Electronic device and heat dissipation assembly thereof

Abstract

The application provides an electronic device and a heat dissipation assembly thereof, the heat dissipation assembly comprising a heat source device, a thermal interface material, a shielding support, a shielding plate and a heat sink, the shielding support being installed around the heat source device and being provided with a slot on a side away from the heat source device, the thermal interface material being connected with the heat source device on one side and being connected with the shielding plate on a side away from the heat source device through the slot, and the shielding plate being arranged between the shielding support and the heat sink. Compared with the prior art, the electronic device and the heat dissipation assembly thereof provided by the application reduce the thermal resistance between the heat source device and the heat sink, improve the heat dissipation effect of the heat source device, and save material cost and assembly cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation assembly, in particular to an electronic equipment and a heat dissipation assembly thereof. BACKGROUND

[0002] With the advent of the 5G communication era, the power density of electronic equipment (such as CPE, router, PC and other electronic products) increases rapidly, which leads to a severe over-temperature risk of the working temperature of related electronic devices. Statistics show that more than 50% of the failure of electronic products is caused by over-temperature. Therefore, it is of great significance to maintain electronic devices within a certain working temperature range by using an efficient heat dissipation method to improve product reliability and user experience. For 5G CPE, 5G router and other data flow products, in order to prevent the interference of integrated circuit signals in the chip with the antenna, resulting in that the product data flow cannot meet the design requirements, a shielding cover is needed to shield the signals of the chip on the board. However, a large amount of heat is generated during the working process of the high-power chip, which makes the temperature of the position where the chip is installed locally high. In order to ensure the performance of the chip and the stable operation of the electronic equipment, the heat generated by the chip needs to be dissipated in time. Therefore, it is necessary to improve the heat dissipation efficiency of the chip while shielding the chip.

[0003] At present, in the heat dissipation assembly of electronic equipment, the chip is installed on the circuit board and covered by the shielding cover, and the heat sink is arranged outside the shielding cover. Heat interface material is usually arranged between the chip and the shielding cover, and heat interface material is also arranged between the shielding cover and the heat sink. The heat generated by the chip needs to pass through the heat interface material, the shielding cover and the heat interface material in sequence to reach the heat sink. Therefore, the heat generated by the chip needs to pass through the three layers of medium to be transmitted to the heat sink, and there is a problem of excessive thermal resistance in the heat dissipation path, which leads to low heat dissipation efficiency. SUMMARY

[0004] The present application provides a heat dissipation assembly, which comprises a heat source device, a heat interface material, a shielding support, a shielding plate and a heat sink. The shielding support is installed around the heat source device and is provided with a slot on the side away from the heat source device. One side of the heat interface material is connected with the heat source device, and the other side thereof is connected with the shielding plate through the slot. The shielding plate is arranged between the shielding support and the heat sink.

[0005] In addition, the present application also provides an electronic equipment, which comprises a heat dissipation assembly and the heat dissipation assembly according to any one of the above embodiments.

[0006] The electronic device and the heat dissipation assembly thereof provided by the application cover the slot of the shielding support by the shielding plate, form a closed cavity with the shielding support, effectively shield the device, reduce the shielding cover and the thermal interface material between the shielding cover and the heat dissipation assembly in the prior art, reduce the thickness of the thermal interface material, and reduce the thermal resistance of the thermal interface material. The technical scheme of the application solves the technical problem that the excessive thickness of the thermal interface material causes the excessive thermal resistance and affects the heat dissipation effect of the heat source device in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the technical scheme in the embodiments of the application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0008] Figure 1 is a structural schematic view of a heat dissipation assembly in the prior art;

[0009] Figure 2 is a heat conduction path schematic view of a heat dissipation assembly in the prior art;

[0010] Figure 3 is a structural front view schematic view of an embodiment of the heat dissipation assembly of the application;

[0011] Figure 4 is a top view schematic view of a partial structure of an embodiment of the heat dissipation assembly of the application;

[0012] Figure 5 is a partial structure sectional view schematic view of an embodiment of the electronic device of the application; DETAILED DESCRIPTION

[0013] The application will be further described in detail in combination with the drawings and embodiments. It is particularly pointed out that the following embodiments are only used to illustrate the application, but do not limit the scope of the application. Similarly, the following embodiments are only some embodiments of the application, but not all embodiments of the application, and all other embodiments obtained by those skilled in the art without any creative effort are within the protection scope of the application.

[0014] All directional indications (such as upper, lower, left, right, front, rear, etc.) contained in the present application are merely used for convenience of description, and thus they are not intended to limit the present application to a particular orientation. The terms "comprises", "comprising", "includes", "including", "has", "having" and their conjugates mean "including but not limited to". The term "consisting of" means "including and limited to". The term "consisting essentially of" means that the composition, method or process can include additional steps, components, elements, etc., but only if such additional steps, components, elements, etc. do not materially affect the basic and novel characteristics of the composition, method or process. Any process, method, article, or apparatus that is described herein can comprise, consist essentially of, or consist of the steps, components, elements, etc. described herein, in any combination, and / or any process, method, article, or apparatus that includes the steps, components, elements, etc. described herein, in any combination.

[0015] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all directed to the same embodiment, or to a common embodiment. It is expressly understood that any of the embodiments described herein can be incorporated into any other embodiment in any combination.

[0016] As used herein, "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive / send communication signals over a wired line (e.g., through a public switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or over a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate over a wireless interface can be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that can combine a cellular radiotelephone with data processing, facsimile, and data communications capabilities; PDA's that can include a wireless radio telephone, wireless router, CPE (Customer Premise Equipment) pager, Internet / intranet access, Web browser, organizer, calendar, and / or a global positioning system (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices that include a wireless radio telephone transceiver. CPE is an electronic device configured with a wireless communication module.

[0017] The shielding cover of the heat dissipation assembly in the prior art is usually made of metal and has a small thickness and a small thermal resistance, and the thermal conductivity of the thermal interface material is generally low, and the thermal resistance of the thermal interface material is the main thermal resistance value on the heat dissipation path. The thermal resistance of the thermal interface material is in a positive relationship with the thickness, and therefore, under the premise of not affecting the shielding effect, reducing the thickness and the thermal resistance of the thermal interface material is an important direction for improving the heat dissipation effect of the heat dissipation assembly.

[0018] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of a heat dissipation assembly in the prior art, Figure 2 is a schematic diagram of a heat conduction path of a heat dissipation assembly in the prior art. Figure 1 The shielding support 130 is fixed on the PCB 170, and the heat source device 110 to be shielded is covered inside, the shielding support 130 is provided with a slot on the side far away from the heat source device 110 in the normal projection area of the heat source device 110, the shielding support 130 is covered with a shielding cover 140, one side of the thermal interface material 120 is in contact with the heat source device 110, and the other side is in contact with the shielding cover 140 through the slot, the thermal interface material 150 is arranged between the shielding cover 140 and the heat sink 160 and is in contact with the surface of the shielding cover 140 facing the heat sink 160 and the surface of the heat sink 160 facing the shielding cover 140. The heat conduction path from the heat source device 110 to the heat sink 160 is composed of three parts, including the thermal interface material 120, the shielding cover 140 and the thermal interface material 150. Among them, the shielding cover 140 is a metal material and is generally thin, and therefore has a low thermal resistance. The thermal conductivity of the thermal interface material 120 and the thermal interface material 150 is low, the base material is an organic silicon polymer, and the common thermal conductivity range is 3-8 W / K.m, and the higher the thermal conductivity, the cost will sharply increase, so in many mass production products, the thermal conductivity of the thermal interface material is still 3 W / K.m; on the other hand, due to the constraint of the height of other devices nearby, the height of the shielding cover is generally more than 1.5 mm, which leads to a very thick thermal interface material between the PCB and the inner wall of the shielding cover, and the thermal resistance of the thermal interface material is in a positive relationship with the thickness, and therefore the thermal resistance value of the thermal interface material is large and is the main thermal resistance value on the heat dissipation path.

[0019] Therefore, the embodiment of the present application provides a structure of a heat dissipation assembly, please refer to Figure 3 and Figure 4 , Figure 3 is a structural front view schematic diagram of an embodiment of the heat dissipation assembly of the present application,

[0020] Figure 4is a top view schematic diagram of a partial structure of an embodiment of the heat dissipation assembly. It should be noted that the heat dissipation assembly in the present application can be used in electronic devices including CPE (Customer Premise Equipment), routers, computers, etc. The heat dissipation assembly in the present embodiment includes, but is not limited to, a heat source device 210, a thermal interface material 220, a shielding bracket 230, a shielding plate 240, a heat sink 250, and a PCB board 260.

[0021] Specifically, the heat source device 210 is arranged on a component surface of the PCB board 260 and is fixedly connected to a pad on the PCB board 260 through a bottom pad. The heat source device 210 is a chip package structure. The heat source device 210 includes, but is not limited to, a system-on-a-chip (SOC), an application processor (AP), a double data rate (DDR), a universal flash storage (UFS), a central processing unit (CPU), a graphics processing unit (GPU), a CPU mos tube, a GPU power supply inductor, or a video random access memory (VRAM), etc., and the present application does not make a specific limitation thereon.

[0022] The PCB board 260 is used to arrange electronic components and realize electrical connection between multiple electronic components. The PCB board 260 can be a hard circuit board, a flexible circuit board, or a soft and hard combined circuit board. The PCB board 260 can adopt an FR-4 medium board, a Rogers medium board, a mixed medium board of FR-4 and Rogers, etc. Here, FR-4 is a code of a fire-resistant material grade, and the Rogers medium board is a high-frequency board.

[0023] In order to prevent the integrated circuit signal inside the heat source device 210 from interfering with external signals, the signal of the heat source device 210 needs to be shielded, and therefore the shielding bracket 230 is installed around the heat source device 210. The shielding bracket 230 includes a bracket top plate 231 and a bracket side wall 232.

[0024] In some embodiments, the support top plate 231 can be a structural member as a whole or can be assembled by multiple parts. The support side wall 232 can be a structural member as a whole or can be assembled by multiple parts. The support side wall 232 and the support top plate 231 can be connected by welding, bonding or the like, or can be integrally formed, that is, the support side wall 232 and the support top plate 231 are a structural member as a whole, which is not specifically limited here.

[0025] The support side wall 232 is fixed vertically on the PCB board 260 by welding or conductive adhesive bonding, and surrounds the heat source device 210, and the support top plate 231 is located at the end of the support side wall 232 away from the PCB board 260, and the included angle between the support top plate 231 and the support side wall 232 is 90°.

[0026] The length, width and height of the shielding support 230 are determined according to the layout structure of the PCB board 260 and the device, and can be any size and shape, not limited to a cuboid. The shielding support 230 is composed of metal or metal alloy materials, including aluminum alloy, stainless steel, copper alloy, or is composed of carbon-based materials with shielding effect, including graphene skeleton materials.

[0027] The heat source device 210 is located inside the cavity formed by the shielding support 230 and does not contact the shielding support 230. The support top plate 231 of the shielding support 230 is provided with a slot 2301, and the slot 2301 is located in the normal projection area of the heat source device 210. The slot 2301 adopts the same or similar shape as the heat source device 210, and the area of the slot 2301 is not less than 80% of the area of the heat source device 210.

[0028] The shielding plate 240 is located outside the shielding support 230 away from the heat source device 210, and the shielding plate 240 adopts the same or similar shape as the slot 2301, and the area of the shielding plate 240 is greater than the area of the slot 2301 and covers the slot 2301 completely. The shielding plate 240, the shielding support 230 and the PCB board 260 form a closed cavity. When the heat source device 210 works, electromagnetic waves are radiated to the surrounding, and when the electromagnetic waves meet the shielding support 230 or the shielding plate 240, part of them is reflected back, and part of them is absorbed by the shielding support 230 or the shielding plate 240, so that the electric field is terminated on the surface of the shielding support 230 or the shielding plate 240. Similarly, when the electromagnetic waves emitted by the external device reach the shielding support 230 or the shielding plate 240, they are also shielded, thereby achieving shielding of the heat source device 210.

[0029] The shielding plate 240 is composed of a shielding layer 241 and a glue layer 242. The shielding layer 241 of the shielding plate 240 is a soft metal or carbon-based material with a shielding effect and good ductility, including any one of graphene, graphite sheet, copper, aluminum, titanium, and magnesium. The shielding layer 241 can be deformed without being damaged when subjected to pressure. The area of the shielding layer 241 is greater than that of the slot 2301 and completely covers the slot 2301.

[0030] The glue layer 242 of the shielding plate 240 includes two parts, one part covers the surface of the shielding layer 241 close to the heat sink 250, and the other part covers the surface of the shielding layer 241 close to the shielding support 230. The glue layer 242 is a material with high-temperature glue properties, including organic silicone-based glue and temperature-resistant epoxy glue material, which can withstand temperatures above 85°C. The glue layer 242 firmly bonds the shielding plate 240 between the shielding support 230 and the heat sink 250.

[0031] The thermal interface material 220 is arranged between the heat source device 210 and the shielding plate 240. One side of the thermal interface material 220 is in contact with the heat source device 210, and the other side away from the heat source device 210 is in contact with the shielding plate 240 through the slot 2301. The thermal interface material 220 is used to conduct heat from the heat source device 210 to the shielding plate 240.

[0032] The thermal interface material 220 is composed of a polymer and a thermal conductive filler. Common polymer matrices of the thermal interface material 220 include organic silicon, epoxy resin, polyurethane, polyisobutylene, and resin-based composite materials, etc. The polymer has high flexibility and insulation characteristics, but the thermal conductivity of the general polymer material is relatively low. The addition of the thermal conductive filler improves the thermal conductivity of the polymer. The thermal conductive filler has high thermal conductivity and high electrical insulation, mainly including carbon-based materials such as amorphous carbon, graphite, diamond, carbon nanotubes, and graphene, and ceramic-based materials such as boron nitride (BN), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), magnesium oxide (MgO), aluminum oxide (Al2O3), and silicon oxide (SiO2), etc.

[0033] The thermal interface material 220 has compression and rebound characteristics and is in a compressed state with a compression amount of 20%-50% of the thickness, giving the shielding plate 240 a normal stress. Under the action of the pressure, the shielding plate 240 and the heat sink 250 can be in full contact, reducing the contact thermal resistance between the shielding plate 240 and the heat sink 250.

[0034] The heat sink 250 is located on the side of the shielding plate 240 away from the shielding support 230, and tightly presses the shielding plate 240 on the shielding support 230, so that the shielding plate 240 and the shielding support 230 can be in close contact, and the shielding effect is ensured. The heat sink 250 is composed of a base plate 251 and heat sink teeth 252, and the connection mode of the base plate 251 and the heat sink teeth 252 can be bonding, welding or one-piece injection molding. Alternatively, the heat sink 250 in the embodiment can be processed from a high-thermal-conductivity metal material, and the thermal conductivity coefficient is generally higher than 50 W / m.K, such as aluminum and aluminum alloy, copper and copper alloy, magnesium and magnesium alloy, etc. The heat sink 250 can also be a high-thermal-conductivity graphite, graphite sheet or other synthetic material. In addition, the base plate 251 of the heat sink 250 can also be a uniform heating plate structure, and the heat sink teeth 252 are combined with the base plate 251 by bonding, interference fit or welding.

[0035] The structure in the embodiment of the application has the following heat dissipation path: when the heat source device 210 works, the heat dissipated by the heat source device 210 is conducted to the shielding plate 240 through the thermal interface material 220, the shielding plate 240 conducts the heat to the heat sink 250, and the heat sink 250 diffuses the heat into the cooling fluid, so that the heat conduction and heat dissipation of the heat source device 210 are realized. The thermal interface material 220 is in a compressed state, and has a normal stress on the heat source device 210 and the shielding plate 240, so that the contact between different interfaces from the heat source device 210 to the heat sink 250 is more sufficient, and the contact thermal resistance is reduced.

[0036] The heat dissipation assembly provided by the embodiment of the application replaces the shielding cover in the prior art and the thermal interface material between the shielding cover and the heat sink, reduces the thickness of the thermal interface material, and uses the compression and rebound characteristics of the thermal interface material between the shielding plate and the heat source device to make the contact between the shielding plate and the heat sink more sufficient and close. In actual production and processing, the PCB, the heat source device, the shielding cover and the heat sink all have certain tolerances, which can cause different interfaces to be unable to be in close contact, and affect the heat dissipation effect. Compared with the prior art which needs two layers of thermal interface materials to eliminate the tolerances between the heat source device and the heat sink, the application can eliminate the tolerances by using one layer of thermal interface material, reduce the thickness of the thermal interface material and the contact thermal resistance, further reduce the thermal resistance on the heat transfer path from the heat source device to the heat sink, and reduce the material cost and the assembly cost.

[0037] Further, the embodiment of the application also provides an electronic device, wherein the electronic device in the embodiment can be a CPE, a router, a computer or the like. Please refer to Figure 5 , Figure 5is a partial structure section view schematic diagram of an embodiment of the electronic device. The electronic device in the embodiment takes CPE as an example, and includes a heat dissipation assembly 200 and a shell 300. The shell 300 is formed with a containing cavity 301, and the heat dissipation assembly 200 is arranged in the containing cavity 301 of the shell 300. The bottom of the shell 300 is provided with an air inlet hole 310, and the top of the shell 300 is provided with an air outlet hole 320.

[0038] The air inlet hole 310 and the air outlet hole 320 are used for the cooling air to enter and exit the electronic device. The air inlet hole 310 and the air outlet hole 320 are not necessarily arranged at the bottom and the top of the shell 300, but also can be arranged at the side of the shell 300 or any other position or form. In order to make the electronic device more beautiful, the air inlet hole and the air outlet hole can not exist.

[0039] When the electronic device works, the heat dissipated by the heat source device 210 of the heat dissipation assembly 200 is conducted to the shielding plate 240 of the heat dissipation assembly 200 through the thermal interface material 220 of the heat dissipation assembly 200, the shielding plate 240 further conducts the heat to the heat dissipator 250 of the heat dissipation assembly 200, and the heat dissipator 250 further diffuses the heat to the cooling air.

[0040] The electronic device in the embodiment of the present application reduces the thickness of the thermal interface material under the premise of ensuring the shielding effect, further reduces the thermal resistance on the heat transfer path from the heat source device to the heat dissipator, and improves the heat dissipation efficiency of the electronic device.

[0041] The above only describes some embodiments of the present application, and does not limit the protection scope of the present application. Any equivalent device or equivalent flow conversion, or direct or indirect application in other related technical fields, which is made by using the content of the specification and drawings of the present application, is also included in the patent protection scope of the present application.

Claims

1. A heat dissipating assembly, characterized by, The heat source device, the heat interface material, the shielding support, the shielding plate and the heat sink are included. The shielding support is installed around the heat source device and is provided with a slot on the side away from the heat source device. The slot is located in the normal projection area of the heat source device and has an area not less than 80% of the area of the heat source device. One side of the heat interface material is connected with the heat source device and the other side is connected with the shielding plate through the slot. The shielding plate is arranged between the shielding support and the heat sink. The shielding plate includes a shielding layer and a glue layer, the shielding layer is made of soft metal, and the shielding plate is bonded with the shielding support and the heat sink through the glue layer.

2. The heat dissipating assembly of claim 1, wherein, The heat sink is located on the side of the shielding plate away from the shielding support and has a pressure on the shielding plate to tightly press the shielding plate on the shielding support.

3. The heat dissipating assembly of claim 2, wherein, The heat interface material has compression and rebound characteristics and is in a compressed state with a compression amount of 20%-50% of the thickness.

4. The heat dissipating assembly of claim 1, wherein, The heat interface material provides a normal stress on the shielding plate to ensure sufficient contact between the shielding plate and the heat sink.

5. The heat dissipation assembly of claim 1, wherein, The heat dissipation assembly further includes a PCB, and the shielding support is fixed on the PCB by welding or conductive glue.

6. An electronic device, comprising: The shielding plate completely covers the slot and forms a closed cavity with the shielding support and the PCB to shield the magnetic field generated by the heat source device. The shielding layer is made of any one of copper, aluminum, titanium and magnesium. The heat sink includes a base plate and heat dissipation teeth extending towards the base plate away from the shielding support. The electronic device includes the heat dissipation assembly of any one of claims 1-5.

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