Panel assembly and electromagnetic heating device

Abstract

The present disclosure relates to a panel assembly and an electromagnetic heating device. The panel assembly comprises a flexible panel (10) including a first surface (12) and a second surface (14); a non-magnetic rigid substrate (20) configured to support the flexible panel (10) in a thickness direction, the rigid substrate (20) including a third surface (22) and a fourth surface (24), the rigid substrate (20) being fixed to the flexible panel (10) in a manner that the third surface (22) contacts the second surface (14); and a fastening device for fastening the flexible panel (10) and the rigid substrate (20) together, the fastening device comprising a plurality of through holes (26) provided on the rigid substrate (20) and a first nail portion provided on the flexible panel (10), the through holes (26) extending from the third surface (22) through the rigid substrate (20) to the fourth surface (24). The panel assembly according to the present disclosure has a smaller thickness and better performance.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to an electromagnetic heating apparatus, and in particular, to an electromagnetic heating apparatus with an ultra-thin thickness. BACKGROUND

[0002] Electromagnetic heating apparatuses, such as induction cooktops, are widely used in kitchens for cooking food. For an electromagnetic heating apparatus, only electricity needs to be provided to conveniently achieve heating of an object, such as food. Unlike gas cookers, which require the provision of a complex gas supply pipeline and related complex ignition equipment. Electromagnetic heating apparatuses are usually provided with a microcrystalline panel, which has good rigidity and is easy to clean, and is widely used as a heating panel of the electromagnetic heating apparatus. The microcrystalline panel is usually fixed to a plastic shell, which is in turn fixed to a base. Conventional electromagnetic heating apparatuses, due to the use of a microcrystalline panel as a heating panel, result in high cost and large thickness (e.g., up to about 5 cm) of the apparatus. It is desirable to further improve the conventional electromagnetic heating apparatus. SUMMARY

[0003] Embodiments of the present disclosure provide a panel assembly and an electromagnetic heating apparatus, which are intended to address one or more of the above problems and other potential problems.

[0004] According to a first aspect of the present disclosure, there is provided a panel assembly for an electromagnetic heating apparatus. The panel assembly comprises: a flexible panel comprising a first surface and a second surface opposite to the first surface, the first surface comprising one or more cooktops adapted to support an appliance to be electromagnetically heated; a non-magnetic rigid substrate configured to support the flexible panel in a thickness direction, the rigid substrate comprising a third surface and a fourth surface opposite to the third surface, the rigid substrate being fixed to the flexible panel with the third surface in surface contact with the second surface; and fastening means for fastening the flexible panel and the rigid substrate together, the fastening means comprising a plurality of through holes provided on the rigid substrate and a first peg portion provided on the flexible panel, the through holes extending through the rigid substrate from the third surface to the fourth surface.

[0005] According to the present disclosure, the thickness of the panel assembly and thus the thickness of an apparatus comprising the panel assembly can be significantly reduced. Furthermore, the panel assembly is easy to store and is not prone to damage.

[0006] In some embodiments, the through-hole includes at least two hole sections formed in different sizes, the at least two hole sections including a first hole section adjacent to the third surface and a second hole section distal to the third surface, the second hole section having a hole diameter larger than a hole diameter of the first hole section, the first peg portion including a first fastening post arranged at the first hole section and a second fastening post arranged at the second hole section.

[0007] In some embodiments, the plurality of through-holes are arranged throughout the third surface of the rigid substrate.

[0008] In some embodiments, the rigid substrate further includes a circumferential side edge, wherein the flexible panel further includes a cladding portion configured to clad the rigid substrate at the circumferential side edge.

[0009] In some embodiments, the fastening device includes a plurality of circumferential notches arranged along the circumferential side edge and a second peg portion disposed on the flexible panel and received in the circumferential notches, the plurality of circumferential notches extending in a plane parallel to the first surface a distance from an outer side of the circumferential side edge toward an inner side.

[0010] In some embodiments, the circumferential notch includes a first notch section adjacent to an outer side of the circumferential side edge of the rigid substrate and a second notch section distal to the outer side of the circumferential side edge, the second notch section having a hole diameter larger than a hole diameter of the first notch section, the second peg portion including a third fastening post arranged at the first notch section and a fourth fastening post arranged at the second notch section.

[0011] In some embodiments, the circumferential notches are arranged at a predetermined interval around an entire circumference of the circumferential side edge.

[0012] In some embodiments, the circumferential side edge further includes a bottom notch extending at the fourth surface, a material of the flexible panel being configured to be at least partially received in the bottom notch to cause the flexible panel to clad the rigid substrate at the fourth surface of the rigid substrate.

[0013] In some embodiments, the flexible panel further includes an integrally formed mounting portion disposed at the cooktop area, the mounting portion being adapted to mount a temperature sensor.

[0014] In some embodiments, the mounting portion comprises a mounting block configured to carry the temperature sensor and at least partially protrude from the first surface, and a connecting bridge configured to elastically connect the mounting block to a body portion of the flexible faceplate, the connecting bridge having a reduced thickness relative to the mounting block and the body portion, the connecting bridge, the mounting block and the body portion being integrally formed; wherein the connecting bridge is configured to elastically deform in response to pressure of the appliance placed on the surface of the cooktop of the flexible faceplate, so that the temperature sensor remains in contact with the bottom surface of the appliance.

[0015] In some embodiments, the connecting bridge comprises a profile at least partially protruding upwardly.

[0016] In some embodiments, the mounting block comprises a receiving cavity recessed from a top surface thereof, the temperature sensor being adapted to be disposed in the receiving cavity; the receiving cavity comprises a cable passage passing through a bottom surface of the receiving cavity, the cable passage being adapted to dispose a cable for transmitting signals of the temperature sensor; the receiving cavity is configured to be filled with a curable gel after the temperature sensor is mounted to the receiving cavity.

[0017] In some embodiments, the mounting block is shaped such that a top portion thereof fits with a cap, wherein the cap is configured to cover the receiving cavity after the temperature sensor is mounted to the receiving cavity, the cap being formed of a non-electromagnetic and heat-conductive material.

[0018] In some embodiments, the rigid substrate further comprises an extended connecting post protruding from the fourth surface, the connecting post being configured to receive a fastener for fastening the faceplate assembly.

[0019] In some embodiments, the faceplate assembly further comprises an indicating component, the flexible faceplate and the rigid substrate comprising an indicating hole extending through both, the indicating hole comprising a first indicating hole disposed in the flexible faceplate and a second indicating hole disposed in the rigid substrate, wherein a size of the first indicating hole is smaller than the second indicating hole; the size of the first indicating hole is determined to receive the indicating portion in an interference fit.

[0020] In some embodiments, the rigid substrate further comprises a fastening flange extending away from the fourth surface adjacent to a circumferential side edge of the rigid substrate.

[0021] In some embodiments, the flexible faceplate is made of a silicone material; and the flexible faceplate and the rigid substrate are integrally formed by insert molding.

[0022] According to a second aspect of the present disclosure, there is provided an electromagnetic heating apparatus. The electromagnetic heating apparatus comprises: a panel assembly according to the first aspect; an electromagnetic heating assembly; a base comprising a cavity adapted to house the electromagnetic heating assembly and being assembled with the panel assembly; and a heat dissipation fan arranged within the cavity, the heat dissipation fan comprising a centrifugal fan and being disposed at a distance from the electromagnetic heating assembly in a plane parallel to the first surface.

[0023] In some embodiments, the base further comprises one or more partition plates extending upwardly from a bottom wall of the base, the partition plates spacing the air inlet and the air outlet of the centrifugal fan from each other.

[0024] According to a third aspect of the present disclosure, there is provided an electromagnetic heating apparatus. The electromagnetic heating apparatus comprises: at least one panel assembly according to any one of the first aspect, each of the panel assemblies comprising a plurality of burners, each of the burners having a heating unit mounted thereunder, the heating unit comprising an electromagnetic heating assembly and a pedestal adapted to house the electromagnetic heating assembly; wherein the panel assemblies are configured to be foldable at a location between two heating units adjacent to each other. BRIEF DESCRIPTION OF DRAWINGS

[0025] The above and other objects, features and advantages of embodiments of the present disclosure will be readily understood with reference to the following detailed description read in conjunction with the drawings, wherein the same reference numerals and characters denote the same elements throughout the drawings. Several embodiments of the present disclosure are shown in the drawings, which are for purposes of example and not limitation.

[0026] Figure 1 A perspective view of an electromagnetic heating apparatus according to an embodiment of the present disclosure is shown.

[0027] Figure 2 An exploded view of an electromagnetic heating apparatus according to an embodiment of the present disclosure is shown.

[0028] Figure 3 A cross-sectional view of an electromagnetic heating apparatus according to an embodiment of the present disclosure is shown.

[0029] Figure 4 A perspective view of a panel assembly according to an embodiment of the present disclosure is shown.

[0030] Figure 5 A cross-sectional view of a panel assembly according to an embodiment of the present disclosure is shown.

[0031] Figure 6 A perspective view of a panel assembly according to an embodiment of the present disclosure is shown. Figure 3 A partial enlarged view of the cross-sectional view shown.

[0032] Figure 7A partial cutaway view of a panel assembly at a temperature sensor is shown according to an embodiment of the present disclosure.

[0033] Figure 8 A plan view of an electromagnetic heating apparatus is shown according to an embodiment of the present disclosure, with a panel assembly removed.

[0034] Figure 9 A perspective view of an electromagnetic heating apparatus is shown according to another embodiment of the present disclosure.

[0035] Figure 10 A perspective view of an electromagnetic heating apparatus is shown according to another embodiment of the present disclosure, viewed from a bottom side.

[0036] In the various drawings, like or corresponding elements are denoted by like or corresponding reference numerals. DETAILED DESCRIPTION

[0037] Preferred embodiments of the present disclosure will be described herein below with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0038] The term "comprising" and variations thereof as used herein are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an overly literal sense unless expressly so defined herein.

[0039] As described in the background section, the panel assembly of conventional electromagnetic heating apparatuses typically employs microcrystalline glass. Microcrystalline glass has good properties of non-magnetic permeability, good rigidity, easy to clean, waterproof, etc., and is a good material for cookers. However, the defect of the apparatus including microcrystalline glass lies in the following aspects: first, the microcrystalline glass is relatively high in cost, making the overall cost of the apparatus relatively high; second, the microcrystalline glass needs to be glued on a plastic part, which results in a high overall height of the apparatus, e.g., up to 5 cm or more; third, the microcrystalline panel glass is fragile, which makes the storage and accommodation of the electromagnetic heating apparatus must be cautious to prevent the microcrystalline glass from being broken.

[0040] According to the present disclosure, a brand new flexible panel assembly is provided and an installation structure with a unique design is adopted to ensure that the flexible panel assembly can perform functions equivalent to or similar to those of a microcrystalline glass, or even functions beyond those of a microcrystalline panel. The structural details of the electromagnetic heating apparatus according to the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that in the following description, an electromagnetic oven is taken as an example of the electromagnetic heating apparatus, and it should be understood that the inventive concept according to the embodiments of the present disclosure can be applied to other types of electromagnetic heating apparatuses.

[0041] Figure 1 and Figure 2 respectively show a perspective view and an exploded view of an electromagnetic heating apparatus 1 according to embodiments of the present disclosure. As shown in Figure 1 , the electromagnetic heating apparatus 1 comprises a panel assembly 11 and a base 40. The panel assembly comprises a flexible panel 10 and a non-magnetic rigid substrate 20 (see Figure 3 , which will be described in detail later). A top surface of the flexible panel 10 defines a support surface 12, which can include heating zones (also referred to as burner eyes 19) thereon. In the illustrated embodiment, the support surface 12 is in the shape of a flat surface, which is advantageous for kitchen appliances in terms of ease of cleaning, maintenance and storage. The base 40 can define a cavity in which various electrical components of the electromagnetic heating apparatus 1 can be arranged. The base 40 is assembled with the panel assembly 11 to form the electromagnetic heating apparatus.

[0042] The electromagnetic heating apparatus 1 further comprises an electromagnetic heating assembly 30, which is located below the burner eyes 19, and a circuit board 50. The circuit board 50 is used to drive the electromagnetic heating assembly 30 and to control the operation of the electromagnetic heating apparatus. The electromagnetic heating assembly 30 and the circuit board 50 can be arranged in the cavity of the base 40, and in the case where the base 40 is assembled with the panel assembly 11, these components are protected in the cavity.

[0043] In some embodiments, as shown in Figure 1 and Figure 2 , the support surface 12 further comprises an indication and control area 13. The indication and control area can include keys for selecting a heating temperature and / or a heating mode, and indicator lights for indication. A user can operate and / or observe the operating status of the electromagnetic heating apparatus 1 through the indication and control area 13. In some embodiments, as shown in Figure 1 and Figure 2As shown, the support surface 12 is also provided with a temperature sensor 17. The temperature sensor 17 is configured to sense the temperature of the appliance to be heated (such as a pot, etc.). The temperature sensor 17 can be communicatively connected to the circuit board 50 to transmit the temperature sensing data to the relevant components of the circuit board. The indication and control area 13 can be coupled with the indicator lights and / or operating components on the circuit board 50. In some embodiments, the indication and control area 13 may include an indicator light, which is optically coupled to the light source of the circuit board 50 through a light guide provided in the panel assembly 11. In some embodiments, the indication and control area 13 may include a key area, and when the user presses the key area, the user can actuate the electrical components corresponding to the key area provided on the circuit board 50 to implement the control settings of the electromagnetic heating device 1.

[0044] According to the present disclosure, by replacing traditional rigid microcrystalline panels with flexible materials, a significant technological advancement is achieved compared to conventional devices. In particular, the use of flexible materials significantly reduces the thickness of the panel assembly, thereby reducing the cost of the entire device. The soft nature of the flexible material also makes it easier to store and accommodate the electromagnetic heating device.

[0045] However, there are still many technical challenges and difficulties in technical implementation to use flexible materials to replace rigid microcrystalline panels. First, flexible materials are easy to deform, so what kind of structure is used to ensure the rigidity required for the flexible material to support the appliance to be heated and how to achieve the installation strength required to fix the flexible material to the base. Secondly, as kitchen equipment requires the cover to have good waterproofness and stain resistance, how can the flexible material ensure waterproofness and stain resistance while achieving problems such as appliance support and fixation. Furthermore, the characteristic of flexible materials that are easy to deform is more significant when heated. How to prevent problems such as bulging caused by uneven local heating of the flexible material when heated. According to the present disclosure, the panel assembly 11 adopts the form of a combination of flexible materials and rigid materials, which can effectively solve one or more of the above-mentioned technical problems. Figures 3-6 The structural details of the panel assembly 11 according to an embodiment of the present disclosure are shown in detail.

[0046] In some embodiments, as Figures 3-6 As shown, the panel assembly 11 includes a flexible panel 10 and a non-magnetic rigid substrate 20. The flexible panel 10 is made of a flexible material. The flexible material is easy to deform and has the performance of being resistant to high temperature heating. An example of a flexible material is silicone, or a material that is similar in flexibility to silicone and is resistant to high temperature. For example, silicone can withstand temperatures of 280 degrees Celsius or even higher. In addition, silicone also has good anti-slip properties, which can prevent utensils such as pots from moving on the supporting surface, further improving the heating performance. Figures 3-6 As shown, in particular, Figure 6As shown, the flexible panel 10 includes a top surface 12 (also referred to as a support surface) and a bottom surface 14 (i.e., a surface adjacent to the base 30) opposite the top surface 14. The top surface 24 defines a surface adapted to support a utensil well 19 to be heated. The rigid substrate 20 is a non-magnetic rigid material, which can be, for example, an aluminum or plastic piece. The rigid substrate 20 includes a top surface 22 (i.e., a surface in contact with the bottom surface 14 of the flexible panel 10) and a bottom surface 24 (i.e., a surface adjacent to the base 30) opposite the top surface 22. The rigid substrate 20 is secured to the flexible panel 10 with the top surface 22 in surface contact with the bottom surface 14 of the flexible panel 10. The bottom surface 24 of the rigid substrate 20 faces the surface of the base 30 and can cover the top portion of the cavity of the base 30.

[0047] The rigid substrate 20 can be secured to the flexible panel 10. In some embodiments, the rigid substrate 20 and the flexible panel 10 can be integrally formed by a mold. As an example, the rigid substrate can be first pre-formed, in the case of the rigid substrate being a plastic, the rigid substrate can be formed using injection molding; however, the rigid substrate is placed in a mold and a flexible material heated to a semi-liquid form is molded around the rigid substrate, thereby integrally forming the rigid substrate 20 and the flexible panel 10. The rigid material not only provides the support rigidity for the utensil to be heated but also provides the rigidity required for the face cover assembly to be secured to the base.

[0048] Considering that the material of the rigid substrate 20 and the material of the flexible panel 10 are different, the two materials expand at different rates when heated, the flexible panel 10 is prone to bulging. To this end, some anti-bulging structures are provided between the rigid substrate 20 and the flexible panel 10. In some embodiments, the flexible panel 10 and the rigid substrate 20 are secured together at the contact area by a plurality of rivet structures. The rivet structures are designed in a special structure that does not cause any damage to the support surface 12 of the flexible panel 10 and ensures sufficient bonding strength between the flexible panel 10 and the rigid substrate 20.

[0049] In some embodiments, the flexible panel 10 and the rigid substrate 20 can be fastened together by a fastening device.

[0050] In some embodiments, the fastening device includes a surface fastening device. The surface fastening device can include a plurality of through holes 26 provided on the rigid substrate 20 and a first peg portion 162 provided on the flexible panel 10. As shown in FIG. 2, the first peg portion 162 is inserted into the through hole 26 and is secured to the rigid substrate 20. The surface fastening device can include a plurality of through holes 26 provided on the rigid substrate 20 and a second peg portion 164 provided on the flexible panel 10. As shown in FIG. 3, the second peg portion 164 is inserted into the through hole 26 and is secured to the rigid substrate 20. Figures 3-6As shown, the rigid substrate 20 includes a plurality of through holes 26. The through holes 26 extend through the thickness of the rigid substrate 20 from the top surface 22 to the bottom surface 24. In some embodiments, the through holes 26 include at least two hole sections formed in different sizes. The material of the flexible panel 10 is at least partially disposed in the two hole sections and bonds the rigid substrate 20 and the flexible panel 10 together via the material located in the two hole sections. The material connecting the flexible panel 10 and the rigid substrate 20 can be formed in a shape matching the hole sections. The first peg portion 162 includes a first fastening post 1622 arranged in the first hole section 262 and a second fastening post 1624 arranged in the second hole section 264. This is achieved, for example, by pressure and the flowability of the flexible material when the flexible panel 10 and the rigid substrate 20 are integrally formed. The shape of the two hole sections can be formed in any appropriate shape as long as the bonding strength of the rigid substrate 20 and the flexible panel 10 can be enhanced.

[0051] In some embodiments, as shown in Figure 3 and Figure 6 The through hole 26 can include two hole sections, i.e., a first hole section 262 adjacent to the top surface 22 and a second hole section 264 away from the top surface 22. The hole diameter of the second hole section 264 is larger than that of the first hole section 262. When the flexible panel 10 is integrally formed, the material of the flexible panel 10 is filled in the second hole section 264. As an example, the second hole section 264 and the first hole section 262 can form the shape of a mushroom or a screw. In this way, the material filling the second hole section 264 can prevent the flexible panel 10 from detaching from the rigid substrate 20 in the thickness direction around the entire circumference of the first hole section 262. It should be understood that the shape of the second hole section 264 does not have to be circular, but can be any other appropriate shape as long as the material filling the second hole section 264 can limit the detachment of the flexible panel 10 from the rigid substrate 20.

[0052] In some embodiments, as shown in Figure 4 and Figure 5 The plurality of through holes 26 is arranged at a distance away from the circumferential side edge 28 of the rigid substrate 20. The plurality of through holes 26 is arranged throughout the top surface 22 of the rigid substrate 20. In other embodiments, the plurality of through holes 26 can be arranged at a predetermined interval only in part of the top surface 22 of the rigid substrate 20. In some embodiments, the plurality of through holes 26 can be arranged in high density and / or low density in part of the top surface 22 of the rigid substrate 20. It should be understood that the plurality of through holes 26 can be arranged in rows and columns or in any pattern. In this way, a rivet-like technical effect can be achieved by the material filling the through holes 26.

[0053] According to the present disclosure, by providing the plurality of through holes 26 on the rigid substrate 20, the rivet structure described above can be conveniently formed when the rigid substrate 20 and the flexible panel 10 are integrally formed on a mold.

[0054] In some embodiments, the flexible panel 10 is configured to wrap around the rigid substrate 20 at the peripheral side edge 28. In some embodiments, in addition to the anti-bulging means being provided at the top surface 22 of the rigid substrate 20, the anti-bulging means is also provided at the peripheral side edge 28 of the rigid substrate 20.

[0055] In some embodiments, the fastening means further comprises a side edge fastening means. The side edge fastening means comprises a plurality of peripheral notches 27 arranged along the peripheral side edge 28 and a second nail portion 164 provided on the flexible panel 10 and received in the peripheral notches 27. In some embodiments, as shown in Figure 5 and Figure 6 The peripheral notches 27 extend from the outer side of the peripheral side edge 28 towards the inner side of the peripheral side edge 28 by a distance. For example, when the flexible panel 10 is integrally formed, the material of the flexible panel 10 is filled in the peripheral notches 27 and the rigid substrate 20 and the flexible panel 10 are peripherally bonded together via the material located in the peripheral notches 27. The shape of the peripheral notches 27 can be formed in any appropriate shape. Accordingly, the second nail portion comprises a third fastening post 1642 arranged at the first notch segment 272 and a fourth fastening post 1644 arranged at the second notch segment 274. In some embodiments, the peripheral notches 27 are formed in a shape to facilitate the filling of the material. In some embodiments, the peripheral notches 27 are formed to enhance the rivet effect. In some embodiments, the peripheral notches 27 can be T-shaped, L-shaped or any other appropriate shape as viewed from a cross-section in the thickness direction of the panel assembly 11. In some embodiments, the peripheral notches 27 are arranged at predetermined intervals around the entire circumference of the peripheral side edge 28. In other embodiments, the peripheral notches 27 can be arranged at predetermined intervals only around a portion of the peripheral side edge 28.

[0056] In some embodiments, as shown in Figure 5 and Figure 6 The peripheral notches 27 comprise a first notch segment 272 adjacent to the outer side of the peripheral side edge 28 of the rigid substrate 20 and a second notch segment 274 distal to the outer side of the peripheral side edge 28. The aperture of the second notch segment 274 is larger than the aperture of the first notch segment 272 and the material of the flexible panel 10 is at least received in the second notch segment 274. In this way, the material filling the second notch segment 274 can prevent the flexible panel 10 from being detached from the rigid substrate 20 in the lateral direction (i.e. in a direction in the plane parallel to the support surface 12) in the entire circumferential direction around the first notch segment 272. It should be understood that the shape of the second notch segment 274 does not have to be circular and can be any other appropriate shape as long as the material filling the second notch segment 274 is able to laterally restrict the flexible panel 10 from being detached from the rigid substrate 20.

[0057] In some embodiments, as shown in FIG. 1, the flexible panel 10 is formed of a flexible material. The flexible panel 10 is configured to be attached to the rigid substrate 20. The flexible panel 10 is configured to be attached to the rigid substrate 20 at the first surface 22. The flexible panel 10 is configured to be attached to the rigid substrate 20 at the second surface 23. The flexible panel 10 is configured to be attached to the rigid substrate 20 at the third surface 25. The flexible panel 10 is configured to be attached to the rigid substrate 20 at the fourth surface 24. Figure 4 and Figure 6 As shown in FIG. 2, the flexible material of the flexible panel 10 extends at least partially to the bottom surface 24 of the rigid substrate 20. The circumferential side edge 28 includes a bottom notch 29 extending at the fourth surface 24. The material of the flexible panel 10 is configured to be at least partially received in the bottom notch 29, such that the flexible panel 10 wraps the rigid substrate 20 at the fourth surface 24 of the rigid substrate 20. For example, when the flexible panel 10 is integrally formed, the flexible material can be conveniently formed following the bottom notch 29.

[0058] The indication and control area 13 can be implemented in various forms. In some embodiments, both the flexible panel 10 and the rigid substrate 20 include an indication hole extending through both. For example, a light guide post can be received in the indication hole. The indication hole includes a first indication hole provided in the flexible panel 10 and a second indication hole provided in the rigid substrate 20. The first indication hole is smaller in size than the second indication hole. In particular, the first indication hole is sized to receive the indication portion in an interference fit. This has the benefit of waterproofing performance of the support surface of the flexible panel 10. Given that the flexible panel 10 is flexible in material, water intrusion can be prevented by taking advantage of the material flexibility and the size fit of the indication hole.

[0059] The temperature sensor 17 can be implemented in various mounting forms. Given that the temperature sensor 17 is exposed at the surface of the flexible panel 10, it is necessary to prevent water and / or foreign matter from intruding into the flexible panel through the area of the temperature sensor 17. In some embodiments, the flexible panel 10 includes a mounting portion 15 provided at the area of the burner hole 19, which is adapted to mount the temperature sensor 17. The mounting portion 15 is integrally formed with the flexible panel 10. In some embodiments, as shown in FIG. 3, the mounting portion 15 includes a mounting block 152 and a connecting bridge 154. The mounting block 152 is configured to carry the temperature sensor 17 and at least partially protrude from the first surface. The connecting bridge 154 is configured to elastically connect the mounting block 152 to a main body portion 153 of the flexible panel 10. Figure 7

[0060] The connecting bridge 154 is configured to elastically deform in response to the pressure of an appliance placed on the surface of the burner hole 19 of the flexible panel 10. Thereby, it can be ensured that the temperature sensor 17 remains in contact with the bottom surface of the appliance. In some embodiments, the connecting bridge 154, the mounting block 152 and the main body portion 153 are integrally formed, for example, a suitable mold can be designed to form when the flexible panel 10 and the rigid substrate 20 are integrally formed.

[0061] In some embodiments, as shown in FIG. 4, the temperature sensor 17 is mounted on the mounting portion 15. The temperature sensor 17 is mounted on the mounting block 152. The temperature sensor 17 is mounted on the mounting block 152 such that the temperature sensor 17 protrudes from the first surface 21 of the flexible panel 10. The temperature sensor 17 is mounted on the mounting block 152 such that the temperature sensor 17 protrudes from the second surface 23 of the rigid substrate 20. The temperature sensor 17 is mounted on the mounting block 152 such that the temperature sensor 17 protrudes from the third surface 25 of the rigid substrate 20. The temperature sensor 17 is mounted on the mounting block 152 such that the temperature sensor 17 protrudes from the fourth surface 24 of the rigid substrate 20. Figure 7 ​As shown, the connecting bridge 154 has a reduced thickness relative to the mounting block 152 and the main body 153. This structure can facilitate deformation of the connecting bridge 154. In some embodiments, the connecting bridge 154 is formed into an arcuate profile that protrudes upward or is recessed downward. In some embodiments, the connecting bridge 154 includes a profile that at least partially protrudes upward. This can reduce the area on the support surface 11 where dirt easily accumulates.

[0062] In some embodiments, as Figure 7 As shown, the mounting block 152 includes a receiving cavity 156 recessed from its top surface, and the temperature sensor 17 is adapted to be disposed in the receiving cavity 156. The mounting block 152 can provide reliable protection for the temperature sensor 17. In some embodiments, the receiving cavity 156 includes a cable channel 158 extending downward from the bottom surface of the receiving cavity 156. The cable channel is adapted to accommodate a cable for transmitting signals from the temperature sensor 17. Providing the cable channel on the bottom surface of the receiving cavity 156 can prevent water on the support surface 11 from entering the flexible panel 10 through the receiving cavity 156.

[0063] In some embodiments, as Figure 7 As shown, the receiving cavity 156 is configured to be filled with a curable colloid after the temperature sensor 17 is mounted in the receiving cavity 156. In this case, the remaining space in the receiving cavity 156 can be filled by the curing colloid, further improving the waterproof performance.

[0064] In some embodiments, as Figure 7 As shown, the mounting block 152 can be protected by a cap 159. The mounting block 152 is shaped so that its top fits together with the cap 159. The cap 159 is configured to cover the receiving cavity 156 after the temperature sensor 17 is installed in the receiving cavity 156. In some embodiments, the cap 159 is formed of a non-electromagnetic and thermally conductive material, for example, aluminum.

[0065] In some embodiments, in order to facilitate fastening the cover assembly 11 to the base 30, the rigid base plate 20 further includes an extended connecting post 23 protruding from the fourth surface 24, and the connecting post 23 is configured to receive a fastener for fastening the panel assembly 11. Figure 3 、 Figure 4 、 Figure 6 As shown, the connecting post 23 may extend to the inner cavity of the base 30. In some embodiments, the connecting post 23 may be provided with threads for threaded fastening.

[0066] In some embodiments, in order to further enhance the fastening strength between the cover assembly 11 and the base 30, the rigid base plate 20 may include a fastening flange 27 extending from the bottom surface 24 away from the bottom surface 24 adjacent to the circumferential side edge 28 of the rigid base plate 20. Figure 6As shown, the fastening flange 27 is provided as a protruding arrangement from the bottom surface 24, whereby the contact area between the rigid substrate 20 and the base 30 can be increased. The fastening flange 27 can be integrally formed when the rigid substrate is pre-formed, for example by injection molding. In some embodiments, the fastening flange 27 is provided around the entire circumference of the rigid substrate 20. In other embodiments, the fastening flange 27 can be provided around a portion of the rigid substrate 20.

[0067] In some embodiments, the electromagnetic heating apparatus 1 further comprises a heat dissipation fan 60 arranged within the cavity of the base 30. The heat dissipation fan 60 is configured to dissipate heat generated by the heat-generating components on the circuit board 50. As shown in Figure 2 and Figure 8 To further reduce the thickness of the electromagnetic heating apparatus 1, the heat dissipation fan 60 adopts a transverse layout, as shown. In particular, the heat dissipation fan 60 is arranged at a distance from the electromagnetic heating assembly 30 in a plane parallel to the support surface 12. In addition, the fan adopts a centrifugal fan. This has benefits in terms of heat dissipation efficiency. With a centrifugal fan, the air duct enters the fan from the lateral side of the apparatus and propagates across the plane, facilitating an increase in the heat dissipation area and improving the heat dissipation performance. In addition, according to the heat dissipation arrangement of the present disclosure, the centrifugal fan can rotate at a higher speed, and has the benefit of reducing noise.

[0068] In some embodiments, as shown in Figure 8 and Figure 8 , the air inlet of the centrifugal fan is formed near the outer periphery of the base at the lower side in the embodiment shown. The outer periphery of the base can comprise an air inlet grille 42. Air from the lower side enters the centrifugal fan, and air coming out of the outlet side of the centrifugal fan flows out through an air outlet grille 44 provided at the outer periphery of the base 40. In Figure 8 the embodiment shown, the air outlet grille 44 is provided on the other three sides of the outer periphery of the base 40. It should be understood that the embodiments shown are merely exemplary, and the air outlet grille 44 can be designed on one or two sides according to the heat dissipation performance requirements.

[0069] In some embodiments, as shown in Figure 2 and Figure 8 , the base 40 can further comprise one or more partition plates 62, 64 extending upwardly from the bottom wall of the base 40. The partition plates 62, 64 separate the air inlet and the air outlet of the centrifugal fan from each other. With this layout, cross talk between the air inlet and the air outlet can be prevented. In some embodiments, as shown in Figure 2 and Figure 8As shown, the partition plates can include an inlet partition plate 62 and an outlet partition plate 64, where the inlet partition plate 62 is arranged near the inlet grill of the base 40 and shaped to direct air from the inlet grill 42 into the air inlet of the fan, and where the outlet partition plate 64 is shaped to match the wall of the air outlet of the centrifugal fan.

[0070] In some embodiments, as shown in Figure 2 and Figure 8 The layout of the circuit board 50 is also modified to a format that fits with the heat-dissipating fan 60. The main heat-generating components of the circuit board 50 can be arranged on the main airflow path of the heat-dissipating fan 60, which facilitates heat dissipation. In some embodiments, the circuit board 50 can include a cutout 52 where the centrifugal fan is mounted. With this arrangement, the thickness of the device can be further reduced. In some embodiments, the partition plates 62, 64 are disposed in the cutout 52. In this case, no impact on the mounting of the circuit board 50 can be caused.

[0071] In Figure 1 the illustrated embodiment, the electromagnetic heating device 1 includes one stove eye 19. In other embodiments, the electromagnetic heating device 1 can include multiple stove eyes 19. Figure 9 and Figure 10 A schematic view of an embodiment including multiple stove eyes 19 is shown. As shown in Figure 9 and Figure 10 The electromagnetic heating device 1 can include one or more integrated panel assemblies 11. The panel assembly 11 is similar in structure to the panel assembly 11 of the foregoing embodiments. The difference is that one panel assembly 11 can include multiple heating units corresponding to the number of stove eyes 19 underneath. Each heating unit includes an electromagnetic heating assembly 30 and a base 40 adapted to house the electromagnetic heating assembly 30. These components are similar to those of the foregoing embodiments, and a detailed description thereof is omitted.

[0072] In some embodiments, the panel assembly 11 is configured to be foldable at a joint 70 between two adjacent heating units. Given that the panel assembly 11 includes a flexible panel 10, a folding device for folding adjacent heating units can be implemented by the flexible panel 10. In some embodiments, the panel assembly 11 is connected at the joint 70 via the material used to constitute the flexible panel 10. The joint can have a reduced thickness relative to other parts of the panel assembly 11 to facilitate folding. It should be understood that the illustrated embodiment is merely exemplary, and the joint 70 can be implemented as other hinge devices.

[0073] Moreover, while operations are depicted in a particular order, this should not be understood as requiring such order nor that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing can be advantageous. Likewise, while several specific implementation details are contained in the above discussion, these should not be construed as limitations on the scope of the disclosure, but rather as descriptions of particular implementations. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination.

[0074] Although the subject matter has been described in language specific to structural features and / or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

[0075] Embodiments of the present disclosure have been described above, with examples illustrating the description, but not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of words in this document is intended to best explain the principles of the embodiments, practical application, or technical improvement in the art, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A panel assembly for electromagnetic heating equipment, characterized in that: include: A flexible panel (10) comprising a first surface (12) and a second surface (14) opposite the first surface (12), the first surface (12) comprising one or more burner eyes (19) adapted to support an appliance to be electromagnetically heated; a non-magnetic rigid substrate (20) configured to support the flexible panel (10) in a thickness direction, the rigid substrate (20) comprising a third surface (22) and a fourth surface (24) opposite to the third surface (22), the rigid substrate (20) being fixed to the flexible panel (10) in such a manner that the third surface (22) is in surface contact with the second surface (14); as well as A fastening device for fastening the flexible panel (10) and the rigid substrate (20) together, the fastening device comprising a plurality of through holes (26) provided on the rigid substrate (20) and a first nail portion (162) provided on the flexible panel (10), wherein the through holes (26) extend from the third surface (22) through the rigid substrate (20) to the fourth surface (24).

2. The panel assembly according to claim 1, wherein: The through hole (26) includes at least two hole segments formed into different sizes, the at least two hole segments include a first hole segment (262) adjacent to the third surface (22) and a second hole segment (264) away from the third surface (22), the hole diameter of the second hole segment (264) is larger than the hole diameter of the first hole segment (262), and the first nail portion (162) includes a first fastening column (1622) arranged in the first hole segment (262) and a second fastening column (1624) arranged in the second hole segment (264).

3. The panel assembly according to claim 2, wherein: The plurality of through holes (26) are arranged throughout the third surface (22) of the rigid substrate (20).

4. The panel assembly according to claim 1, wherein: The rigid substrate (20) further includes a circumferential side edge (28), wherein the flexible panel (10) further includes a covering portion configured to cover the rigid substrate (20) at the circumferential side edge (28).

5. The panel assembly according to claim 4, wherein: The fastening device comprises a plurality of circumferential notches (27) arranged along the circumferential side edge (28) and a second nail portion (164) provided on the flexible panel (10) and received in the circumferential notches (27), wherein the plurality of circumferential notches (27) extend a distance from the outer side of the circumferential side edge (28) toward the inner side in a plane parallel to the first surface (12).

6. The panel assembly according to claim 5, wherein: The circumferential notch (27) includes a first notch segment (272) adjacent to the outer side of the circumferential side edge (28) of the rigid substrate (20) and a second notch segment (274) away from the outer side of the circumferential side edge (28), the aperture of the second notch segment (274) is larger than the aperture of the first notch segment (272), and the second nail portion includes a third fastening column (1642) arranged in the first notch segment (272) and a fourth fastening column (1644) arranged in the second notch segment (274).

7. The panel assembly according to claim 5 or 6, characterized in that: The circumferential notches (27) are arranged at predetermined intervals around the entire circumference of the circumferential side edge (28).

8. The panel assembly according to claim 4, wherein: The circumferential side edge (28) further includes a bottom recess (29) extending at the fourth surface (24), wherein the material of the flexible panel (10) is configured to be at least partially received in the bottom recess (29) so that the flexible panel (10) covers the rigid substrate (20) at the fourth surface (24) of the rigid substrate (20).

9. The panel assembly according to any one of claims 1 to 6 and 8, characterized in that The flexible panel (10) further comprises an integrally formed mounting portion (15) disposed in the furnace eye (19) region and suitable for mounting a temperature sensor (17).

10. The panel assembly according to claim 9, wherein The mounting portion (15) comprises: a mounting block (152) configured to carry the temperature sensor (17) and at least partially protruding from the first surface; and a connecting bridge (154) configured to elastically connect the mounting block (152) to the main body portion (153) of the flexible panel (10), the connecting bridge (154) having a reduced thickness relative to the mounting block (152) and the main body portion (153), the connecting bridge (154), the mounting block (152) and the main body portion (153) being integrally formed; The connecting bridge (154) is configured to elastically deform in response to pressure from the appliance placed on the surface of the oven eye (19) of the flexible panel (10) so that the temperature sensor (17) remains in contact with the bottom surface of the appliance.

11. The panel assembly according to claim 10, wherein: The connecting bridge (154) comprises an at least partially upwardly protruding profile.

12. The panel assembly according to claim 10, wherein: The mounting block (152) includes a receiving cavity (156) recessed from its top surface, and the temperature sensor (17) is suitable for being arranged in the receiving cavity (156); the receiving cavity (156) includes a cable channel (158) extending downward from the bottom surface of the receiving cavity (156), and the cable channel is suitable for arranging a cable for transmitting signals from the temperature sensor (17); the receiving cavity (156) is configured to be filled with a curable colloid after the temperature sensor (17) is mounted to the receiving cavity (156).

13. The panel assembly according to claim 12, wherein: The mounting block (152) is shaped so that a top portion thereof fits together with a cap (159), wherein the cap (159) is configured to cover the receiving cavity (156) after the temperature sensor (17) is mounted in the receiving cavity (156), and the cap (159) is formed of a non-electromagnetic and thermally conductive material.

14. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The rigid substrate (20) further includes an extended connection post (33) protruding from the fourth surface (24), the connection post (33) being configured to receive a fastener for fastening the panel assembly.

15. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The flexible panel (10) and the rigid substrate (20) also include an indication component, wherein the flexible panel (10) and the rigid substrate (20) include indication holes extending through the flexible panel (10) and the rigid substrate (20), wherein the indication holes include a first indication hole provided in the flexible panel (10) and a second indication hole provided in the rigid substrate (20), wherein the size of the first indication hole is smaller than the second indication hole; and the size of the first indication hole is determined to receive the indication component in an interference fit.

16. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The rigid base plate (20) further includes a fastening flange extending from the fourth surface (24) away from the fourth surface (24) adjacent to a circumferential side edge (28) of the rigid base plate (20).

17. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The flexible panel (10) is made of a silicone material; and the flexible panel (10) and the rigid substrate (20) are manufactured in an integrally formed manner through insert molding.

18. An electromagnetic heating device, characterized in that: include: The panel assembly according to any one of claims 1 to 17; electromagnetic heating assembly (30); a base (40), comprising a cavity suitable for accommodating the electromagnetic heating assembly (30) and assembled with the panel assembly; and A heat dissipation fan (60) is arranged in the cavity, wherein the heat dissipation fan (60) comprises a centrifugal fan and is arranged at a distance from the electromagnetic heating component (30) in a plane parallel to the first surface (12).

19. The electromagnetic heating device according to claim 18, characterized in that The base (40) further comprises one or more partition plates (62, 64) extending upwardly from a bottom wall of the base (40), wherein the partition plates separate the air inlet and the air outlet of the centrifugal fan from each other.

20. An electromagnetic heating device, characterized in that: include: At least one panel assembly according to any one of claims 1 to 17, each panel assembly comprising a plurality of furnace eyes (19), a heating unit being installed under each furnace eye, the heating unit comprising an electromagnetic heating assembly (30) and a base (40) suitable for accommodating the electromagnetic heating assembly (30); The panel assembly is configured to be foldable at a location (70) between two adjacent heating units.

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