A method, control equipment, and apparatus for separating waste welding strip raw materials.

Abstract

This invention discloses a method, control equipment, and apparatus for separating waste welding strip raw materials, relating to the field of welding strip technology. The separation method includes: placing the waste welding strip in a discharge bin; heating the discharge bin to melt the coating, wherein the heating temperature is greater than the melting point of the coating and the difference between the heating temperature and the melting point is any value between 1 and 200°C; and rotating the discharge bin by periodically stopping and starting to allow the molten coating liquid to be ejected through the through-hole of the discharge bin and separated from the metal substrate. This invention avoids the molten coating liquid adhering to the central gaps of the wound metal substrate, ensuring thorough separation and improving the recovery rate.

Description

Technical Field

[0001] This invention relates to the field of welding strip technology, and in particular to a method, control equipment and apparatus for separating waste welding strip raw materials. Background Technology

[0002] The production process of photovoltaic solder ribbon generates a large amount of waste solder ribbon with substandard coatings or winding defects. Generally, the main components of solder ribbon are oxygen-free copper substrate and tin-lead alloy coating (the main component is Sn). 60 Pb 40 The tin-lead alloy coating adheres to the surface of the oxygen-free copper substrate. Direct recycling of waste materials can only treat them as scrap copper, but the main high-value material in photovoltaic solder ribbons is the tin-lead alloy, which accounts for 11-20% of the surface. This recycling method would undoubtedly result in a huge waste of resources.

[0003] Therefore, how to efficiently, cleanly, cost-effectively, and quickly recycle and process waste welding strips has become an urgent problem for photovoltaic welding strip manufacturers to solve in the process of improving quality and efficiency.

[0004] Existing technologies employ several separation and recycling methods that utilize the melting point difference between oxygen-free copper substrates and tin-lead alloy coatings. Traditional separation methods typically involve high-temperature heating (700-800℃) for separation and recycling. However, due to the simple equipment structure and unreasonable process flow, separation is usually carried out at temperatures far exceeding those of the tin-lead alloy. High-temperature environments easily lead to oxidation of the tin-lead alloy, resulting in higher impurity content, low separation rates, difficulty in improving efficiency, and compromised operational safety. Furthermore, with the development of photovoltaic technology and innovation in solder ribbon manufacturing technology, solder ribbon products are continuously evolving towards miniaturization and diversification of specifications. Current solder ribbon round wire diameters range from 0.22-0.35mm, flat strip thicknesses from 0.09-0.45mm, widths from 0.9-6mm, and single-sided coating thicknesses are only around 15μm. In addition, solder ribbon waste is often irregularly wound with large internal voids and complex contact states between solder ribbons, posing a significant challenge to the separation of tin-lead alloys from solder ribbons. Traditional separation methods use temperatures nearly 500°C higher than the melting point of tin-lead alloys, leading to significant energy waste and the risk of oxidation pollution. Although some high-temperature centrifugal separation methods and equipment for recycling tin-soldered components in the electronics industry have emerged in recent years, their core concept can be applied to the separation and recycling of oxygen-free copper solder strip raw materials coated with lead-tin alloys, the unique structure of photovoltaic solder strip waste causes molten metal to easily adhere to the central gap of the solder strip waste roll during the separation process, making it difficult to fully separate and recycle. The separation process is also prone to oxidation burn-off and the generation of harmful gases. Summary of the Invention

[0005] To address at least one of the problems mentioned in the background section, the present invention provides a method, control equipment, and apparatus for separating waste welding strip raw materials.

[0006] This invention provides the following solution:

[0007] In a first aspect, a method for separating waste solder strip raw materials is provided, the waste solder strip comprising a metal substrate and a coating adhered to the surface of the metal substrate, the separation method comprising:

[0008] Place the waste welding strip into the discharge bin;

[0009] The discharge bucket is heated to melt the coating, and the heating temperature is greater than the melting point of the coating and the difference between the heating temperature and the melting point of the coating is any value between 1 and 200°C.

[0010] The discharge tank is rotated by periodically stopping and starting so that the molten coating liquid is thrown out through the through hole of the discharge tank and separated from the metal substrate.

[0011] Optionally, the step of periodically stopping and starting the discharge tank to cause the molten coating liquid to be thrown out through the through-hole of the discharge tank and separated from the metal substrate includes:

[0012] When the heating temperature reaches the first preset temperature, the discharge bucket is rotated at the first preset speed and maintained for the first preset time, while the discharge bucket is continuously heated.

[0013] When the molten coating liquid flows downward, the discharge bucket is rotated at a second preset speed, which is greater than the first preset speed.

[0014] When the temperature of the discharge hopper reaches the second preset temperature, the temperature of the discharge hopper is maintained at the second preset temperature, and the discharge hopper is rotated periodically by stopping and starting at the second preset rotation speed.

[0015] Optionally, the number of times the material discharge hopper is rotated periodically by continuously using the second preset rotation speed to stop and start is 3 to 8 times.

[0016] Optionally, the first preset speed is 50 to 150 rpm, and the second preset speed is 150 to 250 rpm.

[0017] Optionally, heating the discharge bucket to melt the coating includes:

[0018] Heating the discharge tank in stages to melt the coating includes:

[0019] Heat the discharge bucket to a third preset temperature and maintain it for a second preset time;

[0020] The material discharge hopper is heated to a first preset temperature, which is greater than the third preset temperature.

[0021] Optionally, the coating is a tin-lead alloy, and the metal substrate is a copper substrate;

[0022] The first preset temperature is a temperature greater than 300℃ and less than 380℃, the second preset temperature is 380~420℃, and the third preset temperature is 300℃.

[0023] Optionally, after maintaining the temperature of the discharge hopper at the second preset temperature and continuously rotating the discharge hopper by periodically stopping and starting at the second preset rotation speed, the method further includes:

[0024] The rotation speed of the discharge hopper is gradually reduced multiple times until the discharge hopper stops rotating.

[0025] Secondly, a separation and control device for waste solder ribbon raw materials is provided, including a memory and a processor. The memory stores a computer program that can run on the processor. When the computer program is executed by the processor, the separation method for the waste solder ribbon raw materials is implemented.

[0026] Thirdly, a device for separating waste welding strip raw materials is provided, including a feeding hopper, a heating mechanism, a rotating mechanism, and the separation control device. The feeding hopper is used to hold waste welding strip. The heating mechanism is used to heat the feeding hopper according to the control of the separation control device to melt the coating. The rotating mechanism is used to rotate the feeding hopper in a periodic stopping and starting manner according to the control of the separation control device so that the molten coating liquid is thrown out through the through hole of the feeding hopper and separated from the metal substrate.

[0027] Fourthly, a computer-readable storage medium is provided, wherein a computer program is stored therein, and when the computer program is executed, a method for separating the waste solder strip raw materials is implemented.

[0028] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0029] The separation method provided by this invention uses a temperature slightly above the melting point of the coating to melt the coating, and separates the coating and the metal substrate through low-temperature separation. This avoids oxidation of the coating at high temperatures and reduces oxide impurities. Furthermore, considering the unique structure of the waste welding strip winding, this application rotates the feeding hopper by periodically stopping and starting. The inertial force during rotation and sudden stops causes the molten coating liquid to centrifuge and detach from the surface of the metal substrate and be ejected through the through-hole. This prevents the molten coating liquid from adhering to the central gap of the wound metal substrate, ensuring thorough separation and improving the recovery rate.

[0030] Furthermore, a multi-stage heating method is adopted, that is, heating at a slightly lower temperature first and then heating at a slightly higher temperature. After the first stage of heating reaches the temperature, a certain period of heat preservation is carried out to ensure that the coating melts to a certain extent while preheating. The second stage of heating at a slightly higher temperature can accelerate the melting speed. The two heating processes complement each other, which can speed up the separation process and improve the separation efficiency.

[0031] Of course, the embodiments of the present invention do not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a flowchart of a method for separating waste solder strip raw materials according to an example of the present invention;

[0034] Figure 2 This is a flowchart of a method for separating waste welding strip raw materials provided in another example of the present invention;

[0035] Figure 3 This is an architectural diagram of a waste welding strip raw material separation and control device provided in one embodiment of the present invention. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0037] The specific implementation schemes provided by the embodiments of the present invention will be described in detail below.

[0038] This invention provides a method for separating waste welding strip raw materials. It adopts an optimized multi-stage heating and multi-pass variable frequency rotary centrifugation method to achieve the effect of fully centrifuging the coating liquid adhering inside the welding strip roll and fully collecting the coating liquid. The separation rate of welding strip raw materials reaches more than 80%, and the separation efficiency reaches 200-500 kg / h. Furthermore, production can continue to be carried out by using shutdown preheating, which further improves production efficiency.

[0039] Example 1

[0040] To address the technical problems mentioned in the background section, this embodiment provides a method for separating waste solder strip raw materials. The waste solder strip includes a metal substrate and a coating adhered to the surface of the metal substrate. The metal substrate is generally made of oxygen-free copper, and the coating is generally made of a tin-lead alloy. Figure 1 As shown, the separation method generally includes the following steps:

[0041] S10: Place the waste welding strip into the discharge bin;

[0042] S20: Heating the discharge bucket to melt the coating, wherein the heating temperature is greater than the melting point of the coating and the difference between the heating temperature and the melting point of the coating is any value between 1 and 200°C;

[0043] S30: The discharge bucket is rotated by periodically stopping and starting so that the molten coating liquid is thrown out through the through hole of the discharge bucket and separated from the metal substrate.

[0044] The aforementioned separation method uses a temperature slightly above the melting point of the coating to melt it, separating the coating and the metal substrate at a low temperature. This avoids oxidation of the coating at high temperatures, reduces oxide impurities, and minimizes the generation of harmful gases. Furthermore, considering the unique structure of the waste welding strip winding, this application uses a periodic stopping and starting to rotate the discharge hopper. The inertial force during rotation and sudden stops causes the molten coating liquid to centrifuge and detach from the surface of the metal substrate, exiting through the through-hole. This prevents the molten coating liquid from adhering to the central gaps of the wound metal substrate, ensuring thorough separation and improving the recovery rate.

[0045] Preferably, such as Figure 2 As shown in one example of this application, S30 includes:

[0046] S31: When the heating temperature reaches the first preset temperature, the discharge bucket is rotated at the first preset speed and maintained for the first preset time, while the discharge bucket is continuously heated.

[0047] S32: When the molten coating liquid flows downward, the discharge bucket is rotated at a second preset speed, which is greater than the first preset speed;

[0048] S33: When the temperature of the discharge hopper reaches the second preset temperature, maintain the temperature of the discharge hopper at the second preset temperature and continuously rotate the discharge hopper by periodically stopping and starting at the second preset rotation speed.

[0049] Preferably, in one example of this application, the number of times the material discharge bucket is rotated periodically by continuously using the second preset rotation speed to stop and start is 3 to 8 times. As an example only, the number of times the material is rotated periodically to stop and start is 5 times.

[0050] Wherein, the first preset speed is 50-150 rpm, and the second preset speed is 150-250 rpm. For example only, the first preset speed is 60 rpm, and the second preset speed is 192 rpm.

[0051] Preferably, in one example of this application, heating the discharge bucket to melt the coating includes:

[0052] Heating the discharge tank in stages to melt the coating includes:

[0053] Heat the discharge bucket to a third preset temperature and maintain it for a second preset time;

[0054] The material discharge hopper is heated to a first preset temperature, which is greater than the third preset temperature.

[0055] Taking the coating as a tin-lead alloy and the metal substrate as a copper substrate as an example, the first preset temperature is a temperature greater than 300℃ and less than 380℃, the second preset temperature is 380~420℃, and the third preset temperature is 300℃.

[0056] The above-mentioned multi-stage heating method, that is, heating at a slightly lower temperature first and then heating at a slightly higher temperature, and holding the temperature for a certain period of time after the first stage of heating to the desired temperature, can ensure that the coating melts to a certain extent while preheating. The second stage of heating at a slightly higher temperature can accelerate the melting speed. The two heating processes complement each other, which can speed up the separation process and improve the separation efficiency.

[0057] Optionally, in one example of this application, after maintaining the temperature of the discharge hopper at a second preset temperature and continuously rotating the discharge hopper by periodically stopping and starting at the second preset rotation speed, the method further includes:

[0058] The rotation speed of the discharge hopper is gradually reduced multiple times until the discharge hopper stops rotating.

[0059] Preferably, in one example, the rotating shaft is stopped five times intermittently, so that the discharge bucket stops rotating after multiple decelerations, thereby allowing the coating liquid to flow out fully and avoiding blockage of the discharge port.

[0060] Example 2

[0061] Corresponding to the above separation method, this embodiment also provides a separation control device for waste solder strip raw materials, which includes a memory and a processor. The memory stores a computer program that can run on the processor. When the computer program is executed by the processor, the separation method for waste solder strip raw materials provided in any example of Embodiment 1 is implemented.

[0062] For example, the separate control device may be a control cabinet, which includes a memory and a processor.

[0063] in, Figure 3 An exemplary control device for separating waste welding strip raw materials is shown, including a computer system 1500. The computer system 1500 may specifically include a processor 1510, a video display adapter 1511, a disk drive 1512, an input / output interface 1513, a network interface 1514, and a memory 1520. The processor 1510, video display adapter 1511, disk drive 1512, input / output interface 1513, network interface 1514, and memory 1520 can communicate with each other via a communication bus 1530.

[0064] The processor 1510 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solution provided by the present invention.

[0065] The memory 1520 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1520 can store the operating system 1521 for controlling the operation of the electronic device, and the basic input / output system (BIOS) for controlling the low-level operations of the electronic device. Additionally, it can store a web browser 1523, a data storage management system 1524, and an icon font processing system 1525, etc. The aforementioned icon font processing system 1525 can be the application program that specifically implements the aforementioned steps in this embodiment of the invention. In summary, when implementing the technical solution provided by this invention through software or firmware, the relevant program code is stored in the memory 1520 and is called and executed by the processor 1510.

[0066] Input / output interface 1513 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touch screens, microphones, various sensors, etc., and output devices may include displays, speakers, vibrators, indicator lights, etc.

[0067] Network interface 1514 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0068] The bus includes a pathway for transmitting information between various components of the device (e.g., processor 1510, video display adapter 1511, disk drive 1512, input / output interface 1513, network interface 1514, and memory 1520).

[0069] In addition, the electronic device can also obtain information on specific claim conditions from the virtual resource object claim condition information database for condition judgment, and so on.

[0070] It should be noted that although the above-described device only shows the processor 1510, video display adapter 1511, disk drive 1512, input / output interface 1513, network interface 1514, memory 1520, bus, etc., in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the present invention, and not necessarily all the components shown in the figures.

[0071] For the parts of Embodiment 2 that are not detailed, please refer to the description in Embodiment 1 above, which will not be repeated here.

[0072] Example 3

[0073] Corresponding to the above separation method, this embodiment also provides a separation device for waste welding strip raw materials, which generally includes a feeding hopper, a heating mechanism, a rotating mechanism, and the separation control device provided in Embodiment 2. The feeding hopper is used to hold waste welding strip. The heating mechanism is used to heat the feeding hopper according to the control of the separation control device to melt the coating. The heating temperature is greater than the melting point of the coating and the difference between the heating temperature and the melting point of the coating is any value between 1 and 200°C. The rotating mechanism is used to rotate the feeding hopper periodically by stopping and starting according to the control of the separation control device so that the molten coating liquid is thrown out through the through hole of the feeding hopper and separated from the metal substrate.

[0074] For the parts of Embodiment 3 that are not detailed, please refer to the description in Embodiment 1 above, which will not be repeated here.

[0075] Example 4

[0076] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed, implements the method for separating waste solder strip raw materials provided in any of the above embodiments.

[0077] As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that the present invention can be implemented by means of software plus necessary general-purpose hardware platforms. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in various embodiments or some parts of the embodiments of the present invention.

[0078] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0079] The technical solution provided by this invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A method for separating waste solder strip raw materials, wherein the waste solder strip comprises a metal substrate and a coating adhered to the surface of the metal substrate, characterized in that, The separation method includes: Place the waste welding strip into the discharge bin; The discharge bucket is heated to melt the coating, and the heating temperature is greater than the melting point of the coating and the difference between the heating temperature and the melting point of the coating is any value between 1 and 200°C. The discharge tank is rotated by periodically stopping and starting to allow the molten coating liquid to be ejected through the through-hole of the discharge tank and separated from the metal substrate, including: When the heating temperature reaches the first preset temperature, the discharge bucket is rotated at the first preset speed and maintained for the first preset time, while the discharge bucket is continuously heated. When the molten coating liquid flows downward, the discharge bucket is rotated at a second preset speed, which is greater than the first preset speed. When the temperature of the discharge hopper reaches the second preset temperature, the temperature of the discharge hopper is maintained at the second preset temperature, and the discharge hopper is rotated periodically by stopping and starting at the second preset rotation speed.

2. The separation method according to claim 1, characterized in that, The number of times the material discharge hopper is rotated periodically by continuously using the second preset rotation speed and stopping and starting is 3 to 8 times.

3. The separation method according to claim 1, characterized in that, The first preset speed is 50~150 rpm, and the second preset speed is 150~250 rpm.

4. The separation method according to claim 1, characterized in that, The step of heating the discharge bucket to melt the coating includes: Heating the discharge tank in stages to melt the coating includes: Heat the discharge bucket to a third preset temperature and maintain it for a second preset time; The discharge hopper is heated to a first preset temperature, which is greater than the third preset temperature.

5. The separation method according to claim 4, characterized in that, The coating is a tin-lead alloy, and the metal substrate is a copper substrate; The first preset temperature is a temperature greater than 300℃ and less than 380℃, the second preset temperature is 380~420℃, and the third preset temperature is 300℃.

6. The separation method according to claim 1, characterized in that, After maintaining the temperature of the discharge hopper at the second preset temperature and continuously rotating the discharge hopper by periodically stopping and starting at the second preset rotation speed, the method further includes: The rotation speed of the discharge hopper is gradually reduced multiple times until the discharge hopper stops rotating.

7. A separation and control device for waste welding strip raw materials, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can run on the processor, and when the computer program is executed by the processor, it implements the method for separating waste solder strip raw materials according to any one of claims 1 to 6.

8. A device for separating waste welding strip raw materials, characterized in that, The device includes a discharge hopper, a heating mechanism, a rotating mechanism, and the separation control device as described in claim 7. The discharge hopper is used to hold waste welding strips. The heating mechanism is used to heat the discharge hopper according to the control of the separation control device to melt the coating. The rotating mechanism is used to rotate the discharge hopper in a periodic stopping and starting manner according to the control of the separation control device so that the molten coating liquid is thrown out through the through hole of the discharge hopper and separated from the metal substrate.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed, it implements the method for separating waste welding strip raw materials as described in any one of claims 1 to 6.

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