Vacuum system and plasma deposition equipment

Abstract

The present invention belongs to the technical field of deposition equipment, and discloses a vacuum pumping system and a plasma deposition equipment. The vacuum pumping system is used to vacuum a reaction chamber, and the reaction chamber is used to accommodate undeposited matter. The vacuum pumping system includes a connecting pipe, a vacuum pump and a cleaning device. One end of the connecting pipe is connected to the reaction chamber, and the suction end of the vacuum pump is connected to the other end of the connecting pipe. The cleaning device is connected to the side wall of the connecting pipe. The cleaning device includes a dust collector, and the dust collector is provided with a vacuum inner cavity. The dust collector is used to collect undeposited matter. The cleaning device in the vacuum pumping system provided by the present invention uses the vacuum inner cavity to suck in the undeposited matter remaining in the connecting pipe. The cleaning device can effectively remove the undeposited matter remaining in the vacuum pumping system, and prevent the problem of insufficient vacuum degree caused by the accumulation of undeposited matter blocking the vacuum pump. The vacuum pumping system can keep the interior of the reaction chamber in a vacuum state, improve production efficiency, and ensure the production quality of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of deposition equipment, and in particular to a vacuum pumping system and a plasma deposition equipment. Background Art

[0002] Plasma is a very good conductor. Plasma technology is widely used in various industries, such as semiconductors, biomedicine, optical fiber preforms, and automotive parts industries. The generation of plasma requires electrons to obtain energy from an external electromagnetic field. The electrons undergo inelastic collisions, which produce reactions such as excitation, dissociation adsorption, dissociation, ionization, and recombination, thereby generating secondary electrons, atoms, molecules, ions, and other substances. During the dissociation and collision process, electrons recombine with gas ions to produce a plasma state. An important condition that determines the generation of plasma is MFP (mean free path: the average distance that particles can move before colliding with each other). MFP is inversely proportional to the ambient pressure. The lower the pressure, the longer the MFP. Therefore, plasma needs to be formed in a low-pressure, near-vacuum reaction chamber.

[0003] In the prior art, plasma deposition equipment is usually equipped with a vacuum system and a reaction chamber, and the vacuum system is used to vacuum the reaction chamber to make the production environment reach a vacuum state. However, plasma cannot be 100% deposited, and the undeposited powder will be sucked into the vacuum system. As the production time increases, the vacuum pump of the vacuum system will be blocked, affecting the suction force of the vacuum pump and causing the vacuum degree in the reaction chamber to change, affecting the quality of the plasma product. In addition, the components contained in the undeposited powder (such as silicon tetrachloride) are corrosive, and need to be cleaned in time after being blocked. However, repeated cleaning of the vacuum system also greatly affects work efficiency.

[0004] Therefore, there is an urgent need for a vacuum pumping system and a plasma deposition device to solve the above problems. Summary of the invention

[0005] The first object of the present invention is to provide a vacuum system to solve the problem that undeposited matter inside the vacuum system is easy to clog the vacuum pump, and can quickly and effectively clean the undeposited matter inside the vacuum system, thereby improving work efficiency.

[0006] The second object of the present invention is to provide a plasma deposition device to solve the problem that undeposited materials inside the plasma deposition device are prone to block the vacuum system, so that a vacuum reaction environment can be maintained in the reaction chamber, thereby improving work efficiency.

[0007] To achieve the first purpose, the present invention adopts the following technical solutions:

[0008] A vacuum pumping system, used for vacuuming a reaction chamber, wherein the reaction chamber is used for containing undeposited matter, comprising:

[0009] A connecting pipe, one end of which is connected to the reaction chamber;

[0010] A vacuum pump, wherein the vacuum pump has an air extraction end connected to the other end of the connecting pipe;

[0011] The cleaning device comprises a dust collector, the dust collector is communicated with the side wall of the connecting pipe, and the inner cavity of the dust collector is a vacuum inner cavity so that the dust collector can collect the undeposited matter.

[0012] Preferably, the vacuum system further comprises a filter element, wherein the filter element is disposed in the connecting pipe and is used for filtering the undeposited matter, and the communication position between the dust collector and the connecting pipe is located on a side of the filter element facing the reaction chamber.

[0013] Preferably, the connecting pipe comprises:

[0014] a first connecting pipe, one end of which is in communication with the reaction chamber, and the dust collector is in communication with the first connecting pipe;

[0015] A second connecting pipe, one end of the second connecting pipe is connected to the other end of the first connecting pipe, the other end of the second connecting pipe is connected to the vacuum pump, the first connecting pipe and the second connecting pipe are detachably connected, and the filter is arranged at the connection between the first connecting pipe and the second connecting pipe.

[0016] Preferably, a first connecting portion is provided at the end of the first connecting tube, and a second connecting portion is provided at the end of the second connecting tube. The first connecting portion and the second connecting portion are detachably connected. A receiving groove is provided on the first connecting portion and / or the second connecting portion, and the filter element is arranged in the receiving groove.

[0017] Preferably, the cleaning device further comprises:

[0018] a third connecting pipe, one end of which is connected to the dust collector, and the other end of which is connected to the connecting pipe;

[0019] A switch valve is disposed on the third connecting pipe, and the switch valve can open or close the third connecting pipe.

[0020] Preferably, the vacuum pumping system further comprises a pressure sensor, a detection end of the pressure sensor is disposed in the connecting tube, and the pressure sensor is used to detect the pressure value in the reaction chamber.

[0021] Preferably, the vacuum pumping system further comprises a display panel, wherein the display panel is electrically connected to the pressure sensor, and the display panel can display the pressure value detected by the pressure sensor.

[0022] Preferably, the cleaning device further comprises a position sensor, wherein the position sensor is disposed in the dust collector, and the position sensor is used to detect the height of the undeposited matter in the dust collector.

[0023] Preferably, the vacuum system further comprises a display panel, wherein the display panel is electrically connected to the position sensor, and the display panel can display the height of the undeposited matter in the dust collector detected by the position sensor.

[0024] To achieve the second purpose, the present invention adopts the following technical solutions:

[0025] The plasma deposition equipment comprises a reaction chamber and the above-mentioned vacuum pumping system, one end of the connecting pipe is connected to the reaction chamber, and the vacuum pumping system is used to vacuum the reaction chamber.

[0026] Beneficial effects of the present invention:

[0027] The vacuum pumping system provided by the present invention is used to vacuumize a reaction chamber. There are undeposited materials in the reaction chamber. One end of a connecting pipe is connected to the reaction chamber, and the suction end of a vacuum pump is connected to the other end of the connecting pipe. By setting a vacuum pump, the reaction chamber can be vacuumed to achieve a vacuum state in the reaction chamber. A cleaning device includes a dust collector, and the inner cavity of the dust collector is a vacuum inner cavity. The dust collector is used to collect undeposited materials. By setting a cleaning device, the vacuum inner cavity can suck in the undeposited materials remaining in the connecting pipe. The cleaning device can effectively and quickly remove the undeposited materials remaining in the vacuum pumping system to prevent the vacuum pump from being blocked due to the accumulation of undeposited materials. The vacuum pumping system can keep the interior of the reaction chamber in a vacuum state, thereby improving production efficiency and ensuring the production quality of the product.

[0028] The plasma deposition equipment provided by the present invention comprises the above-mentioned vacuum pumping system and reaction chamber. By setting a cleaning device in the vacuum pumping system, the vacuum cavity can suck in the undeposited materials left in the connecting pipe, and the cleaning device can effectively and quickly remove the undeposited materials left in the vacuum pumping system to prevent the vacuum pumping system from being blocked due to the accumulation of undeposited materials. The vacuum pumping system can keep the interior of the reaction chamber in a vacuum state continuously, thereby ensuring the vacuum environment required for plasma deposition and ensuring the production quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic structural diagram of the vacuum pumping system of the present invention;

[0030] Figure 2It is an exploded schematic diagram of a partial structure of the vacuum pumping system of the present invention.

[0031] In the figure:

[0032] 1. Reaction chamber;

[0033] 2. Connecting pipe; 21. First connecting pipe; 211. First connecting portion; 22. Second connecting pipe; 221. Second connecting portion;

[0034] 3. Vacuum pump;

[0035] 4. Cleaning device; 41. Dust collector; 42. Third connecting pipe; 43. Switch valve;

[0036] 5. Filter element;

[0037] 6. Pressure sensor;

[0038] 7. Receiving tank. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0043] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0044] like Figure 1 and Figure 2 As shown, the present invention provides a vacuum pumping system, which is used to vacuum a reaction chamber 1, wherein there are undeposited materials in the reaction chamber 1.

[0045] like Figure 1 As shown, the vacuum system includes a connecting pipe 2, a vacuum pump 3 and a cleaning device 4, one end of the connecting pipe 2 is connected to the reaction chamber 1, the exhaust end of the vacuum pump 3 is connected to the other end of the connecting pipe 2, and the cleaning device 4 includes a dust collector 41, the dust collector 41 is connected to the side wall of the connecting pipe 2, and the inner cavity of the dust collector 41 is a vacuum cavity so that the dust collector 41 can collect undeposited matter.

[0046] The vacuum system provided in this embodiment can provide a pipeline for air circulation between the vacuum pump 3 and the reaction chamber 1 by providing a connecting pipe 2, so that the vacuum pump 3 can evacuate the reaction chamber 1. By providing a vacuum pump 3, the reaction chamber 1 can be evacuated to maintain a vacuum state in the reaction chamber 1, and the vacuum pump 3 will extract the undeposited matter while evacuating the reaction chamber 1. By providing a dust collector 41, the undeposited matter in the reaction chamber 1 and the connecting pipe 2 can be sucked into the vacuum cavity by the negative pressure of the vacuum cavity. By providing a cleaning device 4, the undeposited matter in the reaction chamber 1 and the connecting pipe 2 can be effectively removed and collected in the dust collector 41, preventing the vacuum pump 3 from being blocked due to the accumulation of undeposited matter, and preventing the vacuum pump 3 from affecting the vacuum degree in the reaction chamber 1 due to the blockage of the vacuum pump 3. The vacuum system can keep the inside of the reaction chamber 1 in a vacuum state, improve production efficiency, and ensure the production quality of the product.

[0047] It is worth noting that the dust collector 41 can be evacuated by the vacuum pump 3 in the vacuum system to form a vacuum cavity, and can also be evacuated by other vacuum devices (such as vacuum generators, etc.) outside the vacuum system to form a vacuum cavity.

[0048] like Figure 2As shown, the vacuum system provided in this embodiment also includes a filter 5, which is arranged in the connecting pipe 2. The filter 5 is used to filter undeposited matter, and the communication position between the dust collector 41 and the connecting pipe 2 is located on the side of the filter 5 facing the reaction chamber 1. Specifically, the dust collector 41 is connected to the side wall of the connecting pipe 2 located between the filter 5 and the reaction chamber 1. During the process of vacuumizing the reaction chamber 1, the vacuum pump 3 will also suck the undeposited matter in the reaction chamber 1 into the connecting pipe 2. By arranging the filter 5 in the connecting pipe 2, it is possible to effectively prevent the undeposited matter from being drawn into the vacuum pump 3, prevent the vacuum pump 3 from being blocked, ensure the vacuum environment in the reaction chamber 1, and make it easier for the dust collector 41 to collect the undeposited matter remaining in the connecting pipe 2. The connecting position between the dust collector 41 and the connecting pipe 2 is located on the side of the filter element 5 facing the reaction chamber 1, which is conducive to collecting the undeposited matter in the connecting pipe 2 blocked by the filter element 5, preventing the vacuum degree in the reaction chamber 1 from being affected by the blockage of the filter element 5, ensuring the vacuum environment in the reaction chamber 1, ensuring the product quality in the reaction chamber 1, and extending the service life of the filter element 5.

[0049] Specifically, the filter element 5 is a filter screen with a pore size of 1 μm and a filtering accuracy of 0.1 μm, which can block most of the undeposited matter in the connecting pipe.

[0050] Further, in the present embodiment, the connecting pipe 2 includes a first connecting pipe 21 and a second connecting pipe 22, one end of the first connecting pipe 21 is in communication with the reaction chamber 1, the dust collector 41 is in communication with the first connecting pipe 21, one end of the second connecting pipe 22 is in communication with the other end of the first connecting pipe 21, the other end of the second connecting pipe 22 is in communication with the vacuum pump 3, the first connecting pipe 21 and the second connecting pipe 22 are detachably connected, and the filter element 5 is disposed at the connection between the first connecting pipe 21 and the second connecting pipe 22. By providing the first connecting pipe 21 and the second connecting pipe 22 to be detachably connected, the operation process of placing the filter element 5 on the connecting pipe 2 is simplified, the filter element 5 is easily replaced, and the clogging frequency of the filter element 5 is effectively reduced, thereby ensuring the vacuum environment in the reaction chamber 1, which is conducive to improving production efficiency and ensuring product quality.

[0051] Furthermore, if Figure 2 As shown, the end of the first connecting member 21 is provided with a first connecting portion 211, the end of the second connecting tube 22 is provided with a second connecting portion 221, the first connecting portion 211 and the second connecting portion 221 are detachably connected, and a receiving groove 7 is provided on the first connecting portion 211 and / or the second connecting portion 221. By providing the receiving groove 7, the filter element 5 can be arranged in the receiving groove 7, which is convenient for positioning and installing the filter element 5, and the position of the filter element 5 can be fixed, so as to more effectively filter the undeposited matter, prevent the vacuum pump 3 from being blocked, and prevent the vacuum environment of the reaction chamber 1 from being affected.

[0052] Specifically, the accommodating groove 7 is placed at the connection between the first connecting part 211 and the second connecting part 221. Optionally, the accommodating groove 7 can be placed on the first connecting part 211, or on the second connecting part 221, or on the first connecting part 211 and the second connecting part 221. Further, the first connecting part 211 and the second connecting part 221 can be connected by bolts or other connecting parts, which is not specifically limited here.

[0053] Further, in the present embodiment, the cleaning device 4 further includes a third connecting pipe 42 and a switch valve 43, one end of the third connecting pipe 42 is connected to the dust collector 41, and the other end of the third connecting pipe 42 is connected to the connecting pipe 2. Specifically, the other end of the third connecting pipe 42 is connected to the first connecting pipe 21, and the switch valve 43 is placed on the third connecting pipe 42, and the switch valve 43 can open or close the third connecting pipe 42. Through the above-mentioned structural arrangement, the switch valve 43 can be opened when it is necessary to clean the deposited matter, and the switch valve 43 can be closed when it is not necessary to clean the deposited matter, thereby improving the practicality of the cleaning device 4.

[0054] Optionally, the switch valve 43 is an electric ball valve. The switch valve 43 can also be set as a manual valve or other electric valves, which are not specifically limited here.

[0055] Preferably, the vacuum system further includes a pressure sensor 6, and the detection end of the pressure sensor 6 is placed in the connecting tube 2. Specifically, the detection end of the pressure sensor 6 is placed in the first connecting tube 21, and the pressure sensor 6 is used to detect the pressure value in the reaction chamber 1, and can also detect the pressure value in the first connecting tube 21. By providing the pressure sensor 6, it is convenient for the operator to observe the pressure value in the reaction chamber 1 or in the first connecting tube 21. By observing the pressure value in the reaction chamber 1 or in the first connecting tube 21, the blockage of the vacuum pump 3 or the filter element 5 can be determined to prevent the vacuum degree in the reaction chamber 1 from being affected.

[0056] Specifically, the pressure sensor 6 has a measuring range of 0-1000 mbar and a control accuracy of 0.01 mbar, and can accurately measure the pressure value in the reaction chamber 1 or in the first connecting pipe 21 .

[0057] Furthermore, the pressure sensor 6 is electrically connected to the switch valve 43, and the switch valve 43 can be automatically opened or closed according to the pressure value detected by the pressure sensor 6. Through the above-mentioned structural arrangement, the undeposited materials in the reaction chamber 1 and the first connecting pipe 21 can be cleaned in time, and the vacuum pump 3 or the filter element 5 can be prevented from being blocked, and the vacuum environment in the reaction chamber 1 can be further ensured, which reduces the work intensity of the operator, is conducive to improving the automation degree of the equipment, and reduces the labor cost.

[0058] Furthermore, the cleaning device 4 also includes a position sensor, which is arranged in the dust collector 41 and is used to detect the height of the undeposited matter in the dust collector 41. Through the above-mentioned structural arrangement, when the height of the undeposited matter in the dust collector 41 is high, the undeposited matter in the dust collector 41 can be removed in time to prevent the undeposited matter from overflowing the dust collector 41, which is conducive to improving work efficiency.

[0059] In this embodiment, the position sensor adopts a laser sensor, including a transmitting end and a receiving end. The transmitting end is arranged at the top of the dust collector 41. The transmitting end emits laser from top to bottom. The laser will be reflected when it encounters undeposited objects. The receiving end can receive the laser reflected by the undeposited objects and image it to an avalanche photodiode. The avalanche photodiode converts the optical signal into an electrical signal, thereby detecting the height of the undeposited objects.

[0060] Among them, the structures and detection principles of the pressure sensor 6 and the position sensor can refer to the existing technology, which is not the protection focus of this embodiment and will not be described here.

[0061] In this embodiment, the vacuum system further includes a display panel, which is electrically connected to the pressure sensor 6, and can display the pressure value detected by the pressure sensor 6. The display panel is electrically connected to the position sensor, and can display the height of the undeposited matter in the dust collector 41 detected by the position sensor. Since the pressure value in the reaction chamber 1 will be affected after the vacuum pump 3 or the filter element 5 is blocked, the display panel is provided to facilitate the operator to monitor the pressure value in the reaction chamber 1 in real time, and open the switch valve 43 when the pressure value increases, which helps to maintain the vacuum degree in the reaction chamber 1 and ensure its product quality.

[0062] Optionally, the number of display panels may be one or two, one display panel may be electrically connected to the pressure sensor 6 and the position sensor at the same time, and two display panels may be electrically connected to the pressure sensor 6 and the position sensor respectively.

[0063] In this embodiment, the display panel can display the pressure value detected by the pressure sensor 6 (i.e., the actual value), and can also set and display a pressure value (i.e., the set value) according to the production requirements of the product. The display panel can also display two height values ​​(i.e., the first height value and the second height value) of the undeposited matter detected by the position sensor. When the height of the undeposited matter reaches the second height value or when the actual value of the detected pressure exceeds the set value, the display panel can display an alarm state to alert the operator.

[0064] Specifically, the display panel shows that the two height values ​​of the undeposited matter detected by the position sensor are: 20% of the height of the dust collector 41 (ie, the first height value), and 80% of the height of the dust collector 41 (ie, the second height value).

[0065] Optionally, the set value may be an upper limit of the pressure value range required for producing the product, or any value within the pressure value range required for producing the product, and the set value may be a point value or a range value. Specifically, the range of the set value may be adaptively selected according to actual conditions and is not limited here.

[0066] Specifically, when the reaction in the reaction chamber 1 is normal, the switch valve 43 is in a closed state. During the production process, the filter element 5 or the vacuum pump 3 may be blocked, which may cause the pressure value in the reaction chamber 1 to increase. When the pressure value (i.e., the actual value) detected by the pressure sensor 6 reaches the set value, the switch valve 43 automatically opens the third connecting pipe 42, so that the dust collector 41 can suck the undeposited matter in the first connecting pipe 21 and the reaction chamber 1 through the negative pressure of the vacuum cavity, thereby avoiding the problem of clogging the filter element 5 and the vacuum pump 3. After the undeposited matter is sucked into the dust collector 41, the air pressure value in the reaction chamber 1 will decrease, and the switch valve 43 can be closed, so that the pressure value of the actual reaction in the reaction chamber 1 can be controlled within ±1 mbar of the pressure value required for the reaction, thereby avoiding the problem of affecting the product quality due to the increase in the air pressure in the reaction chamber 1.

[0067] The present invention also provides a plasma deposition device, including a reaction chamber 1 and the above-mentioned vacuum pumping system, one end of a connecting pipe 2 is connected to the reaction chamber 1, and the vacuum pumping system is used to vacuum the reaction chamber 1. By setting a cleaning device 4 in the vacuum pumping system, the vacuum cavity can suck in the undeposited matter remaining in the connecting pipe 2, and the cleaning device 4 can effectively and quickly remove the undeposited matter remaining in the vacuum pumping system to prevent the vacuum pumping system from being blocked due to the accumulation of the undeposited matter. The vacuum pumping system can keep the inside of the reaction chamber 1 in a vacuum state, thereby ensuring the vacuum environment required for plasma deposition and ensuring the production quality of the product.

[0068] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A vacuum pumping system for vacuuming a reaction chamber (1), wherein the reaction chamber (1) has undeposited matter, characterized in that: include: A connecting pipe (2), one end of which is connected to the reaction chamber (1); A vacuum pump (3), wherein an air extraction end of the vacuum pump (3) is connected to the other end of the connecting pipe (2); A cleaning device (4), the cleaning device (4) comprising: A dust collector (41), the dust collector (41) being in communication with the side wall of the connecting pipe (2), the inner cavity of the dust collector (41) being a vacuum inner cavity so that the dust collector (41) can collect the undeposited matter; a third connecting pipe (42), one end of the third connecting pipe (42) being in communication with the dust collector (41), and the other end of the third connecting pipe (42) being in communication with the connecting pipe (2); an on-off valve (43), the on-off valve (43) being disposed on the third connecting pipe (42), and the on-off valve (43) being capable of opening or closing the third connecting pipe (42); The vacuum system also includes: a filter element (5), the filter element (5) being arranged in the connecting pipe (2), the filter element (5) being used to filter the undeposited matter, the communication position between the dust collector (41) and the connecting pipe (2) being located on a side of the filter element (5) facing the reaction chamber (1); A pressure sensor (6), wherein the detection end of the pressure sensor (6) is placed in the connecting tube (2), and the pressure sensor (6) is used to detect the pressure value in the reaction chamber (1).

2. The vacuum system according to claim 1, characterized in that: The connecting pipe (2) comprises: a first connecting pipe (21), one end of the first connecting pipe (21) being in communication with the reaction chamber (1), and the dust collector (41) being in communication with the first connecting pipe (21); A second connecting pipe (22), one end of the second connecting pipe (22) is connected to the other end of the first connecting pipe (21), the other end of the second connecting pipe (22) is connected to the vacuum pump (3), the first connecting pipe (21) and the second connecting pipe (22) are detachably connected, and the filter element (5) is arranged at the connection between the first connecting pipe (21) and the second connecting pipe (22).

3. The vacuum system according to claim 2, characterized in that: A first connecting portion (211) is provided at the end of the first connecting tube (21), and a second connecting portion (221) is provided at the end of the second connecting tube (22); the first connecting portion (211) and the second connecting portion (221) are detachably connected; a receiving groove (7) is provided on the first connecting portion (211) and / or the second connecting portion (221), and the filter element (5) is arranged in the receiving groove (7).

4. The vacuum system according to claim 1, characterized in that: The vacuum pumping system further comprises a display panel, the display panel being electrically connected to the pressure sensor (6), and the display panel being capable of displaying the pressure value detected by the pressure sensor (6).

5. The vacuum system according to claim 1, characterized in that: The cleaning device (4) further comprises a position sensor, which is arranged in the dust collector (41) and is used to detect the height of the undeposited matter in the dust collector (41).

6. The vacuum system according to claim 5, characterized in that: The vacuum system further comprises a display panel, the display panel being electrically connected to the position sensor, and the display panel being capable of displaying the height of the undeposited matter in the dust collector (41) detected by the position sensor.

7. Plasma deposition equipment, characterized in that It comprises a reaction chamber (1) and a vacuum pumping system as claimed in any one of claims 1 to 6, one end of the connecting pipe (2) is connected to the reaction chamber (1), and the vacuum pumping system is used to vacuum the reaction chamber (1).

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