Antenna circuit board and method of manufacturing the same

Abstract

An antenna circuit board and a manufacturing method thereof, the antenna circuit board is divided into a first main body area, a bending area and a second main body area connected in sequence, the antenna circuit board comprises a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer and a fifth conductive layer stacked in sequence, the first conductive layer and the fifth conductive layer are arranged corresponding to the first main body area and the second main body area; corresponding to the first main body area, the first conductive layer comprises a first antenna pad, the second conductive layer comprises a first trace, the fourth conductive layer comprises a second trace, the third conductive layer comprises a ground part for isolating the second conductive layer and the fourth conductive layer, and the fifth conductive layer comprises a second antenna pad; corresponding to the bending area, the third conductive layer comprises a first circuit and a second circuit which are spaced apart and parallel; the first trace and the first circuit are electrically connected through a first conductive hole, the second trace and the second circuit are electrically connected through a second conductive hole, the first antenna pad and the first trace are electrically connected, and the second antenna pad and the second trace are electrically connected.

Description

TECHNICAL FIELD

[0001] The present application relates to an antenna circuit board and a manufacturing method thereof. BACKGROUND

[0002] With the upgrading requirements of high frequency and high speed and MIMO (Multiple Input Multiple Output) technology, 5G antennas are widely used in electronic products such as 5G smart phones that have high frequency and high speed requirements. Therefore, how to further improve the anti-interference ability of the signal of the electronic product is a problem to be solved. Moreover, to realize multi-directional signal transmission and reception, more antenna modules need to be set. SUMMARY

[0003] Therefore, it is necessary to provide an antenna circuit board that is beneficial to reducing signal interference and beneficial to increasing the number of antenna modules. It is also necessary to provide a manufacturing method of an antenna circuit board that is beneficial to reducing signal interference and beneficial to increasing the number of antenna modules.

[0004] An antenna circuit board is divided into a first main area, a second main area, and a bending area connecting the first main area and the second main area, and includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked in sequence. The first conductive layer is provided corresponding to the first main area and the second main area, and the fifth conductive layer is provided corresponding to the first main area and the second main area. Corresponding to the first main area, the first conductive layer includes a first antenna pad, the second conductive layer includes a first trace, the fourth conductive layer includes a second trace, the third conductive layer includes a ground part isolating the second conductive layer and the fourth conductive layer, and the fifth conductive layer includes a second antenna pad. Corresponding to the bending area, the third conductive layer includes a first line and a second line that are spaced apart and parallel. The first trace and the first line are electrically connected through a first conductive hole, the second trace and the second line are electrically connected through a second conductive hole, the first antenna pad and the first trace are electrically connected, and the second antenna pad and the second trace are electrically connected.

[0005] A manufacturing method of an antenna circuit board includes the following steps:

[0006] A flexible circuit board is provided, which is divided into a first wiring area, a second wiring area and a bending area connecting the first wiring area and the second wiring area; the flexible circuit board comprises a second conductive layer, a third conductive layer and a fourth conductive layer which are sequentially and spacedly stacked; wherein, corresponding to the first wiring area, the second conductive layer comprises a first trace, the fourth conductive layer comprises a second trace, and the third conductive layer comprises a ground part separating the second conductive layer and the fourth conductive layer; corresponding to the bending area, the third conductive layer comprises a first circuit and a second circuit which are spaced and parallel; the first trace and the first circuit are electrically connected through a first conductive hole, and the second trace and the second circuit are electrically connected through a second conductive hole.

[0007] A first single-sided metal substrate is punched in a thickness direction to form a first gap, and a second single-sided metal substrate is punched in a thickness direction to form a second gap; the first single-sided metal substrate comprises a first metal foil and a first insulating layer which are stacked in a thickness direction, and the second single-sided metal substrate comprises a second metal foil and a second insulating layer which are stacked in a thickness direction.

[0008] The first single-sided metal substrate provided with the first gap is laminated to the second conductive layer, and the second single-sided metal substrate provided with the second gap is laminated to the fourth conductive layer; one side of the first wiring area and the second wiring area of the flexible circuit board is combined with and covered by the first insulating layer, and the other side is combined with and covered by the second insulating layer.

[0009] A third conductive hole is arranged to electrically connect the part of the first single-sided metal substrate corresponding to the first wiring area and the first trace, and a fourth conductive hole is arranged to electrically connect the part of the second single-sided metal substrate corresponding to the first wiring area and the second trace; and

[0010] Circuit fabrication is performed on the first single-sided metal substrate and the second single-sided metal substrate, so that the first metal foil corresponds to form a first conductive layer, and the second metal foil corresponds to form a fifth conductive layer, thereby obtaining the antenna circuit board; wherein, the first conductive layer comprises a first antenna pad corresponding to the first wiring area, and the fifth conductive layer comprises a second antenna pad corresponding to the first wiring area, the first antenna pad is electrically connected to the first trace through the third conductive hole, and the second antenna pad is electrically connected to the second trace through the fourth conductive hole.

[0011] The antenna circuit board and its manufacturing method disclosed in this application, wherein the ground portion of the third conductive layer isolates the first trace and the second trace, thereby blocking signal interference between the first trace and the second trace, while the first and second traces running side by side enable signal transmission and facilitate subsequent bending; that is, the third conductive layer simultaneously performs the functions of shielding and signal transmission. Furthermore, in the aforementioned antenna circuit board, the first antenna pad and the second antenna pad are electrically connected to the first trace and the second trace respectively through the first trace of the second conductive layer and the second trace of the fourth conductive layer, thereby increasing the number of antenna modules that can be mounted on the antenna circuit board. Attached Figure Description

[0012] Figure 1 This is a cross-sectional view of an antenna circuit board according to one embodiment of this application.

[0013] Figure 2 The antenna circuit board of one embodiment of this application is parallel to... Figure 1 A schematic diagram of a cross-section along the indicated cross-sectional direction.

[0014] Figure 3 This is a cross-sectional view of a flexible circuit board according to an embodiment of this application.

[0015] Figure 4 The flexible circuit board of one embodiment of this application is parallel to... Figure 3 A schematic diagram of a cross-section along the indicated cross-sectional direction.

[0016] Figure 5 This is a cross-sectional schematic diagram of a first single-sided metal substrate and a second single-sided metal substrate according to an embodiment of this application.

[0017] Figure 6 The intermediate structure of one embodiment of this application is in Figure 3 A schematic diagram of the cross-section shown.

[0018] Figure 7 The intermediate structure of one embodiment of this application is in Figure 4 A schematic diagram of the cross-section shown.

[0019] Figure 8 In order to be in Figure 6 The diagram shows a cross-sectional view of the intermediate structure with a third conductive hole.

[0020] Figure 9 In order to be in Figure 7 The diagram shows a cross-sectional view of the intermediate structure with a fourth conductive hole.

[0021] Figure 10 This is a cross-sectional schematic diagram of a double-sided metal substrate according to an embodiment of this application.

[0022] Figure 11 for the double-sided metal substrate shown in Figure 10 after circuit fabrication.

[0023] Figure 12 for the double-sided metal substrate shown in Figure 11 after circuit fabrication.

[0024] Figure 13 for the double-sided metal substrate shown in Figure 12 after circuit fabrication.

[0025] Figure 14 for the double-sided metal substrate shown in Figure 12 after circuit fabrication.

[0026] Figure 15 for the third single-sided metal substrate shown in Figure 13 after circuit fabrication.

[0027] Figure 16 for the third single-sided metal substrate shown in Figure 14 after circuit fabrication.

[0028] Main component symbol description

[0029]

[0030]

[0031] The following detailed description will further describe the present application with reference to the above-mentioned drawings. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0034] Some embodiments of the present application will be described in detail with reference to the drawings. The following embodiments and features can be combined with each other, without conflict.

[0035] Referring to Figure 1 and Figure 2 , the antenna circuit board 100 of an embodiment of the present application is divided into a first main area S1, a second main area S2, and a bending area S3 connecting the first main area S1 and the second main area S2. The antenna circuit board 100 includes a first conductive layer L1, a second conductive layer L2, a third conductive layer L3, a fourth conductive layer L4, and a fifth conductive layer L5 stacked in sequence. The first conductive layer L1 is provided corresponding to the first main area S1 and the second main area S2, and the fifth conductive layer L5 is provided corresponding to the first main area S1 and the second main area S2. Corresponding to the first main area S1, the first conductive layer L1 includes a first antenna pad D1, the second conductive layer L2 includes a first trace 21, the fourth conductive layer L4 includes a second trace 41, the third conductive layer L3 includes a ground part 31 isolating the second conductive layer L2 and the fourth conductive layer L4, and the fifth conductive layer L5 includes a second antenna pad D2. Corresponding to the bending area S3, the third conductive layer L3 includes a first line 33 and a second line 35 spaced apart and arranged side by side. Among them, the first trace 21 and the first line 33 are electrically connected through a first conductive hole 61, and the second trace 41 and the second line 35 are electrically connected through a second conductive hole 63. The first antenna pad D1 and the first trace 21 are electrically connected, and the second antenna pad D2 and the second trace 41 are electrically connected.

[0036] In the above-mentioned antenna circuit board 100, the ground part 31 in the third conductive layer L3 isolates the first trace 21 and the second trace 41 to block signal interference between the first trace 21 and the second trace 41, and the first line 33 and the second line 35 arranged side by side realize signal transmission and facilitate subsequent bending, that is, the third conductive layer L3 simultaneously has the functions of shielding and signal transmission. Secondly, in the above-mentioned antenna circuit board 100, the first antenna pad D1 and the second antenna pad D2 are respectively electrically connected to the first line 33 and the second line 35 through the first trace 21 of the second conductive layer L2 and the second trace 41 of the fourth conductive layer L4, respectively, thereby increasing the number of antenna modules provided by the antenna circuit board 100.

[0037] In some embodiments, the first line 33 and the second line 35 can be alternately provided.

[0038] In some embodiments, the first antenna pad D1 can be electrically connected with the first trace 21 through the third conductive via 65, and the second antenna pad D2 can be electrically connected with the second trace 41 through the fourth conductive via 67, so as to avoid multiple winding, and thus facilitate the miniaturization of the structure.

[0039] In some embodiments, corresponding to the bending area S3, the second conductive layer L2 can further include a first shielding portion 23, and the fourth conductive layer L4 can further include a second shielding portion 43, so as to avoid the first trace 33 and the second trace 35 from being interfered by external signals, and meanwhile, avoid the setting of a shielding structure to reduce the signal interference received by the first trace 33 and the second trace 35. The first shielding portion 23 can be a whole copper layer, or can be designed in a mesh shape. The second shielding portion 43 can be a whole copper layer, or can be designed in a mesh shape.

[0040] In some embodiments, the first conductive via 61 can be arranged corresponding to the first main area S1, and the second conductive via 63 can be arranged corresponding to the first main area S1.

[0041] In some embodiments, the antenna circuit board 100 can further include a plurality of shielded conductive vias (not shown in the figure) arranged at intervals, the shielded conductive vias being arranged corresponding to the first main area S1, and being distributed on both sides of the first trace 21 along the trace direction of the first trace 21 and / or being distributed on both sides of the second trace 41 along the trace direction of the first trace 21, so as to reduce the signal interference between the traces and the external environment.

[0042] In some embodiments, the plurality of shielded conductive vias are respectively arranged between the first conductive layer L1 and the second conductive layer L2, between the second conductive layer L2 and the third conductive layer L3, between the third conductive layer L3 and the fourth conductive layer L4, and between the fourth conductive layer L4 and the fifth conductive layer L5.

[0043] In some embodiments, the shielded conductive via can be a conductive via hole penetrating through the first main area S1 along the above-mentioned stacking direction.

[0044] In the present embodiment, preferably, the hole spacing of two adjacent shielded conductive vias located on the same side of the first trace 21 or on the same side of the second trace 41 is 0.5 mm, wherein the hole spacing refers to the spacing between the centers of the two adjacent shielded conductive vias, so as to avoid resonance caused by impedance discontinuity in the first main area S1.

[0045] In the present embodiment, the antenna circuit board 100 can further include a chip module 71 arranged in the second main area S2 and electrically connected with the first trace 33 or the second trace 35.

[0046] Referring to Figures 1 to 16 A method for manufacturing an antenna circuit board according to an embodiment of the present application includes the following steps:

[0047] Step S1, referring to Figure 3 and Figure 4 , a flexible circuit substrate 80 is provided, which is divided into a first wiring area M1, a second wiring area M2, and a bending area S3 connecting the first wiring area M1 and the second wiring area M2. The flexible circuit substrate 80 includes a second conductive layer L2, a third conductive layer L3, and a fourth conductive layer L4 arranged in sequence. Among them, corresponding to the first wiring area M1, the second conductive layer L2 includes a first trace 21, the fourth conductive layer L4 includes a second trace 41, and the third conductive layer L3 includes a ground part 31 separating the second conductive layer L2 and the fourth conductive layer L4. Corresponding to the bending area S3, the third conductive layer L3 includes a first circuit 33 and a second circuit 35 arranged in parallel. Among them, the first trace 21 and the first circuit 33 are electrically connected through a first conductive hole 61, and the second trace 41 and the second circuit 35 are electrically connected through a second conductive hole 63.

[0048] The flexible circuit substrate 80 further includes a dielectric layer 101 combined between the second conductive layer L2, the third conductive layer L3, and the fourth conductive layer L4.

[0049] In some embodiments, the first circuit 33 and the second circuit 35 can be alternately arranged.

[0050] In some embodiments, corresponding to the bending area S3, the second conductive layer L2 can further include a first shielding part 23, and the fourth conductive layer L4 can further include a second shielding part 43, so as to avoid the first circuit 33 and the second circuit 35 from being interfered by external signals, and also avoid setting a shielding structure to reduce the signal interference received by the first circuit 33 and the second circuit 35. The first shielding part 23 can be a whole copper layer or a grid design. The second shielding part 43 can be a whole copper layer or a grid design.

[0051] Step S2, referring to Figure 5 The first single-sided metal substrate 10a is punched in the thickness direction to form a first gap 10b, and the second single-sided metal substrate 50a is punched in the thickness direction to form a second gap 50b.

[0052] Specifically, the first single-sided metal substrate 10a includes a first metal foil 1a and a first insulating layer 1b stacked in a thickness direction. The second single-sided metal substrate 50a includes a second metal foil 5a and a second insulating layer 5b stacked in a thickness direction.

[0053] At step S3, referring to Figure 6 and Figure 7 , the first single-sided metal substrate 10a provided with the first gap 10b is laminated to the second conductive layer L2, and the second single-sided metal substrate 50a provided with the second gap 50b is laminated to the fourth conductive layer L4, thereby obtaining an intermediate structure 90. In the intermediate structure 90, one side of the first wiring area M1 and the second wiring area M2 of the flexible circuit substrate 80 is combined with and covered by the first insulating layer 1b, and the other side is combined with and covered by the second insulating layer 5b.

[0054] In some embodiments, the first shielding portion 23 is exposed from the first gap 10b, and the second shielding portion 43 is exposed from the second gap 50b.

[0055] At step S4, referring to Figure 8 and Figure 9 , a third conductive hole 65 is arranged to electrically connect the first single-sided metal substrate 10a corresponding to the first wiring area M1 and the first trace 21, and a fourth conductive hole 67 is arranged to electrically connect the second single-sided metal substrate 50a corresponding to the first wiring area M1 and the second trace 41.

[0056] At step S5, referring to Figure 1 and Figure 2 , circuit manufacturing is performed on the first single-sided metal substrate 10a and the second single-sided metal substrate 50a, so that the first metal foil 1a corresponds to form a first conductive layer L1, and the second metal foil 5a corresponds to form a fifth conductive layer L5, thereby obtaining an antenna circuit board 100. In the antenna circuit board 100, the first conductive layer L1 corresponding to the first wiring area M1 includes a first antenna pad D1, and the fifth conductive layer L5 corresponding to the first wiring area M1 includes a second antenna pad D2. The first antenna pad D1 is electrically connected to the first trace 21 through the third conductive hole 65, and the second antenna pad D2 is electrically connected to the second trace 41 through the fourth conductive hole 67.

[0057] In some embodiments, the flexible circuit substrate 80 can be prepared by the following steps:

[0058] At step S11, referring to Figure 10 , a double-sided metal substrate 20a is provided, which includes a third metal foil 2a, a second insulating layer 2b, and a fourth metal foil 3a arranged in sequence.

[0059] Step S12, please refer to Figure 11 The double-sided metal substrate 20a is subjected to circuit manufacturing, and the third metal foil 2a corresponds to form a second conductive layer L2, and the fourth metal foil 3a corresponds to form a third conductive layer L3. The third conductive layer L3 includes a circuit area 301 and a grounding portion 31 located on opposite sides of the circuit area 301. The circuit area 301 includes a first circuit 33 and a second circuit 35 which are spaced apart and arranged side by side. The second conductive layer L2 corresponds to a grounding portion 31 and includes a first trace 21.

[0060] In some embodiments, the second conductive layer L2 corresponding to the circuit area 301 can also have a first shielding portion 23.

[0061] In some embodiments, the first circuit 33 and the second circuit 35 can be alternately arranged.

[0062] Step S13, please refer to Figure 12 A third single-sided metal substrate 40a is laminated on the side of the third conductive layer L3 away from the second conductive layer L2, wherein the third single-sided metal substrate 40a includes a fifth metal foil 4a and a third insulating layer 4b laminated together, and the third insulating layer 4b bonds the fifth metal foil 4a and the third conductive layer L3.

[0063] Step S14, please refer to Figure 13 And Figure 14 A first conductive hole 61 is provided to electrically connect the first trace 21 and the first circuit 33, and a second conductive hole 63 is provided to electrically connect the fifth metal foil 4a and the second circuit 35.

[0064] Step S15, please refer to Figure 15 And Figure 16 The third single-sided metal substrate 40a provided with the second conductive hole 63 is subjected to circuit manufacturing, and the fifth metal foil 4a corresponds to form a fourth conductive layer L4, thereby obtaining the flexible circuit substrate 80. The fourth conductive layer L4 includes a second trace 41, and the second trace 41 and the first trace 21 are separated by the grounding portion 31.

[0065] In some embodiments, the fourth conductive layer L4 corresponding to the circuit area 301 can also have a second shielding portion 43.

[0066] The antenna circuit board and the manufacturing method thereof, wherein the ground part 31 in the third conductive layer L3 isolates the first trace 21 and the second trace 41 to cut off the signal interference between the first trace 21 and the second trace 41, and the first line 33 and the second line 35 of the parallel traces realize the signal transmission and facilitate the subsequent bending, that is, the third conductive layer L3 has the functions of shielding and signal transmission. Secondly, the first antenna pad D1 and the second antenna pad D2 in the above antenna circuit board 100 are respectively electrically connected to the first line 33 and the second line 35 through the first trace 21 of the second conductive layer L2 and the second trace 41 of the fourth conductive layer L4, respectively, thereby increasing the number of antenna modules provided by the antenna circuit board 100.

[0067] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in any form. Although the preferred embodiment of the present application has been disclosed above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content without departing from the scope of the technical solution of the present application, and any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present application still falls within the scope of the technical solution of the present application.

Claims

1. An antenna circuit board, divided into a first main body region, a second main body region, and a bending region connecting the first main body region and the second main body region, the antenna circuit board comprising a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially, characterized in that, The first conductive layer is disposed corresponding to the first main body area and the second main body area, and the fifth conductive layer is disposed corresponding to the first main body area and the second main body area; corresponding to the first main body area, the first conductive layer includes a first antenna pad, the second conductive layer includes a first trace, the fourth conductive layer includes a second trace, the third conductive layer includes a ground portion that isolates the second conductive layer and the fourth conductive layer, and the fifth conductive layer includes a second antenna pad; corresponding to the bending area, the third conductive layer includes a first line and a second line that are spaced apart and run side by side; the first trace and the first line are electrically connected through a first conductive hole, the second trace and the second line are electrically connected through a second conductive hole, the first antenna pad and the first trace are electrically connected, and the second antenna pad and the second trace are electrically connected.

2. The antenna circuit board as described in claim 1, characterized in that, Corresponding to the bending area, the second conductive layer further includes a first shielding portion, and the fourth conductive layer further includes a second shielding portion.

3. The antenna circuit board as described in claim 1, characterized in that, The first line and the second line are set alternately.

4. The antenna circuit board as described in claim 1, characterized in that, The antenna circuit board also includes a plurality of spaced shielding conductive holes, which are disposed corresponding to the first main body area and distributed on both sides of the first trace along the trace direction and / or on both sides of the second trace along the trace direction of the first trace.

5. The antenna circuit board as described in claim 4, characterized in that, The spacing between two adjacent shielding conductive holes located on the same side of the first trace or on the same side of the second trace is 0.5 mm.

6. The antenna circuit board as described in claim 1, characterized in that, A third conductive hole is provided corresponding to the first antenna pad to electrically connect the first antenna pad and the first trace, and a fourth conductive hole is provided corresponding to the second antenna pad to electrically connect the second antenna pad and the second trace.

7. The antenna circuit board as described in claim 1, characterized in that, The first conductive hole is disposed in the first main body area, and the second conductive hole is disposed in the first main body area.

8. A method for manufacturing an antenna circuit board, comprising the following steps: A flexible circuit board is provided, the flexible circuit board being divided into a first wiring area, a second wiring area, and a bending area connecting the first wiring area and the second wiring area; the flexible circuit board includes a second conductive layer, a third conductive layer, and a fourth conductive layer stacked and spaced apart sequentially; wherein, corresponding to the first wiring area, the second conductive layer includes a first trace, the fourth conductive layer includes a second trace, and the third conductive layer includes a ground portion isolating the second conductive layer and the fourth conductive layer; corresponding to the bending area, the third conductive layer includes a first line and a second line with spaced-apart parallel traces; the first trace and the first line are electrically connected through a first conductive via, and the second trace and the second line are electrically connected through a second conductive via; A first single-sided metal substrate is punched along the thickness direction to form a first gap, and a second single-sided metal substrate is punched along the thickness direction to form a second gap. The first single-sided metal substrate includes a first metal foil and a first insulating layer stacked along the thickness direction, and the second single-sided metal substrate includes a second metal foil and a second insulating layer stacked along the thickness direction. The first single-sided metal substrate with the first gap is pressed onto the second conductive layer, and the second single-sided metal substrate with the second gap is pressed onto the fourth conductive layer; one side of the first wiring area and the second wiring area of ​​the flexible circuit substrate is bonded to and covered by the first insulating layer, and the other side is bonded to and covered by the second insulating layer. A third conductive via is provided to electrically connect the portion of the first single-sided metal substrate corresponding to the first wiring area and the first trace; a fourth conductive via is provided to electrically connect the portion of the second single-sided metal substrate corresponding to the first wiring area and the second trace; and A circuit is fabricated on the first single-sided metal substrate and the second single-sided metal substrate, such that the first metal foil forms a first conductive layer and the second metal foil forms a fifth conductive layer, thereby obtaining the antenna circuit board; wherein, the first conductive layer includes a first antenna pad corresponding to the first wiring area, the fifth conductive layer includes a second antenna pad corresponding to the first wiring area, the first antenna pad is electrically connected to the first trace through the third conductive hole, and the second antenna pad is electrically connected to the second trace through the fourth conductive hole.

9. The method for manufacturing an antenna circuit board as described in claim 8, characterized in that, Corresponding to the bending area, the second conductive layer further includes a first shielding portion, and the fourth conductive layer further includes a second shielding portion. The first shielding portion is exposed from the first gap, and the second shielding portion is exposed from the second gap.

10. The method for manufacturing an antenna circuit board as described in claim 8, characterized in that, The first line and the second line are set alternately.

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