A kind of electroplating process and electroplating equipment for alloy surface

Abstract

The present invention belongs to the field of electroplating technology, and in particular to an electroplating process for alloy surfaces and electroplating equipment thereof, comprising an electroplating tank with an opening at the top, a liquid replenishing mechanism for replenishing the electroplating solution in the electroplating tank and preventing the electroplating solution in the electroplating tank from overflowing, a lifting mechanism fixedly installed on the top of one side of the electroplating tank, a supporting mechanism for supporting alloy plates and adjustable in position and height installed on the lifting mechanism, a plurality of spraying mechanisms installed on the supporting mechanism, two adjacent spraying mechanisms are distributed in a mirror image, and the spraying mechanisms can clean the outer side of the alloy plate before electroplating. The present invention can clean the electroplating surface of the alloy plate before electroplating through the spraying mechanism, and there will be no situation where dirt attached to the electroplating surface of the alloy plate affects the electroplating effect, ensuring that the electroplating surface of the alloy plate can be electroplated evenly without defects.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, and in particular to an electroplating process for an alloy surface and an electroplating device thereof. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] The electroplating tank is the most basic equipment in the electroplating equipment. Its main function is to install the electroplating solution. In order to obtain a uniform coating, the existing electroplating tank usually adopts a stirring method to increase the uniformity of the electroplating solution in the electroplating tank. However, this is relatively laborious, and the existing ultrasonic electroplating device does not have the function of air-drying the object after electroplating. The user needs to air-dry the electroplating solution on the surface of the object, which brings certain troubles to the user's electroplating work. Therefore, an alloy surface electroplating process and electroplating equipment thereof are proposed. Summary of the invention

[0004] In order to solve the shortcomings in the prior art, the present invention provides an alloy surface electroplating process and electroplating equipment.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: an electroplating device for an alloy surface, comprising an electroplating tank with an opening at the top, one side of the electroplating tank is provided with a liquid replenishing mechanism for replenishing the plating liquid in the electroplating tank and preventing the plating liquid in the electroplating tank from overflowing, a lifting mechanism is fixedly installed on the top of one side of the electroplating tank, a supporting mechanism for supporting an alloy plate and having an adjustable position and height is installed on the lifting mechanism, a plurality of spraying mechanisms are installed on the supporting mechanism, and two adjacent spraying mechanisms are distributed in a mirror image, the spraying mechanism can clean the outer side of the alloy plate before electroplating, the spraying mechanism will also stir the plating liquid in the electroplating tank during electroplating, and the spraying mechanism can also dry the outer side of the alloy plate after the electroplating of the alloy plate is completed.

[0006] Preferably, a vibration mechanism is provided on the electroplating tank, and the vibration mechanism includes a protection box fixed on the bottom inner wall of the electroplating tank and an ultrasonic generator located outside the electroplating tank, a cable is connected to the ultrasonic generator, and a plurality of electroacoustic transducers distributed in a matrix are fixedly installed on the bottom inner wall of the protection box, and the bottom ends of the plurality of electroacoustic transducers extend outside the electroplating tank and are connected to the cable, and two heating rods are fixedly installed on the inner wall of the electroplating tank on one side close to the rehydration mechanism.

[0007] Preferably, the liquid replenishing mechanism includes a liquid storage tank and a water pump, and the liquid storage tank and the water pump are both provided with a liquid inlet and a liquid outlet, the liquid outlet of the liquid storage tank is connected to the liquid inlet of the water pump, the liquid outlet of the water pump is connected to a conduit 1 having one end extending into the electroplating tank, the liquid inlet of the liquid storage tank is connected to an overflow pipe having one end extending into the electroplating tank, and the overflow pipe is located above the conduit 1. A drain pipe is also provided on one side of the electroplating tank, and the bottom of the drain pipe is flush with the bottom inner wall of the electroplating tank.

[0008] Preferably, the lifting mechanism includes a bracket fixed to the top of the electroplating tank, the bracket having two sliding holes, and two guide rods are fixedly installed on the side of the bracket away from the opening of the electroplating tank, and the sliding sleeves on the two guide rods are provided with the same mounting seat, and the lifting mechanism also includes two telescopic rods fixed to the outside of the electroplating tank, and the top ends of the piston rods on the two telescopic rods are fixedly connected to the mounting seat.

[0009] Preferably, the supporting mechanism includes two connecting rods that pass through two sliding holes and are slidably connected to the inner walls of the two sliding holes, the connecting rods are L-shaped, the top ends of the two connecting rods are fixedly connected to the mounting seats, the two mounting seats are fixedly installed with a vertically arranged mounting frame 1 on one side close to each other, and the bottom ends of the two connecting rods are fixedly installed with a horizontally arranged mounting frame 2, the mounting frame 1 is fixedly connected to the mounting frame 2, and the mounting frame 1 and the mounting frame 2 are both hollow, and a plurality of linearly distributed fixing seats are fixedly installed on the top of the mounting frame 2.

[0010] Preferably, the injection mechanism includes an electric linear module fixed on a mounting frame, a collecting hood with an opening on one side is fixedly installed on the slide of the electric linear module, the opening of the collecting hood is parallel to the alloy plate fixed on the fixed seat, and there is a gap between the collecting hood and the alloy plate on the fixed seat, the same circular tube is fixedly installed on the inner walls on both sides of the electric linear module, the circular tube is provided with a plurality of injection holes distributed linearly, and the plurality of injection holes are all vertically facing the alloy plate on the fixed seat.

[0011] Preferably, a transfer cover with an opening on one side is fixedly installed on the side of the gathering cover away from the circular tube, the transfer cover is connected with the gathering cover, and conduit two and conduit three are fixedly installed through the transfer cover, the conduit two is connected with the transfer cover, and the bottom end of conduit three extends into the circular tube and is connected with the inside of the circular tube.

[0012] Preferably, the opening of the gathering hood is wide-mouthed.

[0013] An alloy surface electroplating process, applicable to the above-mentioned alloy surface electroplating equipment, is characterized in that it includes the following steps:

[0014] S1, first adjust the height of the supporting mechanism through the lifting mechanism so that the bottom of the supporting mechanism is flush with the top of the electroplating tank, and then fix the electroplated alloy plates on the supporting mechanism at equal intervals, and the alloy plates are between the corresponding two spraying mechanisms;

[0015] S2, by controlling the spraying mechanisms on both sides of the alloy plate to move up and down, the two spraying mechanisms spray gas to remove dust and fine attachments on the electroplating surface of the alloy plate;

[0016] S3, the lifting mechanism drives the supporting mechanism to move downward, so that the multiple alloy plates on the supporting mechanism are completely immersed in the electroplating liquid in the electroplating tank, and the spraying mechanisms on both sides of the alloy plates move up and down and spray gas to stir the electroplating liquid in the electroplating tank;

[0017] S4, after the electroplating is completed, the lifting mechanism drives the supporting mechanism and multiple alloy plates to move upward. When the supporting mechanism moves to the initial position of S, the spraying mechanisms on both sides of the alloy plates move up and down and spray gas to the alloy plates, which can accelerate the drying of the electroplated surface of the alloy plates.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention can clean the electroplating surface of the alloy plate by the spray mechanism before electroplating, and will not cause dirt to adhere to the electroplating surface of the alloy plate and affect the electroplating effect, thereby ensuring that the electroplating surface of the alloy plate can be electroplated evenly without defects;

[0020] 2. The spray mechanism can also stir the plating solution during electroplating, so that the plating solution at each level in the plating tank is in a uniform state, thereby improving the effect of electroplating;

[0021] 3. After the electroplating is completed, the electroplated surface of the alloy sheet can be blown by the spraying mechanism to accelerate the drying of the electroplated surface of the alloy sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of an alloy surface electroplating device proposed by the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of another aspect of an alloy surface electroplating device proposed by the present invention;

[0024] Figure 3 A partial cross-sectional view of an alloy surface electroplating device proposed by the present invention;

[0025] Figure 4 This is a schematic structural diagram of a liquid replenishing mechanism in an alloy surface electroplating device proposed by the present invention;

[0026] Figure 5 A cross-sectional view of a vibration mechanism in an alloy surface electroplating device proposed by the present invention;

[0027] Figure 6 This is a structural schematic diagram of a supporting mechanism and multiple spraying mechanisms in an alloy surface electroplating device proposed by the present invention;

[0028] Figure 7 for Figure 6 A schematic diagram of the enlarged structure of part A;

[0029] Figure 8 A cross-sectional view of a spray mechanism in an alloy surface electroplating device proposed by the present invention Figure 1 ;

[0030] Fig. 9 A cross-sectional view of a spray mechanism in an alloy surface electroplating device proposed by the present invention Figure 2 .

[0031] In the figure: 1. electroplating tank; 11. heating rod; 12. drain pipe; 2. liquid replenishing mechanism; 21. liquid storage tank; 22. water pump; 23. catheter 1; 24. overflow pipe; 3. lifting mechanism; 31. bracket; 32. sliding hole; 33. guide rod; 34. mounting seat; 35. telescopic rod; 4. supporting mechanism; 41. connecting rod; 42. mounting frame 1; 43. mounting frame 2; 44. fixing seat; 5. vibration mechanism; 51. protection box; 52. ultrasonic generator; 53. electroacoustic transducer; 54. wiring; 6. injection mechanism; 61. electric linear module; 62. gathering cover; 63. round tube; 64. injection hole; 65. transfer cover; 66. catheter 2; 67. catheter 3. DETAILED DESCRIPTION

[0032] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Please refer to Figure 1-Figure 9The present invention provides a technical solution: an electroplating device for an alloy surface, comprising an electroplating tank 1 with an opening at the top, a liquid replenishing mechanism 2 for replenishing the plating solution in the electroplating tank 1 and preventing the plating solution in the electroplating tank 1 from overflowing, a lifting mechanism 3 is fixedly installed on the top of one side of the electroplating tank 1, a supporting mechanism 4 for supporting an alloy plate and having an adjustable position and height is installed on the lifting mechanism 3, a plurality of spray mechanisms 6 are installed on the supporting mechanism 4, two adjacent spray mechanisms 6 are distributed in a mirror image, the spray mechanism 6 can clean the outer side of the alloy plate before electroplating, the spray mechanism 6 will also stir the plating solution in the electroplating tank 1 during electroplating, and the spray mechanism 6 can also dry the outer side of the alloy plate after the alloy plate is electroplated.

[0034] A vibration mechanism 5 is provided on the electroplating tank 1, and the vibration mechanism 5 includes a protection box 51 fixed on the inner wall of the bottom of the electroplating tank 1 and an ultrasonic generator 52 located outside the electroplating tank 1, and a wiring harness 54 is connected to the ultrasonic generator 52. A plurality of electroacoustic transducers 53 distributed in a matrix are fixedly installed on the inner wall of the bottom of the protection box 51, and the bottom ends of the plurality of electroacoustic transducers 53 extend to the outside of the electroplating tank 1 and are connected to the wiring harness 54. Two heating rods 11 are fixedly installed on the inner wall of one side of the electroplating tank 1 close to the rehydration mechanism 2.

[0035] Furthermore, ultrasonic waves are generated by an ultrasonic generator 52, and then transmitted to multiple electroacoustic transducers 53 through the wiring 54. The multiple electroacoustic transducers 53 convert the ultrasonic waves into kinetic energy to cause the protection box 51 to generate high-frequency vibrations and transmit the vibrations to the plating liquid in the plating tank 1, so that the plating liquid in the plating tank 1 is more uniform, and the two heating rods 11 can heat the plating liquid in the plating tank 1 to improve the electroplating effect of the alloy plate.

[0036] The replenishing mechanism 2 includes a liquid storage tank 21 and a water pump 22. The liquid storage tank 21 and the water pump 22 are both provided with a liquid inlet and a liquid outlet. The liquid outlet of the liquid storage tank 21 is connected to the liquid inlet of the water pump 22. The liquid outlet of the water pump 22 is connected to a conduit 23 having one end extending into the electroplating tank 1. The liquid inlet of the liquid storage tank 21 is connected to an overflow pipe 24 having one end extending into the electroplating tank 1. The overflow pipe 24 is located above the conduit 23. A drain pipe 12 is also provided on one side of the electroplating tank 1. The bottom of the drain pipe 12 is flush with the bottom inner wall of the electroplating tank 1.

[0037] Furthermore, the plating liquid in the liquid storage tank 21 is pumped into the plating tank 1 through the conduit 23 by the water pump 22, ensuring that the liquid level of the plating liquid in the plating tank 1 will not be lower than the specified height. When there is too much plating liquid in the plating tank 1, the excess plating liquid will flow into the overflow pipe 24 and re-enter the liquid storage tank 21, thereby avoiding the plating liquid from overflowing from the plating tank 1. The plating liquid in the plating tank 1 can be completely drained through the drain pipe 12, thereby facilitating the overall cleaning of the interior of the plating tank 1.

[0038] The lifting mechanism 3 includes a bracket 31 fixed on the top of the electroplating tank 1, and two sliding holes 32 are provided on the bracket 31. Two guide rods 33 are fixedly installed on the side of the bracket 31 away from the opening of the electroplating tank 1. The two guide rods 33 are slidingly sleeved with the same mounting seat 34. The lifting mechanism 3 also includes two telescopic rods 35 fixed on the outside of the electroplating tank 1. The top ends of the piston rods on the two telescopic rods 35 are fixedly connected to the mounting seat 34. The up and down movement path of the mounting seat 34 is controlled by the two guide rods 33, which can ensure that the up and down movement of the entire supporting mechanism 4 is smoother.

[0039] The supporting mechanism 4 includes two connecting rods 41 that pass through the two sliding holes 32 and are slidably connected to the inner walls of the two sliding holes 32. The connecting rods 41 are L-shaped. The top ends of the two connecting rods 41 are fixedly connected to the mounting seats 34. The two mounting seats 34 are fixedly installed with a vertically arranged mounting frame 1 42 on one side close to each other. The bottom ends of the two connecting rods 41 are fixedly installed with the same horizontally arranged mounting frame 2 43. The mounting frame 1 42 is fixedly connected to the mounting frame 2 43, and the mounting frame 1 42 and the mounting frame 2 43 are both hollow. A plurality of linearly distributed fixing seats 44 are fixedly installed on the top of the mounting frame 2 43.

[0040] Furthermore, the bottom of the alloy plate can be fixed by the fixing seat 44 while keeping the alloy plate in a vertical state, and the hollow mounting frame 1 42 and mounting frame 2 43 will not affect the contact between the electroplating solution and the alloy plate, and the mounting seat 34 can be driven to rise and move downward by controlling the extension and retraction of the two telescopic rods 35, and the mounting seat 34 can drive the mounting frame 1 42 and mounting frame 2 43 to move upward through the two connecting rods 41, thereby controlling the operation of immersing the alloy plate to be electroplated in the electroplating solution and taking the electroplated alloy plate out of the electroplating solution.

[0041] The injection mechanism 6 includes an electric linear module 61 fixed on a mounting frame 42, and a collecting hood 62 with an opening on one side is fixedly installed on the slide of the electric linear module 61. The opening of the collecting hood 62 is parallel to the alloy plate fixed on the fixed seat 44, and there is a gap between the collecting hood 62 and the alloy plate on the fixed seat 44. The same circular tube 63 is fixedly installed on the inner walls on both sides of the electric linear module 61, and a plurality of injection holes 64 are opened on the circular tube 63 in a linear distribution, and the plurality of injection holes 64 are all vertically facing the alloy plate on the fixed seat 44.

[0042] A transfer cover 65 with an opening on one side is fixedly installed on the side of the gathering cover 62 away from the circular tube 63. The transfer cover 65 is connected to the gathering cover 62. A conduit 2 66 and a conduit 3 67 are fixedly installed through the transfer cover 65. The conduit 2 66 is connected to the transfer cover 65. The bottom end of the conduit 3 67 extends into the circular tube 63 and is connected to the inside of the circular tube 63.

[0043] Further, the top ends of the plurality of conduits 2 66 are connected in series and connected to the same gas source 1, the top ends of the plurality of conduits 3 67 are connected in series and connected to the same gas source 2, and the plurality of electric linear modules 61 are synchronously controlled, and the electric linear modules 61 can drive the gathering hood 62 to move upward;

[0044] When cleaning the electroplated surface of the alloy sheet to be electroplated, the gas is pumped into the conduit 3 67 through the gas source 2, and the gas in the conduit 2 66 is extracted out through the gas source 1. The gas generated by the gas source 2 enters the circular tube 63 through the conduit 3 67 and is then ejected out through the plurality of ejection holes 64 and acts on the electroplated surface of the alloy sheet. The dust and some fluff on the electroplated surface of the alloy sheet can be swept off by the gas, thereby cleaning the electroplated surface of the alloy sheet. The gas in the conduit 2 66 is extracted out through the gas source 1, which makes the conduit 2 66 , the second conduit 66 then draws out the gas in the transfer hood 65 and the gathering hood 62, so that a negative pressure is formed inside the gathering hood 62. Therefore, the dust swept from the alloy plate will be gathered in the gathering hood 62 and finally enter the second conduit 66 to be discharged, so that dust will not fly around when cleaning the alloy plate, and at the same time, the cleanliness of the electroplating liquid in the electroplating tank 1 below is also guaranteed. The gathering hood 62 and the round tube 63 are driven up and down by the electric linear module 61, so as to complete the cleaning of the entire electroplating surface of the alloy plate;

[0045] When electroplating the electroplated surface of the alloy plate to be electroplated, gas is pumped into the conduit 3 67 through the gas source 2, and gas is pumped into the conduit 2 66 through the gas source 1. The gas generated by the gas source 2 enters the circular tube 63 through the conduit 3 67 and is then ejected from the plurality of ejection holes 64. The gas generated by the gas source 1 is then ejected from the conduit 2 66, and the electric linear module 61 drives the gathering hood 62 and the circular tube 63 to move up and down. The gas ejected through the ejection holes 64 and the conduit 2 66 can complete the stirring of the plating solution in the plating tank 1, making the plating solution in the plating tank 1 more uniform, and can also prevent the plating solution from entering the circular tube 63, the conduit 2 66 and the conduit 3 67.

[0046] When the electroplating is completed, the electroplating steps are the same as those for the electroplated surface of the alloy plate to be electroplated, the difference being that the gas pressure generated by gas source one and gas source two is smaller, thereby driving the gathering hood 62 and the gathering hood 62 to move up and down through the electric linear module 61, and the gas ejected from the multiple injection holes 64 can accelerate the drying of the electroplated surface of the alloy plate.

[0047] The opening of the gathering hood 62 is wide.

[0048] An alloy surface electroplating process, applicable to the above-mentioned alloy surface electroplating equipment, is characterized in that it includes the following steps:

[0049] S1, first adjust the height of the supporting mechanism 4 through the lifting mechanism 3, so that the bottom of the supporting mechanism 4 is flush with the top of the electroplating tank 1, and then fix the alloy plates with electroplating on the supporting mechanism 4 at equal intervals, and the alloy plates are between the corresponding two spraying mechanisms 6;

[0050] S2, by controlling the spraying mechanisms 6 on both sides of the alloy plate to move up and down, the two spraying mechanisms 6 spray gas to remove dust and fine attachments on the electroplating surface of the alloy plate;

[0051] S3, the lifting mechanism 3 drives the supporting mechanism 4 to move downward, so that the multiple alloy plates on the supporting mechanism 4 are completely immersed in the electroplating liquid in the electroplating tank 1, and the spraying mechanisms 6 on both sides of the alloy plates move up and down and spray gas to stir the electroplating liquid in the electroplating tank 1;

[0052] S4, after the electroplating is completed, the lifting mechanism 3 drives the supporting mechanism 4 and multiple alloy plates to move upward. When the supporting mechanism 4 moves to the initial position of S1, the spraying mechanism 6 on both sides of the alloy plate moves up and down and sprays gas to the alloy plate, which can accelerate the drying of the electroplated surface of the alloy plate.

[0053] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An electroplating device for alloy surface, comprising an electroplating tank (1) with an opening at the top, characterized in that: One side of the electroplating tank (1) is provided with a replenishing mechanism (2) for replenishing the electroplating solution in the electroplating tank (1) and preventing the electroplating solution in the electroplating tank (1) from overflowing; a lifting mechanism (3) is fixedly installed on the top of one side of the electroplating tank (1); a supporting mechanism (4) for supporting the alloy plate and having an adjustable position and height is installed on the lifting mechanism (3); a plurality of spraying mechanisms (6) are installed on the supporting mechanism (4); two adjacent spraying mechanisms (6) are distributed in a mirror image; the spraying mechanisms (6) can clean the outer side of the alloy plate before electroplating; the spraying mechanisms (6) can also stir the electroplating solution in the electroplating tank (1) during electroplating; and after the alloy plate is electroplated, the spraying mechanisms (6) can also dry the outer side of the alloy plate; The lifting mechanism (3) comprises a bracket (31) fixed on the top of the electroplating tank (1), the bracket (31) is provided with two sliding holes (32), two guide rods (33) are fixedly installed on the side of the bracket (31) away from the opening of the electroplating tank (1), and the two guide rods (33) are slidably sleeved with the same mounting seat (34), and the lifting mechanism (3) also comprises two telescopic rods (35) fixed on the outside of the electroplating tank (1), and the top ends of the piston rods on the two telescopic rods (35) are fixedly connected to the mounting seat (34); The supporting mechanism (4) comprises two connecting rods (41) penetrating through the two sliding holes (32) and slidably connected to the inner walls of the two sliding holes (32), the connecting rods (41) are L-shaped, the top ends of the two connecting rods (41) are fixedly connected to the mounting seats (34), the two mounting seats (34) are fixedly installed with a vertically arranged mounting frame 1 (42) on the side close to each other, the bottom ends of the two connecting rods (41) are fixedly installed with a horizontally arranged mounting frame 2 (43), the mounting frame 1 (42) is fixedly connected to the mounting frame 2 (43), and the mounting frame 1 (42) and the mounting frame 2 (43) are both hollow, and the top of the mounting frame 2 (43) is fixedly installed with a plurality of linearly distributed fixing seats (44); The injection mechanism (6) comprises an electric linear module (61) fixed on a mounting frame (42); a collecting cover (62) with an opening on one side is fixedly installed on the slide of the electric linear module (61); the opening of the collecting cover (62) is parallel to the alloy plate fixed on the fixed seat (44); and there is a gap between the collecting cover (62) and the alloy plate on the fixed seat (44); the same circular tube (63) is fixedly installed on the inner walls of both sides of the electric linear module (61); a plurality of injection holes (64) distributed linearly are opened on the circular tube (63); and the plurality of injection holes (64) are all perpendicular to the alloy plate on the fixed seat (44); A transfer cover (65) with an opening on one side is fixedly installed on the side of the gathering cover (62) away from the circular tube (63), and the transfer cover (65) is connected to the gathering cover (62). A second conduit (66) and a third conduit (67) are fixedly installed through the transfer cover (65), and the second conduit (66) is connected to the transfer cover (65). The bottom end of the third conduit (67) extends into the circular tube (63) and is connected to the inside of the circular tube (63); The opening of the gathering cover (62) is wide-mouthed.

2. The electroplating equipment for alloy surface according to claim 1, characterized in that: The electroplating tank (1) is provided with a vibration mechanism (5), the vibration mechanism (5) comprising a protection box (51) fixed on the inner wall of the bottom of the electroplating tank (1) and an ultrasonic generator (52) located outside the electroplating tank (1), the ultrasonic generator (52) being connected to a wiring harness (54), a plurality of electroacoustic transducers (53) distributed in a matrix are fixedly mounted on the inner wall of the bottom of the protection box (51), the bottom ends of the plurality of electroacoustic transducers (53) all extend outside the electroplating tank (1) and are connected to the wiring harness (54), and two heating rods (11) are fixedly mounted on the inner wall of one side of the electroplating tank (1) close to the refilling mechanism (2).

3. The electroplating equipment for alloy surface according to claim 1, characterized in that: The liquid replenishing mechanism (2) comprises a liquid storage tank (21) and a water pump (22), wherein the liquid storage tank (21) and the water pump (22) are both provided with a liquid inlet and a liquid outlet, wherein the liquid outlet of the liquid storage tank (21) is connected to the liquid inlet of the water pump (22), wherein the liquid outlet of the water pump (22) is connected to a conduit (23) having one end extending into the electroplating tank (1), wherein the liquid inlet of the liquid storage tank (21) is connected to an overflow pipe (24) having one end extending into the electroplating tank (1), wherein the overflow pipe (24) is located above the conduit (23), and a liquid discharge pipe (12) is further provided on one side of the electroplating tank (1), wherein the bottom of the liquid discharge pipe (12) is flush with the bottom inner wall of the electroplating tank (1).

4. An alloy surface electroplating process, applicable to an alloy surface electroplating device in claim 1, characterized in that: The following steps are involved: S1, firstly adjusting the height of the supporting mechanism (4) by means of the lifting mechanism (3) so that the bottom of the supporting mechanism (4) is flush with the top of the electroplating tank (1), and then fixing the alloy plates to be electroplated on the supporting mechanism (4) at equal intervals, and the alloy plates are located between the corresponding two spraying mechanisms (6); S2, by controlling the spraying mechanisms (6) on both sides of the alloy plate to move up and down, the two spraying mechanisms (6) spray gas to remove dust and fine attachments on the electroplating surface of the alloy plate; S3, the lifting mechanism (3) drives the supporting mechanism (4) to move downward, so that the multiple alloy plates on the supporting mechanism (4) are completely immersed in the electroplating liquid in the electroplating tank (1), and at this time, the spraying mechanisms (6) on both sides of the alloy plates move up and down and spray gas to stir the electroplating liquid in the electroplating tank (1); S4, after the electroplating is completed, the lifting mechanism (3) drives the supporting mechanism (4) and the plurality of alloy plates to move upwards. When the supporting mechanism (4) moves to the initial position of S1, the spraying mechanisms (6) on both sides of the alloy plates move up and down and spray gas toward the alloy plates, thereby accelerating the drying of the electroplated surface of the alloy plates.

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