Chip bonding device

Abstract

The present invention discloses a chip bonding device, belonging to the technical field of bonding devices. The chip bonding device comprises a base and a manipulator, the output end of the manipulator is equipped with a grabbing plate, the surface of the base is provided with a shock absorbing device, the shock absorbing device comprises a placement plate, both sides of the bottom of the placement plate are fixedly connected with directional telescopic rods, the bottom of the directional telescopic rod is fixedly connected to the top surface of the base, the bottom surface of the placement plate is fixedly connected with a U-shaped support rod, and the top center of the U-shaped support rod is fixedly connected with a sealing rod. The base, manipulator and grabbing plate are composed, the surface of the base is provided with a shock absorbing device, and the placement plate, directional telescopic rod, U-shaped support rod, soft capsule, sealing tube, sealing rod, soft adhesive tape, L-shaped plate, airbag, positioning block, support rod and pressing plate are used to achieve the effect of reducing the impact force during the bonding process when the chip and the carrier are bonded.

Description

Technical Field

[0001] The present invention relates to the technical field of bonding devices, and in particular to a chip bonding device. Background Art

[0002] The chip bonding process is a form of interconnection between the chip and the carrier. As electronic products are developing towards lightness, thinness and miniaturization, the application of chip bonding technology is increasing. Combining the chip bonding process with the wafer packaging process can produce a package with smaller size and higher performance.

[0003] Chinese patent CN 108122787 B, authorized and announced on November 30, 2016, discloses a chip bonding device and a chip bonding method, which include several groups of chip batch transmission components, substrate bearing components, and bonding force output components. In the above application documents, when the chip is pressed down on the carrier, a certain inertial impact force will be generated, which will cause certain damage to the chip and the carrier itself. At the same time, when merging, the carrier is guaranteed to be stably placed on the work plate. Summary of the invention

[0004] In order to solve the problem of pressure when chips and carriers are combined in the prior art, the present invention provides a chip bonding device which can reduce the pressure when the chips and carriers are combined through a shock absorbing device on a working plate.

[0005] A chip bonding device comprises a base and a manipulator, wherein the output end of the manipulator is equipped with a gripping plate;

[0006] A shock absorbing device is provided on the surface of the base, and the shock absorbing device includes a placing plate, both sides of the bottom of the placing plate are fixedly connected with directional telescopic rods, the bottom of the directional telescopic rods is fixedly connected to the top surface of the base, the bottom surface of the placing plate is fixedly connected with a U-shaped support rod, the top center of the U-shaped support rod is fixedly connected with a sealing rod, the surface of the sealing rod is slidably connected with a sealing tube, the surface of the sealing tube passes through and is fixedly connected to the top surface of the base, L-shaped plates are installed on the bottom surfaces of both sides of the placing plate, the surface of the L-shaped plate is hinged with a positioning block, the bottom surface of the positioning block is fixedly connected to the top surface of the base, the top of the L-shaped plate is fixedly connected with a support rod, the side of the support rod away from the L-shaped plate is hinged with a pressure plate, and the top surface of the placing plate is installed with a working plate.

[0007] Furthermore, a warning device is provided inside the placement plate, and the warning device includes a slide groove, a sensor is fixedly connected to the bottom of the slide groove, a round rod is fixedly connected to the top of the inner wall of the sensor, the bottom of the round rod is fixedly connected to the top surface of the sensor, a spring is sleeved on the surface of the round rod, the bottom surface of the spring is fixedly connected to the top surface of the sensor, the top of the spring is fixedly connected to a slide plate, and the surface of the slide plate is fixedly connected to the side of the working plate.

[0008] Furthermore, an auxiliary shock absorbing device is provided on the surface of the grabbing plate, and the auxiliary shock absorbing device includes a barrel, a suction rod is slidably connected to the inside of the barrel, a pressure spring is fixedly connected to the top surface of the suction rod, the top of the pressure spring is fixedly connected to the inner top of the barrel, a soft capsule 2 is fixedly connected to the top of the soft capsule 2, a gas conversion bin is fixedly connected to the top of the soft capsule 2, and the surface of the gas conversion bin is fixedly connected to the top surface of the grabbing plate.

[0009] Furthermore, a soft capsule 1 is fixedly connected to the central bottom of the placement plate, and the bottom of the soft capsule 1 is fixedly connected to the top surface of the sealing tube. The placement plate, the soft capsule 1 and the sealing tube are interconnected. By fixing the soft capsule 1 and the sealing tube at the central bottom, the effects of shock absorption, pressure transmission, sealing protection and flexible adjustment can be achieved, thereby improving the performance, stability and reliability of the equipment.

[0010] Furthermore, a soft rubber tape is fixedly connected to the bottom of the placement plate, and the bottom of the soft rubber tape is fixedly connected to the top of the base. By improving the stability, safety and service life of the equipment, it can play a shock-absorbing and buffering role when the placement plate is subjected to external impact or vibration. It can absorb and disperse the impact force transmitted from the surface of the base, reduce the impact of the impact on the placement plate, and thus protect the equipment or items from damage.

[0011] Furthermore, an airbag is fixedly connected to the bottom of the L-shaped plate, and the bottom of the airbag is fixedly connected to the top surface of the base. By installing the airbag at the bottom of the L-shaped plate, the effects of shock absorption, balance adjustment, vibration absorption and protection of the base surface can be achieved, thereby improving the stability, reliability and service life of the equipment.

[0012] Furthermore, an alarm is installed on the surface of the placement plate, and the alarm and the sensor are electrically connected to each other. The surface of the slide slot is equipped with an accordion cloth. Through the installation of the alarm, an alarm signal can be issued when necessary to remind the operator or system user of specific situations or events, such as reminding personnel not to approach, changes in the pressure of the carrier and the chip, etc. It is crucial to discover and solve potential problems in time, which helps to maintain the normal operation and safety of the equipment.

[0013] Furthermore, the auxiliary shock absorbing devices are assembled in twelve groups as a whole and are evenly arranged on the surface of the grabbing plate. By evenly distributing multiple shock absorbing devices on the surface of the grabbing plate, a more balanced support and shock absorbing effect can be provided during the entire grabbing process, thereby enhancing the stability of the grabbing equipment and making it perform more stably, accurately and efficiently in various working scenarios.

[0014] The difference from the prior art is that the beneficial effects of this application are:

[0015] (1) The chip bonding device is composed of a base, a manipulator and a gripping plate. The base surface is provided with a shock absorbing device. The base surface is provided with a placement plate, a directional telescopic rod, a U-shaped support rod, a soft capsule, a sealing tube, a sealing rod, a soft adhesive tape, an L-shaped plate, an airbag, a positioning block, a support rod and a pressure plate to achieve the effect of reducing the impact force during the bonding process when the chip and the carrier are bonded.

[0016] (2) The chip bonding device is fixedly connected to a sensor through the bottom of the slide groove, a round rod is connected to the top of the inner wall of the sensor, the bottom of the round rod is connected to the top of the sensor, and an alarm is installed on the surface of the placement plate and electrically connected to the sensor, so as to achieve the effect of reminding personnel that the equipment is in the startup process when the equipment is running, so as to ensure the safety or effectiveness of the operation.

[0017] (3) The chip bonding device, when the gripping plate drives the suction rod to suck the chip, presses and fits it with the carrier plate on the working plate, and the robot drives the suction rod to fit it with the placement plate. After the suction rod contacts, the suction rod is retracted toward the inside of the barrel, thereby reducing vibration and impact during the grasping process and improving the stability and accuracy of grasping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0019] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0020] Figure 2 It is a partial enlarged structural schematic diagram of the overall appearance of the present invention;

[0021] Figure 3 It is a schematic structural diagram of the shock absorbing device of the present invention in a cross-section from a first viewing angle;

[0022] Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle;

[0023] Figure 5 It is a schematic structural diagram of the shock absorbing device of the present invention in a cross-section from a second viewing angle;

[0024] Figure 6 It is a partial enlarged structural schematic diagram of the warning device of the present invention;

[0025] Figure 7 For the present invention Figure 6 The enlarged structural diagram at C in the middle;

[0026] Figure 8 It is a partial enlarged structural schematic diagram of the auxiliary shock absorbing device of the present invention;

[0027] Fig. 9 For the present invention Figure 8 Enlarged structural diagram at B in the middle.

[0028] In the figure:

[0029] 100, base; 200, manipulator; 500, grab plate;

[0030] 600, shock absorbing device; 601, placement plate; 602, airbag; 603, directional telescopic rod; 604, U-shaped support rod; 605, sealing tube; 606, positioning block; 607, L-shaped plate; 608, support rod; 609, pressing plate; 610, sealing rod; 611, soft capsule 1; 612, working plate; 613, soft adhesive tape;

[0031] 700, warning device; 701, slide; 702, slide plate; 703, accordion cloth; 704, round rod; 705, spring; 706, sensor; 707, warning device;

[0032] 800, auxiliary shock absorbing device; 801, round barrel; 802, suction rod; 803, soft capsule 2; 804, air transfer chamber; 805, pressure spring. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0034] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application are described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, the process, method, system, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0035] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0037] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] Embodiment 1

[0040] See also Figure 1-Figure 9 , as shown in the figure, a chip bonding device includes a base 100 and a robot 200, and the output end of the robot 200 is equipped with a gripper 500;

[0041] The surface of the base 100 is provided with a shock absorbing device 600, which includes a placement plate 601, both sides of the bottom of the placement plate 601 are fixedly connected with directional telescopic rods 603, the bottom of the directional telescopic rods 603 is fixedly connected to the top surface of the base 100, the bottom surface of the placement plate 601 is fixedly connected with a U-shaped support rod 604, the center bottom of the placement plate 601 is fixedly connected with a soft capsule 611, the bottom of the soft capsule 611 is fixedly connected to the top surface of the sealing tube 605, the placement plate 601 and the soft capsule 611, the sealing tube 605 are fixedly connected to each other, and the placement plate 601 and the soft capsule 611 are fixedly connected to each other. 05 are interconnected, and the installation of the soft capsule 611 and the sealing tube 605 is fixedly connected through the center bottom, which can achieve the effects of shock absorption, pressure transmission, sealing protection and flexible adjustment, thereby improving the performance, stability and reliability of the equipment. The top center of the U-shaped support rod 604 is fixedly connected with a sealing rod 610, and the surface of the sealing rod 610 is slidably connected with the sealing tube 605. The surface of the sealing tube 605 penetrates and is fixedly connected to the top surface of the base 100. The bottom of the placement plate 601 is fixedly connected with a soft rubber cloth 613, and the bottom of the soft rubber cloth 613 is fixedly connected to the bottom of the soft rubber cloth 613. The bottom of the placing plate 601 is fixedly connected to the top of the base 100, and by improving the stability, safety and service life of the equipment, it can play a shock-absorbing and buffering role when the placing plate 601 is subjected to external impact or vibration. It can absorb and disperse the impact force transmitted from the surface of the base 100, reduce the impact of the impact on the placing plate 601, and thus protect the equipment or items from damage. The bottom surfaces of both sides of the placing plate 601 are equipped with L-shaped plates 607, and the bottom of the L-shaped plate 607 is fixedly connected to the airbag 602, and the bottom of the airbag 602 is fixedly connected to the top surface of the base 100. By installing the airbag 602 at the bottom of the L-shaped plate 607, the effects of shock absorption, balance adjustment, vibration absorption and protection of the surface of the base 100 can be achieved, thereby improving the stability, reliability and service life of the equipment. The surface of the L-shaped plate 607 is hinged with a positioning block 606, and the bottom surface of the positioning block 606 is fixedly connected to the top surface of the base 100. The top of the L-shaped plate 607 is fixedly connected with a support rod 608, and the side of the support rod 608 away from the L-shaped plate 607 is hinged with a pressure plate 609, and the top surface of the placement plate 601 is equipped with a working plate 612.

[0042] When in use, the operator first places the carrier plate on the working plate 612 on the placing plate 601, and the controller on the top of the base 100 drives the manipulator 200 to move, and uses the manipulator 200 to drive the grabbing plate 500 to pick up the chip, and then moves to the top of the placing plate 601, and the manipulator 200 carries the chip and presses it toward the carrier plate on the working plate 612, while driving the placing plate 601 to move downward, pressing the bottom directional telescopic rod 603 to retract, and driving the U-shaped support rod 604 to move downward at the same time. It is explained here that the center of the U-shaped support rod 604 drives the connected sealing rod 610 to move along the inner side of the sealing tube 605. It is explained here that since the sealing rod 610 moves in the sealing tube 605, it is similar to the suction generated by the needle rod sliding in the needle tube, so the sealing tube 605 sucks out the air inside the top placement plate 601, so that the carrier can be stably placed on the placement plate 601. At the same time, the placement plate 601 is connected with a soft capsule 611. When the placement plate 601 is pressed downward, its two ends drive the L-shaped plate 607 to rotate. At the same time, the bottom of the L-shaped plate 607 squeezes the airbag 602, and the top drives the support rod 608 and the pressure plate 609 to press on the top of the carrier, which helps the carrier to maintain a stable state during work.

[0043] Also, to remind people when they are working, please refer to Figure 1-Figure 9 As shown in the figure, a warning device 700 is arranged inside the placement plate 601, and the warning device 700 includes a slide groove 701, a sensor 706 is fixedly connected to the bottom of the slide groove 701, a round rod 704 is fixedly connected to the top of the inner wall of the sensor 706, and the bottom of the round rod 704 is fixedly connected to the top surface of the sensor 706. An alarm 707 is installed on the surface of the placement plate 601, and the alarm 707 and the sensor 706 are electrically connected to each other. The surface of the slide groove 701 is equipped with an accordion cloth 703, through the alarm 707 The installation can send out warning signals when necessary to alert operators or system users of specific situations or events, such as reminding personnel not to approach, changes in the pressure of the carrier and chip, etc. It is crucial to discover and solve potential problems in time, which helps to maintain the normal operation and safety of the equipment. The surface of the round rod 704 is sleeved with a spring 705, and the bottom surface of the spring 705 is fixedly connected to the top surface of the sensor 706. The top of the spring 705 is fixedly connected to a slide plate 702, and the surface of the slide plate 702 is fixedly connected to the side of the working plate 612.

[0044] When in use, the working plate 612 moves downward to drive the side slide plate 702, the inner sliding of the slide plate 702 is connected to the round rod 704, the slide plate 702 moves to press the spring 705 at the bottom, when the spring 705 contracts, its bottom gives pressure to the sensor 706, when the sensor 706 receives the pressure, the sensor 706 transmits a signal to the alarm 707, so that it works to ensure the safety or effectiveness of the operation, to remind personnel not to approach the equipment while it is working, to prevent harm to the personnel's own safety.

[0045] At the same time, in order to reduce the impact force when the equipment is working, please refer to Figure 1-Figure 9 As shown in the figure, an auxiliary shock absorbing device 800 is provided on the surface of the grabbing plate 500, and the auxiliary shock absorbing device 800 includes a barrel 801, and a suction rod 802 is slidably connected inside the barrel 801. The auxiliary shock absorbing device 800 is assembled in twelve groups as a whole and is evenly arranged on the surface of the grabbing plate 500. By evenly distributing multiple shock absorbing devices on the surface of the grabbing plate 500, a more balanced support and shock absorbing effect can be provided in the entire grasping process, thereby enhancing the stability of the grasping equipment, making it more stable, accurate and efficient in various working scenarios. A pressure spring 805 is fixedly connected to the top surface of the suction rod 802, and the top of the pressure spring 805 is fixedly connected to the inner top of the barrel 801. A soft capsule 2 803 is fixedly connected to the top of the suction rod 802, and a gas transfer bin 804 is fixedly connected to the top of the soft capsule 2 803. The surface of the gas transfer bin 804 is fixedly connected to the top surface of the grabbing plate 500.

[0046] During use, after the grabbing plate 500 drives the suction rod 802 to suck the chip, it is pressed and fitted with the carrier plate on the working plate 612. When the manipulator 200 drives the suction rod 802 to fit with the placement plate 601, after the suction rod 802 comes into contact, the suction rod 802 is recovered to the inside of the barrel 801. Since the pressure spring 805 is used to reset the inside of the barrel 801 and the suction rod 802, the top of the suction rod 802 is also connected to the soft capsule 2 803, and the top of the soft capsule 2 803 is connected to the air transfer bin 804, which reduces vibration and impact during the grasping process to improve the stability and accuracy of the grasping.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip bonding device, comprising a base (100) and a robot (200), wherein an output end of the robot (200) is equipped with a gripping plate (500); Features: The surface of the base (100) is provided with a shock absorbing device (600), and the shock absorbing device (600) comprises a placement plate (601), and both sides of the bottom of the placement plate (601) are fixedly connected to directional telescopic rods (603), and the bottom of the directional telescopic rod (603) is fixedly connected to the top surface of the base (100), and the bottom surface of the placement plate (601) is fixedly connected to a U-shaped support rod (604), and the top center of the U-shaped support rod (604) is fixedly connected to a sealing rod (610), and the surface of the sealing rod (610) is slidably connected to a sealing tube (605), and the sealing tube (605) is fixedly connected to the bottom surface of the placement plate (601). The surface of the tube (605) passes through and is fixedly connected to the top surface of the base (100); the bottom surfaces of both sides of the placement plate (601) are equipped with L-shaped plates (607); the surface of the L-shaped plate (607) is hinged with a positioning block (606); the bottom surface of the positioning block (606) is fixedly connected to the top surface of the base (100); the top of the L-shaped plate (607) is fixedly connected with a support rod (608); the side of the support rod (608) away from the L-shaped plate (607) is hinged with a pressure plate (609); and the top surface of the placement plate (601) is equipped with a working plate (612); The bottom of the L-shaped plate (607) is fixedly connected to an airbag (602), and the bottom of the airbag (602) is fixedly connected to the top surface of the base (100); The central bottom of the placement plate (601) is fixedly connected to a soft capsule one (611), the bottom of the soft capsule one (611) is fixedly connected to the top surface of the sealing tube (605), and the placement plate (601), the soft capsule one (611) and the sealing tube (605) are interconnected.

2. A chip bonding device according to claim 1, characterized in that: The bottom of the placement plate (601) is fixedly connected to a soft rubber cloth (613), and the bottom of the soft rubber cloth (613) is fixedly connected to the top of the base (100).

3. A chip bonding device according to claim 1, characterized in that: A warning device (700) is arranged inside the placement plate (601), and the warning device (700) comprises a slide groove (701), a sensor (706) is fixedly connected to the bottom of the slide groove (701), a round rod (704) is fixedly connected to the top of the inner wall of the sensor (706), the bottom of the round rod (704) is fixedly connected to the top surface of the sensor (706), a spring (705) is sleeved on the surface of the round rod (704), the bottom surface of the spring (705) is fixedly connected to the top surface of the sensor (706), the top of the spring (705) is fixedly connected to a slide plate (702), and the surface of the slide plate (702) is fixedly connected to the side of the working plate (612).

4. A chip bonding device according to claim 3, characterized in that: The surface of the placement plate (601) is equipped with an alarm (707), the alarm (707) and the sensor (706) are electrically connected to each other, and the surface of the slide groove (701) is equipped with an accordion cloth (703).

5. A chip bonding device according to claim 1, characterized in that: The surface of the grabbing plate (500) is provided with an auxiliary shock absorbing device (800), and the auxiliary shock absorbing device (800) comprises a round barrel (801), the interior of the round barrel (801) is slidably connected to a suction rod (802), the top surface of the suction rod (802) is fixedly connected to a pressure spring (805), the top of the pressure spring (805) is fixedly connected to the inner top of the round barrel (801), the top of the suction rod (802) is fixedly connected to a soft capsule 2 (803), the top of the soft capsule 2 (803) is fixedly connected to an air transfer bin (804), and the surface of the air transfer bin (804) is fixedly connected to the top surface of the grabbing plate (500).

6. A chip bonding device according to claim 5, characterized in that: The auxiliary shock absorbing devices (800) are integrally assembled in twelve groups and are evenly arranged on the surface of the grabbing plate (500).

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