A stereoscopic valve group module for an air conditioning system

By using a multi-layered plate structure and staggered flow channel design, the problem of large refrigerant channel area and inability to lay out complex pipes in existing heat pump air conditioning systems has been solved, realizing the integration of three-dimensional valve group modules and cost reduction.

CN115585582BActive Publication Date: 2026-04-17CHANGZHOU TIANMU INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHANGZHOU TIANMU INTELLIGENT TECH CO LTD
Filing Date
2022-09-29
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

The refrigerant passage of the valve island in existing heat pump air conditioning systems is a single-layer planar plate structure, which occupies a large area and cannot achieve complex pipe layout.

Method used

The plate structure is formed by multiple layers of aluminum or copper plates, with interwoven or independently set flow channels. The valves are set perpendicular to the plate and are processed by stamping to achieve three-dimensional integration.

Benefits of technology

It achieves unlimited valve integration, adjustable flow channel number and flow direction, compact structure, low cost, and suitability for complex pipeline layouts.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention belongs to the technical field of air conditioning systems for new energy vehicles, and particularly relates to a three-dimensional valve assembly module for air conditioning systems. It includes multiple sets of valves and multiple layers of flat plates, with the multiple flat plates arranged sequentially. Adjacent flat plates form a plate structure, each plate structure containing several flow channels. There are no flow channels between adjacent plate structures, or at least one set of adjacent plate structures also has several flow channels. At least one flow channel is interconnected, or the flow channels of each plate structure are independently arranged. Each valve is connected to at least one flow channel, is perpendicular to the plate, and can pass through the plate. There are layered gaps between adjacent plate structures through which the valve passes. Beneficial effects: This three-dimensional valve assembly module cleverly achieves three-dimensional integration of the valve assembly module, solving the problem that existing single-plate refrigerant channels occupy a large planar area and cannot achieve complex pipe layouts.
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Description

Technical Field

[0001] This invention belongs to the technical field of air conditioning systems for new energy vehicles, and particularly relates to a three-dimensional valve group module for air conditioning systems. Background Technology

[0002] Currently, the rapid development of the automotive industry has driven a significant expansion in demand for various automotive systems, including heat pump air conditioning systems. However, with rising consumer spending and increasingly stringent energy conservation and emission reduction policies, automotive air conditioning technology is constantly evolving and improving. In addition to simply cooling, heating, and defrosting the passenger compartment, automotive air conditioning systems must also provide battery cooling, motor waste heat recovery, and other functions, and are also involved in the battery thermal management of new energy vehicles. With the rapid development of new energy vehicles, the quality of different air conditioning systems will also affect battery charge distribution and driving range. Under the new automotive market development situation, automotive air conditioning system solutions will face a new round of upgrades and transformations.

[0003] Existing heat pump air conditioning systems utilize a wide variety of valves, which are generally distributed and installed independently in the piping. To address this issue, valve island design emerged. However, existing valve island refrigerant channels, as used by many manufacturers such as Tesla, employ a simple method of machining channels on aluminum blocks and then covering them with an aluminum plate. Because only one flat plate structure is used for refrigerant flow, the overall shape is flat, occupying a large area and making it impossible to implement complex piping solutions. Summary of the Invention

[0004] To address the problem that existing heat pump air conditioning systems have only one flat plate structure for refrigerant flow in the valve island refrigerant channel, resulting in a flat overall shape, large floor space occupation, and inability to implement complex piping, this invention provides a three-dimensional valve group module for air conditioning systems.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a three-dimensional valve group module for an air conditioning system, comprising multiple sets of valves and multiple layers of flat plates, wherein the multiple layers of flat plates are arranged sequentially, and two adjacent flat plates form a plate structure, wherein the plate structure has a plurality of flow channels, and there are no flow channels between adjacent plate structures, or at least one set of adjacent plate structures also has a plurality of flow channels.

[0006] At least one of the flow channels is interconnected, or the flow channels of the plate structure are all independently arranged; the valve is connected to at least one of the flow channels, the valve is arranged perpendicular to the plate, the valve can pass through the plate, and there is a layered gap between adjacent plate structures through which the valve passes.

[0007] Preferably, the flat plate is made of aluminum. Aluminum plates are lightweight and inexpensive; copper plates can also be used.

[0008] Preferably, the upper or lower half of the flow channel is stamped on the plate, and adjacent plates are joined together to form a complete section of the flow channel. This process, which replaces casting with stamping, facilitates manufacturing and reduces costs.

[0009] Furthermore, adjacent plates are welded together to form a complete section of the flow channel. This facilitates manufacturing, reduces costs, provides excellent sealing, and does not increase the weight of the three-dimensional valve assembly module.

[0010] Preferably, the number of plates is five. The first layer of plates is combined with the second layer of plates to form the first layer of plate structure; the second layer of plates is combined with the third layer of plates to form the second layer of plate structure; and the fourth layer of plates is combined with the fifth layer of plates to form the third layer of plate structure. There are layer gaps between the second and third layer plate structures. This three-dimensional valve assembly module layout resembles an overpass, cleverly achieving three-dimensional integration of the valve assembly module. This removes the limitation on the number of integrated valves, and the number and direction of flow channels can be adjusted according to the number of stacked plates. This solves the problem that existing single-plate refrigerant channels occupy a large planar area and cannot achieve complex pipe layouts.

[0011] Beneficial effects: The three-dimensional valve assembly module for air conditioning systems of the present invention has a simple and reliable structure. Its overall layout is similar to an overpass, and the plate structure is similar to a plate heat exchanger. It cleverly realizes the three-dimensional integration of the valve assembly module, so that the number of valves integrated is no longer limited, and the number and direction of flow channels can also be adjusted according to the number of stacked plates. It provides a new way to realize complex pipeline layouts and solves the problem that the existing single plate refrigerant channel occupies a large plane area and cannot realize complex pipeline layouts. The three-dimensional valve assembly module has a compact layout, is lightweight, and is easy to move and install. The three-dimensional valve assembly module abandons casting and uses stamping process instead, which is easier to process and manufacture and has a lower cost. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a three-dimensional structural schematic diagram of Embodiment 1 of the three-dimensional valve group module for an air conditioning system of the present invention;

[0014] Figure 2This is a three-dimensional structural schematic diagram of another angle of Embodiment 1 of the three-dimensional valve group module for an air conditioning system of the present invention;

[0015] Figure 3 This is a three-dimensional exploded view of Embodiment 1 of the three-dimensional valve group module for an air conditioning system according to the present invention;

[0016] In the diagram: 1. Valve, 2. Plate structure, 21. Flat plate, 211. Mounting hole, 22. Flow channel, 3. Layer gap. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1

[0019] like Figures 1-3 As shown, a three-dimensional valve assembly module for an air conditioning system includes multiple sets of valves 1 and multiple layers of flat plates 21. The multiple layers of flat plates 21 are arranged sequentially, and two adjacent flat plates 21 form a plate structure 2. The plate structure 2 has several flow channels 22, but there are no flow channels 22 between adjacent plate structures 2. The flow channels 22 of the plate structure 2 are all independently arranged, or at least one flow channel 22 of the plate structure 2 is staggered and connected. The valve 1 is connected to at least one of the flow channels 22. The valve 1 is arranged perpendicular to the plate 21 and can pass through the plate 21. There are layer gaps 3 between adjacent plate structures 2 through which the valve 1 passes. The valve 1 controls the opening and closing of each flow channel 22. The layout of this three-dimensional valve module is similar to an overpass, and the plate structure 2 is similar to a plate heat exchanger. It cleverly realizes the three-dimensional integration of the valve module, so that the number of valve components 1 integrated is no longer limited, and the number and direction of flow channels 22 can also be adjusted according to the number of stacked plates 21. This solves the problem that the existing single plate 21 type refrigerant channel occupies a large plane area and cannot achieve complex pipe layout.

[0020] Specifically, in this embodiment, there are five flat plates 21. The first layer of flat plates 21 and the second layer of flat plates 21 are combined to form the first layer of plate structure 2. The second layer of flat plates 21 and the third layer of flat plates 21 are combined to form the second layer of plate structure 2. The fourth layer of flat plates 21 and the fifth layer of flat plates 21 are combined to form the third layer of plate structure 2. There is a layer gap 3 between the second layer of plate structure 2 and the third layer of plate structure 2.

[0021] Specifically, in this embodiment, the plate 21 is an aluminum plate, which is lightweight and low in cost; copper plates can also be used. The upper or lower half of the flow channel 22 is stamped on the plate 21, and mounting holes 211 matching the valve 1 are also stamped on the plate 21. Adjacent plates 21 are joined together to form a complete section of the flow channel 22. The casting process is abandoned in favor of stamping, which is convenient for processing and manufacturing and has a lower cost. Adjacent plates 21 are joined together by welding to form a complete section of the flow channel 22.

[0022] The assembly process of this three-dimensional valve assembly module is as follows:

[0023] First, the upper or lower half of the flow channel 22 is stamped out on each plate 21, and mounting holes 211 matching the valve 1 are also stamped out on the plate 21. Then, the plates 21 are assembled and welded together in sequence, and two adjacent plates 21 form a plate structure 2. The upper and lower halves of the flow channel 22 of the adjacent plates 21 are matched to form a complete section of the flow channel 22. Then, the valve 1 is installed into the corresponding mounting holes 211 in sequence and connected to the corresponding flow channel 22 to complete the three-dimensional valve group module. The refrigerant pipeline of the air conditioning system can be connected to the corresponding valve 1, and the opening and closing of each flow channel 22 can be controlled by the valve 1.

[0024] Example 2

[0025] In this embodiment, the difference from embodiment 1 is that at least one group of adjacent plate structures 2 also has a number of flow channels 22, and at least one flow channel 22 between the plate structures 2 is interconnected, which increases the possibility of the flow channel 22's direction and makes it easier for the three-dimensional valve group module to select the flow channel 22 with the corresponding direction according to the actual working conditions.

[0026] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0027] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0028] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0029] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures with other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation besides the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0030] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0031] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A three-dimensional valve assembly module for an air conditioning system, characterized in that: It includes multiple sets of valve components (1) and multiple layers of plate (21). The multiple layers of plate (21) are arranged sequentially, and two adjacent plates (21) form a plate structure (2). The plate structure (2) has several flow channels (22). There are no flow channels (22) between adjacent plate structures (2), or at least one set of adjacent plate structures (2) also has several flow channels (22). At least one of the flow channels (22) are interconnected, or the flow channels (22) of the plate structure (2) are all independently set; the valve (1) is connected to at least one of the flow channels (22), the valve (1) is set perpendicular to the plate (21), the valve (1) can pass through the plate (21), and there is a layered gap (3) between the adjacent plate structures (2) through which the valve (1) passes.

2. The three-dimensional valve group module for an air conditioning system according to claim 1, characterized in that: The flat plate (21) is an aluminum plate.

3. The three-dimensional valve group module for an air conditioning system according to claim 2, characterized in that: The upper or lower half of the flow channel (22) is stamped out on the plate (21), and the flow channel (22) is formed by splicing adjacent plates (21).

4. The three-dimensional valve group module for an air conditioning system according to claim 3, characterized in that: The adjacent flat plates (21) are welded together to form a complete section of the flow channel (22).

5. The three-dimensional valve group module for an air conditioning system according to any one of claims 1 to 4, characterized in that: The number of the flat plates (21) is five. The first layer of flat plates (21) and the second layer of flat plates (21) are combined to form the first layer of the plate structure (2). The second layer of flat plates (21) and the third layer of flat plates (21) are combined to form the second layer of the plate structure (2). The fourth layer of flat plates (21) and the fifth layer of flat plates (21) are combined to form the third layer of the plate structure (2). There is a layer gap (3) between the second layer of the plate structure (2) and the third layer of the plate structure (2).

Citation Information

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