Circuit board assemblies and electronic devices

Abstract

The present application discloses a circuit board assembly and an electronic device, and relates to the field of communication technology. The circuit board assembly includes a circuit board, a first conductive member, a second conductive member, an electronic compass, a charging management chip and a circuit board, wherein the circuit board is provided with a first through hole and a second through hole, and the circuit board includes a first conductive layer, and the first conductive layer includes a first area and a second area; the first conductive member is inserted in the first through hole; the second conductive member is inserted in the second through hole; the electronic compass is provided in the first area of ​​the first conductive layer; the charging management chip is provided in the second area of ​​the first conductive layer, and the first conductive member and the second conductive member are both electrically connected to the charging management chip through the wire of the first conductive layer; the resistivity of the wire located in the first area and connected to the first conductive member is R1, and the resistivity of the wire located in the second area and connected to the second conductive member is R2, and R1>R2.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a circuit board assembly and an electronic device. Background Art

[0002] In the related art, electronic compasses are widely used as navigation instruments in electronic devices, making people's lives more comfortable and convenient. An electronic compass is a sensor element that measures the direction by measuring the geomagnetic field. As the density of circuit boards and power modules in electronic devices gradually increases, the spacing between each power module and the electronic compass gradually decreases. The magnetic field generated by the current passing through the circuit boards and power modules can easily affect the stability of the electronic compass. Especially when charging electronic devices, the charging ground return current flowing through the circuit board can easily generate an electromagnetic field that affects the operation of the electronic compass, thereby affecting the stability of the electronic compass. Summary of the invention

[0003] The present application aims to provide a circuit board assembly and an electronic device, which at least solve the technical problem that the electromagnetic field generated by the charging ground return current flowing through the circuit board affects the working stability of the electronic compass.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application proposes a circuit board assembly, which includes the circuit board assembly including a circuit board, a first conductive member, a second conductive member, an electronic compass and a charging management chip. The circuit board is provided with a first through hole and a second through hole, and the first through hole and the second through hole both penetrate the circuit board along the thickness direction. The circuit board includes a first conductive layer, the first conductive layer includes a first area and a second area, the second area surrounds the first area, the first through hole penetrates the first area, and the second through hole penetrates the second area; the first conductive member is inserted in the first through hole; the second conductive member is inserted in the second through hole; the electronic compass is arranged in the first area of ​​the first conductive layer; the charging management chip is arranged in the second area of ​​the first conductive layer, and the first conductive member and the second conductive member are both electrically connected to the charging management chip through the wire of the first conductive layer; the resistivity of the wire located in the first area and connected to the first conductive member is R1, and the resistivity of the wire located in the second area and connected to the second conductive member is R2, and R1>R2.

[0006] In the second aspect, the present application also provides a circuit board assembly, the circuit board assembly includes a circuit board, a first conductive member, a second conductive member, an electronic compass and a charging management chip, the circuit board is provided with a first through hole and a second through hole, the first through hole and the second through hole both penetrate the circuit board along the thickness direction, the circuit board includes a first conductive layer; the first conductive member is inserted in the first through hole; the second conductive member is inserted in the second through hole; the electronic compass is arranged in the first conductive layer; the charging management chip is arranged in the first conductive layer, the distance from the charging management chip to the first through hole is greater than the distance from the electronic compass to the first through hole, the first conductive member is spaced apart from the first conductive layer, and the second conductive member is electrically connected to the charging management chip through the first conductive layer.

[0007] In a third aspect, the present application further provides an electronic device, comprising a circuit board assembly as provided in the first aspect, or a circuit board assembly as provided in the second aspect.

[0008] In the circuit board assembly provided in the present application, an electronic compass and a first conductive member are arranged in the first area, and a charging management chip and a second conductive member are arranged in the second area, and the resistivity R1 of the wire located in the first area and connected to the first conductive member is set to be greater than the resistivity R2 of the wire located in the second area and connected to the second conductive member, so as to reduce the current flowing out of the charging management chip through the first conductive member, thereby avoiding or reducing the current flowing through the first area from generating an electromagnetic field that affects the operation of the electronic compass, thereby improving the working stability of the electronic compass.

[0009] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 is one of the three-dimensional structural schematic diagrams of an embodiment of a circuit board assembly according to the present application;

[0012] Figure 2 This is a second three-dimensional structural schematic diagram of an embodiment of a circuit board assembly according to the present application;

[0013] Figure 3 is a third three-dimensional structural schematic diagram of an embodiment of a circuit board assembly according to the present application;

[0014] Figure 4 This is a fourth three-dimensional structural schematic diagram of an embodiment of a circuit board assembly according to the present application;

[0015] Figure 5is a schematic diagram of a disassembled structure of an embodiment of a circuit board assembly according to the present application;

[0016] Figure 6 is a schematic diagram of a circuit board assembly according to an embodiment of the present application;

[0017] Figure 7 It is a partial structural diagram of an embodiment of an electronic device according to the present application. DETAILED DESCRIPTION

[0018] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0019] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0020] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] Combine the following Figures 1 to 6 A circuit board assembly according to an embodiment of the present application is described.

[0023] like Figure 1 As shown, an embodiment of the present application provides a circuit board assembly, the circuit board assembly includes a circuit board, a first conductive member 31, a second conductive member 32, an electronic compass 4, and a charging management chip 5. The circuit board is provided with a first through hole 21 and a second through hole 22. The first through hole 21 and the second through hole 22 both penetrate the circuit board along a thickness direction X. The circuit board includes a first conductive layer 1. The first conductive layer 1 includes a first region 11 and a second region 12. The second region 12 surrounds the first region 11. The first through hole 21 penetrates the first region 11, and the second through hole 22 penetrates the second region 12. The first conductive member 31 is inserted into the first through hole 21; the second conductive member 32 is inserted into the second through hole 22; the electronic compass 4 is arranged in the first area 11 of the first conductive layer 1; the charging management chip 5 is arranged in the second area 12 of the first conductive layer 1, and the first conductive member 31 and the second conductive member 32 are both electrically connected to the charging management chip 5 through the wire of the first conductive layer 1; the resistivity of the wire located in the first area 11 and connected to the first conductive member 31 is R1, and the resistivity of the wire located in the second area 12 and connected to the second conductive member 32 is R2, and R1>R2.

[0024] The circuit board assembly provided in the present application can be arranged in an electronic device, and the charging management chip 5 can manage the power supply of the electronic device to the external device. The electronic compass 4 can provide the user with azimuth information by detecting the geomagnetic field. The charging management chip 5 and the electronic compass 4 are both electrically connected to the circuit board. In addition to the charging management chip 5 and the electronic compass 4, other power modules can be arranged in the electronic device to be connected to the circuit board, such as: a central processing unit, a memory, a battery, a camera, a receiver, an antenna, etc. electrically connected to the circuit board. The circuit board is provided with wires respectively connected to the charging management chip 5, the electronic compass 4 and other power modules to realize the electrical connection between one or more power modules.

[0025] The circuit board includes one or more conductive layers, and the multiple conductive layers are arranged in sequence along the thickness direction X of the circuit board. The wires of each conductive layer are arranged as needed to form a complex and changeable circuit structure to achieve different functions. It can be understood that the circuit board also includes an insulating layer arranged between adjacent conductive layers to avoid unwanted electrical conduction between adjacent conductive layers. The first through hole 21 and the second through hole 22 pass through the circuit board, so that the first conductive member 31 inserted into the first through hole 21 and the second conductive member 32 inserted into the second through hole 22 can contact with each insulating layer and selectively electrically connect with each conductive layer as needed. Of course, in the case where the circuit board only includes the first conductive layer 1, only one insulating layer can be provided, and the insulating layer can be a substrate supporting the conductive layer.

[0026] For the convenience of description, the wire located in the first area 11 and connected to the first conductive member 31 is called the first wire, and the wire located in the second area 12 and connected to the second conductive member 32 is called the second wire. When the charging management chip 5 manages the battery in a charging state, the second conductive member 32 and other metal parts in the electronic device can be used as the GND circuit of the electronic device in the charging state. The other metal parts in the electronic device can be a metal shell. Part of the current flowing out of the charging management chip 5 can form a GND circuit through the second wire, the second conductive member 32, and other metal parts in the electronic device.

[0027] Of course, part of the current flowing out of the charging management chip 5 can also form a GND loop through the first wire, the first conductive part 31, and other metal parts in the electronic device. However, in this application, the wire located in the first area 11 and connected to the first conductive part 31 and the wire located in the second area 12 and connected to the second conductive part 32 are set differently, so that the resistivity R1 of the first wire is greater than the resistivity R2 of the second wire, so that the current I1 flowing from the charging management chip 5 through the first conductive part 31 is less than the current I2 flowing from the charging management chip 5 through the second conductive part 32, so as to reduce the current flowing from the charging management chip 5 to the first conductive part 31, and the electromagnetic field generated by the current flowing through the first conductive part 31.

[0028] The second area 12 may be an area for connecting power modules such as the charging management chip 5 and the processor, and the first area 11 is an area for connecting the electronic compass 4, that is, the power module with higher anti-electromagnetic interference capability may be set in the second area 12, and the power module with weaker anti-electromagnetic interference capability may be set in the first area 11.

[0029] In the circuit board assembly provided in the present application, an electronic compass 4 and a first conductive member 31 are arranged in the first area 11, and a charging management chip 5 and a second conductive member 32 are arranged in the second area 12, and the resistivity R1 of the wire located in the first area 11 and connected to the first conductive member 31 is set to be greater than the resistivity R2 of the wire located in the second area 12 and connected to the second conductive member 32, so as to reduce the current flowing out of the charging management chip 5 through the first conductive member 31, thereby avoiding or reducing the current flowing through the first area 11 to generate an electromagnetic field that affects the operation of the electronic compass 4, thereby improving the working stability of the electronic compass 4.

[0030] The material forming the first conductive line and the material forming the second conductive line may be different, so that the resistivity R1 of the first conductive line is greater than the resistivity R2 of the second conductive line. Of course, the material forming the first conductive line and the material forming the second conductive line may be the same, but the cross-sectional area of ​​the conductive line located in the first region 11 and connected to the first conductive member 31 is smaller than the cross-sectional area of ​​the conductive line located in the second region 12 and connected to the second conductive member 32. The resistivity of the conductive line is related to the cross-sectional area of ​​the conductive line, that is, by changing the cross-sectional area of ​​the conductive line, the resistivity R1 of the conductive line located in the first region 11 and connected to the first conductive member 31 is greater than the resistivity R2 of the conductive line located in the second region 12 and connected to the second conductive member 32.

[0031] Please refer to Figure 2 In some embodiments, the circuit board also includes at least one second conductive layer 6, the second conductive layer 6 includes a third area 61 and a fourth area 62, the fourth area 62 is arranged around the third area 61, the first through hole 21 passes through the third area 61, and the projection of the electronic compass 4 along the thickness direction X on the second conductive layer 6 at least overlaps with the third area 61, and no wire is arranged in the third area 61.

[0032] The second conductive layer 6 can be any conductive layer in the circuit board except the first conductive layer 1. When the number of conductive layers is 2, the first conductive layer 1 and the second conductive layer 6 can be respectively arranged on opposite sides of the insulating layer, and the insulating layer can be an insulating substrate. When the number of conductive layers is ≥ 2, the first conductive layer 1, the second conductive layer 6, and other conductive layers in the multi-layer conductive layer except the first conductive layer 1 and the second conductive layer 6 can be arranged in sequence. The first conductive member 31 and the second conductive member 32 can be electrically connected to one or more electronic components through the second conductive layer 6, thereby providing a GND loop for one or more electronic components.

[0033] The projection of the electronic compass 4 on the second conductive layer 6 along the thickness direction X at least overlaps with the third region 61, that is, the third region 61 is arranged on one side of the electronic compass 4 along the thickness direction X. By not arranging a wire in the third region 61, no current flows into the first conductive member 31 in the third region 61, so as to reduce or avoid the current flowing into the second conductive layer 6 from forming an electromagnetic field that affects the operation of the electronic compass 4, thereby improving the working stability of the electronic compass 4.

[0034] See also Figure 3In some other embodiments, the circuit board further includes at least one second conductive layer 6, the second conductive layer 6 includes a third region 61 and a fourth region 62, the fourth region 62 is arranged around the third region 61, the first through hole 21 passes through the third region 61, the projection of the electronic compass 4 along the thickness direction X on the second conductive layer 6 at least overlaps with the third region 61, the resistivity of the wire located in the third region 61 and connected to the first conductive member 31 is R3, the resistivity of the wire located in the fourth region 62 and connected to the second conductive member 32 is R4, and R3>R4.

[0035] The resistivity R3 of the wire located in the third area 61 and connected to the first conductive member 31 is greater than the resistivity R4 of the wire located in the fourth area 62 and connected to the second conductive member 32, so that the current passing through the wire located in the third area 61 and flowing into the first conductive member 31 is smaller than the current passing through the wire in the fourth area 62 and flowing into the second conductive member 32, thereby avoiding or reducing the current passing through the second conductive layer 6 to generate an electromagnetic field that affects the operation of the electronic compass 4, thereby improving the working stability of the electronic compass 4.

[0036] Those skilled in the art can set the sizes of the first area 11 and the third area 61 in the above embodiment as needed. In one embodiment, the projection of the first area 11 on the second conductive layer 6 falls within the third area 61, that is, the area of ​​the third area 61 is greater than or equal to the area of ​​the first area 11. In another embodiment, along the thickness direction X of the circuit board, the first area 11 and the third area 61 overlap, that is, the area of ​​the third area 61 is equal to the area of ​​the first area 11. The resistivity R3 of the wire located in the third area 61 and connected to the first conductive member 31 can be set with reference to the resistivity R1 of the first wire.

[0037] In order to further reduce the influence of the electromagnetic field generated by the current flowing through the circuit board on the electronic compass 4, the circuit board assembly further includes a central area and a side area arranged around the central area, and the first area 11 is located in the side area, that is, the first through hole 21 and the electronic compass 4 are arranged close to the side of the circuit board. In order to further reduce the influence of the electromagnetic field generated by the current flowing through the circuit board on the electronic compass 4, the electronic compass 4 can also be arranged to be located on the side of the first through hole 21 away from the charging management chip 5.

[0038] See also Figure 4The present application also provides an electronic device, wherein a circuit board assembly comprises: a circuit board, a first conductive member 31, a second conductive member 32, an electronic compass 4 and a charging management chip 5, wherein a first through hole 21 and a second through hole 22 are arranged on the circuit board, and the first through hole 21 and the second through hole 22 both penetrate the circuit board along a thickness direction X, and the circuit board comprises a first conductive layer 1; a first conductive member 31 is inserted in the first through hole 21; a second conductive member 32 is inserted in the second through hole 22; the electronic compass 4 is arranged in the first conductive layer 1; the charging management chip 5 is arranged in the first conductive layer 1, and the maximum distance from the electronic compass 4 to the first through hole 21 is less than the minimum distance from the electronic compass 4 to the second through hole 22, the first conductive member 31 is spaced apart from the first conductive layer 1, and the second conductive member 32 is electrically connected to the charging management chip 5 through the first conductive layer 1.

[0039] The maximum distance from the electronic compass 4 to the first through hole 21 is smaller than the minimum distance from the electronic compass 4 to the second through hole 22, that is, compared with the distance from the electronic compass 4 to the second through hole 22, the distance from the electronic compass 4 to the first through hole 21 is closer, so that compared with the second conductive member 32 located in the second through hole 22, the current generated by the power-on of the first conductive member 31 located in the first through hole 21 has a greater impact on the electronic compass 4.

[0040] The first conductive member 31 is spaced apart from the first conductive layer 1, that is, the first conductive member 31 and the first conductive layer 1 have no direct electrical connection, so that the current flowing out of the charging management chip 5 cannot flow to the first conductive member 31, thereby avoiding or reducing the current flowing through the first conductive layer 1 from generating an electromagnetic field that affects the operation of the electronic compass 4, thereby improving the working stability of the electronic compass 4.

[0041] Please refer to Figure 5 , the first conductive layer 1 includes a vacant area 23, and the vacant area 23 surrounds the first through hole 21. The vacant area 23 is an area where no conductive structure is set. By setting the vacant area 23, the conductive structure in the first conductive layer 1 is prevented from touching the first conductive member 31, so that the current in the first conductive member 311 is conducted to the first conductive member 31. When the first conductive layer 1 is prepared by copper material, the copper foil corresponding to the vacant area 23 can be hollowed out to form the vacant area 23.

[0042] In one embodiment, the circuit board includes a third conductive layer 7, the third conductive layer 7 includes a conductive electrode 71 and a third conductive wire 72, the conductive electrode 71 is arranged around the first through hole 21 and is connected to the first conductive member 31, the conductive electrode 71 and the third conductive wire 72 are arranged at intervals, and the projection portion of the first conductive layer 1 on the third conductive layer 7 along the thickness direction X overlaps with the conductive electrode 71.

[0043] The third wire 72 can be any wire distributed in the third conductive layer 7. The conductive electrode 71 can be a copper foil disposed on the insulating layer, and the edge of the copper foil is hollowed out so that the copper foil is spaced apart from the third wire 72 distributed in the third conductive layer 7, that is, the current flowing through the third wire 72 distributed in the third conductive layer 7 cannot flow into the conductive electrode 71, and the current flowing through the third wire 72 distributed in the third conductive layer 7 cannot flow into the first conductive member 31, thereby avoiding or reducing the electromagnetic field generated by the current flowing through the third conductive layer 7 that affects the operation of the electronic compass 4, and improving the working stability of the electronic compass 4. In addition, since the projection of the first conductive layer 1 on the third conductive layer 7 along the thickness direction X overlaps with the conductive electrode 71, the first conductive layer 1 and the conductive electrode 71 form a capacitor in series with the first conductive member 31, and the characteristics of the capacitor passing AC and blocking DC are used to prevent the DC current flowing out of the charging management chip 5 from flowing back through the first conductive member 31, while the AC current flowing out of other power modules can be conducted to other components through the first conductive member 31. For example, the alternating current flowing out of the antenna can be conducted to the middle frame of the electronic device through the first conductive member 31 .

[0044] Those skilled in the art will understand that the size of the capacitor is related to the area of ​​the electrodes relative to each other, the dielectric constant, and the spacing distance between the two electrodes. When the dielectric constant and the spacing distance between the first conductive layer 1 and the third conductive layer 7 remain unchanged, the size of the capacitor connected in series with the first conductive member 31 can be changed by setting conductive electrodes 71 with different areas.

[0045] In some embodiments, the number of the first conductive layers 1 and the number of the third conductive layers 7 are both N, and the N first conductive layers 1 and the N third conductive layers 7 are arranged in sequence and spaced apart, and N is a positive integer.

[0046] In the case where the multi-layer conductive layer only includes the first conductive layer 1 and the third conductive layer 7, the first conductive layer 1 and the third conductive layer 7 are arranged in sequence. In the case where the multi-layer conductive layer also includes other conductive layers in addition to the first conductive layer 1 and the third conductive layer 7, the first conductive layer 1 and the third conductive layer 7 are arranged in sequence, and one first conductive layer 1 and one third conductive layer 7 form a pair of capacitor conductive layers. Other conductive layers in addition to the first conductive layer 1 and the third conductive layer 7 can also be arranged on one side of the capacitor conductive layer. The number of pairs of capacitor conductive layers formed by the arrangement and combination of m first conductive layers 1 and m third conductive layers 7 is the number of capacitors formed in series with the first conductive member 31.

[0047] See also Figure 6Exemplarily, the circuit board includes 4 conductive layers, 2 first conductive layers 1, and 2 third conductive layers 7, which are arranged in the order of first conductive layer 1, third conductive layer 7, first conductive layer 1, and third conductive layer 7. The first conductive layer 1 located on the first layer and the third conductive layer 7 located on the second layer form a pair of capacitive conductive layers, and a first capacitor C1 is formed therebetween. The third conductive layer 7 located on the second layer and the first conductive layer 1 located on the third layer form a pair of capacitive conductive layers, and a second capacitor C2 is formed therebetween. The first conductive layer 1 located on the third layer and the third conductive layer 7 located on the fourth layer form a pair of capacitive conductive layers, and a third capacitor C3 is formed therebetween. The first capacitor C1, the second capacitor C2, and the third capacitor C3 are all connected to the first conductive member 31.

[0048] In one embodiment, the first conductive layer 1 connected to the electronic compass 4 and the charging management chip 5 is located at the end of the circuit board to facilitate the connection of the electronic compass 4 and the charging management chip 5 to the first conductive layer 1 .

[0049] In some embodiments, the conductive member is a fastener, such as a conductive screw, and the circuit board assembly can be fixed to the electronic device through the conductive member.

[0050] The present application also provides an electronic device, which includes: the circuit board assembly as described above.

[0051] The electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted circuit board assembly, a mobile Internet device (MID), an augmented reality / virtual reality device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0052] In the electronic device provided in the embodiment of the present application, there is a related structure of the aforementioned circuit board assembly, and reference can be made to the circuit board assembly provided in the above embodiments, which has all the beneficial effects of the aforementioned circuit board assembly and will not be repeated here.

[0053] See also Figure 7 In one embodiment, the electronic device also includes a charging interface 20 and a conductive bracket 30, the charging interface 20 is electrically connected to the charging management chip 5; the conductive bracket 30 supports the charging interface 20 and the conductive plate assembly 10, and the first conductive member 31 and the second conductive member 32 are respectively connected to the circuit board and the conductive bracket 30.

[0054] The following is an introduction using a mobile phone as an example of an electronic device. The charging interface 20 can also be reused as a data interface. The charging interface 20 can be a USB interface, a Lightning Dock interface, etc. The USB interface can be a TYPE-C interface, a TYPE-B interface, etc. When an external power source is connected to the charging interface 20, the external device is connected to the charging management chip 5, and the external device can supply power to the electronic device through the charging interface 20.

[0055] The electronic device includes a housing, in which the circuit board assembly, the conductive bracket 30, etc. are all accommodated, and the housing includes a front cover, a middle frame, and a rear cover, wherein the front cover and the rear cover are respectively mounted on opposite sides of the middle frame, that is, the middle frame is located between the front cover and the rear cover. The conductive bracket 30 can be the middle frame, and the conductive member can fix the circuit board assembly on the middle frame.

[0056] In some embodiments, the electronic device further includes an auxiliary circuit board, and the charging interface 20 is disposed on the auxiliary circuit board, and the charging interface 20 is electrically connected to the charging management chip 5 on the circuit board through a flexible circuit board. Figure 7 As shown, when the electronic device is charged through the charging interface 20, the current flows into the charging management chip 5 through the charging interface 20 and the flexible circuit board in sequence through the path IN. A part of the return current flows into the charging interface 20 through the path GND1 through the charging management chip 5 and the flexible circuit board; a part flows into the charging interface 20 through the path GND2 charging management chip 5, the second conductive member 32, and the metal middle frame, and no or less current flows into the charging interface 20 through the path GND3 charging management chip 5, the second conductive member 32, and the metal middle frame.

[0057] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: A circuit board, wherein a first through hole and a second through hole are provided on the circuit board, wherein the first through hole and the second through hole both penetrate the circuit board along a thickness direction of the circuit board, wherein the circuit board comprises a first conductive layer, wherein the first conductive layer comprises a first region and a second region, wherein the second region surrounds the first region, wherein the first through hole penetrates the first region, and wherein the second through hole penetrates the second region; A first conductive member, inserted into the first through hole; A second conductive member, inserted into the second through hole; an electronic compass, disposed in the first region of the first conductive layer; A charging management chip is disposed in the second region of the first conductive layer, and the first conductive element and the second conductive element are both electrically connected to the charging management chip through the wires of the first conductive layer; The resistivity of the conductive wire located in the first region and connected to the first conductive member is R1, the resistivity of the conductive wire located in the second region and connected to the second conductive member is R2, and R1>R2.

2. The circuit board assembly according to claim 1, characterized in that: The cross-sectional area of ​​the conductive wire located in the first region and connected to the first conductive member is smaller than the cross-sectional area of ​​the conductive wire located in the second region and connected to the second conductive member.

3. The circuit board assembly according to claim 1, characterized in that: The circuit board further includes at least one second conductive layer, the second conductive layer includes a third area and a fourth area, the fourth area is arranged around the third area, the first through hole penetrates the third area, and the projection of the electronic compass on the second conductive layer along the thickness direction at least overlaps with the third area; No wire is arranged in the third region.

4. The circuit board assembly according to claim 1, characterized in that: The circuit board further includes at least one second conductive layer, the second conductive layer includes a third area and a fourth area, the fourth area is arranged around the third area, the first through hole penetrates the third area, and the projection of the electronic compass on the second conductive layer along the thickness direction at least overlaps with the third area; The resistivity of the conductive wire located in the third region and connected to the first conductive member is R3, the resistivity of the conductive wire located in the fourth region and connected to the second conductive member is R4, and R3>R4.

5. A circuit board assembly, characterized in that: The circuit board assembly comprises: A circuit board, wherein a first through hole and a second through hole are provided on the circuit board, wherein the first through hole and the second through hole both penetrate the circuit board along a thickness direction of the circuit board, and the circuit board comprises a first conductive layer; A first conductive member, inserted into the first through hole; A second conductive member, inserted into the second through hole; an electronic compass, disposed on the first conductive layer, wherein a maximum distance from the electronic compass to the first through hole is smaller than a minimum distance from the electronic compass to the second through hole; A charging management chip is arranged on the first conductive layer. The first conductive element is spaced apart from the first conductive layer, and the second conductive element is electrically connected to the charging management chip through the first conductive layer.

6. The circuit board assembly according to claim 5, characterized in that: The first conductive layer includes a dummy area surrounding the first through hole.

7. The circuit board assembly according to claim 5, characterized in that: The circuit board further includes a third conductive layer, the third conductive layer includes a conductive electrode and a third conductive wire, the conductive electrode is arranged around the first through hole and connected to the first conductive member, the conductive electrode and the third conductive wire are arranged at intervals, The first conductive layer overlaps the conductive electrode at a projection portion of the third conductive layer along the thickness direction.

8. The circuit board assembly according to claim 7, characterized in that: The number of the first conductive layers and the number of the third conductive layers are both N, and the N first conductive layers and the N third conductive layers are sequentially arranged at intervals, where N is a positive integer.

9. An electronic device, characterized in that: include: A circuit board assembly as claimed in any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that: Also includes: A charging interface, electrically connected to the charging management chip; A conductive bracket supports the charging port and the circuit board assembly, wherein the first conductive member and the second conductive member are respectively connected to the circuit board and the conductive bracket.

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