Device and method for reducing conductivity of cooling water of TCR valve group of SVC system

Abstract

The application discloses a device for reducing the electric conductivity of cooling water of an SVC system TCR valve group, and relates to the technical field of cooling systems.The device comprises a high-level water tank and a deionization tank; the water outlet end of the high-level water tank is connected with the water inlet end of the SVC valve group through a pipeline; the water outlet end of the SVC valve group is connected with the water return end of the high-level water tank through a pipeline; and the deionization tank is arranged on the pipeline between the high-level water tank and the SVC valve group. The deionization tank is arranged in the circulating pipeline between the high-level water tank and the SVC valve group, the ion content in the cooling water system is significantly reduced through the deionization tank, the personnel maintenance cost is reduced, and the stable operation of the SVC system is ensured.

Description

Technical Field

[0001] This invention relates to the field of cooling system technology, and in particular to a device and method for reducing the conductivity of cooling water in a TCR valve group of an SVC system. Background Technology

[0002] The heat generated by the thyristor in the TCR system of the SVC system needs to be carried away by circulating pure water. For the circulating cooling water in a 10kV system, conductivity is a crucial indicator. In long-term operation of the water-cooled system, factors such as the ionization effect of the valve group's electric field on the cooling water, pipe corrosion, and failure to promptly drain water can increase the ion concentration in the circulating cooling water, causing the SVC system to malfunction. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a device and method for reducing the conductivity of cooling water in the TCR valve group of an SVC system.

[0004] To solve the above technical problems, the technical solution of the present invention is as follows:

[0005] This invention provides a device for reducing the conductivity of cooling water in a TCR valve group of an SVC system, comprising an elevated water tank and a deionization tank;

[0006] The outlet of the elevated water tank is connected to the inlet of the SVC valve assembly via a pipeline, and the outlet of the SVC valve assembly is connected to the return end of the elevated water tank via a pipeline.

[0007] The deionization tank is installed on the pipeline between the elevated water tank and the SVC valve assembly.

[0008] As a preferred embodiment of the device for reducing the conductivity of cooling water in the TCR valve group of the SVC system according to the present invention, it further includes a cooler, wherein the inlet end of the cooler is connected to the outlet end of the SVC valve group, and the outlet end of the cooler is connected to the inlet end of the SVC valve group.

[0009] As a preferred embodiment of the device for reducing the conductivity of cooling water in the TCR valve group of the SVC system according to the present invention, it further includes a delivery water pump, which includes a first delivery water pump and a second delivery water pump.

[0010] The first water pump is connected between the outlet end of the SVC valve assembly and the return end of the high-level water tank.

[0011] The second water pump is connected between the outlet of the SVC valve assembly and the inlet of the cooler.

[0012] As a preferred embodiment of the device for reducing the conductivity of cooling water in the TCR valve group of the SVC system according to the present invention, the deion tank includes a first deion tank and a second deion tank.

[0013] The first deionization tank is located between the outlet of the SVC valve assembly and the inlet of the cooler, and the second deionization tank is located between the outlet of the SVC valve assembly and the return end of the high-level water tank.

[0014] As a preferred embodiment of the device for reducing the conductivity of cooling water in the TCR valve group of the SVC system according to the present invention, the cooling water contained in the high-level water tank is pure water.

[0015] The present invention also provides a method for reducing the conductivity of cooling water in a TCR valve assembly of an SVC system, comprising:

[0016] The first and second water pumps are controlled to operate alternately, so that the cooling water in the high-level water tank enters the SVC valve group to cool it down.

[0017] Cooling water flowing out of the SVC valve assembly enters the cooler through the first deion tank, where it exchanges heat with the external water of the cooler and cools down before re-entering the SVC valve assembly. At the same time, cooling water flowing out of the SVC valve assembly enters the high-level water tank through the second deion tank and then enters the SVC valve assembly.

[0018] The beneficial effects of this invention are:

[0019] (1) The present invention installs a deionizer in the circulation pipeline between the high-level water tank and the SVC valve group, thereby significantly reducing the ion content in the cooling water system, thereby reducing personnel maintenance costs and ensuring the stable operation of the SVC system.

[0020] (2) The cooling water in the high-level water tank of the present invention is pure water. The ion content in pure water is low, which reduces the initial conductivity of the cooling water. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the device for reducing the conductivity of cooling water in the TCR valve group of an SVC system provided by the present invention;

[0023] The components include: 1. High-level water tank; 2. SVC valve group; 3. Cooler; 4. First deionization tank; 5. Second deionization tank; 6. First delivery water pump; 7. First delivery water pump. Detailed Implementation

[0024] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0025] Figure 1 This is a schematic diagram of a device for reducing the conductivity of cooling water in the TCR valve assembly of an SVC system, provided in an embodiment of this application. The device includes a high-level water tank 1, a deionization tank, and a cooler 3. Cooling water in the high-level water tank 1 flows into the SVC valve assembly 2, where it exchanges heat with the thyristor in the SVC valve assembly 2, cooling it down, and then returns to the high-level water tank 1, achieving a circulating flow of cooling water. The deionization tank is located on the pipeline between the high-level water tank 1 and the SVC valve assembly 2, reducing the ion content in the cooling water. The cooler 3 cools the cooling water circulating between the SVC valve assembly 2 and the high-level water tank 1, improving the cooling effect of the cooling water on the thyristor in the SVC valve assembly 2.

[0026] For details, see Figure 1 The outlet of the elevated water tank 1 is connected to the inlet of the SVC valve assembly 2 via a pipeline, and the outlet of the SVC valve assembly 2 is connected to the return end of the elevated water tank 1 via a pipeline. Cooling water in the elevated water tank 1 can enter the SVC valve assembly 2 through the pipeline, where it exchanges heat with the thyristor in the SVC valve assembly 2 to maintain its suitable operating temperature. After heat exchange, the cooling water returns to the elevated water tank 1, achieving a circulating flow of cooling water.

[0027] The outlet of SVC valve assembly 2 is also connected to the inlet of cooler 3, and the outlet of cooler 3 is connected to the inlet of SVC valve assembly 2. The cooling water flowing out of the outlet of SVC valve assembly 2 can enter cooler 3 through pipelines, exchange heat with the external water in cooler 3 to cool the water, and then flow out through the outlet of cooler 3 and enter SVC valve assembly 2, so that the temperature of the cooling water entering SVC valve assembly 2 is lower, thereby ensuring the cooling effect of the cooling water on the thyristor in SVC valve assembly 2.

[0028] In this embodiment, the cooler 3 is a water-to-water cooler 3. After the cooling water enters the water-to-water cooler 3, it exchanges heat with the external industrial circulating water to achieve cooling of the cooling water.

[0029] The deionization tank includes a first deionization tank 4 and a second deionization tank 5. The first deionization tank 4 is located between the outlet of the SVC valve assembly 2 and the inlet of the cooler 3. The second deionization tank 5 is located between the outlet of the SVC valve assembly 2 and the return water of the elevated water tank 1. By installing the first deionization tank 4 and the second deionization tank 5, the ion content of the circulating cooling water in the pipeline can be effectively reduced, ensuring the normal operation of the SVC valve assembly 2.

[0030] To ensure the circulation of cooling water in the system piping, a delivery water pump is also installed in the system piping. This delivery water pump includes a first delivery water pump 76 and a second delivery water pump. The first delivery water pump 76 is connected between the outlet of the SVC valve assembly 2 and the return water of the high-level water tank 1. The second delivery water pump is connected between the outlet of the SVC valve assembly 2 and the inlet of the cooler 3. The first delivery water pump 76 and the second delivery water pump operate alternately at regular intervals, causing the cooling water to circulate in the system piping.

[0031] In this embodiment, the cooling water in the high-level water tank 1 is purified water. Purified water has a low ion content, which reduces the initial conductivity of the cooling water. Preferably, the high-level water tank 1 is also equipped with a level gauge and a water level alarm device to ensure that the system will not experience water shortage due to leakage.

[0032] This application also provides a method for reducing the conductivity of cooling water in a TCR valve group of an SVC system. The method includes steps S101 to S102, and the specific steps are described below:

[0033] Step S101: Control the first delivery water pump 76 and the second delivery water pump to operate alternately, so that the cooling water in the high-level water tank 1 enters the SVC valve group 2 to cool it down;

[0034] Step S102: The cooling water flowing out of the outlet of SVC valve group 2 enters the cooler 3 through the first deion tank 4, exchanges heat with the external water of the cooler 3, and after cooling down, enters SVC valve group 2 again. At the same time, the cooling water flowing out of the outlet of SVC valve group 2 enters the high-level water tank 1 through the second deion tank 5, and then enters SVC valve group 2.

[0035] By adopting the above method, the conductivity of the cooling water in the SVC system can reach a maximum of 0.65, and the conductivity stabilization period is long.

[0036] Therefore, the technical solution of this application installs a deionizer in the circulation pipeline between the high-level water tank 1 and the SVC valve group 2, which significantly reduces the ion content in the cooling water system, thereby reducing personnel maintenance costs and ensuring the stable operation of the SVC system.

[0037] In addition to the above embodiments, the present invention may have other implementation methods; all technical solutions formed by equivalent substitution or equivalent transformation fall within the protection scope claimed by the present invention.

Claims

1. A device for reducing the electrical conductivity of cooling water in a TCR valve train of an S VC system, characterized by: The high water tank (1) and the deionization tank are included. The outlet of the high water tank (1) is connected with the inlet of the SVC valve group (2) through a pipeline, and the outlet of the SVC valve group (2) is connected with the return water end of the high water tank (1) through a pipeline. The deionization tank is arranged on the pipeline between the high water tank (1) and the SVC valve group (2). The cooler (3) is further included, the inlet of the cooler (3) is connected with the outlet of the SVC valve group (2), and the outlet of the cooler (3) is connected with the inlet of the SVC valve group (2). The deionization tank includes the first deionization tank (4) and the second deionization tank (5). The first deionization tank (4) is arranged between the outlet of the SVC valve group (2) and the inlet of the cooler (3), and the second deionization tank (5) is arranged between the outlet of the SVC valve group (2) and the return water end of the high water tank (1).

2. The apparatus of claim 1, wherein: The delivery water pump is further included, and the delivery water pump includes the first delivery water pump (6) and the second delivery water pump (7). The first delivery water pump (6) is connected between the outlet of the SVC valve group (2) and the return water end of the high water tank (1). The second delivery water pump (7) is connected between the outlet of the SVC valve group (2) and the inlet of the cooler (3).

3. The apparatus of claim 1, wherein: The cooling water contained in the high water tank (1) is pure water.

4. A method of reducing the conductivity of cooling water for a TCR valve train of an S VC system, characterized by: The following are included: The first delivery water pump (6) and the second delivery water pump (7) are controlled to alternately operate, so that the cooling water in the high water tank (1) enters the SVC valve group (2) to cool the SVC valve group (2); The cooling water flowing out of the outlet of the SVC valve group (2) enters the cooler (3) through the first deionization tank (4), exchanges heat with the external water of the cooler (3), is cooled again, and then enters the SVC valve group (2) again, and at the same time, the cooling water flowing out of the outlet of the SVC valve group (2) enters the high water tank (1) through the second deionization tank (5) and then enters the SVC valve group (2).

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