Design method and device for super deep cold member thermal cutoff component, related equipment

Abstract

The application provides a design method and device of a super-deep cold component thermal cutoff part and related equipment, and comprises the following steps: establishing a design domain of a thermal cutoff part on a main support structure connected with a liquid nitrogen cavity and an outer Dewar cavity; obtaining a target distribution position of the thermal cutoff part through thermal coupling topological analysis; performing parameterized modeling at the target distribution position; performing parameter optimization to obtain a target shape of the thermal cutoff part; and checking the thermal cutoff part with the target shape at the target distribution position. The design method optimizes the distribution position and shape of the thermal cutoff part, specifically, the optimal distribution position of the thermal cutoff part is determined by using a structure topological optimization method, and the optimal shape of the thermal cutoff part is determined by using a structure parameter optimization method, so that the heat from the outside is as low as possible to be transmitted to the superconducting coil.

Description

Technical Field

[0001] This invention relates to the field of superconducting technology, and more specifically, to a design method and apparatus for a thermal cutoff component of an ultracrystal component, as well as related equipment. Background Technology

[0002] Superconducting magnets are the core components of superconducting electric levitation trains. To maintain the powerful electromagnetic force of the superconducting magnets, the superconducting coils made of superconducting tape must be kept below their critical temperature. To maintain the critical temperature of the superconducting coils, they are typically installed in a liquid nitrogen chamber. At the same time, heat cutoff components are installed on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber to minimize the amount of external heat transferred to the superconducting coils.

[0003] Therefore, how to effectively design the position and shape of the heat cut-off component is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, to solve the above problems, the present invention provides a design method and apparatus for thermal cutoff components of ultra-cryogenic components, as well as related equipment, the technical solution of which is as follows:

[0005] A design method for a thermal cutoff component of an ultra-cryogenic component, the design method comprising:

[0006] A design domain for a thermal cutoff component is established on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber.

[0007] The target distribution location of the thermal cutoff component is obtained through thermo-coupled topology analysis;

[0008] Parametric modeling is performed at the target distribution location;

[0009] Parameter optimization is performed to obtain the target shape of the thermal cutoff component;

[0010] The thermal cutoff component with the target shape located at the target distribution position is verified.

[0011] Preferably, in the above-mentioned design method for thermal cutoff components of cryogenic components, the step of obtaining the target distribution location of the thermal cutoff component through thermo-coupling topology analysis includes:

[0012] Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end;

[0013] The normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component are used as optimization objectives. The material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold are used as constraints. At the same time, the Young's modulus, density and heat capacity of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the target distribution position of the heat cut-off component.

[0014] Preferably, in the above-mentioned design method for the thermal cutoff component of ultra-cryogenic components, the step of optimizing parameters to obtain the target shape of the thermal cutoff component includes:

[0015] Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end;

[0016] Using the normal heat flux of the middle section of the main support structure as the optimization objective and the range of variables in the parametric modeling as the constraint, the target shape of the heat cut-off component is determined by structural parameter optimization design.

[0017] Preferably, in the above-mentioned design method for ultra-cryogenic component thermal cutoff parts, the parametric modeling at the target distribution location includes:

[0018] Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

[0019] This application also provides a design apparatus for a thermal cutoff component of an ultra-deep cryogenic component, the design apparatus comprising:

[0020] A module is created to establish the design domain for the thermal cutoff component on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber;

[0021] The location acquisition module is used to obtain the target distribution location of the thermal cutoff component through thermal coupling topology analysis;

[0022] A modeling module is used to perform parametric modeling at the target distribution locations;

[0023] A shape acquisition module is used to perform parameter optimization to obtain the target shape of the thermal cutoff component;

[0024] The verification module is used to verify the thermal cutoff component with the target shape located at the target distribution position.

[0025] Preferably, in the design device for the thermal cutoff component of the aforementioned cryogenic component, the position acquisition module is specifically used for:

[0026] The operating temperature and mechanical boundary conditions at both ends of the main support structure are set, and the main support structure is fixed to the room temperature connection end. The normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component are used as optimization objectives. The material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold are used as constraints. At the same time, the Young's modulus, density and heat capacity of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the target distribution position of the heat cut-off component.

[0027] Preferably, in the design apparatus for the thermal cutoff component of the aforementioned cryogenic component, the shape acquisition module is specifically used for:

[0028] The operating temperature and mechanical boundary conditions at both ends of the main support structure are set, and the connection end between the main support structure and room temperature is fixed. The normal heat flux of the middle section of the main support structure is used as the optimization target, and the range of variables in the parametric modeling is used as the constraint condition. The structural parameter optimization design is carried out to determine the target shape of the heat cut-off component.

[0029] Preferably, in the design apparatus for the thermal cutoff component of the aforementioned cryogenic component, the modeling module is specifically used for:

[0030] Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

[0031] This application also provides a computer-readable storage medium storing computer-executable instructions for performing the design method described in any one of the above claims.

[0032] This application also provides an electronic device, the electronic device comprising: at least one processor, and at least one memory and bus connected to the processor;

[0033] The processor and the memory communicate with each other via the bus.

[0034] The processor is used to invoke program instructions in the memory to execute any of the design methods described above.

[0035] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0036] This invention provides a design method for a thermal cutoff component of an ultracryogenic component, comprising: establishing a design domain for the thermal cutoff component on the main support structure connecting the liquid nitrogen cavity and the external Dewar cavity; obtaining the target distribution position of the thermal cutoff component through thermo-coupling topology analysis; performing parametric modeling at the target distribution position; performing parameter optimization to obtain the target shape of the thermal cutoff component; and verifying the thermal cutoff component with the target shape at the target distribution position. This design method optimizes the distribution position and shape of the thermal cutoff component. Specifically, it uses structural topology optimization to determine the optimal distribution position of the thermal cutoff component and structural parameter optimization to determine the optimal shape of the thermal cutoff component, minimizing the transfer of external heat to the superconducting coil. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0038] Figure 1 A flowchart illustrating a design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention;

[0039] Figure 2 A schematic flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention;

[0040] Figure 3 A flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention;

[0041] Figure 4 A flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention;

[0042] Figure 5 A schematic diagram of the design device for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of the hardware architecture of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Here is an explanation of the terms used in the text:

[0046] Superconducting magnets: Superconducting magnets are electromagnets made by using superconductors with specific transition temperatures and particularly high critical magnetic fields to form coils at low temperatures. Their main characteristics are that there is no electrical loss caused by the resistance of the wires, nor is there any magnetic loss caused by the presence of an iron core.

[0047] Superconducting coil: A coil made of coils made of superconducting tape is called a superconducting coil. There is no resistance or Joule energy loss in a superconducting coil, so once a current is superimposed, the current can exist indefinitely, and the magnetic field it generates can be maintained indefinitely without external work.

[0048] Liquid nitrogen: Liquid nitrogen refers to nitrogen gas in liquid form. In industrial production, liquid nitrogen is obtained by fractional distillation of compressed liquid air. It can be used as a deep refrigerant to provide the temperature required for high-temperature superconductors to exhibit superconductivity, such as yttrium barium copper oxide.

[0049] Thermal cutoff components: These are structures in superconducting magnets used to cool heat sources such as current leads and main support structures.

[0050] Normal heat flux: Heat flux (or thermal flux density) is a vector quantity with directionality. Its magnitude equals the amount of heat flowing through a unit area per unit time along this direction. The direction is along the normal to the isothermal surface, pointing from the high-temperature direction to the low-temperature direction. The unit is W / m². 2 It can characterize the degree and direction of heat transfer.

[0051] Topology optimization is a mathematical method that optimizes the distribution of materials within a given region based on given load conditions, constraints, and performance indicators. It is a type of structural optimization.

[0052] Draft angle: It is an angle designed for molds. More precisely, it is the draft angle of the molded part of the mold in the direction parallel to the mold exit direction.

[0053] Parameter optimization: Parameter optimization is a method to achieve design goals. By parameterizing the design goals, optimization methods are used to continuously adjust the design variables so that the design results continuously approach the parameterized target values.

[0054] Volume fraction: Applying a 30% volume fraction means that the volume of the optimal design must be less than or equal to 30% of the original volume.

[0055] Based on the background information, during the invention process of this application, the inventors discovered that the design of existing heat-blocking components relies on the original structural configuration and engineers' experience, and even after multiple iterations of design, there is a possibility that they may not be able to meet the design requirements.

[0056] Based on this, embodiments of the present invention provide a design method for a thermal cutoff component of an ultracryogenic component, which optimizes the distribution position and shape of the thermal cutoff component. Specifically, the optimal distribution position of the thermal cutoff component is determined by a structural topology optimization method, and the optimal shape of the thermal cutoff component is determined by a structural parameter optimization method, so that the external heat is transferred to the superconducting coil as little as possible.

[0057] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0058] refer to Figure 1 , Figure 1 This is a flowchart illustrating a design method for a cryogenic component thermal cutoff part according to an embodiment of the present invention. The design method for the cryogenic component thermal cutoff part includes:

[0059] S101: Establish the design domain for the thermal cutoff component on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber.

[0060] S102: Obtain the target distribution location of the thermal cutoff component through thermo-coupling topology analysis.

[0061] S103: Perform parametric modeling at the target distribution location.

[0062] S104: Perform parameter optimization to obtain the target shape of the thermal cutoff component.

[0063] S105: Verify the thermal cutoff component with the target shape located at the target distribution position.

[0064] In this step, a thermo-mechanical coupling analysis is performed on the heat cut-off component with the target shape located at the target distribution position to verify whether the heat cut-off component meets the requirements of temperature field (i.e., normal heat flux not greater than 45W) and stress field (maximum Mises stress not exceeding 85% of the material yield strength).

[0065] Specifically, in this embodiment, the design method of the ultracryogenic component heat cut-off part optimizes the distribution position and shape of the heat cut-off part. Specifically, the optimal distribution position of the heat cut-off part is determined by the structural topology optimization method, and the optimal shape of the heat cut-off part is determined by the structural parameter optimization method, so that the external heat is transferred to the superconducting coil as little as possible.

[0066] Optionally, in another embodiment of the invention, reference is made to... Figure 2 , Figure 2 A flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention.

[0067] One possible way to achieve step S102, "obtaining the target distribution location of the thermal cutoff component through thermo-coupled topology analysis," is as follows:

[0068] S1021: Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end; take the normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component as optimization objectives, and take the material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold as constraints. At the same time, multiply the Young's modulus, density and heat capacity of the design domain with the topology optimization penalty function to perform topology optimization iterative design, and obtain the target distribution position of the heat cut-off component.

[0069] Specifically, in this embodiment, thermo-mechanical coupling boundary conditions are applied, that is, the working temperature and mechanical boundary conditions at both ends of the main support structure are set. For example, the initial room temperature is set to 293.15K and the low temperature position temperature is 20K. The connection end between the main support structure and the room temperature is fixedly constrained. The normal heat flux of the middle section of the main support structure (e.g., the plane 28mm away from the room temperature connection end) (requiring the normal heat flux of the middle section of the main support structure to be as small as possible) and the weight of the heat cut-off component (requiring the weight of the heat cut-off component to be as light as possible) are used as optimization objectives. The material volume fraction not exceeding a first threshold (e.g., 30%) and the maximum Mises stress of the material not exceeding a second threshold (e.g., 85%) are used as constraints. At the same time, the Young's modulus K, density ρ, and heat capacity C of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the optimal distribution position of the heat cut-off component, that is, the target distribution position mentioned above.

[0070] Optionally, in another embodiment of the invention, reference is made to... Figure 3 , Figure 3 This is a flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention.

[0071] One possible way to implement "perform parametric modeling at the target distribution location" in step S103 is as follows:

[0072] S1031: Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

[0073] Specifically, in this embodiment, parametric modeling is performed at the optimal distribution position of the heat cut-off component obtained in step S102, mainly including the length L, width W, height H, draft angle θ, and fillet R of the heat cut-off component.

[0074] Optionally, in another embodiment of the invention, reference is made to... Figure 4 , Figure 4 This is a flowchart illustrating another design method for a thermal cutoff component of an ultra-cryogenic component provided in an embodiment of the present invention.

[0075] One possible way to achieve step S104, "performing parameter optimization to obtain the target shape of the thermal cutoff component," is as follows:

[0076] S1041: Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end; take the normal heat flux of the middle section of the main support structure as the optimization target, and take the range of variables in the parametric modeling as the constraint condition, and perform structural parameter optimization design to determine the target shape of the heat cut-off component.

[0077] Specifically, in this embodiment, thermo-coupling boundary conditions are applied, that is, the working temperature and mechanical boundary conditions at both ends of the main support structure are set. For example, the initial room temperature is set to 293.15K and the low temperature position temperature is 20K. The connection end between the main support structure and the room temperature is fixedly constrained. The normal heat flux of the middle section of the main support structure (e.g., the plane 28mm away from the room temperature connection end) is used as the optimization target (the normal heat flux of the middle section of the main support structure is required to be as small as possible). The constraint conditions are designed as the upper and lower bounds of the variables in the parametric modeling of the heat cut-off component (e.g., 5mm < length L < 10mm, 2mm < width W < 8mm, 2mm < height H < 8mm, 0° < draft angle θ < 30° and 0 < fillet R < 5mm). The structural parameters are optimized to determine the optimal shape of the heat cut-off component, that is, the target shape mentioned above.

[0078] Optionally, based on the above embodiments of the present invention, another embodiment of the present invention also provides a design apparatus for a thermal cutoff component of an ultra-cryogenic component, referring to... Figure 5 , Figure 5 This is a schematic diagram of the design device for a thermal cutoff component of an ultra-cryogenic component, provided in an embodiment of the present invention. The design device for the thermal cutoff component of the ultra-cryogenic component includes:

[0079] Module 11 is established to create a design domain for the thermal cutoff component on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber.

[0080] The location acquisition module 12 is used to acquire the target distribution location of the thermal cutoff component through thermal coupling topology analysis;

[0081] Modeling module 13 is used to perform parametric modeling at the target distribution location;

[0082] Shape acquisition module 14 is used to perform parameter optimization to obtain the target shape of the heat cut-off component;

[0083] The verification module 15 is used to verify the heat cut-off component with the target shape located at the target distribution position.

[0084] Optionally, in another embodiment of the present invention, the location acquisition module 12 is specifically used for:

[0085] Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end.

[0086] The normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component are used as optimization objectives. The material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold are used as constraints. At the same time, the Young's modulus, density and heat capacity of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the target distribution position of the heat cut-off component.

[0087] Optionally, in another embodiment of the present invention, the shape acquisition module 14 is specifically used for:

[0088] Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end.

[0089] Using the normal heat flux of the middle section of the main support structure as the optimization objective and the range of variables in the parametric modeling as the constraint, the target shape of the heat cut-off component is determined by structural parameter optimization design.

[0090] Optionally, in another embodiment of the present invention, the modeling module 13 is specifically used for:

[0091] Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

[0092] It should be noted that the principle of the design device for the thermal cut-off component of ultra-cryogenic components provided in the embodiments of the present invention is the same as the principle of the design method for the thermal cut-off component of ultra-cryogenic components provided in the above embodiments of the present invention, and will not be repeated here.

[0093] Optionally, in another embodiment of the present invention, a computer-readable storage medium is also provided, wherein computer-executable instructions are stored in the computer-readable storage medium for performing the design method described in the above embodiments.

[0094] Optionally, in another embodiment of the present invention, an electronic device is also provided, with reference to... Figure 6 , Figure 6 This is a schematic diagram of the hardware architecture of an electronic device provided in an embodiment of the present invention.

[0095] The electronic device includes: at least one processor 21, and at least one memory 22 and bus 23 connected to the processor 21.

[0096] The processor 21 and the memory 22 communicate with each other through the bus 23.

[0097] The processor 21 is used to call program instructions in the memory 22 to execute the design method described in the above embodiments.

[0098] The design method and apparatus for a thermal cutoff component of an ultra-cryogenic component, as well as related equipment, provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

[0099] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0100] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that elements inherent to a process, method, article, or apparatus that comprises a list of elements, or elements inherent to such processes, methods, articles, or apparatus, are also included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0101] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A design method for a thermal cutoff component of an ultra-cryogenic component, characterized in that, The design method includes: A design domain for a thermal cutoff component is established on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber. The target distribution location of the thermal cutoff component is obtained through thermo-coupled topology analysis; Parametric modeling is performed at the target distribution location; Parameter optimization is performed to obtain the target shape of the thermal cutoff component; Verify the heat-stopping component with the target shape located at the target distribution position; The step of optimizing parameters to obtain the target shape of the heat cutoff component includes: Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end; Using the normal heat flux of the middle section of the main support structure as the optimization objective and the range of variables in the parametric modeling as the constraint, the target shape of the heat cut-off component is determined by structural parameter optimization design.

2. The design method according to claim 1, characterized in that, The step of obtaining the target distribution location of the thermal cutoff component through thermo-coupled topology analysis includes: Set the working temperature and mechanical boundary conditions at both ends of the main support structure, and fix the main support structure to the room temperature connection end; The normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component are used as optimization objectives. The material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold are used as constraints. At the same time, the Young's modulus, density and heat capacity of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the target distribution position of the heat cut-off component.

3. The design method according to claim 1, characterized in that, The parametric modeling at the target distribution location includes: Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

4. A design device for a thermal cutoff component of an ultra-cryogenic component, characterized in that, The design device includes: A module is created to establish the design domain for the thermal cutoff component on the main support structure connecting the liquid nitrogen chamber and the external Dewar chamber; The location acquisition module is used to obtain the target distribution location of the thermal cutoff component through thermal coupling topology analysis; A modeling module is used to perform parametric modeling at the target distribution locations; A shape acquisition module is used to perform parameter optimization to obtain the target shape of the thermal cutoff component; The verification module is used to verify the heat cut-off component with the target shape located at the target distribution position; Specifically, the shape acquisition module is used for: The operating temperature and mechanical boundary conditions at both ends of the main support structure are set, and the connection end between the main support structure and room temperature is fixed. The normal heat flux of the middle section of the main support structure is used as the optimization target, and the range of variables in the parametric modeling is used as the constraint condition. The structural parameter optimization design is carried out to determine the target shape of the heat cut-off component.

5. The design device according to claim 4, characterized in that, The location acquisition module is specifically used for: The operating temperature and mechanical boundary conditions at both ends of the main support structure are set, and the main support structure is fixed to the room temperature connection end. The normal heat flux of the middle section of the main support structure and the weight of the heat cut-off component are used as optimization objectives. The material volume fraction not exceeding the first threshold and the maximum Mises stress of the material not exceeding the second threshold are used as constraints. At the same time, the Young's modulus, density and heat capacity of the design domain are multiplied with the topology optimization penalty function to perform topology optimization iterative design and obtain the target distribution position of the heat cut-off component.

6. The design device according to claim 4, characterized in that, The modeling module is specifically used for: Parametric modeling is performed at the target distribution location based on the length, width, height, draft angle, and fillet radius of the heat cut-off component.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for performing the design method according to any one of claims 1-3.

8. An electronic device, characterized in that, The electronic device includes: at least one processor, and at least one memory and bus connected to the processor; The processor and the memory communicate with each other via the bus. The processor is used to invoke program instructions in the memory to execute the design method according to any one of claims 1-3.

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