A 5G-supported industrial control host and heat dissipation control method thereof

Abstract

The present invention provides an industrial control host supporting 5G, which relates to the technical field of industrial control hosts, including a body and a CPU mainboard, a 5G module PCB board, a first heat dissipation device and a second heat dissipation device placed in the body; the first heat dissipation device includes a radiator and a heat dissipation layer placed between the radiator and the 5G module PCB board, and the second heat dissipation device includes a centrifugal fan, which has a first air outlet and a second air outlet, wherein the first air outlet blows toward the first fin, and the second air outlet blows toward the second fin and the 5G module PCB board; and a revolving door is provided on the blowing path of the second air outlet, and the revolving door is configured to rotate toward the direction close to the second fin when the temperature of the 5G module PCB board is higher than the temperature of the CPU mainboard; or when the temperature of the CPU mainboard is higher than the 5G module PCB board, it rotates toward the direction close to the 5G module PCB board, thereby solving the heat dissipation problem of the industrial control host supporting 5G. The present application also provides a heat dissipation control method.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial control hosts, and in particular to an industrial control host supporting 5G and a heat dissipation control method thereof. Background Art

[0002] With the intelligentization of industrial production, the application of industrial control hosts is becoming more and more extensive. The 4G communication module can no longer meet the market demand. The power consumption of the 5G module PCB board is higher than that of the 4G communication module. The traditional heat dissipation method can no longer adapt to the industrial control host that supports 5G. When the whole machine is in a high temperature environment, the industrial control host will find it difficult to reach the required operating frequency, affecting the performance of the industrial control host. Summary of the invention

[0003] The present invention discloses an industrial control host supporting 5G and a heat dissipation method thereof, aiming to improve the heat dissipation problem of the industrial control host supporting 5G.

[0004] The present invention adopts the following scheme:

[0005] A 5G-supporting industrial control host comprises a body and a CPU mainboard, a 5G module PCB board, a first heat dissipation device and a second heat dissipation device disposed in the body; the first heat dissipation device comprises a radiator and a heat dissipation layer disposed between the radiator and the 5G module PCB board, the second heat dissipation device comprises a centrifugal fan, the centrifugal fan has a first air outlet and a second air outlet, the first air outlet blows toward a first fin, and the second air outlet blows toward a second fin and the 5G module PCB board; a revolving door is provided on the blowing path of the second air outlet, the revolving door is configured to rotate toward the second fin when the temperature of the 5G module PCB board is higher than the temperature of the CPU mainboard; or to rotate toward the 5G module PCB board when the temperature of the CPU mainboard is higher than the 5G module PCB board.

[0006] As a further improvement, the heat dissipation layer is made of silicone grease or gel, and the heat dissipation layer occupies at least 70% of the PCB board area of ​​the 5G module.

[0007] As a further improvement, a copper layer is laid on the bottom of the 5G module PCB board, and the copper layer occupies at least 50% of the area of ​​the 5G module PCB board.

[0008] As a further improvement, an air guide cover is provided corresponding to the second air outlet, the air outlet of the air guide cover is directly facing the 5G module PCB board and the second fin, and the revolving door is arranged on the air guide cover.

[0009] As a further improvement, a heat pipe for connecting fin No. 1 and fin No. 2 is configured under the CPU mainboard.

[0010] As a further improvement, the revolving door is driven to rotate via a rotating electromagnet.

[0011] As a further improvement, the rotation angle of the revolving door is 15°, 30°, 45°, 60°, 75° or 90°.

[0012] A heat dissipation control method for the above-mentioned 5G-supporting industrial control host is also provided, and generating a rotation instruction of the revolving door includes:

[0013] When the temperature of the CPU mainboard is less than 45°C, the revolving door rotates 60° clockwise;

[0014] When the temperature of the CPU mainboard is ≥50°C, the revolving door rotates 30° counterclockwise;

[0015] When the temperature of the CPU mainboard is ≥60°C, the revolving door rotates 45° counterclockwise;

[0016] When the temperature of the CPU mainboard is ≥75°C, the revolving door rotates 60° counterclockwise;

[0017] or,

[0018] When the temperature of the 5G module PCB is less than 30°C, the revolving door rotates 60° counterclockwise;

[0019] When the temperature of the 5G module PCB board is ≥35°C, the revolving door rotates 30° clockwise;

[0020] When the temperature of the 5G module PCB board is ≥45°C, the revolving door rotates 45° clockwise;

[0021] When the temperature of the 5G module PCB board is ≥50°C, the revolving door rotates 60° clockwise;

[0022] If the temperatures of the CPU mainboard or the 5G module PCB board meet the trigger conditions at the same time, the trigger condition with the higher temperature will be prioritized.

[0023] As a further improvement, it also includes a No. 1 temperature sensor built into the CPU mainboard and a No. 2 temperature sensor configured on the 5G module PCB, the centrifugal fan is electrically connected to the CPU mainboard, the No. 1 temperature sensor or the No. 2 temperature sensor transmits the detected temperature signal to the CPU mainboard, and the instruction to adjust the speed of the centrifugal fan is generated, including:

[0024] When the temperature of the CPU mainboard is less than 40°C and the temperature of the 5G module PCB board is less than 30°C, the centrifugal fan stops rotating;

[0025] When the temperature of the CPU mainboard rises to 42°C or the temperature of the 5G module PCB rises to 32°C, the speed of the centrifugal fan is adjusted to 2750r / min;

[0026] When the temperature of the CPU mainboard rises to 47°C or the temperature of the 5G module PCB rises to 35°C, the speed of the centrifugal fan is triggered to be adjusted to 3000 r / min;

[0027] When the temperature of the CPU mainboard rises to 50°C or the temperature of the 5G module PCB rises to 38°C, the speed of the centrifugal fan is triggered to be adjusted to 3250r / min;

[0028] When the temperature of the CPU mainboard rises to 58° C. or the temperature of the 5G module PCB rises to 45° C., the speed of the centrifugal fan is adjusted to 3900 r / min;

[0029] When the temperature of the CPU mainboard rises to 60° C. or the temperature of the 5G module PCB rises to 45° C., the speed of the centrifugal fan is adjusted to 4200 r / min;

[0030] When the temperature of the CPU mainboard rises to 70° C. or the temperature of the 5G module PCB rises to 55° C., the speed of the centrifugal fan is adjusted to 4500 r / min;

[0031] If the temperature of the CPU mainboard or the 5G module PCB board meets the trigger conditions of the two speeds respectively, the instruction with the higher speed is executed.

[0032] As a further improvement, when the temperature of the CPU mainboard and the 5G module PCB board drops, the speed instruction is reduced to the speed corresponding to the current temperature at a rate of one speed instruction every two seconds.

[0033] By adopting the above technical solution, the present invention can achieve the following technical effects:

[0034] 1. A first heat dissipation device including a heat sink and a heat dissipation layer is provided to reduce the temperature of the 5G module PCB board from the source and the propagation path.

[0035] 2. Set up a centrifugal fan and use dual air outlets to blow out the heat source of the whole machine from different directions to reduce heat accumulation. At the same time, the air outlet path of the second air outlet can sweep across the 5G module PCB board to enhance the heat dissipation of the 5G module PCB board.

[0036] 3. A revolving door is provided on the blowing path of the second air outlet. By judging the temperature of the CPU mainboard and the 5G module PCB board, the rotation of the revolving door is controlled so that the air volume of the second air outlet is reasonably distributed to improve the heat dissipation efficiency of the centrifugal fan.

[0037] 4. Two heat pipes connecting fin No. 1 and fin No. 2 are configured under the CPU motherboard. The heat pipes are welded on the fins to direct the heat of the CPU motherboard to the air outlet directions of the two fins, thereby further improving the heat dissipation efficiency of the CPU motherboard.

[0038] This application sets up multiple heat dissipations and reasonably controls the air volume distribution to keep the entire machine in an appropriate temperature environment and ensure the operation of the entire machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 It is a structural schematic diagram of one embodiment of the present invention;

[0041] Figure 2 yes Figure 1 a sectional view along one of the sections;

[0042] Figure 3 yes Figure 1 a sectional view along another section;

[0043] Figure 4 yes Figure 3 A magnified view of middle;

[0044] Figure 5 It is a schematic diagram of the structure behind the bottom cover of the hidden body;

[0045] Figure 6 is a schematic structural diagram of a first heat dissipation device and a second heat dissipation device according to one embodiment of the present invention;

[0046] Figure 7 It is a schematic diagram of the structure of one embodiment of the present invention after the machine body and the centrifugal fan are hidden;

[0047] Figure 8 It is a structural schematic diagram of the connection between the first fin and the second fin and the heat pipe in one embodiment of the present invention.

[0048] icon:

[0049] 1-body; 2-CPU motherboard; 3-5G module PCB board; 4-radiator; 5-heat dissipation layer; 6-centrifugal fan; 601-first air outlet; 602-second air outlet; 7-No. 1 fin; 8-No. 2 fin; 9-revolving door; 10-heat pipe; 11-air guide cover; 12-rotating electromagnet. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0051] Example

[0052] Combination Figures 1 to 8 This embodiment provides an industrial control host supporting 5G, including a body 1 and a CPU mainboard 2, a 5G module PCB board 3, a first heat dissipation device and a second heat dissipation device placed in the body 1. Among them, the bottom and sides of the body 1 are provided with a plurality of ventilation holes for air flow in and out. The CPU mainboard 2 is arranged close to the top inner wall of the body 1, and the 5G module PCB board 3 is placed below the CPU mainboard 2. The first heat dissipation device is configured near the bottom of the body 1 and includes a radiator 4 and a heat dissipation layer 5 placed between the radiator 4 and the 5G module PCB board 3. The radiator 4 is preferably an aluminum extruded profile with fins to increase the effective heat dissipation area and enhance the exchange between the radiator 4 and the air. The heat dissipation layer 5 occupies at least 70% of the area of ​​the 5G module PCB board 3, and adopts a thermal conductivity ≥4.5W / m 2 *K silicone grease or gel to ensure the heat dissipation effect. The bottom of the 5G module PCB board 3 is paved with a copper layer, which occupies at least 50% of the area of ​​the 5G module PCB board 3 to disperse the heat of the 5G module PCB board 3. In addition, increasing the copper content can also reduce the current loss thermal resistance and improve thermal conductivity. To reduce the temperature of the 5G module PCB board 3 from the source and propagation path.

[0053] The second heat dissipation device includes a centrifugal fan 6, which has a first air outlet 601 and a second air outlet 602, wherein the first air outlet 601 blows toward the first fin 7, and the second air outlet 602 blows toward the second fin 8 and the 5G module PCB board 3; and a revolving door 9 is provided on the blowing path of the second air outlet 602, and the revolving door 9 is configured to rotate toward the second fin 8 when the temperature of the 5G module PCB board 3 is higher than the temperature of the CPU mainboard 2, so that more air volume is blown toward the 5G module PCB board 3; or when the temperature of the CPU mainboard 2 is higher than the 5G module PCB board 3, the revolving door 9 rotates toward the 5G module PCB board 3, so that more air volume is blown toward the second fin 8. Preferably, the angle between the first air outlet 601 and the second air outlet 602 is 90°, but is not limited thereto and is not specifically limited thereto.

[0054] In this embodiment, the heat source of the whole machine is blown out from different directions by using dual air outlets to reduce heat accumulation. At the same time, the air outlet path of the second air outlet 602 can sweep over the 5G module PCB board 3 to enhance the heat dissipation of the 5G module PCB board 3. In addition, by judging the temperature of the CPU mainboard 2 and the 5G module PCB board 3, the rotation of the revolving door 9 is controlled so that the air volume of the second air outlet 602 is reasonably distributed to improve the heat dissipation efficiency of the centrifugal fan 6. Preferably, two heat pipes 10 for connecting the first fin 7 and the second fin 8 are arranged below the CPU mainboard 2. The heat pipes 10 are welded to the fins to guide the heat to the air outlet directions of the two fins respectively, thereby further improving the heat dissipation efficiency of the CPU mainboard 2.

[0055] On the basis of the above embodiment, in an optional embodiment of the present invention, an air guide cover 11 is provided corresponding to the second air outlet 602, and the air outlet of the air guide cover 11 is directly opposite to the 5G module PCB board 3 and the second fin 8. Specifically, the 5G module PCB board 3 and the second fin 8 are arranged side by side and separated by a partition, the rotation center of the revolving door 9 is located on the center line of the partition, and the initial position of the revolving door 9 is parallel to the partition.

[0056] Exemplarily, the revolving door 9 is driven to rotate by a rotating electromagnet 12, one end of which is fixed on the air guide cover 11, and the other end is connected to the revolving door 9 through a rotating shaft. The height of the revolving door 9 is the same as the height of the second air outlet 602, and the rotation angle can be set to 15°, 30°, 45°, 60°, 75°, 90°, etc. It should be mentioned that the rotating electromagnet 12 rotates to a fixed angle after being energized, and is reset by its own spring when the power is off, and can only rotate within a fixed angle. It can be divided into two types: clockwise and counterclockwise rotation. When the coil is energized, the iron core and the armature are magnetized to become two magnets with opposite polarities, and electromagnetic attraction is generated between them. When the suction force is greater than the reaction force of the spring, the armature begins to move toward the iron core. When the current in the coil is less than a certain value or the power supply is interrupted, the electromagnetic attraction is less than the reaction force of the spring, and the armature will return to the original release position under the action of the reaction force.

[0057] The present invention further provides a heat dissipation control method, which is applied to the above-mentioned industrial control host supporting 5G, wherein the rotating electromagnet 12 is electrically connected to the CPU mainboard 2, and the rotation instruction of the revolving door 9 is generated, including:

[0058] When the temperature of the CPU mainboard 2 is less than 45°C, the revolving door 9 rotates 60° clockwise;

[0059] When the temperature of the CPU mainboard 2 is ≥50°C, the revolving door 9 rotates 30° counterclockwise;

[0060] When the temperature of the CPU mainboard 2 is ≥60°C, the revolving door 9 rotates 45° counterclockwise;

[0061] When the temperature of the CPU mainboard 2 is ≥75°C, the revolving door 9 rotates 60° counterclockwise;

[0062] or,

[0063] When the temperature of the 5G module PCB board 3 is less than 30°C, the revolving door 9 rotates 60° counterclockwise;

[0064] When the temperature of the 5G module PCB board 3 is ≥35°C, the revolving door 9 rotates 30° clockwise;

[0065] When the temperature of the 5G module PCB board 3 is ≥45°C, the revolving door 9 rotates 45° clockwise;

[0066] When the temperature of the 5G module PCB board 3 is ≥50°C, the revolving door 9 rotates 60° clockwise.

[0067] If the temperature of the CPU mainboard 2 or the 5G module PCB board 3 meets the trigger condition at the same time, the trigger condition with the higher temperature will be prioritized. For example, the temperature of the CPU mainboard 2 is 60°C and the temperature of the 5G module PCB board 3 is 35°C. At this time, the temperature of the CPU mainboard 2 is higher. The temperature of the CPU mainboard 2 is used as the trigger condition, and the revolving door 9 rotates 45° counterclockwise.

[0068] On the basis of the above embodiment, in an optional embodiment of the present invention, it further includes a No. 1 temperature sensor built into the CPU mainboard 2 (i.e., the temperature sensor provided by the CPU mainboard 2) and a No. 2 temperature sensor configured on the 5G module PCB, the centrifugal fan 6 is electrically connected to the CPU mainboard 2, the No. 1 temperature sensor or the No. 2 temperature sensor transmits the detected temperature signal to the CPU mainboard 2, and the instruction for adjusting the speed of the centrifugal fan 6 is generated, including:

[0069] When the temperature of the CPU mainboard 2 is less than 40°C and the temperature of the 5G module PCB board 3 is less than 30°C, the centrifugal fan 6 stops rotating;

[0070] When the temperature of the CPU mainboard 2 rises to 42° C. or the temperature of the 5G module PCB board 3 rises to 32° C., the speed of the centrifugal fan 6 is adjusted to 2750 r / min;

[0071] When the temperature of the CPU mainboard 2 rises to 47° C. or the temperature of the 5G module PCB board 3 rises to 35° C., the speed of the centrifugal fan 6 is adjusted to 3000 r / min;

[0072] When the temperature of the CPU mainboard 2 rises to 50° C. or the temperature of the 5G module PCB board 3 rises to 38° C., the speed of the centrifugal fan 6 is triggered to be adjusted to 3250 r / min;

[0073] When the temperature of the CPU mainboard 2 rises to 58° C. or the temperature of the 5G module PCB board 3 rises to 45° C., the rotation speed of the centrifugal fan 6 is adjusted to 3900 r / min;

[0074] When the temperature of the CPU mainboard 2 rises to 60° C. or the temperature of the 5G module PCB board 3 rises to 45° C., the speed of the centrifugal fan 6 is adjusted to 4200 r / min;

[0075] When the temperature of the CPU mainboard 2 rises to 70° C. or the temperature of the 5G module PCB board 3 rises to 55° C., the speed of the centrifugal fan 6 is adjusted to 4500 r / min;

[0076] When the temperature of the CPU mainboard 2 or the 5G module PCB board 3 meets the trigger conditions of the two speeds, the high speed instruction is executed. For example, the temperature of the CPU mainboard 2 is 60°C, and the temperature of the 5G module PCB board 3 is 55°C. At this time, the temperature of the 5G module PCB board 3 corresponds to the high speed of the centrifugal fan 6, so the instruction to adjust the speed of the centrifugal fan 6 to 4500r / min is executed.

[0077] Preferably, when the temperature of the CPU mainboard 2 and the 5G module PCB board 3 drops, the speed is reduced to the speed corresponding to the current temperature with one speed instruction every two seconds. For example, when the temperature of the CPU mainboard 2 drops from 70°C to 47°C, and the temperature of the 5G module PCB board 3 is 30°C, the speed of the centrifugal fan 6 is 4500r / min, and the speed instructions of 4200r / min, 3900r / min, and 3250r / min are executed in sequence every two seconds until the speed drops to 3000r / min.

[0078] It should be noted that, in this embodiment, the rotation angle of the revolving door 9 is controlled by temperature so that the air volume of the second air outlet 602 is reasonably distributed to achieve the best heat dissipation efficiency. In addition, the speed of the centrifugal fan 6 is controlled to avoid the fan always being at the maximum speed, thereby reducing noise and ensuring the service life of the fan.

[0079] The above are only preferred implementations of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention.

Claims

1. An industrial control host supporting 5G, comprising a body, a CPU mainboard and a 5G module PCB board placed in the body, characterized in that: Also includes a first heat sink and a second heat sink; The first heat dissipation device includes a heat sink and a heat dissipation layer disposed between the heat sink and the 5G module PCB board. The second heat dissipation device includes a centrifugal fan, which has a first air outlet and a second air outlet, wherein the first air outlet blows toward fin No. 1, and the second air outlet blows toward fin No. 2 and the 5G module PCB board; and a revolving door is provided on the blowing path of the second air outlet, and the revolving door is configured to rotate toward the direction approaching fin No. 2 when the temperature of the 5G module PCB board is higher than the temperature of the CPU mainboard; or to rotate toward the direction approaching the 5G module PCB board when the temperature of the CPU mainboard is higher than the 5G module PCB board.

2. The 5G-supporting industrial control host according to claim 1, characterized in that: The heat dissipation layer is made of silicone grease or gel, and the heat dissipation layer occupies at least 70% of the PCB board area of ​​the 5G module.

3. The 5G-supporting industrial control host according to claim 1, characterized in that: A copper layer is laid on the bottom of the 5G module PCB board, and the copper layer occupies at least 50% of the area of ​​the 5G module PCB board.

4. The 5G-supporting industrial control host according to claim 1, characterized in that: An air guide cover is provided corresponding to the second air outlet, the air outlet of the air guide cover is directly facing the 5G module PCB board and the second fin, and the revolving door is arranged on the air guide cover.

5. The 5G-supporting industrial control host according to claim 1, characterized in that: A heat pipe for connecting the first fin and the second fin is arranged below the CPU mainboard.

6. The 5G-supporting industrial control host according to claim 1, characterized in that: The revolving door is driven to rotate via a rotating electromagnet.

7. The 5G-supporting industrial control host according to claim 1, characterized in that: The rotation angle of the revolving door is 15°, 30°, 45°, 60°, 75° or 90°.

8. A heat dissipation control method applied to the 5G-supporting industrial control host according to claim 1, characterized in that: Generating the rotation instruction of the revolving door includes: When the temperature of the CPU mainboard is less than 45°C, the revolving door rotates 60° clockwise; When the temperature of the CPU mainboard is ≥50°C, the revolving door rotates 30° counterclockwise; When the temperature of the CPU mainboard is ≥60°C, the revolving door rotates 45° counterclockwise; When the temperature of the CPU mainboard is ≥75°C, the revolving door rotates 60° counterclockwise; or, When the temperature of the 5G module PCB is less than 30°C, the revolving door rotates 60° counterclockwise; When the temperature of the 5G module PCB board is ≥35°C, the revolving door rotates 30° clockwise; When the temperature of the 5G module PCB board is ≥45°C, the revolving door rotates 45° clockwise; When the temperature of the 5G module PCB board is ≥50°C, the revolving door rotates 60° clockwise; If the temperatures of the CPU mainboard or the 5G module PCB board meet the trigger conditions at the same time, the trigger condition with the higher temperature will be prioritized.

9. The heat dissipation control method according to claim 8, characterized in that: It also includes a No. 1 temperature sensor built into the CPU mainboard and a No. 2 temperature sensor configured on the 5G module PCB, the centrifugal fan is electrically connected to the CPU mainboard, the No. 1 temperature sensor or the No. 2 temperature sensor transmits the detected temperature signal to the CPU mainboard, and the instruction to adjust the speed of the centrifugal fan is generated, including: When the temperature of the CPU mainboard is less than 40°C and the temperature of the 5G module PCB board is less than 30°C, the centrifugal fan stops rotating; When the temperature of the CPU mainboard rises to 42°C or the temperature of the 5G module PCB rises to 32°C, the speed of the centrifugal fan is adjusted to 2750r / min; When the temperature of the CPU mainboard rises to 47°C or the temperature of the 5G module PCB rises to 35°C, the speed of the centrifugal fan is triggered to be adjusted to 3000 r / min; When the temperature of the CPU mainboard rises to 50°C or the temperature of the 5G module PCB rises to 38°C, the speed of the centrifugal fan is triggered to be adjusted to 3250r / min; When the temperature of the CPU mainboard rises to 58° C. or the temperature of the 5G module PCB rises to 45° C., the speed of the centrifugal fan is adjusted to 3900 r / min; When the temperature of the CPU mainboard rises to 60° C. or the temperature of the 5G module PCB rises to 45° C., the speed of the centrifugal fan is adjusted to 4200 r / min; When the temperature of the CPU mainboard rises to 70° C. or the temperature of the 5G module PCB rises to 55° C., the speed of the centrifugal fan is adjusted to 4500 r / min; If the temperature of the CPU mainboard or the 5G module PCB board meets the trigger conditions of the two speeds respectively, the instruction with the higher speed is executed.

10. The heat dissipation control method according to claim 9, characterized in that: When the temperature of the CPU mainboard and the 5G module PCB board drops, the speed is reduced to the speed corresponding to the current temperature with one speed instruction every two seconds.

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