Mini LED coated glass and its preparation method and application

Abstract

The present application relates to the field of backlight display technology, and in particular to a Mini LED coated glass and its preparation method and application. The Mini LED coated glass comprises a glass substrate, a first metal film layer, a second metal film layer and a conductive layer stacked in sequence; wherein the material of the first metal film layer comprises metal molybdenum, the material of the second metal film layer comprises tin-lead alloy, and the material of the conductive layer comprises metal copper. The present application can reduce the influence of thick copper stress on adhesion and substrate warping, improve the adhesion of the film layer and reduce the square resistance.

Description

Technical Field

[0001] The present application relates to the field of backlight display technology, and in particular to a Mini LED coated glass and a preparation method and application thereof. Background Art

[0002] Mini LED refers to LED chips with a size of 100-300μm, with a chip pitch between 0.1-1mm, and a micro LED device module in the form of SMD, COB or IMD packaging. Mini LED is often used in RGB display or LCD backlight. Compared with OLED's main advantages such as contrast and color, the performance of Mini LED backlight products is not inferior, and it also has the characteristics of low cost and wide application. At the same time, it has the important advantage of long service life (especially suitable for TV scenes). Mini LED technology essentially adds more backlight partitions to the LCD screen, dividing the screen backlight area into dozens, hundreds or even thousands of areas, allowing each area to be controlled separately, so as to achieve a high contrast ratio that makes the dark part darker and the bright part brighter.

[0003] Traditional Mini LEDs have small pitches, and the width of the conductive circuit will also become smaller. In order to improve the current carrying capacity of the conductive film, copper metal is usually used as the sputtering target. Glass-based copper plating has the advantages of good conductivity and low price. Depositing thick copper on the surface of the glass substrate by vacuum coating has become a very critical preparation process. At this stage, glass-based copper plating generally uses medium-frequency or DC sputtering of silicon dioxide or metal titanium as a base layer, and then DC sputtering of copper film on the base layer. Due to the poor compatibility and bonding between the materials and the small contact area between the film layers, the copper film thickness can generally only be 1μm. The film layer with a thickness exceeding this will have poor adhesion, film cracking and shedding, and the thick copper process cannot be formed, which limits the circuit design and application of MiniLED. Summary of the invention

[0004] In view of the above-mentioned defects of the traditional method, the purpose of this application is to provide a Mini LED coated glass and its preparation method and application.

[0005] In a first aspect, the present application provides a Mini LED coated glass, comprising a glass substrate, a first metal film layer, a second metal film layer and a conductive layer stacked in sequence; wherein the material of the first metal film layer includes metal molybdenum, the material of the second metal film layer includes tin-lead alloy, and the material of the conductive layer includes metal copper.

[0006] Optionally, the glass substrate includes high aluminum glass, soda-lime glass or silicate glass.

[0007] Optionally, the glass substrate has a thickness of 0.2-1.1 mm.

[0008] Optionally, the thickness of the first metal film layer is 80-200 nm.

[0009] Furthermore, the thickness of the first metal film layer is 90-160 nm.

[0010] Optionally, the thickness of the second metal film layer is 120-300 nm.

[0011] Furthermore, the thickness of the second metal film layer is 130-220 nm.

[0012] Optionally, in the tin-lead alloy, the mass content of tin is 60-95%.

[0013] Furthermore, in the tin-lead alloy, the mass content of tin is 70-95%.

[0014] Optionally, the conductive layer has a thickness of 1-10 μm.

[0015] Furthermore, the thickness of the conductive layer is 6-7 μm.

[0016] In a second aspect, the present application provides a method for preparing Mini LED coated glass, comprising the following steps:

[0017] Depositing a first metal material including metal molybdenum on a glass substrate through a first coating process to form a first metal film layer;

[0018] depositing a second metal material including a tin-lead alloy onto the surface of the first metal film layer by a second plating process to form a second metal film layer;

[0019] A conductive metal including copper is deposited on the surface of the second metal film layer through a third plating process to form a conductive layer.

[0020] Optionally, the first coating process includes multi-arc ion plating, and the conditions of the multi-arc ion plating include: coating vacuum degree is 0.1-0.5Pa, speed is 0.5-1.5m / min, current is 50-60A, and voltage is 80-130V.

[0021] Optionally, the second coating process includes first DC power sputtering, and the conditions of the first DC power sputtering include: coating vacuum degree 0.1-0.35Pa, speed 0.5-1.5m / min, current 20-30A, voltage 360-450V.

[0022] Optionally, the third coating process includes second DC power sputtering, and the conditions of the second DC power sputtering include: coating vacuum degree 0.1-0.4Pa, speed 0.5-1.5m / min, current 45-60A, voltage 440-520V.

[0023] In a third aspect, the present application provides an application of the Mini LED coated glass in the preparation of Mini LED.

[0024] In the Mini LED coated glass provided by the present application, different coating materials are stacked on the surface of the glass substrate to solve the problem of high stress in thick copper. Specifically, metal molybdenum is used in the first layer of coating next to the glass substrate to improve the adhesion with the glass substrate and the second layer of coating (stress release layer); the second layer of coating away from the glass substrate uses a tin-lead alloy material, which has low hardness, ductility, and good compatibility with materials. It can be bonded with the molybdenum of the first layer of coating and the copper of the third layer (conductive layer), and the adhesion between the film layers is good. At the same time, the tin-lead alloy can release the film stress of the third layer of thick copper, reducing the warping of the glass-based product after coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the structure of Mini LED coated glass according to one embodiment of the present application.

[0026] Description of Reference Numerals

[0027] 100: Mini LED coated glass; 1: Glass substrate; 2: First metal film layer; 3: Second metal film layer; 4: Conductive layer. DETAILED DESCRIPTION

[0028] For ease of understanding of the present invention, the present application will be described in more detail below. The preferred embodiments of the present application are described below. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0030] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] At present, glass-based copper plating generally uses medium-frequency or direct-current sputtering of silicon dioxide or titanium as a base layer, and then direct-current sputtering of a copper film on the base layer. Due to the poor compatibility and bonding between the materials, the small contact area between the film layers, and the absence of a stress release layer, the copper film thickness can generally only be 1μm. If the thickness exceeds this, the adhesion of the film layer will deteriorate, and the thick copper process cannot be used for film formation, which limits the design and application of Mini LED circuits. Accordingly, the present application has developed a combination of different materials and a film layer structure design to enhance the bonding between the film layer and the substrate, and between the film layers, and to add a stress release layer with a softer material and better bonding compatibility, which can reduce the effect of thick copper stress on adhesion and substrate warping. Specifically, the present application provides a MiniLED coated glass, a preparation method, and an application thereof.

[0032] like Figure 1 As shown, the present application provides a Mini LED coated glass 100, comprising a glass substrate 1, a first metal film layer 2, a second metal film layer 3 and a conductive layer 4 stacked in sequence.

[0033] In the present application, the glass substrate 1 can be selected with reference to that used in existing Mini LEDs, and the present application does not specifically limit this. In some embodiments, the glass substrate 1 includes high aluminum glass, soda-lime glass, or silicate glass.

[0034] In some embodiments, the glass substrate 1 has a thickness of 0.2-1.1 mm. For example, the glass substrate 1 has a thickness of 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm or 1.1 mm.

[0035] In the present application, the material of the first metal film layer 2 includes metal molybdenum, which increases the adhesion between the glass substrate 1 and the second metal film layer 3. In some embodiments, the thickness of the first metal film layer 2 is 80-200nm. For example, the thickness of the first metal film layer 2 is 80nm, 85nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, 125nm, 130nm, 140nm, 150nm, 160nm, 170nm, 175nm, 180nm, 185nm, 190nm, 195nm or 200nm.

[0036] Preferably, the thickness of the first metal film layer 2 is 90-160 nm, which can improve the molybdenum etching efficiency while having a higher bonding force and ensure the etching effect of the subsequent yellow light process thin film circuit.

[0037] In the present application, the material of the second metal film layer 3 includes tin-lead alloy, which is soft and can be used as a stress release layer with good compatibility, reducing the influence of the stress of the conductive layer 4 on the adhesion and the warping of the glass substrate. In some embodiments, the thickness of the second metal film layer 2 is 120-300nm. For example, the thickness of the second metal film layer 3 is 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 185nm, 190nm, 195nm, 200nm, 205nm, 210nm, 220nm, 230nm, 240nm, 250nm, 260nm, 270nm, 280nm, 290nm or 300nm.

[0038] Preferably, the thickness of the second metal film layer 3 is 130-220 nm, which can ensure the stress release effect while reducing the cost.

[0039] In some embodiments, the total thickness of the first metal film layer 2 and the second metal film layer 3 is 260-370 nm.

[0040] In the present application, the mass content of tin in the tin-lead alloy can be 60-95%. From the perspective of further improving the bonding force and stress between the film layers, preferably, the mass content of tin in the tin-lead alloy is 70-95%, for example, 70%, 75%, 80%, 85%, 90% or 95%.

[0041] In the present application, the material of the conductive layer 4 includes copper. The thickness of the conductive layer 4 can be 1-10μm, for example, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm or 10μm. In particular, the first metal film layer 2 and the second metal film layer 3 are sequentially introduced between the glass substrate 1 and the conductive layer 4, which can improve the adhesion of the conductive layer 4 to the glass substrate 1. On this basis, the higher the film thickness of the conductive layer 4, the more conducive it is to reduce the square resistance. Preferably, the thickness of the conductive layer 4 is above 6μm. In a specific embodiment, the thickness of the conductive layer 4 is 6-7μm.

[0042] In the coated glass of the present application, different coating materials are stacked between the glass substrate 1 and the conductive layer 4 to solve the problem of high stress of thick copper, achieve thick copper coating, and reduce the warping of the glass-based product after coating.

[0043] The present application also provides a method for preparing the Mini LED coated glass, comprising the following steps:

[0044] Depositing a first metal material including metal molybdenum on a glass substrate 1 through a first coating process to form a first metal film layer 2;

[0045] Depositing a second metal material including a tin-lead alloy onto the surface of the first metal film layer 2 by a second plating process to form a second metal film layer 3;

[0046] A conductive metal including copper is deposited on the surface of the second metal film layer 3 through a third plating process to form a conductive layer 4 .

[0047] In the present application, the first coating process, the second coating process and the third coating process can be independently selected from various evaporation, sputtering or ion plating processes to deposit corresponding metal materials to form coatings.

[0048] Preferably, the first coating process includes multi-arc ion plating, and the conditions of the multi-arc ion plating include: coating vacuum degree of 0.1-0.5 Pa, speed of 0.5-1.5 m / min, current of 50-60 A, and voltage of 80-130 V. The surface morphology of the molybdenum layer formed by the multi-arc ion plating can form dense and relatively neat columnar crystals. The columnar crystals of the molybdenum layer that continuously grow perpendicular to the substrate are relatively coarse and have a diameter of about 40-60 nm. The columnar crystals increase the surface area, which is beneficial to the effective combination of the second metal film layer 3 and the conductive layer 4 and improves the adhesion.

[0049] Preferably, the second coating process includes first DC power sputtering, that is, forming a tin-lead thin film by DC power sputtering. The conditions of the first DC power sputtering include: coating vacuum degree 0.1-0.35 Pa, speed 0.5-1.5 m / min, current 20-30 A, voltage 380-450 V.

[0050] Preferably, the third coating process includes second DC power sputtering, and the conditions of the second DC power sputtering include: coating vacuum degree 0.1-0.4Pa, temperature 100-200°C, speed 0.5-1.5m / min, current 45-60A, voltage 440-520V.

[0051] According to a specific implementation, the method for preparing the Mini LED coated glass includes the following process:

[0052] S0: Pre-treat the glass substrate: After the glass substrate is cleaned and dried by ultrasonic wave, it is loaded into and out of the coating equipment for vacuuming;

[0053] S1: depositing metal molybdenum on one surface of a glass substrate by multi-arc ion plating to form a first metal film layer; specifically, transferring the glass substrate to a multi-arc ion sputtering chamber, and then preparing and depositing the film layer according to the process parameters of the equipment;

[0054] S2: depositing a tin-lead alloy on the surface of the first metal film layer through a DC power sputtering process to form a second metal film layer; specifically, transferring the substrate coated with the metal molybdenum layer to the second metal target sputtering chamber, and then preparing and depositing the film layer according to the process parameters of the equipment;

[0055] S3: Through the DC power sputtering process, metal copper is immersed on the surface of the second metal film layer to form a conductive layer; specifically, the glass substrate coated with the metal molybdenum film layer and the tin-lead alloy film layer is transferred to the third-layer metal target sputtering chamber, and then the film layer is prepared and deposited according to the process parameters of the equipment. After the film layer preparation is completed, walk out of the coating machine to take the film.

[0056] The preparation method of the present application increases the contact surface area by changing the columnar crystal state of the film through the combination of different power sputtering methods and sputtering materials. The increase in the bonding area is beneficial to improving the adhesion strength between the film layers and the release of thick copper stress.

[0057] The present application also provides the application of the Mini LED coated glass in the preparation of Mini LED. The Mini LED coated glass of the present application has the characteristics of low square resistance and good adhesion, and is particularly suitable for the preparation of Mini LED, which is specifically reflected in the guarantee of process yield and the absence of film shedding problems; at the same time, the low square resistance meets the design of microcircuits and can carry large currents and low heat.

[0058] The following are specific embodiments of the present application.

[0059] The embodiments are used to illustrate the Mini LED coated glass and the preparation method thereof of the present application.

[0060] In the following examples and comparative examples,

[0061] The glass substrate is high aluminum glass with a thickness of 0.8 mm.

[0062] Example 1

[0063] The preparation steps of Mini LED coated glass are as follows:

[0064] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a first metal film layer (metal molybdenum film layer), wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 55A, the voltage is 110V, and the thickness of the plating layer is 100nm;

[0065] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a second metal film layer (tin-lead alloy film layer), wherein the mass content of tin in the tin-lead alloy is 80%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 20 A, the voltage is 380 V, and the coating thickness is 190 nm;

[0066] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a conductive layer (copper film layer), wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0067] The prepared Mini LED coated glass is denoted as G1.

[0068] Example 2

[0069] The preparation steps of Mini LED coated glass are as follows:

[0070] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 60A, the voltage is 130V, and the thickness of the plating layer is 140nm;

[0071] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 90%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 25 A, the voltage is 430 V, and the coating thickness is 200 nm;

[0072] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 45 A, the voltage is 440 V, and the coating thickness is 6 μm.

[0073] The prepared Mini LED coated glass is recorded as G2.

[0074] Example 3

[0075] The preparation steps of Mini LED coated glass are as follows:

[0076] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 50A, the voltage is 90V, and the thickness of the plating layer is 120nm;

[0077] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 75%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 30 A, the voltage is 450 V, and the coating thickness is 220 nm;

[0078] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.2 Pa, the speed is 1 m / min, the current is 60 A, the voltage is 510 V, and the coating thickness is 7 μm.

[0079] The prepared Mini LED coated glass is recorded as G3.

[0080] Example 4

[0081] The preparation steps of Mini LED coated glass are as follows:

[0082] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.3Pa, the coating speed is 1m / min, the current is 50A, the voltage is 90V, and the thickness of the plating layer is 150nm;

[0083] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 85%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 28 A, the voltage is 410 V, and the coating thickness is 200 nm;

[0084] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.4 Pa, the speed is 1 m / min, the current is 55 A, the voltage is 490 V, and the coating thickness is 7 μm.

[0085] The prepared Mini LED coated glass is recorded as G4.

[0086] Example 5

[0087] The preparation steps of Mini LED coated glass are as follows:

[0088] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.3Pa, the coating speed is 1m / min, the current is 50A, the voltage is 80V, and the thickness of the plating layer is 90nm;

[0089] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 85%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 30 A, the voltage is 450 V, and the coating thickness is 220 nm;

[0090] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.2 Pa, the speed is 1 m / min, the current is 45 A, the voltage is 440 V, and the coating thickness is 4 μm.

[0091] The prepared Mini LED coated glass is recorded as G5.

[0092] Example 6

[0093] The preparation steps of Mini LED coated glass are as follows:

[0094] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 55A, the voltage is 110V, and the thickness of the plating layer is 100nm;

[0095] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 66%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 20 A, the voltage is 380 V, and the coating thickness is 190 nm;

[0096] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0097] The prepared Mini LED coated glass is recorded as G6.

[0098] Example 7

[0099] The preparation steps of Mini LED coated glass are as follows:

[0100] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 55A, the voltage is 110V, and the thickness of the plating layer is 160nm;

[0101] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 80%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 20 A, the voltage is 380 V, and the coating thickness is 130 nm;

[0102] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0103] The prepared Mini LED coated glass is recorded as G7.

[0104] Example 8

[0105] The preparation steps of Mini LED coated glass are as follows:

[0106] 1) using a direct current power supply to sputter and deposit metal molybdenum on the surface of a glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2 Pa, the coating speed is 1 m / min, the current is 15 A, the voltage is 390 V, and the thickness of the plating layer is 100 nm;

[0107] 2) using a direct current power supply to sputter and deposit a tin-lead alloy on the surface of the metal molybdenum film layer to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 80%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 20 A, the voltage is 380 V, and the coating thickness is 190 nm;

[0108] 3) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0109] The prepared Mini LED coated glass is recorded as G8.

[0110] Comparative Example 1

[0111] The preparation steps of Mini LED coated glass are as follows:

[0112] 1) using a direct current power supply to sputter and deposit a tin-lead alloy on one surface of a glass substrate to form a tin-lead alloy film layer, wherein the mass content of tin in the tin-lead alloy is 80%, the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 20 A, the voltage is 380 V, and the coating thickness is 290 nm;

[0113] 2) Using a DC power supply to sputter and deposit metallic copper on the surface of the tin-lead alloy film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0114] The prepared Mini LED coated glass is denoted as D-G1.

[0115] Comparative Example 2

[0116] The preparation steps of Mini LED coated glass are as follows:

[0117] 1) using multi-arc ion plating to deposit metal molybdenum on the surface of the glass substrate to form a metal molybdenum film layer, wherein the coating vacuum coating is 0.2Pa, the coating speed is 1m / min, the current is 55A, the voltage is 110V, and the thickness of the plating layer is 290nm;

[0118] 2) Using a DC power supply to sputter and deposit metallic copper on the surface of the metallic molybdenum film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0119] The prepared Mini LED coated glass is denoted as D-G2.

[0120] Comparative Example 3

[0121] The preparation steps of Mini LED coated glass are as follows:

[0122] 1) using a medium frequency power supply to sputter and deposit silicon dioxide on the surface of a glass substrate to form a silicon dioxide film layer, wherein the voltage is 400 V, the current is 15 A, and the film thickness is 290 nm;

[0123] 2) Using a DC power supply to sputter and deposit metallic copper on the surface of the silicon dioxide film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0124] The prepared Mini LED coated glass is recorded as D-G3.

[0125] Comparative Example 4

[0126] The preparation steps of Mini LED coated glass are as follows:

[0127] 1) using a medium frequency power supply to sputter and deposit silicon dioxide on the surface of a glass substrate to form a silicon dioxide film layer, wherein the voltage is 400 V, the current is 15 A, and the film thickness is 290 nm;

[0128] 2) Using a DC power supply to sputter and deposit metallic copper on the surface of the silicon dioxide film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 1 μm.

[0129] The prepared Mini LED coated glass is recorded as D-G4.

[0130] Comparative Example 5

[0131] The preparation steps of Mini LED coated glass are as follows:

[0132] 1) using a direct current power supply to sputter and deposit metal titanium on the surface of a glass substrate to form a metal titanium film layer, wherein the voltage is 430 V, the current is 12 A, and the film thickness is 300 nm;

[0133] 2) Using a DC power supply to sputter and deposit metallic copper on the surface of the metallic titanium film layer to form a copper film layer, wherein the coating vacuum is 0.3 Pa, the speed is 1 m / min, the current is 50 A, the voltage is 460 V, and the coating thickness is 6 μm.

[0134] The prepared Mini LED coated glass is recorded as D-G5.

[0135] Performance Testing

[0136] The properties of the coated glasses (G1 to G8 and D-G1 to D-G5) prepared in the above examples and comparative examples were tested.

[0137] The film adhesion is tested by boiling in water. The test method is: boil the coated glass in 80℃ pure water for 1 hour, take it out and cut through the film with a white grid knife, stick 3M tape on the test area, press it flat with your fingers to ensure there are no bubbles, and pull it quickly after the tape and the product form about 90°. Test 3 times to check the integrity of the film in the 100-grid area. The adhesion grade judgment standards are as follows: 5B, no film shedding; 4B, the film shedding area is less than 5%; 3B, the film shedding area is 5-15%; 2B, the film shedding area is 15-35% (excluding 15%); 1B, the film shedding area is 35-65% (excluding 35%); 0B, the film shedding area exceeds 1B.

[0138] Square resistance is tested with four probes. During the test, ensure that the surface of the product is clean and free of visible dirt. The test probe is perpendicular to the product and the test value is read after it stabilizes.

[0139] The test results are shown in Table 1.

[0140] Table 1

[0141]

[0142]

[0143] Combined with the data in Table 1, by comparing Examples 1-8 with Comparative Examples 1-5, it can be seen that the preparation method provided by the present application can produce thick copper-coated glass with good adhesion and low square resistance. Specifically, by comparing Examples 1-8 with Comparative Examples 1-2, it can be seen that when the coating lacks a metal molybdenum layer or a tin-lead alloy layer, the film adhesion is poor. It can be seen from Comparative Examples 3 and 4 that when a traditional silicon dioxide film layer is used as a base layer, in order to ensure the adhesion of the coating, the copper layer thickness can only reach 1 μm, resulting in too high square resistance.

[0144] Comparing Example 1 with Example 6, it can be seen that controlling the tin content in the tin-lead alloy within an appropriate range can further improve the stress magnitude and adhesion.

[0145] Comparing Example 1 with Example 8, it can be seen that forming the metal molybdenum layer by multi-arc ion plating is more conducive to improving the adhesion of the coating.

[0146] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0147] The above-described embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

[0148] The diagrams may be used to explain the content of the claims.

Claims

1. A Mini LED coated glass, characterized in that: It comprises a glass substrate, a first metal film layer, a second metal film layer and a conductive layer which are stacked in sequence; wherein the material of the first metal film layer comprises metal molybdenum, the material of the second metal film layer comprises tin-lead alloy, and the material of the conductive layer comprises metal copper; and the thickness of the conductive layer is 1-10 μm.

2. The Mini LED coated glass according to claim 1, characterized in that: The glass substrate meets at least one of the following conditions: (1) The glass substrate comprises high-aluminum glass, soda-lime glass or silicate glass; (2) The thickness of the glass substrate is 0.2-1.1 mm.

3. The Mini LED coated glass according to claim 1, characterized in that: The thickness of the first metal film layer is 80-200 nm.

4. The Mini LED coated glass according to claim 1, characterized in that: The thickness of the second metal film layer is 120-300 nm.

5. The Mini LED coated glass according to claim 1 or 4, characterized in that: In the tin-lead alloy, the mass content of tin is 60-95%.

6. The Mini LED coated glass according to claim 5, characterized in that: The mass content of tin is 70-95%.

7. The Mini LED coated glass according to claim 1, characterized in that: The thickness of the conductive layer is 6-7 μm.

8. The method for preparing the Mini LED coated glass according to any one of claims 1 to 7, characterized in that: The steps include: Depositing a first metal material including metal molybdenum on a glass substrate through a first coating process to form a first metal film layer; depositing a second metal material including a tin-lead alloy onto the surface of the first metal film layer by a second plating process to form a second metal film layer; A conductive metal including copper is deposited on the surface of the second metal film layer through a third plating process to form a conductive layer.

9. The preparation method according to claim 8, characterized in that: The first coating process includes multi-arc ion plating, and the conditions of the multi-arc ion plating include: coating vacuum degree is 0.1-0.5Pa, speed is 0.5-1.5m / min, current is 50-60A, and voltage is 80-130V.

10. The preparation method according to claim 8, characterized in that: The second coating process includes first DC power sputtering, and the conditions of the first DC power sputtering include: coating vacuum degree 0.1-0.35Pa, speed 0.5-1.5m / min, current 20-30A, and voltage 360-450V.

11. The preparation method according to claim 8, characterized in that: The third coating process includes second DC power sputtering, and the conditions of the second DC power sputtering include: coating vacuum degree 0.1-0.4Pa, speed 0.5-1.5m / min, current 45-60A, voltage 440-520V.

12. Use of the Mini LED coated glass according to any one of claims 1 to 7 in the preparation of Mini LED.

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