Variable frequency device, compressor and heating and cooling device

Abstract

The application discloses a variable frequency device, a compressor and a heating and ventilation device, and relates to the technical field of variable frequency devices, and discloses the variable frequency device, which comprises a shell, a containing cavity is arranged on the shell, the containing cavity is configured to contain electronic devices, the containing cavity comprises a first cavity and a second cavity, a first radiator is arranged in the first cavity and is configured to reduce the temperature in the first cavity through gas circulation, and a second radiator is configured to dissipate heat for the electronic devices in the second cavity and the electronic components in the first cavity through heat conduction. According to the variable frequency device, the first radiator and the second radiator can be used to dissipate heat for the electronic devices in the first cavity, and the heat dissipation effect and efficiency of the electronic devices in the first cavity can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of frequency converter technology, and particularly to a frequency converter device, a compressor including the frequency converter device, and a heating, ventilation, and air conditioning system including the frequency converter device. Background Technology

[0002] Variable frequency drive (VFD) control cabinets, or VFDs for short, are widely used in various medium-voltage motor equipment such as pumps, fans, compressors, rolling mills, injection molding machines, and belt conveyors in industries such as metallurgy, chemical, petroleum, water supply, mining, building materials, and motors.

[0003] A frequency converter cabinet contains frequency converter cabinet power components, frequency converter cabinet control components, and frequency converter cabinet control components. When the frequency converter cabinet is working, these components will generate heat. If this heat cannot be effectively dissipated, it will directly affect the working environment of these components and thus affect their service life.

[0004] Furthermore, in related technologies, the air outlet of the frequency converter cabinet is usually located at the top or upper front wall of the cabinet. When the frequency converter cabinet is placed inside an air compressor, if the air outlet is located at the top of the cabinet, the hot air exiting the outlet will still be drawn into the air compressor because the outlet is very close to the compressor's inlet. This will cause the internal temperature of the air compressor to become too high, affecting its performance and stability. If the air outlet is located on the upper front wall of the cabinet, the hot air exiting the outlet must use a filter grille with a certain level of protection, causing the air to be discharged diagonally downwards. Therefore, the hot air exiting the outlet will still be drawn into the air inlet located at the lower front wall, causing the internal temperature of the frequency converter cabinet to become too high, affecting its performance and stability. Summary of the Invention

[0005] One object of the present invention is to provide a frequency conversion device that can use a first heat sink and a second heat sink to dissipate heat from electronic components in a first cavity, thereby effectively improving the heat dissipation effect and efficiency of electronic components in the first cavity.

[0006] Another object of the present invention is to provide a compressor that includes the aforementioned variable frequency device.

[0007] One object of the present invention is to provide a heating, ventilation and air conditioning (HVAC) device, which includes the aforementioned compressor or frequency converter.

[0008] According to an embodiment of the present invention, a frequency converter includes: a housing having a receiving cavity configured to house electronic components, the receiving cavity including a first cavity and a second cavity; a first heat sink disposed in the first cavity and configured to reduce the temperature in the first cavity by means of gas flow; and a second heat sink configured to dissipate heat for the electronic components in the second cavity and the electronic components in the first cavity by means of heat conduction.

[0009] According to the frequency converter of the present invention, the first heat sink and the second heat sink can be used to dissipate heat from the electronic components in the first cavity, which can effectively improve the heat dissipation effect and efficiency of the electronic components in the first cavity.

[0010] In addition, the frequency converter according to the above embodiments of the present invention may also have the following additional technical features:

[0011] Optionally, the electronic device includes a first electronic device and a second electronic device, wherein the first electronic device is disposed in the...

[0012] The first cavity is described, the second electronic device is disposed in the second cavity, and the second heat sink cooperates with the first electronic device and the second electronic device for heat transfer, so as to utilize the second heat sink to provide heat transfer for the first electronic device and the second electronic device.

[0013] Device heat dissipation.

[0014] Optionally, the first electronic device and the second electronic device are stacked with the second heat sink for heat exchange.

[0015] Optionally, at least a portion of the second radiator is disposed within the accommodating cavity.

[0016] Optionally, the second heat sink is disposed within the first cavity; or, the second heat sink is disposed within the second cavity; or, a portion of the second heat sink is disposed within the first cavity, and another portion is disposed within the second cavity; or, ...

[0017] A portion of the second heat sink is disposed within at least one of the first cavity and the second cavity, and another portion is disposed outside the accommodating cavity.

[0018] Optionally, the second heat sink is disposed on the back of the housing and corresponds to the positions of at least some electronic devices in the first cavity and at least some electronic devices in the second cavity.

[0019] 5. Optionally, the first radiator is an evaporator; and / or, the second radiator is a parallel flow radiator.

[0020] Optionally, the first cavity is configured as an annular cavity, and the airflow within the first cavity is adapted to circulate under the driving action of the airflow driving element to dissipate heat.

[0021] Optionally, the first cavity includes a first flow channel located at the bottom of the housing and configured to guide heat dissipation airflow from a first side of the housing to a second side, and the first heat sink is disposed in the first flow channel.

[0022] Optionally, the first cavity further includes a second flow channel located on a second side of the housing, guiding the...

[0023] The cooling airflow flows from the bottom of the housing to the top of the housing.

[0024] Optionally, the first cavity further includes a third flow channel disposed on the upper part of the housing, the third flow channel guiding the heat dissipation airflow from the second side of the housing to the first side.

[0025] Optionally, the first cavity further includes a fourth flow channel disposed on the first side, the fourth flow channel guiding the heat dissipation gas flow from the top of the housing to the bottom of the housing.

[0026] Optionally, the first cavity is configured as an annular shape extending along the peripheral wall of the housing within the housing.

[0027] Optionally, the first cavity is configured as a closed annular cavity, and the second cavity is spaced apart from the first cavity.

[0028] Optionally, the first cavity is disposed within the housing near the back plate of the housing.

[0029] Optionally, the frequency converter further includes a door body connected to the housing and configured to open and close the receiving cavity, wherein the door body closes the receiving cavity and seals the second cavity.

[0030] The compressor according to an embodiment of the present invention includes the aforementioned frequency converter.

[0031] The heating, ventilation, and air conditioning equipment according to embodiments of the present invention includes the aforementioned variable frequency device; or the aforementioned compressor. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0033] Figure 2 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0034] Figure 3 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0035] Figure 4 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0036] Figure 5 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0037] Figure 6 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0038] Figure 7 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0039] Figure 8 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0040] Figure 9 This is a schematic diagram of a frequency converter device according to an embodiment of the present invention.

[0041] Reference numerals: 100, frequency converter; 10, housing; 101, accommodating cavity; 102, first cavity; 1021, first flow channel; 1022, second flow channel; 1023, third flow channel; 1024, fourth flow channel; 103, second cavity; 11, first radiator; 12, second radiator; 121, first guide plate; 122, second guide plate; 13, junction box; 14, airflow drive component; 141, first fan; 142, second fan; 20, door; 31, circuit breaker; 32, reactor; 33, capacitor; 34, IGBT; 35, diode; 36, transformer; 37, contactor; A, first electronic component; B, second electronic component. Detailed Implementation

[0042] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0043] like Figure 1 According to an embodiment of the present invention, the frequency converter 100 includes: a housing 10, the housing 10 having a receiving cavity 101, the receiving cavity 101 being configured to receive electronic devices, the receiving cavity 101 including a first cavity 102, the first cavity 102 being configured to dissipate heat through gas flow, in other words, the heat on the electronic devices in the first cavity 102 can be carried away by the flow of air in the first cavity 102, thereby achieving the purpose of heat dissipation of the electronic devices.

[0044] A first heat sink 11 can be installed inside the first cavity 102. The first heat sink 11 can provide cooling. When the heat inside the first cavity 102 is reduced by airflow, the first heat sink 11 can remove heat from the airflow, effectively dissipating heat from the airflow and facilitating better heat dissipation between the airflow and the electronic components inside the first cavity 102, thus improving the heat exchange effect of the airflow inside the first cavity 102. Heat exchange between the first heat sink 11 and the electronic components inside the first cavity 102 is achieved through airflow, thereby reducing the temperature inside the first cavity 102.

[0045] Additionally, the accommodating cavity 101 may also include a second cavity 103, where the heat dissipation method for the electronic devices in the second cavity 103 may differ from that in the first cavity 102. For example, a second heat sink 12 corresponding to the second cavity 103 may be provided, and the second heat sink 12 may be configured to dissipate heat from the electronic devices in the second cavity 103 through heat conduction. This achieves heat dissipation for the electronic devices in the second cavity 103.

[0046] Furthermore, the second heat sink 12 is configured to dissipate heat from the electronic components in the second cavity 103 and the electronic components in the first cavity 102 through heat conduction. In other words, at least a portion of the electronic components in the first cavity 102 can be cooled by the combination of the first heat sink 11 and the second heat sink 12, which can effectively improve the heat dissipation efficiency and effect of the electronic components in the first cavity 102.

[0047] According to an embodiment of the present invention, the frequency converter 100 is provided with a first cavity 102 and a second cavity 103. The first cavity 102 can exchange heat by means of gas flow, and a first heat sink 11 is used to cool the temperature inside the first cavity 102, thereby reducing the temperature of the electronic components inside the first cavity 102. A second heat sink 12 can be used to reduce the temperature of the electronic components inside the second cavity 103. By employing different heat dissipation methods, targeted heat dissipation can be applied to different types of electronic components, reducing heat conduction between different electronic components and improving the operational stability of each electronic component. Simultaneously, the isolation between the first cavity 102 and the second cavity 103 can reduce interference between different electronic components, improving the stability of the frequency converter 100 and reducing the failure rate. Furthermore, the use of the first heat sink 11 and the second heat sink 12 to dissipate heat from the electronic components inside the first cavity 102 effectively improves the heat dissipation effect and efficiency.

[0048] In addition, to facilitate airflow within the first cavity 102, the housing 10 may further include an airflow drive 14. This airflow drive 14 can be configured to drive the airflow within the first cavity 102 to form a cooling airflow. The cooling airflow can flow through the electronic devices within the first cavity 102 and the first heat sink 11. When the airflow flows through the first heat sink 11, it can exchange heat in the airflow with the first heat sink 11 to reduce the temperature of the airflow and absorb the cold energy of the first heat exchanger for cooling the first cavity 102. When the airflow flows through the electronic devices within the first cavity 102, it can exchange the cold energy in the airflow with the electronic devices within the first cavity 102 and carry away the heat from the electronic devices within the first cavity 102, thereby achieving heat dissipation for the electronic devices within the first cavity 102. In other words, the heat of the electronic devices within the first cavity 102 is transferred to the first heat sink 11, achieving heat dissipation for the electronic devices within the first cavity 102.

[0049] like Figure 1 In some embodiments of the present invention, the electronic device includes a first electronic device A and a second electronic device B, wherein the first electronic device A is disposed in a first cavity 102 and the second electronic device B is disposed in a second cavity 103. A first heat sink 11 can be used to dissipate heat from the first electronic device A, and a second heat sink 12 can be used to dissipate heat from the second electronic device B.

[0050] Alternatively, the second heat sink 12 can be configured to cooperate with the heat transfer of the first electronic device A and the second electronic device B, so as to dissipate heat from the first electronic device A and the second electronic device B using the second heat sink 12. The combination of the first heat sink 11 and the second heat sink 12 can be used to dissipate heat from the first electronic device A, improving the heat dissipation efficiency and effect. Simultaneously, the condensation effect of the first heat sink 11 can be used to maintain the humidity environment within the first cavity 102. At the same time, the second heat sink 12 can also be used to dissipate heat from the second electronic device B, maintaining the operating temperature environment of the second electronic device B, thereby optimizing the performance of the frequency converter 100.

[0051] In this configuration, the first electronic device A and the second electronic device B are stacked with the second heat sink 12 for heat exchange. This stacking allows the cooling capacity of the second heat sink 12 to be quickly transferred to the second electronic device B, resulting in better heat dissipation compared to airflow cooling. Therefore, electronic devices with relatively high heat generation power in the frequency converter 100 can generally be cooled using the second heat sink 12, directly through heat conduction.

[0052] In addition, at least a portion of the second heat sink 12 is disposed within the accommodating cavity 101. This enables stable heat dissipation for electronic devices stacked or adjacent to the second heat sink 12; simultaneously, the second heat sink 12 can also reduce the temperature within the second cavity 103, thereby achieving the purpose of heat dissipation for other electronic devices within the second cavity 103.

[0053] The second heat sink 12 can be disposed in the first cavity 102. When the airflow flows along the second cavity 103, it can exchange heat with the second heat sink 12. Therefore, the airflow in the first cavity 102 can guide the heat of the first heat sink 11 and the second heat sink 12 to flow along the first cavity 102, thereby using the second heat sink 12 to dissipate heat from the electronic devices in the first cavity 102, effectively maintaining the ambient temperature in the first cavity 102 and optimizing the operational stability of the components in the first cavity 102.

[0054] Alternatively, the second heat sink 12 can be located inside the second cavity 103. In this case, some electronic components inside the second cavity 103 can be stacked on the second heat sink 12 to improve the efficiency and effectiveness of heat dissipation.

[0055] In addition, the second heat sink 12 can be partially located in the first cavity 102 and partially located in the second cavity 103. The part located in the first cavity 102 can dissipate heat from the airflow and exchange heat with the electronic devices in the first cavity 102 through heat conduction and other means. At the same time, it can also dissipate heat from the electronic devices in the first cavity 102, effectively improving the utilization rate of the second heat sink 12, avoiding the loss of cold energy on the second heat sink 12, and saving energy and protecting the environment.

[0056] In addition, a portion of the second radiator 12 is disposed within at least one of the first cavity 102 and the second cavity 103, and another portion is disposed outside the receiving cavity 101. This simplifies the installation of the second radiator 12, facilitates its connection to other pipelines (such as compressors), improves the efficiency of the assembly and maintenance of the frequency converter 100, reduces the failure rate of the frequency converter 100, and extends its service life.

[0057] Combination Figures 1 to 9 In some embodiments of the present invention, the second heat sink 12 is disposed on the back side of the housing 10 and corresponds to the positions of at least some electronic components in the first cavity 102 and at least some electronic components in the second cavity 103. Installing the second heat sink 12 within the receiving cavity 101 is relatively complex; therefore, in this invention, the second heat sink 12 can also be disposed on the back side of the housing 10 and correspond to the positions of at least some electronic components within the frequency converter 100. This not only facilitates the installation of the second heat sink 12 but also prevents condensate generated during the operation of the second heat sink 12 from flowing into the housing 10, thereby improving the operational stability of the frequency converter 100.

[0058] In some embodiments of the present invention, the first radiator 11 is an evaporator. The first radiator 11 can be combined with a compressor, condenser, etc., to achieve heat dissipation by utilizing the phase change of the refrigerant, thereby optimizing the heat dissipation efficiency and effect within the first cavity 102. In use, the first radiator 11 is disposed within the first cavity 102, and the airflow within the first cavity 102 can be used to transfer the cold energy on the first radiator 11 to other locations within the first cavity 102, thereby achieving heat dissipation for the electronic components within the first cavity 102, optimizing the operating environment of the electronic components within the first cavity 102, and improving the stability and service life of the frequency converter 100.

[0059] Alternatively, the second heat sink 12 can be a parallel flow heat sink. A parallel flow heat sink can have a higher cooling capacity, thereby enabling effective heat dissipation of the electronic components in the second cavity 103, maintaining the stable operation of the electronic components in the second cavity 103, improving the operational stability of the frequency converter 100, and reducing the failure rate.

[0060] In some embodiments of the present invention, the first cavity 102 is a closed chamber, which forms a closed flow channel within the housing 10. The combination of the airflow drive 14 and the first heat sink 11 can be used to dissipate heat from the electronic components within the first cavity 102. The second cavity 103 can be configured as an open space; for example, the space outside the first cavity 102 within the housing 10 can be designated as the second cavity 103. Since the second cavity 103 is an open space, it facilitates the installation and maintenance of the electronic components within it. Furthermore, a door 20 can be installed on the housing 10 to open and close the housing 10. Specifically, in some embodiments, the door 20 can be used to open and close the second cavity 103. When the door 20 is open, the second cavity 103 is open, which facilitates the installation and enclosure of electronic components inside the second cavity 103, and allows for easy inspection of the operating status of the frequency converter 100 through the electronic components inside the second cavity 103. At this time, the first cavity 102 is in a closed state, which does not affect the space inside the second cavity 103. The second cavity 103 can maintain a low humidity and low dust environment, and its heat dissipation effect and operational stability will be relatively high. When the door 20 is closed, the second cavity 103 is closed. At this time, a relatively closed environment will be formed inside the second cavity 103. Under the action of natural convection or other means, the temperature in various parts of the second cavity 103 can also be relatively uniform, and heat dissipation of electronic components inside the second cavity 103 can also be achieved to a certain extent.

[0061] In addition, in this invention, the second cavity 103 may not have an airflow drive structure such as a fan. In this way, the electronic devices in the second cavity 103 will operate under low noise, effectively reducing the noise of the frequency converter 100, and preventing the introduction of high humidity air or dusty airflow from the outside into the second cavity 103, thereby extending the service life of the electronic devices in the second cavity 103. Of course, the second cavity 103 may also have an airflow drive structure such as a fan. In this way, sufficient heat exchange can be achieved for the electronic devices in the second cavity 103, maintaining the temperature environment of the electronic devices in the second cavity 103, and improving the operational stability and service life of the electronic devices in the second cavity 103.

[0062] The first cavity 102 in this invention can be configured as a heat dissipation channel in the form of a straight line, a curve, or a broken line. Through the driving action of the airflow drive 14, the heat is carried away by the first heat sink 11. For example, the heat dissipation airflow can enter from one end of the first cavity 102 and flow out from the second end of the first cavity 102. Of course, this may have an adverse effect on the surrounding environment and may also cause dust-laden airflow from the external environment to enter the first cavity 102, affecting the operating environment inside the first cavity 102.

[0063] Furthermore, a first heat sink 11 is provided in this invention to remove heat from the first cavity 102. During the circulating flow of the cooling airflow within the first cavity 102, the first heat sink 11 can also remove heat from the electronic components in the second cavity 103. Therefore, to reduce the impact on the surrounding environment during heat dissipation, the first cavity 102 can be configured as an annular cavity, and the airflow within the first cavity 102 is adapted to circulate under the driving action of the airflow drive 14 for heat dissipation. Through airflow circulation, the temperature within the first cavity 102 can be effectively reduced, achieving heat dissipation for the electronic components within the first cavity 102, providing a better temperature environment for the operation of the electronic components within the first cavity 102. Simultaneously, it can reduce the impact of heat from the first cavity 102 on the surrounding environment, especially reducing the impact of heat from the first cavity 102 on the electronic components in the second cavity 103, thus improving the stability of the entire frequency converter 100. In addition, the first heat sink 11 also has a condensation function, enabling the regulation of humidity within the first cavity 102 and optimizing the humidity environment for the electronic components within the first cavity 102.

[0064] The first cavity 102 in this invention can be configured as a circular ring, an elliptical ring, a polygonal ring, or other irregularly shaped annular cavity. The first cavity 102 of a specific embodiment of this invention is described below with reference to the accompanying drawings.

[0065] like Figure 7In some embodiments of the present invention, the first cavity 102 may include a first flow channel 1021. The first flow channel 1021 is located at the bottom of the housing 10 and is configured to guide the heat dissipation airflow from a first side to a second side of the housing 10. Referring to the accompanying drawings, the first flow channel 1021 is located at the bottom of the housing 10 and extends from left to right to guide the heat dissipation airflow from the left side of the bottom of the housing 10 to the right side of the housing 10, thereby achieving heat dissipation at the bottom of the housing 10. Simultaneously, if condensation occurs in the first cavity 102, it will flow into the first flow channel 1021 and accumulate at the bottom of the first flow channel 1021, or be discharged through a guide structure provided in the first flow channel 1021.

[0066] During the airflow circulation process within the first cavity 102, the temperature at the location of the first radiator 11 is relatively low. Therefore, condensation is easily generated at the location of the first radiator 11, resulting in condensate. Therefore, in this invention, the first radiator 11 is placed within the first flow channel 1021. In this way, when condensation occurs on the first radiator 11, it can flow to the bottom of the housing 10 more quickly, avoiding the impact of condensate flowing within the first cavity 102 on other electronic components and improving the stability of the frequency converter 100.

[0067] In this invention, a discharge port is provided on the bottom wall of the first flow channel 1021. After condensation occurs in the first cavity 102, the condensation can be discharged through the discharge port, thereby achieving effective drainage of condensation in the first cavity 102 and improving the stability and safety of the electronic devices operating in the first cavity 102. In addition, the first cavity 102 in this invention can be configured as a closed flow channel. Since the internal space of the first cavity 102 is relatively closed, it is difficult for external dust-laden airflow, high-humidity airflow, etc. to enter the first cavity 102. The first heat sink 11 installed in the first cavity 102 can have a certain condensation capacity. Therefore, through the cooperation of the discharge port and the first heat sink 11, the humidity in the first cavity 102 can be effectively reduced, maintaining the stable operation of the components in the first cavity 102.

[0068] Of course, the bottom of the first cavity 102 of the present invention may not be provided with a drain port. When condensation is generated in the first cavity 102, the condensation can be stored in the first cavity 102. Due to the provision of the first radiator 11, the humidity in the first cavity 102 can be effectively reduced. The condensation stored at the bottom of the first cavity 102 can maintain the humidity in the first cavity 102 and prevent the humidity in the first cavity 102 from being too low.

[0069] like Figure 7 In some embodiments of the present invention, the first cavity 102 further includes a second flow channel 1022, which is located on the second side of the housing 10 and guides the heat dissipation airflow from the bottom of the housing 10 to the upper part of the housing 10. (See attached diagram) Figure 7The second flow channel 1022 is located on the right side of the housing 10 and extends vertically, with its lower end connected to the right end of the first flow channel 1021. The second flow channel 1022 can transport the cooling airflow from the first flow channel 1021 to the upper part of the housing 10, thereby dissipating heat from the electronic components on the upper part of the housing 10. Electronic components can be housed within the second flow channel 1022, which is then cooled by the cooling airflow passing through it. Alternatively, the second flow channel 1022 can be used solely as a channel for airflow transport. The second flow channel 1022 can be adjusted according to the actual usage.

[0070] When no electronic components are placed in the second flow channel 1022, some electronic components in the second cavity 103 can be placed close to the second flow channel 1022. This not only utilizes the cooling capacity within the second flow channel 1022 to dissipate heat from these electronic components but also further reduces mutual interference between them. Furthermore, when no electronic components are placed in the second flow channel 1022, the thickness of the second flow channel 1022 in the left-right direction can be set relatively small to optimize the space utilization of the frequency converter 100. For example, the thickness of the second flow channel 1022 in the left-right direction can be set smaller than the thickness of the first flow channel 1021 in the up-down direction. In conjunction with the following embodiments, the thickness of the second flow channel 1022 in the left-right direction can also be set smaller than the thickness of the third flow channel 1023 in the up-down direction, and the thickness of the second flow channel 1022 in the left-right direction can also be set smaller than the thickness of the fourth flow channel 1024 in the left-right direction.

[0071] like Figure 6 In some embodiments of the present invention, the flow channel wall of the first flow channel 1021 includes a first guide plate 121. The first guide plate 121 is disposed near the second flow channel 1022 and is inclined downward relative to the horizontal direction from the first side to the second side. Through the first guide plate 121, the airflow in the first flow channel 1021 can be guided to the first heat sink 11, so that the airflow can better exchange heat with the first heat sink 11, and so that the airflow can carry the cold air of the first heat sink 11 to other locations in the first cavity 102, thereby achieving heat dissipation for the electronic devices in the first cavity 102.

[0072] Due to the guiding effect of the first guide plate 121, the cross-sectional area of ​​the first flow channel 1021 is reduced, resulting in a relatively large air resistance. Therefore, in this invention, the flow channel wall of the second flow channel 1022 is configured to include the second guide plate 122. The second guide plate 122 is close to the first flow channel 1021, and the first and second guide plates are connected in a direction from the first side to the second side. Furthermore, in this direction, the second guide plate 122 is inclined upwards relative to the horizontal direction. The second guide plate increases the airflow area, thereby facilitating airflow and effectively reducing noise during airflow, improving the stability of the frequency converter 100, and achieving noise reduction in the frequency converter 100.

[0073] In addition, the first cavity 102 also includes a third flow channel 1023 disposed on the upper part of the housing 10, the third flow channel 1023 guiding the heat dissipation airflow from the second side to the first side of the housing 10. (See attached diagram) Figure 6 The third flow channel 1023 is located on the upper part of the housing 10 and extends in the left-right direction, with its right end connected to the upper end of the second flow channel 1022. The third flow channel 1023 facilitates the guidance of airflow. Located on the upper part of the housing 10, the cooled airflow can be guided by the aforementioned first and second flow channels 1021. Electronic devices can be housed within the third flow channel 1023. Because of its relatively high position, the third flow channel 1023 avoids the influence of condensation, thus allowing for the placement of electronic devices and improving their operational stability.

[0074] The third flow channel 1023 can house diodes 35. Multiple diodes 35 can be arranged in the third flow channel 1023, and the multiple diodes 35 can be arranged along the airflow direction. For example, multiple rows of diodes 35 can be arranged in the third flow channel 1023, and each row includes at least one diode 35. The multiple rows of diodes 35 are arranged sequentially at intervals along the airflow direction, and adjacent rows of diodes 35 can be arranged side by side or staggered.

[0075] Optionally, the first cavity 102 further includes a fourth flow channel 1024 disposed on the first side, the fourth flow channel 1024 guiding the heat dissipation airflow from the top of the housing 10 to the bottom of the housing 10. (See attached diagram) Figure 7The fourth flow channel 1024 can be located on the left side of the shell 10 and extends vertically. The upper end of the fourth flow channel 1024 is connected to the left end of the third flow channel 1023, and the lower end of the fourth flow channel 1024 is connected to the left end of the first flow channel 1021. Through the guiding effect of the fourth flow channel 1024, the airflow can be guided to the first flow channel 1021, so that the first flow channel 1021, the second flow channel 1022, the third flow channel 1023 and the fourth flow channel 1024 combine to form an annular heat exchange channel.

[0076] The fourth flow channel 1024 is located at the end of the circulation flow channel. At this time, the cooling capacity of the heat dissipation airflow is limited. Therefore, some electronic devices with low temperature requirements can be placed in the fourth flow channel 1024, or in other words, electronic devices with high operating temperatures can be placed in the fourth flow channel 1024.

[0077] Optionally, the first cavity 102 is configured as an annular structure extending along the peripheral wall of the housing 10 within the housing 10. In this case, the first cavity 102 can have a simpler structure and a larger coverage area. Moreover, the first cavity 102 does not truncate the second cavity 103, and the second cavity 103 can also have a larger space to place electronic devices. It can also facilitate the arrangement of electronic devices within the second cavity 103, thereby facilitating the maintenance and use of the frequency converter 100, optimizing the performance of the frequency converter 100, reducing the failure rate of the frequency converter 100, and improving stability.

[0078] Optionally, the first cavity 102 is configured as a closed annular cavity, and the second cavity 103 is separated from the first cavity 102. The closed configuration of the first cavity 102 facilitates the airflow drive 14 in driving the airflow, enabling sufficient heat exchange between the airflow and the first heat sink 11. This effectively improves the heat dissipation efficiency and effect on the airflow and electronic devices within the first cavity 102, and also prevents the heat from the electronic devices within the first cavity 102 from affecting the surrounding environment, and conversely, prevents the surrounding environment from affecting the electronic devices within the first cavity 102. Simultaneously, it reduces the impact of dust, water, and high-humidity air in the external environment on the stable operation of the electronic devices within the first cavity 102.

[0079] Optionally, the first cavity 102 is disposed within the housing 10 near the back plate of the housing 10. This facilitates the installation and maintenance of electronic components in the second cavity 103. Furthermore, in conjunction with the aforementioned embodiment, the first cavity 102 is a closed annular cavity. By placing the first cavity 102 near the back plate, the electronic components in the second cavity 103 can be installed after the first cavity 102 has been assembled. In this case, the first cavity 102 will not affect the installation of components in the second cavity 103, thereby improving the installation efficiency of electronic components within the frequency converter 100.

[0080] Optionally, the frequency converter 100 also includes a door 20, which is connected to the housing 10 and configured to open and close the accommodating cavity 101. When the door 20 closes the accommodating cavity 101, it covers the second cavity 103. The electronic components within the second cavity 103 can be wired, installed, maintained, and debugged by opening and closing the door 20. The door 20 facilitates the installation of electronic components and the use of the frequency converter 100.

[0081] Combination Figures 1 to 9 In some embodiments of the present invention, the accommodating cavity 101 is equipped with a circuit breaker 31, a reactor 32, a capacitor 33, an IGBT 34, and a diode 35. The circuit breaker 31, the reactor 32, the capacitor 33, the IGBT 34, and the diode 35 are electrically connected to realize the frequency conversion function. They can be connected to each other through metal busbars (such as copper busbars) to reduce the resistance of the frequency conversion equipment 100 during operation, reduce energy consumption, and save energy and protect the environment.

[0082] At least one of the circuit breaker 31, reactor 32, capacitor 33, IGBT 34, and diode 35 is disposed in the first cavity 102, and at least one is disposed in the second cavity 103. By disposing of these electronic devices in the first cavity 102 or the second cavity 103, effective heat dissipation of each electronic device can be achieved, thereby improving the efficiency and effectiveness of heat dissipation.

[0083] In conjunction with the foregoing, the first electronic device may include one or more of the following: circuit breaker 31, reactor 32, capacitor 33, IGBT 34, and diode 35; the second electronic device may also include one or more of the following: circuit breaker 31, reactor 32, capacitor 33, IGBT 34, and diode 35.

[0084] In addition, different heat dissipation methods can be provided according to different types of electronic devices. For example, the circuit breaker 31 generates relatively little heat during operation and can be placed in the second cavity 103 at a position relatively far from the second heat sink 12; the reactor 32 generates relatively high heat during operation and can be placed in the first cavity 102 for heat dissipation through gas flow; the capacitor 33 generates less heat than the reactor 32 during operation and can also be placed in the first cavity 102 for heat dissipation through gas flow. Furthermore, in the direction of the heat dissipation airflow, the first heat sink 11 and the capacitor 33... The inductor 32 and the reactor 32 are arranged in sequence to achieve good heat dissipation for all components. The IGBT 34 and diode 35 have relatively high operating temperatures. Placing them in the first cavity 102 may affect the heat dissipation effect of other components in the first cavity 102. Therefore, in this invention, it is preferred to place the IGBT 34 and diode 35 in the second cavity 103 and use the second heat sink 12 to dissipate heat from them. This not only improves the heat dissipation effect of the IGBT 34 and diode 35, but also avoids the heat generated by the IGBT 34 and diode 35 during operation from affecting the stable operation of other electronic devices.

[0085] The present invention provides a frequency converter 100, which has a first cavity 102 and a second cavity 103 and uses different methods for heat dissipation. Heat dissipation can be carried out according to the heat generation power of different components in the frequency converter 100. The components can reduce the mutual heat transfer between components, thus reducing the heat dissipation effect. In addition, it can also play a mobile isolation role and achieve the purpose of anti-interference.

[0086] Combination Figures 1 to 9The frequency converter 100 of the present invention includes a housing 10 and a door 20. The housing 10 has a receiving cavity 101, which can be opened and closed through the door 20. The receiving cavity 101 is divided into a first cavity 102 and a second cavity 103. The first cavity 102 is a closed annular cavity and is arranged along the peripheral wall of the housing 10. The first cavity 102 surrounds the second cavity 103. The first cavity 102 includes a first flow channel 1021, a second flow channel 1022, a third flow channel 1023 and a fourth flow channel 1024 connected in sequence. A first heat sink 11 is provided in the first flow channel 1021. A first fan 141 is provided between the first flow channel 1021 and the second flow channel 1022. A capacitor 33 is provided in the third flow channel 1023. A reactor 32 is provided in the fourth flow channel 1024. A second fan 142 is provided between the third flow channel 1023 and the fourth flow channel 1024. Driven by the first fan 141 and the second fan 142, the airflow can flow in a loop along the first flow channel 1021, the second flow channel 1022, the third flow channel 1023 and the fourth flow channel 1024. The airflow passes through the first heat sink 11, the first fan 141, the capacitor 33, the second fan 142 and the reactor 32 in sequence to achieve heat dissipation for electronic devices.

[0087] The second cavity 103 can house structures such as a circuit breaker 31, a diode 35, an IGBT 34, a transformer 36, a contactor 37, and an electronic control board. Since the IGBT and diode 35 operate at high temperatures, a second heat sink 12 is provided to dissipate heat from them. The second heat sink 12 can be stacked on the back of the housing 10. The IGBT 34 and diode 35 are arranged side-by-side and stacked on the back plate of the housing 10. The contactor 37 and transformer 36 are stacked on the back plate of the housing 10 and located below the IGBT 34.

[0088] Additionally, a junction box 13 is provided on the outside of the housing 10. The junction box 13 is located near the circuit breaker 31. The junction box 13, circuit breaker 31, reactor 32, diode 35, IGBT 34, transformer 36, contactor 37, etc. are electrically connected to form a frequency converter circuit (e.g., connected to form a frequency converter structure in related technologies).

[0089] Furthermore, the present invention also provides a compressor that may include the aforementioned frequency converter, which enables the compressor to change its frequency according to different operating conditions, thereby improving energy efficiency. Moreover, the use of the aforementioned frequency converter in this invention improves the stability and effectiveness of frequency conversion, allowing the compressor to operate stably, reducing the compressor's failure rate, and facilitating stable operation at a predetermined frequency, thus improving energy efficiency and promoting energy conservation and environmental protection.

[0090] This invention also provides a heating, ventilation, and air conditioning (HVAC) system, which may include the aforementioned variable frequency drive (VFD) device, or the aforementioned compressor. By incorporating the aforementioned VFD device, the operational stability of the HVAC system can be improved. Furthermore, the first and second radiators in the VFD device can utilize a refrigerant phase change method for heat dissipation. For example, the first and second radiators can be connected to the HVAC system's unit or compressor, thereby utilizing the compressor or similar device to dissipate heat from the electronic components within the VFD device, improving the stability of both the HVAC system and the VFD device. Additionally, it simplifies the structure of the HVAC system and optimizes its space utilization and stability.

[0091] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0092] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0093] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0095] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A frequency conversion device (100), characterized by, The application relates to a shell (10) provided with a containing cavity (101) configured to contain electronic devices, the containing cavity (101) comprising a first cavity (102) and a second cavity (103); a first heat sink (11) arranged in the first cavity (102) and configured to reduce the temperature in the first cavity (102) through gas circulation; a second heat sink (12) configured to dissipate heat for electronic devices in the second cavity (103) and electronic components in the first cavity (102) through heat conduction; the electronic devices comprise first electronic devices and second electronic devices, the first electronic devices are arranged in the first cavity (102), the second electronic devices are arranged in the second cavity (103), and the second heat sink (12) is in heat transfer cooperation with the first electronic devices and the second electronic devices to dissipate heat for the first electronic devices and the second electronic devices by using the second heat sink (12); at least part of the second heat sink (12) is arranged in the containing cavity (101), or the second heat sink (12) is arranged on the back of the shell (10). The first electronic devices and the second electronic devices are stacked with the second heat sink (12) to exchange heat. The second heat sink (12) is arranged in the first cavity (102), or the second heat sink (12) is arranged in the second cavity (103), or part of the second heat sink (12) is arranged in the first cavity (102) and the other part is arranged in the second cavity (103), or part of the second heat sink (12) is arranged in at least one of the first cavity (102) and the second cavity (103) and the other part is arranged outside the containing cavity (101). The second heat sink (12) is arranged on the back of the shell (10) and corresponds to the positions of at least part of the electronic devices in the first cavity (102) and at least part of the electronic devices in the second cavity (103). The first heat sink (11) is an evaporator, and / or the second heat sink (12) is a parallel flow heat sink. The first cavity (102) is configured as an annular cavity, and the air flow in the first cavity (102) is adapted to circulate and flow to dissipate heat under the driving action of an air flow driving member (14).

2. The frequency conversion device (100) of claim 1, wherein, The first cavity (102) comprises a first flow channel (1021) located at the bottom of the shell (10) and configured to guide the heat dissipation air flow to flow from the first side of the shell (10) to the second side, and the first heat sink (11) is arranged in the first flow channel (1021).

3. The frequency conversion device (100) of claim 1, wherein, The first cavity (102) further comprises a second flow channel (1022) located at the second side of the shell (10) and guiding the heat dissipation air flow to flow from the bottom of the shell (10) to the upper part of the shell (10).

4. The frequency conversion device (100) of claim 1, wherein, ​ 5. The frequency conversion device (100) of any of claims 1-4, wherein, ​ 6. The frequency conversion device (100) of any of claims 1-4, wherein, ​ 7. The frequency conversion device (100) of claim 6, wherein, ​ 8. The frequency conversion device (100) of claim 7, wherein, ​ 9. The frequency conversion device (100) of claim 8, wherein, The first cavity (102) further comprises a third flow channel (1023) disposed at an upper portion of the shell (10), the third flow channel (1023) guiding the heat dissipation airflow to flow from a second side of the shell (10) to the first side.

10. The frequency conversion device (100) of claim 9, wherein, The first cavity (102) further comprises a fourth flow channel (1024) disposed at the first side, the fourth flow channel (1024) guiding the heat dissipation airflow to flow from above the shell (10) to a bottom portion of the shell (10).

11. The frequency conversion device (100) of any one of claims 1-4, wherein, The first cavity (102) is configured to extend annularly within the shell (10) along a peripheral wall of the shell (10); And / or, the first cavity (102) is configured to be a closed annular cavity, and the second cavity (103) is mutually spaced apart from the first cavity (102); And / or, the first cavity (102) is disposed close to a back plate of the shell (10) within the shell (10).

12. The frequency conversion device (100) of any one of claims 1-4, wherein, The variable frequency device (100) further comprises: a door body (20) connected with the shell (10) and configured to open and close the accommodating cavity (101), the door body (20) closing the accommodating cavity (101) to enclose the second cavity (103).

13. A compressor characterized by, The variable frequency device according to any one of claims 1-12.

14. A heating and ventilation device, characterized in that The variable frequency device according to any one of claims 1-12; or the compressor according to claim 13.

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