A chip testing, sorting and classification method, system and production line

Abstract

The present invention discloses a chip test sorting and classification method, system and production line. After a tester is used to test a chip to obtain the material type of the chip to be tested, the chip to be tested is sorted by the tester and marked according to the material type of the chip to be tested. After a batch of tested chips are taken out from the sorter, the batch of tested chips are transferred to a foot scanning station after the test is completed and classified, and the foot scanning machine can be used to further determine the target identification obtained by marking the chip to be tested, and the chips to be tested that do not belong to the same material type are screened and eliminated, thereby avoiding the mixing of materials caused by human operation when the chips to be tested are centrally processed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production technology, and in particular to a chip testing, sorting and classification method, system and production line. Background Art

[0002] The chip testing process needs to be tested by the test machine and the sorting machine to sort and classify the correct BIN (material). However, the subsequent collection and concentration of chips from the sorting machine must be done manually. During the manual process, it is inevitable that there will be problems with mixed materials due to abnormal human operation. Specifically, when the chips are concentrated on the shelf, they are divided into partitions to distinguish different BINs. This method is very easy to cause mixed BINs due to human misplacement. In addition, different colored trays or tubes are used to represent different BINs for distinction. Although such an operation can greatly avoid the current mixed BIN, at the end of the last batch, the tail number needs to be manually concentrated on the same tray with the same BIN. Therefore, it cannot completely avoid the situation of manual misplacement when the tail number materials are concentrated. In addition, when the colored trays or tubes are shipped, they usually need to be changed back to the regular color according to the normal shipping process, and they need to be processed again. Therefore, the existing chips are inevitably mixed due to human participation in the testing process.

[0003] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a chip testing, sorting and classification method, system and production line to solve the problem of material mixing during the testing process of the existing chips.

[0005] The technical solution of the present invention is as follows:

[0006] In a first aspect, the present invention provides a chip testing sorting and classification method, which comprises:

[0007] The tester tests the chip under test and determines the material type of the chip under test;

[0008] The sorting machine marks the tested chips according to the material determination results of the tested chips, classifies the tested chips, and places the classified tested chips on the target material tray; wherein each tested chip has a target mark corresponding to the material type;

[0009] After the batch of chips under test are tested and classified, they are transferred to the scanning station, where they are identified by the scanning machine and the chips under test that do not meet the target category are screened out.

[0010] According to a further configuration of the present invention, the sorting machine marks the chips under test according to the material determination result of the chips under test, and classifies the chips under test, and the steps of placing the classified chips under test on the target material tray include:

[0011] The sorting machine marks the tested chips that are good according to the material classification results;

[0012] The sorting machine places the tested chips on the target tray according to the judgment results.

[0013] According to a further configuration of the present invention, the sorting machine marks the chips under test according to the material determination result of the chips under test, and classifies the chips under test, and the steps of placing the classified chips under test on the target material tray include:

[0014] The sorting machine places the tested chips on the target tray according to the judgment results;

[0015] The sorting machine marks the tested chips that are tested as good products according to the material classification results.

[0016] According to a further configuration of the present invention, the target tray includes a good product tray and a bad product tray; wherein the good product tray includes a chip grade tray and a chip series tray.

[0017] In a further configuration of the present invention, the step of the scanning machine performing target identification and screening out the tested chips that do not meet the target material classification includes:

[0018] The foot scanner reads the conventional pins, positive prints and target marks of the chip under test;

[0019] When it is detected that the conventional pins or positive prints of the chip under test do not meet the requirements, or when it is detected that the target identification of the chip under test does not meet the target category, the corresponding chip under test will be screened out.

[0020] In a further configuration of the present invention, the sorting machine marks the chips under test according to the material determination result of the chips under test, and classifies the chips under test, and the step of placing the classified chips under test on the target material tray also includes:

[0021] When the chip under test is detected as defective, the defective chip under test is classified;

[0022] Return the defective chips to the test machine for retesting.

[0023] In a second aspect, the present invention provides a chip test sorting and classification system based on the above-mentioned chip test sorting and classification method, which comprises: a tester, a sorting machine and a foot scanning machine; wherein,

[0024] The testing machine is connected to the sorting machine, and is used to determine the material type of the tested chip, and send the material type determination result to the sorting machine;

[0025] The sorting machine is used to mark the chips under test according to the material determination results of the chips under test, classify the chips under test, and place the classified chips under test on the target material tray;

[0026] The scanning machine is used to perform target identification on the classified chips under test after the test classification of the batch of chips under test is completed, and to screen out the chips under test that do not meet the target classification.

[0027] According to a further configuration of the present invention, the sorting machine comprises: a machine platform, a feeding area, a chip transfer track, a chip testing area, an empty material tray area, a chip sorting area, a marking device and a first control unit; wherein,

[0028] The feeding area is located on the platform and is used to place the chip to be tested;

[0029] The chip transfer track is located at one side of the chip test area and is used to transfer the chip under test. The chip test area is used to test the transferred chip under test.

[0030] The empty tray area and the chip distribution area are both arranged on the machine platform. When the trays full of tested chips in the chip distribution area are transferred, the empty trays in the empty tray area can be used to supplement the trays in the chip distribution area.

[0031] The marking device is installed on the machine platform and is used to mark the chip under test;

[0032] The first control unit is connected to the marking device and the test machine respectively, and is used to control the marking device to mark the chip under test according to the material classification result sent by the test machine;

[0033] The foot scanning machine includes a second control unit, which is used to read the conventional pins, positive prints and target identifications of the chip under test.

[0034] According to a further configuration of the present invention, the marking device comprises a displacement mechanism and a marking component;

[0035] The displacement mechanism is arranged on the machine platform and connected to the marking component, and is used to adjust the position of the marking component;

[0036] The marking component is connected to the first control unit and is used to mark the chip under test according to the material determination result sent by the test machine.

[0037] In a third aspect, the present invention provides a production line, which includes the chip testing, sorting and classification system as described above.

[0038] The chip testing, sorting and classification method, system and production line provided by the present invention have the following beneficial effects:

[0039] The present invention adopts a testing machine to test the tested chip to obtain the material type of the corresponding tested chip, and then sorts the tested chips after the test and marks them according to the material type of the tested chips. After taking out the batch of tested chips from the sorting machine, the batch of tested chips are transferred to the foot scanning station after the test is completed and classified, and the foot scanning machine is used to further determine the target identification obtained by marking the tested chips, so that the tested chips can be effectively distinguished by the corresponding material type identification by adopting the material type classification marking method, and the tested chips that do not belong to the same material type are screened and eliminated, so as to avoid the mixing of materials caused by manual misjudgment and misoperation when the tested chips are centrally processed, thereby realizing the optimization of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary personnel in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0041] Figure 1 It is a schematic diagram of the process of the chip testing, sorting and classification method of the present invention.

[0042] Figure 2 It is a principle block diagram of the chip testing, sorting and classification system in the present invention.

[0043] Figure 3 It is a structural schematic diagram of the sorting machine in the present invention.

[0044] The marks in the attached drawings are: 100, testing machine; 200, sorting machine; 210, machine table; 220, feeding area; 230, chip transfer track; 240, chip testing area; 250, empty material tray area; 260, chip sorting area; 270, marking device; 280, first control unit; 271, displacement mechanism; 272, marking component; 300, foot sweeper; 310, second control unit. DETAILED DESCRIPTION

[0045] The present invention provides a chip test sorting and classification method, system and production line. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] In the embodiments and the scope of the patent application, unless the text specifically defines the article, "a", "an", "the" and "the" may also include plural forms. If there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0047] It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when an element is said to be "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there can also be intermediate elements. In addition, the "connection" or "coupling" used herein can include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0048] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as generally understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as herein.

[0049] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0050] Please also see Figure 1 The present invention provides a preferred embodiment of a chip testing sorting and classification method.

[0051] In some embodiments, Figure 1As shown, the present invention provides a chip test sorting and classification method, which includes the steps of:

[0052] S100, the testing machine tests the chip under test and determines the material type of the chip under test;

[0053] S200, the sorting machine marks the tested chips according to the material determination results of the tested chips, classifies the tested chips, and places the classified tested chips on the target material tray; wherein each tested chip has a target mark corresponding to the material type;

[0054] S300, after the batch of chips under test are tested and classified, they are transferred to the scanning station, and the target identification is determined by the scanning machine, and the chips under test that do not meet the target material are screened out.

[0055] Specifically, the test machine mainly determines whether the tested chip is a good product and classifies the chip's grade and series. For example, good products are divided into first-class good products, second-class good products, etc., and bad products can be divided into first-class bad products, second-class bad products, etc. The sorting machine has several chip material classification areas, and each material classification area is provided with a corresponding target material tray, wherein the target material tray includes a good material tray and a bad material tray, and the good material tray includes a chip grade material tray and a chip series material tray.

[0056] After the test machine is used to test the chip under test and obtain the information of the material type of the chip under test, the test machine is used to sort the tested chips after the test and mark them according to the material type of the chip under test. Among them, the material type of the chip under test corresponds to the target mark, and a scanning function for the target mark of the chip under test is added to the foot scanner. After the batch of tested chips under test are taken out from the sorting machine, the foot scanner can be used to further determine the target mark obtained by marking the chip under test, and the material type classification marking method is adopted to effectively distinguish the chips under test through the corresponding material type mark, and the chips under test that do not belong to the same material type are screened out, thereby avoiding the mixing of materials caused by manual misjudgment and misoperation when the chips under test are centrally processed, thereby achieving process optimization.

[0057] In some embodiments, the sorting machine marks the chips under test according to the material determination results of the chips under test, and classifies the chips under test, and the steps of placing the classified chips under test on the target tray include:

[0058] S210, the sorting machine marks the tested chips that are good products according to the material classification results;

[0059] S220, the sorting machine places the tested chips on the target tray according to the determination result.

[0060] Specifically, after the test machine completes the material test and determination of the chip under test, the chip under test that is tested as good can be marked first, and then the chip under test can be placed in a tray in the corresponding material partition.

[0061] In other embodiments, the sorting machine marks the chips under test according to the material determination result of the chips under test, and classifies the chips under test, and the steps of placing the classified chips under test on the target material tray include:

[0062] S230, the sorting machine places the tested chips on the target tray according to the determination result;

[0063] S240, the sorting machine marks the tested chips that are tested as good products according to the material classification results.

[0064] Specifically, after the test machine completes the material test and determination of the chip under test, the chip under test that is tested as good can be placed in a material tray in the corresponding material category partition, and then the marking process of the chip under test is completed.

[0065] In some embodiments, the step of the scanning machine performing target identification and screening out the chips under test that do not meet the target material classification includes:

[0066] S310, the foot scanning machine reads the conventional pins, positive prints and target marks of the chip under test;

[0067] S320: When it is detected that the conventional pins or positive prints of the chip under test do not meet the requirements, or when it is detected that the target identification of the chip under test does not meet the target category, the corresponding chip under test is screened out.

[0068] Specifically, after completing the test classification of the chips under test, the construction personnel will transfer the batches of chips under test to the foot scanning machine for scanning. Among them, the control unit program in the foot scanning machine is set with target identification information according to the material type of the chips under test. After completing the interpretation of the conventional pins and the positive print, the target identification of the chip under test will be further judged. If there are chips under test that do not belong to the corresponding material type, the foot scanning machine will screen out and remove the chips under test that do not meet the expectations.

[0069] In some embodiments, the sorting machine marks the chips under test according to the material determination result of the chips under test, and classifies the chips under test, and the step of placing the classified chips under test on the target material tray further includes:

[0070] S250, when the chip under test is detected as a defective product, classifying the defective chip under test;

[0071] S260, returning the defective tested chip to the test machine for retesting.

[0072] Specifically, when the test machine tests and judges the chip under test, if it is detected as a defective product, it will not be marked, and the defective product will be placed in the same material tray, and then the defective product will be tested again to avoid good chips being mistakenly detected as defective chips.

[0073] In some embodiments, Figure 2 As shown, the present invention provides a chip test sorting and classification system based on the chip test sorting and classification method described above, which includes: a tester 100, a sorter 200 and a foot sweeper 300. The tester 100 is connected to the sorter 200, and is used to determine the material type of the tested chip, and send the material type determination result to the sorter 200; the sorter 200 is used to mark the tested chip according to the material type determination result of the tested chip, and classify the tested chip, and place the classified tested chip on the target material tray; the foot sweeper 300 is used to perform target identification on the classified tested chips after the batch of tested chips are tested and classified, and screen out the tested chips that do not meet the target material type.

[0074] In this embodiment, after the tester 100 is used to test the tested chip and obtain the information of the material type of the tested chip, the tested chip is sorted by the tester 100 and marked according to the material type of the tested chip. The material type of the tested chip corresponds to the target identification, and a scanning function for the target identification of the tested chip is added to the foot scanning machine 300. After the tested chips of a batch of completed tests are taken out from the sorting machine 200, the foot scanning machine 300 can be used to further determine the target identification obtained by marking the tested chips, and the tested chips that do not belong to the same material type can be screened out, thereby avoiding the mixing of materials caused by human operation when the tested chips are centrally processed.

[0075] In some embodiments, Figure 3As shown, the sorting machine 200 includes: a machine table 210, a feed area 220, a chip transfer track 230, a chip test area 240, an empty material tray area 250, a chip sorting area 260, a marking device 270 and a first control unit 280; wherein the feed area 220 is located on the machine table 210 and is used to place the chips to be tested; the chip transfer track 230 is located on one side of the chip test area 240 and is used to transfer the chips to be tested, and the chip test area 240 is used to test the transferred chips to be tested; the empty material tray area 250 and the chip sorting area 260 are connected to each other. 60 are all arranged on the machine 210. When the tray full of chips to be tested in the chip distribution area 260 is transferred, the empty trays in the empty tray area 250 can replenish the trays in the chip distribution area 260. The marking device 270 is installed on the machine 210, and is used to mark the chips to be tested. The first control unit 280 is respectively connected to the marking device 270 and the test machine 100, and is used to control the marking device 270 to mark the chips to be tested according to the material classification result sent by the test machine 100.

[0076] Specifically, a feed area 220, a chip test area 240, an empty tray area 250 and a chip sorting area 260 are provided on the machine table 210 of the sorting machine 200. The chip to be tested will first be placed in the tray in the feed area 220, and the chip to be tested will be transferred to the chip transfer track 230 by the robot of the sorting machine 200, and further transferred to the chip test area 240. After being tested and judged by the test machine 100, it will be transferred to the chip transfer track 230, and then transferred to the next workstation by the chip transfer track 230. The first control unit 280 is added with a marking device program, and the running program sets the material identification corresponding to different material types according to user needs. Therefore, the first control unit 280 can control the marking device 270 to complete the marking of the chip to be tested and place the chip to be tested in the tray corresponding to the chip sorting area 260 according to the material type judgment result sent by the test machine 100. Figure 3 As shown, the chip sorting area 260 has six trays. If the chip under test currently belongs to the first tray, the chip under test is placed in the first tray by a robot, and this process is repeated until all the chips under test have been tested and classified.

[0077] In some embodiments, the foot scanner 300 includes a second control unit 310, and a material identification program function is newly written into the second control unit 310, which can not only judge the regular pins and positive prints of the chip under test, but also judge the target identification, so that the foot scanner 300 can judge the target identification of the classified chips under test, and screen out the chips under test that do not meet the target material category.

[0078] In some embodiments, Figure 3 As shown, the marking device 270 includes a displacement mechanism 271 and a marking component 272; the displacement mechanism 271 is arranged on the machine platform 210 and connected to the marking component to adjust the position of the marking component 272; the marking component 272 is connected to the test machine 100, and is used to mark the chip under test according to the judgment result sent by the test machine 100.

[0079] Specifically, the marking device 270 is mainly composed of a displacement mechanism 271 and a marking component 272, and the displacement mechanism 271 and the marking component 272 are controlled by the control unit of the sorting machine 200. When the sorting machine 200 receives the judgment result fed back by the test machine 100, it can control the displacement mechanism 271 to transfer the marking component 272 along the X-axis direction and the Y-axis direction to the top of the corresponding chip under test to complete the corresponding marking work. In one implementation, the marking component 272 can be implemented by laser marking.

[0080] In some embodiments, the present invention provides a production line, which includes the chip testing, sorting and classification system as described above. Specifically, as described in a chip testing and classification system, it will not be repeated here.

[0081] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A chip testing sorting and classification method, characterized in that: include: The tester tests the chip under test and determines the material type of the chip under test; The sorting machine marks the tested chips according to the material determination results of the tested chips, classifies the tested chips, and places the classified tested chips on the target material tray; wherein each tested chip has a target mark corresponding to the material type; After the batch of chips under test are tested and classified, they are transferred to the scanning station, where the scanning machine performs target identification and removes the chips under test that do not meet the target material category. Specifically, the following steps are included: The foot scanner reads the conventional pins, positive prints and target marks of the chip under test; When it is detected that the conventional pins or positive prints of the chip under test do not meet the requirements, or when it is detected that the target identification of the chip under test does not meet the target category, the corresponding chip under test will be screened out; Among them, after completing the interpretation of regular pins and positive prints, the target identification of the chip under test will be further judged. If the chip under test that does not belong to the corresponding material category is detected, the pin scanner will screen out and eliminate the chip under test that does not meet the expectations.

2. The chip test sorting and classification method according to claim 1, characterized in that: The sorting machine marks the chips under test according to the material determination results of the chips under test, classifies the chips under test, and places the classified chips under test on the target tray, including the following steps: The sorting machine marks the tested chips that are good according to the material classification results; The sorting machine places the tested chips on the target tray according to the judgment results.

3. The chip test sorting and classification method according to claim 1, characterized in that: The sorting machine marks the chips under test according to the material determination results of the chips under test, classifies the chips under test, and places the classified chips under test on the target tray, including the following steps: The sorting machine places the tested chips on the target tray according to the judgment results; The sorting machine marks the tested chips that are tested as good products according to the material classification results.

4. The chip testing, sorting and classification method according to any one of claims 1 to 3, characterized in that: The target material trays include good material trays and bad material trays; wherein the good material trays include chip grade material trays and chip series material trays.

5. The chip test sorting and classification method according to claim 1, characterized in that: The sorting machine marks the chips under test according to the material determination result of the chips under test, classifies the chips under test, and places the classified chips under test on the target material tray, which also includes: When the chip under test is detected as defective, the defective chip under test is classified; Return the defective chips to the test machine for retesting.

6. A chip test sorting and classification system based on the chip test sorting and classification method according to any one of claims 1 to 5, characterized in that: include: Testing machine, sorting machine and foot sweeping machine; among them, The testing machine is connected to the sorting machine, and is used to determine the material type of the tested chip, and send the material type determination result to the sorting machine; The sorting machine is used to mark the chips under test according to the material determination results of the chips under test, classify the chips under test, and place the classified chips under test on the target material tray; The scanning machine is used to perform target identification on the classified chips under test after the test classification of the batch of chips under test is completed, and to screen out the chips under test that do not meet the target classification.

7. The chip testing, sorting and classification system according to claim 6, characterized in that: The sorting machine comprises: a machine platform, a feeding area, a chip transfer track, a chip testing area, an empty material tray area, a chip sorting area, a marking device and a first control unit; wherein, The feeding area is located on the platform and is used to place the chip to be tested; The chip transfer track is located at one side of the chip test area and is used to transfer the chip under test. The chip test area is used to test the transferred chip under test. The empty tray area and the chip distribution area are both arranged on the machine platform. When the trays full of tested chips in the chip distribution area are transferred, the empty trays in the empty tray area can be used to supplement the trays in the chip distribution area. The marking device is installed on the machine platform and is used to mark the chip under test; The first control unit is connected to the marking device and the test machine respectively, and is used to control the marking device to mark the chip under test according to the material classification result sent by the test machine; The foot scanning machine includes a second control unit, which is used to read the conventional pins, positive prints and target identifications of the chip under test.

8. The chip testing, sorting and classification system according to claim 7, characterized in that: The marking device comprises a displacement mechanism and a marking component; The displacement mechanism is arranged on the machine platform and connected to the marking component, and is used to adjust the position of the marking component; The marking component is connected to the first control unit and is used to mark the chip under test according to the material determination result sent by the test machine.

9. A production line, characterized in that: It comprises a chip testing, sorting and classification system as described in any one of claims 6 to 8.

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