Jetting device, control method, system and control device for preventing wafer displacement

Abstract

The application relates to the technical field of semiconductor process control, and discloses an air jet device, a control method and system for preventing wafer displacement, and a control device, the air jet device is applied to a mechanical arm, a plurality of holes are arranged on the mechanical arm, and the air jet device is connected with the holes; the air jet device is used for jetting out gas from the holes of the mechanical arm, so that liquid films between the mechanical arm and wafers during loading and unloading of the wafers are eliminated. The application avoids water viscosity caused by liquid film effect, prevents wafer displacement during loading and unloading, ensures that the wafers can be stably and accurately grabbed to specified positions, and solves the problem that liquid films are easily generated between the mechanical arm and the wafers in a wet environment, and the wafers are displaced due to adhesion caused by the liquid films.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process control technology, specifically to an air jet device, a control method, system, and control device for preventing wafer displacement. Background Technology

[0002] Chemical mechanical planarization (CMP) is a crucial process in semiconductor manufacturing. With advancements in semiconductor processing technology, the transfer of wafers between different workstations has become increasingly important. The wafer transfer system is a vital component of the CMP system, responsible for transferring wafers between these workstations. Semiconductor robots, also known as semiconductor wafer transfer robots, are primarily used in the front-end processes of semiconductor manufacturing, such as integrated circuit and chip production, to transport wafers. Robots are commonly used in semiconductor processing steps such as grinding, polishing, etching, diffusion, and deposition for the transfer and positioning of semiconductor wafers. As processing technology continues to advance, the coordination between different modules requires greater precision. Therefore, the loading and unloading points of the robots must be more accurate, while also avoiding scratching the wafer surface and affecting wafer processing.

[0003] In semiconductor equipment robotic arms, especially in humid environments, most robotic arms employ a telescopic design, using grippers to hold and load wafers. The wafers are then moved through the extension, rotation, and lifting motions of the robotic arm. Therefore, the robotic arm requires highly precise positioning during wafer loading and unloading. Figure 1 As shown, the distance between the robot and the wafer is very short. Due to the presence of liquid, a liquid film will form between the robot and the wafer. Due to the surface tension, the robot's loading and unloading of the wafer will be affected.

[0004] Currently, robotic arms unload wafers by extending and retracting their arms. However, with advancements in wafer fabrication technology, wafers are becoming increasingly thinner, leading to smaller grippers on the robotic arms. This results in a shorter distance between the robotic arm and the wafer. During wafer loading and unloading, moisture on both the robotic arm and wafer surfaces creates a thin liquid film. In humid environments, this film can easily cause adhesion, leading to wafer displacement, detachment, and impacting subsequent module processing. It can even cause machine downtime, errors, and wafer fragmentation. Summary of the Invention

[0005] In view of this, the present invention provides an air jet device, a control method, system and control device for preventing wafer displacement, to solve the problem that liquid film is easily generated between the robot and the wafer in a humid environment, causing adhesion and wafer displacement.

[0006] In a first aspect, the present invention provides an air jet device applied in a robotic arm, wherein the robotic arm has multiple holes and the air jet device is connected to the holes;

[0007] The jetting device is used to spray gas from the holes of the robotic arm to eliminate the liquid film between the robotic arm and the wafer during wafer loading and unloading.

[0008] In one alternative implementation, the jetting device is also used to eject gas from the orifices of the robotic arm to provide support for the wafer as the robotic arm unloads the wafer, lifting the wafer to a designated location.

[0009] The jetting device provided by this invention is applied to a robotic arm. By jetting gas from the holes of the robotic arm, the liquid film between the robotic arm and the wafer is eliminated. The gas jetting device can also provide support for the wafer when the robotic arm unloads the wafer, so as to lift the wafer to the designated position, ensuring that the wafer can be stably and accurately placed at the designated position, and avoiding the displacement of the wafer during loading and unloading due to the water viscosity caused by the liquid film effect.

[0010] In a second aspect, the present invention provides a control method for preventing wafer shift, the method comprising:

[0011] After the robotic arm picks up the wafer, it emits sound waves that are parallel to the wafer.

[0012] Measuring the propagation time of sound waves;

[0013] Determining the presence of a liquid film between the robotic arm and the wafer based on the propagation time of sound waves;

[0014] When a liquid film is present, the jetting device of the first aspect or any corresponding embodiment described above is controlled to eject gas to eliminate the liquid film between the robotic arm and the wafer.

[0015] The present invention provides a control method for preventing wafer displacement. After a robotic arm grasps a wafer, it emits a sound wave parallel to the wafer. The propagation time of the sound wave is measured. Based on the propagation time, it determines whether a liquid film exists between the robotic arm and the wafer. Accurately determining the presence of a liquid film between the robotic arm and the wafer, and when a liquid film exists, controlling a jetting device to eject gas to eliminate it, ensures the accuracy of wafer loading and unloading points, prevents wafer displacement during loading, and avoids the influence of water adhesion between the robotic arm and the wafer during loading and unloading. This improves the success rate of wafer loading and unloading and solves the problem of wafer displacement caused by the easy formation of a liquid film between the robotic arm and the wafer in humid environments.

[0016] In one alternative implementation, the wafer comprises wafers of different sizes, and the method further includes, prior to measuring the propagation time of the sound waves:

[0017] Based on wafers of different sizes, the standard time for sound wave propagation between the robotic arm and the wafer without a liquid film was measured under the same conditions.

[0018] The control method for preventing wafer displacement provided by this invention measures the standard time of sound wave propagation between the robotic arm and the wafer in the same environment when there is no liquid film, based on wafers of different sizes. This provides a benchmark for measuring sound wave propagation time in a humid environment and lays the foundation for accurately determining whether a liquid film exists between the robotic arm and the wafer based on the sound wave propagation time.

[0019] In one alternative implementation, measuring the propagation time of the sound wave includes:

[0020] Obtain the propagation speed and propagation length of the sound wave, and calculate the propagation time based on the propagation speed and propagation length;

[0021] Alternatively, obtain the transmission time and reception time of the sound wave, calculate the time difference between the reception time and the transmission time, and obtain the propagation time.

[0022] The control method for preventing wafer shift provided by this invention obtains the propagation speed and propagation length of the sound wave, and calculates the propagation time based on the propagation speed and propagation length; or, obtains the emission time and reception time of the sound wave, calculates the time difference between the reception time and the emission time, and obtains the propagation time, providing a calculation basis for calculating the propagation time of the sound wave and improving the accuracy of measuring the propagation time of the sound wave.

[0023] In one optional implementation, determining whether a liquid film exists between the robotic arm and the wafer based on the propagation time includes:

[0024] If the propagation time is less than the standard time, it is determined that there is a liquid film between the robotic arm and the wafer;

[0025] When the propagation time equals the standard time, it is determined that there is no liquid film between the robotic arm and the wafer.

[0026] The control method for preventing wafer displacement provided by this invention accurately determines whether a liquid film exists between the robotic arm and the wafer based on the relationship between the propagation time of the sound wave and the standard time, thus providing a basis for subsequent control of the jet device to eliminate the liquid film.

[0027] In one alternative implementation, when a liquid film is present, controlling the ejection of gas from the robotic arm to eliminate the liquid film between the robotic arm and the wafer includes:

[0028] Obtain the liquid film thickness;

[0029] Gas gradient pressure is set based on liquid film thickness;

[0030] The gas ejection pressure is calculated based on the propagation time of the sound wave and the gas gradient pressure.

[0031] The gas is ejected from the robotic arm based on the gas ejection pressure.

[0032] The control method for preventing wafer displacement provided by this invention controls the gas ejected from the robotic arm according to the gas pressure required when different liquid film thicknesses exist, ensuring that the wafer can be detached from the robotic arm at a designated point, quickly eliminating the liquid film between the robotic arm and the wafer, avoiding wafer displacement due to water viscosity, and improving the accuracy of wafer loading and unloading.

[0033] In one alternative implementation, the method further includes: dynamically adjusting the gas ejection pressure from the robotic arm based on the change in the time difference between the propagation time of the sound wave and a standard time.

[0034] The control method for preventing wafer displacement provided by this invention dynamically adjusts the gas to achieve precise control of the gas pressure, preventing wafer displacement caused by excessively low or high gas pressure. By controlling the gas pressure, the jetting device can also jet gas through evenly distributed holes on the robotic arm to provide a uniform supporting force at the bottom of the robotic arm, preventing wafer fragmentation due to the wafer being too thin, improving wafer processing efficiency, and avoiding machine downtime caused by wafer loading / unloading failures or wafer displacement during loading / unloading.

[0035] Thirdly, the present invention provides a control system for preventing wafer displacement, applied to the control method for preventing wafer displacement in the second aspect or any corresponding embodiment thereof. The system includes: an acoustic wave transmitting and receiving subsystem, a signal processing subsystem, and a pressure control subsystem; the acoustic wave transmitting and receiving subsystem, the signal processing subsystem, and the pressure control subsystem are integrated in a robotic arm; the pressure control subsystem is equipped with an air jet device in the first aspect or any corresponding embodiment thereof.

[0036] The acoustic wave transmitting and receiving subsystem is used to transmit acoustic waves parallel to the wafer to be loaded or unloaded to the robotic arm after the robotic arm has grasped the wafer and the wafer to be loaded or unloaded is placed on the robotic arm.

[0037] The signal processing subsystem is used to measure the propagation time of sound waves and feed it back to the pressure control subsystem;

[0038] The pressure control subsystem is used to cause the jetting device to spray gas to eliminate the liquid film between the robotic arm and the wafer when there is a liquid film between them.

[0039] The control system for preventing wafer displacement provided by this invention includes an acoustic wave transmitting and receiving subsystem that emits acoustic waves parallel to the wafer to be loaded or unloaded onto the robotic arm after the robotic arm has grasped the wafer; a signal processing subsystem that measures the propagation time of the acoustic waves and feeds it back to the pressure control subsystem; and a pressure control subsystem that, when there is a liquid film between the robotic arm and the wafer, causes an air jet device to spray gas to eliminate the liquid film between the robotic arm and the wafer, ensuring the accuracy of the wafer loading and unloading points of the robotic arm, preventing wafer displacement during loading and unloading, avoiding the influence of water adhesion between the robotic arm and the wafer during wafer loading and unloading, improving the wafer loading and unloading success rate, and solving the problem of wafer displacement caused by the easy formation of a liquid film between the robotic arm and the wafer in humid environments.

[0040] In one alternative implementation, the system further includes a calibration subsystem for measuring a standard time between the robotic arm and the wafer without a liquid film, based on wafers of different sizes, under the same conditions with acoustic waves.

[0041] The pressure subsystem is also used to dynamically adjust the gas ejection pressure from the robotic arm based on the time difference between the sound wave propagation time and the standard time.

[0042] The control system for preventing wafer displacement provided by this invention includes a calibration subsystem for measuring the standard time between the robotic arm and the wafer in the same environment without a liquid film, based on wafers of different sizes. This provides a reference for measuring the sound wave propagation time in a humid environment. The pressure subsystem dynamically adjusts the gas ejection pressure from the robotic arm based on the time difference between the sound wave propagation time and the standard time, achieving precise control of the gas pressure and preventing wafer displacement caused by excessively low or high gas pressure. By controlling the gas pressure, the jetting device can also eject gas through evenly distributed holes on the robotic arm to provide a uniform supporting force at the bottom of the robotic arm, preventing wafer fragmentation due to excessively thin wafers, improving wafer processing efficiency, and avoiding machine downtime caused by wafer loading / unloading failures or wafer displacement during loading / unloading.

[0043] Fourthly, the present invention provides a control device for preventing wafer displacement, the control device comprising:

[0044] The transmitting module is used to emit sound waves parallel to the wafer after the robotic arm grasps the wafer;

[0045] The first measurement module is used to measure the propagation time of sound waves;

[0046] The judgment module is used to determine whether a liquid film exists between the robotic arm and the wafer based on the propagation time of the sound waves;

[0047] A control module is configured to, when a liquid film is present, control the jetting device of the first aspect or any corresponding embodiment described above to eject gas to eliminate the liquid film between the robotic arm and the wafer.

[0048] Fifthly, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to perform the control method for preventing wafer shift described in the second aspect or any corresponding embodiment thereof.

[0049] In a sixth aspect, the present invention provides a computer-readable storage medium storing computer instructions for causing a computer to perform the control method for preventing wafer shift described in the second aspect or any corresponding embodiment thereof. Attached Figure Description

[0050] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the formation of a liquid film between a robotic arm and a wafer in existing technology;

[0052] Figure 2 This is a schematic diagram of the structure of the jet device according to an embodiment of the present invention;

[0053] Figure 3 This is a flowchart illustrating a control method for preventing wafer shifting according to an embodiment of the present invention;

[0054] Figure 4 This is a flowchart illustrating another control method for preventing wafer shifting according to an embodiment of the present invention;

[0055] Figure 5 This is a flowchart illustrating another control method for preventing wafer shifting according to an embodiment of the present invention;

[0056] Figure 6 This is a structural block diagram of a control system for preventing wafer displacement according to an embodiment of the present invention;

[0057] Figure 7 This is a schematic diagram of the pressure control subsystem regulating pressure according to an embodiment of the present invention;

[0058] Figure 8This is a structural block diagram of a control device for preventing wafer displacement according to an embodiment of the present invention;

[0059] Figure 9 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0061] According to an embodiment of the present invention, an embodiment of a jet device is provided. Figure 2 This is a schematic diagram of the structure of the jet device according to an embodiment of the present invention, as shown below. Figure 2 As shown, the jetting device 11 is applied to the robotic arm 12, which has multiple holes 121. The jetting device is connected to the holes 121. The jetting device 11 is used to spray gas from the holes of the robotic arm to eliminate the liquid film 13 between the robotic arm and the wafer 14 during loading and unloading. The relationship between the robotic arm and the wafer, as well as the liquid film between the robotic arm and the wafer, are as follows: Figure 1 As shown. Specifically, the jetting device includes a jet nozzle and a cavity for holding the gas, with the jet nozzle connected to the cavity. To avoid the water film effect, pipes are installed inside the robotic arm, and holes for gas ejection are provided on the surface of the robotic arm. Both the pipes and the holes are connected to the jetting device, as shown. Figure 2 As shown, during wafer loading and unloading, the type and pressure of the ejected gas can be set according to the different wafer materials and processing technology. During wafer loading and unloading, the gas from the jetting device is transmitted from the jetting nozzle to the cavity of the robotic arm, and the gas is ejected from the cavity of the robotic arm to eliminate the liquid film between the robotic arm and the wafer.

[0062] The jetting device is also used to spray gas from the holes of the robotic arm to provide support for the wafer as it is unloaded, lifting it to a designated location.

[0063] Specifically, during wafer unloading, an air jet device sprays gas from the orifices of the robotic arm. This removes the liquid film between the robotic arm and the wafer while providing support to lift the wafer, allowing it to detach more easily from the robotic arm and reach the designated location. The air jet device provided by this invention, applied to a robotic arm, sprays gas from the orifices of the robotic arm to eliminate the liquid film between the robotic arm and the wafer. During wafer unloading, it provides support to lift the wafer to the designated location, ensuring stable and precise wafer gripping and preventing displacement during loading and unloading due to the viscosity of water caused by the liquid film effect.

[0064] According to an embodiment of the present invention, a control method embodiment for preventing wafer shift is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0065] This embodiment provides a control method for preventing wafer shift, which can be used in a control system. Figure 3 This is a flowchart of a control method for preventing wafer shifting according to an embodiment of the present invention, such as... Figure 3 As shown, the process includes the following steps:

[0066] Step S101: After the robotic arm picks up the wafer, a sound wave parallel to the wafer is emitted towards the robotic arm.

[0067] Specifically, the mechanical structure for loading and unloading wafers includes a lifting mechanism, a rotating mechanism, a radial extension structure, and an end effector. The end effector is a robotic arm, which includes grippers 122, such as... Figure 2 As shown. After the gripper of the robotic arm picks up the wafer, a sound wave parallel to the wafer is emitted from one end of the gripper. The frequency of this sound wave includes, but is not limited to, ultrasound and megahertz, with a frequency of 2kHz-500MHz (2 kilohertz-500 megahertz).

[0068] Step S102: Measure the propagation time of the sound wave.

[0069] Specifically, when a sound wave parallel to the wafer is emitted from one end of the gripper of the robotic arm, the sound wave is reflected back after hitting the other end of the gripper. The time difference between the emission time and the reception time can be calculated based on the emission time and the reception time of the sound wave. This time difference is the propagation time of the sound wave.

[0070] Step S103: Determine whether there is a liquid film between the robotic arm and the wafer based on the propagation time of the sound wave.

[0071] For example, after obtaining the propagation time of the sound wave, based on the principle of sound wave ranging, the difference in the propagation speed of sound waves in air and liquid is used to determine whether a liquid film exists between the robotic arm and the wafer, based on the difference in the reception time of the sound wave. The propagation speed of sound waves in liquids is faster than that in air, therefore the reception time of the sound wave in a liquid is shorter than that in air. For example, if the propagation time of the sound wave in air is set as the standard time, when the actual measured propagation time of the sound wave is equal to the standard time, it is determined that no liquid film exists between the robotic arm and the wafer. When the actual measured propagation time of the sound wave is less than the standard time, it is determined that a liquid film exists between the robotic arm and the wafer.

[0072] Step S104, when a liquid film is present, control as follows: Figure 2 The jet device shown sprays gas to eliminate the liquid film between the robotic arm and the wafer.

[0073] Specifically, during the loading and unloading of wafers by the robotic arm, when there is a liquid film between the robotic arm and the wafer, the gas from the jet device is transmitted from the jet nozzle to the cavity of the robotic arm, and the gas is ejected from the cavity of the robotic arm to eliminate the liquid film between the robotic arm and the wafer.

[0074] The control method for preventing wafer displacement provided in this embodiment involves emitting a sound wave parallel to the wafer after the robotic arm grasps the wafer; measuring the propagation time of the sound wave; determining whether a liquid film exists between the robotic arm and the wafer based on the propagation time of the sound wave; accurately determining whether a liquid film exists between the robotic arm and the wafer; and when a liquid film exists, controlling an air jet device to spray gas to eliminate the liquid film between the robotic arm and the wafer, ensuring the accuracy of the wafer loading and unloading points of the robotic arm, preventing the wafer from falling off due to wafer displacement during loading, avoiding the influence of water adhesion between the robotic arm and the wafer during wafer loading and unloading, improving the wafer loading and unloading success rate, and solving the problem of wafer displacement caused by the easy formation of a liquid film between the robotic arm and the wafer in humid environments.

[0075] This embodiment provides a control method for preventing wafer shift, which can be used in the aforementioned control system, etc. Figure 4 This is a flowchart of a control method for preventing wafer shifting according to an embodiment of the present invention, such as... Figure 4 As shown, the process includes the following steps:

[0076] Step S201: After the robotic arm grasps the wafer, a sound wave parallel to the wafer is emitted towards the robotic arm. The wafer includes wafers of different sizes. For details, please refer to [link to details]. Figure 3 Step S101 of the illustrated embodiment will not be described again here.

[0077] Step S202: Measure the standard time for sound wave propagation between the robotic arm and the wafer without a liquid film under the same environment, according to wafers of different sizes.

[0078] Specifically, wafer sizes include 6-inch, 8-inch, and 12-inch. Depending on the wafer size, before loading, unloading, and processing, the acoustic wave propagation time between the robotic arm and the wafer is measured when there is no liquid film. This is achieved by emitting a sound wave parallel to the wafer from one end of the robotic arm's gripper, which then reflects back after hitting the other end of the gripper. The time required for the sound wave to travel from one end of the gripper to the other and back is measured as the standard time. When the measurement environment varies, the standard time needs to be measured in advance.

[0079] Step S203: Measure the propagation time of the sound wave.

[0080] Specifically, step S203 includes:

[0081] Step S2031: Obtain the propagation speed and propagation length of the sound wave, and calculate the propagation time based on the propagation speed and propagation length.

[0082] Specifically, based on the principle of acoustic ranging, the difference in sound wave propagation speed in air and liquid, and the difference in sound wave reception time, determines whether a liquid film exists between the robotic arm and the wafer. Sound waves propagate faster in liquids than in air, therefore the reception time in a liquid is shorter than in air. By using relevant measurement techniques to obtain the propagation speed and propagation length of the sound wave, and then dividing the propagation length by the propagation speed, the propagation time of the sound wave can be obtained.

[0083] Alternatively, in step S2032, the transmission time and reception time of the sound wave are obtained, the time difference between the reception time and the transmission time is calculated, and the propagation time is obtained.

[0084] Specifically, when a sound wave parallel to the wafer is emitted from one end of the gripper of the robotic arm, the sound wave is reflected back after hitting the other end of the gripper. The time difference between the emission and reception times can be calculated based on the emission and reception times of the sound wave. This time difference is the sound wave propagation time.

[0085] Step S204: Determine whether a liquid film exists between the robotic arm and the wafer based on the propagation time.

[0086] In some optional implementations, step S204 above includes:

[0087] In step S2041, if the propagation time is less than the standard time, it is determined that there is a liquid film between the robotic arm and the wafer.

[0088] Specifically, after obtaining the propagation time of the sound wave, based on the principle of sound wave ranging, the difference in the propagation speed of sound waves in air and liquids is used to determine whether a liquid film exists between the robotic arm and the wafer, according to the difference in the reception time of the sound wave. The propagation speed of sound waves in liquids is faster than that in gases, therefore the reception time of sound waves in liquids is shorter than that in gases. When the actual measured propagation time of the sound wave is less than the standard time, it is determined that a liquid film exists between the robotic arm and the wafer.

[0089] In step S2042, when the propagation time is equal to the standard time, it is determined that there is no liquid film between the robotic arm and the wafer.

[0090] Specifically, when the actual measured propagation time of the sound wave is equal to the standard time, it is determined that there is no liquid film between the robotic arm and the wafer.

[0091] Step S205, when a liquid film is present, control as follows: Figure 2 The jetting device shown ejects gas to eliminate the liquid film between the robotic arm and the wafer. See details... Figure 3 Step S104 of the illustrated embodiment will not be described again here.

[0092] The control method for preventing wafer displacement provided in this embodiment measures the standard time of sound wave propagation when there is no liquid film between the robotic arm and the wafer under the same environment, based on wafers of different sizes. This provides a benchmark for measuring sound wave propagation time in a humid environment, obtains the propagation speed and propagation length of the sound wave, and calculates the propagation time based on the propagation speed and propagation length; or, it obtains the emission time and reception time of the sound wave, calculates the time difference between the reception time and the emission time, and obtains the propagation time, providing a calculation basis for calculating the propagation time of the sound wave and improving the accuracy of measuring the propagation time of the sound wave.

[0093] This embodiment provides a control method for preventing wafer shift, which can be used in the aforementioned control system. Figure 5 This is a flowchart of a control method for preventing wafer shifting according to an embodiment of the present invention, such as... Figure 5 As shown, the process includes the following steps:

[0094] Step S301: After the robotic arm grasps the wafer, a sound wave parallel to the wafer is emitted towards the robotic arm. For details, please refer to [link to relevant documentation]. Figure 4 Step S201 of the illustrated embodiment will not be described again here.

[0095] Step S302: Measure the propagation time of the sound wave. For details, please refer to [link to relevant documentation]. Figure 4 Step S203 of the illustrated embodiment will not be described again here.

[0096] Step S303: Determine whether a liquid film exists between the robotic arm and the wafer based on the sound wave propagation time. For details, please refer to [link to relevant documentation]. Figure 4 Step S204 of the illustrated embodiment will not be described again here.

[0097] Step S304, when a liquid film is present, control as follows: Figure 2 The jet device shown sprays gas to eliminate the liquid film between the robotic arm and the wafer.

[0098] Specifically, step S304 includes:

[0099] Step S3041: Obtain the liquid film thickness.

[0100] Specifically, when a liquid film is present, the post-processing module of the fluid dynamics simulation software can be used to measure the thickness of the liquid film between the robotic arm and the wafer. The post-processing module obtains the liquid film thickness by calculating the height difference between the liquid surfaces.

[0101] Step S3042: Set the gas gradient pressure based on the liquid film thickness.

[0102] Specifically, during the loading and unloading of wafers by a robotic arm, different liquid film thicknesses require different ejected gas pressures to quickly eliminate the liquid film between the robotic arm and the wafer. Since the liquid film thickness between the robotic arm and the wafer is uneven, when a sound wave is emitted from one end of the robotic arm's gripper, the propagation time of the sound wave is detected. The gas pressure is dynamically set based on the actual detected sound wave propagation time, i.e., a gas pressure gradient is set according to the propagation time gradient. Let's assume the propagation time gradient is set to t0, t1…t… n The gas pressure gradient is set to p0, p1…p n .

[0103] Step S3043: Calculate the gas ejection pressure based on the propagation time of the sound wave and the gas gradient pressure.

[0104] Specifically, when the actual sound wave propagation time is measured to be t, the gas ejection pressure is calculated based on the propagation time gradient and the gas pressure gradient, using the following formula:

[0105]

[0106]

[0107] The ejection pressure of the gas ejected by the jet device is obtained from equations (1) and (2):

[0108] p = kt + b

[0109] Where: t1 < t < t2, p is the gas ejection pressure, t1 and t2 are the propagation times of sound waves under different liquid film thicknesses respectively, k and b are intermediate variables during calculation, and p1 and p2 are the gas ejection pressures under different liquid film thicknesses.

[0110] Step S3044, control the gas to be ejected from the robotic arm according to the gas ejection pressure.

[0111] Specifically, when the robotic arm loads and unloads wafers, according to the different liquid film thicknesses between the robotic arm and the wafer, control the gas ejection device to eject gas from the holes of the robotic arm according to the calculated gas ejection pressure, so as to eliminate the liquid film between the robotic arm and the wafer. When the robotic arm unloads the wafer, the gas ejection device can also eject gas through the holes evenly distributed on the robotic arm to provide a uniform supporting force for the wafer on the robotic arm, prevent the wafer from being broken due to the wafer being too thin, and can lift the wafer, so that the wafer can more easily break away from the robotic arm and reach the specified position.

[0112] Step S305, dynamically adjust the gas ejection pressure of the gas ejected from the robotic arm according to the change in the time difference between the propagation time of the sound wave and the standard time.

[0113] Specifically, when the robotic arm loads and unloads wafers, due to the uneven liquid film thickness and different liquid film thicknesses between the robotic arm and the wafer, dynamically adjust the gas ejection pressure of the gas ejected from the robotic arm according to the change in the time difference between the propagation time of the sound wave and the standard time.

[0114] Exemplarily, when the time difference between the actually measured propagation time of the sound wave and the standard time becomes larger, increase the gas pressure ejected from the holes of the robotic arm by the gas ejection device, so that the ejected gas can quickly eliminate the liquid film between the robotic arm and the wafer. On the contrary, when the time difference between the actually measured propagation time of the sound wave and the standard time becomes smaller, reduce the gas pressure ejected from the holes of the robotic arm by the gas ejection device or turn off the gas ejection device. Set the propagation time gradient and gas pressure gradient when calculating the gas ejection pressure to provide an adjustment benchmark for dynamically adjusting the gas ejection pressure.

[0115] The wafer displacement prevention control method provided in this embodiment controls the gas ejected from the robotic arm according to the required gas pressure for different liquid film thicknesses. This ensures that the wafer can detach from the robotic arm at a designated point, quickly eliminating the liquid film between the robotic arm and the wafer, preventing wafer displacement due to water viscosity, and improving the accuracy of wafer loading and unloading. Dynamically adjusting the gas pressure achieves precise control, preventing excessively low or high gas pressure that could lead to wafer displacement. By controlling the gas pressure, the jetting device can also eject gas through evenly distributed holes on the robotic arm to provide a uniform supporting force at the bottom of the robotic arm, preventing wafer fragmentation due to thin wafers, improving wafer processing efficiency, and avoiding machine downtime caused by wafer loading / unloading failures or wafer displacement during loading / unloading.

[0116] This embodiment also provides a control system for preventing wafer shift, applied to the above-mentioned... Figures 3 to 5 Any of the control methods for preventing wafer displacement shown herein includes a control system comprising: an acoustic wave transmitting and receiving subsystem, a signal processing subsystem, and a pressure control subsystem; the acoustic wave transmitting and receiving subsystem, the signal processing subsystem, and the pressure control subsystem are integrated in a robotic arm; the pressure control subsystem is equipped with an air jet device as described in the first aspect or any corresponding embodiment thereof; the acoustic wave transmitting and receiving subsystem is used to transmit acoustic waves parallel to the wafer to be loaded or unloaded to the robotic arm when the robotic arm has grasped the wafer and the wafer is placed on the robotic arm; the signal processing subsystem is used to measure the propagation time of the acoustic waves and feed it back to the pressure control subsystem; the pressure control subsystem is used to cause the air jet device to spray gas to eliminate the liquid film between the robotic arm and the wafer when there is a liquid film between the robotic arm and the wafer.

[0117] Specifically, Figure 6 This is a structural block diagram of a control system for preventing wafer shifting according to an embodiment of the present invention, such as... Figure 6 As shown, the acoustic wave transmitting and receiving subsystem provides acoustic wave transmission and reception, including an acoustic wave transmitter and a acoustic wave receiver. The acoustic wave transmitter is mounted at one end of the robotic arm gripper, and the acoustic wave receiver is mounted at the other end. The acoustic wave transmitter emits ultrasonic waves parallel to the wafer at one end of the robotic arm gripper. The ultrasonic waves are reflected back to the acoustic wave receiver after hitting the other end of the gripper, and the receiver receives the reflected ultrasonic waves. Both the acoustic wave transmitter and the acoustic wave receiver are connected to a signal processing subsystem, which sends the transmission and reception times of the acoustic waves to the signal processing subsystem for rapid data processing.

[0118] The signal processing subsystem includes a propagation time measuring device, used to process the transmission and return times of the sound waves sent by the sound wave transmitting and receiving subsystem. Specifically, it calculates the time difference between the transmission and reception times, which is the propagation time of the sound wave. The signal processing subsystem is connected to the pressure control subsystem, feeding back the calculated sound wave propagation time to the pressure control subsystem for further processing.

[0119] The pressure control subsystem is equipped with a jetting device, which can be implemented using, but is not limited to, pressure controllers, pressure control switches, and pressure control sensors. When a liquid film exists between the robotic arm and the wafer, the gas ejection pressure of the jetting device is controlled so that the jetting device ejects gas at the specified gas ejection pressure to eliminate the liquid film between the robotic arm and the wafer.

[0120] In one alternative implementation, the system further includes a calibration subsystem for measuring a standard time between the robotic arm and the wafer without a liquid film, based on wafers of different sizes, under the same conditions as acoustic waves.

[0121] Specifically, wafer sizes include 6-inch, 8-inch, and 12-inch. The calibration subsystem is designed to accommodate wafers of different sizes and transportation environments. Before wafer loading, unloading, and processing, the calibration subsystem measures the acoustic wave propagation time between the robotic arm and the wafer when there is no liquid film. This involves emitting a sound wave parallel to the wafer from one end of the robotic arm's gripper, which then reflects back after hitting the other end of the gripper. The standard time required for the sound wave to travel from one end of the gripper to the other and back to the first end is measured. When the measurement environment varies, the standard time measurement needs to be performed in advance.

[0122] For example, such as Figure 7 As shown, before loading and unloading wafers, the robotic arm uses a calibration subsystem to obtain the sound wave propagation speed in a dry, liquid-free environment and the propagation time from the sound wave transmitter to the sound wave receiver for that wafer size, thereby obtaining the standard time for accurate sound wave propagation in that working environment.

[0123] When a robotic arm loads and unloads wafers, different liquid film thicknesses require different ejected gas pressures. To quickly eliminate the liquid film between the robotic arm and the wafer, and considering the uneven thickness of the liquid film, a gas pressure gradient is dynamically set based on the propagation time of the sound wave emitted from one end of the robotic arm's gripper. This is achieved by detecting the sound wave's propagation time and setting the gas pressure according to the actual propagation time gradient. Let's assume the propagation time gradient is set to t0, t1…t… n The gas pressure gradient is set to p0, p1…p n .

[0124] When the measured propagation time of the actual sound wave is t, the gas ejection pressure is calculated based on the propagation time gradient and the gas pressure gradient. The specific formula is as follows:

[0125]

[0126]

[0127] According to equations (1) and (2), the gas ejection pressure ejected by the jetting device is:

[0128] p = kt + b

[0129] Where: t1 < t < t2, p is the gas ejection pressure, t1 and t2 are the propagation times of the sound wave at different liquid film thicknesses respectively, k and b are intermediate variables during calculation, and p1 and p2 are the gas ejection pressures at different liquid film thicknesses.

[0130] When the robotic arm loads and unloads the wafer, the jetting device is controlled to eject gas from the holes of the robotic arm according to the calculated gas ejection pressure corresponding to different liquid film thicknesses between the robotic arm and the wafer, so as to eliminate the liquid film between the robotic arm and the wafer. When the robotic arm unloads the wafer, the jetting device can also eject gas through the holes evenly distributed on the robotic arm to provide a uniform supporting force for the wafer on the robotic arm, which can lift the wafer and prevent the wafer from being broken due to being too thin, enabling the wafer to more easily separate from the robotic arm and reach the designated position.

[0131] Meanwhile, the pressure control subsystem can also dynamically adjust the gas ejection pressure according to the sound wave propagation time measured by the signal processing subsystem. When the time difference between the actually measured propagation time of the sound wave and the standard time becomes larger, the gas pressure ejected by the jetting device from the holes of the robotic arm is increased, so that the ejected gas can quickly eliminate the liquid film between the robotic arm and the wafer. On the contrary, when the time difference between the actually measured propagation time of the sound wave and the standard time becomes smaller, the gas pressure ejected by the jetting device from the holes of the robotic arm is decreased or the jetting device is turned off. The propagation time gradient and the gas pressure gradient are set during the calculation of the gas ejection pressure to provide an adjustment reference for the dynamic adjustment of the gas ejection pressure.

[0132] The control system for preventing wafer displacement provided in this embodiment includes a calibration subsystem for measuring the standard time between the robotic arm and the wafer in the same environment without a liquid film, based on wafers of different sizes. This provides a reference for measuring the sound wave propagation time in a humid environment. The pressure subsystem dynamically adjusts the gas ejection pressure from the robotic arm based on the time difference between the sound wave propagation time and the standard time, achieving precise control of the gas pressure and preventing wafer displacement caused by excessively low or high gas pressure. By controlling the gas pressure, the jetting device can also eject gas through evenly distributed holes on the robotic arm to provide a uniform supporting force at the bottom of the robotic arm, preventing wafer fragmentation due to excessively thin wafers, improving wafer processing efficiency, and avoiding machine downtime caused by wafer loading / unloading failures or wafer displacement during loading / unloading.

[0133] This embodiment also provides a control device for preventing wafer shift, which is used to implement the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0134] This embodiment provides a control device to prevent wafer displacement, such as... Figure 8 As shown, it includes:

[0135] The transmitting module 801 is used to emit sound waves parallel to the wafer to the robotic arm after the robotic arm grasps the wafer.

[0136] Measurement module 802 is used to measure the propagation time of sound waves.

[0137] The judgment module 803 is used to determine whether there is a liquid film between the robotic arm and the wafer based on the propagation time of the sound wave.

[0138] Control module 804 is used to control the above-mentioned... when a liquid film is present. Figure 2 The jet device shown sprays gas to eliminate the liquid film between the robotic arm and the wafer.

[0139] In some alternative implementations, the measurement module 802 includes:

[0140] The first calculation unit is used to obtain the propagation speed and propagation length of the sound wave, and calculate the propagation time based on the propagation speed and propagation length;

[0141] The second calculation unit is used to obtain the transmission time and reception time of the sound wave, calculate the time difference between the reception time and the transmission time, and obtain the propagation time.

[0142] In some optional implementations, the determination module 803 includes:

[0143] The first judgment unit is used to determine that there is a liquid film between the robotic arm and the wafer when the propagation time is less than the standard time.

[0144] The second judgment unit is used to determine that there is no liquid film between the robotic arm and the wafer when the propagation time is equal to the standard time.

[0145] In some alternative implementations, the control module 804 includes:

[0146] The acquisition unit is used to acquire the liquid film thickness.

[0147] The setting unit is used to set the gas gradient pressure based on the liquid film thickness.

[0148] The third calculation unit is used to calculate the gas ejection pressure based on the propagation time of the sound wave and the gas gradient pressure.

[0149] The control unit is used to control the gas ejected from the robotic arm based on the gas ejection pressure.

[0150] The control device for preventing wafer shift provided in this embodiment of the invention further includes:

[0151] The second measurement module is used to measure the standard time of sound wave propagation between the robotic arm and the wafer without a liquid film under the same environment, based on wafers of different sizes.

[0152] The adjustment module is used to dynamically adjust the gas ejection pressure from the robotic arm based on the change in the time difference between the sound wave propagation time and the standard time.

[0153] Further functional descriptions of the above modules and units are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0154] In this embodiment, the control device for preventing wafer shift is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0155] This invention also provides a computer device having the above-described features. Figure 8 The control device shown is designed to prevent wafer displacement.

[0156] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of a computer device provided in an optional embodiment of the present invention, such as... Figure 9As shown, the computer device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 9 Take a processor 10 as an example.

[0157] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GDA), or any combination thereof.

[0158] The memory 20 stores instructions executable by at least one processor 10 to cause the at least one processor 10 to perform the method shown in the above embodiments.

[0159] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0160] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0161] The computer device also includes an input device 30 and an output device 40. The processor 10, memory 20, input device 30, and output device 40 can be connected via a bus or other means. Figure 9 Taking the example of a connection between China and Israel via a bus.

[0162] Input device 30 can receive input numerical or character information, and generate key signal inputs related to user settings and function control of the computer device, such as a touchscreen, keypad, mouse, trackpad, touchpad, joystick, one or more mouse buttons, trackball, joystick, etc. Output device 40 may include display devices, auxiliary lighting devices (e.g., LEDs), and haptic feedback devices (e.g., vibration motors). The aforementioned display devices include, but are not limited to, liquid crystal displays, light-emitting diodes, displays, and plasma displays. In some alternative embodiments, the display device may be a touchscreen.

[0163] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded via a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0164] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A control method for preventing wafer shift, characterized in that, The method includes: After the robotic arm picks up the wafer, it emits sound waves that are parallel to the wafer into the robotic arm. Measure the propagation time of the sound wave; The presence of a liquid film between the robotic arm and the wafer is determined based on the propagation time of the sound waves. When a liquid film is present, the jet device is controlled to spray gas to eliminate the liquid film between the robotic arm and the wafer; The jetting device is used in a robotic arm, which has multiple holes, and the jetting device is connected to the holes. The jetting device is used to spray gas from the holes of the robotic arm to eliminate the liquid film between the robotic arm and the wafer during loading and unloading. The jetting device is also used to eject gas from the holes of the robotic arm to provide support for the wafer when the robotic arm unloads the wafer, so as to lift the wafer to a designated position.

2. The method according to claim 1, characterized in that, The wafer includes wafers of different sizes, and the method further includes, before measuring the propagation time of the sound wave: Based on wafers of different sizes, the standard time for sound wave propagation between the robotic arm and the wafer without a liquid film was measured under the same conditions.

3. The method according to claim 2, characterized in that, The measurement of the propagation time of the sound wave includes: Obtain the propagation speed and propagation length of the sound wave, and calculate the propagation time based on the propagation speed and propagation length; Alternatively, the transmission time and reception time of the sound wave can be obtained, and the time difference between the reception time and the transmission time can be calculated to obtain the propagation time.

4. The method according to claim 3, characterized in that, The step of determining whether a liquid film exists between the robotic arm and the wafer based on the propagation time includes: If the propagation time is less than the standard time, it is determined that there is a liquid film between the robotic arm and the wafer; When the propagation time is equal to the standard time, it is determined that there is no liquid film between the robotic arm and the wafer.

5. The method according to claim 1, characterized in that, The method of controlling the ejection of gas from the robotic arm to eliminate the liquid film between the robotic arm and the wafer when a liquid film is present includes: Obtain the liquid film thickness; The gas gradient pressure is set based on the liquid film thickness; The gas ejection pressure is calculated based on the propagation time of the sound wave and the gas gradient pressure. The gas is controlled to be ejected from the robotic arm based on the gas ejection pressure.

6. The method according to claim 2, characterized in that, The method further includes: dynamically adjusting the gas ejection pressure from the robotic arm based on the change in the time difference between the propagation time of the sound wave and the standard time.

7. A control system for preventing wafer shift, characterized in that, A control method for preventing wafer shift as described in any one of claims 1 to 6, the system comprising: an acoustic wave transmitting and receiving subsystem, a signal processing subsystem, and a pressure control subsystem; wherein the acoustic wave transmitting and receiving subsystem, the signal processing subsystem, and the pressure control subsystem are integrated in a robotic arm; wherein the pressure control subsystem is equipped with an air jet device; The acoustic wave transmitting and receiving subsystem is used to transmit acoustic waves parallel to the wafer to the robotic arm after the robotic arm grasps the wafer. The signal processing subsystem is used to measure the propagation time of the sound wave and feed it back to the pressure control subsystem; The pressure control subsystem is used to cause the jetting device to spray gas to eliminate the liquid film between the robotic arm and the wafer when there is a liquid film between them. The jetting device is used in a robotic arm, which has multiple holes, and the jetting device is connected to the holes. The jetting device is used to spray gas from the holes of the robotic arm to eliminate the liquid film between the robotic arm and the wafer during loading and unloading. The jetting device is also used to eject gas from the holes of the robotic arm to provide support for the wafer when the robotic arm unloads the wafer, so as to lift the wafer to a designated position.

8. The system according to claim 7, characterized in that, The system also includes a calibration subsystem for measuring the standard time between the robotic arm and the wafer without a liquid film under the same conditions, based on wafers of different sizes. The pressure subsystem is also used to dynamically adjust the gas ejection pressure from the robotic arm based on the change in the time difference between the sound wave propagation time and the standard time.

9. A control device for preventing wafer displacement, characterized in that, The control device includes: The transmitting module is used to emit sound waves parallel to the wafer into the robotic arm after the robotic arm grasps the wafer; The first measurement module is used to measure the propagation time of the sound wave; The judgment module is used to determine whether a liquid film exists between the robotic arm and the wafer based on the propagation time of the sound wave; The control module is used to control the jetting device to spray gas to eliminate the liquid film between the robotic arm and the wafer when a liquid film is present. The jetting device is used in a robotic arm, which has multiple holes, and the jetting device is connected to the holes. The jetting device is used to spray gas from the holes of the robotic arm to eliminate the liquid film between the robotic arm and the wafer during loading and unloading. The jetting device is also used to eject gas from the holes of the robotic arm to provide support for the wafer when the robotic arm unloads the wafer, so as to lift the wafer to a designated position.

10. A computer device, characterized in that, include: A memory and a processor are communicatively connected, the memory storing computer instructions, and the processor executing the computer instructions to perform the control method for preventing wafer shift as described in any one of claims 1 to 7.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a computer to perform the control method for preventing wafer shift as described in any one of claims 1 to 7.

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