A semiconductor mounter conveying device with good stability

Abstract

The present invention discloses a semiconductor mounter conveying device with good stability, including a conveying table, a conveyor belt, and a roller group. A guide plate is fixedly connected to the inner wall of the conveying table. The inner wall of the conveying table is rotationally connected to the outer wall of the roller group, and the outer wall of the roller group is rotationally connected to the inner wall of the conveyor belt. Square holes are formed in the conveyor belt where the inner and outer walls on both sides are connected. Through the movement of the suction pump, the gas inside the box enters the inside of the suction pump through the air pipe, thereby creating a vacuum inside the pump chamber. When the pressure inside the pump chamber is lower than the external atmospheric pressure, a pressure difference will be generated between the air suction port of the suction pump and the external atmospheric pressure. Then, the semiconductor can be sucked through the round hole on the top plate, thereby increasing the stability of the semiconductor on the conveyor belt, avoiding changes in the position of the semiconductor during transportation by the conveyor belt, correspondingly improving the stability of the semiconductor, and enabling the conveyor belt to convey the semiconductor more accurately.

Description

Technical Field

[0001] The present invention belongs to the technical field of conveying equipment, and particularly relates to a semiconductor mounter conveying equipment with good stability. Background Art

[0002] Conveying equipment is a mechanical equipment widely used in various industrial production and logistics transportation fields, mainly used to transfer materials from one place to another. It has a wide variety of types, each with its own characteristics, to meet the needs of different material properties and working environments;

[0003] Semiconductor mounter conveying equipment is an indispensable part of the semiconductor manufacturing process, mainly responsible for accurately and quickly conveying semiconductor components from the supply source to the chip mounting area to achieve automated and high-efficiency production.

[0004] However, the following problems still exist when the traditional device is in use:

[0005] For the existing semiconductor conveyor belt, semiconductors are directly placed on the conveyor belt. However, during the conveying process, the conveyor belt will vibrate during operation, and through the acting force of the vibration, it is easy for the semiconductors to change their positions. When the vibration intensity increases, it is easy for the semiconductors to pile up, thus affecting the conveying efficiency;

[0006] Therefore, we need a semiconductor mounter conveying equipment with good stability to solve the problem of instability of semiconductors during the conveying process and increase the stability of semiconductors during the conveying process. Summary of the Invention

[0007] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide a semiconductor mounter conveying equipment with good stability, which has the advantage of increasing the stability of semiconductors during the conveying process.

[0008] To achieve the above purpose, the present invention provides the following technical solutions: including a conveying table, a conveyor belt, and a roller group. A guiding plate is fixedly connected to the inner wall of the conveying table. The outer wall of the roller group is rotatably connected to the inner wall of the conveying table, and the inner wall of the conveyor belt is rotatably connected to the outer wall of the roller group. The conveyor belt is provided with a square hole with the inner and outer walls on both sides communicating. A pushing plate is fixedly connected to the inner wall of the conveying table, and a suction structure is fixedly connected inside the square hole. The suction structure is used to increase the suction force on the semiconductors, so that the semiconductors can be more firmly on the top of the conveyor belt, facilitating the more stable transportation of the conveyor belt to the position of the mounter.

[0009] Preferably, the air suction structure includes a box body, a top plate, an air suction pump and an air pipe. The inside of the square hole above the conveyor belt is fixedly connected to the outer wall of the box body. The opposite sides of the two box bodies are fixedly connected to the outer walls at both ends of the air pipe. The inner walls at the tops of the multiple air pipes are fixedly connected to the output end of the air suction pump. The outer wall of the top of the box body is fixedly connected to a top plate, and multiple round holes are opened on the top plate.

[0010] Preferably, a cleaning structure is fixedly connected inside the multiple box bodies. The cleaning structure is used to intercept dust on the semiconductor, preventing the dust on the semiconductor from entering the inside of the air suction pump through the box body when the semiconductor is vacuum-fixed, thereby correspondingly improving the working efficiency of the air suction pump.

[0011] Preferably, the cleaning structure includes a collection box, an interception net, a mounting rod, a cleaning brush, a magnetic plate and a magnetic block. The upper part inside the box body is fixedly connected to the outer wall of the interception net. Slide grooves are opened on both sides of the inner wall of the box body near the upper part of the interception net. Sliders are slidably connected inside the slide grooves. The box body is provided with discharge ports communicating the inner and outer walls on both sides. The bottom of the discharge port is an inclined surface. The outer wall of the box body near both sides of the discharge port is fixedly connected to limiting rods. The outer wall at the top of the limiting rods is fixedly connected to anti-collision pads. The outer walls of the limiting rods are movably inserted into the inner wall of one side of the collection box.

[0012] Preferably, the outer walls on the opposite sides of the two sliders are fixedly connected to the outer wall of the mounting rod. The outer wall at the bottom of the mounting rod is fixedly connected to the outer wall at the top of the cleaning brush. The outer walls at the bottom of the mounting rod are respectively fixedly connected to the outer walls at the top of the magnetic blocks at the middle position and on both sides of the cleaning brush. The outer wall at the bottom of the magnetic block is connected to the outer wall at the top of the magnetic plate with opposite poles attracting each other.

[0013] Preferably, a deflation structure is movably connected to the lower part inside the box body. The deflation structure is used to stop the air suction structure from fixing the semiconductor after the semiconductor is transported to the patching position, so that the semiconductor slides off the conveyor belt and can enter the mounter.

[0014] Preferably, the deflation structure includes a connecting plate, a return spring, a blocking block, a fixing plate and a sealing plate. The fixing plate is fixedly connected to the lower part inside the box body, and the fixing plate is provided with air holes communicating the inner and outer walls on both sides.

[0015] Preferably, a connecting plate is slidably connected to the back surface of the box body. The connecting plate is in an irregular U shape. The inner wall of one side of the connecting plate is fixedly connected to the outer wall of one end of a return spring. The outer wall of the other end of the return spring is fixedly connected to the outer wall of the back surface of the box body. The outer wall of the bottom of the connecting plate is fixedly connected to the outer wall of the top of a blocking block. The outer wall of the inside of the connecting plate is fixedly connected to the outer wall of one end of a sealing plate. A rubber pad is fixedly connected to the outer wall of the sealing plate. The outer wall of the sealing plate is slidably connected to the inner wall of the box body. A roller is rotatably connected to the inner wall of the bottom of the blocking block. The bottom of the blocking block is movably lapped with the top of an air hole. The outer wall of the top of the sealing plate is fixedly connected to the outer wall of the bottom of a magnetic plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] Through the movement of the suction pump, the gas inside the box body enters the inside of the suction pump through the trachea, thereby forming a vacuum inside the pump cavity. When the pressure inside the pump cavity is lower than the external atmospheric pressure, a pressure difference will be generated between the air suction port of the suction pump and the external atmospheric pressure. Then, the semiconductor can be sucked through the round hole on the top plate, thereby increasing the stability of the semiconductor on the conveyor belt, avoiding the change in position when the conveyor belt transports the semiconductor, correspondingly improving the stability of the semiconductor, and enabling the conveyor belt to convey the semiconductor more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the present invention;

[0019] Figure 2 is a schematic structural diagram of the internal structure of the conveyor belt of the present invention;

[0020] Figure 3 is a schematic structural diagram of the air suction structure of the present invention;

[0021] Figure 4 is a schematic sectional view of the box body of the present invention;

[0022] Figure 5 is a schematic diagram of the internal structure of the box body of the present invention;

[0023] Figure 6 is a schematic structural diagram of the blocking block of the present invention;

[0024] Figure 7 is a schematic structural diagram of the mounting rod of the present invention;

[0025] Figure 8 is a schematic sectional view of the connecting plate of the present invention;

[0026] Figure 9 is a schematic structural diagram of the collection box of the present invention;

[0027] Figure 10 Schematic diagram of the limit rod structure of the present invention.

[0028] In the figure: 1, conveying table; 2, guide plate; 3, conveyor belt; 4, roller group; 5, box body; 51, top plate; 52, suction pump; 53, air pipe; 6, connecting plate; 61, return spring; 62, blocking block; 63, fixing plate; 64, sealing plate; 65, roller; 7, collection box; 71, chute; 72, intercepting net; 73, mounting rod; 74, slider; 75, cleaning brush; 76, magnetic plate; 77, magnetic block; 78, limit rod; 8, pull rod; 81, gasket; 82, limit plate; 83, elastic block; 84, base; 9, push plate. Specific embodiments

[0029] In order to clearly and completely describe the purpose, technical solution of the present invention, and make the advantages more clearly understood, the following further details the embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present invention.

[0030] Embodiment 1

[0031] Please refer to Figures 1 to 10 , the present invention provides a technical solution: including a conveying table 1, a conveyor belt 3, and a roller group 4. The inner wall of the conveying table 1 is fixedly connected with a guide plate 2. The inner wall of the conveying table 1 is rotationally connected with the outer wall of the roller group 4. The outer wall of the roller group 4 is rotationally connected with the inner wall of the conveyor belt 3. The conveyor belt 3 is provided with square holes with the inner and outer walls on both sides communicating. The inner wall of the conveying table 1 is fixedly connected with a push plate 9. An air suction structure is fixedly connected inside the square hole. The air suction structure is used to increase the suction force on the semiconductor, so that the semiconductor can be more stable on the top of the conveyor belt 3, facilitating the more stable transportation of the conveyor belt 3 to the position of the mounter. The air suction structure includes a box body 5, a top plate 51, a suction pump 52, and an air pipe 53. The inside of the square hole above the conveyor belt 3 is fixedly connected with the outer wall of the box body 5. The opposite sides of the two box bodies 5 are fixedly connected with the outer walls of both ends of the air pipe 53. The inner walls of the tops of the multiple air pipes 53 are fixedly connected with the output end of the suction pump 52. The outer wall of the top of the box body 5 is fixedly connected with a top plate 51. Multiple round holes are provided on the top plate 51.

[0032] Through the movement of the suction pump 52, the gas inside the box body 5 enters the inside of the suction pump 52 through the trachea 53, thereby creating a vacuum inside the pump chamber. When the pressure inside the pump chamber is lower than the external atmospheric pressure, a pressure difference will be generated between the suction port of the suction pump 52 and the external atmospheric pressure, and the semiconductor can be sucked through the round hole on the top plate 51, thereby increasing the stability of the semiconductor on the conveyor belt 3, avoiding the position change of the semiconductor during the transportation by the conveyor belt 3, correspondingly improving the stability of the semiconductor, and enabling the conveyor belt 3 to convey the semiconductor more accurately.

[0033] Embodiment Two

[0034] In order to intercept the particles or impurities on the semiconductor, a cleaning structure is fixedly connected inside multiple box bodies 5. The cleaning structure is used to intercept the dust on the semiconductor, avoiding the dust on the semiconductor from entering the inside of the suction pump 52 through the box body 5 during the vacuum fixation of the semiconductor, correspondingly improving the working efficiency of the suction pump 52. The cleaning structure includes a collection box 7, an intercepting net 72, a mounting rod 73, a cleaning brush 75, a magnetic plate 76, and a magnetic block 77. The upper part inside the box body 5 is fixedly connected to the outer wall of the intercepting net 72. Slide grooves 71 are opened on both sides of the inner wall of the box body 5 near the upper part of the intercepting net 72. A slider 74 is slidably connected inside the slide groove 71. The box body 5 is provided with a discharge port where the inner and outer walls on both sides are connected. The bottom of the discharge port is inclined. The two sides of the outer wall of the box body 5 near the discharge port are fixedly connected with limit rods 78. A collision-proof pad is fixedly connected to the outer wall of the top of the limit rod 78. The outer wall of the limit rod 78 is movably inserted into the inner wall of one side of the collection box 7. The outer walls of the opposite sides of the two sliders 74 are fixedly connected to the outer wall of the mounting rod 73. The outer wall of the bottom of the mounting rod 73 is fixedly connected to the outer wall of the top of the cleaning brush 75. The outer walls of the bottom of the mounting rod 73 are respectively fixedly connected to the outer wall of the top of the magnetic block 77 at the middle position of the cleaning brush 75 and at both sides of the cleaning brush 75. The outer wall of the bottom of the magnetic block 77 is connected to the outer wall of the top of the magnetic plate 76 with opposite poles attracting each other.

[0035] When the suction pump 52 fixes the semiconductor, the particles or impurities on the semiconductor can be removed. At this time, through the setting of the intercepting net 72 provided on the box body 5, the impurities or particles on the semiconductor can be intercepted, avoiding these impurities or particles from entering the inside of the suction pump 52 along with the gas, correspondingly improving the working efficiency of the suction pump 52, and thus reducing the pollution of these impurities to the semiconductor and facilitating the semiconductor to enter the subsequent processing.

[0036] Embodiment Three

[0037] In order to release the fixation of the semiconductor, a deflation structure is movably connected at the bottom of the box body 5. The deflation structure is used to stop the fixation of the semiconductor by the suction structure after the semiconductor is transported to the position of the patch, so that the semiconductor slides off the conveyor belt 3 and can enter the patch machine. The deflation structure includes a connecting plate 6, a reset spring 61, a blocking block 62, a fixing plate 63 and a blocking plate 64. The fixing plate 63 is fixedly connected at the bottom of the box body 5. The fixing plate 63 is provided with air holes connected to the inner and outer walls on both sides. The back of the box body 5 is slidably connected to the connecting plate 6. The shape of the connecting plate 6 is an irregular U-shape. The inner wall on one side of 6 is fixedly connected to the outer wall at one end of the return spring 61, the outer wall at the other end of the return spring 61 is fixedly connected to the outer wall on the back side of the box body 5, the outer wall at the bottom of the connecting plate 6 is fixedly connected to the outer wall at the top of the blocking block 62, the outer wall inside the connecting plate 6 is fixedly connected to the outer wall at one end of the blocking plate 64, the outer wall of the blocking plate 64 is fixedly connected with a rubber pad, the outer wall of the blocking plate 64 is slidingly connected to the inner wall of the box body 5, the inner wall at the bottom of the blocking block 62 is rotatably connected with a roller 65, the bottom of the blocking block 62 is movably overlapped with the top of the pore, and the outer wall at the top of the blocking plate 64 is fixedly connected to the outer wall at the bottom of the magnetic plate 76.

[0038] The sealing plate 64 completely enters the inner wall of the box body 5, so that a strip hole appears at the position of the sealing plate 64, which facilitates the air to enter the interior of the box body 5. At this time, the circular hole on the top plate 51 can be released from fixing the semiconductor, so that the semiconductor can enter the interior of the placement machine through the guide plate 2, which is correspondingly convenient for releasing the fixation of the semiconductor, thereby improving the efficiency of stable transportation of the semiconductor.

[0039] Embodiment 4

[0040] In order to facilitate the replacement of the sealing gasket 81, the outer wall of the connecting plate 6 is movably connected to the sealing gasket 81, a cavity is opened on one side of the connecting plate 6, and an elastic block 83 is fixedly connected inside the cavity. The outer walls on one side of the multiple elastic blocks 83 are fixedly connected to a limiting plate 82, and the shape of the limiting plate 82 is an I-shape. The inner wall of the cavity is fixedly connected to a base 84, and the inside of the base 84 is slidably connected to a pull rod 8. The outer wall of the pull rod 8 is fixedly connected to the inner wall of the limiting plate 82.

[0041] When the sealing gasket 81 is worn and affects the sealing effect, the user can pull the pull rod 8, and then the movement of the pull rod 8 can make the limit plate 82 drive the elastic block 83 to move, so that a gap appears between the limit plate 82 and the connecting plate 6. At this time, the sealing gasket 81 on the outer wall of the connecting plate 6 can be removed and replaced. When the replacement is completed, the pull rod 8 can be loosened. At this time, under the action of the elastic block 83, it can be restored to its original position, avoiding the appearance of a gap between the limit plate 82 and the connecting plate 6, and correspondingly increasing the fit between the limit plate 82 and the connecting plate 6, thereby more effectively fixing the sealing gasket 81.

[0042] Working principle and usage process of the present invention: During operation, first, start the motor and the suction pump 52. Then, through the movement of the motor, the roller set 4 can be driven to move. By utilizing the movement of the roller set 4, the conveyor belt 3 can be made to move accordingly, thereby enabling the transportation device to work. At this time, after the semiconductor enters the conveyor belt 3, through the movement of the suction pump 52, the gas inside the box body 5 can enter the inside of the suction pump 52 through the air pipe 53, thereby creating a vacuum inside the pump chamber. When the pressure inside the pump chamber is lower than the external atmospheric pressure, a pressure difference will be generated between the air extraction port of the suction pump 52 and the external atmospheric pressure, and the semiconductor can be sucked through the round hole on the top plate 51, thereby increasing the stability of the semiconductor on the conveyor belt 3, avoiding changes in the position of the semiconductor during transportation by the conveyor belt 3, correspondingly improving the stability of the semiconductor, and enabling the conveyor belt 3 to convey the semiconductor more precisely.

[0043] It should be noted that: The suction pump 52 is a conventional structure.

[0044] While the suction pump 52 fixes the semiconductor, particles or impurities on the semiconductor can be removed. At this time, through the setting of the intercepting net 72 provided on the box body 5, impurities or particles on the semiconductor can be intercepted, preventing these impurities or particles from entering the inside of the suction pump 52 along with the gas. Correspondingly, the working efficiency of the suction pump 52 is improved, thereby reducing the contamination of these impurities to the semiconductor and facilitating the semiconductor to enter subsequent processing.

[0045] When the semiconductor on the conveyor belt 3 is transported to the position of the mounter, the connecting plate 6 can be pushed under the setting of the pushing plate 9, so that the connecting plate 6 slides inside the box body 5. Then, through the movement of the connecting plate 6, the blocking block 62 and the sealing plate 64 can be driven to move. When the blocking block 62 moves to the position of the air hole, it can be blocked through the action of the blocking block 62, thereby preventing the suction pump 52 from continuing to extract the air inside the box body 5. At this time, the sealing plate 64 completely enters the inner wall of the box body 5, so that a strip-shaped hole appears in the position of the sealing plate 64, facilitating the air to enter the inside of the box body 5. At this time, the fixation of the semiconductor by the round hole on the top plate 51 can be released, enabling the semiconductor to enter the inside of the mounter through the guiding plate 2. Correspondingly, it is convenient to release the fixation of the semiconductor, thereby improving the efficiency of stable transportation of the semiconductor.

[0046] It should be noted that: By means of the rollers 65 provided at the bottom of the blocking block 62, the friction between the blocking block 62 and the fixing plate 63 can be reduced when the blocking block 62 moves, thereby increasing the movement speed of the blocking block 62.

[0047] When the plugging plate 64 moves within the box body 5, it can drive the magnetic plate 76 to move. Then, by utilizing the attracting force between the opposite poles of the magnetic plate 76 and the magnetic block 77, under the action of the movement of the magnetic plate 76, the magnetic block 77 can be driven to move accordingly. Subsequently, through the movement of the magnetic block 77, the mounting rod 73 can drive the slider 74 to slide inside the chute 71, thereby causing the cleaning brush 75 to move accordingly. Then, by utilizing the movement of the cleaning brush 75, the particles or impurities on the intercepting net 72 can be removed and enter the interior of the collection box 7 through the discharge port, enabling the intercepting net 72 to always maintain a good working state, preventing the intercepting net 72 from being blocked by particles or impurities, and correspondingly increasing the air permeability of the intercepting net 72.

[0048] When the interior of the collection box 7 is filled with impurities and needs to be cleaned, the handle on one side of the collection box 7 can be pulled upward. Then, through the movement of the handle, the collection box 7 can be driven to slide on the limiting rod 78, so that the collection box 7 leaves the limiting rod 78, and the sundries inside the collection box 7 can be cleaned.

[0049] It should be noted that: the attracting force between the opposite poles of the magnetic plate 76 and the magnetic block 77 is greater than the gravity of the mounting rod 73 and the cleaning brush 75 and the friction force between the slider 74 and the chute 71.

[0050] When the sealing gasket 81 wears out and affects the sealing effect after long-term use, the user can pull the pull rod 8. Then, through the movement of the pull rod 8, the limiting plate 82 can be driven to drive the elastic block 83 to move, so that a gap appears between the limiting plate 82 and the connecting plate 6. At this time, the sealing gasket 81 on the outer wall of the connecting plate 6 can be removed and replaced. After the replacement is completed, the pull rod 8 can be released. At this time, under the action of the elastic block 83, it can be restored to its original position, preventing a gap from appearing between the limiting plate 82 and the connecting plate 6, and correspondingly increasing the adhesion between the limiting plate 82 and the connecting plate 6, thereby more effectively fixing the sealing gasket 81.

[0051] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip mounter conveying device with good stability, comprising a conveying platform (1), a conveyor belt (3), and a roller group (4), characterized in that: The inner wall of the conveying platform (1) is fixedly connected to a guide plate (2), the inner wall of the conveying platform (1) is rotatably connected to the outer wall of the roller group (4), the outer wall of the roller group (4) is rotatably connected to the inner wall of the conveying belt (3), the conveying belt (3) is provided with a square hole with inner and outer walls connected on both sides, the inner wall of the conveying platform (1) is fixedly connected to a push plate (9), and the interior of the square hole is fixedly connected to an air suction structure; The suction structure is used to increase the suction force on the semiconductor, so that the semiconductor is more firmly on the top of the conveyor belt (3), so as to facilitate the conveyor belt (3) to be transported to the position of the placement machine more firmly; The air suction structure comprises a box body (5), a top plate (51), an air suction pump (52) and an air pipe (53); the interior of the square hole on the conveyor belt (3) is fixedly connected to the outer wall of the box body (5); the two opposite sides of the box bodies (5) are fixedly connected to the outer walls of both ends of the air pipe (53); the inner walls of the tops of the plurality of air pipes (53) are fixedly connected to the output ends of the air suction pump (52); the outer wall of the top of the box body (5) is fixedly connected to the top plate (51); and the top plate (51) is provided with a plurality of circular holes; The lower part of the box body (5) is movably connected with a deflation structure, and the deflation structure is used to stop the suction structure from fixing the semiconductor after the semiconductor is transported to the placement position, so that the semiconductor slides off the conveyor belt (3) and enters the placement machine; The degassing structure comprises a connecting plate (6), a return spring (61), a blocking block (62), a fixing plate (63) and a blocking plate (64); the fixing plate (63) is fixedly connected to the lower part of the box body (5); the fixing plate (63) is provided with air holes communicating with the inner and outer walls on both sides; The back side of the box body (5) is slidably connected to a connecting plate (6), the connecting plate (6) being in an irregular U-shape, the inner wall of one side of the connecting plate (6) being fixedly connected to the outer wall of one end of a return spring (61), the outer wall of the other end of the return spring (61) being fixedly connected to the outer wall of the back side of the box body (5), the outer wall of the bottom side of the connecting plate (6) being fixedly connected to the outer wall of the top side of a blocking block (62), the outer wall on the inside of the connecting plate (6) being fixedly connected to the outer wall of one end of a blocking plate (64), the outer wall of the blocking plate (64) being fixedly connected to a rubber pad, the outer wall of the blocking plate (64) being slidably connected to the inner wall of the box body (5), the inner wall of the bottom side of the blocking block (62) being rotatably connected to a roller (65), the bottom side of the blocking block (62) being movably overlapped with the top side of the pore, and the outer wall of the top side of the blocking plate (64) being fixedly connected to the outer wall of the bottom side of the magnetic plate (76); The outer wall of the connecting plate (6) is movably connected to a sealing gasket (81); a cavity is provided on one side of the connecting plate (6); an elastic block (83) is fixedly connected to the interior of the cavity; the outer walls of one side of the plurality of elastic blocks (83) are fixedly connected to a limit plate (82); the limit plate (82) is in an I-shape; the inner wall of the cavity is fixedly connected to a base (84); the interior of the base (84) is slidably connected to a pull rod (8); the outer wall of the pull rod (8) penetrates and is fixedly connected to the inner wall of the limit plate (82); Through the movement of the suction pump (52), the gas inside the box (5) enters the suction pump (52) through the air pipe (53), so that a vacuum is formed inside the pump chamber. When the pressure inside the pump chamber is lower than the external atmospheric pressure, a pressure difference is generated at the suction port of the suction pump (52) and the external atmospheric pressure, and the semiconductor is sucked through the circular hole on the top plate (51), thereby increasing the stability of the semiconductor on the conveyor belt (3), avoiding the position change of the conveyor belt (3) when transporting the semiconductor, and correspondingly improving the stability of the semiconductor, so that the conveyor belt (3) can transport the semiconductor more accurately; The sealing plate (64) completely enters the inner wall of the box body (5), so that a strip-shaped hole appears at the position of the sealing plate (64), which facilitates the entry of air into the interior of the box body (5). At this time, the fixation of the semiconductor by the circular hole on the top plate (51) is released, so that the semiconductor enters the interior of the chip mounter through the guide plate (2), which facilitates the release of the fixation of the semiconductor, thereby improving the efficiency of stable transportation of the semiconductor; When the sealing gasket (81) is worn and the sealing effect is affected, the pull rod (8) is pulled, and then the limit plate (82) drives the elastic block (83) to move through the movement of the pull rod (8), so that a gap appears between the limit plate (82) and the connecting plate (6). At this time, the sealing gasket (81) on the outer wall of the connecting plate (6) is removed and replaced. After the replacement is completed, the pull rod (8) is loosened. At this time, under the action of the elastic block (83), it is restored to its original position, avoiding the gap between the limit plate (82) and the connecting plate (6), and correspondingly increasing the fit between the limit plate (82) and the connecting plate (6), thereby more effectively fixing the sealing gasket (81).

2. According to claim 1, a semiconductor placement machine conveying device with good stability is characterized in that: A cleaning structure is fixedly connected to the interior of the plurality of boxes (5), and the cleaning structure is used to intercept dust on the semiconductor, thereby preventing the dust on the semiconductor from entering the interior of the suction pump (52) through the boxes (5) when the semiconductor is vacuum fixed, thereby correspondingly improving the working efficiency of the suction pump (52).

3. A semiconductor placement machine conveying device with good stability according to claim 2, characterized in that: The cleaning structure comprises a collection box (7), an intercepting net (72), a mounting rod (73), a cleaning brush (75), a magnetic plate (76) and a magnetic block (77); the upper part of the interior of the box body (5) is fixedly connected to the outer wall of the intercepting net (72); both sides of the inner wall of the box body (5) near the upper part of the intercepting net (72) are provided with slide grooves (71); the interior of the slide grooves (71) is slidably connected with sliders (74); the box body (5) is provided with a discharge port with inner and outer walls connected on both sides; the bottom of the discharge port is an inclined surface; both sides of the outer wall of the box body (5) near the discharge port are fixedly connected with limit rods (78); the outer wall of the top of the limit rod (78) is fixedly connected with an anti-collision pad; the outer wall of the limit rod (78) is movably plugged with the inner wall of one side of the collection box (7).

4. A semiconductor chip mounter conveying device with good stability according to claim 3, characterized in that: The outer walls of the two sliding blocks (74) on opposite sides are fixedly connected to the outer wall of the mounting rod (73); the outer wall of the bottom of the mounting rod (73) is fixedly connected to the outer wall of the top of the cleaning brush (75); the outer wall of the bottom of the mounting rod (73) is respectively fixedly connected to the outer wall of the top of the magnetic block (77) at a position in the middle of the cleaning brush (75) and at positions on both sides of the cleaning brush (75); the outer wall of the bottom of the magnetic block (77) is connected to the outer wall of the top of the magnetic plate (76) in a manner of attracting each other at different levels.

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