Integrated Vapor Chamber

Abstract

The present invention discloses an integrated heat spreader, which at least includes a metal upper cover plate, a metal lower cover plate, a working space, a capillary structure and a working fluid. The metal upper cover plate includes a condensation inner surface, the condensation inner surface has a plurality of upper grooves arranged in parallel to each other and a plurality of support structures protruding between the grooves. The metal lower cover plate includes a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface has at least one recessed space for accommodating a heat-releasing element, and the evaporation inner surface has a plurality of lower grooves arranged in parallel to each other. The working space is an airtight space formed by the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate being joined to each other, and the plurality of support structures extend from the condensation inner surface and abut between the lower grooves of the evaporation inner surface to support the working space. The capillary structure is located in the lower groove. The working fluid exists in the working space and the capillary structure.

Description

Technical Field

[0001] The present invention relates to a vapor chamber, and in particular to an integrated vapor chamber. Background Art

[0002] High-power electronic components are a new generation of semiconductor components. With the popularization of 5G communications and artificial intelligence, data center servers are required to operate at higher frequencies and have more functional requirements. However, in order to meet high-speed communications and computing, high-power electronic components or chip processors inevitably generate a lot of heat when operating due to their high power density. The increasing heat generation will greatly affect the reliability of the operation of electronic components and limit the development of their applications if the heat accumulated in the electronic components cannot be effectively and timely dissipated. Therefore, a more efficient cooling system or module must be used to accelerate heat removal and ensure the stable operation of the chip.

[0003] With the development of 5G communication, chiplet packaging is expected to become a new trend in the future advanced process. Therefore, international giants such as Intel, TSMC, ASE, AMD, ARM, Microsoft and Qualcomm have announced the creation of the UCIe (Universal Chiplet Interconnect Express) industry alliance to integrate multiple chiplets into chiplets to achieve faster computing speeds. It is foreseeable that after the integration of multiple chiplets, the heat generated by the operation of these chips will be more than before. If the cooling system does not keep up with the pace of integration, the heat accumulated in the chip cannot be removed in time and effectively, and the impact will be the instability of the overall chip system. Common cooling systems use heat-generating electronic components, such as CPUs and GPUs, to stick a heat-conducting metal protective shell on them through thermal paste, so that the heat can be diffused to the entire metal protective shell. Then, the fin-type heat sink is attached to the metal protective shell with thermal paste, and a high-speed fan or water cooling is used to accelerate the heat dissipation of the heat sink. However, the computing speed of electronic components is increasing rapidly. Such heat dissipation efficiency can no longer effectively and timely remove the huge amount of heat generated by the operation of electronic components. Therefore, the new generation of heat dissipation modules introduces the fastest heat dissipation efficiency heat spreader and structures it between the above-mentioned metal protective shell and the radiator, so as to quickly remove the heat generated by the electronic components in large quantities.

[0004] The vapor chamber uses the phase change of the working fluid in its closed working chamber to quickly dissipate heat. It is the most efficient heat dissipation method at present. It uses the large amount of latent heat of vaporization involved in the rapid vaporization and condensation process of the working fluid in the near-vacuum chamber to achieve the purpose of rapid heat dissipation. The thermal conductivity of the vapor chamber can reach 10000W / (m 2·℃) or above, the thermal conductivity can reach dozens of times higher than that of traditional air convection or liquid convection, and the overall thickness of the heat spreader can be only about 3.0mm. It has been widely used in thin mobile devices and thin notebook computers.

[0005] However, when a large amount of heat is generated from electronic components, the heat must first be conducted and dispersed to the metal protective shell through thermal paste, and then the heat of the metal protective shell is further conducted to the heat spreader through thermal paste, and then the large amount of heat is quickly taken away by the heat spreader. The heat dissipation efficiency of thermal paste is far inferior to that of general metal protective shells and heat spreaders, and it becomes the largest thermal resistance in the overall heat dissipation system, seriously reducing the heat dissipation efficiency of the heat spreader. Furthermore, in order to be able to closely and smoothly contact with the electronic components so that the heat can be effectively conducted to the metal protective shell, the material used for the metal protective shell is mostly aluminum-magnesium alloy or other alloys with high hardness and non-deformability, and pure copper with softer material but higher thermal conductivity cannot be used as the metal protective shell, which will also cause thermal resistance to the overall heat dissipation system. In order to improve the heat dissipation efficiency, in view of the above problems, the present invention proposes an integrated heat sink, which is made of pure copper with a high hardness by cold forging, and a recessed space is reserved on the heat absorbing surface of the heat sink to accommodate and directly contact the electronic components. The original metal protective shell and the heat sink are integrally formed and forged with the same metal sheet to form an integrated heat sink, thereby eliminating the thermal resistance generated by the heterogeneous interface between the electronic components and the heat sink, thereby improving the heat dissipation efficiency.

[0006] In addition to being used for heat dissipation of a single electronic component, the integrated heat spreader of the present invention can also reserve multiple accommodating spaces that conform to the chip morphology on the heat-absorbing surface of the heat spreader to integrate multiple small chip packages for future 5G communications, and directly make the protective shell of multiple chips and the heat spreader into an integrated form. The heat spreader can directly contact the chipset to accelerate the heat conduction efficiency, and no longer needs to use thermal conductive paste as a medium, and can be used for heat dissipation of multiple chips in mobile devices.

[0007] In addition, the integrated heat spreader of the present invention uses cold forging to shape metal sheets (e.g., copper), and then uses CNC finishing. The metal does not need to be preheated and annealed during the forging process, so the internal grain structure of the forged metal will not cause holes or hypertrophy due to annealing, thereby reducing the thermal conductivity. On the contrary, the internal grain structure of the metal after cold forging can still be quite dense because there is no heating process, and the forged metal has the advantages of improved rigidity and density. After testing, the thermal conductivity and thermal diffusion coefficient of the metal can be further improved. Summary of the invention

[0008] The object of the present invention is to provide an integrated vapor chamber.

[0009] One embodiment of the present invention provides an integrated heat spreader, which at least includes a metal upper cover plate, a metal lower cover plate, a working space, a capillary structure and a working fluid. The metal upper cover plate includes a heat dissipation outer surface and a condensation inner surface. A frame of appropriate height is provided around the condensation inner surface, an upper channel groove is provided on the frame, and the condensation inner surface has a plurality of upper grooves arranged in parallel with each other and a plurality of support structures protruding between the grooves. The metal lower cover plate includes a heat absorption outer surface and an evaporation inner surface. The heat absorption outer surface has at least one recessed space for accommodating a heat release element. A frame of appropriate height is provided around the evaporation inner surface, a lower channel groove is provided on the frame, and the evaporation inner surface has a plurality of lower grooves arranged in parallel with each other. The working space is an airtight space formed by the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate, wherein the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate are opposite to each other, and the arrangement of the upper groove and the lower groove can be mapped and overlapped with each other, and the plurality of support structures extend from the condensation inner surface protrusion and abut between the lower grooves of the evaporation inner surface to support the working space. The exhaust channel is formed by the corresponding joint of the upper channel groove and the lower channel groove, and can be used to exhaust the working space. The capillary structure is located in the lower groove. The working fluid exists in the working space and the capillary structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1-Figure 3 This is a schematic diagram of a common heat dissipation module.

[0011] Figure 4 and Figure 5A-Figure 5B FIG. 4 is a schematic diagram of an integrated vapor chamber structure according to an embodiment of the present invention.

[0012] Figure 6A-6B FIG. 1 is a schematic diagram of a metal upper cover structure of an integrated heat sink according to an embodiment of the present invention.

[0013] Figure 7A-7B Schematic diagram of the metal lower cover structure of an integrated heat sink according to an embodiment of the present invention.

[0014] Figure 8A-B FIG. 1 is a schematic diagram of a metal lower cover structure of an integrated heat sink according to another embodiment of the present invention.

[0015] Fig. 9 It is a schematic diagram of the application of a metal lower cover plate of an integrated heat sink according to another embodiment of an embodiment of the present invention.

[0016] Explanation of the reference numerals: 10, 20, 30 - heat dissipation module of the prior art; 80 - integrated heat spreader; 100 - substrate; 200 - electronic component; 300 - metal protective shell; 400 - thermal paste; 500 - heat sink; 600 - heat spreader (prior art); 800 - metal upper cover; 810 - heat dissipation outer surface; 820 - condensation inner surface; 830 - upper groove; 840 - support structure; 880 - upper frame; 881 - upper channel groove; 900, 901 - metal lower cover; 910 - heat absorption outer surface; 920 - evaporation inner surface; 930 - lower groove; 940 - recessed space; 980 - lower frame; 981 - lower channel groove; 1010 - welding groove; 1020 - working space; 1040 - capillary structure; 1080 - exhaust channel. DETAILED DESCRIPTION

[0017] The following will refer to the relevant drawings to illustrate the embodiment of the integrated heat sink of the present invention. For the sake of clarity and convenience of the illustration, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, the technical terms used should be interpreted in the sense commonly known and used by those of ordinary skill in the art. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols. As described in this specification, the word "about" generally refers to the actual value within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. The word "about" in this article means that the actual value falls within the acceptable standard error of the mean value, depending on the consideration of those of ordinary skill in the art to which the present invention belongs. Except for the examples, or unless otherwise explicitly stated, it should be understood that the ranges, quantities, values ​​and percentages used herein are all modified by "about". Therefore, unless otherwise stated, the values ​​or parameters disclosed in this specification and claims are approximate values ​​and can be changed as needed.

[0018] See also Figure 1 , which is a common existing heat dissipation module 10 for electronic components such as CPU or GPU, including: a substrate 100, an electronic component 200, a metal protective shell 300 and a heat sink 500; wherein the heat-generating electronic component 200 is firstly adhered to the metal protective shell 300 with a thermal conductive paste 400, and then the heat sink 500 is adhered to the outer surface of the metal protective shell 300 with the thermal conductive paste 400 to accelerate heat dissipation.

[0019] As the computing power of electronic components increases, conventional heat dissipation modules are no longer able to dissipate heat efficiently. Therefore, in order to further improve the heat dissipation capacity, the new generation of heat dissipation modules introduces a heat sink 600 that has a heat dissipation efficiency that is dozens of times higher than that of traditional convection heat dissipation. Common designs, such as Figure 2The heat dissipation module 20 shown in the figure inserts a heat spreader 600 between the metal protective shell 300 and the heat sink 500 of the conventional heat dissipation module, and a thermal conductive paste 400 is applied between the heat spreader 600 and the metal protective shell 300 or the heat sink 500 to make them closely adhere to each other. However, compared with the conventional heat dissipation module, this method adds a layer of thermal conductive paste 400 with a lower thermal conductivity coefficient in the heat dissipation system, so that the overall heat dissipation system cannot exert heat dissipation efficiency due to an additional thermal resistance.

[0020] In order not to increase thermal resistance, please refer to Figure 3 Another design of the heat dissipation module 30 is to directly adhere the heat spreader 600 to the electronic component 200 with the thermal paste 400. When the heat source is generated from the electronic component 200, the heat is transferred through the thermal paste 200 to the heat spreader 600 with higher heat dissipation efficiency. After the heat spreader 600 absorbs the heat, the working fluid in its internal space will quickly vaporize to form steam. Because the heat spreader 600 is connected to the top of the heat spreader 600, when the steam rises quickly and contacts the colder surface of the top externally connected to the heat spreader 500, the steam will condense and release a large amount of heat through phase change. This large amount of heat is then transferred to the heat spreader 500 through the thermal paste 400, and then the heat is taken away by air convection. Since the total thickness of the general heat spreader 600 is only about 3mm, the biggest problem with this approach is that the heat spreader 600 made of pure copper, which is a relatively soft material, is prone to deformation and warping under long-term use, causing the electronic component 200 and the heat spreader 600 to lose complete sealing and fail to effectively transfer heat, thereby increasing thermal resistance. In view of this, the inventors of the present invention use a cold forging method and reserve a space for accommodating electronic components on the heat-absorbing surface of the lower cover of the heat spreader to produce a heat spreader that is high in hardness, resistant to deformation, and can cover the electronic components 200 to improve heat dissipation efficiency.

[0021] See also Figure 4 and Figure 5A-Figure 5B, which is an integrated heat spreader 80 of an embodiment of the present invention, at least comprising: a metal upper cover plate 800, comprising a heat dissipation outer surface 810 and a condensation inner surface 820, an upper frame 880 of appropriate height is arranged around the condensation inner surface 820, an upper channel groove 881 is arranged on the upper frame 880, and the condensation inner surface 820 has a plurality of upper grooves 830 arranged in parallel with each other and a plurality of support structures 840 protruding between the grooves; a metal lower cover plate 900, comprising a heat absorption outer surface 910 and an evaporation inner surface 920, the heat absorption outer surface 910 has at least one recessed space 940 for accommodating a heat release element, a lower frame 980 of appropriate height is arranged around the evaporation inner surface 920, a lower channel groove 981 is arranged on the lower frame 980, and the evaporation inner surface 920 has a plurality of lower grooves 930 arranged in parallel with each other; The working space 1020 is an airtight space formed by the upper frame 880 of the metal upper cover plate 800 and the lower frame 980 of the metal lower cover plate 900, wherein the condensation inner surface 820 of the metal upper cover plate 800 and the evaporation inner surface 920 of the metal lower cover plate 900 are opposite to each other, and the arrangement of the upper groove 830 and the lower groove 930 can be mapped and aligned with each other, and the plurality of support structures 840 protrude from the condensation inner surface 820 and abut against the lower groove 930 of the evaporation inner surface 920 to support the working space 1020; the exhaust channel 1080 is composed of the corresponding joint of the upper channel groove 881 and the lower channel groove 981, which can be used to exhaust the working space 1020; the capillary structure 1040 is located in the lower groove 930; the working fluid exists in the working space 1020 and the capillary structure 1040. In one embodiment, the upper frame 880 and the lower frame 980 of the integrated vapor chamber 80 further have a welding groove 1010 for welding and joining the metal upper cover plate 800 and the metal lower cover plate 900 to form the vapor chamber 80 .

[0022] See also Fig. 6A and Figure 6B , which is the metal upper cover plate 800 of the integrated heat spreader of the present invention. In this embodiment, the integrated heat spreader of the present invention is characterized in that the shape and structural features included in the metal upper cover plate, such as the support structure, are directly formed on the same piece of metal by cold forging rather than sintering or external connection. In other words, the metal upper cover plate as a whole is formed by forging the same metal sheet into the shape and structural features, and then modified by general CNC methods. Further explanation: the metal upper cover plate 800 of the integrated heat spreader of the present embodiment, the plurality of support structures 840 on the condensation inner surface 820 are directly formed on the condensation inner surface 820 by cold forging, and are inseparable from the condensation inner surface 820 of the metal upper cover plate 800, and are not sintered and joined after the metal upper cover plate 800 is formed, and is not formed and then sintered and externalized to the condensation inner surface 820 as is generally done.

[0023] See also Fig. 7A and Figure 7B , which is the metal lower cover plate 900 of the integrated heat spreader of the present invention. In this embodiment, the integrated heat spreader of the present invention is characterized in that the shape and structural features of the lower cover plate are directly formed on the same piece of metal by cold forging, including the recessed space 940 of the heat absorbing outer surface 910 of the metal lower cover plate 900, and then modified by CNC processing. In addition, the recessed space 940 of the heat absorbing outer surface 910 of the metal lower cover plate 900 made by cold forging is recessed from the heat absorbing outer surface 910 to the evaporation inner surface 920 but does not protrude from the corresponding evaporation inner surface 920, which is different from the general stamping process where one side is recessed and the corresponding other side has a corresponding protrusion.

[0024] Generally speaking, the method of making an integrated upper cover plate of the integrated heat spreader of the present invention as described above can adopt an etching process or a composite processing process (for example: integrating a stamping process and a milling machine) in combination with a sintering method. The advantage of the etching process is that it can etch out more complex structures, which are generally used for products that are not easy to make with traditional processing processes. The advantage of the composite processing process is that most of the manufacturing methods used are mature and can be produced without much development. However, the etching process takes a long process time, and there will be problems with uneven processing surfaces and the need for secondary processing. The composite processing process requires more steps and time to produce.

[0025] The integrated heat spreader of the present invention adopts cold forging to produce the shape and structure of the metal upper cover plate 800 and the metal lower cover plate 900. The difference from the etching process or the composite processing process is that the cold forging method is to place the metal sheet (or metal block) to be processed in a female mold, and then continuously forge the metal sheet with a male mold at room temperature to form it. A person of ordinary knowledge in this technical field should understand that the cold forging method does not require the metal to be pre-heated, softened and annealed during the forging process as in the general stamping process, so the internal grain structure of the forged metal will not cause holes or tissue hypertrophy due to annealing, thereby reducing the thermal conductivity coefficient. After cold forging, the metal can maintain a fairly dense internal grain structure due to the absence of a heating process, and can reduce internal defects such as pores. The metal surface after forging is smoother, and can have a closer contact with electronic components to reduce the thermal resistance of poor contact. It also has the advantages of improved rigidity and density, and is not easy to deform. According to testing, the thermal conductivity and thermal diffusion coefficient of the metal after forging are higher than those before forging, that is, the heat dissipation efficiency of the integrated heat sink of the present invention is higher than that of the general traditional process.

[0026] In an integrated heat sink of an embodiment of the present invention, the metal upper cover plate 800 and the metal lower cover plate 900 are formed into the above structure by cold forging using metal sheets (eg, pure copper) with high thermal conductivity and thermal diffusion coefficient.

[0027] In another embodiment, the metal upper cover plate 800 and the metal lower cover plate 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 800 and the metal lower cover plate 900 manufactured after cold forging have a Vickers hardness of approximately 90HV to 120HV, for example, a Vickers hardness of approximately 95HV to 120HV, 100HV to 120HV, 105HV to 120HV, 110HV to 120HV, 115HV to 120HV, preferably 115HV to 117HV.

[0028] In another embodiment, the metal upper cover plate 800 and the metal lower cover plate 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 800 and the metal lower cover plate 900 manufactured by cold forging have a thermal conductivity of approximately 400W / (m·K) to 430W / (m·K), for example, a thermal conductivity of approximately 405W / (m·K) to 430W / (m·K), 410W / (m·K) to 430W / (m·K), preferably 420W / (m·K) to 430W / (m·K).

[0029] In another embodiment, the metal upper cover plate 800 and the metal lower cover plate 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 800 and the metal lower cover plate 900 manufactured after cold forging have a thermal diffusion coefficient of about 90 mm. 2 / sec~120mm 2 / sec, for example, with a thermal diffusion coefficient of about 95 mm 2 / sec~120mm 2 / sec、100mm 2 / sec~120mm 2 / sec、105mm 2 / sec~120mm 2 / sec、110mm 2 / sec~120mm 2 / sec、115mm 2 / sec~120mm 2 / sec, preferably 115mm 2 / sec~117mm 2 / sec.

[0030] A person of ordinary skill in the art should be able to understand that the above-mentioned values ​​of Vickers hardness, thermal conductivity and thermal diffusion coefficient are physical properties that pure copper has only after cold forging. These physical properties are different from the material properties obtained through other processing methods and are also one of the key technical features of the present invention. In one embodiment of the integrated heat spreader of the present invention, the metal upper cover plate 800 and the metal lower cover plate 900 of the integrated heat spreader are made of pure copper, and the material properties after cold forging are commissioned to a third-party measurement unit (Yuanhe Company; YUANHE) to measure the physical properties such as Vickers hardness, thermal conductivity and thermal diffusion coefficient, and the obtained values ​​are compared with the material properties after the traditional composite processing process (combined with traditional stamping and CNC processes), as shown in Table 1 below.

[0031] Table 1

[0032] Cold forging method Traditional composite processing Vickers hardness (HV) 115～117 85～87 Thermal conductivity (W / m·K) Approx. 430 Approx. 395 <![CDATA[Thermal diffusivity (mm 2 / sec)]]> 115～117 85～87

[0033] From the values ​​measured in Table 1, people with ordinary knowledge in this field should be able to clearly understand that the integrated heat sink made by cold forging has a more significant advantage over traditional composite processing methods because the characteristics of the process will give the material better physical properties in terms of heat dissipation. It should be understood that the degree of improvement of these physical properties is related to the number of forging times and force required during the cold forging process. The more forging times and the greater the force, the higher the above values ​​will be. Therefore, after cold forging, the above values ​​will be better than those of general traditional processing.

[0034] See also Fig. 8A and Figure 8B , which is a metal lower cover plate 901 of another embodiment of the integrated heat sink of the present invention, wherein the heat absorbing outer surface 910 of the metal lower cover plate 901 further includes a plurality of recessed spaces 940, which are recessed from the heat absorbing outer surface 910 toward the evaporation inner surface 920 but do not protrude from the evaporation inner surface 920, for accommodating a plurality of electronic components. Fig. 9 , which is a metal lower cover plate 901 of another embodiment of the integrated heat spreader of the present invention. As shown in the figure, the plurality of recessed spaces 940 have the same or different shapes and volumes. According to the size and shape of each small chip in the chipset on the circuit board, a plurality of recessed spaces 940 that can be used to simultaneously accommodate various electronic components of the same or different shapes and volumes can be customized. For example, an integrated heat spreader that can simultaneously accommodate a 5G server chipset (such as Fig. 8AAs shown). When the external electronic components are accommodated in the plurality of recessed spaces 940 of the heat absorbing outer surface 910, a thermally conductive material with good thermal conductivity can be further added between the electronic components and the heat absorbing outer surface 910 to reduce the thermal resistance caused by slight unevenness of the contact surface, such as thermal conductive paste or graphite sheet, so that the electronic components can fit closely with the heat absorbing outer surface 910 to improve the heat dissipation efficiency. It should be understood that in any embodiment of the integrated heat spreader of the present invention, the metal lower cover plates 900 and 901 are forged as a whole using cold forging. In one embodiment, pure copper with a higher thermal diffusion coefficient and a higher thermal conductivity is forged as a whole using cold forging. Therefore, the manufactured pure copper metal lower cover plate has a higher hardness and rigidity than that made by general traditional processing methods, and is less likely to deform.

[0035] In an embodiment of the integrated vapor chamber of the present invention, the support structure is columnar.

[0036] In an embodiment of the integrated vapor chamber of the present invention, the working fluid is pure water.

[0037] In one embodiment of the integrated vapor chamber of the present invention, the air pressure in the working space is less than 1x10 -3 torr, 1x10 -4 torr, 1x10 -5 torr.

[0038] Of course, the above embodiments are only used for illustration rather than to limit the scope of the present invention. Any equivalent modifications or changes made to the integrated vapor chamber according to the above embodiments should still be included in the protection scope of the present invention.

[0039] It is worth mentioning that most of the existing heat dissipation modules will add a metal protective shell between the heat spreader and the electronic components. The main reason is that in order to pursue thin electronic products, the thickness of the current heat spreader is only about 3mm, and most of them are made of pure copper with good thermal conductivity but softer material. In order to avoid deformation under high temperature for a long time and affect the heat dissipation efficiency, the metal protective shell is usually made of aluminum-magnesium alloy with higher rigidity but lower thermal conductivity than pure copper. In addition, the metal protective shell needs to transfer heat to the heat spreader through thermal paste for heat dissipation. Compared with the integrated heat spreader of the present invention, the metal lower cover is directly made to replace the metal protective shell, eliminating the thermal resistance of aluminum-magnesium alloy and thermal paste. Therefore, the present invention will have better heat dissipation efficiency than traditional heat dissipation modules. In addition, compared to other general traditional processing methods, the cold forging method can not only give the material a finer grain structure, but also reduce internal defects such as pores. The material can thus obtain excellent mechanical properties such as higher strength, deformation resistance and fatigue resistance, and can also improve the thermal conductivity and thermal diffusion efficiency of the material. The integrated heat sink manufactured will also be superior to general heat dissipation modules with similar structures in terms of heat dissipation efficiency, durability and reliability.

[0040] It can be seen that the present invention has indeed achieved the desired improved effect by breaking through the prior art, and it is also not easy for those familiar with the art to think of.

[0041] The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention should be included in the scope of the claims.

Claims

1. An integrated vapor chamber, characterized in that: At least: A metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface, an upper frame of appropriate height is arranged around the condensation inner surface, an upper channel groove is arranged on the upper frame, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other and a plurality of support structures protruding between the grooves; A metal lower cover plate, including a heat absorbing outer surface and an evaporating inner surface, the heat absorbing outer surface having at least one recessed space for accommodating a heat releasing element, a lower frame having a suitable height around the evaporating inner surface, a lower channel groove being provided on the lower frame, and the evaporating inner surface having a plurality of lower grooves arranged in parallel with each other; A working space, which is an airtight space formed by the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate being joined to each other, wherein the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate are opposite to each other, and the arrangement of the upper groove and the lower groove are aligned with each other, and the plurality of supporting structures protrude from the condensation inner surface and abut between the lower grooves of the evaporation inner surface to support the working space; a capillary structure located in the lower groove; A working fluid exists in the working space and the capillary structure.

2. The integrated vapor chamber according to claim 1, wherein: The metal upper cover plate as a whole including the supporting structure is forged by cold forging a metal sheet as a whole, and the metal lower cover plate as a whole is forged by cold forging a metal sheet as a whole.

3. The integrated vapor chamber as claimed in claim 2, wherein: The metal sheet is pure copper, and the upper cover plate and the lower cover plate have a Vickers hardness of about 90HV to 120HV.

4. The integrated vapor chamber as claimed in claim 2, wherein: The metal sheet is pure copper, and the upper cover plate and the lower cover plate have a thermal conductivity of about 400W / (m·K) to 430W / (m·K).

5. The integrated vapor chamber as claimed in claim 2, wherein: The upper cover plate and the lower cover plate have a thermal diffusion coefficient of about 90 mm 2 / sec~120mm 2 / sec.

6. The integrated vapor chamber as claimed in claim 2, wherein: The supporting structure is columnar.

7. The integrated vapor chamber as claimed in claim 2, wherein: The recessed spaces are plural in number and are used to accommodate plural electronic components.

8. The integrated vapor chamber according to claim 7, wherein: Each of the recessed spaces has the same or different shapes and volumes, and is used to simultaneously accommodate a plurality of electronic components of the same or different shapes and volumes.

9. The integrated vapor chamber as claimed in claim 2, wherein: The recessed space is recessed from the heat absorbing outer surface toward the evaporating inner surface but is not protruding from the corresponding evaporating inner surface.

10. The integrated vapor chamber as claimed in claim 2, wherein: The metal upper cover plate and the metal lower cover plate are joined to each other and then combined by welding.

11. The integrated vapor chamber as claimed in claim 2, wherein: The working fluid is pure water.

12. The integrated vapor chamber as claimed in claim 2, wherein: The air pressure in this working space is less than 1x10 -3 torr.

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