body (1) for a duration of 3 to 10 seconds; Scraping: rotating the polishing pad (12), the main body (1) evenly scrapes the polishing liquid onto the surface of the polishing pad; Grinding: starting the grinder (14) to grind the workpiece; Flushing: Start the flusher (16) to flush the particles on the surface of the grinding pad (12).

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