Display panel manufacturing method and display panel

Abstract

The present application discloses a display panel manufacturing method and a display panel, and relates to the field of display technology. The technical solution provided by the present application adopts a protective film with a first side portion. When the protective film is applied, the first side portion faces the non-display area and is in a stepped shape extending away from the drive substrate in the direction close to the non-display area. This special shape makes it difficult for the conductive metal film layer to form a continuous film layer on the contour surface of the first side portion during deposition, and also reduces the thickness of the conductive metal film layer corresponding to the lower portion of the first side portion, thereby improving the isolation between the conductive metal film layer deposited on the surface of the protective film and the conductive metal film layer deposited on the non-display area of ​​the drive substrate, and avoiding the conductive metal film layer deposited on the non-display area of ​​the drive substrate from peeling off when the protective film is peeled off.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel manufacturing method and a display panel. Background Art

[0002] With the development of electronic display products, consumers' pursuit of product visual senses has become stronger. Therefore, some technical solutions suitable for providing narrow-border display panels have gradually emerged among the relevant technical solutions. For display panels with narrow borders, the main technical means currently used include back binding, which is to transfer the binding area to the back of the substrate so that the external circuit is connected to the binding area on the back, thereby achieving the purpose of reducing the border area. Among them, in some processes of back binding, side wires will be formed on the side of the substrate. Existing side wire forming methods can be divided into two methods: silver paste transfer and deposition of conductive metal film layer.

[0003] Before depositing the conductive metal film layer to form the side wires, a protective film needs to be attached to the display area of ​​the driving substrate to protect the display area. When the protective film is peeled off, the conductive metal film layer deposited on the surface of the protective film will affect the conductive metal film layer deposited on the non-display area of ​​the driving substrate, thereby causing the conductive metal film layer deposited on the non-display area of ​​the driving substrate to peel off. Summary of the invention

[0004] In summary, the technical problem to be solved by the present application is to provide a method for manufacturing a display panel, in which when peeling off the protective film, the risk of peeling off the conductive metal film layer deposited on the non-display area of ​​the driving substrate is low.

[0005] The technical means adopted by this application to solve the above-mentioned technology are:

[0006] In a first aspect, the present application provides a method for manufacturing a display panel, comprising:

[0007] Providing a driving substrate, the driving substrate having a display area and a non-display area at least arranged outside one side of the display area;

[0008] A protective film is attached to the driving substrate, wherein the protective film covers the display area, a side of the protective film facing the non-display area is a first side, and the first side is in a stepped shape extending away from the driving substrate in a direction close to the non-display area;

[0009] A conductive metal film layer is deposited on the driving substrate, and the protective film is peeled off to remove the portion where the conductive metal film layer is deposited on the protective film, thereby forming a binding wire in the non-display area.

[0010] Optionally, in some embodiments of the present application, the protective film is a stacked structure formed by stacking multiple covering layers in sequence, and in the direction away from the drive substrate, a portion of the first side defined by a rear covering layer protrudes beyond a portion of the first side defined by a front covering layer.

[0011] Optionally, in some embodiments of the present application, there are at least two adjacent covering layers satisfying the relationship: in the direction away from the drive substrate, a portion of the first side defined by the latter covering layer protrudes 20um to 30um beyond a portion of the first side defined by the former covering layer.

[0012] Optionally, in some embodiments of the present application, the covering layer closest to the driving substrate is an adhesive layer, and / or at least one covering layer is a polyimide layer.

[0013] Optionally, in some embodiments of the present application, the driving substrate includes a substrate and a thin film transistor layer arranged on at least one side of the substrate, and a planar layer is arranged on a side of the thin film transistor layer facing away from the substrate, and a recessed structure is formed on a portion of the planar layer extending to a non-display area.

[0014] Optionally, in some embodiments of the present application, the recessed structure is a groove, and the cross-sectional shape of the groove is any one of an arcuate shape, a trapezoidal shape, and a rectangular shape, or any combination of several of them.

[0015] Optionally, in some embodiments of the present application, there are multiple grooves, and the multiple grooves are arranged in sequence from close to the display area to far away from the display area.

[0016] Optionally, in some embodiments of the present application, the binding wire extends from the front side of the driving substrate through the side surface of the driving substrate to the back side of the driving substrate.

[0017] Optionally, in some embodiments of the present application, a driving substrate is provided, wherein the driving substrate has a display area and a non-display area at least arranged outside one side of the display area, including:

[0018] providing a substrate;

[0019] A thin film transistor layer is disposed on at least one side of the substrate, a planar layer is disposed on a side of the thin film transistor layer facing away from the substrate, and a groove is formed at a portion of the planar layer extending to the non-display area;

[0020] Wherein, forming a groove at a portion where the planar layer extends to the non-display area comprises:

[0021] The groove is formed by laser engraving or etching at a portion of the planar layer extending into the non-display area.

[0022] In a second aspect, the present application provides a display panel manufactured using the display panel manufacturing method described in the first aspect.

[0023] In summary, due to the adoption of the above technical means, this application has at least the following beneficial effects:

[0024] The present application provides a display panel manufacturing method and a display panel, which use a protective film having a first side portion. When the protective film is applied, the first side portion faces the non-display area and is in a stepped shape extending away from the drive substrate in a direction close to the non-display area. This special shape makes it difficult for the conductive metal film layer to form a continuous film layer on the contour surface of the first side portion during deposition, and also reduces the thickness of the conductive metal film layer corresponding to the lower portion of the first side portion, thereby improving the isolation between the conductive metal film layer deposited on the surface of the protective film and the conductive metal film layer deposited on the non-display area of ​​the drive substrate, and preventing the conductive metal film layer deposited on the non-display area of ​​the drive substrate from being peeled off when the protective film is peeled off. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. The drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a schematic diagram of the process of the preparation method in Example 1 provided by the present invention;

[0027] Figure 2 This is a schematic structural diagram of the driving substrate in Example 1 provided by the present invention when the protective film is attached;

[0028] Figure 3 This is a schematic diagram of the structure after a conductive metal film layer is deposited on the driving substrate in Example 1 provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the structure of the driving substrate after the protective film is peeled off and the binding wires are laser engraved in Example 1 provided by the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a unique orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0032] In the application, the word "exemplary" is used to mean "serving as an example, illustration, or description". Any embodiment described in this application as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the invention. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present invention can be implemented without using these specific details. In other instances, known structures and processes are not described in detail to avoid obscuring the description of the invention with unnecessary details. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles disclosed in this application.

[0033] Example 1

[0034] See also Figure 1 This embodiment provides a display panel manufacturing method, which specifically includes:

[0035] S1. Provide a driving substrate 1, wherein the driving substrate 1 has a display area AA and a non-display area BA at least arranged outside one side of the display area AA;

[0036] S2. A protective film 2 is attached to the driving substrate 1, wherein the protective film 2 covers the display area AA, and a side portion of the protective film 2 facing the non-display area BA is a first side portion 2a, and the first side portion 2a is in a stepped shape extending away from the driving substrate 1 in a direction close to the non-display area BA;

[0037] S3 . Depositing a conductive metal film layer 15 on the driving substrate 1 , and peeling off the protective film 2 to remove the portion where the conductive metal film layer 15 is deposited on the protective film 2 , thereby forming a binding wire 16 in the non-display area BA.

[0038] See also Figure 2 and Figure 3 When the protective film 2 is attached to the driving substrate 1, it can be seen that the side of the protective film 2 facing the non-display area BA is in a stepped shape, and extends away from the driving substrate 1 in the direction close to the non-display area BA. In other words, the contour surface of the first side portion 2a is roughly in the shape of a negative angle, so it is difficult for the conductive metal film layer 15 to form a continuous film layer on the contour surface of the first side portion 2a after deposition. At the same time, the contour surface of the first side portion 2a is in a protruding shape, which also reduces the thickness of the conductive metal film layer 15 corresponding to the lower part of the first side portion 2a, thereby improving the isolation between the conductive metal film layer 15 deposited on the surface of the protective film 2 and the conductive metal film layer 15 deposited on the non-display area BA of the driving substrate 1, and avoiding the conductive metal film layer 15 deposited on the non-display area BA of the driving substrate 1 from being peeled off when the protective film 2 is peeled off in step S3.

[0039] It should be noted that the above-mentioned driving substrate 1 includes a substrate 11 and a driving circuit layer arranged on the front side of the substrate 11. The driving circuit layer is used to drive the corresponding sub-pixel unit to light up, and it may include the film layers required to form thin-film transistors distributed in an array (for example: gate, gate insulation layer, active layer, source and drain, etc.). At the same time, the driving substrate 1 also includes a display element layer arranged on the side of the driving circuit layer facing away from the substrate 11. It can be understood that the above-mentioned display element layer is correspondingly arranged in the display area AA of the driving substrate 1. The driving circuit layer extends to both the display area AA and the non-display area BA.

[0040] It should also be noted that the binding wire 16 described above can be used in the case where the binding area is located on the back of the driving substrate 1 as shown in the present embodiment, and can also be used in the case where the binding area is located on the side of the driving substrate 1. Regardless of which binding method is used, the contour surface of the first side portion 2a can enhance the isolation of the conductive metal film layer 15 deposited on the non-display area BA of the driving substrate 1. More specifically, in the present embodiment, the binding wire 16 extends from the front of the driving substrate 1 through the side of the driving substrate 1 to the back of the driving substrate 1, so that one end of the binding wire 1 is connected to the binding area on the back of the driving substrate 1, and the binding area is used to bind an external circuit. The external circuit referred to here may include a driver IC and a printed circuit board connected to the driver IC. The other end of the binding wire 16 is connected to the driving circuit layer.

[0041] Regarding the protective film 2, the implementer can directly use a protective film 2 formed by a single film layer, but it is obvious that for a protective film 2 having only one film layer, the first side portion 2a is difficult to form and the process difficulty is relatively high. Therefore, in the present embodiment, the protective film 2 is a stacked structure formed by stacking multiple covering layers in sequence. In the direction away from the drive substrate 1, the portion of the first side portion 2a defined by the rear covering layer protrudes from the portion of the first side portion 2a defined by the front covering layer. In other words, in the present embodiment, the rear covering layer protrudes from the front covering layer to form the stepped shape of the first side portion 2a. With such a configuration, it is only necessary to stack the covering layers to naturally form a stepped surface, which is simpler in process and convenient for large-scale production. In addition, in this embodiment, there are at least two adjacent covering layers satisfying the relationship: in the direction away from the driving substrate 1, the portion of the first side portion 2a defined by the rear covering layer protrudes 20um to 30um from the portion of the first side portion 2a defined by the front covering layer. The specific values ​​may be 21um, 22um, 23um, 24um, 25um, 30um, and so on.

[0042] In addition, more specifically, in this embodiment, the number of film layers of the covering film included in a single protective film 2 is two layers, one of which is specifically an adhesive layer 21, and the other is a polyimide layer 22. The adhesive layer 21 is mainly used to enable the protective film 2 to be firmly connected to the driving substrate 1, while the polyimide layer 22 plays a protective role. The implementer can also select a protective film 2 of other structural styles according to actual conditions.

[0043] Furthermore, in the present embodiment, the driving substrate 1 includes a substrate 11 and a thin film transistor layer 12 disposed at least on one side of the substrate 11, and a flat layer 13 is disposed on the side of the thin film transistor layer 12 facing away from the substrate 11, and a recessed structure is formed on the portion where the flat layer 13 extends to the non-display area BA. In the present embodiment, the above-mentioned thin film transistor layer 12 is only disposed on the front side of the substrate 11, that is, the thin film transistor layer 12 constitutes the driving circuit layer, and the flat layer 13 covers the thin film transistor layer 12 for the formation of the recessed structure. Among them, the conductive metal film layer 15 is affected by the inner edge contour of the recessed structure in the recessed structure and is more likely to break, thereby further improving the isolation between the conductive metal film layer 15 deposited on the surface of the protective film 2 and the conductive metal film layer 15 deposited on the non-display area BA of the driving substrate 1.

[0044] Regarding the recessed structure, it can be in the shape of a hole, and in this embodiment, the recessed structure is a groove 13a, and the cross-sectional shape of the groove 13a is any one of an arcuate, a trapezoidal, and a rectangular shape or any combination of several of them. Specifically, in this embodiment, the cross-sectional shape of the groove 13a is a trapezoidal shape. The implementer can select the number of grooves 13a according to their own needs. For example, in this embodiment, the number of grooves 13a is multiple, and the multiple grooves 13a are arranged in sequence from close to the display area AA to away from the display area AA.

[0045] Meanwhile, as described above, in this embodiment, the thin film transistor layer 12 is only provided on one side of the substrate 11. The implementer may also provide thin film transistor layers 12 on two opposite sides of the substrate 11, wherein one thin film transistor layer 12 is used as a driving circuit layer. It is understood that when the thin film transistor layer 12 is provided on both sides of the substrate 11, both sides need to be covered with a protective film 2, and the protective films 2 on both sides may be the same or different.

[0046] In addition, regarding step S1, in this embodiment, a driving substrate 1 is provided, the driving substrate 1 having a display area AA and a non-display area BA at least arranged outside one side of the display area AA, specifically comprising:

[0047] S101, providing a substrate 11;

[0048] S102, a thin film transistor layer 12 is provided on at least one side of the substrate 11, a planar layer 13 is provided on a side of the thin film transistor layer 12 facing away from the substrate 11, and a groove 13a is formed at a portion of the planar layer 13 extending to the non-display area BA;

[0049] Wherein, a groove 13a is formed on a portion where the planar layer 13 extends to the non-display area BA, including:

[0050] A groove 13 a is formed by laser engraving or etching at a portion of the planar layer 13 extending into the non-display area BA.

[0051] At the same time, after the flat layer 13 is provided, the step of providing a display element array layer 14 on the flat layer 13 may also be included, specifically transferring the LED chip and connecting the display element array layer 14 to the drive circuit layer. Figure 3 and Figure 4 More specifically, in the present embodiment, in step S3, a conductive metal film layer 15 is deposited on the driving substrate 1, and the protective film 2 is peeled off to remove the portion where the conductive metal film layer 15 is deposited on the protective film 2, and then the conductive metal film layer 15 deposited in the non-display area BA is laser engraved to form a binding wire 16.

[0052] Example 2

[0053] The subject of Embodiment 2 is a display panel, wherein the display panel is manufactured by the display panel manufacturing method described in Embodiment 1. The display panel provided in this embodiment can be a liquid crystal display panel, an LED display panel, etc., and the implementer can select the specific one according to his / her own needs.

[0054] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0055] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0056] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0057] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining the number of digits. Although the numerical domains and parameters used to confirm the breadth of the range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0058] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this application is hereby incorporated by reference in its entirety, except for application history documents that are inconsistent with or conflicting with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or later attached to this application). It should be noted that if the descriptions, definitions, and / or use of terms in the attached materials of this application are inconsistent or conflicting with the content of this application, the descriptions, definitions, and / or use of terms in this application shall prevail.

Claims

1. A method for manufacturing a display panel, characterized in that: include: Providing a driving substrate, the driving substrate having a display area and a non-display area at least arranged outside one side of the display area; A protective film is attached to the driving substrate, wherein the protective film covers the display area, a side of the protective film facing the non-display area is a first side, and the first side is in a stepped shape extending away from the driving substrate in a direction close to the non-display area; Depositing a conductive metal film layer on the driving substrate, and peeling off the protective film to remove the portion where the conductive metal film layer is deposited on the protective film, thereby forming a binding wire in the non-display area; The driving substrate includes a substrate and a thin film transistor layer at least arranged on one side of the substrate, a flat layer is arranged on the side of the thin film transistor layer facing away from the substrate, and a concave structure is formed on the portion of the flat layer extending to the non-display area.

2. The method for manufacturing a display panel according to claim 1, wherein: The protection film is a stacked structure formed by stacking a plurality of cover layers in sequence, and in a direction away from the drive substrate, a portion of the first side portion defined by a rear cover layer protrudes beyond a portion of the first side portion defined by a front cover layer.

3. The method for manufacturing a display panel according to claim 2, wherein: There are at least two adjacent covering layers satisfying the relationship that, in a direction away from the drive substrate, a portion of the first side defined by the latter covering layer protrudes from a portion of the first side defined by the former covering layer by 20 um to 30 um.

4. The method for manufacturing a display panel according to claim 2, wherein: The covering layer closest to the driving substrate is an adhesive layer, and / or at least one of the covering layers is a polyimide layer.

5. The method for manufacturing a display panel according to claim 1, wherein: The recessed structure is a groove, and the cross-sectional shape of the groove is any one of an arcuate shape, a trapezoidal shape, and a rectangular shape, or any combination of the above.

6. The method for manufacturing a display panel according to claim 5, wherein: There are multiple grooves, and the multiple grooves are arranged in sequence from close to the display area to far away from the display area.

7. The method for manufacturing a display panel according to claim 1, wherein: The binding wire extends from the front side of the driving substrate through the side surface of the driving substrate to the back side of the driving substrate.

8. The method for manufacturing a display panel according to claim 1, wherein: A driving substrate is provided, wherein the driving substrate has a display area and a non-display area at least arranged outside one side of the display area, including: providing a substrate; A thin film transistor layer is disposed on at least one side of the substrate, a planar layer is disposed on a side of the thin film transistor layer facing away from the substrate, and a groove is formed at a portion of the planar layer extending to the non-display area; Wherein, forming a groove at a portion where the planar layer extends to the non-display area comprises: The groove is formed by laser engraving or etching at a portion of the planar layer extending into the non-display area.

9. A display panel, characterized in that: The display panel is manufactured by the display panel manufacturing method as described in any one of claims 1 to 8.

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