Light-emitting module, display device and control method of control circuit

Abstract

The present application provides a control method for a light-emitting module, a display device and a control circuit. The light-emitting module includes a substrate, a light-emitting component, a heat transfer component and a control circuit. The substrate has multiple partitions; the light-emitting component is arranged on one side of the substrate; the light-emitting component includes a driving chip layer and multiple light-emitting chips arranged on the side of the driving chip layer away from the substrate; the driving chip layer includes multiple driving chips; wherein multiple heat transfer components are arranged between the substrate and the driving chip layer; the heat transfer component is located in the partition and is arranged one-to-one with the partition, and is used to dissipate heat or heat the driving chip in the partition; the control circuit is connected to the heat transfer component, and is used to control the operation of the heat transfer component separately. By controlling the heat transfer component to dissipate heat or heat the light-emitting chip separately through the control circuit, and performing regional management and control, the heating conditions of the driving chip and the light-emitting chip in the partition can be handled in a targeted manner, and the service life of the light-emitting chip and the control accuracy of the driving chip layer can also be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting module, a display device, and a control method of a control circuit. Background Art

[0002] Currently, more and more display products use Mini-LED (Mini-light-emitting diode) as the backlight display. Mini-LED adopts a direct-down and small-pitch lamp bead design, and realizes regional dimming in a smaller range through a large number of dense distribution. Compared with the traditional backlight design, it can have better brightness uniformity and higher color contrast within a smaller mixing distance, which can realize ultra-thin design of terminal products and save energy.

[0003] The LED of Miniled backlight is greatly affected by temperature. Temperature plays a vital role in the photoelectric properties and life of the LED. Mini-LED backlight products will generate a lot of heat during operation, which greatly reduces the life of the lamp beads. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a control method for a light-emitting module, a display device and a control circuit, so as to solve the problem in the prior art that the life of lamp beads is shortened due to the influence of temperature.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide a light-emitting module, the light-emitting module comprising:

[0006] a base plate having a plurality of partitions;

[0007] A light-emitting component is arranged on one side of the substrate; the light-emitting component comprises a driving chip layer and a plurality of light-emitting chips arranged on a side of the driving chip layer away from the substrate; the driving chip layer comprises a plurality of driving chips;

[0008] Among them, it also includes:

[0009] A plurality of heat transfer components, wherein the heat transfer components are arranged between the substrate and the driver chip layer; the heat transfer components are located in the partitions and are arranged one-to-one with the partitions, and are used to dissipate heat or heat the driver chips in the partitions;

[0010] The control circuit is connected to the heat transfer component and is used to independently control the operation of the heat transfer component.

[0011] Wherein, it also includes a plurality of first temperature sensors arranged between the substrate and the light-emitting component, the first temperature sensors are located in the partitions and are arranged one-to-one corresponding to the partitions.

[0012] Wherein, the control circuit comprises:

[0013] a sensing module, configured to obtain the temperature of the driving chip in the partition through the first temperature sensor;

[0014] A comparison module, used for comparing the temperature of the driving chip with a preset value;

[0015] The heat transfer module controls the heat transfer component in the corresponding partition to dissipate heat or heat the driver chip according to the comparison result of the comparison module.

[0016] Wherein, the preset value includes a first temperature preset value and a second temperature preset value, and the first temperature preset value is greater than the second temperature preset value; and the heat transfer module is further used for:

[0017] In response to the temperature of the driver chip being greater than or equal to the first preset temperature value, controlling the heat transfer component in the corresponding partition to dissipate heat for the driver chip;

[0018] In response to the temperature of the driver chip being less than or equal to the second temperature preset value, controlling the heat transfer component in the corresponding partition to heat the driver chip;

[0019] In response to the temperature of the driving chip being less than the first preset temperature value and greater than the second preset temperature value, the heat transfer component in the corresponding partition is controlled not to work.

[0020] Wherein, the control circuit comprises:

[0021] An algorithm control module, used to obtain the light-emitting parameters of the light-emitting chip; the light-emitting parameters include the cumulative conduction time of the light-emitting chip;

[0022] A comparison module, used for comparing the light emitting parameter with a preset value;

[0023] The heat transfer module controls the heat transfer component in the corresponding partition to dissipate heat for the driver chip according to the comparison result of the comparison module.

[0024] Wherein, a second temperature sensor is further included, which is arranged on a side of the substrate away from the light-emitting component and is used to sense the ambient temperature; the control circuit includes:

[0025] A storage module stores a corresponding relationship between the ambient temperature and the preset value;

[0026] A sensing module, configured to sense the ambient temperature through the second temperature sensor;

[0027] An algorithm control module, used for acquiring the light-emitting parameters of the light-emitting chip; the light-emitting parameters include the cumulative conduction time of the light-emitting chip;

[0028] A comparison module, selecting a corresponding preset value according to the ambient temperature sensed by the sensing module, and comparing the light emitting parameter with the preset value;

[0029] The heat transfer module controls the heat transfer component in the corresponding partition to dissipate heat for the driver chip according to the comparison result of the comparison module.

[0030] The light-emitting parameters include the cumulative conduction time of the light-emitting chip corresponding to the area of ​​the heavy-loaded screen displayed by the display device of the light-emitting module.

[0031] Wherein, the heat transfer component includes a semiconductor cooling plate; the light-emitting chip is an inorganic light-emitting diode or an organic light-emitting diode.

[0032] In order to solve the above technical problem, the second technical solution provided in the present application is: to provide a display device, wherein the display device includes the above light-emitting module.

[0033] In order to solve the above technical problems, the third technical solution provided by the present application is: to provide a control method of a control circuit, wherein the control method is used to control the above control circuit; the control method of the control circuit includes:

[0034] Acquire parameters of the light-emitting component; the parameters include the temperature of the driving chip in the partition or the light-emitting parameters of the light-emitting chip;

[0035] Comparing the size of the parameter with a preset value;

[0036] According to the comparison result between the parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat or heat the driver chip.

[0037] Beneficial effects of the present application: Different from the prior art, the present application provides a control method for a light-emitting module, a display device and a control circuit, wherein the light-emitting module includes a substrate, a light-emitting component, a heat transfer component and a control circuit, wherein the substrate has multiple partitions; the light-emitting component is arranged on one side of the substrate; the light-emitting component includes a driving chip layer and multiple light-emitting chips arranged on the side of the driving chip layer away from the substrate; the driving chip layer includes multiple driving chips; wherein multiple heat transfer components are arranged between the substrate and the driving chip layer; the heat transfer component is located in the partition and is arranged one-to-one with the partition, and is used to dissipate heat or heat the driving chip in the partition; the control circuit is connected to the heat transfer component, and is used to individually control the operation of the heat transfer component. By individually controlling the heat transfer component to dissipate heat or heat the light-emitting chip through the control circuit, and performing regional management and control, the heating conditions of the driving chip and the light-emitting chip in the partition can be handled in a targeted manner, and the service life of the light-emitting chip and the control accuracy of the driving chip layer can also be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] Figure 1 is a structural schematic diagram of the first embodiment of the light-emitting module provided by the present application;

[0040] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0041] Figure 3 It is a schematic diagram of the structure of the connection between the heat transfer component provided by the present application and the driver chip layer and the substrate;

[0042] Figure 4 is a module schematic diagram of the first embodiment of the light-emitting module provided by the present application;

[0043] Figure 5 is a structural schematic diagram of a second embodiment of a light-emitting module provided by the present application;

[0044] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure at the middle BB;

[0045] Figure 7 is a module schematic diagram of a second embodiment of a light-emitting module provided by the present application;

[0046] Figure 8 is a module schematic diagram of a third embodiment of a light-emitting module provided by the present application;

[0047] Fig. 9 It is a flow chart of an implementation method of a control circuit provided by the present application;

[0048] Fig.10 is a flow chart of a first implementation method of a control circuit provided by the present application;

[0049] Fig.11 is a flow chart of a second implementation of a control method for a control circuit provided by the present application;

[0050] Fig.12 It is a flow chart of the third implementation mode of the control method of the control circuit provided in the present application.

[0051] Description of Figure Numbers:

[0052] Light-emitting module-100, substrate-10, partition-11, light-emitting component-20, light-emitting chip-21, driver chip layer-22, driver chip-220, heat transfer component-30, semiconductor refrigeration plate-310, semiconductor pair-311, P-type semiconductor-312, N-type semiconductor-313, first conductive electrode-314, second conductive electrode-315, third conductive electrode-316, first end-a / b, second end-c / d, first temperature sensor-40, second temperature sensor-50, control circuit-60, algorithm control module-61, comparison module-62, heat transfer module-63, sensing module-64, storage module-65. DETAILED DESCRIPTION

[0053] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0054] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0055] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0056] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0057] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0058] See also Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of the first embodiment of the light-emitting module provided by the present application, Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle.

[0059] The present application provides a light emitting module 100, which includes a substrate 10, a light emitting component 20, a heat transfer component 30 and a control circuit 60 (see Figure 4 The light emitting assembly 20 is disposed on one side of the substrate 10. A plurality of heat transfer assemblies 30 are disposed between the light emitting assembly 20 and the substrate 10 for dissipating heat or heating the light emitting assembly 20. The control circuit 60 is connected to the heat transfer assemblies 30 for controlling the operation of the heat transfer assemblies 30 individually.

[0060] The light-emitting component 20 includes a driving chip layer 22 and a plurality of light-emitting chips 21 disposed on a side of the driving chip layer 22 away from the substrate 10. The driving chip layer 22 includes a plurality of driving chips 220. The driving chip 220 is used to drive the light-emitting chip 21 to emit light. The light-emitting chip 21 is an inorganic light-emitting diode or an organic light-emitting diode (OLED). Specifically, the light-emitting chip 21 can be a Mini-LED or a micro-LED (micrometer light-emitting diode).

[0061] The substrate 10 has a plurality of partitions 11, and the size of each partition 11 can be the same or different, and is selected according to actual needs. The substrate 10 can include 300 partitions 11, 500 partitions 11, or more than 1,100 partitions 11. The number of partitions 11 is not limited here, and is selected according to actual needs. The light-emitting chip 21 is located in the partition 11, and each partition 11 includes at least one light-emitting chip 21. In this embodiment, each partition 11 is the same size, and the plurality of partitions 11 are arranged in a matrix. In other embodiments, the plurality of partitions 11 may also have other arrangements, which are not limited here.

[0062] The heat transfer component 30 is located in the partition 11 and is arranged one-to-one with the partition 11, and is used to dissipate heat or heat the driver chip 220 in the partition 11. In other words, a heat transfer component 30 is arranged in a partition 11, and the heat transfer component 30 is used to dissipate heat or heat the light-emitting chip 21 in the partition 11 where the heat transfer component 30 is located. The heat transfer component 30 is located in the middle position of the partition 11, so as to uniformly dissipate heat or heat the light-emitting component 20 in the partition 11. It should be understood that the heat transfer component 30 can also be located at other positions in the partition 11, which is not limited here and is selected according to actual needs.

[0063] See also Figure 1 and Figure 3 , Figure 3 It is a schematic diagram of the structure of the heat transfer component provided in the present application connected to the driver chip layer and the substrate.

[0064] The heat transfer component 30 includes a semiconductor refrigeration plate 310. The semiconductor refrigeration plate 310 has no sliding parts, is less restricted by space, has high reliability and no refrigerant pollution. The semiconductor refrigeration plate 310 includes at least one semiconductor pair 311, and the semiconductor pair 311 includes a P-type semiconductor 312 and an N-type semiconductor 313. The P-type semiconductor 312 and the N-type semiconductor 313 are connected in series. In each semiconductor pair 311, the first end a of the P-type semiconductor 312 and the first end b of the N-type semiconductor 313 are electrically connected through a conductive electrode. In each semiconductor pair 311, the second end c of the P-type semiconductor 312 and the second end d of the N-type semiconductor 313 are respectively used to connect to the power supply. The heat transfer effect of the semiconductor refrigeration plate 310 is related to the size of the DC current passed and the number of pairs of semiconductor pairs 311, which are not limited here and are selected according to actual needs.

[0065] When the P-type semiconductor 312 and the N-type semiconductor 313 in the semiconductor pair 311 are connected to form a couple, energy transfer can be generated after a direct current is connected in the circuit. When the current flows from the N-type semiconductor 313 to the P-type semiconductor 312, the first end a of the P-type semiconductor 312 and the first end b of the N-type semiconductor 313 together constitute the cold end of the semiconductor refrigeration plate 310; the second end c of the P-type semiconductor 312 and the second end d of the N-type semiconductor 313 together constitute the hot end of the semiconductor refrigeration plate 310. When the current flows from the P-type semiconductor 312 to the N-type semiconductor 313, the first end a of the P-type semiconductor 312 and the first end b of the N-type semiconductor 313 together constitute the hot end of the semiconductor refrigeration plate 310; the second end c of the P-type semiconductor 312 and the second end d of the N-type semiconductor 313 together constitute the cold end of the semiconductor refrigeration plate 310.

[0066] The semiconductor cooling sheet 310 including a semiconductor pair 311 is used as an example for description. The first end a of the P-type semiconductor 312 and the first end b of the N-type semiconductor 313 are electrically connected through the first conductive electrode 314. The first conductive electrode 314 is arranged on the side surface of the driver chip layer 22 close to the substrate 10. One of the second end d of the N-type semiconductor 313 and the second end c of the P-type semiconductor 312 is connected to the positive pole of the power supply, and the other is connected to the negative pole of the power supply. In this embodiment, the second end d of the N-type semiconductor 313 is connected to the positive pole of the power supply through the second conductive electrode 315, and the second end c of the P-type semiconductor 312 is connected to the negative pole of the power supply through the third conductive electrode 316. The second conductive electrode 315 and the third conductive electrode 316 are insulated and arranged at intervals on the side surface of the substrate 10 close to the light-emitting component 20. When the current flows from the N-type semiconductor 313 to the P-type semiconductor 312, the semiconductor cooling sheet 310 absorbs the heat of the driver chip 220 in the partition 11 where the semiconductor cooling sheet 310 is located to dissipate the heat of the driver chip 220. When current flows from the P-type semiconductor 312 to the N-type semiconductor 313 , the semiconductor cooling plate 310 releases heat to the driving chip 220 in the partition 11 where the semiconductor cooling plate 310 is located to heat the driving chip 220 .

[0067] See also Figure 1 and Figure 4 , Figure 4 It is a module schematic diagram of the first embodiment of the light-emitting module provided in the present application.

[0068] In addition to being connected to the heat transfer component 30, the control circuit 60 is also connected to the driver chip layer 22, and is used to control the light-emitting chip 21 to emit light independently. In other words, each light-emitting chip 21 can emit light independently. The control circuit 60 can independently control all the light-emitting chips 21 in a partition 11 to emit light, that is, it can control the light-emitting chips 21 to emit light in different regions. The control circuit 60 can independently control the operation of the heat transfer component 30 in a certain partition 11. It can be understood that the control circuit 60 controls all the light-emitting chips 21 in a certain partition 11 to emit light, and the driver chip 220 that drives the light-emitting chip 21 in the partition 11 to emit light generates heat during the operation process, and controls the heat transfer component 30 in the partition 11 to dissipate heat for the driver chip 220 and the light-emitting chip 21 in the partition 11, so as to avoid shortening the service life of the light-emitting chip 21 and the driver chip 220 due to the increase in temperature and affecting the reliability.

[0069] like Figure 4 As shown, further, the control circuit 60 includes an algorithm control module 61 , a comparison module 62 and a heat transfer module 63 .

[0070] The algorithm control module 61 is used to obtain the light-emitting parameters of the light-emitting chip 21. The light-emitting parameters include the cumulative conduction time of the light-emitting chip 21. The comparison module 62 is used to compare the light-emitting parameters with the preset value. The heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to dissipate heat for the driver chip 220 according to the comparison result of the comparison module 62.

[0071] The algorithm control module 61 reads the on-time of the light-emitting chip 21, and obtains the cumulative on-time of the light-emitting chip 21 by calculation. The longer the light-emitting time of the light-emitting chip 21, the higher the temperature of the light-emitting chip 21. The light-emitting time of the light-emitting chip 21 can be understood as the time when the data line is connected with the data voltage, that is, the time when the light-emitting chip 21 is turned on. That is, the longer the light-emitting chip 21 is turned on, the longer the light-emitting chip 21 emits light, the higher the brightness, and the higher the temperature of the light-emitting chip 21. The longer the light-emitting chip 21 is turned on, the longer the working time of the driving chip 220, the more heat generated by the driving chip 220, and the higher the temperature of the driving chip 220. When the data line is connected with voltage at intervals, the on-time of the light-emitting chip 21 needs to be accumulated to more accurately obtain the temperature of the driving chip 220.

[0072] Furthermore, the light-emitting parameters include the cumulative conduction time of the light-emitting chip 21 corresponding to the area of ​​the heavy-loaded screen displayed by the display device using the above-mentioned light-emitting module 100. The area where the heavy-loaded screen is displayed is the area where the heat is serious. By obtaining the cumulative conduction time of the light-emitting chip 21 corresponding to the area where the heavy-loaded screen is displayed, the heat generation of the light-emitting chip 21 and the driving chip 220 can be handled in a targeted manner. In other words, only the heat transfer component 30 corresponding to the area where the heavy-loaded screen is displayed works, which can reduce power consumption.

[0073] In this embodiment, the preset value includes a time preset value. The comparison module 62 compares the cumulative conduction time of the light emitting chip 21 with the time preset value, and transmits the comparison result to the heat transfer module 63.

[0074] The heat transfer module 63 determines the working state of the heat transfer component 30 according to the comparison result of the comparison module 62. When the cumulative conduction time of the light emitting chip 21 is greater than the preset time value, the heat transfer module 63 determines the partition 11 where the light emitting chip 21 is located, and controls the heat transfer component 30 in the partition 11 to dissipate heat for the driver chip 220 and the light emitting chip 21, so as to protect the performance of the driver chip 220 from being affected by temperature.

[0075] In the process of driving the light-emitting chips 21 of different partitions 11 to emit light, the data calculation of the driver chip 220 is large, the heating of the driver chip 220 is more serious than that of the light-emitting chip 21, and the temperature has a greater impact on the driver chip 220. Too high or too low temperature will affect the inaccuracy of the control of the driver chip layer 22, thereby affecting the display effect. The driver chip 220 drives the light-emitting chip 21 to emit light. As long as the light-emitting chip 21 is turned on, the driver chip 220 must work. The data calculation of the driver chip 220 is large, which causes the driver chip 220 to generate heat. In this embodiment, the temperature of the driver chip 220 is controlled according to the cumulative time of the conduction of the light-emitting chip 21, and through regional control, the heating conditions of the driver chip 220 and the light-emitting chip 21 can be more accurately analyzed to avoid the driver chip 220 being affected by temperature, thereby improving the service life of the light-emitting chip 21 and the control accuracy of the driver chip layer 22; and the heating conditions of the driver chip 220 in the partition 11 can be handled more targeted.

[0076] See also Figure 1 as well as Figures 5 to 7 , Figure 5 is a structural schematic diagram of a second embodiment of the light-emitting module provided in this application, Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure at the middle BB, Figure 7 It is a module schematic diagram of the second embodiment of the light-emitting module provided in this application.

[0077] The structure of the second embodiment of the light emitting module 100 provided in the present application is basically similar to that of the first embodiment of the light emitting module 100 provided in the present application, except that: a first temperature sensor 40 is further included.

[0078] The light-emitting module 100 also includes a plurality of first temperature sensors 40 disposed between the substrate 10 and the light-emitting component 20. The first temperature sensors 40 are located in the partitions 11 and are disposed one-to-one with the partitions 11. That is, a first temperature sensor 40 is disposed in a partition 11, and the temperature sensor is used to sense the temperature of the driver chip 220 in the partition 11. A plurality of first temperature sensors 40 can be disposed in a partition 11, or a first temperature sensor 40 can be disposed, which is not limited here and is selected according to actual needs. The arrangement of the first temperature sensor 40 and the heat transfer component 30 in each partition 11 is not limited and is selected according to actual needs.

[0079] In this embodiment, a first temperature sensor 40 is disposed in a partition 11. The first temperature sensor 40 is disposed on one side of the heat transfer component 30 in the partition 11. Specifically, in the row direction or column direction of the partition 11, the first temperature sensor 40 and the heat transfer component 30 are alternately disposed.

[0080] In addition to being connected to the heat transfer component 30 and the driver chip layer 22, the control circuit 60 is also connected to the first temperature sensor 40 to control the first temperature sensor 40 to work independently. The control circuit 60 can independently control the first temperature sensor 40 in a certain partition 11 to work. It can be understood that the control circuit 60 controls all the light-emitting chips 21 in a certain partition 11 to emit light, controls the first temperature sensor 40 in the partition 11 to sense the temperature of the driver chip 220 in the partition 11, and controls the heat transfer component 30 in the partition 11 to dissipate heat or heat.

[0081] like Figure 7 As shown, further, the control circuit 60 includes a sensing module 64 , a comparing module 62 and a heat transfer module 63 .

[0082] The sensing module 64 is used to obtain the temperature of the driver chip 220 in the partition 11 through the first temperature sensor 40. The comparison module 62 is used to compare the temperature of the driver chip 220 with a preset value. The heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to dissipate heat or heat the driver chip 220 according to the comparison result of the comparison module 62.

[0083] The sensing module 64 can sense the temperature of the driving chip 220 in each partition 11 and transmit the temperature data to the comparison module 62 .

[0084] The preset value includes a first temperature preset value and a second temperature preset value, and the first temperature preset value is greater than the second temperature preset value. The comparison module 62 compares the acquired temperature of the driver chip 220 in the partition 11 with the first temperature preset value and the second temperature preset value, and transmits the comparison result to the heat transfer module 63.

[0085] The heat transfer module 63 determines the working state of the heat transfer component 30 in the corresponding partition 11 according to the comparison result of the comparison module 62. Specifically, in response to the temperature of the driver chip 220 being greater than or equal to the first temperature preset value, the heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to dissipate heat for the driver chip 220.

[0086] In response to the temperature of the driving chip 220 being less than or equal to the second preset temperature value, the heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to heat the driving chip 220 .

[0087] In response to the temperature of the driving chip 220 being less than the first preset temperature value and greater than the second preset temperature value, the heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to not work.

[0088] When the light-emitting module 100 is in an environment with a low ambient temperature, the low temperature will affect the performance of the driver chip 220. This embodiment uses the first temperature sensor 40 to control the temperature of the driver chip 220, and through regional control, compared with the first embodiment of the light-emitting module 100 provided in this application, in addition to being able to specifically handle the heating of the driver chip 220 in the partition 11, the driver chip 220 can also be heated in a low temperature environment to improve the control accuracy of the driver chip layer 22.

[0089] See also Figure 1 and Figure 8 , Figure 8 It is a module schematic diagram of the third embodiment of the light-emitting module provided in the present application.

[0090] The third embodiment of the light emitting module 100 provided in the present application is substantially similar in structure to the first embodiment of the light emitting module 100 provided in the present application, except that: a second temperature sensor 50 is further included.

[0091] The light emitting module 100 further includes a second temperature sensor 50. The second temperature sensor 50 is disposed on a side of the substrate 10 away from the light emitting component 20, and is used to sense the ambient temperature. There is no restriction on the position and quantity of the second temperature sensor 50, and it is only necessary to ensure that the second temperature sensor 50 senses the temperature of the environment where the light emitting module 100 is located, rather than the temperature of the driving chip 220 or the light emitting chip 21.

[0092] In addition to being connected to the heat transfer component 30 and the driving chip layer 22 , the control circuit 60 is also connected to the second temperature sensor 50 for controlling the second temperature sensor 50 to work independently.

[0093] Furthermore, the control circuit 60 includes a sensing module 64 , an algorithm control module 61 , a comparison module 62 , a heat transfer module 63 and a storage module 65 .

[0094] The storage module 65 stores the corresponding relationship between the ambient temperature and the preset value. The sensing module 64 is used to sense the ambient temperature through the second temperature sensor 50. The algorithm control module 61 is used to obtain the light-emitting parameters of the light-emitting chip 21. The light-emitting parameters include the cumulative conduction time of the light-emitting chip 21. The comparison module 62 selects the corresponding preset value according to the ambient temperature sensed by the sensing module 64, and compares the light-emitting parameter with the preset value. The heat transfer module 63 controls the heat transfer component 30 in the corresponding partition 11 to dissipate heat for the driver chip 220 according to the comparison result of the comparison module 62.

[0095] The sensing module 64 is used to sense the ambient temperature of the light-emitting module 100 and transmit the ambient temperature data to the comparison module 62 .

[0096] The algorithm control module 61 is described above and will not be described again here.

[0097] The storage module 65 is used to store the preset values ​​corresponding to different ambient temperatures. In other words, different ambient temperatures correspond to different preset values. It can be understood that when the ambient temperature is too high, even if the light-emitting chip 21 in the partition 11 does not emit light, the temperature of the driver chip 220 will be too high and greater than the preset value, which will mislead the control circuit 60 to control the heat transfer component 30 to dissipate heat from the driver chip 220. In other words, the excessive temperature of the driver chip 220 is not caused by the heat generated by the driver chip 220, but is affected by the ambient temperature, which will cause the heat transfer component 30 to work even if the light-emitting chip 21 does not emit light, wasting resources and increasing power consumption.

[0098] Through experiments, it is obtained that under multiple different ambient temperatures, when the cumulative conduction time of the light-emitting chip 21 in the partition 11 accumulates to a certain value, the temperature of the driver chip 220 will affect the control accuracy of the driver chip 220. The value is the preset value corresponding to the ambient temperature. The preset value under the ambient temperature is recorded and stored in the storage module 65. That is, multiple ambient temperatures correspond to multiple preset values. The preset value is a time preset value. The preset storage module in the comparison module 62 obtains the ambient temperature sensed by the sensing module 64, and matches the corresponding time preset value according to the ambient temperature. The comparison module 62 then compares the cumulative conduction time of the light-emitting chip 21 with the time preset value.

[0099] The heat transfer module 63 determines the working state of the heat transfer component 30 according to the comparison result of the comparison module 62. When the cumulative conduction time of the light emitting chip 21 is greater than the preset time value, the heat transfer module 63 determines the partition 11 where the light emitting chip 21 is located, and controls the heat transfer component 30 in the partition 11 to dissipate heat for the driver chip 220 and the light emitting chip 21, so as to protect the performance of the driver chip 220 from being affected by temperature.

[0100] This embodiment reduces the influence of the ambient temperature on the heat transfer component 30 by matching different preset values ​​for different ambient temperatures. Compared with the first embodiment of the light-emitting module 100 provided in the present application, in addition to being able to specifically handle the heating of the driver chip 220 in the partition 11, the heat transfer component 30 can also more accurately dissipate the heat of the driver chip 220 in operation.

[0101] The present application provides a light-emitting module 100, which includes a substrate 10, a light-emitting component 20, a heat transfer component 30 and a control circuit 60. The substrate 10 has multiple partitions 11; the light-emitting component 20 is arranged on one side of the substrate 10; the light-emitting component 20 includes a driving chip layer 22 and multiple light-emitting chips 21 arranged on the side of the driving chip layer 22 away from the substrate 10; the driving chip layer 22 includes multiple driving chips 220; wherein, multiple heat transfer components 30 are arranged between the substrate 10 and the driving chip layer 22; the heat transfer component 30 is located in the partition 11 and is arranged one-to-one with the partition 11, and is used to dissipate heat or heat the driving chip 220 in the partition 11; the control circuit 60 is connected to the heat transfer component 30, and is used to independently control the operation of the heat transfer component 30. By controlling the heat transfer component 30 individually through the control circuit 60 to dissipate heat or heat the light-emitting chip 21, and performing regional management and control, the heating conditions of the driving chip 220 and the light-emitting chip 21 in the partition 11 can be handled in a targeted manner, and the service life of the light-emitting chip 21 and the control accuracy of the driving chip layer 22 can be improved.

[0102] The present application also provides a display device, which includes the above-mentioned light-emitting module 100.

[0103] In one embodiment, the display device is a liquid crystal display device, and the display device includes a liquid crystal display panel and a backlight module. The backlight module includes the light emitting module 100 described above.

[0104] In another embodiment, the display device includes a display panel, and the display panel includes a light emitting module 100 .

[0105] See also Fig. 9 , Fig. 9 It is a flow chart of an implementation method of a control circuit provided in the present application.

[0106] The present application also provides a control method for a control circuit, and the control method for a control circuit is used to control the above-mentioned control circuit.

[0107] The specific steps of the control method of the control circuit are as follows:

[0108] S100: Acquire parameters of the light-emitting component; the parameters include the temperature of the driving chip in the partition or the light-emitting parameters of the light-emitting chip.

[0109] Specifically, the parameters of the light-emitting component are acquired, and the parameters include the temperature of the driving chip in the partition or the light-emitting parameters of the light-emitting chip.

[0110] In one embodiment, the parameters of the light emitting component are obtained, and the parameters include the temperature of the driver chip in the partition. The temperature of the driver chip in the partition can be sensed by a first temperature sensor.

[0111] In another embodiment, the parameters of the light-emitting component are obtained, and the parameters include the light-emitting parameters of the light-emitting chip. The light-emitting parameters include the cumulative conduction time of the light-emitting chip.

[0112] In another embodiment, in addition to obtaining the parameters of the light-emitting component, it is also necessary to obtain the ambient temperature and store the corresponding relationship between the ambient temperature and the preset value. The ambient temperature can be sensed by a second temperature sensor.

[0113] S200: Compare the parameter with the preset value.

[0114] Specifically, the size of the parameter is compared with the preset value.

[0115] In one embodiment, the preset value includes a first temperature preset value and a second temperature preset value, the first temperature preset value is greater than the second temperature preset value, and the temperature of the driving chip in the partition is compared with the first temperature preset value and the second temperature preset value.

[0116] In another embodiment, the preset value includes a time preset value, and the cumulative conduction time of the light-emitting chip and the time preset value are compared.

[0117] In another embodiment, the preset value includes a time preset value. Different ambient temperatures correspond to different preset values. The time preset value corresponding to the ambient temperature is selected, and the cumulative conduction time of the light-emitting chip is compared with the size of the time preset value.

[0118] S300: According to the comparison result between the parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat or heat the driver chip.

[0119] Specifically, according to the comparison structure between the parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat or heat the driver chip.

[0120] In one embodiment, when the temperature of the driver chip is less than or equal to the second temperature preset value, the heat transfer component in the corresponding partition is controlled to heat the driver chip. When the temperature of the driver chip is less than the first temperature preset value and greater than the second temperature preset value, the heat transfer component in the corresponding partition is controlled not to work. When the temperature of the driver chip is greater than or equal to the first temperature preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat from the driver chip.

[0121] In another embodiment, the cumulative conduction time of the light-emitting chip is greater than a preset time value, and the heat transfer component in the corresponding partition is controlled to dissipate heat for the driving chip.

[0122] See also Figure 7 and Fig.10 , Fig.10 It is a flowchart of the first implementation method of the control circuit provided by the present application.

[0123] The specific steps of the first implementation method of the control circuit provided by the present application are as follows:

[0124] S11: Acquire the temperature of the driver chip in the partition.

[0125] Specifically, the temperature of the driving chip in the partition is sensed by the first temperature sensor.

[0126] S12: Compare the temperature of the driver chip with a preset value.

[0127] Specifically, the preset value includes a first temperature preset value and a second temperature preset value, the first temperature preset value is greater than the second temperature preset value, and the temperature of the driving chip in the partition is compared with the first temperature preset value and the second temperature preset value.

[0128] S13: According to the comparison result between the temperature of the driver chip and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat or heat the driver chip.

[0129] Specifically, when the temperature of the driver chip is less than or equal to the second temperature preset value, the heat transfer component in the corresponding partition is controlled to heat the driver chip. When the temperature of the driver chip is less than the first temperature preset value and greater than the second temperature preset value, the heat transfer component in the corresponding partition is controlled not to work. When the temperature of the driver chip is greater than or equal to the first temperature preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat from the driver chip.

[0130] See also Figure 4 and Fig.11 , Fig.11 It is a flow chart of the second implementation mode of the control method of the control circuit provided in the present application.

[0131] The specific steps of the second implementation method of the control circuit provided by the present application are as follows:

[0132] S21: Acquire the light-emitting parameters of the light-emitting chip; the light-emitting parameters include the cumulative conduction time of the light-emitting chip.

[0133] Specifically, the cumulative on-time of the light-emitting chip is obtained.

[0134] S22: Compare the light-emitting parameter with the preset value.

[0135] Specifically, the preset value includes a time preset value. The cumulative conduction time of the light-emitting chip and the time preset value are compared.

[0136] S23: According to the comparison result of the light emitting parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate the heat of the driving chip.

[0137] Specifically, when the cumulative conduction time of the light-emitting chip is greater than a preset time value, the heat transfer component in the corresponding partition is controlled to dissipate heat for the driving chip.

[0138] See also Figure 8 and Fig.12 , Fig.12 It is a flow chart of the third implementation mode of the control method of the control circuit provided in the present application.

[0139] The specific steps of the third embodiment of the control method of the control circuit provided by the present application are as follows:

[0140] S31: obtaining light-emitting parameters of the light-emitting chip, and obtaining the ambient temperature and storing the corresponding relationship between the ambient temperature and the preset value; the light-emitting parameters include the cumulative conduction time of the light-emitting chip.

[0141] Specifically, the cumulative conduction time of the light-emitting chip is obtained, and the ambient temperature is obtained and the corresponding relationship between the ambient temperature and the preset value is stored. Different ambient temperatures correspond to different preset values. The corresponding relationship between the ambient temperature and the preset value can be obtained through multiple experiments.

[0142] S32: Compare the light emitting parameter with the preset value.

[0143] Specifically, a preset value corresponding to the ambient temperature is selected, and the preset value includes a time preset value, that is, the time preset value corresponding to the ambient temperature is selected, and the cumulative conduction time of the light-emitting chip and the time preset value are compared.

[0144] S33: According to the comparison result of the light-emitting parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate the heat of the driving chip.

[0145] Specifically, when the cumulative conduction time of the light-emitting chip is greater than a preset time value, the heat transfer component in the corresponding partition is controlled to dissipate heat for the driving chip.

[0146] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A light-emitting module, comprising: a base plate having a plurality of partitions; A light-emitting component is disposed on one side of the substrate; The light-emitting component comprises a driving chip layer and a plurality of light-emitting chips arranged on a side of the driving chip layer away from the substrate; the driving chip layer comprises a plurality of driving chips; It is characterized by further comprising: A plurality of heat transfer components, wherein the heat transfer components are arranged between the substrate and the driver chip layer; the heat transfer components are located in the partitions and are arranged one-to-one with the partitions, and are used to dissipate heat or heat the driver chips in the partitions; A control circuit, connected to the heat transfer component, for independently controlling the operation of the heat transfer component; The light-emitting module further includes a second temperature sensor, which is disposed on a side of the substrate away from the light-emitting component and is used to sense the ambient temperature; the control circuit includes: A storage module stores a corresponding relationship between the ambient temperature and the preset value; A sensing module, configured to sense the ambient temperature through the second temperature sensor; An algorithm control module, used for acquiring the light-emitting parameters of the light-emitting chip; the light-emitting parameters include the cumulative conduction time of the light-emitting chip; A comparison module, selecting a corresponding preset value according to the ambient temperature sensed by the sensing module, and comparing the light emitting parameter with the preset value; the preset value includes a time preset value; The heat transfer module controls the heat transfer component in the corresponding partition to dissipate heat for the driver chip according to the comparison result of the comparison module.

2. The light emitting module according to claim 1, characterized in that: The light-emitting parameters include the cumulative conduction time of the light-emitting chip corresponding to the area of ​​the heavy-loaded picture displayed by the display device of the light-emitting module.

3. The light emitting module according to claim 1, characterized in that: The heat transfer component includes a semiconductor cooling plate; the light emitting chip is an inorganic light emitting diode or an organic light emitting diode.

4. A display device, characterized in that: The display device comprises the light emitting module according to any one of claims 1 to 3.

5. A control method for a control circuit, characterized in that: Used to control the light-emitting module according to any one of claims 1 to 3; The control method of the control circuit comprises: Acquire parameters of the light-emitting component; the parameters include light-emitting parameters of the light-emitting chip; Comparing the size of the parameter with a preset value; According to the comparison result between the parameter and the preset value, the heat transfer component in the corresponding partition is controlled to dissipate heat or heat the driver chip.

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