A super strong plate and preparation method thereof

Abstract

The present invention discloses a super-strong board and a preparation method thereof, and belongs to the technical field of board processing. In the preparation method, thick bamboo pieces are used as the outer layer, and metal wires are arranged in each layer of bamboo pieces. The prepared board has a static bending strength of more than 180MPa, an elastic modulus of more than 15000MPa, and a moisture absorption thickness expansion rate of less than 2%. The higher the static bending strength and elastic modulus indicators, the better the mechanical properties of the board; the lower the moisture absorption thickness expansion rate, the better the weather resistance of the board. The super-strong board of the present invention can be applied to different scene requirements, so that products can be developed layer by layer and extended downward, thereby realizing a large consumption of bamboo resources and promoting the development of the bamboo industry.

Description

Technical Field

[0001] The present invention belongs to the technical field of plate processing, and in particular, relates to a super-strong plate and a preparation method thereof. Background Art

[0002] my country has abundant bamboo resources, and the bamboo industry is one of the important pillars of the mountain economy. Bamboo has high strength, good toughness, high hardness, and good plasticity. It is an excellent raw material for processing and manufacturing structural materials, panels, furniture and other products. How to give full play to the performance of bamboo, especially to use bamboo to prepare super-strong panels, has become the focus and hot spot of research in recent years. Super-strong panels need to pay attention to the following technical issues:

[0003] (1) The morphological consistency of the processed bamboo base unit, including length, thickness, width, moisture content, etc.;

[0004] (2) The bamboo strips are uniform and consistent, and are cut into narrow, long, thin and flat pieces without curling or debris;

[0005] (3) The uniformity of the stacking of the basic units and the pressing effect between the units;

[0006] (4) The wettability and dispersibility of the selected adhesive, its weather resistance after curing, and its ability to penetrate and seal bamboo;

[0007] (5) Bending strength: Bamboo is a biomass material, and its basic unit cannot be compared with steel. It is necessary to achieve a breakthrough in the plate index through overall structural enhancement;

[0008] (6) Compression and venting methods: Bamboo has a moisture content. If it is too wet, it cannot be glued together, resulting in failure of the board; if it is too dry, it will cause huge deformation;

[0009] (7) Plate balance and plasticity. The pressed plate cannot have completely uniform density inside, so there are local unbalanced stresses and water vapor accumulation. Stress relief and balance treatment are required to ensure the stability of product application quality.

[0010] CN201172244Y discloses a method for manufacturing an enhanced artificial board, wherein a multi-layer reinforcement net is implanted in an existing integrally pressed decorative board, and the reinforcement net is also provided with reinforcement ribs. The implantation of the reinforcement net effectively enhances the toughness of the decorative board, and the water resistance, folding resistance and compression resistance are significantly improved, and the decorative board is not easy to break, thereby effectively extending the service life of the decorative board. However, the artificial board is a pressurized gluing of various forms of wood, and the implantation of a multi-layer reinforcement net in the board structure will destroy the gluing effect between the wood units, causing the gluing strength to decrease, and in severe cases, the board will burst. The implanted reinforcement net and reinforcement ribs are themselves made of wood and cotton, and even if they are glued together, there will be no leapfrog improvement in performance.

[0011] CN101811313A discloses a metal reinforcement technology for plywood. A metal mesh is embedded between each wood plywood blank, and the embedded metal mesh is bonded and composited with each wood plywood blank by an adhesive. The embedding of the metal mesh plays a role in reinforcing the tendons and bones, and significantly improves the mechanical strength of the wood composite board. However, the reinforcement technology disclosed in CN101811313A specifically refers to the reinforcement of the plywood structure. The wood veneer is soft. If the metal plate is forcibly pressed into the veneer surface, the bonding area between the veneer layers is affected, and the incompatibility of the metal mesh and the wood will cause product stratification. Summary of the invention

[0012] In order to solve one of the above technical problems, the present invention aims to provide a method for preparing a super-strong board, specifically, to provide a bamboo super-strong board with high static bending strength, low elastic modulus, and low moisture absorption thickness expansion rate and a preparation method thereof. To this end, the technical solution of the present invention is as follows:

[0013] A first aspect of the present invention provides a method for preparing a super-strong plate, comprising the following steps:

[0014] S1, obtaining bamboo pieces with a length of 10 to 15 cm and a first thickness, a second thickness and a third thickness and a metal wire with a diameter of 0.1 to 0.3 cm, and performing low-temperature plasma treatment on each of them;

[0015] S2, the bamboo pieces are atomized and mixed with phenolic glue having a solid content of 75-78%, and the metal wires are soaked in phenolic glue having a solid content of 75-78%;

[0016] S3, directional paving,

[0017] Laying the first layer: using bamboo pieces with a first thickness for paving, with the bamboo pieces in the same direction;

[0018] Laying the second layer: using bamboo pieces with a second thickness for paving, the bamboo pieces are in the same direction and are at an angle of 75 to 90 degrees to the direction of the first layer of bamboo pieces;

[0019] Laying the third layer: using bamboo pieces with a third thickness for paving, the bamboo pieces are in the same direction and form an angle of 75 to 90 degrees with the direction of the second layer of bamboo pieces;

[0020] Lay the fourth layer in the same way as the second layer, and the fifth layer in the same way as the first layer;

[0021] When laying each layer, metal wires are laid, with intervals of 1 to 5 cm in the width direction of the wires;

[0022] Thus, a slab for preparing the super-strong plate is obtained.

[0023] S4, hot pressing, hot pressing the slab obtained after paving,

[0024] S5, cutting the hot pressed slab, and then pressing it with a cold press to obtain the super strong slab.

[0025] The thickness of the bamboo piece is 0.6-1.2 mm, the first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.

[0026] In some embodiments of the present invention, the first thickness is 0.9-1.0 mm, the second thickness is 0.8-0.9 mm, and the third thickness is 0.7-0.8 mm.

[0027] In some embodiments of the present invention, the method for obtaining bamboo chips is as follows:

[0028] The original bamboo of 4 to 5 years old is sawn into bamboo tubes of 10 to 15 cm, the green bamboo is polished off, and the bamboo tubes are processed by rotary cutting to obtain bamboo slices with the first thickness, the second thickness and the third thickness.

[0029] In some embodiments of the present invention, the blade of the knife used for peeling is W-shaped. The bamboo pieces thus obtained have grooves, which can enhance gluing on the one hand, and on the other hand, the metal wire is laid in the grooves of the bamboo pieces to fill the gaps on the surface of the bamboo pieces, further enhancing the gluing effect of the upper and lower layers.

[0030] In some embodiments of the present invention, when laying the metal wire, both ends of the metal wire extend out of the slab and are tightened by an external tensioner. Preferably, the metal wire is tightened by a deadweight block, and the weight of the deadweight block is 5 to 8 kg.

[0031] In some embodiments of the present invention, the phenolic glue with a solid content of 75-78% is obtained by adding 10-15% phenol to the phenolic glue.

[0032] In some embodiments of the present invention, when laying bamboo strips, the overlapping length in the length direction is 1 / 4 to 1 / 3 of the total length of the bamboo strips, and the overlapping width in the width direction is 1 / 5 to 1 / 4 of the width of the bamboo strips.

[0033] In some embodiments of the present invention, the moisture content of the bamboo pieces obtained in step S1 is 10-12%. Too high a moisture content will result in poor gluing, while too low a moisture content will cause the bamboo pieces to curl and deform.

[0034] In some embodiments of the present invention, in step S4, hot pressing is performed in the order of pre-pressing-pressurizing-maintaining-pressure-releasing, specifically:

[0035] (1) The pre-pressing stage is 0.5-1 MPa and the time is 1-2 minutes;

[0036] (2) During the pressurization phase, the pressure is directly increased to 4-5 MPa for 2-3 minutes;

[0037] (3) During the pressure maintenance phase, the pressure is controlled at 3-4 MPa, and the pressure is adjusted to 0.1 MPa for floating and pressure replenishment, and the time is 5-6 minutes;

[0038] (4) The pressure relief phase is step-by-step, with the pressure decreasing at 1 MPa / min for the first 2 minutes, followed by 0.5 MPa / min until it reaches 0 MPa, which takes 4 to 6 minutes.

[0039] In the present invention, the metal wire is in a tensioned state while maintaining hot pressing, and after the hot pressing is completed, the lateral load is removed. The bamboo pieces and the metal wire are fully solidified together and straightened internally to make the stress in the board consistent, avoid deformation, improve the bending resistance of the board, and finally obtain ultra-high strength.

[0040] The second aspect of the present invention provides a plate prepared by any method for preparing a super-strong plate as described in the first aspect of the present invention.

[0041] In the present invention, bamboo chips, shavings and bamboo shavings have the same meaning.

[0042] Beneficial effects of the present invention

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] The plate prepared by the present invention has a static bending strength of more than 180MPa, an elastic modulus of more than 15000MPa, and a moisture absorption thickness expansion rate of less than 2%. In the field of building materials, the important indicators for measuring the performance of plates are static bending strength, elastic modulus and moisture absorption thickness expansion rate. The higher the static bending strength and elastic modulus, the better the mechanical properties; the lower the moisture absorption thickness expansion rate, the better the weather resistance of the plate.

[0045] The board material of the present invention can be adapted to the needs of different scenarios, thereby enabling products to be developed layer by layer and extended downward, thereby consuming a large amount of bamboo resources and promoting the development of the bamboo industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 The cross-sectional view of the bamboo slices rotary cut by the W-shaped blade cutter in Example 1 of the present invention is shown. DETAILED DESCRIPTION

[0047] Unless otherwise indicated, implied from the context, or customary in the prior art, all parts and percentages in this application are based on weight, and the tests and characterization methods used are all synchronized with the filing date of this application. Where applicable, the contents of any patent, patent application or disclosure involved in this application are fully incorporated herein by reference, and their equivalent patent families are also introduced as references, especially the definitions of relevant terms in the art disclosed in these documents. If the definition of a specific term disclosed in the prior art is inconsistent with any definition provided in this application, the definition of the term provided in this application shall prevail.

[0048] Numerical ranges in this application are approximate values, so unless otherwise specified, they may include numerical values ​​outside the range. Numerical ranges include all numerical values ​​from the lower limit to the upper limit increased by 1 unit, provided that there is an interval of at least 2 units between any lower value and any higher value. For a range comprising a numerical value less than 1 or a range comprising a fraction greater than 1 (e.g., 1.1, 1.5, etc.), 1 unit is appropriately considered as 0.0001, 0.001, 0.01 or 0.1. For a range comprising a single digit less than 10 (e.g., 1 to 5), 1 unit is generally considered as 0.1. These are only specific examples of what is intended to be expressed, and all possible combinations of numerical values ​​between the lowest and highest values ​​listed are considered to be clearly recorded in this application.

[0049] The terms "comprising", "including", "having" and their derivatives do not exclude the presence of any other components, steps or processes, and are irrelevant to whether these other components, steps or processes are disclosed in this application. To eliminate any doubt, unless explicitly stated, all compositions using the terms "comprising", "including", or "having" in this application may include any additional additives, adjuvants or compounds. On the contrary, except for those necessary for operating performance, the term "essentially consisting of..." excludes any other components, steps or processes from the scope of any description of the term below. The term "consisting of..." does not include any components, steps or processes that are not specifically described or listed. Unless explicitly stated, the term "or" refers to the listed individual members or any combination thereof.

[0050] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments.

[0051] Example

[0052] The following examples are used to demonstrate preferred embodiments of the present invention. It will be appreciated by those skilled in the art that the techniques disclosed in the following examples represent techniques discovered by the inventors that can be used to implement the present invention and therefore can be considered as preferred embodiments of the present invention. However, it will be appreciated by those skilled in the art based on this specification that many modifications may be made to the specific embodiments disclosed herein and still achieve the same or similar results without departing from the spirit or scope of the present invention.

[0053] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the disclosure and materials cited therein are hereby incorporated by reference.

[0054] Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many technical equivalents to the specific embodiments of the invention described herein. Such equivalents are intended to be encompassed by the claims.

[0055] The experimental methods in the following examples are conventional methods unless otherwise specified. The instruments and equipment used in the following examples are conventional laboratory instruments and equipment unless otherwise specified; the experimental materials used in the following examples are purchased from conventional biochemical reagent stores unless otherwise specified.

[0056] Example 1 A method for preparing a super strong base plate

[0057] 1. Bamboo chip processing

[0058] Select 4-5 year old raw bamboo, which has the highest bamboo fiber strength, and obtain bamboo chips according to the following steps:

[0059] (1) Cut the original bamboo into bamboo tubes with a length of 10 to 15 cm. The bamboo tubes should not be too long, otherwise gaps will be created after subsequent stacking.

[0060] (2) Grinding off the green bamboo can effectively avoid the influence of green bamboo on gluing;

[0061] (3) using rotary cutting to set thickness, the bamboo tube is processed into bamboo slices with thicknesses of 0.7-0.8 mm, 0.8-0.9 mm, and 0.9-1.0 mm, and the width is the wall thickness of the bamboo tube cut in the radial direction, which is in the range of 0.8-3 cm;

[0062] The blade of the tool for cutting the bamboo tube is W-shaped (comb-shaped), with an inclination angle of 25 to 30 degrees, the interval between adjacent blades is 0.2 to 0.5 mm, the top to bottom of the blade is 0.1 to 0.3 mm, and the thickness of the blade extending from the cutting platform is adjustable. In this embodiment, it is adjusted to 0.7 to 0.8 mm, 0.8 to 0.9 mm, and 0.9 to 1.0 mm, respectively. As a result, the end of the cut bamboo piece is W-shaped (such as Figure 1 ), the thickness can be 0.7~0.8mm, 0.8~0.9mm, 0.9~1.0mm, there are 3 kinds of bamboo strips with a width of 0.8~3cm and a length of 10~15cm.

[0063] Since bamboo is a bundled tube structure, if a flat blade is used for cutting, it will tear and peel, resulting in a jagged surface. In addition, using a knife edge to shape the surface can achieve a more consistent effect.

[0064] (4) The moisture content of the processed bamboo strips is 10-12%. Too high a moisture content will result in poor gluing, while too low a moisture content will cause the bamboo strips to curl and deform.

[0065] 2. Wire Preparation

[0066] The metal wire (steel wire) is processed into a strip having a length of the slab size, and the diameter of the metal wire is 0.1 to 0.3 cm.

[0067] 3. Low temperature plasma treatment

[0068] The prepared metal wire and bamboo pieces are respectively put into a low-temperature plasma generator, and the differential excitation power supply is turned on. When the voltage reaches the air discharge voltage, a dielectric barrier discharge is formed between the two electrodes to generate cold plasma. The bamboo pieces continuously pass through the gap between the two electrodes under the action of the feed conveyor belt, the feed roller and the feed guide plate, and the double sides of the bamboo pieces are treated with cold plasma at 4.5 to 5.5 kilowatts per minute. Since the cold plasma treatment can change the chemical and physical properties of the material surface, the surface is etched to improve the surface roughness, and active functional groups are generated on the surface, the reactivity and compatibility of the material surface with the adhesive are improved, thereby improving its adhesion.

[0069] The test and analysis found that after cold plasma treatment, the content of oxygen-containing polar functional groups on the bamboo surface increased from 5.28-5.5% to 21.57-31.21%, which greatly enhanced the hydrophilicity of the bamboo surface, and also improved its surface wettability and thus improved the reactivity and compatibility between the bamboo surface and the adhesive. At the same time, the antenna angle decreased from 80-90° to 40-45°, which can improve the bonding performance between metal, board adhesive and bamboo, and thus improve the physical and mechanical properties of the board.

[0070] 4. Glue mixing

[0071] The bamboo strips are sprayed with high-solid-content phenolic glue to make the glue evenly applied, with the glue amount ranging from 60 to 80 g / ㎡. The metal wire is soaked in high-solid-content phenolic glue. 10 to 15% of phenol is added to the phenolic glue, so that the solid content of the phenolic glue is 75 to 78%, the gel time is 14 to 20 minutes, and the viscosity is 200 to 500 mPa.s.

[0072] 5. Directional paving

[0073] The bamboo strips are paved in a directional manner, with a 5-layer structure. The 1st and 5th layers are 0.9-1.0mm thick bamboo strips, which are paved longitudinally; the 2nd and 4th layers are 0.8-0.9mm thick bamboo strips, which are paved horizontally; and the core layer is 0.7-0.8mm bamboo strips. Paving the surface with thick bamboo strips can better utilize the bending and tensile properties of bamboo. The overlap of each layer of bamboo strips in the paving direction, that is, the length direction, is 1 / 4-1 / 3 of the length, and the overlap in the width direction is 1 / 5-1 / 4 of the width. The paving thickness is 4-6mm for the 1st and 5th layers, 3-5mm for the 2nd and 4th layers, and the thickness of the core layer is 2-4mm.

[0074] When paving each layer, lay a layer of metal wire. The direction of the metal wire and the bamboo pieces of this layer are consistent, and the metal wire width direction is 1 to 5 cm apart. The full slab is laid, and the metal wire and the surface of the bamboo pieces achieve a filling effect. The cross-section of the metal wire is triangular, and there are rough spikes on the surface, which is convenient for penetrating into the grooves of the bamboo pieces to make them tightly combined. When the board is under pressure, the metal wire plays a horizontal tensile and enhanced static bending effect, and at the same time fills the gaps in the surface of the bamboo pieces to enhance the gluing effect of the upper and lower layers. During paving, both ends of the metal wire extend out of the slab, and are tightened by an external tension force to maintain horizontal force. In this embodiment, a deadweight block is added to tighten, and the weight of the deadweight block is 5 to 8 kg.

[0075] 6. Hot pressing

[0076] The slab obtained after paving is hot pressed in the order of pre-pressing, pressurizing, maintaining pressure and releasing pressure, specifically:

[0077] (5) The pre-pressing stage is 0.5-1 MPa and the time is 1-2 min;

[0078] (6) During the pressurization phase, the pressure is increased directly and rapidly to 4-5 MPa for 2-3 minutes;

[0079] (7) During the pressure maintenance (damp removal) phase, the pressure is controlled at 3-4 MPa, and the pressure is adjusted to 0.1 MPa for floating and pressure replenishment, which takes 5-6 minutes;

[0080] (8) The pressure relief phase is step-by-step, with the pressure decreasing at 1 MPa / min for the first 2 minutes, followed by 0.5 MPa / min until it reaches 0 MPa, which takes 4 to 6 minutes.

[0081] When hot pressing is maintained, the metal wire is in a tensioned state. After hot pressing is completed, the lateral load is removed. The bamboo pieces and the metal wire are fully solidified together and straightened internally to make the stress in the board consistent, avoid deformation, improve the bending resistance of the board, and finally achieve ultra-high strength.

[0082] 7. Ballast

[0083] After cutting, the prepared boards are sent to a space with a temperature of 40-50°C and a humidity of 15% for stacking, and then sent to a cold press for ballasting with a pressure of 1-1.2MPa and a balancing time of 24 hours.

[0084] The density of the prepared board exceeds 850Kg / m 3 .

[0085] Comparative Example 1

[0086] Except that water-based phenolic resin with a conventional solid content (solid content of 45-55%) is used in the glue mixing process, the rest of the processing procedures and parameters are the same as those in Example 1.

[0087] Comparative Example 2

[0088] In the bamboo chip processing, a flat blade is used to cut ordinary bamboo chips, and the rest of the processing procedures and parameters are the same as those in Example 1.

[0089] Comparative Example 3

[0090] During the directional paving process, the metal wire is not tightened, and the rest of the processing procedures and parameters are the same as those in Example 1.

[0091] Comparative Example 4

[0092] During the directional paving process, the metal wires were spaced 8 cm apart in width direction, and the rest of the processing procedures and parameters were the same as those in Example 1.

[0093] Comparative Example 5

[0094] During the directional paving process, the laying direction of the metal wire is inconsistent with the direction of the groove on the surface of the bamboo piece (at an angle of 45°), and the rest of the processing procedures and parameters are the same as those in Example 1.

[0095] Comparative Example 6

[0096] In the hot pressing step, a conventional hot pressing method is adopted, that is, a process of rapid pressurization-pressure maintenance-pressure relief, that is, there is no pre-pressing process, and the rest of the processing flow and parameters are the same as those in Example 1.

[0097] Comparative Example 7

[0098] Ultrasonic treatment was used instead of cryopreservation.

[0099] Comparative Example 8

[0100] In the bamboo chip processing step, the moisture content of the bamboo chips is 20%.

[0101] Example 2 Plate performance test

[0102] The performance tests were conducted on the plates obtained in Example 1 and Comparative Examples 1 to 8, respectively, and the static bending strength, elastic modulus and moisture absorption thickness expansion rate were measured. The results are shown in Table 1:

[0103] Table 1 Properties of the plates obtained in Example 1 and Comparative Examples 1 to 8

[0104]

[0105]

[0106] From Table 1 we can see that:

[0107] The performance of the board obtained in comparative example 1 is significantly lower than that of the board obtained in example 1. Further analysis shows that low adhesive content will affect the bonding strength within the bamboo pieces. In addition, due to the increased moisture content, the hot pressing time needs to be extended, and there is also the possibility that the water vapor cannot be discharged and the board may burst.

[0108] The performance of the board obtained in Comparative Example 2 is significantly lower than that of the board obtained in Example 1. Analysis shows that this is because the bonding area of ​​the bamboo strips cut by the flat blade is reduced by about 20%, and additional press pressure is required to promote the bonding of the bamboo strips.

[0109] The performance of the boards obtained in Comparative Examples 3 to 5 is significantly lower than that of the boards obtained in Example 1. This is because the metal wires are not in a tensioned state and cannot tighten the stress in the slabs. The spacing between the wires is too wide and cannot be effectively distributed. The laying direction is inconsistent with the direction of the bamboo grooves, all of which affect the gluing effect (hinder gluing), greatly reducing the performance of the boards obtained.

[0110] The performance of the board obtained in Comparative Example 6 is significantly lower than that of the board obtained in Example 1, indicating that pre-pressing is a key step that can promote the plastic shaping of the bamboo board blank. Direct and rapid hot pressing will fail to achieve gluing, resulting in poor results. In addition, the use of conventional hot pressing methods will also cause the water vapor inside the board blank to be rapidly discharged, resulting in an increased probability of board explosion.

[0111] The performance of the plate obtained in Comparative Example 7 is significantly lower than that of the plate obtained in Example 1, which shows that the low-temperature plasma treatment has achieved unexpected technical effects.

[0112] The performance of the board obtained in Comparative Example 8 is significantly lower than that of the board obtained in Example 1. Analysis shows that too high a moisture content will cause poor bonding, thus affecting the performance of the board.

[0113] All documents mentioned in the present invention are cited as references in this application, just as each document is cited as reference individually. In addition, it should be understood that after reading the above teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

Claims

1. A method for preparing a super-strong plate, characterized in that: The following steps are involved: S1, obtaining bamboo pieces with a length of 10-15 cm and a first thickness, a second thickness and a third thickness and a metal wire with a diameter of 0.1-0.3 cm, and performing low-temperature plasma treatment on each of them; S2, the bamboo pieces are atomized and mixed with phenolic glue having a solid content of 75-78%, and the metal wires are soaked in phenolic glue having a solid content of 75-78%; S3, directional paving, Laying the first layer: using bamboo pieces with a first thickness for paving, with the bamboo pieces in the same direction; Laying the second layer: using bamboo pieces with a second thickness for paving, the bamboo pieces are in the same direction and at an angle of 75-90° to the direction of the first layer of bamboo pieces; Laying the third layer: using bamboo pieces with the third thickness for paving, the bamboo pieces are in the same direction and at an angle of 75-90° to the direction of the second layer of bamboo pieces; Lay the fourth layer in the same way as the second layer, and the fifth layer in the same way as the first layer; When laying each layer, metal wires are laid with a spacing of 1 to 5 cm in the width direction; Thus, a slab for preparing the super-strong plate is obtained. S4, hot pressing, hot pressing the slab obtained after paving, S5, cutting the hot pressed slab, and then pressing it with a cold press to obtain the super strong slab. The thickness of the bamboo piece is 0.6-1.2 mm, the first thickness is greater than the second thickness, and the second thickness is greater than the third thickness. The method for obtaining the bamboo piece is as follows: The original bamboo of 4 to 5 years old is sawn into bamboo tubes of 10 to 15 cm, the green bamboo is polished off, and the bamboo tubes are processed by rotary cutting to obtain bamboo slices with the first thickness, the second thickness and the third thickness, respectively. The blade of the tool used for rotary cutting is W-shaped.

2. The method for preparing a super-strong plate according to claim 1, characterized in that: The first thickness is 0.9-1.0 mm, the second thickness is 0.8-0.9 mm, and the third thickness is 0.7-0.8 mm.

3. The method for preparing a super-strong plate according to claim 1, characterized in that: The metal wire is laid in the groove of the bamboo piece.

4. The method for preparing a super-strong plate according to claim 3, characterized in that: When laying the wire, both ends of the wire extend out of the slab and are tightened by an external tensioner.

5. A method for preparing a super-strong plate according to any one of claims 1 to 4, characterized in that: Phenolic glue with a solid content of 75-78% is obtained by adding 10-15% phenol to phenolic glue.

6. A method for preparing a super-strong plate according to any one of claims 1 to 4, characterized in that: When laying bamboo strips, the overlap length in the length direction is 1 / 4~1 / 3 of the total length of the bamboo strips, and the overlap width in the width direction is 1 / 5~1 / 4 of the width of the bamboo strips.

7. A method for preparing a super-strong plate according to any one of claims 1 to 4, characterized in that: The moisture content of the bamboo chips obtained in step S1 is 10-12%.

8. A plate prepared by the method for preparing a super-strong plate according to any one of claims 1 to 7.

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