Refrigerator and control method thereof

Abstract

The present invention provides a refrigerator and a control method thereof, wherein the refrigerator has an oxygen processing device, which is used to generate oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of the storage space of the refrigerator, and the control method includes: obtaining the temperature of the oxygen processing device; judging whether the temperature of the oxygen processing device exceeds a preset safety threshold; if so, determining the desired heat dissipation path of the oxygen processing device; and delivering a low-temperature airflow to the oxygen processing device along the desired heat dissipation path. Since the low-temperature airflow can be delivered to the oxygen processing device in a direction along a fixed flow path, the heat dissipation efficiency of the oxygen processing device can be improved by adopting the solution of the present invention.

Description

Technical Field

[0001] The invention relates to a controlled atmosphere freshness-keeping technology, and in particular to a refrigerator and a control method thereof. Background Art

[0002] Controlled atmosphere preservation technology is a technology that extends the storage life of food by adjusting the gas composition of the environment. Refrigeration and freezing devices with controlled atmosphere preservation function are widely favored. Among the many gas components, oxygen has attracted much attention. The oxygen processing device can process the oxygen in the working environment to produce oxygen-deficient gas or oxygen-rich gas, thereby playing a role in regulating the oxygen content.

[0003] The inventors have realized that some oxygen processing devices in the prior art use electrochemical reactions to process oxygen, and the electrochemical reaction process generates heat, causing the temperature of the oxygen processing device to rise, thereby creating safety hazards. Therefore, how to reduce the safety risks caused by the electrochemical reaction of the oxygen processing device has become a technical problem that needs to be solved urgently by those skilled in the art.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] An object of the present invention is to overcome at least one technical defect in the prior art and to provide a refrigerator and a control method thereof.

[0006] A further object of the present invention is to reduce the safety risks caused by electrochemical reactions in oxygen processing devices.

[0007] Another further object of the present invention is to improve the heat dissipation efficiency of the oxygen processing device.

[0008] A further object of the present invention is to reduce or avoid interference between the heat dissipation process and the gas conditioning process of the oxygen processing device.

[0009] In particular, according to one aspect of the present invention, a control method of a refrigerator is provided, the refrigerator having an oxygen processing device for generating oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of a storage space of the refrigerator, and the control method comprises:

[0010] obtaining the temperature of the oxygen processing device;

[0011] Determining whether the temperature of the oxygen processing device exceeds a preset safety threshold;

[0012] If yes, determining a desired heat dissipation path of the oxygen processing device;

[0013] A low temperature air flow is delivered to the oxygen processing device along the desired heat dissipation path.

[0014] Optionally, the oxygen processing device has a plurality of preset heat dissipation paths, each of which is connected to the oxygen processing device and the low-temperature space in the refrigerator; and

[0015] The step of determining a desired heat dissipation path of the oxygen processing device comprises:

[0016] Acquire the current working mode of the oxygen processing device;

[0017] The desired heat dissipation path corresponding to the current operation mode of the oxygen processing device is determined from the plurality of heat dissipation paths.

[0018] Optionally, the working mode of the oxygen processing device is preset with an oxygen reduction mode for generating oxygen-depleted gas and an oxygen increase mode for generating oxygen-rich gas; the heat dissipation path of the oxygen processing device includes a first path and a second path, the first path is connected to the oxygen processing device and the low-oxygen space in the refrigerator, and the second path is connected to the oxygen processing device and the high-oxygen space in the refrigerator; and

[0019] The step of determining the desired heat dissipation path corresponding to the current working mode of the oxygen processing device from the plurality of heat dissipation paths comprises:

[0020] When the current working mode of the oxygen processing device is the oxygen reduction mode, determining the first path as the expected heat dissipation path;

[0021] When the current working mode of the oxygen processing device is the oxygen enrichment mode, the second path is determined as the expected heat dissipation path.

[0022] Optionally, the refrigerator comprises an oxygen reduction fan, which is used to promote airflow circulation between the low oxygen space and the oxygen processing device when the oxygen processing device operates in the oxygen reduction mode; and

[0023] In the case where the first path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path includes: increasing the rotation speed of the oxygen reduction fan.

[0024] Optionally, the refrigerator further comprises a refrigeration system and an air supply fan, the refrigeration system comprises a compressor and an evaporator, and the air supply fan is used to force the heat exchange air flow passing through the evaporator to flow to the low oxygen space; and

[0025] While increasing the rotation speed of the oxygen reduction fan, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path also includes:

[0026] Determining that the compressor is in operation;

[0027] The frequency of the compressor is increased, and the rotation speed of the air supply fan is increased.

[0028] Optionally, the second path is in a blocked state when the oxygen processing device starts to operate in the oxygen enrichment mode; and

[0029] In the case where the second path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path includes: unblocking the second path.

[0030] Optionally, after the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path, the method further includes:

[0031] Obtaining a heating rate of the oxygen processing device;

[0032] Determining whether the heating rate of the oxygen processing device is greater than a preset first rate threshold;

[0033] If so, the operating state of the oxygen processing device is adjusted to reduce its heat generation rate.

[0034] Optionally, the step of adjusting the operating state of the oxygen processing device includes:

[0035] determining desired electrical parameters of the oxygen processing device;

[0036] The oxygen processing device is operated according to the desired electrical parameters.

[0037] Optionally, after the step of adjusting the operating state of the oxygen processing device to reduce its heat generation rate, the method further comprises:

[0038] obtaining again the heating rate of the oxygen processing device;

[0039] Determining whether the heating rate of the oxygen processing device is greater than a preset second rate threshold;

[0040] If yes, a fault prompt signal is output.

[0041] According to another aspect of the present invention, a refrigerator is provided, the refrigerator having an oxygen processing device for generating oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of the storage space of the refrigerator, and the refrigerator further comprising:

[0042] A processor and a memory, wherein a machine executable program is stored in the memory, and when the machine executable program is executed by the processor, it is used to implement the control method according to any one of the above items.

[0043] The refrigerator and control method thereof of the present invention monitor the temperature of the oxygen processing device, and when the temperature of the oxygen processing device exceeds a preset safety threshold, determine the expected heat dissipation path of the oxygen processing device, and transmit a low-temperature airflow to the oxygen processing device along the expected heat dissipation path, so as to utilize the low-temperature airflow to exchange heat with the oxygen processing device, thereby reducing the safety risks caused by the electrochemical reaction of the oxygen processing device.

[0044] Furthermore, when the refrigerator and control method thereof of the present invention delivers a low-temperature airflow to the oxygen processing device along a desired heat dissipation path, since the low-temperature airflow can be directionally delivered to the oxygen processing device along a fixed flow path, the heat dissipation efficiency of the oxygen processing device can be improved by adopting the solution of the present invention.

[0045] Furthermore, the refrigerator and control method thereof of the present invention, since the heat dissipation process and gas conditioning process of the oxygen processing device respectively need to contact with the external air, by obtaining the current working mode of the oxygen processing device and determining the heat dissipation path corresponding to the current working mode of the oxygen processing device as the expected heat dissipation path, the heat dissipation process and gas conditioning process of the oxygen processing device can reduce or avoid mutual interference.

[0046] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0048] Figure 1 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention;

[0049] Figure 2 is a schematic block diagram of a refrigerator according to an embodiment of the present invention;

[0050] Figure 3 is a schematic structural diagram of an oxygen processing device of a refrigerator according to an embodiment of the present invention;

[0051] Figure 4 yes Figure 3 A schematic exploded view of an oxygen handling device of a refrigerator shown;

[0052] Figure 5 is a schematic perspective view of a refrigerator according to one embodiment of the present invention;

[0053] Figure 6 is a schematic diagram of a partial structure of a refrigerator according to an embodiment of the present invention;

[0054] Figure 7 is a schematic diagram of a refrigerator control method according to an embodiment of the present invention;

[0055] Figure 8 is a control flow chart of a refrigerator according to an embodiment of the present invention. DETAILED DESCRIPTION

[0056] Reference will now be made in detail to embodiments of the present invention, one or more examples of which are illustrated in the accompanying drawings. The various embodiments provided are intended to explain the present invention, not to limit the present invention. In fact, it will be apparent to those skilled in the art that various modifications and variations may be made to the present invention without departing from the scope or spirit of the present invention. For example, a feature illustrated or described as a part of one embodiment may be used together with another embodiment to produce yet another embodiment. Therefore, the present invention is intended to cover such modifications and variations within the scope of the appended claims and their equivalents.

[0057] Refer to the following Figures 1 to 8 Unless otherwise clearly and specifically defined, when a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0058] In the description of the present embodiment, the description with reference to the terms "one embodiment", "some embodiments", "an example", "some examples", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] The embodiment of the present invention first provides a refrigerator 20 . Figure 1 is a schematic structural diagram of a refrigerator 20 according to an embodiment of the present invention. The refrigerator 20 of the embodiment of the present invention should be understood in a broad sense, and can be a refrigeration device with a low-temperature storage function such as a refrigerator, a freezer, a freezer or a refrigerator. The refrigerator 20 generally includes a processor 110 and a memory 120, and can further include a box 600. The interior of the box 600 defines a storage space 610 for storing food.

[0060] Figure 2is a schematic block diagram of a refrigerator 20 according to an embodiment of the present invention. The refrigerator 20 of this embodiment may further include an oxygen processing device 300, which is used to generate oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of the storage space 610 of the refrigerator 20. For example, the oxygen processing device 300 can generate oxygen through an electrochemical reaction under the action of a working voltage, thereby serving as an oxygen supply source for the storage space 610. Of course, in another example, the oxygen processing device 300 can also consume oxygen through an electrochemical reaction under the action of a working voltage to reduce the oxygen content of the storage space 610.

[0061] In one example, the refrigerator 20 may have multiple storage spaces 610, and at least one storage space 610 is a low oxygen space for creating a low oxygen fresh-keeping atmosphere, and at least one storage space 610 is a high oxygen space for creating a high oxygen fresh-keeping atmosphere. The oxygen processing device 300 can be connected to the low oxygen space airflow to consume the oxygen in the space, and can also be connected to the high oxygen space airflow to provide oxygen to the space.

[0062] Figure 3 is a schematic structural diagram of an oxygen processing device 300 of a refrigerator 20 according to an embodiment of the present invention, Figure 4 yes Figure 3 Schematic exploded view of the oxygen processing device 300 of the refrigerator 20 shown. In some optional embodiments, the oxygen processing device 300 may include a shell 320, a cathode plate 330 and an anode plate 340. The shell 320 has a lateral opening 321. For example, the shell 320 can be in the shape of a flat rectangular parallelepiped. The lateral opening 321 can be set on any surface of the shell 320, such as the top surface, the bottom surface or the side surface. In one example, the lateral opening 321 can be set on the surface of the shell 320 with the largest area.

[0063] The cathode plate 330 is disposed at the side opening 321 to define together with the housing 320 an electrolysis chamber for containing electrolyte and for consuming oxygen through electrochemical reaction under the action of the electrolysis voltage. Under the action of the electrolysis voltage, oxygen in the air can undergo a reduction reaction at the cathode plate 330, i.e., O2+2H2O+4e - →4OH - .

[0064] The anode plate 340 and the cathode plate 330 are disposed in the electrolysis chamber at intervals, and are used to provide reactants to the cathode plate 330 and generate oxygen through electrochemical reactions. - An oxidation reaction may occur at the anode plate 340 and generate oxygen, namely: 4OH - →O2+2H2O+4e -. An exhaust hole 323 may be provided on the shell 320 for discharging the oxygen generated by the anode plate 340, for example, to any storage space 610. The exhaust hole 323 may be connected to the high oxygen space through a pipeline. A liquid replenishment port 322 may also be provided on the shell 320, and the liquid replenishment port 322 may be connected to an external liquid source through a pipeline, so that the liquid from the external liquid source can flow into the electrolysis chamber to achieve liquid replenishment. In one example, the cathode plate 330 may be connected to the airflow of the low oxygen space to utilize the oxygen from the low oxygen space as a reactant for the electrochemical reaction.

[0065] The above examples of electrochemical reactions of the cathode plate 330 and the anode plate 340 are merely illustrative. Based on the understanding of the above embodiments, those skilled in the art should be able to easily change the type of electrochemical reaction, or expand the structure of the oxygen treatment device 300 suitable for other types of electrochemical reactions. These changes and expansions should all fall within the scope of protection of the present invention.

[0066] The oxygen processing device 300 may be disposed in the refrigerator 20. In one example, the oxygen processing device 300 may be disposed outside the storage space 610.

[0067] In some further examples, the oxygen processing device 300 can be disposed in a foaming layer or a compressor chamber of the refrigerator 20 and connected to the storage space 610 through a pipeline to transport the generated oxygen to the storage space 610 or provide oxygen to the storage space 610. Figure 5 2 is a schematic perspective view of a refrigerator 20 according to an embodiment of the present invention, showing the internal structure of the refrigerator 20 from a side view. Figure 5 The oxygen processing device 300 shown is disposed in the foaming layer of the refrigerator 20 and is connected to the storage space 610 via a ventilation pipeline 700 .

[0068] Figure 6 It is a schematic diagram of a partial structure of a refrigerator 20 according to an embodiment of the present invention, showing an oxygen processing device 300, a storage space 610, a ventilation pipeline 700 and an oxygen reduction fan 500, and the arrow direction in the figure shows the airflow direction.

[0069] In one example, at least one storage space 610 may be a refrigerated space, and the oxygen processing device 300 may be disposed in the refrigerated space.

[0070] The memory 120 and the processor 110 can form a part of the main control board of the refrigerator 20. The memory 120 stores a machine executable program 121, which is used to implement the control method of the refrigerator 20 of any of the following embodiments when executed by the processor 110. The processor 110 can be a central processing unit (CPU), or a digital processing unit (DSP), etc. The memory 120 is used to store the program executed by the processor 110. The memory 120 can be any medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to this. The memory 120 can also be a combination of various memories 120. Since the machine executable program 121 implements the various processes of the following method embodiments when executed by the processor 110, and can achieve the same technical effect, it will not be repeated here to avoid repetition.

[0071] Figure 7 is a schematic diagram of a control method for a refrigerator 20 according to an embodiment of the present invention. The control method for the refrigerator 20 may generally include the following steps:

[0072] Step S702 , obtaining the temperature of the oxygen processing device 300 . For example, the refrigerator 20 may further include a temperature sensor, which is disposed on the oxygen processing device 300 and is used to detect the temperature of the oxygen processing device 300 .

[0073] Step S704, determine whether the temperature of the oxygen processing device 300 exceeds a preset safety threshold, if so, execute the following step S706. The safety threshold can be set according to the reasonable temperature required for the oxygen processing device 300 to perform an electrochemical reaction and / or the safe temperature that the oxygen processing device 300 and its surrounding environment can withstand. When the temperature of the oxygen processing device 300 does not exceed the preset safety threshold, the oxygen processing device 300 can perform an electrochemical reaction normally, and will not cause safety risks to itself and its surrounding environment due to the electrochemical reaction.

[0074] Step S706, determining the desired heat dissipation path of the oxygen processing device 300. The desired heat dissipation path of the oxygen processing device 300 refers to the desired flow path of the low-temperature airflow. By determining the desired heat dissipation path of the oxygen processing device 300, the low-temperature airflow can flow to the oxygen processing device 300 quickly and in large quantities.

[0075] Step S708: delivering low-temperature airflow along the desired heat dissipation path to the oxygen processing device 300. By determining the desired heat dissipation path of the oxygen processing device 300 and delivering the low-temperature airflow along the desired heat dissipation path to the oxygen processing device 300, the low-temperature airflow can be delivered to the oxygen processing device 300 in a directionally manner along the desired heat dissipation path.

[0076] By using the above method, the temperature of the oxygen processing device 300 is monitored, and when the temperature of the oxygen processing device 300 exceeds a preset safety threshold, the desired heat dissipation path of the oxygen processing device 300 is determined, and a low-temperature airflow is delivered to the oxygen processing device 300 along the desired heat dissipation path, so as to utilize the low-temperature airflow to exchange heat with the oxygen processing device 300, thereby reducing the safety risk caused by the electrochemical reaction of the oxygen processing device 300.

[0077] When the low-temperature airflow is delivered to the oxygen processing device 300 along the desired heat dissipation path, since the low-temperature airflow can be directionally delivered to the oxygen processing device 300 along a fixed flow path, the heat dissipation efficiency of the oxygen processing device 300 can be improved by adopting the solution of the embodiment of the present invention.

[0078] The oxygen processing device 300 may have multiple heat dissipation paths preset. In step S706, the desired heat dissipation path may be selected from the preset multiple heat dissipation paths. When the desired heat dissipation path is determined from the multiple heat dissipation paths, and the low-temperature airflow is delivered to the oxygen processing device 300 along the desired heat dissipation path, since the flow path of the low-temperature airflow can be flexibly selected, the solution of the embodiment of the present invention can improve the flexibility of the heat dissipation process of the oxygen processing device 300, and facilitate the selection of an appropriate heat dissipation method according to actual conditions.

[0079] In some optional embodiments, the oxygen processing device 300 is preset with multiple heat dissipation paths, each heat dissipation path connecting the oxygen processing device 300 and the low-temperature space in the refrigerator 20. The oxygen processing device 300 can have multiple working modes preset, and they are set one by one corresponding to the heat dissipation paths of the oxygen processing device 300. That is, each heat dissipation path is set corresponding to a working mode. In each working mode, the oxygen processing device 300 is respectively set with a corresponding air conditioning path, and exchanges air with the storage space 610 to be regulated through the air conditioning path.

[0080] In one example, the heat dissipation path and the air conditioning path corresponding to each working mode may be arranged in isolation from each other.

[0081] In one example, the low temperature space may refer to a low oxygen space, a high oxygen space, or any other space with a lower temperature.

[0082] The step of determining the desired heat dissipation path of the oxygen processing device 300 includes: acquiring the current working mode of the oxygen processing device 300, and determining the desired heat dissipation path corresponding to the current working mode of the oxygen processing device 300 from multiple heat dissipation paths.

[0083] Since the heat dissipation process and the gas conditioning process of the oxygen processing device 300 respectively need to contact with the external gas, by using the above method, by obtaining the current working mode of the oxygen processing device 300, and determining the heat dissipation path corresponding to the current working mode of the oxygen processing device 300 as the expected heat dissipation path, the heat dissipation process and the gas conditioning process of the oxygen processing device 300 can be reduced or avoided. Interference with each other.

[0084] In some optional embodiments, the working mode of the oxygen processing device 300 is preset with an oxygen reduction mode for generating oxygen-depleted gas and an oxygen increase mode for generating oxygen-enriched gas. The heat dissipation path of the oxygen processing device 300 includes a first path and a second path, the first path connects the oxygen processing device 300 and the low-oxygen space in the refrigerator 20, and the second path connects the oxygen processing device 300 and the high-oxygen space in the refrigerator 20. The low-oxygen space may refer to a storage space 610 that creates a low-oxygen fresh-keeping atmosphere by reducing the oxygen content. The high-oxygen space may refer to any other space except the low-oxygen space, for example, it may refer to a storage space 610 that creates a high-oxygen fresh-keeping atmosphere by increasing the oxygen content, or it may refer to an installation cavity for installing an evaporator.

[0085] The step of determining the expected heat dissipation path corresponding to the current operating mode of the oxygen processing device 300 from multiple heat dissipation paths includes: when the current operating mode of the oxygen processing device 300 is the oxygen reduction mode, determining the first path as the expected heat dissipation path; when the current operating mode of the oxygen processing device 300 is the oxygen increase mode, determining the second path as the expected heat dissipation path.

[0086] When the current working mode of the oxygen processing device 300 is the oxygen reduction mode, since the airflow needs to circulate between the low oxygen space and the oxygen processing device 300 to achieve ventilation, and the low oxygen space is in a low temperature state, the first path is determined as the desired heat dissipation path, so that the oxygen processing device 300 can be cooled during the oxygen reduction process. The oxygen reduction process and the temperature reduction process can be carried out simultaneously via the same path, complementing each other.

[0087] When the current working mode of the oxygen processing device 300 is the oxygen enrichment mode, since oxygen needs to be delivered to the storage space 610 to be adjusted, the oxygen-rich gas will flow unidirectionally to the storage space 610 to be adjusted, and there is no need to adjust the oxygen content of the low oxygen space. At this time, determining the second path as the desired heat dissipation path can reduce or avoid the adverse effect of the heat dissipation process of the oxygen processing device 300 on the temperature state of the low oxygen space.

[0088] Of course, it should be noted that the oxygen processing device 300 can obviously perform oxygen reduction and oxygen increase at the same time. At this time, the heat dissipation path corresponding to the current working mode of the oxygen processing device 300 is the first path.

[0089] In some optional embodiments, the refrigerator 20 includes an oxygen reduction fan 500, which is used to promote airflow circulation between the low-oxygen space and the oxygen processing device 300 when the oxygen processing device 300 operates in the oxygen reduction mode.

[0090] When the first path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device 300 along the desired heat dissipation path includes: increasing the rotation speed of the oxygen reduction fan 500. Under the action of the oxygen reduction fan 500, the low-temperature airflow in the low-oxygen space flows along the first path to the oxygen processing device 300 to exchange heat with the oxygen processing device 300, thereby reducing the temperature of the oxygen processing device 300.

[0091] Under normal circumstances, when the oxygen treatment device 300 starts to operate in the oxygen reduction mode, the oxygen reduction fan 500 can operate at a preset speed. When the speed of the oxygen reduction fan 500 is increased, the ventilation rate between the low oxygen space and the oxygen treatment device 300 can be accelerated, so that the oxygen treatment device 300 frequently exchanges heat with a large amount of low temperature airflow, thereby quickly eliminating the safety risks caused by the electrochemical reaction of the oxygen treatment device 300.

[0092] The oxygen reduction blower 500 may be disposed on the first path. In one example, the first path may be defined by a ventilation pipeline 700 connected between the hypoxic space and the oxygen processing device 300 .

[0093] In some optional embodiments, the refrigerator 20 further has a refrigeration system and an air supply fan. The refrigeration system may be a compression refrigeration system. The refrigeration system may generally include a compressor, a condenser, a throttling device, and an evaporator, which are connected in series to form a refrigeration circuit. The refrigeration system may utilize the refrigerant to absorb heat in the evaporator to undergo a phase change, thereby providing cooling for the storage space 610.

[0094] The air supply fan can be installed in the installation cavity together with the evaporator, and is used to force the heat exchange air flow passing through the evaporator to flow to the low oxygen space.

[0095] While increasing the speed of the oxygen reduction fan 500, the step of delivering the low-temperature airflow to the oxygen processing device 300 along the desired heat dissipation path also includes: determining that the compressor is in operation, increasing the frequency of the compressor, and increasing the speed of the air supply fan.

[0096] When the evaporator delivers heat exchange airflow to the low oxygen space, the installation cavity where the evaporator is located is indirectly connected to the oxygen processing device 300. Using the above method, when delivering low-temperature airflow to the oxygen processing device 300 along the first path, on the one hand, the speed of the oxygen reduction fan 500 is increased, and on the other hand, the frequency of the compressor and the speed of the air supply fan are increased, which can further increase the heat exchange between the low-temperature airflow per unit flow and the oxygen processing device 300, so that the oxygen processing device 300 frequently and efficiently exchanges heat with a large amount of low-temperature airflow, thereby more quickly eliminating the safety risks caused by the electrochemical reaction of the oxygen processing device 300.

[0097] In some optional embodiments, when the speed of the oxygen reduction fan 500 is increased, if the compressor is not in operation, that is, if the compressor has not yet met the start-up conditions, the air supply fan can be operated at a preset maximum speed. At the same time, the start-up conditions of the compressor can be adjusted, for example, the start-up point of the storage space 610 can be lowered by 1 to 3°C, so that the compressor starts when the temperature of the storage space 610 rises to the start-up point.

[0098] In some optional embodiments, the second path is blocked when the oxygen treatment device 300 starts to operate in the oxygen enrichment mode. That is, the second path is normally closed. For example, the second path may extend from the oxygen treatment device 300 to the hyperoxia space. A damper may be provided at the end of the second path or between the ends thereof, and the damper is controlled to move to block or clear the second path.

[0099] When the second path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device 300 along the desired heat dissipation path includes: unblocking the second path. In the step of unblocking the second path, the damper can be controlled to switch the second path from a blocked state to an unblocked state.

[0100] By using the above method, when the oxygen processing device 300 operates in the oxygen enrichment mode, since there is no need to use the first path to dissipate heat, it is possible to reduce or avoid the oxygen processing device 300 from damaging the fresh-keeping atmosphere of the low-oxygen space due to heat dissipation.

[0101] In some optional embodiments, the high oxygen space may refer to a mounting cavity for mounting an evaporator. After the second path is unblocked, the low temperature airflow around the evaporator can be used to cool the oxygen processing device 300, and the heat of the oxygen processing device 300 can be used to defrost the evaporator.

[0102] The oxygen processing device 300 can be arranged outside the storage space 610 of the refrigerator 20, for example, in the foaming layer, or in the compressor room. A pipeline can be connected between the installation cavity where the evaporator is located and the oxygen processing device 300 to achieve airflow communication.

[0103] In some optional embodiments, after the step of delivering a low-temperature airflow to the oxygen processing device 300 along a desired heat dissipation path, the control method may further include: obtaining the heating rate of the oxygen processing device 300, determining whether the heating rate of the oxygen processing device 300 is greater than a preset first rate threshold, and if so, adjusting the operating state of the oxygen processing device 300 to reduce its heat generation rate.

[0104] After taking the above cooling measures, by further obtaining the temperature rise rate of the oxygen processing device 300, it can be evaluated whether the above cooling measures can achieve the desired risk control effect. If the temperature rise rate of the oxygen processing device 300 is greater than the preset first rate threshold, it indicates that the above cooling measures still cannot effectively reduce the safety risk caused by the electrochemical reaction of the oxygen processing device 300. At this time, it is necessary to adjust the operating state of the oxygen processing device 300 to further enhance the risk control effect.

[0105] In the step of adjusting the working state of the oxygen processing device 300, in order to reduce its heat generation rate, the oxygen processing device 300 can be switched from the working mode to the standby mode to stop the electrochemical reaction.

[0106] In some optional embodiments, the step of adjusting the operating state of the oxygen processing device 300 includes: determining the desired electrical parameters of the oxygen processing device 300, and operating the oxygen processing device 300 according to the desired electrical parameters. That is, by adjusting the electrical parameters of the oxygen processing device 300, the heat generation rate of the oxygen processing device 300 is further reduced.

[0107] The electrical parameters of the oxygen processing device 300 may include any one of the following parameters or a combination thereof: operating voltage, operating current, and operating resistance. The refrigerator 20 may further include a power supply circuit for providing an operating voltage to the oxygen processing device 300. The operating voltage of the oxygen processing device 300 is the electrolysis voltage provided by the power supply circuit to the oxygen processing device 300.

[0108] By adjusting the electrical parameters of the oxygen processing device 300, the speed of the electrochemical reaction rate of the oxygen processing device 300 can be adjusted, thereby adjusting the temperature of the oxygen processing device 300. For example, when the working voltage or working current of the oxygen processing device 300 is reduced, the electrochemical reaction rate of the oxygen processing device 300 can be reduced, thereby reducing the temperature of the oxygen processing device 300.

[0109] In some optional embodiments, a power supply is further provided on the power supply circuit. The step of determining the desired electrical parameters of the oxygen processing device 300 includes: determining the desired reduction of the voltage output value of the power supply to reduce the operating voltage of the oxygen processing device 300.

[0110] In one example, the power supply can be integrated on the main control board of the refrigerator 20. By adjusting the operating parameters of the main control board, the voltage output value of the power supply can be adjusted. The expected reduction in the voltage output value of the power supply refers to the difference between the preset voltage output value and the expected voltage output value of the power supply.

[0111] In a further example, the expected reduction in the voltage output value of the power supply may be any value within a range of 40% to 80%, for example, 50%.

[0112] In some optional embodiments, after the step of delivering the low-temperature airflow to the oxygen processing device 300 along the desired heat dissipation path and before the step of adjusting the operating state of the oxygen processing device 300, the control method may further include: further increasing the frequency of the compressor and further increasing the speed of the air supply fan. For example, the frequency of the compressor and the speed of the air supply fan may be increased in stages until the frequency of the compressor reaches a preset maximum value and the speed of the air supply fan reaches a preset maximum value.

[0113] In some optional embodiments, after the step of adjusting the operating state of the oxygen processing device 300 to reduce its heat generation rate, the control method may further include: obtaining the temperature rise rate of the oxygen processing device 300 again, determining whether the temperature rise rate of the oxygen processing device 300 is greater than a preset second rate threshold, and if so, outputting a fault prompt signal. The second rate threshold may be equal to the first rate threshold, or may be less than the first rate threshold.

[0114] After the step of adjusting the operating state of the oxygen processing device 300 to reduce its heat generation rate, if the heating rate of the oxygen processing device 300 is still greater than the preset second rate threshold, it indicates that the above cooling measures have not achieved the desired risk control effect, the power supply circuit fails, and the electrical parameters of the oxygen processing device 300 cannot be adjusted according to the preset method.

[0115] By using the above method, when it is determined that the safety risk caused by the electrochemical reaction of the oxygen processing device 300 cannot be effectively reduced, the user can be promptly reminded to repair the control fault of the power supply circuit by outputting a fault prompt signal.

[0116] In some optional embodiments, the refrigerator 20 can achieve higher technical effects by further optimizing and configuring the above steps. The control method of the refrigerator 20 of this embodiment is described in detail below in combination with the introduction to the optional execution process of this embodiment. This embodiment is only an example of the execution process. During the specific implementation, the execution order and operating conditions of some steps can be modified according to the specific implementation requirements.

[0117] Figure 82 is a control flow chart of a refrigerator 20 according to an embodiment of the present invention. The control flow generally may include the following steps:

[0118] Step S802, obtaining the temperature of the oxygen processing device 300.

[0119] Step S804, determining whether the temperature of the oxygen processing device 300 exceeds a preset safety threshold, if so, executing step S806, if not, executing step S802.

[0120] Step S806, obtaining the current working mode of the oxygen processing device 300.

[0121] Step S808 : determining a desired heat dissipation path corresponding to the current working mode of the oxygen processing device 300 from the multiple heat dissipation paths.

[0122] Step S810: delivering low-temperature airflow to the oxygen processing device 300 along a desired heat dissipation path.

[0123] Step S812, obtaining the heating rate of the oxygen processing device 300.

[0124] Step S814, determining whether the heating rate of the oxygen treatment device 300 is greater than a preset first rate threshold, if so, executing step S816, if not, executing step S826.

[0125] Step S816, determining the desired electrical parameters of the oxygen processing device 300;

[0126] Step S818: operating the oxygen processing device 300 according to the desired electrical parameters.

[0127] Step S820, obtaining the heating rate of the oxygen processing device 300 again.

[0128] Step S822, determining whether the heating rate of the oxygen treatment device 300 is greater than a preset second rate threshold, if so, executing step S824, if not, executing step S826.

[0129] Step S824, outputting a fault prompt signal.

[0130] Step S826, when the temperature of the oxygen processing device 300 drops below a preset safety threshold, the cooling measure is terminated, that is, the above control process is stopped.

[0131] By using the above method, the temperature of the oxygen processing device 300 is monitored, and when the temperature of the oxygen processing device 300 exceeds a preset safety threshold, the desired heat dissipation path of the oxygen processing device 300 is determined, and a low-temperature airflow is delivered to the oxygen processing device 300 along the desired heat dissipation path, so as to utilize the low-temperature airflow to exchange heat with the oxygen processing device 300, thereby reducing the safety risk caused by the electrochemical reaction of the oxygen processing device 300.

[0132] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A control method for a refrigerator, wherein the refrigerator has an oxygen processing device, wherein the oxygen processing device is used to generate oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of a storage space of the refrigerator, and the control method comprises: obtaining the temperature of the oxygen processing device; Determining whether the temperature of the oxygen processing device exceeds a preset safety threshold; If yes, determining a desired heat dissipation path of the oxygen processing device; delivering a low temperature airflow to the oxygen processing device along the desired heat dissipation path; There are multiple heat dissipation paths preset for the oxygen processing device, each of which is connected to the oxygen processing device and the low-temperature space in the refrigerator; and The step of determining a desired heat dissipation path of the oxygen processing device comprises: Acquire the current working mode of the oxygen processing device; determining the desired heat dissipation path corresponding to the current operating mode of the oxygen processing device from the plurality of heat dissipation paths; The working mode of the oxygen processing device is preset with an oxygen reduction mode for generating oxygen-deficient gas and an oxygen increase mode for generating oxygen-rich gas; the heat dissipation path of the oxygen processing device includes a first path and a second path, the first path is connected to the oxygen processing device and the low-oxygen space in the refrigerator, and the second path is connected to the oxygen processing device and the high-oxygen space in the refrigerator; and The step of determining the desired heat dissipation path corresponding to the current working mode of the oxygen processing device from the plurality of heat dissipation paths comprises: When the current working mode of the oxygen processing device is the oxygen reduction mode, determining the first path as the expected heat dissipation path; When the current working mode of the oxygen processing device is the oxygen enrichment mode, the second path is determined as the expected heat dissipation path.

2. The control method according to claim 1, wherein: The refrigerator comprises an oxygen reduction fan, and the oxygen reduction fan is used to promote airflow circulation between the low oxygen space and the oxygen processing device when the oxygen processing device operates in the oxygen reduction mode; and In the case where the first path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path includes: increasing the rotation speed of the oxygen reduction fan.

3. The control method according to claim 2, wherein: The refrigerator further comprises a refrigeration system and an air supply fan, wherein the refrigeration system comprises a compressor and an evaporator, and the air supply fan is used to force the heat exchange air flow passing through the evaporator to flow to the low oxygen space; and While increasing the rotation speed of the oxygen reduction fan, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path also includes: Determining that the compressor is in operation; The frequency of the compressor is increased, and the rotation speed of the air supply fan is increased.

4. The control method according to claim 1, wherein: The second path is in a blocked state when the oxygen processing device starts to operate in the oxygen enrichment mode; and In the case where the second path is determined as the desired heat dissipation path, the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path includes: unblocking the second path.

5. The control method according to claim 1, after the step of delivering the low-temperature airflow to the oxygen processing device along the desired heat dissipation path, further comprising: Obtaining a heating rate of the oxygen processing device; Determining whether the heating rate of the oxygen processing device is greater than a preset first rate threshold; If so, the operating state of the oxygen processing device is adjusted to reduce its heat generation rate.

6. The control method according to claim 5, wherein: The step of adjusting the operating state of the oxygen processing device comprises: determining desired electrical parameters of the oxygen processing device; The oxygen processing device is operated according to the desired electrical parameters.

7. The control method according to claim 5, after the step of adjusting the operating state of the oxygen processing device to reduce its heat generation rate, further comprising: obtaining again the heating rate of the oxygen processing device; Determining whether the heating rate of the oxygen processing device is greater than a preset second rate threshold; If yes, a fault prompt signal is output.

8. A refrigerator, comprising an oxygen processing device for generating oxygen-depleted gas or oxygen-rich gas through an electrochemical reaction to adjust the oxygen content of a storage space of the refrigerator, and further comprising: A processor and a memory, wherein a machine executable program is stored in the memory, and when the machine executable program is executed by the processor, it is used to implement the control method according to any one of claims 1-7.

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