Fault detection device, method, system and storage medium

Abstract

The present invention discloses a fault detection device, which includes: a control module, a storage module and at least one interface communication module; the interface communication module is connected to the corresponding mainboard interface in the device to be tested; the control module is connected to the storage module and the at least one interface communication module, and is used to perform a pin cold soldering test on at least one mainboard interface to detect whether there is a cold soldering fault on the voltage input pin in at least one mainboard interface; and to perform a performance test and / or a stress test on at least one mainboard interface to detect whether there is a transmission fault on at least one mainboard interface. The technical solution of the embodiment of the present invention realizes the cold soldering fault detection of the voltage input pin, ensures the stability of the input voltage of the interface, and improves the safety performance of the interface. At the same time, it realizes the transmission fault detection of the data transmission pin, and improves the data transmission efficiency and data transmission accuracy of the interface.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a fault detection device, method, system and storage medium. Background Art

[0002] The motherboard of a computer device has a large number of communication interfaces, and each communication interface works together to complete the normal operation of the entire device. When the motherboard operates abnormally, it is necessary to accurately detect the location of the fault.

[0003] The prior art usually uses a motherboard diagnostic card (i.e., a motherboard fault diagnostic card) to detect abnormalities in the motherboard's boot process. Specifically, the detection results of the BIOS (Basic Input Output System) program in the motherboard are displayed in the form of code, and the fault can be quickly determined in combination with the meaning of the code.

[0004] However, the above fault diagnosis method can only roughly know which interface the fault occurs on. For the interface, it cannot determine in which functional component of the interface the fault occurs, nor can it determine the specific fault type in the interface, and the fault detection effect is poor. Summary of the invention

[0005] The present invention provides a fault detection device, method, system and storage medium to solve the detection of pin cold soldering fault and transmission fault in a mainboard interface.

[0006] According to one aspect of the present invention, there is provided a fault detection system, comprising: a control module, a storage module and at least one interface communication module; the interface communication module is connected to the corresponding mainboard interface in the device to be tested; the control module is connected to the storage module and the at least one interface communication module, and is used to perform a pin cold soldering test on at least one mainboard interface through at least one of the interface communication modules, so as to detect whether there is a cold soldering fault on the voltage input pin of the at least one mainboard interface; and to perform a performance test and / or a stress test on the at least one mainboard interface through the storage module and the at least one interface communication module, so as to detect whether there is a transmission fault on the at least one mainboard interface.

[0007] The control module is specifically used to obtain the real-time input voltage of at least one voltage input pin in the mainboard interface through the interface communication module, and compare the real-time input voltage with the corresponding standard input voltage to determine whether there is a first cold soldering fault pin in the at least one voltage input pin; wherein the first cold soldering fault pin is related to overvoltage, undervoltage or voltage oscillation. By detecting the first cold soldering fault pin in the mainboard interface, damage to external devices caused by voltage oscillation or excessive voltage is avoided, and the voltage is prevented from being too low to support the effective operation of external devices, thereby improving the safety performance of the mainboard interface.

[0008] The fault detection device also includes at least one indicator light; the control module is connected to the at least one indicator light, and is also used to change the brightness and / or color of the corresponding indicator light if the first cold soldering fault pin is related to overvoltage or undervoltage; if the first cold soldering fault pin is related to voltage oscillation, the working mode of the corresponding indicator light is set to flashing. The changes in the brightness, color and working mode of the indicator light not only intuitively reflect the overvoltage, undervoltage and voltage oscillation phenomena existing in the voltage input pins in the motherboard interface, but also the brightness adjustment and flashing interval time of the indicator light are configured according to a pre-set fixed value, avoiding the situation that the brightness is not significantly reduced when the undervoltage value is small, the brightness is increased too much when the overvoltage value is large, causing damage to the indicator light, and the flashing interval time is too long when the voltage oscillation frequency is low, resulting in the operator failing to perceive the fault in time.

[0009] The fault detection device also includes a display module; the control module is connected to the display module and is also used to display the number and fault type of the voltage input pin with a cold soldering fault through the display module; wherein the fault type includes at least one of open circuit, short circuit, overvoltage, undervoltage and voltage oscillation. Compared with the fault code displayed by the existing motherboard diagnostic card, which can only characterize the interface where the fault is located, the fault detection device of the present application can not only display the number of the specific fault pin through the display module, but also display the specific fault type caused by the pin, which greatly improves the convenience of fault detection in the motherboard interface and ensures that the operator can promptly know the accurate fault pin and fault type.

[0010] The control module is also specifically used to perform performance testing and / or stress testing on the mainboard interface through the storage module and the interface communication module, so as to obtain the transmission fault pin in each of the data transmission pins according to the performance parameters of each data transmission pin in the mainboard interface and the single pin performance parameter threshold; wherein the single pin performance parameter threshold is related to the interface performance parameter threshold of the current mainboard interface, or is related to both the interface performance parameter threshold of the current mainboard interface and the number of data transmission pins. Compared with the existing mainboard diagnostic card that can only determine the interface where the fault is located, the embodiment of the present invention not only realizes the detection of data transmission faults in the mainboard interface, but also determines that the transmission fault comes from a specific data transmission pin, further improving the fault detection accuracy of the mainboard interface.

[0011] The control module is specifically used to perform a performance test on the mainboard interface through the storage module and the interface communication module to detect whether there is a first transmission fault pin in the data transmission pins of the mainboard interface, and to perform a stress test on the mainboard interface to detect whether there is a second transmission fault pin in the data transmission pins of the mainboard interface; if the first transmission fault pin and the second transmission fault pin have the same target data transmission pin, it is determined that the target data transmission pin has a cold soldering fault. While realizing the cold soldering fault detection of the data transmission pin in the mainboard interface, the accuracy of the detection result is ensured, and the detection range of the pin cold soldering fault is expanded.

[0012] The control module is also specifically used to determine that the transmission fault of the data transmission pin is related to the cold soldering fault of the data transmission pin if no cold soldering fault is detected in any of the voltage input pins of the current motherboard interface and a transmission fault is detected in the data transmission pins in the current motherboard interface. By detecting the cold soldering fault of the voltage input pins in the motherboard interface and the transmission fault of the data transmission pins, the cold soldering fault detection of the data transmission pins is realized, and the accuracy of the detection result is further ensured.

[0013] According to one aspect of the present invention, a fault detection method is provided, and a control module applied to a fault detection device includes:

[0014] If a voltage input signal of the mainboard interface is obtained through the interface communication module, a first test signal is sent to the mainboard interface through the interface communication module;

[0015] If a feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time, it is determined whether a voltage input signal is not detected in each voltage input pin of the mainboard interface;

[0016] If no voltage input signal is detected in the first voltage input pin, it is determined that the first voltage input pin has a circuit breakage or cold solder joint fault;

[0017] If no feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within the preset waiting time, determining whether a voltage input signal is detected in each voltage input pin of the mainboard interface;

[0018] If a voltage input signal is detected in the second voltage input pin, it is determined that a short circuit or cold solder joint fault exists in the second voltage input pin.

[0019] According to another aspect of the present invention, a fault detection system is provided, comprising: a mainboard diagnostic card and a fault detection device; the fault detection device comprises a control module, a storage module and at least one interface communication module; the interface communication module is connected to a corresponding mainboard interface in a device to be tested;

[0020] The mainboard diagnostic card is used to perform fault detection on the mainboard of the device to be tested and display the fault code on a display screen;

[0021] The control module is connected to the mainboard diagnostic card and is used to determine the corresponding fault interface according to the fault code displayed by the mainboard diagnostic card, and perform a pin cold soldering test on the fault interface through a target interface communication module matching the fault interface to detect whether there is a cold soldering fault on the voltage input pin in the fault interface, and perform a performance test and / or a stress test on the fault interface through the storage module and the target interface communication module matching the fault interface to detect whether there is a transmission fault in the fault interface.

[0022] According to one aspect of the present invention, there is provided a fault detection device, which is configured in a control module and includes:

[0023] A voltage input signal detection module, configured to send a first test signal to the mainboard interface through the interface communication module if a voltage input signal of the mainboard interface is acquired through the interface communication module;

[0024] a feedback signal detection module, configured to determine whether no voltage input signal is detected in each voltage input pin of the mainboard interface if a feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time;

[0025] A circuit-breaking and cold-soldering fault detection module, configured to determine that a circuit-breaking and cold-soldering fault exists in the first voltage input pin if no voltage input signal is detected in the first voltage input pin;

[0026] a voltage input signal determination module, configured to determine whether a voltage input signal is detected in each voltage input pin of the mainboard interface if no feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time;

[0027] The short circuit and cold solder joint fault detection module is used to determine that a short circuit and cold solder joint fault exists in the second voltage input pin if a voltage input signal is detected in the second voltage input pin.

[0028] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the fault detection method described in any embodiment of the present invention when executed.

[0029] According to the technical solution of the embodiment of the present invention, the fault detection device performs a pin cold soldering test on the voltage input pin of the corresponding mainboard interface in the test device through the interface communication module, thereby realizing the cold soldering fault detection of the voltage input pin, ensuring the stability of the input voltage of the interface, and improving the safety performance of the interface. At the same time, through the storage module and the interface communication module, the performance test and / or stress test of the mainboard interface is performed, thereby realizing the transmission fault detection of the data transmission pin, and improving the data transmission efficiency and data transmission accuracy of the interface.

[0030] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1A is a structural schematic diagram of a fault detection device provided according to Embodiment 1 of the present invention;

[0033] Figure 1B is a structural schematic diagram of a fault detection device provided according to Embodiment 1 of the present invention;

[0034] Figure 2 is a flow chart of a fault detection method provided according to Embodiment 2 of the present invention;

[0035] Figure 3is a structural schematic diagram of a fault detection system provided according to Embodiment 3 of the present invention;

[0036] Figure 4 It is a structural schematic diagram of a fault detection device provided according to Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0039] Embodiment 1

[0040] Figure 1A A structural diagram of a fault detection device provided in Embodiment 1 of the present invention comprises: a control module 100, a storage module 200 and at least one interface communication module 300; the interface communication module 300 is connected to the corresponding mainboard interface in the device to be tested.

[0041] Since the motherboard of an electronic device usually includes a variety of different types of interfaces, for example, a PCI (Peripheral Component Interconnection) interface (i.e., a PCI slot), a memory slot, a PCIe (PCI-Express, Peripheral Component Interconnection Extension) interface, an Industrial Standard Architecture (ISA) slot, etc., the fault detection device may also include a plurality of interface communication modules 300, and the structure of each interface communication module 300 matches the structure of the corresponding interface on the motherboard, so that the fault detection device can connect to the corresponding interfaces on the motherboard through each interface communication module 300 when performing fault detection; optionally, in the embodiment of the present invention, the type, structure and number of the motherboard interface and the interface communication module 300 are not specifically limited.

[0042] The control module 100 is connected to the storage module 200 and the at least one interface communication module 300, and is used to perform a pin cold soldering test on at least one motherboard interface through at least one of the interface communication modules 300 to detect whether there is a cold soldering fault on the voltage input pins in the at least one motherboard interface; and to perform a performance test and / or a stress test on the at least one motherboard interface through the storage module 200 and the at least one of the interface communication modules 300 to detect whether there is a transmission fault on the at least one motherboard interface. Each interface on the motherboard has a fixed pin structure, and each pin has a fixed function; for example, the A2 pin in the PCI interface is used to input a 12V voltage, the A5 pin is used to input a 5V voltage, and the A27 pin is used to input a 3.3V voltage; therefore, it is possible to detect whether there is a voltage input signal on each voltage input pin.

[0043] Specifically, after the fault detection device is connected to the mainboard of the device to be tested, when the mainboard is in an unstarted state, the fault detection device cannot detect the input voltage signal from each voltage input pin of the mainboard interface through the interface communication module 300; when the mainboard is started, the fault detection device can detect the input voltage signal from each voltage input pin of the mainboard interface through the interface communication module 300; therefore, when the fault detection device obtains the input voltage provided by the mainboard through any voltage input pin, the fault detection device sends a first test signal to the mainboard through the interface communication module 300; if a feedback signal of the mainboard for the first test signal is obtained, it indicates that the mainboard has been started, and the input voltage obtained by the fault detection device is a normal voltage signal after the mainboard is started. At this time, if no voltage input signal is detected on one or more voltage input pins, it indicates that the above-mentioned voltage input pins are in an open circuit state due to a cold soldering fault.

[0044] If no feedback signal is obtained from the mainboard in response to the first test signal, it indicates that the mainboard has not been started at this time, and the input voltage obtained by the fault detection device is abnormal power supply caused by a short circuit. At this time, if a voltage input signal is detected on one or more voltage input pins, it indicates that the above-mentioned voltage input pins are in a short-circuit state due to a cold soldering fault; thereby, the cold soldering detection of the voltage input pins is achieved through open circuit detection and short circuit detection.

[0045] Optionally, in an embodiment of the present invention, the control module 100 is specifically used to obtain the real-time input voltage of at least one voltage input pin in the motherboard interface through the interface communication module 300, and compare the real-time input voltage with the corresponding standard input voltage to determine whether there is a first cold soldering fault pin in the at least one voltage input pin; wherein the first cold soldering fault pin is related to overvoltage, undervoltage or voltage oscillation. The standard input voltage is the input voltage of the current voltage input pin under normal working conditions, such as the A2 pin of the PCI interface in the above technical solution is used to provide a 12V input voltage, and the standard input voltage is 12V.

[0046] If within the preset detection time, the real-time input voltage of the current voltage input pin is less than the corresponding standard input voltage, it indicates that the current voltage input pin is undervoltage; if within the preset detection time, the real-time input voltage is greater than the corresponding standard input voltage, it indicates that the current voltage input pin is overvoltage; if within the preset detection time, the real-time input voltage is smaller than the standard input voltage at some moments and greater than the standard input voltage at some moments, it indicates that the current voltage input pin has voltage oscillation, and the current voltage input pin is a cold soldering fault pin (i.e., the first cold soldering fault pin); by detecting the first cold soldering fault pin in the motherboard interface, damage to external devices caused by voltage oscillation or excessive voltage is avoided, and the voltage is prevented from being too low to support the effective operation of external devices, thereby improving the safety performance of the motherboard interface.

[0047] like Figure 1BAs shown, optionally, in an embodiment of the present invention, the fault detection device further includes at least one indicator light 400; the control module 100 is connected to the at least one indicator light 400, and is also used to change the brightness and / or color of the corresponding indicator light 400 if the first cold soldering fault pin is related to overvoltage or undervoltage; if the first cold soldering fault pin is related to voltage oscillation, the working mode of the corresponding indicator light 400 is set to flashing. The fault detection device may include only one indicator light 400, and when there is at least one first cold soldering fault pin, the indicator light 400 is prompted to the detection personnel by changing the brightness, color or working mode; wherein the working mode includes always on, always off, and flashing; the fault detection device may also include multiple indicator lights 400, and different indicator lights 400 are matched one by one with the numbering result of the voltage input pin according to the numbering order, for example, the indicator light 400 No. 1 matches the voltage input pin with the highest number, and due to the different pin distributions of different interfaces, the voltage input pin may be the A2 pin, the A5 pin, or any other pin.

[0048] The changes in the brightness, color and working mode of the indicator light 400 not only intuitively reflect the overvoltage, undervoltage and voltage oscillation phenomena existing in the voltage input pins of the mainboard interface, but also the brightness adjustment and flashing interval of the indicator light 400 are configured according to pre-set fixed values, avoiding the situation where the brightness is not significantly reduced when the undervoltage value is small, the brightness is increased too much when the overvoltage value is large, causing damage to the indicator light 400, and the flashing interval is too long when the voltage oscillation frequency is low, resulting in the operator failing to promptly perceive the fault that has occurred.

[0049] Optionally, in an embodiment of the present invention, the fault detection device further includes a display module 500; the control module 100 is connected to the display module 500 and is also used to display the number and fault type of the voltage input pin with a cold soldering fault through the display module 500; wherein the fault type includes at least one of open circuit, short circuit, overvoltage, undervoltage and voltage oscillation. The control module 100 can determine the type, pin structure and number of each pin of the current motherboard interface according to the currently used interface communication module 300; if it is detected that the voltage input signal of a certain voltage input pin has an open circuit, short circuit, overvoltage, undervoltage or voltage oscillation, the number and fault type identification of the current voltage input pin are displayed through the display module 500; wherein, open circuit, short circuit, overvoltage, undervoltage or voltage oscillation correspond to different fault identifications respectively. Compared to the existing motherboard diagnostic card, in which the fault code displayed can only characterize the interface where the fault is located, the fault detection device of the present application can not only display the specific fault pin number through the display module 500, but also display the specific fault type caused by the pin, thereby greatly improving the convenience of fault detection in the motherboard interface and ensuring that the operator is aware of the accurate fault pin and fault type in a timely manner.

[0050] When the control module 100 performs a performance test on the mainboard interface, it first sends a performance test request to the mainboard; after obtaining the performance test request, the mainboard performs read and write data operations on the storage module 200 in the fault detection device through the current interface and the interface communication module 300 connected to the current interface; the control module 100 obtains the data operation results of the read and write data operations through the storage module 200; at the same time, the control module 100 also directly obtains the data execution parameters when the mainboard performs the above-mentioned read and write data operations through the interface communication module 300; finally, according to the above-mentioned data execution parameters and the data operation results, the performance parameters of this performance test can be determined.

[0051] Similarly, when the control module 100 performs a stress test on the mainboard interface, its test process is the same as the test process of the performance test, that is, firstly, a stress test request is sent to the mainboard; after the mainboard obtains the stress test request, the mainboard performs a read and write data operation on the storage module 200 in the fault detection device through the current interface and the interface communication module 300 connected to the current interface; the control module 100 obtains the data operation result of the read and write data operation through the storage module 200; at the same time, the control module 100 also directly obtains the data execution parameters when the mainboard performs the above-mentioned read and write data operation through the interface communication module 300; finally, according to the above-mentioned data execution parameters and data operation results, the performance parameters of this stress test can be determined. Among them, the difference between the performance test and the stress test is that the stress test is to perform a read and write data test on the current mainboard interface under a high load state, which reflects the communication performance of the communication link of the current mainboard interface under a high load state; the performance test is to perform a read and write data test on the current mainboard interface under a normal load (i.e., general load or low load) state, which reflects the communication performance of the communication link of the current mainboard interface under a normal load state.

[0052] Among them, the performance parameters include at least one of bit error rate, packet loss rate, rate, bandwidth and throughput; the bit error rate (symbol error rate) and packet loss rate are reliability indicators in the data transmission process, which reflect the transmission accuracy of the current motherboard interface in the data transmission process; the rate, bandwidth and throughput reflect the transmission efficiency of the current motherboard interface in the data transmission process; the larger the bit error rate or the packet loss rate, the lower the data transmission accuracy; the larger the rate, the larger the bandwidth or the larger the throughput, the higher the data transmission efficiency. If the performance parameters of the interface do not meet the interface performance parameter threshold, it is obvious that there is a transmission fault in the current motherboard interface.

[0053] Optionally, in an embodiment of the present invention, the control module 100 is further specifically used to perform performance testing and / or stress testing on the mainboard interface through the storage module 200 and the interface communication module 300, so as to obtain the transmission fault pin in each data transmission pin based on the performance parameters of each data transmission pin in the mainboard interface, and the single-pin performance parameter threshold; wherein the single-pin performance parameter threshold is related to the interface performance parameter threshold of the current mainboard interface, or is related to both the interface performance parameter threshold of the current mainboard interface and the number of data transmission pins.

[0054] Specifically, the single-pin bit error rate threshold and the single-pin packet loss rate threshold can be set to the interface bit error rate threshold and the interface packet loss rate threshold of the current motherboard interface, respectively; the quotient of the interface rate threshold and the number of data transmission pins of the current interface is used as the single-pin rate threshold, the quotient of the interface bandwidth threshold and the number of data transmission pins is used as the single-pin bandwidth threshold, and the quotient of the interface throughput threshold and the number of data transmission pins is used as the single-pin throughput threshold; after performance testing and / or stress testing, if the performance parameters of any data transmission pin do not meet the single-pin performance parameter threshold, there is a transmission fault in the data transmission pin, that is, the transmission fault pin; compared with the existing motherboard diagnostic card that can only determine the interface where the fault is located, the embodiment of the present invention not only realizes the detection of data transmission faults in the motherboard interface, but also determines that the transmission fault comes from a specific data transmission pin, further improving the fault detection accuracy of the motherboard interface.

[0055] Optionally, in an embodiment of the present invention, the control module 100 is specifically used to perform a performance test on the mainboard interface through the storage module 200 and the interface communication module 300 to detect whether there is a first transmission fault pin in the data transmission pins of the mainboard interface, and to perform a stress test on the mainboard interface to detect whether there is a second transmission fault pin in the data transmission pins of the mainboard interface; if the first transmission fault pin and the second transmission fault pin have the same target data transmission pin, it is determined that the target data transmission pin has a cold soldering fault. Since the performance test and the stress test are performed at different time points and under different load conditions, if the same data transmission pin has a transmission fault during the above two tests, it can be determined that the pin fault is not caused by accidental external factors, but is caused by the cold soldering problem of the data transmission pin itself. Therefore, while realizing the cold soldering fault detection of the data transmission pin in the mainboard interface, the accuracy of the detection result is ensured, and the detection range of the pin cold soldering fault is expanded.

[0056] Optionally, in an embodiment of the present invention, the control module 100 is also specifically used to determine that the transmission fault of the data transmission pin is related to the cold soldering fault of the data transmission pin if no cold soldering fault is detected in the voltage input pins of the current motherboard interface, and a transmission fault is detected in the data transmission pins in the current motherboard interface. When a cold soldering fault exists in the voltage input pins in the interface, resulting in a small input voltage or an unstable input voltage (i.e., there is voltage oscillation), the above voltage state will also affect the data transmission efficiency and data transmission accuracy of the interface. Therefore, if no cold soldering fault is detected in the voltage input pins of the current motherboard interface, but a transmission fault is detected in the data transmission pins, it indicates that the transmission fault in the data transmission pins is caused by the cold soldering fault of the data transmission pins themselves. Therefore, by detecting the cold soldering fault of the voltage input pins in the motherboard interface and the transmission fault of the data transmission pins, the cold soldering fault detection of the data transmission pins is realized, and the accuracy of the detection result is further ensured.

[0057] According to the technical solution of the embodiment of the present invention, the fault detection device performs a pin cold soldering test on the voltage input pin of the corresponding mainboard interface in the test device through the interface communication module, thereby realizing the cold soldering fault detection of the voltage input pin, ensuring the stability of the input voltage of the interface, and improving the safety performance of the interface. At the same time, through the storage module and the interface communication module, the performance test and / or stress test of the mainboard interface is performed, thereby realizing the transmission fault detection of the data transmission pin, and improving the data transmission efficiency and data transmission accuracy of the interface.

[0058] Embodiment 2

[0059] Figure 2 This is a flow chart of a fault detection method provided in the second embodiment of the present invention. This embodiment can be applied to a fault detection device to detect a cold soldering fault of a voltage input pin in a motherboard interface. This method can be executed by the control module of the fault detection device in the first embodiment. Figure 2 As shown, the method includes:

[0060] S201. If a voltage input signal of a mainboard interface is acquired through an interface communication module, a first test signal is sent to the mainboard interface through the interface communication module.

[0061] S202: If a feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time, it is determined whether a voltage input signal is not detected in each voltage input pin of the mainboard interface.

[0062] S203: If no voltage input signal is detected in the first voltage input pin, determine that the first voltage input pin has a circuit breakage or cold solder joint fault.

[0063] If voltage input signals are detected in all voltage input pins, it indicates that there are no broken or cold-soldered pins in the current interface.

[0064] S204: If no feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time, determine whether a voltage input signal is detected in each voltage input pin of the mainboard interface.

[0065] S205: If a voltage input signal is detected in the second voltage input pin, determine that a short circuit or cold solder joint fault exists in the second voltage input pin.

[0066] If no voltage input signal is detected in all voltage input pins, it indicates that there are no short-circuited or cold-soldered pins in the current interface.

[0067] According to the technical solution of the embodiment of the present invention, the fault detection device performs a pin cold soldering test on the voltage input pin of the corresponding mainboard interface in the test device through the interface communication module, thereby realizing short-circuit cold soldering fault detection and open-circuit cold soldering fault detection of the voltage input pin, ensuring the stability of the input voltage of the interface and improving the safety performance of the interface.

[0068] Embodiment 3

[0069] Figure 3 A structural schematic diagram of a fault detection system provided for Embodiment 3 of the present invention, the system comprising: a mainboard diagnostic card 600 and a fault detection device 700; the fault detection device 700 comprises a control module 100, a storage module 200 and at least one interface communication module 300; the interface communication module 300 is connected to a corresponding mainboard interface in a device to be tested; the mainboard diagnostic card 600 is used to perform fault detection on the mainboard of the device to be tested and display the fault code on a display screen.

[0070] The control module 100 is connected to the mainboard diagnostic card 600, and is used to determine the corresponding fault interface according to the fault code displayed by the mainboard diagnostic card 600, and perform a pin cold soldering test on the fault interface through a target interface communication module 300 matching the fault interface to detect whether there is a cold soldering fault on the voltage input pin in the fault interface, and perform a performance test and / or a stress test on the fault interface through the storage module 200 and the target interface communication module 300 matching the fault interface to detect whether there is a transmission fault in the fault interface.

[0071] Specifically, the control module 100 of the fault detection device 700 is connected to the mainboard diagnostic card 600. When the mainboard diagnostic card 600 obtains the fault code, the control module 100 obtains the fault interface corresponding to the current fault code based on the mapping relationship between the fault code and the fault interface, and then determines the target interface communication module 300 corresponding to the fault interface, and then calls the target interface communication module 300 to detect the cold soldering fault of the voltage input pin in the mainboard interface and the data transmission fault in the mainboard interface through the fault detection method disclosed in the above technical solution.

[0072] According to the technical solution of the embodiment of the present invention, the fault detection system performs a large-scale fault detection on the mainboard through the mainboard diagnostic card, and preliminarily determines the interface where the fault is located, and then calls the target interface communication module corresponding to the interface where the fault is located through the fault detection device, and performs a cold soldering fault detection on the voltage input pins in the interface where the fault is located. At the same time, a transmission fault detection is performed on the interface where the fault is located. While realizing comprehensive fault detection of the mainboard, cold soldering detection of pins in the fault interface and transmission fault detection are also realized, thereby realizing targeted detection of the faulty interface and improving the fault detection accuracy.

[0073] Embodiment 4

[0074] Figure 4 : is a structural block diagram of a fault detection device provided by Embodiment 4 of the present invention, the device specifically comprises:

[0075] A voltage input signal detection module 401 is used to send a first test signal to the mainboard interface through the interface communication module if a voltage input signal of the mainboard interface is acquired through the interface communication module;

[0076] A feedback signal detection module 402, configured to determine whether no voltage input signal is detected in each voltage input pin of the mainboard interface if a feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time;

[0077] A circuit-breaking and cold-soldering fault detection module 403 is used to determine that a circuit-breaking and cold-soldering fault exists in the first voltage input pin if no voltage input signal is detected in the first voltage input pin;

[0078] A voltage input signal determination module 404 is configured to determine whether a voltage input signal is detected in each voltage input pin of the mainboard interface if no feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time;

[0079] The short circuit and cold solder joint fault detection module 405 is used to determine that a short circuit and cold solder joint fault exists in the second voltage input pin if a voltage input signal is detected in the second voltage input pin.

[0080] According to the technical solution of the embodiment of the present invention, the fault detection device performs a pin cold soldering test on the voltage input pin of the corresponding mainboard interface in the test device through the interface communication module, thereby realizing short-circuit cold soldering fault detection and open-circuit cold soldering fault detection of the voltage input pin, ensuring the stability of the input voltage of the interface and improving the safety performance of the interface.

[0081] The above device can execute the fault detection method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method. For technical details not described in detail in this embodiment, please refer to the fault detection method provided by any embodiment of the present invention.

[0082] Embodiment 5

[0083] In some embodiments, the fault detection method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit. In some embodiments, part or all of the computer program may be loaded and / or installed on a heterogeneous hardware accelerator via a ROM and / or a communication unit. When the computer program is loaded into RAM and executed by a processor, one or more steps of the fault detection method described above may be performed. Alternatively, in other embodiments, the processor may be configured to perform the fault detection method in any other appropriate manner (e.g., by means of firmware).

[0084] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0085] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0086] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0087] To provide interaction with a user, the systems and techniques described herein may be implemented on a heterogeneous hardware accelerator having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and pointing device (e.g., a mouse or trackball) through which a user can provide input to the heterogeneous hardware accelerator. Other types of devices may also be used to provide interaction with a user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0088] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0089] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0090] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0091] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A fault detection device, characterized in that: include: A control module, a storage module and at least one interface communication module; The interface communication module is connected to the corresponding mainboard interface in the device to be tested; The control module is connected to the storage module and the at least one interface communication module, and is used to perform a pin cold soldering test on at least one mainboard interface through at least one of the interface communication modules to detect whether there is a cold soldering fault on a voltage input pin in the at least one mainboard interface; and performing a performance test and / or a stress test on the at least one mainboard interface through the storage module and at least one of the interface communication modules to detect whether there is a transmission fault in the at least one mainboard interface; The control module is specifically used to obtain the real-time input voltage of at least one voltage input pin in the mainboard interface through the interface communication module, and compare the real-time input voltage with the corresponding standard input voltage to determine whether there is a first cold soldering fault pin in the at least one voltage input pin; wherein the first cold soldering fault pin is related to overvoltage, undervoltage or voltage oscillation; The control module is specifically used to perform a performance test on the mainboard interface through the storage module and the interface communication module to detect whether there is a first transmission fault pin among the data transmission pins of the mainboard interface, and to perform a stress test on the mainboard interface to detect whether there is a second transmission fault pin among the data transmission pins of the mainboard interface; if the first transmission fault pin and the second transmission fault pin have the same target data transmission pin, it is determined that the target data transmission pin has a cold soldering fault.

2. The fault detection device according to claim 1, characterized in that: The fault detection device also includes at least one indicator light; The control module is connected to the at least one indicator light and is also used to change the brightness and / or color of the corresponding indicator light if the first cold soldering fault pin is related to overvoltage or undervoltage; if the first cold soldering fault pin is related to voltage oscillation, set the working mode of the corresponding indicator light to flashing.

3. The fault detection device according to claim 1, characterized in that: The fault detection device also includes a display module; The control module is connected to the display module and is also used to display the number and fault type of the voltage input pin with a cold soldering fault through the display module; wherein the fault type includes at least one of open circuit, short circuit, overvoltage, undervoltage and voltage oscillation.

4. The fault detection device according to claim 1, characterized in that: The control module is further specifically used to perform a performance test and / or a stress test on the mainboard interface through the storage module and the interface communication module, so as to obtain a transmission fault pin in each of the data transmission pins according to the performance parameters of each data transmission pin in the mainboard interface and the single pin performance parameter threshold; The single-pin performance parameter threshold is related to the interface performance parameter threshold of the current motherboard interface, or is related to both the interface performance parameter threshold of the current motherboard interface and the number of data transmission pins.

5. The fault detection device according to claim 1, characterized in that: The control module is also specifically used to determine that the transmission fault of the data transmission pin is related to the cold soldering fault of the data transmission pin if no cold soldering fault is detected in the voltage input pins of the current motherboard interface and a transmission fault is detected in the data transmission pins in the current motherboard interface.

6. A fault detection method, characterized in that: A control module applied to the fault detection device according to any one of claims 1 to 5, comprising: If a voltage input signal of the mainboard interface is obtained through the interface communication module, a first test signal is sent to the mainboard interface through the interface communication module; If a feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within a preset waiting time, it is determined whether a voltage input signal is not detected in each voltage input pin of the mainboard interface; If no voltage input signal is detected in the first voltage input pin, it is determined that the first voltage input pin has a circuit breakage or cold solder joint fault; If no feedback signal of the mainboard interface for the first test signal is obtained through the interface communication module within the preset waiting time, determining whether a voltage input signal is detected in each voltage input pin of the mainboard interface; If a voltage input signal is detected in the second voltage input pin, it is determined that a short circuit or cold solder joint fault exists in the second voltage input pin.

7. A fault detection system, characterized in that: include: Mainboard diagnostic card and fault detection device; the fault detection device includes a control module, a storage module and at least one interface communication module; The interface communication module is connected to the corresponding mainboard interface in the device to be tested; The mainboard diagnostic card is used to perform fault detection on the mainboard of the device to be tested and display the fault code on a display screen; The control module is connected to the mainboard diagnostic card and is used to determine the corresponding fault interface according to the fault code displayed by the mainboard diagnostic card, and perform a pin cold soldering test on the fault interface through a target interface communication module matching the fault interface to detect whether there is a cold soldering fault on the voltage input pin in the fault interface, and perform a performance test and / or a stress test on the fault interface through the storage module and the target interface communication module matching the fault interface to detect whether there is a transmission fault in the fault interface; The control module is specifically used to obtain the real-time input voltage of at least one voltage input pin in the mainboard interface through the interface communication module, and compare the real-time input voltage with the corresponding standard input voltage to determine whether there is a first cold soldering fault pin in the at least one voltage input pin; wherein the first cold soldering fault pin is related to overvoltage, undervoltage or voltage oscillation; The control module is specifically used to perform a performance test on the mainboard interface through the storage module and the interface communication module to detect whether there is a first transmission fault pin among the data transmission pins of the mainboard interface, and to perform a stress test on the mainboard interface to detect whether there is a second transmission fault pin among the data transmission pins of the mainboard interface; if the first transmission fault pin and the second transmission fault pin have the same target data transmission pin, it is determined that the target data transmission pin has a cold soldering fault.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the fault detection method of claim 6 when executed.

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