Low-thermal-conductivity waterproof silicone epoxy resin, preparation method and application thereof

Abstract

The application relates to the technical field of modified epoxy resins, in particular to a low-thermal-conductivity waterproof organic silicon epoxy resin and a preparation method and application thereof, which can solve the problems of poor heat resistance, low brittleness and poor water resistance of epoxy resin products caused by the molecular structure characteristics of the epoxy resin. The low-thermal-conductivity waterproof organic silicon epoxy resin is made of long-chain fatty acid glyceride, tetrahydrophthalic anhydride, hydroxyl silicone oil and an oxidizing agent; wherein the molar ratio of the tetrahydrophthalic anhydride to the long-chain fatty acid glyceride is (2-2.5):1, the molar ratio of the hydroxyl silicone oil to the first intermediate product is (2.5-3.5):1, and the molar ratio of the second intermediate product to the oxidizing agent is 1:(2-2.1); the first intermediate product is prepared by reacting the tetrahydrophthalic anhydride with the long-chain fatty acid glyceride, and the second intermediate product is prepared by reacting the first intermediate product with the hydroxyl silicone oil.

Description

Technical Field

[0001] This application relates to the field of modified epoxy resin technology, and more specifically, to a low thermal conductivity waterproof epoxy resin, its preparation method, and its application. Background Technology

[0002] Epoxy resins are widely used in electronic packaging and other electronic chemical fields. In certain environments, such as high-temperature or polar environments, the extreme temperatures of electronic devices can severely affect their normal operation, reducing efficiency or even causing failure. Therefore, there is a need for an epoxy resin with low thermal conductivity. Furthermore, because epoxy resins contain hydrophilic groups such as hydroxyl groups, coatings made from epoxy resins have poor water resistance. Thus, due to the molecular structure characteristics of epoxy resins, epoxy resin products suffer from poor heat resistance and poor water resistance. Summary of the Invention

[0003] To address the shortcomings of epoxy resin products, such as poor heat resistance and poor water resistance, caused by the molecular structure characteristics of epoxy resin, this application provides a low thermal conductivity and waterproof silicone epoxy resin, its preparation method, and its application.

[0004] The embodiments of this application are implemented as follows:

[0005] This application provides a low thermal conductivity and waterproof silicone epoxy resin, its preparation method, and its application. The low thermal conductivity and waterproof silicone epoxy resin is made from the following raw materials: long-chain fatty acid glycerides, tetrahydrophthalic anhydride, hydroxyl silicone oil, and oxidant.

[0006] The molar ratio of tetrahydrophthalic anhydride to long-chain fatty acid glycerides is (2-2.5):1, the molar ratio of hydroxyl silicone oil to the first intermediate is (2.5-3.5):1, and the molar ratio of the second intermediate to the oxidant is 1:(2-2.1).

[0007] The first intermediate product is prepared by reacting the tetrahydrophthalic anhydride with long-chain fatty acid glycerides, and the second intermediate product is prepared by reacting the first intermediate product with the hydroxyl silicone oil.

[0008] This application also provides a low thermal conductivity and waterproof silicone epoxy resin, its preparation method, and its application. The method includes the following steps:

[0009] Tetrahydrophthalic anhydride and long-chain fatty acid glycerides were subjected to an esterification reaction under the first preset conditions to obtain the first intermediate product.

[0010] Hydroxy silicone oil was added to the first intermediate product, and an esterification reaction was carried out under a second preset condition to obtain the second intermediate product.

[0011] The second intermediate product and the oxidant are taken and subjected to an epoxidation reaction under a third preset condition to obtain an organosilicon epoxy resin.

[0012] In some embodiments, tetrahydrophthalic anhydride and long-chain fatty acid glycerides are subjected to an esterification reaction under first preset conditions to obtain a first intermediate product, comprising:

[0013] Tetrahydrophthalic anhydride, long-chain fatty acid glycerides and the first catalyst were dissolved in a solvent and esterified at a reaction temperature of 50℃~70℃. During the esterification reaction, reflux was carried out and the reaction was carried out for 1h~2h to obtain the first intermediate product.

[0014] The long-chain fatty acid glycerides are one or more of monododecanoglycerides, monooctadecanoic acid glycerides, monodecanoic acid glycerides, and monohexadecanoic acid glycerides, and the molar ratio of tetrahydrophthalic anhydride to long-chain fatty acid glycerides is (2-2.5):1.

[0015] In some embodiments, hydroxyl silicone oil is added to the first intermediate product, and an esterification reaction is carried out under the second preset conditions to obtain a second intermediate product, comprising:

[0016] Hydroxysilicone oil and a second catalyst were added to the first intermediate product, and the reaction was carried out at a reaction temperature of 60°C to 80°C for 5 to 7 hours to obtain the second intermediate product.

[0017] The molar ratio of hydroxyl silicone oil to the first intermediate product is (2.5–3.5):1.

[0018] In some embodiments, the second intermediate product and an oxidant are subjected to an epoxidation reaction under third preset conditions to obtain an organosilicon epoxy resin, comprising:

[0019] At 10℃~15℃, the oxidant was slowly added dropwise to the second intermediate product which had been cooled to room temperature, and then the temperature was raised to 30℃~40℃ and reacted at the reaction temperature of 30℃~40℃ for 3h~4h to obtain the crude product.

[0020] The crude product was subjected to vacuum distillation to obtain the organosilicon epoxy resin.

[0021] The oxidant is m-chloroperoxybenzoic acid, and the molar ratio of the second intermediate product to the oxidant is 1:(2-2.1).

[0022] In some embodiments, the first catalyst is anhydrous sodium acetate or aluminum trichloride, and the mass of the first catalyst is 0.02% to 0.08% of the sum of the masses of tetrahydrophthalic anhydride and long-chain fatty acid glycerides.

[0023] In some embodiments, the second catalyst is concentrated sulfuric acid, phosphoric acid, or benzenesulfonic acid, and the mass of the second catalyst is 0.02% to 0.08% of the sum of the mass of the first intermediate product used in the esterification reaction under the second preset conditions and the mass of the hydroxyl silicone oil.

[0024] In some embodiments, the solvent is dimethylformamide.

[0025] In some embodiments, the long-chain fatty acid glycerides are one or more of monododecanoglycerides, monooctadecanoic acid glycerides, monodecanoic acid glycerides, and monohexadecanoic acid glycerides.

[0026] This application also provides an application of a low thermal conductivity and waterproof silicone epoxy resin, including the application of the aforementioned low thermal conductivity and waterproof silicone epoxy resin in the fields of coatings, electronic packaging, and adhesives.

[0027] The beneficial effects of this application are:

[0028] Because of the cross-linked network structure of organosilicon segments, the introduction of organosilicon segments into epoxy resin segments through molecular design enhances the toughness of the cured organosilicon epoxy resin. Furthermore, the presence of large-volume branches in long-chain fatty acid glycerides creates high porosity in the organosilicon epoxy resin molecules. Simultaneously, the randomness of the branches prevents the formation of crystalline regions within the organosilicon epoxy resin, further reducing its density and promoting the filling of low-thermal-conductivity air into the interior of the organosilicon epoxy resin molecules, thus reducing its thermal conductivity. Furthermore, the introduction of alicyclic hydrocarbons from tetrahydrophthalic anhydride improves the water resistance of the organosilicon epoxy resin.

[0029] The organosilicon epoxy resin prepared in this application combines the advantages of epoxy resin and organosilicon resin, namely, it has excellent adhesion, as well as excellent water resistance, low thermal conductivity and flexibility; at the same time, the synthesis process of organosilicon epoxy resin is simple and can be industrialized. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 The hydrogen NMR spectrum provided for an embodiment of this application. Detailed Implementation

[0032] To enable those skilled in the art to understand the features and effects of the present invention, the terms and expressions used in the specification and claims are explained and defined in general below. Unless otherwise specified, all technical and scientific terms used herein have the ordinary meaning understood by those skilled in the art regarding the present invention, and in case of conflict, the definitions in this specification shall prevail.

[0033] The theories or mechanisms described and disclosed herein, whether right or wrong, should not in any way limit the scope of the invention, that is, the contents of the invention can be implemented without being limited by any particular theory or mechanism.

[0034] In this document, all features defined by numerical ranges or percentage ranges, such as numerical values, quantities, contents, and concentrations, are for the sake of brevity and convenience only. Accordingly, descriptions of numerical ranges or percentage ranges should be considered as covering and specifically disclosing all possible sub-ranges and individual numerical values ​​(including integers and fractions) within those ranges.

[0035] Unless otherwise specified, the terms “contains”, “includes”, “containing”, “having” or similar terms cover the meanings of “composed of” and “mainly composed of”. For example, “A contains a” covers the meanings of “A contains a and others” and “A contains only a”.

[0036] For the sake of brevity, not all possible combinations of the technical features in each implementation scheme or embodiment are described herein. Therefore, as long as there is no contradiction in the combination of these technical features, the technical features in each implementation scheme or embodiment can be combined arbitrarily, and all possible combinations should be considered within the scope of this specification.

[0037] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0038] The following examples use instruments and equipment conventional in the art. Experimental methods in the following examples, unless otherwise specified, are generally performed under conventional conditions or as recommended by the manufacturer. All raw materials used in the following examples are conventional commercially available products with specifications conventional in the art. In this specification and the following examples, unless otherwise specified, "%" represents weight percentage, "parts" represents parts by weight, and "ratio" represents weight proportion.

[0039] This application provides a low thermal conductivity and waterproof silicone epoxy resin, its preparation method, and its application. The silicone epoxy resin is made from the following raw materials: long-chain fatty acid glycerides, tetrahydrophthalic anhydride, hydroxyl silicone oil, and oxidant.

[0040] Among them, the amount of tetrahydrophthalic anhydride: the amount of long-chain fatty acid glycerides = (2~2.5):1, the amount of hydroxyl silicone oil: the amount of the first intermediate product = (2.5~3.5):1; the amount of the second intermediate product: the amount of the oxidant = 1:(2~2.1).

[0041] The first intermediate product is prepared by reacting the tetrahydrophthalic anhydride with long-chain fatty acid glycerides, and the second intermediate product is prepared by reacting the first intermediate product with the hydroxyl silicone oil.

[0042] In some embodiments, the chemical formula of the hydroxyl silicone oil is HO[(CH3)2SiO] n H, n = 50~100.

[0043] This application also provides a low thermal conductivity and waterproof silicone epoxy resin, its preparation method, and its application. The method includes the following steps:

[0044] Tetrahydrophthalic anhydride and long-chain fatty acid glycerides were subjected to an esterification reaction under the first preset conditions to obtain the first intermediate product.

[0045] Hydroxy silicone oil was added to the first intermediate product, and an esterification reaction was carried out under a second preset condition to obtain the second intermediate product.

[0046] The second intermediate product and the oxidant are taken and subjected to an epoxidation reaction under a third preset condition to obtain an organosilicon epoxy resin.

[0047] In some embodiments, tetrahydrophthalic anhydride and long-chain fatty acid glycerides are subjected to an esterification reaction under first preset conditions to obtain a first intermediate product, comprising:

[0048] Tetrahydrophthalic anhydride, long-chain fatty acid glycerides and the first catalyst were dissolved in a solvent and esterified at a reaction temperature of 50℃~70℃. During the esterification reaction, reflux was carried out and the reaction was carried out for 1h~2h to obtain the first intermediate product.

[0049] The long-chain fatty acid glycerides are one or more of monododecanoglycerides, monooctadecanoic acid glycerides, monodecanoic acid glycerides, and monohexadecanoic acid glycerides, and the molar ratio of tetrahydrophthalic anhydride to long-chain fatty acid glycerides is (2-2.5):1.

[0050] In some embodiments, hydroxyl silicone oil is added to the first intermediate product, and an esterification reaction is carried out under the second preset conditions to obtain a second intermediate product, comprising:

[0051] Hydroxysilicone oil and a second catalyst were added to the first intermediate product, and the reaction was carried out at a reaction temperature of 60°C to 80°C for 5 to 7 hours to obtain the second intermediate product.

[0052] The molar ratio of hydroxyl silicone oil to the molar ratio of the first intermediate product is (2.5–3.5):1.

[0053] In some embodiments, the second intermediate product and an oxidant are subjected to an epoxidation reaction under third preset conditions to obtain an organosilicon epoxy resin, comprising:

[0054]

[0055] At 10℃~15℃, the oxidant was slowly added dropwise to the second intermediate product which had been cooled to room temperature, and then the temperature was raised to 30℃~40℃ and reacted at the reaction temperature of 30℃~40℃ for 3h~4h to obtain the crude product.

[0056] The crude product is subjected to vacuum distillation to obtain the organosilicon epoxy resin; wherein the oxidant is m-chloroperoxybenzoic acid, and the molar ratio of the second intermediate product to the oxidant is 1:(2-2.1).

[0057] In some embodiments, a principle equation for preparing a low thermal conductivity and waterproof silicone epoxy resin, using monododecanoic acid glyceride as an example, is also provided:

[0058] Where n = 50 to 100.

[0059] In some embodiments, the first catalyst is anhydrous sodium acetate or aluminum trichloride, and the mass of the first catalyst is 0.02% to 0.08% of the sum of the masses of tetrahydrophthalic anhydride and long-chain fatty acid glycerides.

[0060] In some embodiments, the second catalyst is concentrated sulfuric acid, phosphoric acid, or benzenesulfonic acid, and the mass of the second catalyst is 0.02% to 0.08% of the sum of the mass of the first intermediate product used in the esterification reaction under the second preset conditions and the mass of the hydroxyl silicone oil.

[0061] In some embodiments, the solvent is dimethylformamide. The long-chain fatty acid glycerides are one or more selected from monododecanoglyceride, monooctadecanoic acid glyceride, monodecanoic acid glyceride, and monohexadecanoic acid glyceride.

[0062] This application also provides an application of a low thermal conductivity and waterproof silicone epoxy resin, including the application of the aforementioned low thermal conductivity and waterproof silicone epoxy resin in the fields of coatings, electronic packaging, and adhesives.

[0063] The present application will be further described below with reference to specific embodiments.

[0064] Example 1

[0065] 10 g of monododecanoic acid glyceride, 2.77 g of tetrahydrophthalic anhydride, 0.0026 g of aluminum trichloride and 100 mL of DMF (i.e., dimethylformamide) were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The mixture was heated to 50 °C, refluxed and reacted for 1 h to obtain the first intermediate product.

[0066] Add 30g of hydroxyl silicone oil and 0.0840g of concentrated sulfuric acid to 12g of the first intermediate product, heat to 60℃, and react for 5h. After the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0067] 20g of m-chloroperoxybenzoic acid was slowly added to 10g of the second intermediate at 10℃, and the system was heated to 30℃. After reacting for 3h, the crude product was obtained.

[0068] The crude product was subjected to vacuum distillation to remove DM, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0069] Example 2

[0070] 10 g of monododecanoic acid glyceride, 2.64 g of tetrahydrophthalic anhydride, 0.0038 g of aluminum trichloride and 100 mL of DMF were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The mixture was heated to 55 °C, refluxed and reacted for 1 h to obtain the first intermediate product.

[0071] Add 33.6g of hydroxyl silicone oil and 0.1368g of phosphoric acid to 12g of the first intermediate product, heat to 65℃, and react for 5.5h. After the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0072] 20.2 g of m-chloroperoxybenzoic acid was slowly added to 10 g of the second intermediate at 10 °C, and the system was heated to 32 °C and reacted for 3 h to obtain the crude product.

[0073] The crude product was subjected to vacuum distillation to remove DM, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0074] Example 3

[0075] 10 g of glyceryl monooctadecanoate, 1.93 g of tetrahydrophthalic anhydride, 0.0048 g of aluminum trichloride and 100 mL of DMF were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The temperature was raised to 60 °C, refluxed and the reaction was carried out for 1.5 h. The reaction was then completed and the first intermediate product was obtained.

[0076] Add 34.8g of hydroxyl silicone oil and 0.1752g of benzenesulfonic acid to 12g of the first intermediate product, heat to 70℃, react for 6h, and after the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0077] 20.4 g of m-chloroperoxybenzoic acid was slowly added to 10 g of the second intermediate at 13 °C, and the system was heated to 34 °C and reacted for 3.5 h to obtain the crude product.

[0078] The crude product was subjected to vacuum distillation to remove DM, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0079] Example 4

[0080] 10 g of glyceryl monooctadecanoate, 1.85 g of tetrahydrophthalic anhydride, 0.0059 g of anhydrous sodium acetate and 100 mL of DMF were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The mixture was heated to 65 °C, refluxed and reacted for 1.5 h to obtain the first intermediate product.

[0081] Add 36g of hydroxyl silicone oil and 0.225g of benzenesulfonic acid to 12g of the first intermediate product, heat to 75℃, and react for 6.5h. After the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0082] 20.6 g of m-chloroperoxybenzoic acid was slowly added to 10 g of the second intermediate at 15 °C, and the system was heated to 36 °C and reacted for 3.5 h to obtain the crude product.

[0083] The crude product was subjected to vacuum distillation to remove DM, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0084] Example 5

[0085] 10 g of monodecanoic acid glyceride, 1.78 g of tetrahydrophthalic anhydride, 0.0071 g of anhydrous sodium acetate and 100 mL of DMF were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The mixture was heated to 70 °C, refluxed and reacted for 2 h to obtain the first intermediate product.

[0086] Add 38.4g of hydroxyl silicone oil and 0.3024g of phosphoric acid to 12g of the first intermediate product, heat to 80℃, and react for 7h. After the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0087] 20.8 g of m-chloroperoxybenzoic acid was slowly added to 10 g of the second intermediate at 15 °C, and the system was heated to 38 °C. After reacting for 4 h, the crude product was obtained.

[0088] The crude product was subjected to vacuum distillation to remove DM, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0089] Example 6

[0090] 10 g of hexadecanoic acid glyceride, 1.85 g of tetrahydrophthalic anhydride, 0.0095 g of anhydrous sodium acetate and 100 mL of DMF were added to a four-necked flask equipped with a stirrer, thermometer and condenser. The mixture was heated to 70 °C, refluxed and reacted for 2 h to obtain the first intermediate product.

[0091] Add 42g of hydroxyl silicone oil and 0.432g of concentrated sulfuric acid to 12g of the first intermediate product, heat to 80℃, and react for 7h. After the reaction is completed, cool the reaction solution in the four-necked flask to room temperature to obtain the second intermediate product.

[0092] 20.1 g of m-chloroperoxybenzoic acid was slowly added to 10 g of the second intermediate at 15 °C, and the system was heated to 40 °C and reacted for 4 h to obtain the crude product.

[0093] The crude product was subjected to vacuum distillation to remove DMF, yielding a low thermal conductivity and waterproof silicone epoxy resin.

[0094] To characterize the structural features of the low thermal conductivity and waterproof silicone epoxy resin, the low thermal conductivity and waterproof silicone epoxy resin synthesized in Example 4 was subjected to 1H NMR spectroscopy. The 1H NMR spectrum is shown below. Figure 1 As shown, the test results are as follows:

[0095] 1 H NMR (300MHz, DMSO): δ6.35 (s, H), 5.85 (t, H), 4.42 (m, H), 4.17 (m, H), 2.32 (t, H), 2.04 (m, H), 1.93 (m, H), 1.79 (m, H), 1.68 (m, H), 1.53 (m, H), 1.43 (m, H), 1.30 (s, H), 1.26 (s, H), 0.88 (d, H), 0.14 (s, H) ppm.

[0096] According to NMR data, this invention successfully prepared a low thermal conductivity and waterproof organosilicon epoxy resin with the target structure.

[0097] The silicone epoxy resins prepared in Examples 1-6 were used to form silicone epoxy resin grease cured coatings, all with a thickness of 1 mm. Specifically, the silicone epoxy resins prepared according to the methods described in Examples 1-6 were mixed with epoxy curing agents, initiators, and reactive diluents in a certain proportion, stirred evenly, coated onto the surface of a glass plate, and cured in a 60°C oven for 20 minutes to obtain a silicone epoxy resin cured coating.

[0098] Contact angle, heat distortion temperature and tensile strength of each silicone epoxy resin cured coating were tested, and the results are shown in Table 1.

[0099] The contact angle was tested using a contact angle meter. In each embodiment, the epoxy resin was tested at least three times in parallel, and the average value was taken as the test result.

[0100] Mechanical property tests were conducted using a TS2000-S universal testing machine, and the tensile strength of the epoxy resin in each embodiment was determined by the tensile strength test.

[0101] The heat distortion temperature of the epoxy resins prepared in each example was determined using an FYWK-300 Vicat thermometer. Before testing, the epoxy resins obtained in each example were poured into a polytetrafluoroethylene mold and cured under the following conditions: 120℃ / 2h + 140℃ / 1h.

[0102] Table 1 shows the test results of the contact angle, heat distortion temperature, and tensile strength of the waterproof and heat-resistant silicone epoxy resin in the examples.

[0103]

[0104] As shown in Table 1, the low thermal conductivity and waterproof silicone epoxy resin has a contact angle of 107° to 133°, indicating good waterproof performance; the heat distortion temperature can reach 134°C, indicating that the silicone epoxy resin prepared by this invention has good low thermal conductivity; the tensile strength can reach 98MPa, and the toughness of the modified silicone epoxy resin is significantly enhanced.

[0105] For ease of explanation, the above description has been provided in conjunction with specific embodiments. However, the discussion in some embodiments above is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained based on the above teachings. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, thereby enabling those skilled in the art to better utilize the embodiments and various different variations of the embodiments suitable for specific application considerations.

Claims

1. A low thermally conductive waterproof silicone epoxy resin, characterized by, The low thermal conductivity and waterproof silicone epoxy resin is made from the following raw materials: long-chain fatty acid glycerides, tetrahydrophthalic anhydride, hydroxyl silicone oil and oxidant; The molar ratio of tetrahydrophthalic anhydride to long-chain fatty acid glycerides is (2~2.5):1, the molar ratio of hydroxyl silicone oil to the first intermediate is (2.5~3.5):1, and the molar ratio of the second intermediate to the oxidant is 1:(2~2.1). The long-chain fatty acid glycerides are one or more of monododecanoglycerides, monooctadecanoic acid glycerides, monodecanoic acid glycerides, and monohexadecanoic acid glycerides. The first intermediate product is prepared by reacting the tetrahydrophthalic anhydride with the long-chain fatty acid glyceride, and the second intermediate product is prepared by reacting the first intermediate product with the hydroxyl silicone oil. The low thermal conductivity and waterproof silicone epoxy resin is obtained by epoxidation reaction of a second intermediate product and an oxidant.

2. A method for producing a low thermally conductive waterproof silicone epoxy resin, characterized by, The low thermal conductivity and waterproof silicone epoxy resin is the low thermal conductivity and waterproof silicone epoxy resin according to claim 1, and the preparation method includes: Tetrahydrophthalic anhydride and long-chain fatty acid glycerides were subjected to an esterification reaction under the first preset conditions to obtain the first intermediate product. Hydroxy silicone oil was added to the first intermediate product, and an esterification reaction was carried out under a second preset condition to obtain the second intermediate product. The second intermediate product and the oxidant are taken and subjected to an epoxidation reaction under a third preset condition to obtain an organosilicon epoxy resin.

3. The preparation method of the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 2, characterized in that, Tetrahydrophthalic anhydride and long-chain fatty acid glycerides are subjected to an esterification reaction under a first preset condition to obtain a first intermediate product, comprising: Tetrahydrophthalic anhydride, long-chain fatty acid glycerides and the first catalyst were dissolved in a solvent and esterified at a reaction temperature of 50℃~70℃. During the esterification reaction, reflux was carried out and the reaction was carried out for 1 h~2 h to obtain the first intermediate product. The long-chain fatty acid glycerides are one or more of monododecanoglycerides, monooctadecanoic acid glycerides, monodecanoic acid glycerides, and monohexadecanoic acid glycerides, and the molar ratio of tetrahydrophthalic anhydride to long-chain fatty acid glycerides is (2~2.5):

1.

4. The preparation method of the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 2, characterized in that, Hydroxysilicone oil is added to the first intermediate product, and an esterification reaction is carried out under the second preset conditions to obtain a second intermediate product, comprising: Hydroxysilicone oil and a second catalyst were added to the first intermediate product, and the reaction was carried out at a reaction temperature of 60℃~80℃ for 5h~7h to obtain the second intermediate product. The molar ratio of hydroxyl silicone oil to the first intermediate product is (2.5~3.5):

1.

5. The preparation method of the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 2, characterized in that, The second intermediate product and an oxidant are subjected to an epoxidation reaction under third preset conditions to obtain an organosilicon epoxy resin, comprising: At 10℃~15℃, the oxidant was slowly added dropwise to the second intermediate product which had been cooled to room temperature, and then the temperature was raised to 30℃~40℃ and reacted at a reaction temperature of 30℃~40℃ for 3 h~4 h to obtain the crude product. The crude product was subjected to vacuum distillation to obtain the organosilicon epoxy resin. The oxidant is m-chloroperoxybenzoic acid, and the molar ratio of the second intermediate product to the oxidant is 1:(2~2.1).

6. The preparation method of the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 3, characterized in that, The first catalyst is anhydrous sodium acetate or aluminum trichloride, and the mass of the first catalyst is 0.02% to 0.08% of the sum of the mass of tetrahydrophthalic anhydride and long-chain fatty acid glycerides.

7. The preparation method of the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 4, characterized in that, The second catalyst is concentrated sulfuric acid, phosphoric acid or benzenesulfonic acid, and the mass of the second catalyst is 0.02% to 0.08% of the sum of the mass of the first intermediate product and the hydroxyl silicone oil used in the esterification reaction under the second preset conditions.

8. The method for preparing the low thermal conductivity and waterproof organosilicon epoxy resin as described in claim 3, characterized in that, The solvent is dimethylformamide.

9. An application of a low thermal conductivity and waterproof silicone epoxy resin, characterized in that, This includes the application of the low thermal conductivity and waterproof silicone epoxy resin as described in claim 1 in the fields of coatings, electronic packaging, and adhesives.

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