A temperature adjustment device and a neutron diffraction residual stress measurement system

Abstract

The present application relates to the field of residual stress measurement, and discloses a temperature adjustment device and a neutron diffraction residual stress measurement system. The temperature adjustment device includes a containing box, a first refrigeration component, and a second refrigeration component. Among them, a containing cavity is formed in the containing box, and a placement portion is provided in the containing cavity, and the placement portion is used to place a test sample. The first refrigeration component is thermally connected to the containing cavity, and the first refrigeration component can reduce the temperature of the test sample to a first temperature. The second refrigeration component is thermally connected to the containing cavity, and is relatively independent from the first refrigeration component. The second refrigeration component can reduce the temperature of the test sample to a second temperature. Among them, the refrigeration capacity of the second refrigeration component is greater than the refrigeration capacity of the first refrigeration component, and the second temperature is lower than the first temperature. The temperature adjustment device provided in the present application has the advantages of high refrigeration efficiency, can save cooling time for the test sample, and has low energy consumption.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of residual stress measurement, and in particular to a temperature adjustment device and a neutron diffraction residual stress measurement system. Background Art

[0002] During the manufacturing process of materials and parts, residual stress caused by uneven elastic-plastic deformation is widely present in parts. Residual stress will be released during the use of parts, which will cause the size of parts to change. High residual tensile stress will reduce the fatigue performance of materials and seriously affect the performance and service life of parts. Therefore, the study of residual stress has received widespread attention in the field of mechanical manufacturing.

[0003] In terms of residual stress detection and evaluation, the neutron diffraction method has the advantages of high detection accuracy, non-destructive detection, three-dimensionality and large penetration depth compared to the X-ray method, blind hole method or profile method. It can accurately evaluate the residual stress in parts and components and has broad application prospects in the field of mechanical manufacturing.

[0004] In order to study the evolution of residual stress at different temperatures, a neutron diffraction residual stress measuring instrument can be used to measure the residual stress of parts at different temperatures. However, in the related technology, the adjustment of the temperature of the parts is inefficient and the energy consumption is high. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a temperature adjustment device and a neutron diffraction residual stress measurement system, wherein the temperature adjustment device has the following advantages: high refrigeration efficiency, capable of saving cooling time for the test sample, and low energy consumption.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0007] In the first aspect, an embodiment of the present application provides a temperature adjustment device for adjusting the temperature of a test sample so that a seed diffraction residual stress measuring instrument can measure the residual stress of the test sample at different temperatures. The temperature adjustment device includes a containing box, a first refrigeration component, and a second refrigeration component. A containing cavity is formed in the containing box, and a placement portion is provided in the containing cavity, and the placement portion is used to place the test sample. The first refrigeration component is thermally connected to the containing cavity, and the first refrigeration component can reduce the temperature of the test sample to a first temperature. The second refrigeration component is thermally connected to the containing cavity, and the second refrigeration component is relatively independent of the first refrigeration component, and the second refrigeration component can reduce the temperature of the test sample to a second temperature. The refrigeration capacity of the second refrigeration component is greater than the refrigeration capacity of the first refrigeration component, and the second temperature is lower than the first temperature.

[0008] In the temperature adjustment device provided in the embodiment of the present application, by arranging a containing box, and arranging a containing cavity in the containing box, it is possible to provide an installation basis for the placement of the test sample, and at the same time, by using the containing cavity to form a space isolated from the external environment, it is possible to facilitate cooling the test sample. On this basis, by arranging the first refrigeration assembly and the second refrigeration assembly, and setting the refrigeration capacity of the second refrigeration assembly to be greater than the first refrigeration capacity, the temperature of the test sample can be reduced to the first temperature using the first refrigeration assembly. On this basis, the temperature of the test sample can be reduced to the second temperature using the second refrigeration assembly. Thus, the first refrigeration assembly and the second refrigeration assembly can be both in the range of higher refrigeration efficiency, so that the overall refrigeration efficiency of the temperature adjustment device provided in the embodiment of the present application can be improved, the cooling time of the test sample can be saved, and the energy consumption of the temperature adjustment device provided in the embodiment of the present application can be reduced.

[0009] In a possible implementation of the present application, the first refrigeration assembly includes a liquid nitrogen tank, a first connecting pipe and a second connecting pipe, the first connecting pipe is connected between the outlet of the liquid nitrogen tank and the accommodating chamber, and the second connecting pipe connects the accommodating chamber to the external environment.

[0010] In a possible implementation of the present application, the temperature adjustment device also includes a control unit, which includes a controller, a temperature measurement sensor and a control valve; the temperature measurement sensor is arranged on the placement portion and is used to measure the temperature of the test sample; the control valve is arranged on the first connecting pipe; the temperature measurement sensor and the control valve are electrically connected to the controller; the controller is used to control the opening of the control valve according to the temperature of the test sample measured by the temperature measurement sensor.

[0011] In a possible implementation of the present application, the second refrigeration component includes a refrigerator, a cold head of the refrigerator is arranged in the accommodating cavity, and the upper surface of the cold head forms a placement portion; the refrigerator is electrically connected to a controller, and the controller is also used to control the operation of the refrigerator according to the temperature of the test sample measured by the temperature measurement sensor.

[0012] In a possible implementation of the present application, the placement portion is connected to a heat conductor, the middle position of the heat conductor is used to place the test sample, and the heat conductor is used to make the temperature in the accommodating cavity uniform.

[0013] In a possible implementation of the present application, the heat conducting member is a heat conducting coil, the heat conducting coil is made of copper or copper alloy, and the axial direction of the heat conducting coil is a vertical direction.

[0014] In a possible implementation of the present application, the temperature adjustment device further includes a heating component, the heating component includes a heating part, and the heating part is located in the accommodating cavity.

[0015] In a possible implementation of the present application, the pressure in the accommodation chamber is vacuum.

[0016] In a possible implementation of the present application, the containing box is provided with a heat-insulating layer.

[0017] In a second aspect, an embodiment of the present application provides a neutron diffraction residual stress measurement system, which includes a neutron diffraction residual stress measuring instrument and a temperature adjustment device provided in any one of the first aspects. The neutron diffraction residual stress measuring instrument is used to irradiate a test sample to determine the stress distribution of the test sample.

[0018] Since the neutron diffraction residual stress measurement system provided in the embodiment of the present application includes the temperature adjustment device provided in any one of the first aspects, it has the same technical effect, that is, high refrigeration efficiency, can save cooling time for the test sample, and has low energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a temperature adjustment device provided in an embodiment of the present application.

[0020] Reference numerals:

[0021] 01-test sample; 1-containment box; 11-containment cavity; 12-neutron inlet; 13-neutron outlet; 2-first refrigeration component; 21-liquid nitrogen tank; 22-first connecting pipe; 23-second connecting pipe; 3-second refrigeration component; 31-refrigeration machine; 311-cold head; 4-control unit; 41-controller; 42-temperature measurement sensor; 43-control valve; 431-solenoid valve; 5-heat conducting element; 51-heat conducting coil; 6-heating component; 61-heating part. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0023] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0024] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0025] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0026] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0027] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0028] When measuring the residual stress in parts, the neutron wavelength can be used to measure the residual stress in parts through neutron diffraction experiments. Specifically, after the neutron beam is irradiated on the test sample and passes through the lattice structure inside the test sample, the neutron will diffract to form a diffraction pattern. By analyzing the diffraction pattern, the lattice distortion in the material can be obtained, and thus the distribution of residual stress can be determined.

[0029] For parts, in order to reduce the residual stress in the parts, mechanical methods (including stretching or compression method, vibration aging method and pulsation method, etc.), heat treatment method (including constant temperature aging method, thermal aging method, reverse quenching method and deformation heat treatment method, etc.) and ultrasonic and magnetic field treatment methods are often used. The effects of the above-mentioned various treatment methods are not the same. Among them, heat treatment method is more widely used.

[0030] However, reducing the residual stress in the parts by heat treatment usually causes a decrease in the mechanical properties of the parts' materials. Therefore, it is necessary to consider the influence of the process parameters of the heat treatment method on the residual stress of the parts. Therefore, it is particularly important to choose a suitable heat treatment temperature to ensure that the mechanical properties of the material are not sacrificed. Therefore, it is necessary to understand the evolution law of the residual stress of the parts at different temperatures.

[0031] In addition to the above-mentioned heat treatment methods, cryogenic treatment is also commonly used to treat parts. Cryogenic treatment is a material processing process that places parts in a low temperature environment below -100°C to improve material properties through changes in the material microstructure. In recent years, it has shown significant effects and advantages in the regulation of residual stress in aluminum alloys, aluminum-based composite materials, etc.

[0032] However, there is still a lack of in-depth research on the changing laws of residual stress during cryogenic treatment of parts, which seriously restricts the application of cryogenic treatment technology.

[0033] In view of this, an embodiment of the present application provides a temperature adjustment device and a neutron diffraction residual stress measurement system.

[0034] Reference Figure 1 The temperature adjustment device provided in the embodiment of the present application includes a containing box 1, a first refrigeration component 2 and a second refrigeration component 3. Specifically, a containing chamber 11 is formed in the containing box 1, and a placement portion is placed in the containing chamber 11, and the placement portion is used to place the test sample 01. The first refrigeration component 2 is thermally connected to the containing chamber 11, and the first refrigeration component 2 can reduce the temperature of the test sample 01 to a first temperature. The second refrigeration component 3 is thermally connected to the containing chamber 11, and the second refrigeration component 3 is relatively independently arranged with the first refrigeration component 2, and the second refrigeration component 3 can reduce the temperature of the test sample 01 to a second temperature. Among them, the refrigeration capacity of the second refrigeration component 3 is greater than the refrigeration capacity of the first refrigeration component 2, and the second temperature is lower than the first temperature.

[0035] It can be understood that in the embodiment of the present application, the type of the test sample 01 is not limited, and the neutron diffraction residual stress measurement system provided in the embodiment of the present application can be used to measure the residual stress of the test sample 01 of various materials such as metal, ceramic or plastic for analysis.

[0036] It should be noted that in the embodiment of the present application, the specific structural form of the containing box 1 is not limited. The containing box 1 can be used to isolate the containing chamber 11 in the containing box 1 from the external environment, so that the containing chamber 11 forms a relatively independent closed environment. There are a variety of structural forms that can achieve the above functions. Exemplarily, the containing box 1 can be set as a cylindrical barrel structure, and a relatively openable cover is set on the cylindrical barrel structure. In this way, when the cover is open relative to the cylindrical barrel structure, the test sample 01 can be conveniently taken and placed; when the cover is closed relative to the cylindrical barrel structure, the containing chamber 11 can be kept sealed. In addition, in the embodiment of the present application, the containing box 1 can also be set as a cubic box structure, etc.

[0037] In addition, in the embodiments of the present application, the material of the container 1 is not limited, and can be set according to the penetration characteristics of neutrons. It can be understood that the neutron beam can penetrate from one side of the container 1 to the other side, and the container 1 in the embodiments of the present application can be made of a material that can allow neutrons to penetrate. For example, in some embodiments of the present application, the material of the container 1 can be set to stainless steel or aluminum alloy, etc.

[0038] On this basis, it can be considered that the placement portion in the accommodating cavity 11 is a structure for placing the test sample 01. It should be noted that in the embodiments of the present application, the specific structural form of the placement portion is not limited. Exemplarily, the placement portion can be set as a bracket-like structure or a placement table-like structure, so that the test sample 01 can be placed directly on the upper surface of the placement portion, which is convenient for placing the test sample 01. In addition, in some embodiments of the present application, the placement portion can also be set as a mechanism with a clamping function, so that the test sample 01 can have different placement forms in the accommodating cavity 11.

[0039] On this basis, in the embodiment of the present application, the form in which the first refrigeration component 2 and the second refrigeration component 3 are thermally connected to the accommodating cavity 11 is not limited.

[0040] It can be understood that the first refrigeration component 2 and the second refrigeration component 3 are used to cool the temperature in the receiving cavity 11, and then cool the test sample 01 placed in the receiving cavity 11. Exemplarily, the first refrigeration component 2 or the second refrigeration component 3 can be used to directly contact the test sample 01, so that the test sample 01 can be directly cooled; in addition, the first refrigeration component 2 or the second refrigeration component 3 can also be used to cool the receiving cavity 11, so as to form a temperature field with a lower temperature, and the first refrigeration component 2 or the second refrigeration component 3 can be used to indirectly cool the test sample 01.

[0041] With reference to the above description, in the embodiment of the present application, the first refrigeration component 2 can be thermally connected to the accommodating cavity 11 or thermally connected to the placement portion, or the first refrigeration component 2 can be directly in contact with the test sample 01. Through the above methods, the temperature of the test sample 01 can be reduced by using the first refrigeration component 2. Similarly, the second refrigeration component 3 can be thermally connected to the accommodating cavity 11 or thermally connected to the placement portion, or the second refrigeration component 3 can be directly in contact with the test sample 01. Through the above methods, the temperature of the test sample 01 can be reduced by using the second refrigeration component 3. Specifically, the method for cooling the test sample 01 can be set according to the characteristics of the first refrigeration component 2 and the second refrigeration component 3.

[0042] Further, it can be understood that different refrigeration devices have different refrigeration capacities, and different refrigeration devices have different refrigeration efficiencies at the same low temperature. For the convenience of description, the lowest temperature to which the first refrigeration component 2 can cool the temperature of the test sample 01 is referred to as the first temperature, and the lowest temperature to which the second refrigeration component 3 can cool the temperature of the test sample 01 is referred to as the second temperature.

[0043] The above-mentioned first temperature can also be understood as the lowest refrigeration temperature of the first refrigeration component 2 , and the above-mentioned second temperature can also be understood as the lowest refrigeration temperature of the second refrigeration component 3 .

[0044] For refrigeration equipment, the refrigeration capacity of the refrigeration equipment can be characterized by parameters such as minimum refrigeration temperature, cooling time, and refrigeration capacity.

[0045] Here, the refrigeration capacity of the second refrigeration assembly 3 is greater than the refrigeration capacity of the first refrigeration assembly 2, including that the lowest refrigeration temperature of the second refrigeration assembly 3 is lower than the lowest refrigeration temperature of the first refrigeration assembly 2. Exemplarily, in some embodiments of the present application, the lowest refrigeration temperature of the second refrigeration assembly 3 is -269°C, and the lowest refrigeration temperature of the first refrigeration assembly 2 is -196°C.

[0046] It is understandable that if the time required to directly cool the temperature of the test sample 01 to the second temperature by using the second refrigeration component 3 is long, the refrigeration efficiency of the second refrigeration component 3 will be low. If the temperature of the test sample 01 is first cooled to the first temperature by using the first refrigeration component 2, and then the test sample 01 is further cooled to the second temperature by using the second refrigeration component 3 on the basis of the first temperature, the cooling efficiency of the test sample 01 by the second refrigeration component 3 can be improved, the cooling time of the test sample 01 can be saved, and the energy consumption of the temperature adjustment device provided in the embodiment of the present application can be reduced.

[0047] In this way, in the temperature adjustment device provided in the embodiment of the present application, by providing a containing box 1 and providing a containing chamber 11 in the containing box 1, it is possible to provide an installation basis for placing the test sample 01. At the same time, the containing chamber 11 is used to form a space isolated from the external environment, which can facilitate cooling of the test sample 01. On this basis, by providing the first refrigeration component 2 and the second refrigeration component 3, and setting the refrigeration capacity of the second refrigeration component 3 to be greater than the first refrigeration capacity, the temperature of the test sample 01 can be reduced to the first temperature by using the first refrigeration component 2. On this basis, the temperature of the test sample 01 can be reduced to the second temperature by using the second refrigeration component 3. Thus, the first refrigeration component 2 and the second refrigeration component 3 can be placed in a range of higher refrigeration efficiency, thereby improving the overall refrigeration efficiency of the temperature adjustment device provided in the embodiment of the present application, saving the cooling time of the test sample 01, and reducing the energy consumption of the temperature adjustment device provided in the embodiment of the present application.

[0048] On this basis, in some embodiments of the present application, liquid nitrogen can be used to cool the test sample 01.

[0049] Specifically, refer to Figure 1 In some embodiments of the present application, the first refrigeration assembly 2 includes a liquid nitrogen tank 21, a first connecting pipe 22, and a second connecting pipe 23. Specifically, the first connecting pipe 22 is connected between the outlet of the liquid nitrogen tank 21 and the accommodating chamber 11, and the second connecting pipe 23 connects the accommodating chamber 11 to the external environment.

[0050] It is understandable that, in the embodiment of the present application, the first connecting tube 22 is connected between the outlet of the liquid nitrogen tank 21 and the accommodating chamber 11, and the liquid nitrogen in the liquid nitrogen tank 21 can flow into the accommodating chamber 11 through the first connecting tube 22, so that the temperature of the test sample 01 placed in the accommodating chamber 11 can be reduced by using the liquid nitrogen. The second connecting tube 23 is used to connect the accommodating chamber 11 to the external environment, so that the liquid nitrogen in the accommodating chamber 11 can be discharged through the second flow pipe. Through the above arrangement, liquid nitrogen can be continuously introduced into the accommodating chamber 11, so that the test sample 01 can be continuously cooled by using the liquid nitrogen to reduce the test sample 01 to a temperature corresponding to the liquid nitrogen.

[0051] It should be noted that, under normal pressure, the boiling point of liquid nitrogen is -196°C, so the temperature of the test sample 01 can be reduced to -196°C using liquid nitrogen.

[0052] In addition, in the embodiment of the present application, the pressure of the liquid nitrogen tank 21 is not limited. For example, the pressure of the liquid nitrogen tank 21 can be set to 0.4 to 0.8 MPa.

[0053] In the embodiment of the present application, the communication positions of the first communication pipe 22 and the second communication pipe 23 on the containing box 1 are not limited. Figure 1 The first connecting tube 22 and the second connecting tube 23 can be arranged on opposite sides of the containing box 1, so that the cooling efficiency of the liquid nitrogen for cooling the test sample 01 can be improved. On this basis, the first connecting tube 22 can be connected to the lower end of the containing box 1, and the second connecting tube 23 can be connected to the upper end of the containing box 1, so that the containing box 1 can be filled with liquid nitrogen, and the cooling efficiency of the liquid nitrogen for cooling the test sample 01 can also be improved.

[0054] It is understandable that a valve may be provided on the first connecting pipe 22 to control the connection or disconnection between the liquid nitrogen tank 21 and the containing chamber 11. In addition, the valve provided on the first connecting pipe 22 may be used to control the flow of liquid nitrogen in the first connecting pipe 22 to improve the cooling efficiency of the test sample 01 by the liquid nitrogen.

[0055] Thus, in the temperature adjustment provided in the embodiment of the present application, the first refrigeration component 2 is set by using the liquid nitrogen tank 21, and the test sample 01 can be cooled by using liquid nitrogen, so that the structure of the first refrigeration component 2 is simple. At the same time, by using liquid nitrogen to cool the test sample 01, the liquid nitrogen can be in close contact with the test sample 01, so that the heat transfer resistance can be reduced, and the cooling efficiency of cooling the test sample 01 can be improved.

[0056] On this basis, refer to Figure 1 , the temperature adjustment device provided in the embodiment of the present application further includes a control unit 4. Specifically, the control unit 4 includes a controller 41, a temperature measurement sensor 42 and a control valve 43. The temperature measurement sensor 42 is arranged on the placement portion and is used to measure the temperature of the test sample 01. The control valve 43 is arranged on the first connecting pipe 22. In addition, the temperature measurement sensor 42 and the control valve 43 are both electrically connected to the controller 41, and the controller 41 can control the opening of the control valve 43 according to the temperature of the test sample 01 measured by the temperature measurement sensor 42.

[0057] It should be noted that the temperature measurement sensor 42 and the control valve 43 are electrically connected to the controller 41, which means that the controller 41 can obtain the temperature signal of the test sample 01 measured by the temperature measurement sensor 42, and the controller 41 can send a command signal to the control valve 43 to control the opening of the control valve 43.

[0058] Here, the type of the temperature measurement sensor 42 is not limited. For example, the temperature measurement sensor 42 in the embodiment of the present application can be set using a thermistor sensor or a thermocouple sensor. It is understood that the range of the temperature measurement sensor 42 should be within the range of the temperature change of the test sample 01.

[0059] Furthermore, in some embodiments of the present application, the number of temperature measurement sensors 42 can be set to two or more, so that two or more temperature measurement sensors 42 can be used to measure the temperature of different parts of the test sample 01. In addition, the temperatures of different parts of the test sample 01 measured by two or more temperature measurement sensors 42 can be integrated to serve as the temperature signal of the test sample 01. Exemplarily, the temperatures of different parts of the test sample 01 can be averaged as the temperature signal of the test sample 01; the higher value or lower value of the temperatures of different parts of the test sample 01 can also be used as the temperature signal of the test sample 01.

[0060] In addition, in the embodiment of the present application, there is no limitation on the type of the controller 41. For example, a programmable logic controller (PLC) can be used as the controller 41 in the embodiment of the present application. In addition, other devices with processing functions can also be used as the controller 41 in the embodiment of the present application, such as an industrial computer.

[0061] In the embodiment of the present application, the specific type of the control valve 43 is not limited. For example, the control valve 43 can be set to be a solenoid valve 431, an electric control valve or a pneumatic control valve, etc.

[0062] On this basis, a temperature threshold can be preset to control the opening of the control valve 43 using the controller 41. Specifically, when the temperature of the test sample 01 measured by the temperature measurement sensor 42 is greater than the above temperature threshold, the control valve 43 can be in an open state, at which time the liquid nitrogen in the liquid nitrogen tank 21 is passed into the containing chamber 11 to continue cooling the test sample 01; when the temperature of the test sample 01 measured by the temperature measurement sensor 42 is less than or equal to the above temperature threshold, the control valve 43 can be in a closed state, at which time the liquid nitrogen in the liquid nitrogen tank 21 stops passing into the containing chamber 11.

[0063] Exemplarily, for liquid nitrogen, the above-mentioned temperature threshold can be set to -196°C. In this way, when the temperature of the test sample 01 is greater than -196°C, the control valve 43 can be opened and the test sample 01 can continue to be cooled by liquid nitrogen; when the temperature of the test sample 01 is equal to -196°C, the control valve 43 can be closed.

[0064] In this way, through the above-mentioned settings, in the temperature adjustment device provided in the embodiment of the present application, the control unit 4 can be used to automatically control the temperature of the test sample 01, which can improve the degree of automation of the temperature adjustment device in the embodiment of the present application. At the same time, through the above-mentioned settings, the adjustment accuracy of the temperature of the test sample 01 can also be improved.

[0065] Further, see Figure 1 In some embodiments of the present application, the second refrigeration assembly 3 includes a refrigerator 31. Specifically, a cold head 311 of the refrigerator 31 is disposed in the accommodating cavity 11 of the accommodating box 1. In this way, the upper surface of the cold head 311 can be used to form a placement portion, and the separate arrangement of the placement portion can be omitted, thereby making the structure of the temperature adjustment device provided in the embodiment of the present application simple.

[0066] Meanwhile, in the embodiment of the present application, the refrigerator 31 is also electrically connected to the controller 41 , and the controller 41 is also used to control the operation of the refrigerator 31 according to the temperature of the test sample 01 measured by the temperature measurement sensor 42 .

[0067] It is understandable that in the embodiment of the present application, the minimum refrigeration temperature of the refrigerator 31 is relatively low. For liquid nitrogen, the minimum refrigeration temperature of the refrigerator 31 is lower than -196°C. Specifically, the refrigerator 31 can be set according to the need for cooling the test sample 01. Exemplarily, in some embodiments of the present application, a refrigeration device with a minimum temperature of -269°C can be selected as the refrigerator 31 in the embodiment of the present application.

[0068] On this basis, in the temperature adjustment device provided in the embodiment of the present application, the controller 41 can be used to control the movement of the refrigerator 31 .

[0069] Specifically, after the temperature of the test sample 01 measured by the temperature measurement sensor 42 has reached the lowest temperature at which liquid nitrogen can cool the test sample 01, the controller 41 can be used to control the refrigerator 31 to start running, so that the refrigerator 31 can continue to cool the test sample 01. Exemplarily, for the above-mentioned refrigeration equipment of -269°C as the refrigerator 31 in the embodiment of the present application, after the temperature of the test sample 01 measured by the temperature measurement sensor 42 has reached the lowest temperature at which liquid nitrogen can cool the test sample 01, the controller 41 controls the refrigerator 31 to start running, and the test sample 01 can continue to be cooled to -269°C.

[0070] It should be noted that when measuring the residual stress of the test sample 01 at different temperatures, the temperature at which the test sample 01 is cooled by liquid nitrogen or the temperature at which the test sample 01 is cooled by the refrigerator 31 can be controlled according to the temperature at which the test sample 01 is cooled.

[0071] In addition, in the embodiment of the present application, the type of refrigerator 31 is not limited. For example, a GM type low-temperature refrigerator or a pulse tube refrigerator can be selected according to the requirements of cooling capacity or cooling temperature.

[0072] For example, when the residual stress of the test sample 01 at -100°C needs to be measured, the test sample 01 can be cooled to -100°C by liquid nitrogen, and then the neutron diffraction residual stress measuring instrument can be used to measure the test sample 01. When the residual stress of the test sample 01 at -200°C needs to be measured, the test sample 01 can be first cooled to -196°C by liquid nitrogen, and then cooled to -200°C by the refrigerator 31, and then the test sample 01 can be measured by the neutron diffraction residual stress measuring instrument.

[0073] Thus, through the above arrangement, in the temperature adjustment device provided in the embodiment of the present application, by arranging the cold head 311 of the refrigerator 31 in the accommodating chamber 11, the cold head 311 of the refrigerator 31 can be used to form a placement portion, so that there is no need to set up another structure to form the placement portion, which can make the structure of the temperature adjustment device provided in the embodiment of the present application simple. In addition, by using the controller 41 to control the operation of the refrigerator 31 according to the temperature of the test sample 01 measured by the temperature measurement sensor 42, the refrigeration capacity of liquid nitrogen and the refrigerator 31 can be comprehensively utilized, and the refrigeration effect of liquid nitrogen and the refrigerator 31 can be improved, so that rapid, large-capacity and ultra-low-temperature cooling of the test sample 01 can be achieved.

[0074] In addition, refer to Figure 1 In some embodiments of the present application, a heat conductor 5 is connected to the placement portion, and the middle position of the heat conductor 5 is used to place the test sample 01 , and the heat conductor 5 is used to make the temperature in the accommodating cavity 11 uniform.

[0075] It is understandable that in the embodiment of the present application, the heat conducting member 5 has good heat conductivity and can establish a relatively uniform temperature field in the accommodating cavity 11. For example, the heat conducting member 5 in the embodiment of the present application can be made of silver, copper or aluminum.

[0076] In addition, in the embodiment of the present application, there is no limitation on the specific structural form of the heat conducting member 5. For example, the heat conducting member 5 can be configured as a coil type, a plate type, or a U-type, etc., with reference to a common heat exchanger.

[0077] It should be noted that when the heat conducting member 5 is arranged in the accommodating cavity 11 , the heat conducting member 5 should not affect the transmission of neutrons.

[0078] In this way, through the above-mentioned configuration, the temperature of the test sample 01 can be reduced by utilizing the radiation of the heat-conducting member 5 , and the cooling efficiency of the test sample 01 by the temperature adjustment device provided in the embodiment of the present application can be further improved.

[0079] On this basis, refer to Figure 1 In some embodiments of the present application, the heat conducting member 5 is set as a heat conducting coil 51, and the material of the heat conducting coil 51 is set as copper or copper alloy, and the axial direction of the heat conducting coil 51 is set as a vertical direction.

[0080] Reference Figure 1 It can be understood that the heat conducting coil 51 here refers to a structure in which a copper tube is arranged in a spiral rise similar to a cylindrical shell. A blank area is formed in the middle of the heat conducting coil 51, and the test sample 01 can be placed in the blank area.

[0081] Furthermore, in some embodiments of the present application, the material of the heat conducting coil 51 can also be set to copper. Copper has high mechanical strength and hardness. In addition, the strength of copper does not change with temperature. Therefore, copper can maintain relatively stable performance in both low temperature and high temperature environments. Therefore, in the embodiments of the present application, by setting the material of the heat conducting member 5 to copper, the heat conducting member 5 can have better thermal conductivity and mechanical properties.

[0082] In addition, refer to Figure 1 In the embodiment of the present application, by setting the axial direction of the heat-conducting coil 51 to a vertical direction, it is also convenient to take and place the test sample 01 in the middle position of the heat-conducting coil 51.

[0083] Reference Figure 1 In some embodiments of the present application, the temperature adjustment device further includes a heating component 6 , the heating component 6 includes a heating portion 61 , the heating portion 61 is located in the accommodating cavity 11 , and the heating portion 61 is connected to the heat conductor 5 .

[0084] Exemplarily, in some embodiments of the present application, the heating component 6 can be set to an electric heating mode. It can be understood that the heating portion 61 of the heating component here refers to the heating part of the heating component. By setting the heating portion 61 in the accommodating cavity 11, the heating portion 61 can be used to heat the test sample 01 placed in the accommodating cavity 11. In this way, the heating component 6 can be used to achieve annealing stress relief treatment of the test sample 01, and the residual stress can be measured during the annealing process. On this basis, the heating component 6 can be used in combination with the first refrigeration component 2 or the second refrigeration component 3 to achieve continuous processing of the hot and cold cycle process and in-situ residual stress measurement of the test sample 01.

[0085] It is understandable that, referring to Figure 1In some embodiments of the present application, the cold head 311 of the refrigerator 31 can be set at the bottom of the accommodating cavity 11, the heating part of the heating element can be set at the upper part of the accommodating cavity 11, the heat conductor 5 can be set between the cold head 311 and the heating part, and the lower end of the heat conductor 5 is connected to the cold head 311, and the upper end of the heat conductor 5 is connected to the heating part.

[0086] It should be noted that in the embodiments of the present application, the maximum heating temperature of the heating element is not limited. For example, the maximum heating temperature of the heating element can be set to 500° C., which can meet the needs of more heat treatment processes.

[0087] In addition, in some embodiments of the present application, the heating element may be electrically connected to the controller 41, and the controller 41 may be used to control the operating state of the heating element, so that the heating rate and heating speed of the heating element may be accurately controlled by the controller 41.

[0088] It is understandable that, on the basis of cooling the test sample 01 by the first refrigeration component 2 or the second refrigeration component 3, the heating element can be used to increase the temperature of the test sample 01. By using the refrigeration component, the second refrigeration component 3 and the heating plate in coordination, the refrigeration and heating process of the test sample 01 can be precisely controlled.

[0089] In addition, in some embodiments of the present application, the pressure in the containing chamber 11 is vacuum.

[0090] Exemplarily, an air extraction pipe and an air extraction pump may be connected to the containing box 1 to make the pressure in the containing chamber 11 lower than the atmospheric pressure, thereby forming a vacuum environment.

[0091] It should be noted that in the embodiment of the present application, the vacuum degree of the containing chamber 11 is not limited, and can be reasonably selected according to the strength of the containing box 1 .

[0092] In this way, by setting the pressure in the receiving chamber 11 to a vacuum, the thermal inertia in the receiving chamber 11 can be reduced, so that the heating or cooling speed of the test sample 01 in the receiving chamber 11 can be increased, and the heating or cooling efficiency of the test sample 01 can be improved. At the same time, the temperature uniformity in the receiving chamber 11 can be improved, so that the heating or cooling of the test sample 01 is uniform.

[0093] In addition, in some embodiments of the present application, a heat-insulating layer is provided on the container 1. For example, a heat-insulating coating may be provided on the inner wall of the container 1 as the heat-insulating layer; in addition, a heat-insulating coating may be provided on the outer wall of the container 1 as the heat-insulating layer.

[0094] In addition, the storage box 1 can be specially configured to form an insulation layer. For example, the storage box 1 can be configured to have a double-layer structure, and a vacuum interlayer is provided between the double-layer structure of the storage box 1 to form an insulation layer. On this basis, the cleanliness of the space environment in the storage chamber 11 can be ensured, and the impact of external environmental problems can be reduced.

[0095] In this way, through the above arrangement, the heat-insulating layer can be used to reduce the impact of the external environment on the accommodating chamber 11, and further the temperature in the accommodating chamber 11 can be accurately controlled.

[0096] On this basis, the embodiment of the present application further provides a neutron diffraction residual stress measurement system. The neutron diffraction residual stress measurement system comprises a neutron diffraction residual stress measuring instrument and the temperature adjustment device provided in the above embodiment.

[0097] Specifically, refer to Figure 1 A neutron inlet 12 and a neutron outlet 13 may be provided on the containing box 1, and the residual stress in the component may be measured through a neutron diffraction experiment by utilizing the characteristic that the wavelength of the neutron is equivalent to the crystal lattice constant.

[0098] In this way, in the neutron diffraction residual stress measurement system provided in the embodiment of the present application, the test sample 01 can be in-situ detected within a larger temperature range (such as the aforementioned range of -269°C to 500°C), and the evolution process of the residual stress of the test sample 01 in different process states can be detected, effectively solving the problem that the evolution process of residual stress with temperature is difficult to evaluate.

[0099] The serial numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above are only preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature adjustment device, characterized in that: Used to adjust the temperature of the test sample so that the neutron diffraction residual stress measuring instrument can measure the residual stress of the test sample at different temperatures, the temperature adjustment device includes: A containing box, wherein a containing cavity is formed in the containing box, a placing portion is provided in the containing cavity, and the placing portion is used to place the test sample; a first refrigeration assembly, the first refrigeration assembly being capable of lowering the temperature of the test sample to a first temperature, the first refrigeration assembly comprising a liquid nitrogen tank, a first connecting pipe and a second connecting pipe, the first connecting pipe being connected between the outlet of the liquid nitrogen tank and the containing chamber, and the second connecting pipe connecting the containing chamber to an external environment; a second refrigeration assembly, thermally connected to the accommodating cavity and relatively independently arranged with the first refrigeration assembly, the second refrigeration assembly can reduce the temperature of the test sample to a second temperature, the second refrigeration assembly comprises a refrigerator, a cold head of the refrigerator is arranged in the accommodating cavity of the accommodating box, and the upper surface of the cold head forms the placement portion; wherein the refrigeration capacity of the second refrigeration assembly is greater than the refrigeration capacity of the first refrigeration assembly, and the second temperature is lower than the first temperature; First, the first refrigeration component is used to cool the temperature of the test sample to the first temperature, and then the second refrigeration component is used to continue cooling the test sample to the second temperature based on the first temperature.

2. The temperature adjustment device according to claim 1, characterized in that: The temperature adjustment device further comprises a control unit, which comprises a controller, a temperature measurement sensor and a control valve; The temperature measurement sensor is disposed on the placement portion and is used to measure the temperature of the test sample; the control valve is disposed on the first connecting pipe; the temperature measurement sensor and the control valve are electrically connected to the controller; The controller is used to control the opening degree of the control valve according to the temperature of the test sample measured by the temperature measurement sensor.

3. The temperature adjustment device according to claim 2, characterized in that: The refrigerator is electrically connected to the controller, and the controller is further used to control the operation of the refrigerator according to the temperature of the test sample measured by the temperature measurement sensor.

4. The temperature adjustment device according to claim 1, characterized in that: The placement portion is connected to a heat-conducting member, the middle position of the heat-conducting member is used to place the test sample, and the heat-conducting member is used to make the temperature in the containing cavity uniform.

5. The temperature adjustment device according to claim 4, characterized in that: The heat-conducting member is a heat-conducting coil, the heat-conducting coil is made of copper or copper alloy, and the axial direction of the heat-conducting coil is the vertical direction.

6. The temperature adjustment device according to claim 4, characterized in that: The temperature adjustment device further includes a heating component, wherein the heating component includes a heating portion, and the heating portion is located in the accommodating cavity.

7. The temperature adjustment device according to claim 1, characterized in that: The pressure in the accommodating chamber is vacuum.

8. The temperature adjustment device according to claim 1, characterized in that: The containing box is provided with a heat-insulating layer.

9. A neutron diffraction residual stress measurement system, characterized in that: include: A neutron diffraction residual stress measuring instrument, which is used to irradiate a test sample to determine the stress distribution of the test sample; The temperature adjustment device according to any one of claims 1 to 8.

Images