Copper-clad ceramic structure and method for preparing copper-clad ceramic structure

Abstract

The application discloses a copper-clad ceramic structural member and a preparation method thereof. The copper-clad ceramic structural member comprises a substrate body, the substrate body is provided with a pin seat positioning hole; a plurality of pin seats are arranged in the pin seat positioning hole respectively, and the pin seat and the substrate body are fixedly connected; and a pin is connected with the pin seat correspondingly. The pin seat positioning hole is additionally arranged on the substrate body, so that the position of the pin seat on the substrate body can be accurately determined, deviation of the position of the pin seat is avoided, the pin seat with slight deviation can be pulled back to the design position by means of the siphon effect, the pin can be accurately connected with the pin seat, the pin cannot be inserted into the pin seat due to the deviation of the position of the pin seat, damage to the substrate body is avoided, the preparation yield of the copper-clad ceramic structural member is improved, and the production cost is reduced.

Description

Technical Field

[0001] This application belongs to the field of electronic technology, and in particular relates to a copper-clad ceramic structural component and a method for preparing the copper-clad ceramic structural component. Background Technology

[0002] Copper-clad ceramic structural components include copper-clad ceramic substrates. Copper-clad ceramic substrates have excellent thermal cycling properties, shape stability, high rigidity, high thermal conductivity, and high reliability. Various patterns can be etched onto the copper-clad surface. Furthermore, it is a pollution-free and environmentally friendly product with a wide operating temperature range of -55℃ to 850℃. Its coefficient of thermal expansion is close to that of silicon, making it suitable for a wide range of applications: semiconductor coolers, electronic heaters, high-power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace and military electronic components, solar panel components, telecommunications switches, receiving systems, and laser industrial electronics.

[0003] However, due to the structural limitations of existing copper-clad ceramic structural components, the positional accuracy of the pin sockets on the copper-clad ceramic structural components cannot meet the requirements.

[0004] Therefore, there is an urgent need for a new copper-clad ceramic structural component and a method for preparing copper-clad ceramic structural components. Summary of the Invention

[0005] This application provides a copper-clad ceramic structural component and a method for manufacturing the copper-clad ceramic structural component. By additionally setting pin seat positioning holes on the substrate body, the position of the pin seat on the substrate body can be accurately determined, avoiding positional deviations of the pin seat and ensuring that the pin can be accurately connected to the pin seat. This prevents the pin from being unable to be inserted into the pin seat due to positional deviations, thereby avoiding damage to the substrate body, improving the yield of the copper-clad ceramic structural component, and reducing production costs.

[0006] One embodiment of this application provides a copper-clad ceramic structural component, comprising: a substrate body having pin seat positioning holes; a plurality of pin seats, each pin seat being disposed within the pin seat positioning holes and fixedly connected to the substrate body; and pins correspondingly connected to the pin seats.

[0007] According to one aspect of this application, the pin seat positioning hole is a blind hole; the depth of the blind hole is 0.1 mm to 0.2 mm along the thickness direction of the substrate body.

[0008] According to one aspect of this application, the pin holder has a predetermined interval between the outer edge of the orthographic projection of the substrate body on the substrate body and the outer edge of the orthographic projection of the pin holder positioning hole on the substrate body.

[0009] According to one aspect of this application, the predetermined interval ranges from 0.05 mm to 0.2 mm.

[0010] According to one aspect of this application, the orthographic projection of the pin holder on the substrate body and the orthographic projection of the pin holder positioning hole on the substrate body coincide.

[0011] According to one aspect of this application, the orthographic projection pattern of the pin holder on the substrate body and the orthographic projection pattern of the pin holder positioning hole on the substrate body are the same.

[0012] According to one aspect of this application, the pin socket and the substrate body are welded together by a solder joint.

[0013] According to one aspect of this application, the substrate body includes a first metal layer, a ceramic layer and a second metal layer stacked together, and the pin seat positioning hole is formed in at least the second metal layer.

[0014] Another aspect of the present invention provides a method for preparing a copper-clad ceramic structural component, comprising the following steps: providing a substrate body to be processed; forming patterned pin seat positioning holes on one side of the substrate body to be processed using a mask; setting pin seats in the pin seat positioning holes and fixing the pin seats and the substrate body to be processed in a fixed connection; and connecting the pins and the pin seats.

[0015] According to another aspect of this application, in the step of forming patterned pin positioning holes on one side of the substrate body using a mask: the patterned pin positioning holes are formed on one side of the substrate body using a dry etching process or a wet etching process.

[0016] Compared with the prior art, the copper-clad ceramic structural component provided in this embodiment of the invention includes a substrate body, a pin socket, and pins. Compared with the prior art, this embodiment of the invention additionally provides pin socket positioning holes on the substrate body to accurately determine the position of the pin socket on the substrate body, avoid positional deviation of the pin socket, ensure that the pins can accurately correspond to the pin socket for connection, and prevent the pins from being unable to be inserted into the pin socket due to positional deviation of the pin socket, thereby avoiding damage to the substrate body, improving the manufacturing yield of the copper-clad ceramic structural component, and reducing production costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a copper-clad ceramic structural component provided in one embodiment of this application;

[0019] Figure 2 yes Figure 1 A membrane structure diagram provided in one embodiment at point A-A';

[0020] Figure 3 yes Figure 1 A structural schematic diagram provided in one embodiment at point B;

[0021] Figure 4 This is a flowchart of a method for preparing a copper-clad ceramic structural component according to one embodiment of this application;

[0022] Figure 5 This is a cross-sectional schematic diagram of the structure obtained in step S110 of the method for preparing copper-clad ceramic structural parts according to an embodiment of the present invention;

[0023] Figure 6 This is a schematic cross-sectional view of the structure obtained in step S120 of the method for preparing copper-clad ceramic structural parts according to an embodiment of the present invention;

[0024] Figure 7 This is a cross-sectional schematic diagram of the structure obtained in step S130 of the method for preparing copper-clad ceramic structural parts according to an embodiment of the present invention.

[0025] Attached Figure

[0026] 1-Substrate body; 11-First metal layer; 12-Ceramic layer; 13-Second metal layer; 2-Pin socket; 3-Pin; K-Pin socket positioning hole. Detailed Implementation

[0027] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0029] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0030] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0031] This application provides a copper-clad ceramic structural component and a method for manufacturing the copper-clad ceramic structural component. The following will be described in conjunction with the attached drawings. Figures 1 to 7 Various embodiments of copper-clad ceramic structural components and their preparation methods are described.

[0032] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a copper-clad ceramic structural component provided in one embodiment of this application; Figure 2 yes Figure 1 A membrane structure diagram provided in one embodiment at point A-A'; Figure 3 yes Figure 1 A schematic diagram of a structure provided in one embodiment is shown at point B.

[0033] The copper-clad ceramic structural component provided in this application includes: a substrate body 1, the substrate body 1 having a pin seat positioning hole K; a plurality of pin seats 2, each pin seat 2 being disposed in the pin seat positioning hole K, and the pin seat 2 being fixedly connected to the substrate body 1; and pins 3, which are correspondingly connected to the pin seats 2.

[0034] The copper-clad ceramic structural component provided in this embodiment of the invention includes a substrate body 1, a pin holder 2, and pins 3. Compared with the prior art, this embodiment of the invention provides an additional pin holder positioning hole K on the substrate body 1 to accurately determine the position of the pin holder 2 on the substrate body 1, avoiding positional deviation of the pin holder 2. At the same time, the siphon effect can pull the slightly deviated pin holder back to the designed position to ensure that the pin 3 can accurately correspond to and connect with the pin holder 2, and the pin 3 will not be unable to be inserted into the pin holder 2 due to positional deviation of the pin holder 2. This avoids damage to the substrate body 1, improves the manufacturing yield of the copper-clad ceramic structural component, and reduces production costs.

[0035] The copper-clad ceramic structural component in this embodiment of the invention is also called copper-clad ceramic, which is an electronic basic material made by directly sintering copper foil onto the ceramic surface using DCB (Direct CopperBond) technology.

[0036] In this embodiment, as Figure 2 As shown, optionally, the substrate body 1 includes a first metal layer 11, a ceramic layer 12 and a second metal layer 13 stacked together, and at least the second metal layer 13 has a pin seat positioning hole K.

[0037] Both the first metal layer 11 and the second metal layer 13 can be made of copper. At least the second metal layer 13 has a pin socket positioning hole K, thus the second metal layer 13 is used for conduction and signal transmission. The first metal layer 11 is located on the other side of the ceramic layer 12 to provide heat dissipation for the heat sink. The ceramic layer 12 is an ideal insulating material with high thermal conductivity.

[0038] It should be noted that the lead socket positioning hole K in the embodiments of the present invention is usually a blind hole, that is, the lead socket positioning hole K does not penetrate the entire substrate body 1. When the lead socket positioning hole K is opened in the second metal layer 13, part of the second metal layer 13 can be etched to form the lead socket positioning hole K. The lead socket positioning hole K can expose the ceramic layer 12 or not expose the ceramic layer 12, so as to facilitate the soldering connection of the lead socket 2 and the second metal layer 13.

[0039] Please see Figure 2 and Figure 3In some optional embodiments, the pin header positioning hole K is a blind hole; the depth of the blind hole along the thickness direction of the substrate body 1 is 0.1mm to 0.2mm. It is understood that the depth of the blind hole should not be too large, as this may affect the overall structural strength of the substrate body 1 and the connection effect between the pin header 2 and the substrate body 1. The depth of the blind hole should also not be too small, as this may affect the positioning effect of the pin header 2. In this embodiment, the depth of the blind hole can specifically be any one of 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, and 0.2mm, and can be selected according to actual conditions without special limitation.

[0040] In some optional embodiments, the pin holder 2 and the substrate body 1 are welded together by a soldering part, which is specifically solder paste. Solder paste is a homogeneous mixture composed of alloy solder powder, paste flux and some additives, and has a certain viscosity and good thixotropic properties.

[0041] Considering that the solder paste has a certain fluidity after melting, in order to avoid the solder paste overflowing on the surface of the substrate body 1, optionally, there is a predetermined interval between the outer edge of the orthogonal projection of the pin seat 2 on the substrate body 1 and the outer edge of the orthogonal projection of the pin seat positioning hole K on the substrate body 1.

[0042] In this embodiment, the size of the pin socket positioning hole K is larger than the size of the pin socket 2. After the pin socket 2 is placed in the pin socket positioning hole K, there is still a part of free space in the pin socket positioning hole K, that is, the area where the predetermined interval is located, which can be used to accommodate the molten solder paste. That is, the solder paste under reflow soldering can also be pulled back into the pin socket positioning hole K by the siphon effect, avoiding the solder paste flowing around on the surface of the substrate body 1, and improving the preparation yield of copper-clad ceramic structural parts.

[0043] In some optional embodiments, the predetermined interval ranges from 0.05 mm to 0.2 mm.

[0044] Understandably, the predetermined interval should not be too large, as this may affect the positioning effect of the pin socket positioning hole K on the pin socket 2. The predetermined interval should also not be too small, as this will result in insufficient space in the pin socket positioning hole K to accommodate the solder paste, thus failing to effectively hold the solder paste. Optionally, the predetermined interval can be any of 0.05mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, or 0.2mm, and the specific choice can be made based on the actual situation without any particular limitation.

[0045] In some optional embodiments, the orthographic projection pattern of the pin holder 2 on the substrate body 1 is the same as the orthographic projection pattern of the pin holder positioning hole K on the substrate body 1, so as to accurately position the pin holder 2 in the pin holder positioning hole K.

[0046] For example, when the orthographic projection of the pin header 2 onto the substrate body 1 is circular, the orthographic projection of the pin header positioning hole K onto the substrate body 1 is also circular, and the radius of the orthographic projection of the circular pin header positioning hole K is greater than or equal to the radius of the orthographic projection of the circular pin header 2. Alternatively, when the orthographic projection of the pin header 2 onto the substrate body 1 is rectangular, the orthographic projection of the pin header positioning hole K onto the substrate body 1 is also rectangular. Of course, other shapes can also be used for the orthographic projections of the pin header 2 and the pin header positioning hole K onto the substrate body 1, and can be selected according to actual needs without special limitations.

[0047] To ensure the accuracy of the pin locating hole K in defining the position of the pin 2, in some alternative embodiments, the orthographic projection of the pin 2 on the substrate body 1 coincides with the orthographic projection of the pin locating hole K on the substrate body 1.

[0048] It is understandable that the size and shape of the orthographic projection of the pin seat 2 on the substrate body 1 are exactly the same as the size and shape of the orthographic projection of the pin seat positioning hole K on the substrate body 1, so that the pin seat 2 can be placed exactly in the pin seat positioning hole K, ensuring the accuracy of the position of the pin seat 2 on the substrate body 1, and the pin seat positioning hole K can play a certain role in fixing the pin seat 2.

[0049] Please see Figure 4 This invention also provides a method for preparing copper-clad ceramic structural components, comprising the following steps:

[0050] S110: Provides a substrate body 1 to be processed, such as Figure 5 As shown;

[0051] S120: Using a mask, patterned pin positioning holes K are formed on one side of the substrate body 1 to be processed, such as... Figure 6 As shown;

[0052] S130: A pin holder 2 is installed within the pin holder positioning hole K, and the pin holder 2 is fixedly connected to the substrate body 1 to be processed. Figure 7 As shown; S140: Connect pin 3 and pin socket 2, as follows. Figure 2 As shown.

[0053] The copper-clad ceramic structural component manufacturing method provided in this embodiment of the invention forms patterned pin seat positioning holes K on one side of the substrate body 1 to accurately determine the position of the pin seat 2 on the substrate body 1, avoids positional deviation of the pin seat 2, ensures that the pin 3 can accurately correspond to and connect with the pin seat 2, and does not cause the pin 3 to be unable to be inserted into the pin seat 2 due to positional deviation of the pin seat 2, thereby avoiding damage to the substrate body 1, improving the manufacturing yield of the copper-clad ceramic structural component and reducing production costs.

[0054] In step S110, the substrate body 1 to be processed can be made by directly sintering copper foil onto the ceramic surface using DCB (Direct Copper Bond) technology.

[0055] In step S120, a mask can be used to cover the area of ​​the substrate body 1 that does not need to be etched, while exposing the area of ​​the substrate body 1 that needs to be etched, so as to remove part of the material of the substrate body 1 and form the required pin seat positioning hole K.

[0056] Optionally, in the step of forming patterned pin positioning holes K on one side of the substrate body 1 using a mask: the patterned pin positioning holes K are formed on one side of the substrate body 1 using a dry etching process or a wet etching process. The mask can have the same shape as the substrate body 1, but the mask has mask openings corresponding to the pin positioning holes K.

[0057] Etching includes dry etching and wet etching processes. The difference lies in the use of solvents or solutions for etching. Wet etching is a purely chemical reaction process that utilizes the chemical reaction between a solution and the pre-etching material to remove the unmasked portions. Its advantages include good selectivity, high repeatability, high production efficiency, simple equipment, and low cost. Dry etching processes, on the other hand, include various types such as photoelectrolysis, vapor phase etching, and plasma etching. The advantages of dry etching are: good anisotropy, high selectivity, good controllability, flexibility, and repeatability; safe operation on fine lines; easy automation; no chemical waste liquid; no pollution introduced during the process; and high cleanliness.

[0058] In step S130, the pin seat 2 can be positioned on the substrate body 1 by using the pin seat positioning hole K. After the pin seat 2 is placed in the pin seat positioning hole K, the pin seat 2 and the substrate body 1 can be fixedly connected by welding. Specifically, the size of the pin seat positioning hole K can be set to be larger than the size of the pin seat 2. After the pin seat 2 is placed in the pin seat positioning hole K, there is still some free space in the pin seat positioning hole K, which can be used to accommodate the molten solder paste. That is, the solder paste under reflow soldering can also be pulled back into the pin seat positioning hole K by the siphon effect, avoiding the solder paste from flowing around on the surface of the substrate body 1, thus improving the preparation yield of copper-clad ceramic structural parts.

[0059] In step S140, since the pin locating hole K is used to improve the accuracy of the pin locator 2 on the substrate body 1 to be processed, the pin 3 can also be accurately inserted into the pin locator 2.

[0060] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0061] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A copper-clad ceramic structural component, characterized in that, include: A substrate body, wherein the substrate body has pin socket positioning holes, and the pin socket positioning holes are blind holes; Multiple pin sockets are provided, each pin socket is disposed in a pin socket positioning hole, and the pin socket and the substrate body are fixedly connected by welding. There is a predetermined interval between the outer edge of the pin socket's orthogonal projection on the substrate body and the outer edge of the pin socket positioning hole's orthogonal projection on the substrate body. There is a space around the pin socket in the pin socket positioning hole for accommodating molten solder paste. The solder paste under reflow soldering can be pulled back into the pin socket positioning hole by a siphon effect. The pins are connected to the corresponding pin sockets; In the thickness direction of the substrate body, the depth of the blind hole is 0.1mm~0.2mm to ensure the structural strength of the substrate body and the reliability of the connection between the pin socket and the substrate body.

2. The copper-clad ceramic structural component according to claim 1, characterized in that, The predetermined interval is in the range of 0.05mm to 0.2mm.

3. The copper-clad ceramic structural component according to any one of claims 1 to 2, characterized in that, The orthographic projection of the pin socket on the substrate body and the orthographic projection of the pin socket positioning hole on the substrate body are the same.

4. The copper-clad ceramic structural component according to claim 1, characterized in that, The pin socket and the substrate body are welded together by a solder joint.

5. The copper-clad ceramic structural component according to claim 1, characterized in that, The substrate body includes a first metal layer, a ceramic layer and a second metal layer stacked together, and the pin seat positioning hole is formed in at least the second metal layer.

6. A method for preparing a copper-clad ceramic structural component, characterized in that, Includes the following steps: Provide the substrate body to be processed; A mask is used to form patterned blind hole-shaped lead seat positioning holes with a depth of 0.1mm to 0.2mm on one side of the substrate body to be processed; A pin seat is provided in the pin seat positioning hole, and the pin seat and the substrate body to be processed are fixedly connected by welding. There is a predetermined interval between the outer edge of the pin seat's orthogonal projection on the substrate body and the outer edge of the pin seat positioning hole's orthogonal projection on the substrate body. There is a space around the pin seat in the pin seat positioning hole to accommodate the molten solder paste. The solder paste under reflow soldering can be pulled back into the pin seat positioning hole by the siphon effect. Connect the pin to the pin socket.

7. The method for preparing copper-clad ceramic structural components according to claim 6, characterized in that, In the step of forming patterned pin seat positioning holes on one side of the substrate body using a mask: Patterned pin positioning holes are formed on one side of the substrate body using a mask through dry or wet etching processes.

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