Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel and a method for preparing the same, and a display device; the display panel includes a driving substrate, a pixel definition layer, an overhang structure, and sub-pixels. The pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the overhang structure is arranged on the side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; the sub-pixel is arranged in the pixel accommodating area; the sub-pixel includes an anode, an organic light-emitting layer, and a cathode stacked in sequence from close to the driving substrate to away from the driving substrate; the overhang structure separates the organic light-emitting layer and the cathode of two adjacent sub-pixels. The overhang structure includes a first overhang structure and a second overhang structure; the first overhang structure is arranged on the surface of the pixel definition layer; the second overhang structure is arranged on the side of the first overhang structure away from the pixel definition layer. The display panel can enhance the isolation effect of the overhang structure on the organic light-emitting layer and the cathode, and effectively avoid the occurrence of pixel crosstalk.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In the preparation process of OLED (Organic Light-Emitting Diode, OLED) organic light-emitting devices, maskless deposition and photolithography (photo lithography) patterned pixel methods can greatly increase the effective light-emitting area (aperture ratio) of active matrix OLED, which is conducive to greatly increasing pixel density. In order to achieve high resolution and colorization of passive matrix OLED, a cathode isolation column structure is introduced, that is, no metal template is used in the preparation of the device, but before evaporating the organic film and the metal cathode, an insulating partition is made on the substrate, and finally the different pixels of the device are separated to realize the pixel array arrangement. This cathode isolation column structure is also called an overhang structure.

[0003] However, in existing display panels, there is a risk that the overhang structure cannot completely isolate pixels. Summary of the invention

[0004] The display panel and the preparation method thereof provided in the present application are intended to solve the problem that the overhanging structure existing in the existing display panel cannot completely isolate the pixels.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a display panel, comprising:

[0006] Driver substrate;

[0007] A pixel definition layer is disposed on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area;

[0008] A suspension structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area;

[0009] A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate; the overhang structure separates the organic light-emitting layer and the cathode of two adjacent sub-pixels;

[0010] The overhanging structure comprises:

[0011] A first overhanging structure is disposed on the surface of the pixel definition layer;

[0012] The second overhanging structure is arranged on a side of the first overhanging structure away from the pixel definition layer.

[0013] In a specific embodiment, the first overhang structure includes a conductive portion serving as a common cathode and a first insulating portion shielding the conductive portion; the first insulating portion is disposed on a side of the conductive portion away from the pixel definition layer; the second overhang structure includes a supporting portion (non-conductive) and a second insulating portion shielding the supporting portion;

[0014] Wherein, the cathode of the sub-pixel is arranged in contact with the conductive part.

[0015] In a specific embodiment, along a first direction perpendicular to the stacking direction, opposite sides of the first insulating portion protrude from the sidewalls of the conductive portion to form a first eaves structure;

[0016] Along the first direction, opposite sides of the second insulating portion protrude from the sidewalls of the supporting portion to form a second eaves structure;

[0017] A width of the support portion along the first direction is smaller than a width of the first insulating portion along the first direction.

[0018] In a specific embodiment, the height of the support portion along the stacking direction is smaller than the height of the conductive portion along the stacking direction;

[0019] A height of the second insulating portion along the stacking direction is smaller than a height of the first insulating portion along the stacking direction.

[0020] In a specific embodiment, a width of the support portion along the first direction is smaller than a width of the conductive portion along the first direction.

[0021] In a specific embodiment, the volume of the second overhanging structure is 0.4 to 0.6 times the volume of the first overhanging structure.

[0022] In a specific embodiment, the height of the support portion along the stacking direction is equal to the height of the conductive portion along the stacking direction; the height of the second insulating portion along the stacking direction is equal to the height of the first insulating portion along the stacking direction;

[0023] The width of the supporting portion along the first direction is equal to the width of the conductive portion along the first direction; the width of the second insulating portion along the first direction is equal to the width of the first insulating portion along the first direction.

[0024] In a specific embodiment, the anode is disposed on a surface of the driving substrate facing the pixel definition layer; and the pixel definition layer covers a portion of the anode;

[0025] The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer is overlapped on the pixel definition layer;

[0026] The cathode is arranged on a surface of the organic light emitting layer which is away from the anode; and the cathode completely covers the organic light emitting layer and overlaps the pixel definition layer to separate the organic light emitting layer from the conductive part.

[0027] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a method for preparing a display panel, comprising:

[0028] Providing a preform; the preform comprises a driving substrate, a pixel definition layer and an anode; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area;

[0029] forming a first overhang structure on the pixel definition layer;

[0030] forming a second overhang structure on a surface of the first overhang structure facing away from the pixel definition layer;

[0031] An organic light-emitting material and a cathode material are sequentially deposited by evaporation on a side of the anode away from the driving substrate to form a sub-pixel.

[0032] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a display device, comprising a display panel as involved in any one of the above items.

[0033] Beneficial effects of the embodiments of the present application: Different from the prior art, the present application provides a display panel and a method for preparing the same, and a display device; the display panel includes a driving substrate, a pixel definition layer, a suspension structure, and sub-pixels. The pixel definition layer is arranged on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the suspension structure is arranged on the side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; the sub-pixel is arranged in the pixel accommodating area; the sub-pixel includes an anode, an organic light-emitting layer, and a cathode stacked in sequence from close to the driving substrate to away from the driving substrate; the suspension structure separates the organic light-emitting layer and the cathode of two adjacent sub-pixels. Specifically, the suspension structure includes a first suspension structure and a second suspension structure; the first suspension structure is arranged on the surface of the pixel definition layer; the second suspension structure is arranged on the side of the first suspension structure away from the pixel definition layer. By adding a second overhang structure on the first overhang structure to enhance the isolation effect of the overhang structure, when the organic light-emitting layer and cathode of the sub-pixel are evaporated and deposited, the overhang structure can better prevent the organic light-emitting material and cathode material from being deposited in the light-emitting areas of other color sub-pixels, thereby effectively avoiding the occurrence of pixel crosstalk. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the structure of a display panel provided in the first embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of a display panel provided in the second embodiment of the present application;

[0036] Figure 3 A schematic diagram of the structure of a display panel provided in the third embodiment of the present application;

[0037] Figure 4 A simplified structural diagram of a display device provided in an embodiment of the present application;

[0038] Figure 5 A flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0039] Figure 6 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application;

[0040] Figure 7 For Figure 6 A schematic diagram of a structure in which a first overhanging structure is arranged on the structure shown;

[0041] Figure 8 For Figure 7 A schematic diagram of a structure in which a second overhanging structure is arranged on the structure shown;

[0042] Fig. 9 For Figure 7 A schematic diagram of a structure in which a transition layer is provided on the structure shown;

[0043] Fig.10 For Figure 8 A schematic diagram of a structure in which an organic light-emitting layer and a cathode are arranged on the structure shown;

[0044] Fig.11 For Fig.10 A schematic diagram of the structure in which an encapsulation layer, a filling layer and a cover plate are arranged on the structure shown.

[0045] Description of Figure Numbers:

[0046] 100-display panel; 1-driving substrate; 2-pixel definition layer; 3-overhang structure; 4-sub-pixel; 5-encapsulation layer; 6-filling layer; 7-cover plate; 8-transition layer; 10-preform; 11-substrate; 12-driving circuit layer; 31-first overhang structure; 32-second overhang structure; 41-anode; 42-organic light-emitting layer; 43-cathode; 311-conductive part; 312-first insulating part; 321-support part; 322-second insulating part. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0049] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0050] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0051] See also Figure 1 , Figure 1 A structural schematic diagram of a display panel provided for the first embodiment of the present application; the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel; the display panel may include a driving substrate 1, a pixel definition layer 2, an overhang structure and a sub-pixel 4.

[0052] The driving substrate 1 may include a substrate 11 and a driving circuit layer 12; wherein the substrate 11 may be a glass substrate; or a flexible substrate, wherein the material of the flexible substrate is polyimide (PI). The driving circuit layer 12 may be a TFT circuit layer, and the TFT circuit layer is used to drive the sub-pixel 4 to emit light. The pixel definition layer 2 is disposed on a side surface of the driving substrate 1, and protrudes from the driving substrate 1 to form a plurality of pixel accommodation areas for accommodating the sub-pixels 4; specifically, the pixel definition layer 2 defines a plurality of openings on the driving circuit layer 12, and the openings are the pixel accommodation areas; each film layer of the sub-pixel 4 may be deposited and disposed in the openings.

[0053] The sub-pixel 4 includes an anode 41, an organic light-emitting layer 42 and a cathode 43 which are stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1; wherein the anode 41 is connected to the anode 41 power line, and the cathode 43 is connected to the cathode 43 power line, so that the organic light-emitting layer 42 is conductive and emits light. The overhang structure is arranged on the surface of the side of the pixel definition layer 2 away from the driving substrate 1, and the overhang structure protrudes and is arranged around the pixel accommodating area, which is used to separate sub-pixels 4 of different colors to avoid pixel crosstalk. The overhang structure separates the organic light-emitting layers 42 of two adjacent sub-pixels 4, and at the same time separates the cathodes 43 of two adjacent sub-pixels 4.

[0054] Specifically, the overhang structure may include a first overhang structure 31 and a second overhang structure 32; wherein the first overhang structure 31 is disposed on the surface of the pixel definition layer 2, and the second overhang structure 32 is disposed on the side of the first overhang structure 31 away from the pixel definition layer 2. Thus, by adding the second overhang structure 32 to the first overhang structure 31 to enhance the isolation effect of the overhang structure, when the organic light-emitting layer 42 and the cathode 43 of the sub-pixel 4 are deposited by evaporation, the overhang structure can better prevent the organic light-emitting material and the cathode 43 material from being deposited in the light-emitting area of ​​the sub-pixel 4 of other colors, thereby effectively avoiding the occurrence of pixel crosstalk.

[0055] In a specific embodiment, the first overhang structure 31 may include a conductive portion 311 and a first insulating portion 312 that blocks the conductive portion 311; specifically, the conductive portion 311 and the first insulating portion 312 are stacked in sequence on the pixel definition layer 2 from close to the pixel definition layer 2 to away from the pixel definition layer 2. The conductive portion 311 is disposed on a side of the first overhang structure 31 close to the pixel definition layer 2 and located on the surface of the pixel definition layer 2 facing the overhang structure; the conductive portion 311 may be disposed as a common cathode 43 in contact with the cathode 43 of the sub-pixel 4, so that the cathodes 43 of different sub-pixels 4 are connected through the conductive portion 311. The first insulating portion 312 is disposed on a side surface of the conductive portion 311 that is away from the pixel definition layer 2, and completely covers the side surface of the conductive portion 311, and is used to separate sub-pixels 4 of different colors.

[0056] Specifically, the material of the conductive part 311 can be one or two conductive metals such as Mo, Al, Mg, Cu, Cr, or conductive oxides such as ITO and IZO; the material of the first insulating part 312 can be an inorganic insulating material such as SiNx, SiOx, or an inorganic conductive material such as Ti.

[0057] Further, the second overhang structure 32 includes a support portion 321 and a second insulating portion 322 that blocks the support portion 321; specifically, the support portion 321 and the second insulating portion 322 are stacked in sequence on the first overhang structure 31 from close to the pixel definition layer 2 to away from the pixel definition layer 2. The support portion 321 is arranged on a side of the second overhang structure 32 close to the first overhang structure 31, and is located on a side surface of the first insulating portion 312 away from the pixel definition layer 2; the second insulating portion 322 is arranged on a side surface of the support portion 321 away from the first insulating portion 312, and completely covers the side surface of the support portion 321; in this way, the partition effect of the overhang structure is enhanced, and the sub-pixels 4 of different colors are completely separated. The support portion 321 is used to increase the height of the second overhang structure 32 along the stacking direction Z, and further enhance the partition effect of the overhang structure. In this embodiment, the material of the support portion 321 can be an insulating material. Of course, in other embodiments, the material of the support portion 321 can also be a conductive material.

[0058] Continue reading Figure 1 In a specific embodiment, along the first direction X perpendicular to the stacking direction Z, the opposite side edges of the first insulating portion 312 protrude from the sidewalls of the conductive portion 311 to form a first eaves structure, so that when the organic light-emitting layer 42 and the cathode 43 are deposited by evaporation, the evaporation angle can be changed by the first eaves structure so that the cathode 43 can completely cover the organic light-emitting layer 42. Similarly, along the first direction X, the opposite side edges of the second insulating portion 322 can also protrude from the sidewalls of the supporting portion 321 to form a second eaves structure.

[0059] The width of the support portion 321 along the first direction X is smaller than the width of the first insulating portion 312 along the first direction X, so as to avoid affecting the evaporation deposition of the organic light-emitting layer 42 and the cathode 43. It can be understood that if the width of the support portion 321 along the first direction X is too large, the deposition area of ​​the organic light-emitting layer 42 in the pixel accommodating area may be reduced, thereby reducing the area of ​​the light-emitting area. In addition, making the width of the support portion 321 along the first direction X smaller than the width of the first insulating portion 312 along the first direction X can also reduce the difficulty of the manufacturing process of the second overhang structure 32.

[0060] like Figure 1 As shown, in a specific embodiment, the height h of the support portion 321 along the stacking direction Z is 2 smaller than the height h of the conductive portion 311 along the stacking direction Z1 ; and the height h of the second insulating portion 322 along the stacking direction Z 4 smaller than the height h of the first insulating portion 312 along the stacking direction Z 3 That is, along the stacking direction Z, the height of the second overhang structure 32 is less than the height of the first overhang structure 31, so as to ensure a good isolation effect on the organic light-emitting layer 42 and the cathode 43 on both sides of the overhang structure while making the height of the second overhang structure 32 as small as possible, thereby making the overall thickness of the display panel film layer smaller and avoiding adverse effects on the thinness of the display panel.

[0061] like Figure 1 As shown, in a specific embodiment, the anode 41 is disposed on a surface of the driving substrate 1 facing the pixel definition layer 2, and is located in the pixel accommodation area, and is etched into a preset pattern. The pixel definition layer 2 is disposed between the anodes 41 of adjacent sub-pixels 4 to space the anodes 41 between the sub-pixels 4, to prevent the anodes 41 of adjacent sub-pixels 4 from being mutually conductive, thereby affecting the display effect of the display panel. Specifically, the height of the pixel definition layer 2 along the stacking direction Z may also be greater than the height of the anode 41 along the stacking direction Z, to further ensure that the anodes 41 of the sub-pixels 4 cannot be conductive; preferably, the two sides of the pixel definition layer 2 may also cover the edge portions of the anode 41 close to the pixel definition layer 2, respectively.

[0062] The organic light-emitting layer 42 is disposed on the surface of the anode 41 facing away from the driving substrate 1. In a specific embodiment, the organic light-emitting layer 42 can be deposited on the display panel by evaporation; the organic light-emitting layer 42 covers the anode 41 and covers part of the first pixel definition layer 2 to completely cover the anode 41, so as to prevent the cathode 43 subsequently evaporated from contacting and conducting with the anode 41, thereby affecting the display effect. Of course, the organic light-emitting layer 42 can also overlap the pixel definition layer 2 and cover part of the pixel definition layer 2 to completely cover the anode 41.

[0063] The cathode 43 is disposed on the surface of the organic light-emitting layer 42 facing away from the anode 41. In a specific embodiment, the cathode 43 can also be deposited on the surface of the organic light-emitting layer 42 by evaporation; during the evaporation process, the evaporation angle can be changed so that the cathode 43 completely covers the organic light-emitting layer 42 and overlaps the pixel definition layer 2 to separate the organic light-emitting layer 42 from the conductive portion 311; and the cathode 43 is arranged in contact with the conductive portion 311, so that the cathode 43 of the sub-pixel 4 is connected to the common cathode 43. Specifically, the cathode 43 covers the portion of the surface of the pixel definition layer 2 that is not covered by the organic light-emitting layer 42 and the conductive portion 311, and covers part of the surface of the side wall of the conductive portion 311.

[0064] like Figure 1As shown, in a specific embodiment, the display panel may further include an encapsulation layer 5, a filling layer 6 and a cover plate 7. The encapsulation layer 5 is used to perform anti-etching protection on the film layers in the sub-pixel 4 in the process of preparing sub-pixels 4 of other colors of the display panel, so as to prevent the prepared sub-pixel 4 from being damaged by the impact of the solution or external force during the subsequent preparation process. Specifically, the encapsulation layer 5 may be arranged on the side of the cathode 43 away from the organic light-emitting layer 42, and cover the surface of the cathode 43 and the uncovered surface of the overhanging structure; so as to perform anti-etching protection on the film layer of the sub-pixel 4. The encapsulation layer 5 may include a non-conductive inorganic material; specifically, the encapsulation layer 5 may include a silicon-containing inorganic material, such as a SiNx-based inorganic material.

[0065] After all sub-pixels 4 are prepared, a filling layer 6 and a cover plate 7 may be arranged on the display panel for overall packaging to protect the internal film layer of the display panel. Specifically, the filling layer 6 is coated on the side of the encapsulation layer 5 away from the drive substrate 1, and the cover plate 7 is attached to the surface of the filling layer 6 away from the encapsulation layer 5; wherein the surface of the filling layer 6 away from the encapsulation layer 5 is flattened to facilitate the arrangement of the cover plate 7 on the surface. The filling layer 6 may be an organic material; and the cover plate 7 may be a plastic film such as PET.

[0066] See also Figure 2 , Figure 2 Schematic diagram of the structure of the display panel provided in the second embodiment of the present application; the structure of the display panel provided in the second embodiment of the present application is basically the same as that of the display panel provided in the first embodiment of the present application, except that in the second embodiment of the present application, the width d of the support portion 321 along the first direction X is 2 smaller than the width d of the conductive portion 311 along the first direction X 1 , and the width d of the second insulating portion 322 along the first direction X 4 smaller than the width d of the first insulating portion 312 along the first direction X 3 That is, along the first direction X, the width of the second overhang structure 32 is smaller than the width of the first overhang structure 31 ; in this way, the difficulty of manufacturing the second overhang structure 32 on the surface of the first overhang structure 31 is reduced.

[0067] Specifically, the volume of the second overhang structure 32 may be 0.4 to 0.6 times the volume of the first overhang structure 31; for example, the volume of the second overhang structure 32 may be any value of 0.4, 0.5 or 0.6 times the volume of the first overhang structure 31; preferably, the volume of the second overhang structure 32 may be 0.5 times the volume of the first overhang structure 31. It is understood that if the volume of the second overhang structure 32 is too small, the partition effect of the second overhang structure 32 on the organic light-emitting layer 42 and the cathode 43 may be weakened; if the volume of the second overhang structure 32 is too large, the difficulty of the manufacturing process will be increased.

[0068] See also Figure 3 , Figure 3 Schematic diagram of the structure of the display panel provided in the third embodiment of the present application; the structure of the display panel provided in the third embodiment of the present application is basically the same as that of the display panel provided in the first embodiment of the present application, except that, in the third embodiment of the present application, the size of the second overhang structure 32 is the same as that of the first overhang structure 31, so as to further enhance the partition effect of the second overhang structure 32 on the organic light-emitting layer 42 and the cathode 43. Specifically, the height h of the support portion 321 along the stacking direction Z is 2 is equal to the height h of the conductive portion 311 along the stacking direction Z 1 ; The height h of the second insulating portion 322 along the stacking direction Z 4 is equal to the height h of the first insulating portion 312 along the stacking direction Z 3 The width d of the support portion 321 along the first direction X 2 is equal to the width d of the conductive portion 311 along the first direction X 1 The width d of the second insulating portion 322 along the first direction X 4 is equal to the width d of the first insulating portion 312 along the first direction X 3 .

[0069] Of course, in some other embodiments, the first overhang structure 31 may also be an inverted trapezoidal single-layer structure; in these embodiments, the first overhang structure 31 may be made by using a negative photoresist after exposure and development. It can be understood that the single-layer first overhang structure 31 cannot conduct electricity, and therefore a conductive metal layer needs to be provided between the first overhang structure 31 and the pixel definition layer 2 to turn on the cathode of the sub-pixel 4.

[0070] In other embodiments, the second overhang structure 32 may also be an inverted trapezoidal single-layer structure; similarly, the second overhang structure 32 may also be made of negative photoresist; it is understood that since the second overhang structure 32 does not need to play the role of a common cathode, the inverted trapezoidal second overhang structure 32 may be directly arranged on the surface of the first overhang structure 31 away from the drive substrate 1. Of course, in some embodiments, the first overhang structure 31 and the second overhang structure 32 may also be arranged as inverted trapezoidal single-layer structures.

[0071] The present application provides a display panel, which includes a driving substrate 1, a pixel definition layer 2, a suspension structure and a sub-pixel 4. The pixel definition layer 2 is arranged on a side surface of the driving substrate 1; the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodation area; the suspension structure is arranged on the side of the pixel definition layer 2 away from the driving substrate 1 and surrounds the pixel accommodation area; the sub-pixel 4 is arranged in the pixel accommodation area; the sub-pixel 4 includes an anode 41, an organic light-emitting layer 42 and a cathode 43 stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1; the suspension structure separates the organic light-emitting layer 42 and the cathode 43 of two adjacent sub-pixels 4. Specifically, the suspension structure includes a first suspension structure 31 and a second suspension structure 32; the first suspension structure 31 is arranged on the surface of the pixel definition layer 2; the second suspension structure 32 is arranged on the side of the first suspension structure 31 away from the pixel definition layer 2. By adding a second overhang structure 32 on the first overhang structure 31 to enhance the isolation effect of the overhang structure, when the organic light-emitting layer 42 and the cathode 43 of the sub-pixel 4 are evaporated and deposited, the overhang structure can better prevent the organic light-emitting material and the cathode 43 material from being deposited in the light-emitting areas of other color sub-pixels 4, thereby effectively avoiding the occurrence of pixel crosstalk.

[0072] See also Figure 4 , Figure 4 A schematic diagram of the structure of a display device provided in an embodiment of the present application; the present application also provides a display device, which may include the display panel 100 involved in any of the above embodiments. The display device can completely isolate the organic light-emitting layer 42 and cathode 43 of different sub-pixels 4, and can effectively avoid the problem of pixel crosstalk. The display device can be a product or component with display function such as a mobile phone, a tablet computer, a laptop computer and a television. The display device also includes a mainboard, a control circuit, etc. These structures are the same or similar to the relevant structures of the existing display device. For details, please refer to the prior art and will not be repeated here.

[0073] See also Figure 5-Figure 10 , Figure 5 A flow chart of a method for preparing a display panel provided in one embodiment of the present application; Figure 6 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application; Figure 7 For Figure 6 A schematic diagram of a structure in which a first overhanging structure is arranged on the structure shown; Figure 8 For Figure 7 A schematic diagram of a structure in which a second overhanging structure is arranged on the structure shown; Fig. 9 For Figure 7 A schematic diagram of a structure in which a transition layer is provided on the structure shown; Fig.10 For Figure 8The present application also provides a method for preparing a display panel, which is used to prepare the display panel involved in any of the above embodiments. The steps of the preparation method specifically include:

[0074] Step S1: providing a preform; the preform comprises a driving substrate, a pixel definition layer and an anode; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area.

[0075] Specifically, Figure 6 As shown, a metal material is deposited on a driving substrate 1 and etched into a preset pattern to form an anode 41; then a pixel definition layer 2 is disposed on the surface of the driving substrate 1 not covered by the anode 41, and the edge of the pixel definition layer 2 covers the edge of the anode 41. The height of the pixel definition layer 2 along the stacking direction Z is greater than the thickness of the anode 41 along the stacking direction Z, and a plurality of openings are formed around the pixel definition layer 2, namely, the pixel accommodating area.

[0076] Step S2: forming a first overhang structure on the pixel definition layer.

[0077] like Figure 7 As shown, in the specific implementation process, one or two conductive metals such as Mo, Al, Mg, Cu, Cr, or conductive oxides such as ITO and IZO are first deposited on the surface of the pixel definition layer 2 away from the driving substrate 1 to form a conductive material layer, and then inorganic insulating materials such as SiNx and SiOx are deposited on the surface of the conductive material layer to form an insulating material layer; finally, the insulating material layer and the conductive material layer are sequentially etched by photolithography to form a conductive portion 311 and a first insulating portion 312 to obtain a first overhang structure 31, and the first overhang structure 31 surrounds the pixel accommodating area. Specifically, the photolithography method can be a dry etching method or a wet etching method.

[0078] Of course, in other embodiments, an inorganic conductive material such as Ti may be deposited on the surface of the conductive material layer to form the first insulating portion 312 .

[0079] Step S3: forming a second overhang structure on a surface of the first overhang structure facing away from the pixel definition layer.

[0080] like Figure 8 As shown, in the specific implementation process, an inorganic insulating material is deposited on the surface of the first insulating portion 312 facing away from the drive substrate 1, and then the supporting portion 321 and the second insulating portion 322 are sequentially etched using the same photolithography method. Of course, in other embodiments, the supporting portion 321 can also be made of the same material as the conductive portion 311.

[0081] After step S2 and before step S3, the method may further include: filling an organic material in the pixel accommodating area to form a transition layer.

[0082] Specifically, Fig. 9 As shown, an organic material such as polyimide, epoxy resin, etc. is filled in the pixel accommodating area surrounded by the first overhang structure 31 to form a transition layer 8; and the surface of the transition layer 8 facing away from the drive substrate 1 is flush with the surface of the first overhang structure 31 facing away from the drive substrate 1. In this way, when the second overhang structure 32 is subsequently deposited and manufactured, the conductive part 311 can be placed on the same level or close to the same level, so that the subsequent photolithography process is easier to control.

[0083] Step S4: depositing an organic light-emitting material and a cathode material in sequence by evaporation on the side of the anode facing away from the driving substrate to form a sub-pixel.

[0084] like Fig.10 As shown, in the specific implementation process, the organic light-emitting layer 42 can be deposited on the display panel by evaporation and completely covers the anode 41; the cathode 43 can also be deposited on the surface of the organic light-emitting layer 42 by evaporation; the anode 41, the organic light-emitting layer 42 and the cathode 43 together constitute the sub-pixel 4.

[0085] Specifically, during the evaporation process, the evaporation angle can be changed so that the cathode 43 completely covers the organic light-emitting layer 42 and at least partially covers the pixel definition layer 2, and at the same time, the cathode 43 covers a portion of the side wall of the conductive part 311 to separate the organic light-emitting layer 42 from the conductive part 311.

[0086] In a specific implementation process, after step S4, the method may further include: forming an encapsulation layer on a surface of the cathode facing away from the organic light-emitting layer.

[0087] Specifically, Fig.11 As shown, Fig.11 For Fig.10 Schematic diagram of the structure in which an encapsulation layer, a filling layer and a cover plate are arranged on the structure shown. An inorganic material is deposited on the surface of the cathode 43 facing away from the organic light-emitting layer 42 to form an encapsulation layer 5; the encapsulation layer 5 can cover the surface of the cathode 43 and the uncovered surface of the overhang structure; so as to provide anti-etching protection for each film layer of the sub-pixel 4.

[0088] In a specific implementation process, after the step of forming the encapsulation layer 5 , the following steps may be further included: forming a filling layer on a side of the encapsulation layer away from the drive substrate; and attaching a cover plate to a surface of the side of the filling layer away from the drive substrate.

[0089] Specifically, Fig.11 As shown, an organic material is deposited on the side of the encapsulation layer 5 away from the driving substrate 1 to form a filling layer 6, and the surface of the filling layer 6 away from the encapsulation layer 5 is flattened; then a plastic film such as PET is attached to the surface of the filling layer 6 to form a cover plate 7.

[0090] The present application provides a method for preparing a display panel, which comprises providing a preform 10; the preform 10 comprises a driving substrate 1, a pixel definition layer 2 and an anode 41; wherein the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodation region; the anode 41 is arranged in the pixel accommodation region; then a first overhang structure 31 is formed on the pixel definition layer 2; then a second overhang structure 32 is formed on the surface of the first overhang structure 31 on the side away from the pixel definition layer 2; then an organic light-emitting material and a cathode 43 material are sequentially deposited by vapor deposition on the side of the anode 41 away from the driving substrate 1 to form a sub-pixel 4. In this way, by adding the second overhang structure 32 on the first overhang structure 31 to enhance the partition effect of the overhang structure, when the organic light-emitting layer 42 and the cathode 43 of the sub-pixel 4 are deposited by vapor deposition, the overhang structure can better prevent the organic light-emitting material and the cathode 43 material from being deposited in the light-emitting region of the sub-pixel 4 of other colors, and effectively avoid the occurrence of pixel crosstalk.

[0091] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising: Driver substrate; A pixel definition layer is disposed on a surface of one side of the driving substrate; The pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; A suspension structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate; the overhang structure separates the organic light-emitting layer and the cathode of two adjacent sub-pixels; It is characterized in that The overhanging structure comprises: A first overhang structure is arranged on the surface of the pixel definition layer; the first overhang structure comprises a conductive portion as a common cathode and a first insulating portion shielding the conductive portion; the first insulating portion is arranged on a side of the conductive portion away from the pixel definition layer; wherein the cathode of the sub-pixel is arranged in contact with the conductive portion; The second overhanging structure is arranged on a side of the first overhanging structure away from the pixel definition layer; the second overhanging structure includes a supporting portion and a second insulating portion covering the supporting portion.

2. The display panel according to claim 1, characterized in that: Along a first direction perpendicular to the stacking direction, opposite sides of the first insulating portion protrude from the sidewalls of the conductive portion to form a first eaves structure; Along the first direction, opposite sides of the second insulating portion protrude from the sidewalls of the supporting portion to form a second eaves structure; A width of the support portion along the first direction is smaller than a width of the first insulating portion along the first direction.

3. The display panel according to claim 2, characterized in that: The height of the support portion along the stacking direction is smaller than the height of the conductive portion along the stacking direction; A height of the second insulating portion along the stacking direction is smaller than a height of the first insulating portion along the stacking direction.

4. The display panel according to claim 3, characterized in that: A width of the support portion along the first direction is smaller than a width of the conductive portion along the first direction.

5. The display panel according to claim 4, characterized in that: The volume of the second overhanging structure is 0.4 to 0.6 times the volume of the first overhanging structure.

6. The display panel according to claim 2, characterized in that: The height of the supporting portion along the stacking direction is equal to the height of the conductive portion along the stacking direction; the height of the second insulating portion along the stacking direction is equal to the height of the first insulating portion along the stacking direction; The width of the supporting portion along the first direction is equal to the width of the conductive portion along the first direction; A width of the second insulating portion along the first direction is equal to a width of the first insulating portion along the first direction.

7. The display panel according to claim 1, characterized in that: The anode is disposed on a surface of the driving substrate facing the pixel definition layer; and the pixel definition layer covers a portion of the anode; The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer is overlapped on the pixel definition layer; The cathode is arranged on a surface of the organic light emitting layer which is away from the anode; and the cathode completely covers the organic light emitting layer and overlaps the pixel definition layer to separate the organic light emitting layer from the conductive part.

8. A method for preparing a display panel, characterized in that: include: Provide prefabricated parts; The preform comprises a driving substrate, a pixel definition layer and an anode; The pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; The anode is disposed in the pixel accommodating area; Depositing a conductive material layer and an insulating material layer on the pixel definition layer in sequence, and then etching to form a conductive portion and a first insulating portion to form a first overhang structure; Depositing an inorganic insulating material on a surface of the first overhanging structure on a side away from the pixel definition layer, and then etching to form a supporting portion and a second insulating portion to form a second overhanging structure; An organic light-emitting material and a cathode material are sequentially deposited by evaporation on a side of the anode away from the driving substrate to form a sub-pixel.

9. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-7.

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