Thermal stability testing equipment for electronic components

Abstract

The invention relates to the field of electronic component testing, and specifically discloses a thermal stability testing device for electronic components, comprising a testing structure, wherein the testing structure comprises a hot air testing component, a cold air testing component and a positioning component; the positioning component uses a clamping method to limit and fix the electronic component, and is suitable for limiting the electronic components of different models and sizes, and the positioning component is located inside the hot air testing component and the cold air testing component, and different tests are performed on the electronic component by changing the position of the positioning component; the hot air testing component and the cold air testing component are integrated, and a distance is provided between the hot air testing component and the cold air testing component to avoid conflict between hot air and cold air and reduce energy consumption, and the electronic component can be heated by the hot air testing component to test the working state of the electronic component in a high temperature environment, and the electronic component can be cooled by the cold air testing component to test the working state of the electronic component in a low temperature environment.

Description

Technical Field

[0001] The invention relates to the field of electronic component testing, in particular to a thermal stability testing device for electronic components. Background Art

[0002] Thermal stability testing of electronic components is an important test method to evaluate the performance stability of electronic components in high temperature environments. This test is mainly used to ensure the reliability and durability of electronic components under extreme temperature conditions. Thermal stability testing can be performed using a variety of different techniques and equipment.

[0003] After leaving the factory, electronic components will be randomly sampled for thermal stability testing to check the quality of the current batch of products. The thermal stability test is to place the electronic components inside the test equipment and test the electronic components by heating the environment. For example, the Chinese patent with patent number CN214097225U tests the electronic components, but the heating equipment in the above patent has uneven heat, which can easily cause local heating of the electronic components, resulting in unstable test results of the electronic components. Summary of the invention

[0004] In order to solve the problem in the above background technology that local heating of electronic components causes unstable test results of the electronic components, the present invention provides a thermal stability test device for electronic components.

[0005] The thermal stability testing device of an electronic component provided by the present invention adopts the following technical solution:

[0006] A thermal stability testing device for electronic components, comprising a testing structure, wherein the testing structure comprises a hot wind testing component, a cold wind testing component and a positioning component;

[0007] The positioning assembly is used to install electronic components. The positioning assembly uses a clamping method to limit and fix the electronic components. It is suitable for limiting the position of electronic components of different models and sizes. The positioning assembly is located inside the hot air test assembly and the cold air test assembly. By changing the position of the positioning assembly, different tests can be performed on the electronic components. The cold environment stability test of the electronic components can be performed by moving the positioning assembly to the through slot near the cold air duct, and the thermal environment stability test of the electronic components can be performed by moving the positioning assembly to the through slot near the hot air duct.

[0008] The hot air test assembly and the cold air test assembly are integrated, and a distance is provided between the hot air test assembly and the cold air test assembly to avoid conflict between hot air and cold air and reduce energy consumption. The hot air test assembly can heat the electronic components to test the working state of the electronic components in a high temperature environment, and the cold air test assembly can cool the electronic components to test the working state of the electronic components in a low temperature environment.

[0009] The hot air duct and the cold air duct are both inclined, and a distance is provided between the outer shell and the inner liner, and the distance between the outer shell and the inner liner forms an air duct. The cross-sections of the outer shell and the inner liner are both rectangular, and the corners of the outer shell and the inner liner are provided with rounded corners, which guide the air when it flows, so that the air circulates in the air duct. An air guide plate A is provided at one end of the hot air duct inside the outer shell, and the air guide plate A is inclined, and the air guide plate A is fixed integrally with the outer shell. An air guide plate B is provided at one end of the cold air duct inside the outer shell, and the air guide plate B is inclined, and the air guide plate B is fixed integrally with the outer shell.

[0010] Two baffle plates are arranged between the outer shell and the inner liner, with a spacing between the two baffle plates. The inner and outer sides of the baffle plates are respectively welded and fixed to the outer shell and the inner liner. A plurality of air permeable grooves are provided on the outer side of the outer shell, and the air permeable grooves are located between the two baffle plates. A plurality of through grooves are symmetrically provided near the two ends of the inner liner.

[0011] Preferably, the hot air test assembly and the cold air test assembly include an outer shell, a hot air pipe, a heating wire, a cold air pipe, a cooling sheet, and an inner tank;

[0012] The outer shell is sleeved on the outside of the inner shell, and a plurality of hot air pipes are distributed in a ring shape on the outside of one end of the outer shell. The hot air pipes and the outer shell are an integrated fixed structure, and a heating wire is arranged inside each hot air pipe.

[0013] A plurality of cold air ducts are distributed in an annular manner on the outside of the other end of the outer shell. The cold air ducts and the outer shell are an integrated fixed structure. A plurality of embedded refrigeration fins are arranged on the outer wall of each cold air duct.

[0014] Preferably, the hot air duct and the cold air duct are both provided with a fan assembly, and the fan assembly includes a fan frame, a fan and a dustproof net;

[0015] Several fan racks are embedded in the hot air duct and the cold air duct. Each fan rack is equipped with multiple fans. The interior of the fan rack is prefabricated with multiple card slots. The fans are embedded in the internal card limiter of the fan rack. One end of the fan rack is provided with a groove. The fan rack is made of metal, and the dustproof net is made of soft magnetic sheet. The dustproof net is embedded in the groove and fixed to the fan rack by magnetic attraction.

[0016] Preferably, the positioning assembly includes an electronic component positioning frame, a guide rod, a spring, and a gasket B;

[0017] There are two electronic component positioning frames, and a spacing is provided between the two electronic component positioning frames. The electronic component positioning frames are all rectangular in shape. An integrally fixed plug rod is provided on the outer side of the electronic component positioning frame near the corners. A "U"-shaped groove is provided at the corners of the guide rod. There are four guide rods, and both ends of the guide rod pass through the "U"-shaped grooves on the two electronic component positioning frames respectively. An integrally fixed gasket A is provided at both ends of the guide rod. A spring is provided on the inner side of each gasket A. Both ends of the spring are respectively welded and fixed to the gasket A and the gasket B. The gasket B is sleeved on the outer side of the plug rod to clamp and limit.

[0018] The guide rod is provided with two integrally fixed clamping blocks, and the two clamping blocks are respectively fitted on the inner sides of the two electronic component positioning frames.

[0019] Preferably, a plurality of integrally fixed support rods are provided on the inner side of the two electronic component positioning frames, a spacing is provided between every two support rods, the ends of the support rods are covered with rubber caps, and an integrally fixed handle is provided on the outer side of each electronic component positioning frame.

[0020] Preferably, symmetrical sealing covers are provided on both sides of the outer shell, and two integrally fixed convex strips are provided on the inner side of the sealing cover, and the two convex strips are respectively attached to the inner side of the outer shell and the outer side of the inner liner, and two symmetrical legs are provided on the outer side of each sealing cover, the top of the leg is welded and fixed to the sealing cover, and the bottom of the leg is provided with an anti-slip pad.

[0021] In summary, the present invention includes at least one of the following beneficial technical effects:

[0022] 1. The distance between the outer shell and the inner shell forms an air duct. The cross-sections of the outer shell and the inner shell are both rectangular. The corners of the outer shell and the inner shell are both rounded. The rounded corners guide the air when it flows, so that the air circulates in the air duct. The inclined structure enables the hot air flow and the cold air flow to flow better inside the equipment to form an effective heat exchange. The air guide plate A and the air guide plate B are respectively located at one end of the hot air duct and the cold air duct. The air guide plate A and the air guide plate B form an integrated fixed structure with the outer shell, thereby effectively guiding the direction of the hot air flow and the cold air flow to prevent the hot air and the cold air from blowing directly on the electronic components.

[0023] 2. The positioning component is located inside the hot air test component and the cold air test component. Different tests can be performed on the electronic components by changing the position of the positioning component. The cold environment stability test of the electronic components can be performed by moving the positioning component to the slot near the cold air duct. The thermal environment stability test of the electronic components can be performed by moving the positioning component to the slot near the hot air duct. Both tests can be completed at one time, and the cold stability test can be performed immediately after the thermal stability test, which can simulate usage scenarios in extreme environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall explosion structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the partial explosion structure of the present invention;

[0027] Figure 4 It is a schematic cross-sectional view of a local structure of the present invention;

[0028] Figure 5 It is a schematic diagram of the cross-sectional structure of the positioning component of the present invention;

[0029] Figure 6 This is a schematic diagram of the inner tank structure of the present invention;

[0030] Figure 7 For the present invention Figure 3 Schematic diagram of the enlarged structure of part A in the middle.

[0031] Reference numerals: 100, outer shell; 101, ventilation groove; 200, hot air duct; 201, heating wire; 202, air guide plate A; 300, cold air duct; 301, cooling plate; 302, air guide plate B; 400, fan rack; 401, fan; 402, dustproof net; 500, liner; 501, through groove; 502, baffle plate;

[0032] 600, electronic component positioning frame; 601, handle; 602, plug rod; 603, support rod; 604, guide rod; 605, block; 606, gasket A; 607, spring; 608, gasket B; 700, sealing cover; 701, convex strip; 702, support leg. DETAILED DESCRIPTION

[0033] Embodiment 1, below is combined with the attached Figure 1-4 The present invention is described in further detail.

[0034] The embodiment of the present invention discloses a thermal stability test device for electronic components, including a test structure, wherein the test structure includes a hot air test component, a cold air test component, and a positioning component;

[0035] The positioning assembly is used to install electronic components. The positioning assembly uses a clamping method to limit and fix the electronic components. It is suitable for limiting the positioning of electronic components of different models and sizes. The positioning assembly is located inside the hot air test assembly and the cold air test assembly. By changing the position of the positioning assembly, different tests can be performed on the electronic components.

[0036] The hot air test assembly and the cold air test assembly are integrated into one, and a distance is provided between the hot air test assembly and the cold air test assembly to avoid conflict between hot air and cold air and reduce energy consumption. The hot air test assembly can be used to heat the electronic components to test the working conditions of the electronic components in a high temperature environment, and the cold air test assembly can be used to cool the electronic components to test the working conditions of the electronic components in a low temperature environment.

[0037] See also Figure 1-7 The hot air test assembly and the cold air test assembly include an outer shell 100, a hot air pipe 200, a heating wire 201, a cold air pipe 300, a cooling plate 301, and an inner liner 500; the outer shell 100 is sleeved on the outer side of the inner liner 500, and a plurality of hot air pipes 200 are distributed in an annular manner on the outer side of one end of the outer shell 100. The hot air pipe 200 and the outer shell 100 are an integrated structure, and the hot air pipe 200 is fixed on the outer side of the outer shell 100 to form an integrated structure closely connected with the outer shell 100. Each hot air pipe 200 is equipped with an efficient heating wire 201 inside, which can generate a large amount of hot air flow by quickly heating the air to meet the performance requirements of testing electronic components in a high temperature environment, improve the heat transfer efficiency, and make the entire device more compact and easy to operate and maintain;

[0038] See also Figure 1-7 A plurality of cold air ducts 300 are distributed in a ring on the outside of the other end of the outer shell 100. The cold air duct 300 and the outer shell 100 are an integrated fixed structure. The cold air duct 300 is distributed in a ring on the outside of the outer shell 100, forming an integrated fixed structure with the outer shell. A plurality of cooling fins 301 are embedded on the outer wall of each cold air duct 300. The cooling surface is inside the cold air duct 300, and the heating surface is outside the cold air duct to contact with the air for heat exchange. These cooling fins 301 can quickly reduce the air temperature and generate cold air flow. Through the synergistic effect of the cold air duct 300 and the hot air duct, comprehensive testing of electronic components in different temperature environments can be achieved.

[0039] See also Figure 1-7, several fan racks 400 are embedded in the hot air duct 200 and the cold air duct 300, and multiple fans 401 are fixedly installed inside each fan rack 400. The fan rack 400 is prefabricated with multiple card slots. The fans 401 are embedded in the internal card limit of the fan rack 400. One end of the fan rack 400 is provided with a groove. The fan rack 400 is made of metal. The dustproof net 402 is made of soft magnetic sheet. The dustproof net 402 is embedded in the groove and fixed to the fan rack 400 by magnetic attraction. The hot air duct 200 and the cold air duct 300 are both provided with fan components. The fan rack 400 is fixed on the hot air duct 200, and can generate strong wind force, blow the heat energy generated by the heating wire 201 and transport it to the inside of the outer shell 100, so as to perform a thermal stability test on the electronic components. The fan rack 400 is fixed on the cold air duct 300, and can generate strong wind force, blow the cold air generated by the refrigeration plate 301 and transport it to the inside of the outer shell 100, so as to perform a cold air environment test on the electronic components. The dustproof net 402 can effectively prevent dust and impurities from entering the inside of the fan, thereby ensuring the normal operation of the fan and extending its service life.

[0040] See also Figure 1-7 The hot air duct 200 and the cold air duct 300 are both inclined, and a distance is provided between the outer shell 100 and the inner liner 500. The distance between the outer shell 100 and the inner liner 500 forms an air duct. The cross-sections of the outer shell 100 and the inner liner 500 are both rectangular. The corners of the outer shell 100 and the inner liner 500 are both rounded. The rounded corners guide the air when it flows, so that the air circulates in the air duct. The inclined structure enables the hot air flow and the cold air flow to flow better inside the device, forming an effective heat exchange. At the same time, the distance between the outer shell 100 and the inner liner 500 forms an air duct, in which the air can circulate, so that the heat can The outer shell 100 and the inner shell 500 are both rectangular in cross-section. This design not only makes the appearance of the device more beautiful, but also enhances its structural stability. The outer shell 100 and the inner shell are both provided with rounded corners at the edges and corners. These rounded corners guide the air flow, allowing the air to circulate more smoothly in the air duct.

[0041] See also Figure 1-7An air guide plate A202 is provided at one end of the hot air duct 200 inside the outer shell 100, and the air guide plate A202 is inclined. The air guide plate A202 is fixed integrally with the outer shell 100. An air guide plate B302 is provided at one end of the cold air duct 300 inside the outer shell 100, and the air guide plate B302 is inclined. The air guide plate B302 is fixed integrally with the outer shell 100. The air guide plate A202 and the air guide plate B302 are respectively located at one end of the hot air duct 200 and the cold air duct 300, forming an integral fixed structure with the outer shell 100, thereby effectively guiding the direction of the hot air flow and the cold air flow, so that the heat can be more evenly distributed in the test area.

[0042] See also Figure 1-7 Two baffle plates 502 are provided between the outer shell 100 and the inner liner 500, and the two baffle plates 502 are used to block cold air and hot air to prevent energy loss caused by the intersection of cold air and hot air. A spacing is provided between the two baffle plates 502, and a plurality of air permeable grooves 101 are located between the two baffle plates 502. The air between the two baffle plates 502 can be exchanged with cold and heat through the air permeable grooves 101 to balance the temperature between the two baffle plates 502 and avoid the temperature being too low or too high. The inner and outer sides of the baffle plates 502 are respectively welded and fixed to the outer shell 100 and the inner liner 500, thereby strengthening the overall structure.

[0043] See also Figure 1-7 The positioning assembly includes an electronic component positioning frame 600, a guide rod 604, a spring 607, and a gasket B608; there are two electronic component positioning frames 600, and a spacing is provided between the two electronic component positioning frames 600. The electronic components can be clamped and limited by the two electronic component positioning frames 600. The electronic component positioning frames 600 are all rectangular in shape. The outer sides of the electronic component positioning frames 600 are provided with an integrally fixed plug rod 602 near the corners, and the corners of the guide rod 604 are provided with a "U"-shaped groove. There are four guide rods 604, and the two ends of the guide rod 604 pass through the "U"-shaped grooves on the two electronic component positioning frames 600 respectively. The two ends of the guide rod 604 are provided with an integrally fixed gasket A606, and each gasket A606 A spring 607 is provided on the inner side, and the two ends of the spring 607 are respectively welded and fixed to the gasket A606 and the gasket B608. The gasket B608 is sleeved on the outer side of the plug rod 602 to limit the position. When disassembly is required, the gasket B608 is tightened to squeeze the spring 607, so that 608 is separated from the plug rod 602. At this time, the guide rod 604 can be separated from 600, so that the two electronic component positioning frames 600 are separated from the electronic components in the middle position, thereby completing the disassembly; two integrally fixed clamping blocks 605 are provided on the guide rod 604, and the two clamping blocks 605 are respectively attached to the inner sides of the two electronic component positioning frames 600. The front and back sides of the electronic component positioning frames 600 are limited by the clamping blocks 605 and the gasket B608 to achieve the clamping effect.

[0044] See also Figure 1-7 A plurality of integrally fixed support rods 603 are provided on the inner side of the two electronic component positioning frames 600. A spacing is provided between every two support rods 603. Rubber caps are covered on the ends of the support rods 603. Point support is formed by the plurality of support rods 603 to reduce the contact area with the electronic components, so that the electronic components can avoid being locally affected during testing. A handle 601 is provided on the outer side of each electronic component positioning frame 600.

[0045] See also Figure 1-7 Symmetrical sealing covers 700 are provided on both sides of the outer shell 100, and two integrally fixed convex strips 701 are provided on the inner side of the sealing cover 700. The two convex strips 701 are respectively attached to the inner side of the outer shell 100 and the outer side of the liner 500, so as to seal the cold air channel and the hot air channel to prevent the loss of hot air and cold air. Two symmetrical legs 702 are provided on the outer side of each sealing cover 700, and the top of the leg 702 is welded and fixed to the sealing cover 700, and the bottom of the leg 702 is provided with an anti-slip pad.

[0046] Working principle:

[0047] When in use, the electronic components to be tested are placed between the two electronic component positioning frames 600, and then the four guide rods 604 are clamped in the "U"-shaped grooves on the two electronic component positioning frames 600, so that the gasket B608 squeezes the spring 607 to shrink it. At this time, the round hole on the gasket B608 is aligned with the plug rod 602, and the gasket B608 is loosened so that the spring 607 rebounds and pushes the gasket B608 to be sleeved on the outer side of the plug rod 602 to engage the limit. The spring 607 pushes the gasket B608, so that the gasket B608 pushes the electronic component positioning frame 600 to fit with the block 605, thereby completing the limit fixation. At this time, the electronic component positioning frame 600 is inserted into the interior of 500.

[0048] By moving the positioning assembly to the through slot 501 near the cold air duct 300, a cold environment stability test of the electronic component can be performed; by moving the positioning assembly to the through slot 501 near the hot air duct 200, a thermal environment stability test of the electronic component can be performed. Both tests can be completed at one time, and the cold stability test can be performed immediately after the thermal stability test, which can simulate usage scenarios in extreme environments.

[0049] The above are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal stability testing device for electronic components, characterized in that: The test structure includes a hot wind test component, a cold wind test component and a positioning component; The positioning assembly is used to install electronic components. The positioning assembly uses a clamping method to limit and fix the electronic components. It is suitable for limiting the position of electronic components of different models and sizes. The positioning assembly is located inside the hot air test assembly and the cold air test assembly. By changing the position of the positioning assembly, different tests can be performed on the electronic components. The cold environment stability test of the electronic components can be performed by moving the positioning assembly to the through slot near the cold air duct. The hot environment stability test of the electronic components can be performed by moving the positioning assembly to the through slot near the hot air duct. The positioning assembly comprises an electronic component positioning frame (600), a guide rod (604), a spring (607), and a gasket B (608); There are two electronic component positioning frames (600), a spacing is provided between the two electronic component positioning frames (600), the electronic component positioning frames (600) are all rectangular, an integrally fixed plug rod (602) is provided on the outer side of the electronic component positioning frame (600) near the corner, a "U"-shaped groove is provided at the corner of the guide rod (604), there are four guide rods (604), both ends of the guide rod (604) respectively pass through the "U"-shaped grooves on the two electronic component positioning frames (600), both ends of the guide rod (604) are provided with an integrally fixed gasket A (606), each gasket A (606) is provided with a spring (607) on the inner side, the two ends of the spring (607) are respectively welded and fixed to the gasket A (606) and the gasket B (608), and the gasket B (608) is sleeved on the outer side of the plug rod (602) to clamp and limit; Two integrally fixed clamping blocks (605) are provided on the guide rod (604), and the two clamping blocks (605) are respectively attached to the inner sides of the two electronic component positioning frames (600); The hot air test assembly and the cold air test assembly are integrated, and a distance is provided between the hot air test assembly and the cold air test assembly to avoid conflict between hot air and cold air and reduce energy consumption. The hot air test assembly can heat the electronic components to test the working state of the electronic components in a high temperature environment, and the cold air test assembly can cool the electronic components to test the working state of the electronic components in a low temperature environment. The hot air duct (200) and the cold air duct (300) are both inclined, and a distance is provided between the outer shell (100) and the inner liner (500), and the distance between the outer shell (100) and the inner liner (500) forms an air duct, and the cross-sections of the outer shell (100) and the inner liner (500) are both rectangular, and the corners of the outer shell (100) and the inner liner (500) are both rounded, so that the rounded corners guide the air when it flows, so that the air can flow in the air duct. To achieve circulation, an air guide plate A (202) is provided at one end of the hot air duct (200) inside the outer shell (100), the air guide plate A (202) is inclined, and the air guide plate A (202) is fixed integrally to the outer shell (100); an air guide plate B (302) is provided at one end of the cold air duct (300) inside the outer shell (100), the air guide plate B (302) is inclined, and the air guide plate B (302) is fixed integrally to the outer shell (100); Two baffle plates (502) are provided between the outer shell (100) and the inner liner (500), a spacing is provided between the two baffle plates (502), the inner and outer sides of the baffle plates (502) are respectively welded and fixed to the outer shell (100) and the inner liner (500), a plurality of venting grooves (101) are provided on the outer side of the outer shell (100), and the venting grooves (101) are located between the two baffle plates (502), and a plurality of through grooves (501) are symmetrically provided near both ends of the inner liner (500).

2. The thermal stability testing device for electronic components according to claim 1, characterized in that: The hot air test assembly and the cold air test assembly comprise an outer shell (100), a hot air pipe (200), a heating wire (201), a cold air pipe (300), a cooling plate (301), and an inner tank (500); The outer shell (100) is sleeved on the outer side of the inner shell (500); a plurality of hot air pipes (200) are distributed in an annular manner on the outer side of one end of the outer shell (100); the hot air pipes (200) and the outer shell (100) are an integral fixed structure; and a heating wire (201) is provided inside each hot air pipe (200); A plurality of cold air ducts (300) are distributed in a ring shape on the outside of the other end of the outer shell (100); the cold air ducts (300) and the outer shell (100) are an integral fixed structure; and a plurality of embedded refrigeration fins (301) are provided on the outer wall of each cold air duct (300).

3. The thermal stability testing device for electronic components according to claim 2, characterized in that: The hot air duct (200) and the cold air duct (300) are both provided with a fan assembly, wherein the fan assembly comprises a fan frame (400), a fan (401) and a dustproof net (402); A plurality of fan racks (400) are embedded in the hot air duct (200) and the cold air duct (300), each fan rack (400) is provided with a plurality of fans (401), the fan rack (400) is prefabricated with a plurality of slots, the fans (401) are embedded in the fan rack (400) for internal locking and limiting, one end of the fan rack (400) is provided with a groove, the fan rack (400) is made of metal, the dustproof net (402) is made of a soft magnetic sheet, and the dustproof net (402) is embedded in the groove and is fixed to the fan rack (400) by magnetic attraction.

4. The thermal stability testing device for electronic components according to claim 1, characterized in that: A plurality of integrally fixed support rods (603) are provided on the inner sides of the two electronic component positioning frames (600), a spacing is provided between every two support rods (603), the ends of the support rods (603) are covered with rubber caps, and an integrally fixed handle (601) is provided on the outer side of each electronic component positioning frame (600).

5. The thermal stability testing device for electronic components according to claim 2, characterized in that: Symmetrical sealing covers (700) are provided on both sides of the outer shell (100), and two integrally fixed convex strips (701) are provided on the inner side of the sealing cover (700), and the two convex strips (701) are respectively attached to the inner side of the outer shell (100) and the outer side of the inner liner (500), and two symmetrical supporting legs (702) are provided on the outer side of each sealing cover (700), and the top of the supporting legs (702) is welded and fixed to the sealing cover (700), and the bottom of the supporting legs (702) is provided with anti-slip pads.

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