A circuit board semiconductor welding positioning device

Abstract

The invention discloses a circuit board semiconductor welding positioning device, which relates to the field of electrical appliance welding and solves the fixing problem of special-shaped circuit boards and the problem of double-sided soldering. The circuit board semiconductor welding positioning device includes a fixed top plate, a mainframe bottom plate and a hollow support rod, and also includes a special-shaped circuit board fixing mechanism and a second welding electric soldering iron. The special-shaped circuit board fixing mechanism also includes: a special-shaped work table, a lateral fixing component, a reinforcement component and a reverse soldering component. The reverse soldering component is installed at the bottom of the lateral fixing component. The reverse soldering component can simultaneously solder the reverse side of the circuit board. The reverse soldering component includes a first welding electric soldering iron. The fixing effect of the semiconductor object to be soldered is strengthened by the special-shaped circuit board fixing mechanism, and the semiconductor object to be soldered can be moved. The fixing effect and fixing effect of the fixing mechanism are better than those of a suction cup, and the special-shaped work table can withstand greater impact force.

Description

Technical Field

[0001] The invention relates to the field of electrical appliance welding, in particular to a circuit board semiconductor welding positioning device. Background Art

[0002] Circuit board welding is an important part of the electronic manufacturing process. It connects various electronic components to the circuit board by soldering to complete the connection and assembly of the circuit. Brazing requires heating to melt the solder, but the workpiece does not melt. It is a welding method that uses the diffusion between non-ferrous filler metals such as brass and solder and the base material to connect the two welded workpieces together. Correct welding methods and techniques are essential to ensure the quality and stability of circuit boards. Existing circuit board welding generally uses manual welding and semi-automatic welding methods, and the welding of double-sided circuit boards is not automated enough.

[0003] Comparative Document 1: The existing Chinese patent with publication number CN110802293B discloses a semiconductor device welding positioning device and a semiconductor device welding method, wherein the semiconductor device welding positioning device comprises: a metal carrier plate for carrying a circuit board; a limiting assembly, which can be detachably mounted to the metal carrier plate; the limiting assembly comprises a metal limiting plate with a limiting through hole, and a metal spacer arranged on the side of the metal limiting plate away from the metal carrier plate; a metal pressure plate, which can be detachably connected to the metal carrier plate and carried by the metal spacer; wherein the metal carrier plate has a positioning mechanism for positioning the circuit board, the limiting assembly and the metal pressure plate; during welding, the circuit board is placed between the metal carrier plate and the metal limiting plate, the semiconductor device is placed in the limiting through hole and is horizontally limited by the limiting through hole, and the semiconductor device abuts against the metal pressure plate and is vertically limited by the metal pressure plate. The semiconductor device welding positioning device can be reused, and can simultaneously limit the semiconductor device in the horizontal and vertical directions, with high positioning accuracy:

[0004] 1. The device can only fix circuit boards with fixed shapes, but cannot stably fix circuit boards with special shapes and other shapes. The device has a single application scope and low versatility.

[0005] Comparative Document 2: The existing Chinese patent with publication number CN114346545A discloses a semiconductor refrigeration plate welding device and a basic welding process, including a fixed bracket, the top of the fixed bracket is fixedly connected to a support frame, the inner wall of the fixed bracket is fixedly connected to a conveyor belt, the top of the inner wall of the support frame is fixedly connected to a connecting device, the part of the top of the inner wall of the support frame located on one side of the welding device is fixedly connected to a fixing device, the fixing device includes a fixed seat, the bottom of the fixed seat is fixedly connected to a telescopic rod, the end of the telescopic rod away from the fixed seat is fixedly connected to an electronic rotating table, the rotating part of the electronic rotating table is fixedly connected to a positioning seat, and the side of the positioning seat is penetrated and fixedly connected to a positioning rod. The semiconductor refrigeration plate welding device and its welding process are to move the semiconductor refrigeration plate to the bottom of the welder through a suction cup, and then control the direction of the semiconductor refrigeration plate through a rotating table, so as to facilitate the realization of assembly line processing, and automatically weld the semiconductor refrigeration plate through the welding device to avoid safety accidents caused by manual operation errors.

[0006] 1. The fixing effect of the welding suction cup is limited. During welding, the semiconductor object to be welded is subjected to a large impact force, which makes the semiconductor object to be welded easy to fall off. In addition, the poor fixing effect of the semiconductor object to be welded will lead to inadequate welding and desoldering. In addition, the device does not take into account the fixing method of special-shaped semiconductor objects to be welded and the problem of reverse welding. When both the front and back sides of the semiconductor object to be welded need to be welded, the front and back sides of the double-sided circuit board cannot be welded at the same time, and the angle between the electric soldering iron and the circuit board cannot be adjusted;

[0007] 2. When the welding volume is large and a long semiconductor object needs to be welded, the welding point will be subjected to the force of the soldering iron, causing both ends to curl up. Summary of the invention

[0008] The object of the present invention is to provide a circuit board semiconductor welding positioning device to solve the problems raised in the above background technology.

[0009] The technical solution of the present invention is: a circuit board semiconductor welding positioning device, comprising a fixed top plate, a mainframe bottom plate and a hollow support rod; the circuit board semiconductor welding positioning device also comprises a special-shaped circuit board fixing mechanism and a second welding electric soldering iron, the special-shaped circuit board fixing mechanism fixes the circuit board;

[0010] Among them, the special-shaped circuit board fixing mechanism also includes:

[0011] A special-shaped work surface, the special-shaped work surface is installed on the top of the main body bottom plate, and the special-shaped work surface has a special-shaped appearance, the special-shaped work surface can fix the special-shaped circuit board, a horizontal slide rail is installed on one side of the top of the special-shaped work surface, and an inclined slide rail is installed on the inclined surface on the other side of the top of the special-shaped work surface, a horizontal slide plate, a first overhead block and a first insulating gasket are installed on the top of the horizontal slide rail, and a first positioning rod is installed on the top of the first insulating gasket, and the first positioning rod can fix the special-shaped circuit board;

[0012] A lateral fixing component, the lateral fixing component is installed on both sides of the special-shaped circuit board fixing mechanism, the lateral fixing component can fix both sides of the special-shaped circuit board, and the lateral fixing component includes a clamping top plate, a first magnetic fixing plate, a second magnetic fixing plate and a third magnetic fixing plate;

[0013] A reinforcement component, wherein the reinforcement component is installed on one side of the lateral fixing component, and the reinforcement component can further reinforce both sides of the special-shaped circuit board, and the reinforcement component includes a fourth magnetic fixing plate, a fifth magnetic fixing plate, and a sixth magnetic fixing plate;

[0014] A reverse soldering assembly is installed at the bottom of the lateral fixing assembly, the reverse soldering assembly can simultaneously solder the reverse side of the circuit board, and the reverse soldering assembly includes a first soldering electric soldering iron.

[0015] Furthermore, a first movable slider is installed at the connection between the horizontal slide rail and the horizontal slide plate, and the first movable slider is slidably connected to the horizontal slide rail, and the top end of the first movable slider is fixed to the horizontal slide plate;

[0016] Among them, two groups of first overhead blocks are installed on the top of the horizontal slide, and the first overhead blocks are T-shaped. A first insulating gasket is installed on the top of the first overhead block, and a first positioning rod is installed at the middle position of the first insulating gasket. A special-shaped circuit board sample is provided on the top of the first positioning rod, and a plurality of groups of through holes are inlaid on the surface of the special-shaped circuit board sample, and the first positioning rod and the through holes are through-connected.

[0017] Furthermore, an inclined slide plate is provided at the top of the inclined slide rail, and a second movable slide plate is installed at the connection between the inclined slide plate and the inclined slide rail, the second movable slide plate is slidably connected to the inclined slide rail, the inclined slide plate and the inclined slide rail are inclined at an angle of 45 degrees to the horizontal plane, a second overhead block is installed at the top of the inclined slide plate, and the second overhead block is T-shaped.

[0018] Among them, a second insulating gasket is installed on the top of the second overhead block, a second positioning rod is fixed on the top of the second insulating gasket, and the second positioning rod is connected with a through hole embedded in the surface of the special-shaped circuit board sample, and the first positioning rod and the second positioning rod can fix the position of the special-shaped circuit board sample.

[0019] Furthermore, the lateral fixing assembly also includes a T-shaped support base, and a first flip motor is fixed to one side of the T-shaped support base, the output end of the first flip motor is connected to a first movable flap, and the first movable flap flips about the output end of the first flip motor, the end of the first movable flap away from the first flip motor is connected to a clamping top plate, and one side of the clamping top plate is connected to a third magnetic fixing plate, the bottom end of the clamping top plate is connected to the first magnetic fixing plate, and the bottom of one side of the first magnetic fixing plate is connected to the second magnetic fixing plate.

[0020] Furthermore, some positions on the surfaces of the clamping top plate, the first magnetic fixing plate, the second magnetic fixing plate and the third magnetic fixing plate have magnetic attraction, and the clamping top plate, the first magnetic fixing plate, the second magnetic fixing plate and the third magnetic fixing plate can fix special-shaped circuit boards of different shapes by splicing.

[0021] Furthermore, a supporting base plate is installed on one side of the T-shaped support base, and one side of the supporting base plate is engaged and connected with the second magnetic fixing plate.

[0022] Furthermore, one side of the T-shaped support base is connected to the support bracket, and a telescopic motor is installed at one end of the support bracket away from the T-shaped support base, and a first welding electric soldering iron is installed at the output end of the telescopic motor.

[0023] Wherein, the special-shaped bracket provided inside the supporting bracket can extend the first welding electric soldering iron to the back side of the circuit board.

[0024] Furthermore, the reinforcement component also includes an L-shaped support base, and a second flip motor is installed on one side of the L-shaped support base, the output end of the second flip motor is connected to a second movable flap, and one side of the second movable flap is connected to a fourth magnetic fixing plate, and the bottom of the fourth magnetic fixing plate is connected to a fifth magnetic fixing plate, and one end of the fifth magnetic fixing plate is connected to a sixth magnetic fixing plate.

[0025] Furthermore, the fourth magnetic fixing plate, the fifth magnetic fixing plate and the sixth magnetic fixing plate have magnetic attraction at some positions on their surfaces, and the fourth magnetic fixing plate, the fifth magnetic fixing plate and the sixth magnetic fixing plate can fix special-shaped circuit boards of different shapes by splicing;

[0026] Wherein, a manual wrench is installed at one end of the second flip motor, and the manual wrench can manually open and close the second flip motor in an emergency.

[0027] Furthermore, the top of the fixed top plate is inlaid with a limited slide groove, the top of the fixed top plate is installed with a connecting angle steel, and the bottom of the connecting angle steel is provided with a slider sliding in the limited slide groove, the bottom of the fixed top plate is installed with an upright telescopic rod, and the output end of the upright telescopic rod is installed with a second welding electric soldering iron,

[0028] Wherein, an inclined telescopic rod is installed at the bottom end of the connecting angle steel, and a third soldering iron is installed at the output end of the inclined telescopic rod.

[0029] A hollow support rod is fixed at the connection between the fixed top plate and the mainframe bottom plate.

[0030] The present invention provides a circuit board semiconductor welding positioning device through improvement, which has the following improvements and advantages compared with the prior art:

[0031] First, the fixing effect of the semiconductor object to be welded is enhanced by the special-shaped circuit board fixing mechanism, and the semiconductor object to be welded can be moved. The fixing effect and fixing effect of the fixing mechanism are better than those of the suction cup, and the special-shaped work table can withstand greater impact force, thereby improving the fixing effect of the semiconductor object to be welded and avoiding desoldering caused by inadequate welding. In addition, the cooperation of the slide rail and the slide groove enables the semiconductor object to be welded to be moved according to the adjustment of welding, and the special-shaped shape of the top of the special-shaped work table is convenient for fixing the semiconductor object to be welded with special shapes and bends, because the circuit board can not only produce a flat shape, but also be set into circuit boards of different shapes according to the use field and the shell of the device. The device can be flexibly spliced, which is convenient for adapting to circuit boards of different shapes. In addition, the circuit board can be suspending through the first overhead block to avoid high temperature damage to the workbench during welding, and it is convenient for heat dissipation and cooling;

[0032] In addition, the side fixing components are used to fix the two sides of the larger and longer semiconductor circuit boards, thereby preventing the two ends of the circuit board from warping due to the force on the welding points, because the warping and resetting of the two ends will cause the circuit board to shift. In addition, the clamping top plate, the first magnetic fixing plate, the second magnetic fixing plate and the third magnetic fixing plate are assembled together to fix special-shaped circuit boards of different shapes. The first flip motor is started to flip the clamping top plate to press the circuit board from the top.

[0033] Secondly, the first welding electric soldering iron, the second welding electric soldering iron and the third soldering electric soldering iron cooperate with each other to facilitate welding work on the front and back sides of the semiconductor object to be welded at the same time, so as to achieve the effect of welding the front and back sides of the semiconductor object to be welded at the same time, which is convenient for processing double-sided semiconductor circuit boards. By adjusting the shape of the supporting bracket, it is convenient to adjust the direction of the first welding electric soldering iron relative to the circuit board. The telescopic motor can be extended and retracted, and the first welding electric soldering iron is pushed toward the circuit board when welding is required.

[0034] Thirdly, the reinforcement component is convenient for assisting in fixing the circuit board, because the reverse solder component will apply upward pushing pressure to the circuit board from the bottom when working, and the reinforcement component is needed to support the circuit board from the top, and by starting the second flip motor, the second movable flip plate can be driven to flip and press the circuit board from the top. The function of the fourth magnetic fixing plate, the fifth magnetic fixing plate and the sixth magnetic fixing plate is to adjust the shape of the pressure plate according to the shape of the special-shaped circuit board. Because the number of automated processing and production is large, although the shape of the pressure plate needs to be adjusted, the number of circuit boards processed at one time is large, and this method of splicing the pressure plates can enhance the fixing effect while avoiding the embarrassment that the production line can only produce circuit boards of one shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be further explained below in conjunction with the accompanying drawings and Examples:

[0036] Figure 1 It is a schematic diagram of the first three-dimensional appearance structure of the present invention;

[0037] Figure 2 It is a schematic diagram of a second three-dimensional appearance structure of the present invention;

[0038] Figure 3 It is a side view schematic diagram of the lateral fixing assembly and the reinforcing assembly of the present invention;

[0039] Figure 4 It is a top view schematic diagram of the lateral fixing assembly and the reinforcement assembly of the present invention;

[0040] Figure 5 It is a first stereoscopic schematic diagram of the lateral fixing assembly and the reinforcing assembly of the present invention;

[0041] Figure 6 It is a second stereoscopic schematic diagram of the lateral fixing assembly and the reinforcing assembly of the present invention;

[0042] Figure 7 It is a third stereoscopic schematic diagram of the lateral fixing assembly and the reinforcing assembly of the present invention;

[0043] Figure 8 It is a fourth stereoscopic schematic diagram of the lateral fixing assembly and the reinforcing assembly of the present invention;

[0044] Fig. 9 It is a first stereoscopic schematic diagram of the lateral fixing assembly of the present invention;

[0045] Fig.10 It is a second stereoscopic schematic diagram of the lateral fixing assembly of the present invention;

[0046] Fig.11 It is a third stereoscopic schematic diagram of the lateral fixing assembly of the present invention;

[0047] Fig.12 is a three-dimensional schematic diagram of a reinforcement assembly of the present invention;

[0048] Fig.13 It is a first stereoscopic schematic diagram of the special-shaped circuit board fixing mechanism of the present invention;

[0049] Fig.14 It is a second stereoscopic schematic diagram of the special-shaped circuit board fixing mechanism of the present invention;

[0050] Fig.15 For the present invention Fig.14 The enlarged structural diagram at A in the middle;

[0051] Fig.16 It is a third stereoscopic schematic diagram of the special-shaped circuit board fixing mechanism of the present invention;

[0052] Fig.17 It is a fourth stereoscopic schematic diagram of the special-shaped circuit board fixing mechanism of the present invention.

[0053] Explanation of the reference numerals: 1. Fixed top plate; 2. Vertical telescopic rod; 3. Tilted telescopic rod; 4. Mainframe bottom plate; 5. Special-shaped circuit board fixing mechanism; 501. Tilted slide rail; 502. Tilted slide plate; 503. Horizontal slide rail; 504. Horizontal slide plate; 505. First overhead card block; 506. Second overhead card block; 507. First insulating gasket; 508. Special-shaped work surface; 509. First positioning plug rod; 510. First movable slider; 511. Second movable slider; 512. Second insulating gasket; 513. Second positioning plug rod; 6. Lateral fixing assembly; 601. First flip motor; 602. First movable flap; 603. Clamping top plate; 604. First Magnetic fixing plate; 605, second magnetic fixing plate; 606, supporting bottom plate; 607, third magnetic fixing plate; 608, T-shaped support base; 7, reinforcement component; 701, second flip motor; 702, L-shaped support base; 703, manual wrench; 704, fourth magnetic fixing plate; 705, fifth magnetic fixing plate; 706, sixth magnetic fixing plate; 707, second movable flap; 8, reverse soldering component; 801, support bracket; 802, telescopic motor; 803, first welding soldering iron; 9, special-shaped circuit board sample; 10, second welding soldering iron; 11, connecting angle steel; 12, limiting slide; 13, hollow support rod; 14, third soldering soldering iron. DETAILED DESCRIPTION

[0054] The following will be combined with the attached Figures 1 to 17 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] The present invention provides a circuit board semiconductor welding positioning device through improvement. Figure 1-17 As shown in the figure, a circuit board semiconductor welding positioning device includes a fixed top plate 1, a main body bottom plate 4 and a hollow support rod 13: the circuit board semiconductor welding positioning device also includes a special-shaped circuit board fixing mechanism 5 and a second welding electric soldering iron 10, the special-shaped circuit board fixing mechanism 5 fixes the circuit board, and the fixing effect of the semiconductor object to be welded is enhanced by the special-shaped circuit board fixing mechanism 5, and the semiconductor object to be welded can be moved. The fixing effect and fixing effect of the fixing mechanism are better than those of the suction cup;

[0056] The top of the fixed top plate 1 is inlaid with a limited slide groove 12, the top of the fixed top plate 1 is installed with a connecting angle steel 11, and the bottom of the connecting angle steel 11 is provided with a slider that slides in the limited slide groove 12, the bottom of the fixed top plate 1 is installed with an upright telescopic rod 2, and the output end of the upright telescopic rod 2 is installed with a second welding electric soldering iron 10.

[0057] Among them, the bottom end of the connecting angle steel 11 is installed with an inclined telescopic rod 3, and the output end of the inclined telescopic rod 3 is installed with a third soldering iron 14.

[0058] A hollow support rod 13 is fixed at the connection between the fixed top plate 1 and the main body bottom plate 4;

[0059] Among them, the special-shaped circuit board fixing mechanism 5 also includes:

[0060] The special-shaped work surface 508 is installed on the top of the main body bottom plate 4, and the special-shaped work surface 508 has a special-shaped appearance. The special-shaped work surface 508 can fix the special-shaped circuit board. The special-shaped work surface 508 can withstand greater impact force, improve the fixing effect of the semiconductor soldering object, and avoid desoldering caused by inadequate soldering. Moreover, the special-shaped appearance of the top of the special-shaped work surface 508 is convenient for fixing the semiconductor soldering object with special shape and bend, because the circuit board can not only produce a flat shape, but also be set into circuit boards with different shapes according to the use field and the shell of the device. The device can be flexibly spliced ​​to adapt to circuit boards of different shapes. A horizontal slide rail 503 is installed on one side of the top of the special-shaped work surface 508, and an inclined slide rail 501 is installed on the inclined surface on the other side of the top of the special-shaped work surface 508. The cooperation of the slide rail and the slide plate enables the semiconductor to be welded to move according to the adjustment of welding. A horizontal slide plate 504, a first overhead block 505 and a first insulating gasket 507 are installed on the top of the horizontal slide rail 503, and a first positioning rod 509 is installed on the top of the first insulating gasket 507. The first positioning rod 509 can fix the special-shaped circuit board;

[0061] A first movable slider 510 is installed at the connection between the horizontal slide rail 503 and the horizontal slide plate 504, and the first movable slider 510 is slidably connected to the horizontal slide rail 503, and the top end of the first movable slider 510 is fixed to the horizontal slide plate 504;

[0062] Among them, two groups of first overhead blocks 505 are installed on the top of the horizontal slide plate 504, and the first overhead blocks 505 are T-shaped. The circuit board can be suspended through the first overhead blocks 505 to avoid high temperature damage to the workbench during welding, and to facilitate heat dissipation and cooling. The first insulating gasket 507 is installed on the top of the first overhead block 505, and the first positioning rod 509 is installed at the middle position of the first insulating gasket 507. The top of the first positioning rod 509 is provided with a special-shaped circuit board sample 9, and the surface of the special-shaped circuit board sample 9 is inlaid with multiple groups of through holes, and the first positioning rod 509 and the through holes are connected through.

[0063] The top of the inclined slide rail 501 is provided with an inclined slide plate 502, and a second movable slider 511 is installed at the connection between the inclined slide plate 502 and the inclined slide rail 501. The second movable slider 511 is slidably connected with the inclined slide rail 501. The inclined slide plate 502 and the inclined slide rail 501 are inclined at an angle of 45 degrees to the horizontal plane. The top of the inclined slide plate 502 is provided with a second overhead block 506, and the second overhead block 506 is T-shaped.

[0064] Among them, a second insulating gasket 512 is installed on the top of the second overhead block 506, and a second positioning rod 513 is fixed on the top of the second insulating gasket 512. The second positioning rod 513 is connected with the through hole embedded in the surface of the special-shaped circuit board sample 9, and the first positioning rod 509 and the second positioning rod 513 can fix the position of the special-shaped circuit board sample 9;

[0065] The lateral fixing component 6 is installed on both sides of the special-shaped circuit board fixing mechanism 5. The lateral fixing component 6 can fix both sides of the special-shaped circuit board. The lateral fixing component 6 on the side can fix both sides of the semiconductor circuit board with a large volume and a long strip, so as to avoid the effect that the two ends of the circuit board are lifted due to the force on the welding point, because the lifting and reset of the two ends will cause the circuit board to deviate. The lateral fixing component 6 includes a clamping top plate 603, a first magnetic fixing plate 604, a second magnetic fixing plate 605 and a third magnetic fixing plate 607;

[0066] The lateral fixing assembly 6 also includes a T-shaped support base 608, and a first flip motor 601 is fixed to one side of the T-shaped support base 608, the output end of the first flip motor 601 is connected to a first movable flap 602, and the first movable flap 602 flips about the output end of the first flip motor 601, and the end of the first movable flap 602 away from the first flip motor 601 is connected to a clamping top plate 603, and the first flip motor 601 is started to flip the clamping top plate 603 to press the circuit board from the top, and one side of the clamping top plate 603 is connected to a third magnetic fixing plate 607, the bottom end of the clamping top plate 603 is connected to the first magnetic fixing plate 604, and the bottom of one side of the first magnetic fixing plate 604 is connected to a second magnetic fixing plate 605;

[0067] Part of the surface of the clamping top plate 603, the first magnetic fixing plate 604, the second magnetic fixing plate 605 and the third magnetic fixing plate 607 has magnetic attraction, and the clamping top plate 603, the first magnetic fixing plate 604, the second magnetic fixing plate 605 and the third magnetic fixing plate 607 can fix special-shaped circuit boards of different shapes by splicing;

[0068] A supporting base plate 606 is installed on one side of the T-shaped support base 608, and one side of the supporting base plate 606 is engaged and connected with the second magnetic fixing plate 605;

[0069] The back soldering assembly 8 is installed at the bottom of the side fixing assembly 6. The back soldering assembly 8 can simultaneously solder the back side of the circuit board. The back soldering assembly 8 includes a first soldering electric soldering iron 803. The first soldering electric soldering iron 803, the second soldering electric soldering iron 10 and the third soldering electric soldering iron 14 cooperate with each other to facilitate the simultaneous soldering of the front and back sides of the semiconductor object to be soldered, so as to achieve the effect of simultaneously soldering the front and back sides of the semiconductor object to be soldered, and facilitate the processing of double-sided semiconductor circuit boards;

[0070] One side of the T-shaped support base 608 is installed and connected with the support bracket 801. The special-shaped bracket inside the support bracket 801 can extend the first welding electric soldering iron 803 to the back side of the circuit board. By adjusting the shape of the support bracket 801, it is convenient to adjust the direction of the first welding electric soldering iron 803 with respect to the circuit board. A telescopic motor 802 is installed at one end of the support bracket 801 away from the T-shaped support base 608. The output end of the telescopic motor 802 is installed with the first welding electric soldering iron 803. The telescopic motor 802 can be extended and retracted. When welding is required, the first welding electric soldering iron 803 is pushed toward the circuit board.

[0071] The reinforcement component 7 is installed on one side of the lateral fixing component 6. The reinforcement component 7 can further reinforce both sides of the special-shaped circuit board. The reinforcement component 7 is used to assist in fixing the circuit board, because the reverse soldering component 8 will apply an upward pushing pressure to the circuit board from the bottom when working, and the reinforcement component 7 is required to support the circuit board from the top. The reinforcement component 7 includes a fourth magnetic fixing plate 704, a fifth magnetic fixing plate 705 and a sixth magnetic fixing plate 706;

[0072] The reinforcement component 7 also includes an L-shaped support base 702, and a second flip motor 701 is installed on one side of the L-shaped support base 702, and the output end of the second flip motor 701 is connected to a second movable flap 707, and the second movable flap 707 can be driven to flip and press the circuit board from the top by starting the second flip motor 701, and a fourth magnetic fixing plate 704 is connected to one side of the second movable flap 707, and a fifth magnetic fixing plate 705 is connected to the bottom of the fourth magnetic fixing plate 704, and one end of the fifth magnetic fixing plate 705 is connected to a sixth magnetic fixing plate 706;

[0073] Partial positions on the surfaces of the fourth magnetic fixing plate 704, the fifth magnetic fixing plate 705 and the sixth magnetic fixing plate 706 have magnetic attraction, and the fourth magnetic fixing plate 704, the fifth magnetic fixing plate 705 and the sixth magnetic fixing plate 706 can be spliced ​​to adjust the shape of the pressing plate according to the shape of the special-shaped circuit board, so as to fix the special-shaped circuit boards with different shapes; because the number of automated processing and production is large, although the shape of the pressing plate needs to be adjusted, the number of circuit boards processed at one time is large, and this method of splicing the pressing plate can enhance the fixing effect while avoiding the embarrassment that the production line can only produce circuit boards of one shape;

[0074] Among them, a manual wrench 703 is installed at one end of the second flip motor 701, and the manual wrench 703 can manually open and close the second flip motor 701 in an emergency, so as to facilitate the emergency stopping of the device in case of power failure or abnormality.

[0075] Working principle: First, fix the special-shaped circuit board sample 9 on the top of the special-shaped circuit board fixing mechanism 5. The special-shaped circuit board fixing mechanism 5 can enhance the fixing effect of the semiconductor object to be welded, and can move the semiconductor object to be welded. Compared with the suction cup, the fixing effect and fixing effect of the fixing mechanism are better, and the special-shaped circuit board sample 9 is fixed on the top of the special-shaped workbench 508. It can withstand greater impact force, improve the fixing effect of the semiconductor object to be welded, and avoid desoldering caused by inadequate welding. In addition, the cooperation of the slide rail and the slide groove allows the semiconductor object to be welded to move according to the adjustment of welding, and the special-shaped shape of the top of the special-shaped workbench 508 It is convenient to fix semiconductor objects to be welded with irregular shapes, because the circuit board will not only produce a flat shape, but also be configured into circuit boards with different shapes according to the field of use and the housing of the device. The mechanism can be flexibly spliced ​​to facilitate adaptation to circuit boards with different shapes. In addition, the circuit board can be suspended by the first overhead block 505 to avoid damage to the workbench due to high temperature during welding, and to facilitate heat dissipation and cooling. The first insulating gasket 507 and the second insulating gasket 512 can play an insulating role to avoid leakage during detection. The second positioning rod 513 and the first positioning rod 509 are engaged with the through holes on the irregular circuit board sample 9 to facilitate fixing the position of the irregular circuit board sample 9.

[0076] Then, by inserting the two sides of the larger and long strip semiconductor circuit board into the inside of the side fixing assembly 6, the side fixing assembly 6 plays the role of fixing the two sides of the long strip semiconductor circuit board, so as to avoid the two ends of the circuit board from being lifted up due to the force on the welding points, because the lifting and resetting of the two ends will cause the circuit board to deviate. In addition, by splicing and assembling the clamping top plate 603, the first magnetic fixing plate 604, the second magnetic fixing plate 605 and the third magnetic fixing plate 607, the special-shaped circuit boards with different shapes can be fixed. The first flip motor 601 is started to flip the clamping top plate 603 to press the circuit board from the top.

[0077] In addition, the reinforcement component 7 is used to assist in fixing the circuit board, because the reverse solder component 8 will apply an upward pushing pressure to the circuit board from the bottom when working, and the reinforcement component 7 is needed to support the circuit board from the top, and by starting the second flip motor 701, the second movable flap 707 can be driven to flip and press the circuit board from the top. The function of the fourth magnetic fixing plate 704, the fifth magnetic fixing plate 705 and the sixth magnetic fixing plate 706 is to adjust the shape of the pressure plate according to the shape of the special-shaped circuit board. Due to the large number of automated processing and production, although the shape of the pressure plate needs to be adjusted, the number of circuit boards processed at one time is large, and this method of splicing the pressure plates can enhance the fixing effect while avoiding the embarrassment that the production line can only produce circuit boards of one shape.

[0078] Finally, by cooperating with each other, the first welding soldering iron 803, the second welding soldering iron 10 and the third soldering soldering iron 14 can simultaneously perform welding work on the front and back sides of the semiconductor object to be welded, thereby achieving the effect of welding the front and back sides of the semiconductor object to be welded at the same time, which is convenient for processing double-sided semiconductor circuit boards. By adjusting the shape of the supporting bracket 801, it is convenient to adjust the direction of the first welding soldering iron 803 relative to the circuit board. The telescopic motor 802 can be telescopic, and when welding is required, the first welding soldering iron 803 is pushed toward the circuit board.

[0079] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board semiconductor welding positioning device, comprising a fixed top plate (1), a mainframe bottom plate (4) and a hollow support rod (13), characterized in that: The circuit board semiconductor welding positioning device further comprises a special-shaped circuit board fixing mechanism (5) and a second welding electric soldering iron (10), wherein the special-shaped circuit board fixing mechanism (5) fixes the circuit board; Wherein, the special-shaped circuit board fixing mechanism (5) further comprises: A special-shaped work surface (508), the special-shaped work surface (508) is installed on the top of the main body bottom plate (4), and the special-shaped work surface (508) has a special-shaped appearance, the special-shaped work surface (508) can fix the special-shaped circuit board, a horizontal slide rail (503) is installed on one side of the top of the special-shaped work surface (508), and an inclined slide rail (501) is installed on the inclined surface on the other side of the top of the special-shaped work surface (508), a horizontal slide plate (504), a first overhead block (505) and a first insulating gasket (507) are installed on the top of the horizontal slide rail (503), and a first positioning rod (509) is installed on the top of the first insulating gasket (507), and the first positioning rod (509) can fix the special-shaped circuit board; A lateral fixing component (6), the lateral fixing component (6) being installed on both sides of the special-shaped circuit board fixing mechanism (5), the lateral fixing component (6) being capable of fixing both sides of the special-shaped circuit board, the lateral fixing component (6) comprising a clamping top plate (603), a first magnetic fixing plate (604), a second magnetic fixing plate (605) and a third magnetic fixing plate (607); A reinforcement component (7), wherein the reinforcement component (7) is installed on one side of the lateral fixing component (6), and the reinforcement component (7) can further reinforce both sides of the special-shaped circuit board, and the reinforcement component (7) comprises a fourth magnetic fixing plate (704), a fifth magnetic fixing plate (705) and a sixth magnetic fixing plate (706); A reverse soldering assembly (8), the reverse soldering assembly (8) being mounted on the bottom of the lateral fixing assembly (6), the reverse soldering assembly (8) being capable of simultaneously soldering the reverse side of a circuit board, the reverse soldering assembly (8) comprising a first soldering electric soldering iron (803); A first movable slider (510) is installed at the connection between the horizontal slide rail (503) and the horizontal slide plate (504), and the first movable slider (510) and the horizontal slide rail (503) are slidably connected, and the top end of the first movable slider (510) and the horizontal slide plate (504) are fixed; Wherein, two groups of first overhead blocks (505) are installed at the top of the horizontal slide plate (504), and the first overhead blocks (505) are in a T-shaped shape, a first insulating gasket (507) is installed at the top of the first overhead block (505), and a first positioning rod (509) is installed at the middle position of the first insulating gasket (507), a special-shaped circuit board sample (9) is provided at the top of the first positioning rod (509), and the surface of the special-shaped circuit board sample (9) is inlaid with a plurality of groups of through holes, and the first positioning rod (509) and the through holes are through-connected; The top of the inclined slide rail (501) is provided with an inclined slide plate (502), and a second movable slide block (511) is installed at the connection between the inclined slide plate (502) and the inclined slide rail (501), and the second movable slide block (511) is slidably connected to the inclined slide rail (501), and the inclined slide plate (502) and the inclined slide rail (501) form an inclined angle of 45 degrees with the horizontal plane, and a second overhead block (506) is installed at the top of the inclined slide plate (502), and the second overhead block (506) is in a T-shaped shape. A second insulating gasket (512) is installed at the top of the second overhead block (506), a second positioning rod (513) is fixed at the top of the second insulating gasket (512), and the second positioning rod (513) is connected to a through hole embedded in the surface of the special-shaped circuit board sample (9), and the first positioning rod (509) and the second positioning rod (513) can fix the position of the special-shaped circuit board sample (9).

2. A circuit board semiconductor welding positioning device according to claim 1, characterized in that: The lateral fixing component (6) also includes a T-shaped support base (608), and a first flip motor (601) is fixed to one side of the T-shaped support base (608), the output end of the first flip motor (601) is connected to a first movable flap (602), and the first movable flap (602) flips relative to the output end of the first flip motor (601), the end of the first movable flap (602) away from the first flip motor (601) is connected to a clamping top plate (603), and one side of the clamping top plate (603) is connected to a third magnetic fixing plate (607), the bottom end of the clamping top plate (603) is connected to the first magnetic fixing plate (604), and the bottom of one side of the first magnetic fixing plate (604) is connected to a second magnetic fixing plate (605).

3. A circuit board semiconductor welding positioning device according to claim 2, characterized in that: Partial positions on the surfaces of the clamping top plate (603), the first magnetic fixing plate (604), the second magnetic fixing plate (605) and the third magnetic fixing plate (607) have magnetic attraction, and the clamping top plate (603), the first magnetic fixing plate (604), the second magnetic fixing plate (605) and the third magnetic fixing plate (607) can fix special-shaped circuit boards of different shapes by splicing.

4. A circuit board semiconductor welding positioning device according to claim 3, characterized in that: A supporting base plate (606) is installed on one side of the T-shaped support base (608), and one side of the supporting base plate (606) is snap-connected with the second magnetic fixing plate (605).

5. A circuit board semiconductor welding positioning device according to claim 4, characterized in that: One side of the T-shaped support base (608) is connected to the support bracket (801), and a telescopic motor (802) is installed at one end of the support bracket (801) away from the T-shaped support base (608), and a first welding electric soldering iron (803) is installed at the output end of the telescopic motor (802). The special-shaped bracket provided inside the support bracket (801) can extend the first welding electric soldering iron (803) to the back side of the circuit board.

6. A circuit board semiconductor welding positioning device according to claim 1, characterized in that: The reinforcement component (7) also includes an L-shaped support base (702), and a second flip motor (701) is installed on one side of the L-shaped support base (702), the output end of the second flip motor (701) is connected to a second movable flap (707), and one side of the second movable flap (707) is connected to a fourth magnetic fixing plate (704), and the bottom of the fourth magnetic fixing plate (704) is connected to a fifth magnetic fixing plate (705), and one end of the fifth magnetic fixing plate (705) is connected to a sixth magnetic fixing plate (706).

7. A circuit board semiconductor welding positioning device according to claim 6, characterized in that: Partial positions on the surfaces of the fourth magnetic fixing plate (704), the fifth magnetic fixing plate (705) and the sixth magnetic fixing plate (706) have magnetic attraction, and the fourth magnetic fixing plate (704), the fifth magnetic fixing plate (705) and the sixth magnetic fixing plate (706) can fix special-shaped circuit boards of different shapes by splicing; Wherein, a manual wrench (703) is installed at one end of the second flip motor (701), and the manual wrench (703) can be used to manually open and close the second flip motor (701) in an emergency.

8. A circuit board semiconductor welding positioning device according to claim 1, characterized in that: The top end of the fixed top plate (1) is inlaid with a limiting slide groove (12), the top end of the fixed top plate (1) is installed with a connecting angle steel (11), and the bottom end of the connecting angle steel (11) is provided with a slider that slides in the limiting slide groove (12), the bottom end of the fixed top plate (1) is installed with a vertical telescopic rod (2), and the output end of the vertical telescopic rod (2) is installed with a second welding electric soldering iron (10), Wherein, the bottom end of the connecting angle steel (11) is equipped with an inclined telescopic rod (3), and the output end of the inclined telescopic rod (3) is equipped with a third soldering iron (14). A hollow support rod (13) is fixed at the connection between the fixed top plate (1) and the main machine bottom plate (4).

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