Semiconductor process control method and device

Abstract

The present application discloses a semiconductor process control method and device, which includes: responding to a process operation command for a semiconductor process sent by a host device and an allocated first power resource, controlling the current process equipment corresponding to the lower device to execute the semiconductor process; determining the real-time output power of the current process equipment during the execution of the semiconductor process, and if the real-time output power is greater than the first power resource, performing a power limiting operation on the real-time output power, and sending a power allocation request to the upper device; receiving a second power resource allocated by the upper device, and when the second power resource is greater than or equal to the real-time output power, stopping the power limiting operation on the real-time output power, otherwise, continuing the power limiting operation on the real-time output power, and returning to the step of sending a power allocation request to the upper device. The present application can ensure that the output power of the process equipment does not exceed the plant load while taking into account the accuracy of the process results.

Description

Technical Field

[0001] The present application relates to the field of semiconductor process technology, and in particular to a semiconductor process control method and device. Background Art

[0002] As an effective green energy product, crystalline silicon solar cell modules are receiving increasing attention from both the government and society, leading to higher production requirements. Diffusion furnaces and PECVD (Plasma Enhanced Chemical Vaper Deposition) equipment are key components of the PN junction (a space charge region formed at the interface of a P-type semiconductor and an N-type semiconductor on the same semiconductor substrate) and coating processes in the production of crystalline silicon solar cell modules. To further increase the production capacity of a single unit of the aforementioned equipment (hereinafter referred to as the "equipment"), the length, diameter, and number of furnace tubes within the equipment have been expanded to varying degrees, resulting in a sharp increase in the equipment's power consumption.

[0003] In the prior art, during process operation, multiple devices or multiple furnace tubes operate without scheduling, resulting in overlapping process times. There are also cases where all devices or furnace tubes are manually controlled to operate the process simultaneously. In these cases, the output power of the equipment will reach its peak, which can easily cause the output power of the equipment to exceed the maximum power of the power distribution system of the plant, resulting in equipment tripping and production suspension, and even causing safety issues such as line damage. To avoid these problems, the prior art generally reduces the output power of the equipment by controlling and reducing the output current. However, this approach will cause the output power to be delayed and fail to meet the required level, which will extend the process time, reducing production efficiency and affecting process parameters, thereby affecting the accuracy of the process results. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a semiconductor process control method and device to solve the problem that the existing semiconductor process cannot take into account the accuracy of the process results while ensuring that the output power of the process equipment does not exceed the factory load.

[0005] To solve the above technical problems, the embodiments of the present application are implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a semiconductor process control method, which is applied to a lower computer device, comprising:

[0007] In response to a process operation command for a semiconductor process sent by a host device and a first power resource allocated for the semiconductor process, controlling the current process equipment corresponding to the slave device to execute the semiconductor process; the process operation command is sent by the host device when it is determined that the current process equipment meets the process operation conditions;

[0008] determining a real-time output power of the current process equipment during execution of the semiconductor process, and determining whether the real-time output power is greater than the first power resource;

[0009] If so, performing a power limiting operation on the real-time output power and sending a power allocation request to the host device;

[0010] Receive a second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop performing the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue performing the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

[0011] In a second aspect, an embodiment of the present application provides a semiconductor process control method, which is applied to a host computer device, including:

[0012] In response to a process operation request for a semiconductor process sent by a lower computer device, determining a total standard power resource required by the semiconductor process in a process time period to be operated;

[0013] Determine the allocated power resources corresponding to the process time period; determine whether the current process equipment corresponding to the lower computer device meets the process operation conditions based on the total standard power resources and the allocated power resources;

[0014] If yes, sending a process operation command to the lower computer device and allocating a first power resource to the lower computer device so that the lower computer device controls the current process device to execute the semiconductor process according to the process operation command;

[0015] Upon receiving a power allocation request sent by the lower device, a second power resource is allocated to the lower device according to the power allocation request; the power allocation request is sent by the lower device to the upper device when it is determined that the real-time output power of the current process equipment during the execution of the semiconductor process is greater than the first power resource.

[0016] In a third aspect, an embodiment of the present application provides a semiconductor process control device, located in a lower computer device, comprising:

[0017] a control module configured to control a current process device corresponding to the slave device to execute the semiconductor process in response to a process operation command for the semiconductor process sent by the host device and a first power resource allocated for the semiconductor process; the process operation command is sent by the host device when it is determined that the current process device meets the process operation conditions;

[0018] a first determining and judging module, configured to determine the real-time output power of the current process equipment during the execution of the semiconductor process, and to judge whether the real-time output power is greater than the first power resource;

[0019] an execution and sending module, configured to perform a power limiting operation on the real-time output power and send a power allocation request to the host device when the real-time output power is greater than the first power resource;

[0020] A receiving and executing module is used to receive a second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop performing the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue performing the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

[0021] In a fourth aspect, an embodiment of the present application provides a semiconductor process control device, located in a host computer device, comprising:

[0022] A first determining module is configured to determine, in response to a process operation request for a semiconductor process sent by a lower computer device, a total standard power resource required for the semiconductor process within a process time period to be operated;

[0023] The second determination and judgment module is used to determine the allocated power resources corresponding to the process time period; and to judge whether the current process equipment corresponding to the lower computer device meets the process operation conditions based on the total standard power resources and the allocated power resources;

[0024] a sending and allocating module, configured to, if yes, send a process operation command to the slave device and allocate a first power resource to the slave device, so that the slave device controls the current process device to execute the semiconductor process according to the process operation command;

[0025] The first allocation module is used to allocate a second power resource to the lower computer device according to the power allocation request when receiving the power allocation request sent by the lower computer device; the power allocation request is sent to the upper computer device by the lower computer device when it determines that the real-time output power of the current process equipment in the execution of the semiconductor process is greater than the first power resource.

[0026] In a fifth aspect, an embodiment of the present application provides a semiconductor process control device, comprising a processor and a memory electrically connected to the processor, the memory storing a computer program, and the processor being used to call and execute the computer program from the memory to implement the semiconductor process control method as described in the first aspect, or to implement the semiconductor process control method as described in the second aspect.

[0027] In a sixth aspect, an embodiment of the present application provides a storage medium for storing a computer program, wherein the computer program can be executed by a processor to implement the semiconductor process control method as described in the first aspect, or to implement the semiconductor process control method as described in the second aspect.

[0028] Adopting the technical scheme of the embodiment of the present application, the lower-level device controls the current process equipment corresponding to the lower-level device to execute the semiconductor process by responding to the process operation command for the semiconductor process sent by the upper-level device (sent by the upper-level device when determining that the current process equipment corresponding to the lower-level device meets the process operation conditions) and the first power resource allocated for the semiconductor process. Thus, through the interaction between the upper-level device and the lower-level device, the current process equipment that meets the process operation conditions can be scheduled to execute the semiconductor process, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. Moreover, by determining the real-time output power of the current process equipment during the execution of the semiconductor process, when the real-time output power is greater than the first power resource, the real-time output power is power-limited, and a power allocation request is sent to the upper-level device, the second power resource allocated by the upper-level device based on the power allocation request is received, and when the second power resource is greater than or equal to the real-time output power, the real-time output power is stopped from being power-limited. When the second power resource is less than the real-time output power, the real-time output power is continued to be power-limited, and the step of sending the power allocation request to the upper-level device is returned. As can be seen, by real-time monitoring of the output power of the current process equipment during process operation, the problem of the output power exceeding the factory load during process operation is effectively avoided. Furthermore, when the real-time output power exceeds the power resources allocated for the semiconductor process of the current process equipment, power resources can be requested from the upper computer equipment, ensuring that the process parameters are not affected to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0029] Furthermore, the upper computer device determines the total standard power resources required for the semiconductor process during the process time period to be run, and determines the allocated power resources corresponding to the process time period, by responding to the process operation request for the semiconductor process sent by the lower computer device. Based on the total standard power resources and the allocated power resources, the upper computer device determines whether the current process equipment corresponding to the lower computer device meets the process operation conditions. When the current process equipment corresponding to the lower computer device meets the process operation conditions, the upper computer device sends a process operation command to the lower computer device and allocates the first power resource to the lower computer device. It can be seen that this technical solution, through the interaction between the upper computer device and the lower computer device, can schedule the current process equipment that meets the process operation conditions to execute the semiconductor process, thereby solving the problem of unscheduled process operation of the semiconductor process in the prior art. Furthermore, by allocating the second power resource to the lower computer device according to the power allocation request upon receiving the power allocation request sent by the lower computer device, the process parameters are ensured to the greatest extent possible, thereby ensuring the accuracy of the process results. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0031] Figure 1 is a schematic block diagram of a semiconductor process control system according to an embodiment of the present application;

[0032] Figure 2 is a flow chart of a semiconductor process control method according to an embodiment of the present application;

[0033] Figure 3 is a flow chart of a semiconductor process control method according to another embodiment of the present application;

[0034] Figure 4 is a schematic diagram of a power output fitting curve according to an embodiment of the present application;

[0035] Figure 5 is a schematic diagram of an interactive flow of a semiconductor process control method according to an embodiment of the present application;

[0036] Figure 6 is a structural diagram of a semiconductor process control device according to an embodiment of the present application;

[0037] Figure 7 is a structural schematic diagram of a semiconductor process control device according to another embodiment of the present application;

[0038] Figure 8 is a structural diagram of a semiconductor process control device according to an embodiment of the present application;

[0039] Figure 9 It is a structural schematic diagram of a semiconductor process control device according to another embodiment of the present application. DETAILED DESCRIPTION

[0040] The embodiments of the present application provide a semiconductor process control method and device to solve the problem that existing semiconductor processes cannot take into account the accuracy of process results while ensuring that the output power of process equipment does not exceed the factory load.

[0041] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0042] Figure 1 is a schematic block diagram of a semiconductor process control system according to an embodiment of the present application, such as Figure 1 As shown, the semiconductor process control system includes a host computer device 110, a slave computer device 120, and a process device 130 corresponding to the slave computer device 120. The host computer device 110 includes a host computer software device 111 and a control program device 112, and the slave computer device 120 includes a slave computer software device 121.

[0043] It should be understood that current semiconductor process equipment typically includes multiple furnace tubes, each of which includes multiple heating zones. Each heating zone is equipped with a separate heating wire, transformer, and temperature control instrument. During the production process, the time at which each furnace tube begins operating and the furnace tube temperature required for each process step vary. The temperature control instrument for each heating zone sets the output power of the heating wire based on the process requirements. Each furnace tube is a process device 130, each furnace tube corresponds to a slave device 120, and each device used to perform semiconductor processes corresponds to a host device 110. Figure 1 Schematically illustrates a slave device 120 communicatively connected to a host device 110, and a process device 130 communicatively connected to the slave device 120. In actual applications, if the equipment performing the semiconductor process includes multiple furnace tubes, the host device 110 can be communicatively connected to each of the multiple slave devices 120, and each slave device 120 can be communicatively connected to a corresponding furnace tube.

[0044] In this embodiment, the user can start and display the control program device 112 by calling the host computer software device 111. In order to meet the needs of different types of product equipment, multiple process steps and different equipment hardware selection, the control program device 112 provides an editable parameter interface. The interface content of the parameter interface includes the following af: a. the communication connection status of each process equipment 130, which is fed back by the lower computer device 120 corresponding to each process equipment 130; b. the rated output power of each heating area of ​​the process equipment 130, which is determined according to the equipment performing the semiconductor process and the semiconductor process performed in the specific application; c. the maximum power resource of the upper computer device 110, which is determined according to the equipment performing the semiconductor process in the specific application; d. the real-time output power of the process equipment 130, which is fed back by the lower computer device 120 corresponding to each process equipment 130; e. the power output fitting curve of the process recipe, which is obtained by pre-analyzing and fitting the historical process data of different process recipes to obtain the output power curve required for heating a single process equipment 130 in different time periods for each process, and is stored in the control program device 112 in the form of data; f. the setting button, through which the ae on the parameter interface can be modified, so that different process recipes and different types of product equipment can realize the control of the process operation of the semiconductor process through the semiconductor process control system provided by this embodiment.

[0045] The upper computer software device 111 is used to send control commands such as running the process and setting the heating temperature of the process equipment 130 to the lower computer software device 121 based on the process recipe input by the user through the upper computer device 110, including parameters such as which process equipment 130 is currently running, the operating time period of each process equipment 130, and the temperature of each process equipment 130. At the same time, it calls the control program device 112 to start and display.

[0046] The lower computer software device 121 can send a process operation request for the semiconductor process to the control program device 112 according to the control command sent by the upper computer software device 111, and when receiving the process operation command for the semiconductor process sent by the control program device 112 and the first power resource allocated for the semiconductor process, control the process equipment 130 to execute the semiconductor process, and determine the real-time output power of the process equipment 130 during the execution of the semiconductor process, judge whether the real-time output power is greater than the first power resource, and when the real-time output power is greater than the first power resource, perform power limiting operation on the real-time output power, and send a power allocation request to the control program device 112, receive the second power resource allocated by the control program device 112 based on the power allocation request, stop power limiting operation on the real-time output power when the second power resource is greater than or equal to the real-time output power, and continue power limiting operation on the real-time output power when the second power resource is less than the real-time output power, and return to the step of sending the power allocation request to the control program device 112.

[0047] The control program device 112 is connected to the lower-computer device 120 corresponding to each process equipment 130 through the upper-computer device 110, and responds to the process operation request for the semiconductor process sent by the lower-computer software device 121. It determines the total standard power resources required by the process equipment 130 during the process time period to be run for the semiconductor process, and determines the allocated power resources corresponding to the process time period. Based on the total standard power resources and the allocated power resources, it is judged whether the process equipment 130 meets the process operation conditions. If so, it sends a process operation command to the lower-computer software device 121 and allocates the first power resource to the lower-computer software device 121, so that the lower-computer device 120 controls the current process equipment to execute the semiconductor process according to the process operation command. When receiving the power allocation request sent by the lower-computer software device 121, it allocates the second power resource to the lower-computer software device 121 according to the power allocation request.

[0048] In this embodiment, the control program device 112 can be the device control program software PwDispatch, the lower-machine software device 121 can be the lower-machine software Sevenstar, and the ModbusTCP / IP communication protocol can be used between the upper-machine device 110 and the lower-machine device 120, with the upper-machine device 110 serving as the master station and the lower-machine device 120 serving as the slave station. Other communication protocols that can use the upper-machine device 110 as the master station and the lower-machine device 120 as the slave station can also be used, and this application does not limit this. The lower-machine device 120 corresponding to each process device 130 is connected to the upper-machine device 110 via a network cable and a switch. Taking the process device 130 as a furnace tube as an example, the data exchange content of the communication is as follows:

[0049] The data sent by the lower computer device 120 to the upper computer device 110 may include the following gi: g, furnace tube status, where 0 can be used to represent that the furnace tube is idle, 1 can be used to represent that the furnace tube has started to run the process, and 2 can be used to represent that the furnace tube is in process operation; h, whether to apply for power, where 0 can be used to represent the default allocated power (i.e., the first power resource), and 1 can be used to represent the application for temporary output power (i.e., sending a power allocation request or a temporary power allocation request); i, the real-time output power of the current furnace tube, in kilowatts (Kw).

[0050] The data sent by the upper computer device 110 to the lower computer device 120 may include the following jm: j, the output power allocated to each furnace tube (i.e., the first power resource); k, whether the process can be run, where 0 can be used to indicate that the process cannot be started, and 1 can be used to indicate that the process can be started; l, the rated power of the furnace wire and the rated power of the auxiliary heating wire in each heating area of ​​the furnace tube; m, whether the upper computer device 110 currently has remaining power resources, where 0 can be used to indicate no, and 1 can be used to indicate yes.

[0051] In this embodiment, a semiconductor process control system can be used to control the process operation of the semiconductor process without modifying the existing equipment that performs the semiconductor process, saving equipment modification costs. It can also be applied to different types of product equipment without affecting the equipment's production capacity and process results, and has a wide range of applications.

[0052] The following describes in detail the operations specifically performed by the host device 110 and the slave device 120 in the semiconductor process control system in the semiconductor process control method.

[0053] Figure 2 FIG. 1 is a flow chart of a semiconductor process control method according to an embodiment of the present application, wherein the method is applied to the lower computer device 120. Figure 2 As shown, the method includes:

[0054] S202 , in response to a process operation command for a semiconductor process sent by the upper computer device and a first power resource allocated for the semiconductor process, controlling a current process device corresponding to the lower computer device to execute the semiconductor process.

[0055] The process operation command is sent by the host device when it determines that the current process equipment meets the process operation conditions. For the specific process, please refer to Figure 3 The embodiment shown.

[0056] In one embodiment, the process operation request may include the identification information of the current process equipment, process identification information, process duration, process time period, etc. Among them, the identification information of the current process equipment may be the number of the current process equipment (such as the factory number of the equipment, etc.), the preset serial number corresponding to the current process equipment (such as current process equipment 1, current process equipment A), etc., the process identification information may be the name of the process currently requested to be run by the current process equipment (such as coating process, diffusion process, etc.), the code (such as process 1, process A), etc., the process duration may be the duration of the process currently requested to be run by the current process equipment (such as 1 hour, 24 hours, etc.), and the process time period may be the time period of the process currently requested to be run by the current process equipment (such as 9 am to 3 pm, 5 pm to 10 am the next day, etc.).

[0057] The process operation condition may include: the sum of the total standard power resources required by the semiconductor process during the process time period and the allocated power resources corresponding to the process time period is less than or equal to the total power resources that can be allocated by the host computer device.

[0058] S204 , determining the real-time output power of the current process equipment during the execution of the semiconductor process, and judging whether the real-time output power is greater than the first power resource.

[0059] S206: If yes, perform power limiting operation on the real-time output power and send a power allocation request to the upper computer device.

[0060] In one embodiment, if the real-time output power is less than or equal to the first power resource, the process returns to S204 until the semiconductor process is completed.

[0061] S208, receiving the second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stopping the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continuing the power limiting operation on the real-time output power, and returning to the step of sending a power allocation request to the upper computer device.

[0062] The second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

[0063] Adopting the technical scheme of the embodiment of the present application, the lower-level device controls the current process equipment corresponding to the lower-level device to execute the semiconductor process by responding to the process operation command for the semiconductor process sent by the upper-level device (sent by the upper-level device when determining that the current process equipment corresponding to the lower-level device meets the process operation conditions) and the first power resource allocated for the semiconductor process. Thus, through the interaction between the upper-level device and the lower-level device, the current process equipment that meets the process operation conditions can be scheduled to execute the semiconductor process, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. Moreover, by determining the real-time output power of the current process equipment during the execution of the semiconductor process, when the real-time output power is greater than the first power resource, the real-time output power is power-limited, and a power allocation request is sent to the upper-level device, the second power resource allocated by the upper-level device based on the power allocation request is received, and when the second power resource is greater than or equal to the real-time output power, the real-time output power is stopped from being power-limited. When the second power resource is less than the real-time output power, the real-time output power is continued to be power-limited, and the step of sending the power allocation request to the upper-level device is returned. As can be seen, by real-time monitoring of the output power of the current process equipment during process operation, the problem of the output power exceeding the factory load during process operation is effectively avoided. Furthermore, when the real-time output power exceeds the power resources allocated for the semiconductor process of the current process equipment, power resources can be requested from the upper computer equipment, ensuring that the process parameters are not affected to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0064] In one embodiment, the power limiting operation may be performed on the real-time output power of the current process equipment during the semiconductor process according to the following steps A1-A3:

[0065] Step A1: Determine the parameter output percentage corresponding to the current process equipment according to the parameter output data of the current process equipment.

[0066] Assuming that the current process equipment is a furnace tube, then the equipment for performing semiconductor processes includes multiple furnace tubes, each furnace tube includes multiple heating areas, each heating area is equipped with a separate heating wire, transformer and temperature control instrument, each furnace tube corresponds to a lower computer device, and each equipment used to perform semiconductor processes corresponds to a host computer device. The parameter output data of the current process equipment can be the current temperature of each heating area, and the parameter output percentage corresponding to the current process equipment can be determined, that is, the parameter output percentage corresponding to each heating area is determined.

[0067] It should be understood that, based on the process recipe, the host device will send control commands such as operating the process and setting the heating temperature of the furnace tube to the slave device. When the slave device receives the control command, it will send a process operation request for the semiconductor process to the host device. When the host device determines that the current process equipment meets the process operation conditions, it will send a process operation command for the semiconductor process and the power resources allocated for the semiconductor process to the slave device. The slave device controls the current process equipment to execute the semiconductor process. At this time, the slave device will set the heating temperature of the furnace tube indicated in the control command to the temperature control instrument corresponding to each heating zone. The temperature control instrument automatically adjusts the output power percentage of the heating wire according to the current temperature of the furnace tube in the corresponding heating zone (i.e., determines the parameter output percentage corresponding to each heating zone).

[0068] Assuming that the furnace tube includes three heating zones, A1 can be used to represent the parameter output percentage corresponding to the first heating zone, A2 can be used to represent the parameter output percentage corresponding to the second heating zone, and A3 can be used to represent the parameter output percentage corresponding to the third heating zone.

[0069] Step A2: Calculate the power limit coefficient of the current process equipment according to the real-time output power of the current process equipment during the semiconductor process, the first power resource allocated by the host computer device for the semiconductor process, and the parameter output percentage corresponding to the current process equipment.

[0070] According to the example in step A1, the real-time output power of the current process equipment is the real-time output power of the furnace tube (denoted as P1), which is the sum of the real-time output power of each heating zone of the furnace tube. P1 can be calculated according to formula (1):

[0071] P1=p1A1+p2A2+p3A3, (1)

[0072] Among them, p1 represents the rated power corresponding to the heating wire of the first heating area, p2 represents the rated power corresponding to the heating wire of the second heating area, p3 represents the rated power corresponding to the heating wire of the third heating area, and A1, A2, and A3 represent the parameter output percentages corresponding to the three heating areas respectively.

[0073] In this embodiment, calculating the power limit coefficient of the current process equipment is to calculate the power limit coefficient of each heating area of ​​the furnace tube, which can be calculated according to formula (2):

[0074]

[0075] Among them, x takes the value of 1, 2, 3, A' xCharacterizes the power limiting coefficients corresponding to the three heating areas, P1 is the real-time output power of the furnace tube, P'1 is the first power resource allocated by the host device for the semiconductor process, A x Characterizes the parameter output percentage corresponding to the three heating areas.

[0076] Step A3: performing a power limiting operation on the real-time output power of the current process equipment during the semiconductor process according to the power limiting coefficient of the current process equipment.

[0077] In this embodiment, the parameter output percentage corresponding to the current process equipment is determined based on the parameter output data of the current process equipment, and the power limiting coefficient of the current process equipment is calculated based on the real-time output power of the current process equipment, the first power resource and the parameter output percentage. Therefore, according to the power limiting coefficient, the real-time output power of the current process equipment is subjected to power limiting operation, so that the execution of the power limiting operation is more accurate and faster. By performing the power limiting operation, the instantaneous maximum output power of the upper computer equipment can be prevented from exceeding the carrying range (that is, the total power resources that can be allocated to the upper computer equipment), thereby avoiding the impact on production efficiency and process results due to the tripping and shutdown of the current process equipment.

[0078] Corresponding to this application Figure 2 The method provided in the illustrated embodiment is based on the same idea. The embodiment of the present application also provides a semiconductor process control method, which is applied to the host computer device 110. Figure 3 FIG. 1 is a flow chart of a semiconductor process control method according to another embodiment of the present application. Figure 3 As shown, the method includes:

[0079] S302 : In response to a process operation request for a semiconductor process sent by a lower computer device, determine the total standard power resources required by the semiconductor process in a process time period to be operated.

[0080] In one embodiment, the process operation request may include identification information of the current process equipment, process identification information, process duration, process time period, etc. The above contents have been described in detail in S202 and will not be repeated here.

[0081] The total standard power resource can be determined from a power output fitting curve pre-stored in the host device as data based on the content of the process operation request (such as process identification information and process time period). The total standard power resource is the power resource required by the semiconductor process during the process time period during the historical process operation.

[0082] The schematic diagram of the power output fitting curve is as follows: Figure 4As shown, the horizontal axis is the process time T, and the vertical axis is the power resource P required by the semiconductor process in each process time period. When the power output fitting curve is stored in the host computer device in the form of data, the time interval for storing the data can be determined based on the power output fitting curve. For example, the power output fitting curve can be stored in the List list data set in the host computer device at a time interval of every 30 seconds. It should be noted that the power output fitting curve is a fitting curve of the power resources required by a single process device in different time periods of running the process during the historical process. When a host computer device controls multiple process devices to run the process, multiple List list data sets need to be created simultaneously in the host computer device to store the power output fitting curve corresponding to each process device.

[0083] S304: Determine the allocated power resources corresponding to the process time period, and judge whether the current process equipment corresponding to the lower-level device meets the process operation conditions based on the total standard power resources and the allocated power resources.

[0084] The allocated power resources corresponding to the process time period are the power resources allocated by the upper computer device to other lower computer devices that have sent process operation requests and meet the process operation conditions before the upper computer device receives the process operation request sent by the lower computer device.

[0085] S306: If yes, send a process operation command to the subordinate device and allocate a first power resource to the subordinate device so that the subordinate device controls the current process device to execute the semiconductor process according to the process operation command.

[0086] The first power resource allocated to the slave device may be greater than or equal to the total standard power resource. For example, if the upper device has a minimum requirement for the power resource allocated to the slave device, the minimum power resource may be allocated as the first power resource allocated to the slave device based on the difference between the total standard power resource and the minimum power resource allocated. If the total standard power resource is less than the minimum power resource allocated, the minimum power resource allocated may be used as the first power resource allocated to the slave device.

[0087] For example, the minimum requirement of a host device for the power resources allocated to the slave device is 1000 watts. When the total standard power resources required by the determined semiconductor process during the process time period to be run are 800 watts, since the total standard power resources of 800 watts are less than the minimum required allocated power resources of 1000 watts, the minimum required allocated power resources of 1000 watts are used as the first power resources allocated to the slave device.

[0088] In one embodiment, if the current process equipment does not meet the process operation conditions, the process returns to S304 .

[0089] S308 : When receiving the power allocation request sent by the lower device, allocate a second power resource to the lower device according to the power allocation request.

[0090] The power allocation request is sent by the lower computer device to the upper computer device when the lower computer device determines that the real-time output power of the current process equipment during the execution of the semiconductor process is greater than the first power resource.

[0091] According to the technical solution of the embodiment of the present application, the upper computer device determines the total standard power resources required for the semiconductor process during the process time period to be run by responding to the process operation request for the semiconductor process sent by the lower computer device, and determines the allocated power resources corresponding to the process time period, thereby judging whether the current process equipment corresponding to the lower computer device meets the process operation conditions based on the total standard power resources and the allocated power resources. When the current process equipment corresponding to the lower computer device meets the process operation conditions, the upper computer device sends a process operation command to the lower computer device and allocates the first power resource to the lower computer device. It can be seen that the technical solution can schedule the current process equipment that meets the process operation conditions to execute the semiconductor process through the interaction between the upper computer device and the lower computer device, solving the problem of unscheduled process operation of the semiconductor process in the prior art. In addition, by allocating the second power resource to the lower computer device according to the power allocation request when receiving the power allocation request sent by the lower computer device, the process parameters are ensured to be unaffected to the greatest extent, thereby ensuring the accuracy of the process results.

[0092] In one embodiment, before executing S302 and responding to the process operation request for the semiconductor process sent by the lower computer device, the following steps B1-B3 may be performed in advance:

[0093] Step B1: Acquire historical process data of the current process equipment, wherein the historical process data includes historical output power of the current process equipment in each process time period when the semiconductor process is executed.

[0094] Step B2: determining the standard power resources required by the current process equipment in each process time period when performing the semiconductor process based on the historical process data.

[0095] The power output fitting curve of the current process equipment when executing the semiconductor process can be obtained by analyzing and fitting the historical process data, and the above-mentioned standard power resource can be determined based on the power output fitting curve.

[0096] Step B3: storing the corresponding relationship between the process identification information of the semiconductor process and the standard power resources required in each process time period.

[0097] The corresponding relationship between the process identification information of the semiconductor process and the standard power resources required in each process time period is stored according to a preset time interval.

[0098] Therefore, when determining the total standard power resources required by a semiconductor process during a process time period to be executed, the total standard power resources can be determined based on the process identification information of the semiconductor process, the process time period to be executed, and the aforementioned correspondence. The corresponding total standard power resources can be determined for each preset time interval within the process time period to be executed.

[0099] In this embodiment, by predetermining the power resources required for the semiconductor process in each process time period, when receiving a process operation request for the semiconductor process from a lower-level device, the standard power resources required by the current process equipment in the process time period of the semiconductor process can be quickly determined, providing a data basis for subsequent judgment on whether the current process equipment meets the process operation conditions.

[0100] In one embodiment, when judging whether the current process equipment corresponding to the lower-level device meets the process operation conditions based on the total standard power resources and the allocated power resources required by the semiconductor process during the process time period to be run, the sum of the total standard power resources and the allocated power resources can be calculated first, and it can be judged whether the sum is less than or equal to the total power resources that can be allocated to the upper-level device. If the sum is less than or equal to the total power resources that can be allocated to the upper-level device, it is determined that the current process equipment corresponding to the lower-level device meets the process operation conditions.

[0101] Among them, when the sum of the total standard power resources and the allocated power resources is greater than the total power resources that can be allocated by the upper computer device, it is considered that the current process equipment corresponding to the lower computer device does not meet the process operation conditions, and the process of calculating the sum of the total standard power resources and the allocated power resources and judging the sum is continued until the current process equipment corresponding to the lower computer device meets the process operation conditions or the process time period to be run ends.

[0102] It should be understood that the correspondence between the process identification information of the semiconductor process and the standard power resources required in each process time period is stored according to a preset time interval. The corresponding total standard power resources can be determined in each preset time interval in the process time period to be run. That is to say, the total standard power resources may change in the process time period to be run. Therefore, when the current process equipment corresponding to the lower-level device does not meet the process operation conditions, the process of calculating the sum of the total standard power resources and the allocated power resources and judging the sum value continues. It is possible that the current process equipment corresponding to the lower-level device meets the process operation conditions within a certain preset time interval in the process time period to be run.

[0103] In this embodiment, by calculating the sum of the total standard power resources required for the semiconductor process during the process time period to be run and the power resources allocated to the upper computer device, it is determined whether the sum is less than or equal to the total power resources that can be allocated to the upper computer device. When the sum is less than or equal to the total power resources that can be allocated to the upper computer device, it is determined that the current process equipment corresponding to the lower computer device meets the process operation conditions, thereby achieving the effect of scheduling the current process equipment to run the semiconductor process according to the power resources, avoiding the power resources allocated to the lower computer device exceeding the total power resources of the upper computer device, thereby avoiding the situation where the process equipment trips and stops production.

[0104] In one embodiment, while the current process equipment is executing a semiconductor process, or when the semiconductor process is about to be executed after receiving the first power resource allocated by the upper computer device, the target temperature input by the user can be sent to the lower computer device through the upper computer device, so that when the upper computer device receives the temporary power allocation request sent by the lower computer device, the third power resource is allocated to the lower computer device according to the temporary power allocation request.

[0105] The temporary power allocation request is sent by the lower computer device to the upper computer device when the lower computer device determines the target output power resource according to the target temperature and determines that the target output power resource is greater than the first power resource.

[0106] In this embodiment, the target temperature input by the user is sent to the lower computer device through the upper computer device. When the lower computer device determines the target output power resource based on the target temperature and judges that the target output power resource is greater than the first power resource, the lower computer device sends a temporary power allocation request to the upper computer device. When the upper computer device receives the temporary power allocation request sent by the lower computer device, it allocates the third power resource to the lower computer device according to the temporary power allocation request. Therefore, when the user schedules the execution of the semiconductor process, it can ensure that the process parameters are not affected to the greatest extent, thereby ensuring the accuracy of the process results.

[0107] In one embodiment, when the upper computer device receives the temporary power allocation request sent by the lower computer device, the upper computer device allocates the third power resource to the lower computer device according to the temporary power allocation request, which can be specifically performed as follows: steps C1-C5:

[0108] Step C1, when receiving a temporary power allocation request sent by the lower device, determine whether there are other process devices currently waiting for process execution; if so, execute step C2; if not, execute step C3.

[0109] The other process equipment may be a process equipment that has sent a process operation request to the upper computer device, but the upper computer device is still determining whether the process equipment corresponding to the lower computer device meets the process operation condition.

[0110] Step C2: Prioritize the allocation of power resources to other process equipment waiting for process execution.

[0111] Step C3, determining whether the current process equipment is in process execution; if so, executing step C4; if not, executing step C5.

[0112] In one embodiment, determining whether the current process equipment is currently executing a process refers to determining the current process equipment status. The current process equipment status may include idle, starting a process, or currently executing a process. If the current process equipment status is either starting a process or currently executing a process, step C4 is executed. If the current process equipment status is idle, it indicates that the user has manually adjusted the output power of the slave device corresponding to the current process equipment through the host device, and step C5 is executed.

[0113] Step C4, determine whether there are other process equipment in the process execution; if there are other process equipment in the process execution, allocate power resources to the other process equipment in the process execution and the current process equipment in turn according to the lower computer equipment corresponding to the other process equipment in the process execution and the order in which the lower computer equipment sends power allocation requests; if there are no other process equipment in the process execution, allocate the third power resource to the current process equipment.

[0114] Step C5, determine whether there are other process equipment in the process execution; if there are other process equipment in the process execution, allocate power resources to the other process equipment in the process execution first; if there are no other process equipment in the process execution, allocate the third power resource to the current process equipment according to the serial number of the current process equipment.

[0115] The third power resource is allocated to the current process equipment according to the sequence number of the current process equipment, that is, the third power resource is allocated to the current process equipment in sequence according to the sequence number of the current process equipment (e.g., ascending or descending order). Assume that there is a current process equipment with sequence number 1 (hereinafter referred to as equipment 1) and a current process equipment with sequence number 2 (hereinafter referred to as equipment 2), and both equipment 1 and equipment 2 are in idle status, and there is no other process equipment currently executing a process. Then, when the third power resource is allocated to the current process equipment in sequence according to the ascending sequence number of the current process equipment, the third power resource may be allocated to equipment 1 first, and then to equipment 2.

[0116] In this embodiment, upon receiving a temporary power allocation request sent by the lower device, the third power resource is allocated to the lower device according to the temporary power allocation request, thereby ensuring that the process parameters are not affected to the greatest extent, thereby ensuring the accuracy of the process results.

[0117] In one embodiment, when allocating the third power resource to the slave device based on the temporary power allocation request, the remaining power resource of the master device can be calculated based on the total power resource that can be allocated to the master device and the power resource currently allocated to other devices. If the remaining power resource is greater than or equal to the maximum output power of the current process equipment, the third power resource equal to the maximum output power is allocated to the slave device; if the remaining power resource is less than the third power resource, the third power resource equal to the remaining power resource is allocated to the slave device.

[0118] The maximum output power of the current process equipment is the power resource requested by the temporary power allocation request.

[0119] For example, the total power resource that can be allocated by the host device is 5000 watts, and the power resource that the slave device requests the host device to allocate is 1000 watts. If the power resource currently allocated to other devices by the host device is 4200 watts, then, by calculation, it can be determined that the remaining power resource of the host device is 800 watts, and the remaining power resource of 800 watts is less than 1000 watts. At this time, the third power resource allocated to the slave device is the remaining power resource of 800 watts of the host device. If the power resource currently allocated to other devices by the host device is 3900 watts, then, by calculation, it can be determined that the remaining power resource of the host device is 1100 watts, and the remaining power resource of 1100 watts is greater than 1000 watts. At this time, the third power resource allocated to the slave device is the power resource (i.e., the maximum output power of the current process equipment) 1000 watts requested by the slave device.

[0120] In this embodiment, the remaining power resources of the upper computer device are calculated based on the total power resources that can be allocated to the upper computer device and the power resources currently allocated to other devices. The resources allocated to the lower computer device are then determined based on the remaining power resources of the upper computer device. This ensures that the process parameters are not affected without affecting the normal operation of the semiconductor process of the process equipment corresponding to other lower computer devices, thereby ensuring the accuracy of the process results.

[0121] To facilitate understanding of the method provided by the embodiment of the present application, the semiconductor process control method provided by the embodiment of the present application will be introduced below in a manner in which a lower computer device and a host computer device interact with each other. Figure 5 FIG. 1 is a schematic diagram of an interactive process of a semiconductor process control method according to an embodiment of the present application. Figure 5 As shown, the method includes:

[0122] S501 : The lower computer device sends a process operation request for a semiconductor process to the upper computer device according to the control command sent by the upper computer device.

[0123] Based on the process recipe, the host device sends control commands to the subordinate devices, such as running the process and setting the heating temperature of the process equipment. The process operation request may include the identification information of the current process equipment, process identification information, process duration, process time period, etc.

[0124] S502 : The upper computer device determines the total standard power resources required for the semiconductor process in the process time period to be run according to the process operation request sent by the lower computer device.

[0125] Prior to executing S502, historical process data for the current process equipment can be obtained. Based on the historical process data, the standard power resources required by the current process equipment for each process time period when executing the semiconductor process are determined. The corresponding relationship between the process identification information of the semiconductor process and the standard power resources required for each process time period is stored. Thus, when executing S502, the total standard power resources can be determined based on the process identification information of the semiconductor process, the process time period to be executed, and the corresponding relationship.

[0126] The historical process data includes historical output power of the current process equipment during each process time period when the semiconductor process is executed.

[0127] S503, the upper computer device determines the allocated power resources corresponding to the above-mentioned process time period, and judges whether the current process equipment corresponding to the lower computer device meets the process operation conditions based on the total standard power resources and the allocated power resources; if so, execute S504; if not, continue to execute S503.

[0128] When executing S503, the sum of the total standard power resources and the allocated power resources can be calculated, and it can be determined whether the sum is less than or equal to the total power resources that can be allocated to the upper computer device; if the sum is less than or equal to the total power resources that can be allocated to the upper computer device, it is determined that the current process equipment corresponding to the lower computer device meets the process operation conditions; if the sum is greater than the total power resources that can be allocated to the upper computer device, it is determined that the current process equipment corresponding to the lower computer device does not meet the process operation conditions, and the sum is continued to be determined within the above-mentioned process time period whether it is less than or equal to the total power resources that can be allocated to the upper computer device.

[0129] S504 : The upper computer device sends a process operation command for the semiconductor process to the lower computer device, and allocates a first power resource to the lower computer device.

[0130] In one embodiment, after executing S504, the target temperature input by the user can be sent to the lower computer device through the upper computer device. When the lower computer device determines the target output power resource based on the target temperature and judges that the target output power resource is greater than the first power resource, a temporary power allocation request is sent to the upper computer device. When the upper computer device receives the temporary power allocation request sent by the lower computer device, the third power resource is allocated to the lower computer device according to the temporary power allocation request.

[0131] In one embodiment, when the upper computer device receives a temporary power allocation request from a lower computer device, it can determine whether other process equipment is currently waiting for process execution. If other process equipment is currently waiting for process execution, power resources are preferentially allocated to the other process equipment. If no other process equipment is currently waiting for process execution, it is determined whether the current process equipment is currently executing a process. Thus, if the current process equipment is currently executing a process, it is determined whether other process equipment is currently executing a process. If other process equipment is currently executing a process, power resources are allocated to the other process equipment and the current process equipment in sequence based on the lower computer devices corresponding to the other process equipment in executing a process and the order in which the lower computer devices sent power allocation requests. If no other process equipment is currently executing a process, a third power resource is allocated to the current process equipment. If the current process equipment is not currently executing a process, it is determined whether other process equipment is currently executing a process. If other process equipment is currently executing a process, power resources are preferentially allocated to the other process equipment in executing a process. If no other process equipment is currently executing a process, the third power resource is allocated to the current process equipment based on the sequence number of the current process equipment.

[0132] In one embodiment, when allocating a third power resource to a lower-level device based on a temporary power allocation request, the remaining power resources of the upper-level device can be calculated based on the total power resources that can be allocated to the upper-level device and the power resources currently allocated to other devices; if the remaining power resources are greater than or equal to the maximum output power of the current process equipment, the third power resource equal to the maximum output power is allocated to the lower-level device; if the remaining power resources are less than the third power resource, the third power resource equal to the remaining power resource is allocated to the lower-level device.

[0133] S505 , the lower computer device controls the current process device corresponding to the lower computer device to execute the semiconductor process in response to the process operation command for the semiconductor process sent by the upper computer device and the first power resource allocated for the semiconductor process.

[0134] S506, determining the real-time output power of the current process equipment during the execution of the semiconductor process, and judging whether the real-time output power is greater than the first power resource; if so, executing S507; if not, continuing to execute S506.

[0135] S507: The lower computer device performs a power limit operation on the real-time output power and sends a power allocation request to the upper computer device.

[0136] Among them, when performing power limiting operation on the real-time output power, the parameter output percentage corresponding to the current process equipment can be determined based on the parameter output data of the current process equipment, and the power limiting coefficient of the current process equipment can be calculated based on the real-time output power, the first power resource and the parameter output percentage, so as to perform power limiting operation on the real-time output power according to the power limiting coefficient.

[0137] S508 : When the upper computer device receives the power allocation request sent by the lower computer device, the upper computer device allocates a second power resource to the lower computer device according to the power allocation request.

[0138] S509, the lower computer device receives the second power resource allocated by the upper computer device, and determines whether the second power resource is greater than or equal to the real-time output power; if so, execute S510; if not, jump to S507.

[0139] S510: Stop performing power limiting operation on the real-time output power.

[0140] In one embodiment, after executing S510, the process can jump to S506 to determine the real-time output power of the current process equipment during the execution of the semiconductor process, and judge whether the real-time output power is greater than the second power resource, so as to execute subsequent steps according to the judgment result until the process time period to be run ends.

[0141] in, Figure 5 The specific implementation process of each step in the embodiment of the method shown can be referred to Figure 2 and Figure 3 The embodiments shown will not be described in detail here.

[0142] Adopting the technical scheme of the embodiment of the present application, the lower-level device controls the current process equipment corresponding to the lower-level device to execute the semiconductor process by responding to the process operation command for the semiconductor process sent by the upper-level device (sent by the upper-level device when determining that the current process equipment corresponding to the lower-level device meets the process operation conditions) and the first power resource allocated for the semiconductor process. Thus, through the interaction between the upper-level device and the lower-level device, the current process equipment that meets the process operation conditions can be scheduled to execute the semiconductor process, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. Moreover, by determining the real-time output power of the current process equipment during the execution of the semiconductor process, when the real-time output power is greater than the first power resource, the real-time output power is power-limited, and a power allocation request is sent to the upper-level device, the second power resource allocated by the upper-level device based on the power allocation request is received, and when the second power resource is greater than or equal to the real-time output power, the real-time output power is stopped from being power-limited. When the second power resource is less than the real-time output power, the real-time output power is continued to be power-limited, and the step of sending the power allocation request to the upper-level device is returned. As can be seen, by real-time monitoring of the output power of the current process equipment during process operation, the problem of the output power exceeding the factory load during process operation is effectively avoided. Furthermore, when the real-time output power exceeds the power resources allocated for the semiconductor process of the current process equipment, power resources can be requested from the upper computer equipment, ensuring that the process parameters are not affected to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0143] Furthermore, the upper computer device determines the total standard power resources required for the semiconductor process during the process time period to be run, and determines the allocated power resources corresponding to the process time period, by responding to the process operation request for the semiconductor process sent by the lower computer device. Based on the total standard power resources and the allocated power resources, the upper computer device determines whether the current process equipment corresponding to the lower computer device meets the process operation conditions. When the current process equipment corresponding to the lower computer device meets the process operation conditions, the upper computer device sends a process operation command to the lower computer device and allocates the first power resource to the lower computer device. It can be seen that this technical solution, through the interaction between the upper computer device and the lower computer device, can schedule the current process equipment that meets the process operation conditions to execute the semiconductor process, thereby solving the problem of unscheduled process operation of the semiconductor process in the prior art. Furthermore, by allocating the second power resource to the lower computer device according to the power allocation request upon receiving the power allocation request sent by the lower computer device, the process parameters are ensured to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0144] In summary, specific embodiments of the present subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing may be advantageous.

[0145] Corresponding to the above Figure 2 The semiconductor process control method provided in the embodiment shown is based on the same technical concept. The embodiment of the present application also provides a semiconductor process control device. Figure 6 This is a schematic diagram of the structure of a semiconductor process control device according to an embodiment of the present application. The semiconductor process control device is located in a lower computer device. The semiconductor process control device is used to execute Figure 2 Semiconductor process control methods described, such as Figure 6 As shown, the semiconductor process control device includes:

[0146] A control module 610 is configured to control a current process device corresponding to a slave device to execute the semiconductor process in response to a process operation command for the semiconductor process sent by the master device and a first power resource allocated for the semiconductor process. The process operation command is sent by the master device when the master device determines that the current process device meets the process operation conditions.

[0147] A first determination and judgment module 620 is configured to determine the real-time output power of the current process equipment during the execution of the semiconductor process, and to determine whether the real-time output power is greater than the first power resource;

[0148] An execution and sending module 630 is configured to perform a power limiting operation on the real-time output power and send a power allocation request to a host device when the real-time output power is greater than the first power resource;

[0149] The receiving and executing module 640 is used to receive the second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

[0150] In one embodiment, the execution and sending module 630 includes:

[0151] A first determining unit is configured to determine a parameter output percentage corresponding to the current process equipment according to parameter output data of the current process equipment;

[0152] A first calculation unit is used to calculate a power limit coefficient of a current process device according to the real-time output power, the first power resource and the parameter output percentage;

[0153] The power limiting unit is used to perform power limiting operation on the real-time output power according to the power limiting coefficient.

[0154] In one embodiment, the process operation request includes at least one of identification information of the current process equipment, process identification information, process duration, and process time period;

[0155] The process operation conditions include: the sum of the total standard power resources required by the semiconductor process during the process time period and the allocated power resources corresponding to the process time period is less than or equal to the total power resources that can be allocated by the host computer device.

[0156] Using the apparatus of the embodiment of the present application, the lower-level device controls the current process equipment corresponding to the lower-level device to execute the semiconductor process by responding to the process operation command for the semiconductor process sent by the upper-level device (sent by the upper-level device when determining that the current process equipment corresponding to the lower-level device meets the process operation conditions) and the first power resource allocated for the semiconductor process. Thus, through the interaction between the upper-level device and the lower-level device, the current process equipment that meets the process operation conditions can be scheduled to execute the semiconductor process, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. In addition, by determining the real-time output power of the current process equipment during the execution of the semiconductor process, when the real-time output power is greater than the first power resource, the real-time output power is power-limited, and a power allocation request is sent to the upper-level device, and the second power resource allocated by the upper-level device based on the power allocation request is received. When the second power resource is greater than or equal to the real-time output power, the power-limiting operation on the real-time output power is stopped. When the second power resource is less than the real-time output power, the power-limiting operation on the real-time output power is continued, and the step of sending the power allocation request to the upper-level device is returned. As can be seen, by real-time monitoring of the output power of the current process equipment during process operation, the problem of the output power exceeding the factory load during process operation is effectively avoided. Furthermore, when the real-time output power exceeds the power resources allocated for the semiconductor process of the current process equipment, power resources can be requested from the upper computer equipment, ensuring that the process parameters are not affected to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0157] Corresponding to the above Figure 3 The semiconductor process control method provided in the embodiment shown is based on the same technical concept. The embodiment of the present application also provides a semiconductor process control device. Figure 7This is a schematic diagram of the structure of a semiconductor process control device according to another embodiment of the present application. The semiconductor process control device is located in a host computer device. The semiconductor process control device is used to execute Figure 3 Semiconductor process control methods described, such as Figure 7 As shown, the semiconductor process control device includes:

[0158] A first determining module 710 is configured to determine, in response to a process operation request for a semiconductor process sent by a lower computer device, a total standard power resource required by the semiconductor process during a process time period to be operated;

[0159] The second determination and judgment module 720 is used to determine the allocated power resources corresponding to the process time period; based on the total standard power resources and the allocated power resources, it is determined whether the current process equipment corresponding to the lower computer device meets the process operation conditions;

[0160] a sending and allocating module 730 configured to send a process operation command to the subordinate device and allocate a first power resource to the subordinate device so that the subordinate device controls the current process device to execute the semiconductor process according to the process operation command;

[0161] The first allocation module 740 is used to allocate the second power resource to the lower device according to the power allocation request when receiving the power allocation request sent by the lower device; the power allocation request is sent by the lower device to the upper device when it determines that the real-time output power of the current process equipment in the execution of the semiconductor process is greater than the first power resource.

[0162] In one embodiment, the process operation request includes at least one of identification information of current process equipment, process identification information, process duration, and process time period.

[0163] In one embodiment, the second determination and judgment module 720 includes:

[0164] A second calculation unit, configured to calculate the sum of the total standard power resources and the allocated power resources;

[0165] A first judging unit, configured to judge whether the sum value is less than or equal to the total power resources allocable to the host device;

[0166] The second determining unit is configured to determine that, if yes, the current process equipment corresponding to the lower computer device meets the process operation conditions.

[0167] In one embodiment, the semiconductor process control apparatus further includes:

[0168] An acquisition module is used to acquire historical process data of the current process equipment; the historical process data includes historical output power of the current process equipment in each process time period when the semiconductor process is performed;

[0169] A second determining module is used to determine the standard power resources required by the current process equipment in each process time period when performing the semiconductor process based on the historical process data;

[0170] A storage module, used for storing the corresponding relationship between process identification information of the semiconductor process and the standard power resources required in each process time period;

[0171] The first determining module 710 includes:

[0172] The third determining unit is configured to determine the total standard power resource according to the process identification information of the semiconductor process, the process time period to be run, and the corresponding relationship.

[0173] In one embodiment, the semiconductor process control apparatus further includes:

[0174] The sending module is used to send the target temperature input by the user to the lower computer device;

[0175] A second allocation module is configured to allocate a third power resource to the lower device according to the temporary power allocation request when receiving the temporary power allocation request sent by the lower device;

[0176] The temporary power allocation request is sent by the lower computer device to the upper computer device when the lower computer device determines the target output power resource according to the target temperature and determines that the target output power resource is greater than the first power resource.

[0177] In one embodiment, the second allocation module includes:

[0178] The second judgment unit is used to judge whether there are other process devices waiting for process execution when receiving the temporary power allocation request sent by the lower computer device;

[0179] A first allocation unit is configured to allocate power resources to other process equipment waiting for process execution if there are other process equipment waiting for process execution;

[0180] a third judging unit, configured to judge whether the current process equipment is in process execution if there is no other process equipment waiting for process execution;

[0181] The first judgment and execution unit is configured to, if the current process equipment is in process execution, determine whether there are other process equipment in process execution; if there are other process equipment in process execution, allocate power resources to the other process equipment in process execution and the current process equipment in sequence according to the order in which the lower computer devices corresponding to the other process equipment in process execution and the lower computer devices send power allocation requests; if there are no other process equipment in process execution, allocate a third power resource to the current process equipment;

[0182] The second judgment and execution unit is used to judge whether there are other process equipment in process execution if the current process equipment is not in process execution; if there are other process equipment in process execution, power resources are allocated to other process equipment in process execution on a priority basis; if there are no other process equipment in process execution, the third power resource is allocated to the current process equipment according to the serial number of the current process equipment.

[0183] In one embodiment, the second allocation module includes:

[0184] a third calculating unit, configured to calculate the remaining power resources of the host device according to the total power resources allocable to the host device and the power resources currently allocated to other devices;

[0185] The second allocation unit is configured to allocate a third power resource equal to the maximum output power to the lower device if the remaining power resource is greater than or equal to the maximum output power of the current process device;

[0186] The third allocating unit is configured to allocate the third power resource equal to the remaining power resource to the lower device if the remaining power resource is less than the third power resource.

[0187] Using the device of the embodiment of the present application, the upper computer device determines the total standard power resources required for the semiconductor process during the process time period to be run, and determines the allocated power resources corresponding to the process time period, by responding to the process operation request for the semiconductor process sent by the lower computer device. Thus, based on the total standard power resources and the allocated power resources, it is judged whether the current process equipment corresponding to the lower computer device meets the process operation conditions. When the current process equipment corresponding to the lower computer device meets the process operation conditions, the process operation command is sent to the lower computer device, and the first power resource is allocated to the lower computer device. It can be seen that the device can schedule the current process equipment that meets the process operation conditions to execute the semiconductor process through the interaction between the upper computer device and the lower computer device, solving the problem of unscheduled process operation of the semiconductor process in the prior art. Moreover, by allocating the second power resource to the lower computer device according to the power allocation request when receiving the power allocation request sent by the lower computer device, the process parameters are ensured to the greatest extent without being affected, thereby ensuring the accuracy of the process results.

[0188] Those skilled in the art should understand that Figure 6 and Figure 7 The semiconductor process control device in can be used to implement the semiconductor process control method described above. The detailed description should be similar to the description of the method part above. To avoid redundancy, it will not be repeated here.

[0189] Based on the same idea, the embodiment of the present application also provides a semiconductor process control device, Figure 8 FIG. 1 is a schematic structural diagram of a semiconductor process control device according to an embodiment of the present application. Figure 8 As shown. The semiconductor process control equipment may have relatively large differences due to different configurations or performances, and may include one or more processors 801 and memory 802, and the memory 802 may store one or more storage applications or data. Among them, the memory 802 may be a temporary storage or a permanent storage. The application stored in the memory 802 may include one or more modules (not shown in the figure), each module may include a series of computer executable instructions in the semiconductor process control equipment. Furthermore, the processor 801 can be configured to communicate with the memory 802 to execute a series of computer executable instructions in the memory 802 on the semiconductor process control equipment. The semiconductor process control equipment may also include one or more power supplies 803, one or more wired or wireless network interfaces 804, one or more input and output interfaces 805, and one or more keyboards 806.

[0190] Specifically, in this embodiment, the semiconductor process control device includes a memory and one or more programs, wherein the one or more programs are stored in the memory, and the one or more programs may include one or more modules, and each module may include a series of computer-executable instructions for the semiconductor process control device, and the one or more programs are configured to be executed by one or more processors, including computer-executable instructions for performing the following:

[0191] In response to a process operation command for a semiconductor process sent by the upper computer device and a first power resource allocated for the semiconductor process, controlling the current process equipment corresponding to the lower computer device to execute the semiconductor process; the process operation command is sent by the upper computer device when it is determined that the current process equipment meets the process operation conditions;

[0192] Determining the real-time output power of the current process equipment during the execution of the semiconductor process, and judging whether the real-time output power is greater than the first power resource;

[0193] If so, the real-time output power is limited and a power allocation request is sent to the upper device;

[0194] Receive the second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

[0195] Using the device of the embodiment of the present application, the lower-level device controls the current process equipment corresponding to the lower-level device to execute the semiconductor process by responding to the process operation command for the semiconductor process sent by the upper-level device (sent by the upper-level device when determining that the current process equipment corresponding to the lower-level device meets the process operation conditions) and the first power resource allocated for the semiconductor process. Thus, through the interaction between the upper-level device and the lower-level device, the current process equipment that meets the process operation conditions can be scheduled to execute the semiconductor process, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. In addition, by determining the real-time output power of the current process equipment during the execution of the semiconductor process, when the real-time output power is greater than the first power resource, the real-time output power is power-limited, and a power allocation request is sent to the upper-level device, and the second power resource allocated by the upper-level device based on the power allocation request is received. When the second power resource is greater than or equal to the real-time output power, the real-time output power is stopped from being power-limited. When the second power resource is less than the real-time output power, the real-time output power is continued to be power-limited, and the step of sending the power allocation request to the upper-level device is returned. As can be seen, by real-time monitoring of the output power of the current process equipment during process operation, the problem of the output power exceeding the factory load during process operation is effectively avoided. Furthermore, when the real-time output power exceeds the power resources allocated for the semiconductor process of the current process equipment, power resources can be requested from the upper computer equipment, ensuring that the process parameters are not affected to the greatest extent possible, thereby ensuring the accuracy of the process results.

[0196] Based on the same idea, the embodiment of the present application also provides a semiconductor process control device, Figure 9 is a structural diagram of a semiconductor process control device according to another embodiment of the present application. Figure 9As shown. The semiconductor process control equipment may have relatively large differences due to different configurations or performances, and may include one or more processors 901 and memory 902, and the memory 902 may store one or more storage applications or data. Among them, the memory 902 may be a temporary storage or a permanent storage. The application stored in the memory 902 may include one or more modules (not shown in the figure), each module may include a series of computer executable instructions in the semiconductor process control equipment. Furthermore, the processor 901 can be configured to communicate with the memory 902 to execute a series of computer executable instructions in the memory 902 on the semiconductor process control equipment. The semiconductor process control equipment may also include one or more power supplies 903, one or more wired or wireless network interfaces 904, one or more input and output interfaces 905, and one or more keyboards 906.

[0197] Specifically, in this embodiment, the semiconductor process control device includes a memory and one or more programs, wherein the one or more programs are stored in the memory, and the one or more programs may include one or more modules, and each module may include a series of computer-executable instructions for the semiconductor process control device, and the one or more programs are configured to be executed by one or more processors, including computer-executable instructions for performing the following:

[0198] In response to a process operation request for a semiconductor process sent by a lower computer device, determining a total standard power resource required by the semiconductor process in a process time period to be operated;

[0199] Determine the allocated power resources corresponding to the process time period; based on the total standard power resources and the allocated power resources, determine whether the current process equipment corresponding to the lower-level equipment meets the process operation conditions;

[0200] If so, sending a process operation command to the subordinate device and allocating a first power resource to the subordinate device so that the subordinate device controls the current process device to execute the semiconductor process according to the process operation command;

[0201] When receiving a power allocation request sent by a lower computer device, a second power resource is allocated to the lower computer device according to the power allocation request; the power allocation request is sent by the lower computer device to the upper computer device when it determines that the real-time output power of the current process equipment in the execution of the semiconductor process is greater than the first power resource.

[0202] Using the device of the embodiment of the present application, the upper computer device determines the total standard power resources required for the semiconductor process in the process time period to be run, and determines the allocated power resources corresponding to the process time period, by responding to the process operation request for the semiconductor process sent by the lower computer device. Thus, based on the total standard power resources and the allocated power resources, it is judged whether the current process equipment corresponding to the lower computer device meets the process operation conditions. When the current process equipment corresponding to the lower computer device meets the process operation conditions, the process operation command is sent to the lower computer device, and the first power resource is allocated to the lower computer device. It can be seen that the device can schedule the current process equipment that meets the process operation conditions to execute the semiconductor process through the interaction between the upper computer device and the lower computer device, solving the problem of no scheduling of process operation of the semiconductor process in the prior art. Moreover, by allocating the second power resource to the lower computer device according to the power allocation request when receiving the power allocation request sent by the lower computer device, it is ensured that the process parameters are not affected to the greatest extent, thereby ensuring the accuracy of the process results.

[0203] An embodiment of the present application also proposes a storage medium that stores one or more computer programs. The one or more computer programs include instructions. When the instructions are executed by an electronic device that includes multiple application programs, the electronic device can execute the various processes of the above-mentioned semiconductor process control method embodiment applied to the lower computer device, and can achieve the same technical effect. To avoid repetition, they will not be repeated here.

[0204] An embodiment of the present application also proposes a storage medium that stores one or more computer programs. The one or more computer programs include instructions. When the instructions are executed by an electronic device that includes multiple application programs, the electronic device can execute the various processes of the above-mentioned semiconductor process control method embodiment applied to the host computer device, and can achieve the same technical effect. To avoid repetition, they will not be repeated here.

[0205] The systems, devices, modules, or units described in the above embodiments may be implemented by computer chips or entities, or by products having certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0206] For the convenience of description, the above devices are described as being divided into various units according to their functions. Of course, when implementing this application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0207] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0208] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the steps in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0209] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0210] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0211] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0212] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0213] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media (transitory media), such as modulated data signals and carrier waves.

[0214] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0215] The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communications network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0216] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiments are generally similar to the method embodiments, so the description is relatively simple. For relevant parts, refer to the description of the method embodiments.

[0217] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A semiconductor process control method, applied to a lower computer device, characterized in that: include: In response to a process operation command for a semiconductor process sent by a host computer device and a first power resource allocated for the semiconductor process, controlling a current process device corresponding to the slave computer device to execute the semiconductor process, wherein the first power resource is allocated by the host computer device to the current process device; the process operation command is sent by the host computer device when it is determined that the current process device meets the process operation conditions; determining a real-time output power of the current process equipment during execution of the semiconductor process, and determining whether the real-time output power is greater than the first power resource; If so, performing a power limiting operation on the real-time output power and sending a power allocation request to the host device; Receive a second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop performing the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue performing the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

2. The method according to claim 1, characterized in that The performing a power limiting operation on the real-time output power includes: Determining the parameter output percentage corresponding to the current process equipment according to the parameter output data of the current process equipment; Calculating a power limiting coefficient of the current process equipment according to the real-time output power, the first power resource, and the parameter output percentage; A power limiting operation is performed on the real-time output power according to the power limiting coefficient.

3. The method according to claim 1, characterized in that The process operation request includes at least one of the identification information of the current process equipment, process identification information, process duration, and process time period; The process operation condition includes: the sum of the total standard power resources required by the semiconductor process in the process time period and the allocated power resources corresponding to the process time period is less than or equal to the total power resources that can be allocated by the host computer device.

4. A semiconductor process control method, applied to a host computer device, characterized in that: include: In response to a process operation request for a semiconductor process sent by a lower computer device, determining a total standard power resource required by the semiconductor process in a process time period to be operated; Determining allocated power resources corresponding to the process time period; Determining whether the current process equipment corresponding to the lower-level device meets the process operation conditions according to the total standard power resources and the allocated power resources; If so, sending a process operation command to the lower computer device and allocating a first power resource to the lower computer device, so that the lower computer device controls the current process device to perform the semiconductor process according to the process operation command, where the first power resource is allocated by the upper computer device to the current process device; Upon receiving a power allocation request sent by the lower device, a second power resource is allocated to the lower device according to the power allocation request; the power allocation request is sent by the lower device to the upper device when it is determined that the real-time output power of the current process equipment during the execution of the semiconductor process is greater than the first power resource.

5. The method according to claim 4, characterized in that The process operation request includes at least one of the identification information of the current process equipment, process identification information, process duration, and the process time period.

6. The method according to claim 4, characterized in that The determining, based on the total standard power resources and the allocated power resources, whether the current process equipment corresponding to the lower computer equipment meets the process operation conditions includes: Calculating a sum of the total standard power resource and the allocated power resource; Determining whether the sum is less than or equal to the total power resources allocable to the host device; If so, it is determined that the current process equipment corresponding to the lower computer device meets the process operation conditions.

7. The method according to claim 5, characterized in that Before responding to the process operation request for the semiconductor process sent by the lower computer device, the method further includes: Acquiring historical process data of the current process equipment; the historical process data includes historical output power of the current process equipment in each process time period when performing the semiconductor process; Determining, based on the historical process data, standard power resources required by the current process equipment in each of the process time periods when executing the semiconductor process; Storing a correspondence between process identification information of the semiconductor process and the standard power resources required in each process time period; Determining the total standard power resources required by the semiconductor process during the process time period to be run includes: The total standard power resource is determined according to the process identification information of the semiconductor process, the process time period to be run, and the corresponding relationship.

8. The method according to claim 4, characterized in that Also includes: Sending the target temperature input by the user to the slave device; When receiving the temporary power allocation request sent by the lower device, allocating a third power resource to the lower device according to the temporary power allocation request; The temporary power allocation request is sent by the lower computer device to the upper computer device when the lower computer device determines the target output power resource according to the target temperature and determines that the target output power resource is greater than the first power resource.

9. The method according to claim 8, characterized in that When receiving the temporary power allocation request sent by the lower device, allocating the third power resource to the lower device according to the temporary power allocation request includes: When receiving the temporary power allocation request sent by the lower computer device, determining whether there are other process devices currently waiting for process execution; If there are other process equipment waiting for the process to be executed, power resources are allocated to the other process equipment waiting for the process to be executed first; If there is no other process equipment waiting for process execution, determining whether the current process equipment is in process execution; If the current process equipment is in process execution, determining whether there are other process equipment in process execution; if there are other process equipment in process execution, allocating power resources to the other process equipment in process execution and the current process equipment in sequence according to the order in which the lower computer devices corresponding to the other process equipment in process execution and the lower computer devices send power allocation requests; if there are no other process equipment in process execution, allocating the third power resource to the current process equipment; If the current process equipment is not in the process execution, determine whether there are other process equipment in the process execution; if there are other process equipment in the process execution, prioritize allocating power resources to the other process equipment in the process execution; if there are no other process equipment in the process execution, allocate the third power resource to the current process equipment based on the serial number of the current process equipment.

10. The method according to claim 8, characterized in that Allocating a third power resource to the slave device according to the temporary power allocation request includes: Calculate the remaining power resources of the host device based on the total power resources that can be allocated to the host device and the power resources currently allocated to other devices; If the remaining power resource is greater than or equal to the maximum output power of the current process equipment, allocating the third power resource equal to the maximum output power to the lower device; If the remaining power resource is less than the third power resource, the third power resource equal to the remaining power resource is allocated to the lower device.

11. A semiconductor process control device, located in a lower computer device, characterized in that: include: a control module, configured to control a current process device corresponding to the slave device to execute the semiconductor process in response to a process operation command for a semiconductor process sent by a host device and a first power resource allocated for the semiconductor process, wherein the first power resource is allocated by the host device to the current process device; the process operation command is sent by the host device when it is determined that the current process device meets the process operation conditions; a first determining and judging module, configured to determine the real-time output power of the current process equipment during the execution of the semiconductor process, and to judge whether the real-time output power is greater than the first power resource; an execution and sending module, configured to perform a power limiting operation on the real-time output power and send a power allocation request to the host device when the real-time output power is greater than the first power resource; A receiving and executing module is used to receive a second power resource allocated by the upper computer device, and when the second power resource is greater than or equal to the real-time output power, stop performing the power limiting operation on the real-time output power; when the second power resource is less than the real-time output power, continue performing the power limiting operation on the real-time output power, and return to the step of sending a power allocation request to the upper computer device; the second power resource is allocated by the upper computer device to the lower computer device based on the power allocation request.

12. A semiconductor process control device, located in a host computer device, characterized in that: include: A first determining module is configured to determine, in response to a process operation request for a semiconductor process sent by a lower computer device, a total standard power resource required for the semiconductor process within a process time period to be operated; A second determination and judgment module is used to determine the allocated power resources corresponding to the process time period; Determining whether the current process equipment corresponding to the lower-level device meets the process operation conditions according to the total standard power resources and the allocated power resources; a sending and allocating module, configured to, if yes, send a process operation command to the lower computer device and allocate a first power resource to the lower computer device, so that the lower computer device controls the current process device to perform the semiconductor process according to the process operation command, wherein the first power resource is allocated by the upper computer device to the current process device; The first allocation module is used to allocate a second power resource to the lower computer device according to the power allocation request when receiving the power allocation request sent by the lower computer device; the power allocation request is sent to the upper computer device by the lower computer device when it determines that the real-time output power of the current process equipment in the execution of the semiconductor process is greater than the first power resource.

Images