Prediction Method for Pull-Out Force of Solid Glue and Bonding Method for Solid Glue

Abstract

The present application provides a method for predicting the pulling force of a solid glue, comprising the following steps: measuring the true density of the solid glue to obtain the porosity of the solid glue; performing dielectric curing measurement on the solid glue to obtain the ionic viscosity of the solid glue; predicting whether the pulling force of the solid glue meets the standard based on the porosity of the solid glue and the ionic viscosity of the solid glue. The present application also provides a method for bonding the solid glue. The method for predicting the pulling force of the solid glue provided by the present application predicts the pulling force of the solid glue based on the porosity of the solid glue and the ionic viscosity of the solid glue, and this method has high accuracy.

Description

Technical Field

[0001] This application relates to the technical field of solid glue bonding analysis, and particularly relates to a method for predicting the pulling force of solid glue and a method for bonding solid glue. Background Art

[0002] Solid glue, also known as hot melt glue, is widely popular because of its advantages such as convenient and fast use. The PU glue in solid glue is polyurethane glue, which is thermoplastic polyurethane resin or prepolymer.

[0003] Solid PU glue is usually used to bond two workpieces in the manufacturing process, and the bonding ability is a key factor to measure the performance of solid PU glue. At present, the bonding ability of the glue is usually considered through the pulling force test. However, the pulling force test needs to be carried out after the workpiece bonding process, and the process is complex and time-consuming. Summary of the Invention

[0004] This application provides a method for predicting the pulling force of solid glue to solve the problems of complex process and long time consumption in the detection of the pulling force of solid glue. The prediction method provided by this application has the advantages of simple method and high accuracy.

[0005] The first aspect of this application provides a method for predicting the pulling force of solid glue. First, the true density of the solid glue is measured to obtain the porosity of the solid glue, and at the same time, the solid glue is subjected to dielectric curing measurement to obtain the ionic viscosity of the solid glue. Then, based on the porosity of the solid glue and the ionic viscosity of the solid glue, it is predicted whether the pulling force of the solid glue meets the standard. The method for predicting the pulling force of the solid glue provided by this application predicts the pulling force of the solid glue based on the porosity and ionic viscosity of the solid glue, thereby predicting whether the pulling force of the solid glue meets the standard. Applying this prediction method, the prediction result of the pulling force of the solid glue is accurate, and the manufacturing yield of the solid glue is improved.

[0006] The second aspect of this application provides a method for bonding solid glue. First, several solid glue test samples are extracted from a batch of solid glue, and then the pulling force of the solid glue test samples is predicted according to the method for predicting the pulling force of the solid glue to determine whether the pulling force of the solid glue meets the standard. Then, it is determined whether the proportion of the solid glue test samples with the pulling force meeting the standard in the above several solid glue test samples is greater than the threshold value. If it is greater than or equal to the threshold value, the solid glue test samples are qualified solid glue. If it is less than the threshold value, the above steps are repeated for another batch until the proportion of the solid glue test samples with the pulling force meeting the standard in the batch of solid glue is greater than or equal to the threshold value, and then the above qualified solid glue is used to bond the first component and the second component. The method for bonding solid glue provided by this application first determines whether the solid glue test samples meet the standard according to the method for predicting the pulling force of the solid glue, and further can determine whether the batch of solid glue belongs to qualified solid glue, thereby ensuring the quickness and accuracy of the actual application of the solid glue. Description of the Drawings

[0007] Figure 1 This is a schematic diagram of the device for measuring the true density of the solid glue in this application, where 1 is the test chamber and 2 is the reference chamber;

[0008] Figure 2 This is a schematic diagram of the relationship between the change in porosity of the solid glue in this application and the thermal expansion of the gas;

[0009] Figure 3 This is a schematic diagram of the reorientation of dipoles under the action of an alternating electric field for measuring the dielectric curing of the solid glue in this application;

[0010] Figure 4 This is a graph of the ionic viscosity before and after curing of solid glue A and solid glue B in this application;

[0011] Figure 5 This is a schematic diagram of the bonding of the first element, solid glue, and the second element in this application, where 1 is the first element, 2 is the solid glue, and 3 is the second element;

[0012] Figure 6 This is a schematic diagram of the flow of the method for predicting the pulling force of the solid glue in this application;

[0013] Figure 7 This is a schematic diagram of the flow of the bonding method of the solid glue in this application;

[0014] Figure 8 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Experimental Group 1 of this application;

[0015] Figure 9 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Experimental Group 2 of this application;

[0016] Figure 10 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Experimental Group 3 of this application;

[0017] Figure 11 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Experimental Group 4 of this application;

[0018] Figure 12 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Experimental Group 5 of this application;

[0019] Figure 13 This is a data table of the porosity, ionic viscosity, prediction results, and measured results of the solid glue provided by Comparative Group 1 of this application;

[0020] Figure 14Data table of porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Comparative Group 2 of this application. Detailed implementation manners

[0021] To further understand this application, the preferred implementation manners of this application will be described below in conjunction with embodiments. However, it should be understood that these descriptions are only for further explaining the features and advantages of this application, rather than limiting the claims of this application.

[0022] In view of the problem that the data of the pull-out force test in the prior art lacks predictability, which in turn affects the process yield of the solid glue, this application provides a method for predicting the pull-out force of the solid glue. Based on the porosity and ionic viscosity of the solid glue, it predicts the pull-out force of the solid glue and further predicts whether it meets the standard. Applying this prediction result improves the process yield of the solid glue. Specifically, the embodiments of this application disclose a method for predicting the pull-out force of the solid glue, including the following steps:

[0023] Measure the true density of the solid glue to obtain the porosity of the solid glue;

[0024] Perform dielectric curing measurement on the solid glue to obtain the ionic viscosity of the solid glue;

[0025] Based on the porosity of the solid glue and the ionic viscosity of the solid glue, predict whether the pull-out force of the solid glue meets the standard.

[0026] In the method for predicting the pull-out force of the solid glue of this application, subsequent predictions are mainly based on the porosity and ionic viscosity of the solid glue.

[0027] In this application, the porosity is obtained by measuring the true density of the solid glue. The principle of the true density measurement is based on the ideal gas formula PV = nRT. Put the test material in the test chamber of the true density tester, use nitrogen as the medium, gradually pressurize the test chamber to a specified value in the test chamber, and then nitrogen expands into the reference chamber. The equilibrium pressures of the two processes are automatically recorded by the instrument. According to the law of conservation of mass, after calibrating the volumes of the measurement chamber and the reference chamber with a standard ball, the volume of the test material is determined, and then the true density is calculated (the true density tester is as Figure 1 shown), and the sample volume is obtained through formula conversion. For the solid glue, the porosity is a structure with loose holes on the surface and inside of the solid glue. The actual volume of the solid glue cut out according to the design drawing will be smaller than the theoretical volume calculated by the template because the colloid contains holes. Using the above-mentioned true density measurement principle to obtain the actual volume of the sample, and then using the theoretical volume, the porosity of the solid glue can be calculated, that is, the ratio of the actual volume to the theoretical volume is the porosity of the solid glue, that is: porosity = 1 - (actual volume / theoretical volume).

[0028] The calculation method of the above porosity is exemplified by the following samples: The theoretical volumes of Series A solid glue and Series B solid glue are both 0.4133 cm 3 . According to the true density measurement, the actual volume of the solid glue is obtained. Using the formula: porosity = 1 - (actual volume / theoretical volume), the porosities of Series A solid glue and Series B solid glue are calculated. The specific results are shown in Table 1;

[0029] Table 1 Data table related to the porosity of Series A solid glue and Series B solid glue

[0030]

[0031] As can be seen from Table 1, the change in porosity of Series B solid glue before and after pressure holding is very large, indicating that more gas is discharged during the hot pressing process, the gas content in the glue is less, and the degree of gas expansion by heating is also small (as shown in the left figure), indirectly indicating that the drawing force of the solid glue is small; while the change in porosity of Series A solid glue before and after pressure holding is not large and the porosity base number is large, indicating that the gas content is more and the degree of gas thermal expansion is also higher (as shown in the right figure), indirectly indicating that the drawing force of the solid glue is large. Figure 2 As can be seen from Table 1, the change in porosity of Series B solid glue before and after pressure holding is very large, indicating that more gas is discharged during the hot pressing process, the gas content in the glue is less, and the degree of gas expansion by heating is also small (as shown in the left figure), indirectly indicating that the drawing force of the solid glue is small; while the change in porosity of Series A solid glue before and after pressure holding is not large and the porosity base number is large, indicating that the gas content is more and the degree of gas thermal expansion is also higher (as shown in the right figure), indirectly indicating that the drawing force of the solid glue is large. Figure 2 As can be seen from Table 1, the change in porosity of Series B solid glue before and after pressure holding is very large, indicating that more gas is discharged during the hot pressing process, the gas content in the glue is less, and the degree of gas expansion by heating is also small (as shown in the left figure), indirectly indicating that the drawing force of the solid glue is small; while the change in porosity of Series A solid glue before and after pressure holding is not large and the porosity base number is large, indicating that the gas content is more and the degree of gas thermal expansion is also higher (as shown in the right figure), indirectly indicating that the drawing force of the solid glue is large.

[0032] According to the present application, the factors related to the drawing force of the solid glue also include ionic viscosity. The present application measures the ionic viscosity through dielectric curing. Specifically, in the dielectric curing measurement: during the dielectric curing test, an alternating current is applied on both sides of the electrode to generate a corresponding sinusoidal fluctuating current; when the charged ions in the sample move towards the electrodes with opposite polarities, the dipoles in the material will also attempt to reposition in the electric field (as shown in the figure); during the test, a sinusoidal alternating excitation voltage is continuously applied to the sample by the electrode as an input, and the output sinusoidal current signal is measured. Based on the amplitude, angular frequency, and phase difference of the voltage and current, the complex dielectric constant is analyzed and calculated, and the imaginary part is taken and converted to obtain the resistivity ρ. Figure 3 As shown; during the test, a sinusoidal alternating excitation voltage is continuously applied to the sample by the electrode as an input, and the output sinusoidal current signal is measured. Based on the amplitude, angular frequency, and phase difference of the voltage and current, the complex dielectric constant is analyzed and calculated, and the imaginary part is taken and converted to obtain the resistivity ρ.

[0033] The greater the degree of crosslinking and curing in the solid glue, the lower the self-fluidity, the corresponding increase in viscosity, the decrease in ion mobility, resulting in an increase in resistivity. The bridging density refers to the reaction degree of the crosslinking agent in the colloid, which can reflect the starting state of the colloid. Through theoretical derivation and practical comparison, it is found that during the fluidization and crosslinking process of the resin, the change law of the bridging density of the colloid can be inferred from the change in resistivity. Due to this corresponding relationship, the resistivity measured by dielectric curing is vividly named "ionic viscosity". Different colloids have different starting values with the input of the current signal, which can be used to infer the trend after the colloid is cured.

[0034] As Figure 4 shown Figure 4 is the ionic viscosity curve graph of Solid Glue A and Solid Glue B before and after crosslinking. As Figure 4It can be seen that there are significant differences between Solid Glue A and Solid Glue B during the curing and crosslinking process. According to the initial difference in room temperature curing, the degree of crosslinking reaction of the colloid during the hot pressing process can be judged, thereby indirectly reflecting the physical viscosity of the colloid.

[0035] In view of the above analysis of porosity and ionic viscosity, it can be known that the pulling force of the solid glue is related to the porosity of the solid glue and the ionic viscosity of the solid glue.

[0036] Taking the following samples as an example to further determine the weight relationship between the pulling force of the solid glue, the porosity of the solid glue, and the ionic viscosity. Table 2 is the data table of the porosity, ionic viscosity, and pulling force yield rate of the solid glue;

[0037] Table 2 Data Table of Porosity, Ionic Viscosity, and Pulling Force Yield Rate of Solid Glue

[0038]

[0039] As can be seen from Table 2, when the porosity is 7%, as the ionic viscosity ranges from 0 to 0.6, the yield rate decreases by 12%; when the ionic viscosity is 0, as the porosity ranges from 7% to 0%, the yield rate decreases by 34%. Thus, it can be known that in the pulling test of Solid Glue ORT, the decision-making power of porosity is greater than that of ionic viscosity, and it can be further determined to be 2 to 3 times that of ionic viscosity.

[0040] In view of the above analysis, based on the ionic viscosity and the porosity of the solid glue to predict the reference coefficient of the pulling force of the solid glue, and based on the reference coefficient of the pulling force of the solid glue, a relationship formula between the reference coefficient of the pulling force of the solid glue and the porosity and ionic viscosity can be established; further, the reference coefficient of the pulling force of the solid glue has a linear relationship with the porosity, and the reference coefficient of the pulling force of the solid glue also has a linear relationship with the ionic viscosity.

[0041] The relationship formula between the reference coefficient of the pulling force of the solid glue of the present application and the porosity and ionic viscosity is shown in (Ⅰ):

[0042] Reference coefficient of solid glue pulling force = D × porosity + (1 - D) × ionic viscosity (Ⅰ);

[0043] Among them, 50% < D < 100%;

[0044] The measured value range of the porosity is 0 - 8%;

[0045] The measured value range of the ionic viscosity is 0.6 - 0.

[0046] Further, D can be selected as 60%, 70%, 80%, or 90%. In specific embodiments, the D is specifically selected from 60% and 70%.

[0047] Further, the measured value of the porosity is converted into a standard value corresponding to the porosity, and the set range is 0 to 10; the measured value of the ionic viscosity is converted into a standard value corresponding to the ionic viscosity, and the set range is 0 to 10.

[0048] Therefore, according to the above relationship, it is possible to predict whether the pull-out force of the solid adhesive meets the standard based on the measured values of the porosity and the ionic viscosity; in this application, when the numerical value of the reference coefficient of the pull-out force can be determined to be > 6 according to the standard values of the porosity and the ionic viscosity after the above conversion, the pull-out force of the solid adhesive meets the standard, and the process yield can be improved.

[0049] According to this application, after the pull-out force of the solid adhesive is predicted, it is then practically applied. Specifically, this application also provides a method for bonding a solid adhesive, where the solid adhesive is used to bond a first component and a second component, and the bonding method includes:

[0050] Extract a number of solid adhesive test samples from a batch of solid adhesives;

[0051] Predict the pull-out force of the solid adhesive test samples according to the prediction method of the pull-out force of the solid adhesive in the above solution to determine whether the pull-out force of the solid adhesive meets the standard;

[0052] Determine whether the proportion of the solid adhesive test samples with a pull-out force meeting the standard among the several solid adhesive test samples is greater than a threshold value;

[0053] If the proportion of the solid adhesive test samples with a pull-out force meeting the standard is greater than or equal to the threshold value, then the solid adhesive is a qualified solid adhesive; if the proportion of the solid adhesive test samples with a pull-out force meeting the standard is less than the threshold value, then repeat the above steps for another batch of solid adhesives until the proportion of the solid adhesive test samples with a pull-out force meeting the standard in the another batch of solid adhesives is greater than or equal to the threshold value;

[0054] Use the qualified solid adhesive to bond the first component and the second component.

[0055] Specifically as Figure 5 shown, the solid adhesive is used to bond the first component and the second component, that is, the solid adhesive is bonded between the first component and the second component. Before bonding the solid adhesive, it is also necessary to further determine whether the solid adhesive meets the standard: first, extract a number of solid adhesives from a batch of solid adhesives as test samples, and predict the pull-out force of the several solid adhesive test samples according to the above prediction method to determine whether the pull-out force of the solid adhesive meets the standard.

[0056] After determining whether the pulling force of the solid glue meets the standard, calculate the proportion of the solid glue that meets the standard in this batch of solid glue. Specify the threshold of the above proportion according to actual needs. The range of the threshold can be 70% to 99%. If the above proportion is greater than or equal to the above threshold, use this batch of solid glue to bond the first component and the second component. If the above proportion is less than the above threshold, repeat the above prediction and judgment steps for the next batch of solid glue until qualified solid glue is obtained to realize the bonding of the first component and the second component by the solid glue.

[0057] The step of bonding the first component and the second component with the batch of solid glue includes, in sequence, film tearing - fitting - preheating - film tearing - heating - complete fitting - curing, specifically:

[0058] Remove the first protective film of the solid glue to expose the first glue surface of the solid glue, and fit the first glue surface of the solid glue with the first component to obtain a fitting intermediate;

[0059] Use a first pressing head to preheat the fitting intermediate to make the solid glue fit tightly with the first component, and remove the second protective film of the solid glue to expose the second glue surface of the solid glue;

[0060] Fit the second glue surface of the solid glue with the second component to obtain a fitting body, and use a second pressing head to heat the fitting body to make the first component and the second component fit completely with the solid glue;

[0061] Let the fitting body heated by the second pressing head stand still to cure the solid glue.

[0062] In the above process, the first pressing head includes a first upper pressing head and a first lower pressing head, and the second pressing head includes a second upper pressing head and a second lower pressing head; the temperature range of the first upper pressing head is 65°C to 75°C, the temperature range of the first lower pressing head is 25°C to 35°C, the pressure range between the first upper pressing head and the first lower pressing head is 100 Kg to 120 Kg, and the time range for the first pressing head to preheat the bonding intermediate is 8 s to 12 s; the temperature range of the second upper pressing head is 85°C to 95°C, the temperature range of the second lower pressing head is 95°C to 105°C, the pressure range between the second upper pressing head and the second lower pressing head is 107 Kg to 127 Kg, and the time range for using the second pressing head to heat the bonded body is 40 s to 60 s; further, the temperature range of the first upper pressing head is 68°C to 72°C, the temperature range of the first lower pressing head is 28°C to 32°C, the pressure range between the first upper pressing head and the first lower pressing head is 105 Kg to 115 Kg, and the time range for the first pressing head to preheat the bonding intermediate is 9 s to 11 s; the temperature range of the second upper pressing head is 88°C to 92°C, the temperature range of the second lower pressing head is 98°C to 102°C, the pressure range between the second upper pressing head and the second lower pressing head is 110 Kg to 120 Kg, and the time range for using the second pressing head to heat the bonded body is 45 s to 55 s.

[0063] For the curing, specifically, the first component, the solid glue, and the second component are left standing to wait for the cross-linking of the activated solid glue to achieve the optimal bonding. The time range for the standing is 1 h to 3 h, and more specifically 1.5 h to 2.5 h.

[0064] The present application provides a method for predicting the pulling force of a solid glue. By testing the true density and resistivity of the solid glue, the porosity and ionic viscosity are calculated to predict whether the pulling force of the solid glue meets the standard; further, in the present application, the porosity and ionic viscosity of the solid glue are combined with weight distribution to obtain a relational expression between the reference coefficient of the pulling force of the solid glue and the porosity and ionic viscosity, so as to predict whether the pulling force meets the standard. This method can efficiently detect the quality of the incoming materials and ultimately improve the yield of the solid glue.

[0065] To further understand the present application, the following will specifically describe the method for predicting the pulling force of the solid glue and the bonding method of the solid glue provided by the present application in combination with embodiments. The protection scope of the present application is not limited by the following embodiments.

[0066] Implementation groups 1 - 5

[0067] Test the true density and resistivity of several solid glues to obtain the porosity and ionic viscosity of the several solid glues, and the results are as Figures 8 to 12 shown;

[0068] Based on the above porosity and ionic viscosity, the relationship for the pull-out reference coefficient of the solid glue in Implementation Group 1 is determined as = 60% * porosity + 40% * ionic viscosity, and the relationship for the pull-out reference coefficient of the solid glue in Implementation Group 2 is = 70% * porosity + 30% * ionic viscosity, the relationship for the pull-out reference coefficient of the solid glue in Implementation Group 3 is = 50% * porosity + 50% * ionic viscosity, the relationship for the pull-out reference coefficient of the solid glue in Implementation Group 4 is = 40% * porosity + 60% * ionic viscosity, and the relationship for the pull-out reference coefficient of the solid glue in Implementation Group 5 is = 30% * porosity + 70% * ionic viscosity. That is, for Implementation Groups 1 - 5, the D values in relationship (Ⅰ) correspond to 60%, 70%, 50%, 40%, and 30% respectively.

[0069] Figure 8 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Implementation Group 1 Figure 9 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Implementation Group 2 Figure 10 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Implementation Group 3 Figure 11 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Implementation Group 4 Figure 12 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for Implementation Group 5; Figures 9 to 12 It respectively lists the porosity, ionic viscosity, pull-out force yield rate, formula-related parameters, values calculated by the formula, predicted results, and actual test results of the solid glue corresponding to different embodiments. Based on the above description of the prediction method, values can be calculated according to the porosity, ionic viscosity, and formula-related parameters, that is, the pull-out reference coefficient of the solid glue. If the value > 6, it indicates that the solid glue is qualified. At the same time, the actual pull-out force of the solid glue in the above experimental groups was detected according to the existing method, that is, the actual test results. According to Figure 8 、 Figure 9 It can be seen that when the formula-related parameter D is 60% and 70%, the prediction method provided by this application is completely consistent with the actual test results, indicating that the prediction method provided by this application has a high accuracy rate; according to Figure 10 、 Figure 11 and Figure 12 , it can be seen from the different values of the formula-related parameter D that when the value of D gradually increases from 30% to 60%, the accuracy of the predicted results gradually improves.

[0070] Comparison Groups 1 - 2

[0071] The steps are the same as those of the implementation group prediction method, with the difference that the parameters corresponding to the porosity and ionic viscosity have both changed. The relationship formula for the pulling reference coefficient of the solid glue in comparison group 1 is determined as = 100% * porosity + 0% * ionic viscosity, and the relationship formula for the pulling reference coefficient of the solid glue in comparative group 2 is = 0% * porosity + 100% * ionic viscosity. That is, for comparison groups 1 - 2, the D values in relationship formula (Ⅰ) are 100% and 0% respectively. The results are as Figures 13 to 14 shown.

[0072] Figure 13 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for comparison group 1, Figure 14 Data table of the porosity, ionic viscosity, predicted results, and measured results of the solid glue provided for comparison group 2; Figures 13 to 14 It lists respectively the porosity, ionic viscosity, pulling force yield rate, formula - related parameters, values calculated by the formula, predicted results, and actual test results of the solid glue corresponding to different comparative examples. Based on the above description of the prediction method, values can be calculated according to the porosity, ionic viscosity, and formula - related parameters, that is, the pulling reference coefficient of the solid glue. If the value > 6, it indicates that the solid glue is qualified. At the same time, the actual pulling force of the solid glue in the above experimental group was detected according to the existing method, that is, the actual test results. According to Figure 13 , Figure 14 It can be seen that when the values of the formula - related parameter D are 100% and 0% respectively, the predicted results deviate greatly from the actual test results. Therefore, the pulling force of the solid glue in this application is related to the porosity and ionic viscosity of the solid glue. Considering only one of them will inevitably affect the accuracy of the prediction method for the pulling force of the solid glue.

[0073] Example 3

[0074] 200 solid glues were taken out from a batch of solid glues as test samples;

[0075] According to the method of implementation group 1, it was predicted whether the pulling reference coefficient of the above - mentioned test samples was > 6. After calculation, 181 test samples with qualified pulling force in the test samples (more than the threshold of 80%) were obtained, and this batch of solid glue was qualified;

[0076] The first protective film of this batch of solid glue was removed to expose the first glue surface of the solid glue, and the first glue surface of the solid glue was adhered to the first component to obtain an adhered intermediate;

[0077] Preheat the bonding intermediate using a first indenter to closely bond the solid adhesive to the first component, and remove the second protective film of the solid adhesive to expose the second adhesive surface of the solid adhesive; the temperature of the upper indenter of the first indenter is 70°C, the temperature of the lower indenter is 30°C, the pressure between the upper and lower indenters is 110 Kg, and preheat for 10 s;

[0078] Bond the second adhesive surface of the solid adhesive to the second component to obtain a bonded body, and heat the bonded body using a second indenter to completely bond the first component and the second component to the solid adhesive; the temperature of the upper indenter of the second indenter is 90°C, the temperature of the lower indenter is 100°C, the pressure between the upper and lower indenters is 117 Kg, and the heating time is 50 s;

[0079] Let the bonded body stand still for 2 h to allow the solid adhesive to stand still, so that the solid adhesive cures.

[0080] The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

[0081] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for predicting the pulling force of a solid glue, comprising the following steps: Measure the true density of the solid glue to obtain the porosity of the solid glue; Perform dielectric curing measurement on the solid glue to obtain the ionic viscosity of the solid glue; Based on the porosity of the solid glue and the ionic viscosity of the solid glue, predict whether the pulling force of the solid glue meets the standard; The step of predicting whether the pulling force of the solid glue meets the standard based on the porosity of the solid glue and the ionic viscosity of the solid glue includes: Predict the reference coefficient of the pulling force of the solid glue based on the ionic viscosity and the porosity of the solid glue; Based on the reference coefficient of the pulling force of the solid glue, establish a relationship between the reference coefficient of the pulling force of the solid glue, the porosity, and the ionic viscosity, and predict whether the pulling force of the solid glue meets the standard; In the step of establishing a relationship between the reference coefficient of the pulling force of the solid glue, the porosity, and the ionic viscosity, and predicting whether the pulling force of the solid glue meets the standard, the relationship is as shown in (Ⅰ): Reference coefficient of the pulling force of the solid glue = D × porosity + (1 - D) × ionic viscosity (Ⅰ); where, 50% < D < 100%; The measured value range of the porosity is 0 to 8%; The measured value range of the ionic viscosity is 0.6 to 0.

2. The prediction method according to claim 1, wherein In the step of measuring the true density of the solid glue to obtain the porosity of the solid glue, it further includes: Measure the true density of the solid glue to obtain the actual volume of the solid glue; Measure the theoretical volume of the solid glue; According to the following formula, calculate the porosity of the solid glue; Porosity = 1 - (actual volume / theoretical volume).

3. The prediction method according to claim 1, wherein The ionic viscosity is the resistivity of the solid glue obtained from the dielectric curing measurement.

4. The prediction method according to claim 1, wherein, In the step of establishing a relationship between the reference coefficient of the pulling force of the solid glue, the porosity, and the ionic viscosity, the reference coefficient of the pulling force of the solid glue and the porosity are linearly related, and the reference coefficient of the pulling force of the solid glue and the ionic viscosity are linearly related.

5. The prediction method according to claim 1, wherein, The measured value of the porosity is converted into the standard value corresponding to the porosity, and the set range is 0 to 10; the measured value of the ionic viscosity is converted into the standard value corresponding to the ionic viscosity, and the set range is 0 to 10.

6. The prediction method according to claim 5, wherein The step of establishing a relationship between the reference coefficient of the pulling force of the solid glue, the porosity, and the ionic viscosity, and predicting whether the pulling force of the solid glue meets the standard further includes: Obtain the numerical value of the reference coefficient of the pulling force of the solid glue according to the relationship, and determine that if the numerical value of the reference coefficient of the pulling force of the solid glue > 6, it is determined that the pulling force of the solid glue meets the standard.

7. A bonding method for a solid glue, the solid glue is used for bonding a first component and a second component, and the bonding method includes: Extract several solid glue test samples from a batch of solid glue; Use the method for predicting the pulling force of the solid glue according to any one of claims 1 to 6 to predict the pulling force of the solid glue test samples to determine whether the pulling force of the solid glue meets the standard; Determine whether the proportion of the solid glue test samples with the draw force meeting the standard among the several solid glue test samples is greater than the threshold value; If the proportion of the solid glue test samples with the draw force meeting the standard is greater than or equal to the threshold value, then the solid glue test samples are qualified solid glue; If the proportion of the solid glue test samples with the draw force meeting the standard is less than the threshold value, then repeat the above steps for another batch of solid glue until the proportion of the solid glue test samples with the draw force meeting the standard in the another batch of solid glue is greater than or equal to the threshold value; Bond the first component and the second component using the qualified solid glue.

8. The laminating method according to claim 7, wherein, The solid glue includes a first protective film and a second protective film, and the step of bonding the first component and the second component using the qualified solid glue includes: Remove the first protective film of the solid glue to expose the first glue surface of the solid glue, and attach the first glue surface of the solid glue to the first component to obtain a bonded intermediate; Preheat the bonded intermediate using a first press head to make the solid glue closely attached to the first component, and remove the second protective film of the solid glue to expose the second glue surface of the solid glue; Attach the second glue surface of the solid glue to the second component to obtain a bonded body, and heat the bonded body using a second press head to make the first component and the second component completely attached to the solid glue; Let the bonded body heated by the second press head stand still to cure the solid glue.

9. The lamination method according to claim 8, wherein, The first press head includes a first upper press head and a first lower press head, and the second press head includes a second upper press head and a second lower press head. In the step of preheating the bonded intermediate using the first press head, the temperature range of the first upper press head is 65°C to 75°C, the temperature range of the first lower press head is 25°C to 35°C, the pressure range between the first upper press head and the first lower press head is 100 Kg to 120 Kg, and the preheating time range of the bonded intermediate by the first press head is 8 s to 12 s; In the step of heating the bonded body using the second press head, the temperature range of the second upper press head is 85°C to 95°C, the temperature range of the second lower press head is 95°C to 105°C, the pressure range between the second upper press head and the second lower press head is 107 Kg to 127 Kg, and the heating time range of the bonded body by the second press head is 40 s to 60 s.

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