A semiconductor processing and testing tool that is easy to pick up

Abstract

The present invention discloses a semiconductor processing and testing tooling that is convenient for taking out parts, relates to the field of semiconductor processing and testing, and includes a first feeding mechanism, wherein the first feeding mechanism includes a connecting block and a first box body is fixed on the side of the connecting block, and four groups of screw rods are installed inside the first box body through bearings, and the four groups of screw rods are threadedly connected to a lifting platform, and a fourth gear is fixed at the bottom of two groups of screw rods, and these two groups of screw rods are connected to the other two groups of screw rods by setting a second pulley assembly. The present invention sets a first feeding mechanism, and when a second motor drives the first feeding mechanism to rotate, the lifting platforms in the boxes on both sides drive the height of the storage box to rise one by one, so that the working height of the robot arm taking out and putting back remains unchanged, thereby saving the time consumed by frequent lifting and lowering, until all the wafers in the first storage box in the first box body are moved to the second storage box in the second box body.

Description

Technical Field

[0001] The invention relates to the field of semiconductor processing and testing, and in particular to a semiconductor processing and testing tooling which is convenient for taking out parts. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. From the idea to the final deliverable product, semiconductor chips need to go through chip production, chip packaging and chip testing. Among them, semiconductor chips need to undergo CP testing, i.e. wafer testing. Wafer testing is between wafer manufacturing and packaging in the entire chip production process. Wafer testing can find defective products before product packaging, thereby improving the yield rate before leaving the factory.

[0003] The wafer test of semiconductor chips requires a probe station, which can perform electrical tests on the surface of the wafer to determine the performance and reliability of the chip, so as to judge whether it is good or not. The test process also requires the use of a loading and unloading robot, which consists of two arms with the same function. One arm is responsible for grabbing untested wafers from the storage box to the probe station for testing, and the other is responsible for grabbing the tested wafers on the probe station and placing them in the storage box. The robot can realize functions such as grabbing, steering and lifting through computer program control. Wafers are usually stored in wafer storage boxes, and multiple wafers can be placed in the storage box at the same time. Wafers are placed in the storage box, and one or two spaces at the bottom usually do not contain wafers. There is a certain gap between the wafers. The arm claw starts to grab and inspect the bottom wafer in the storage box, and then the inspected wafers are placed in the space at the bottom of the storage box. In this way, there are one or two spaces between the uninspected wafers and the inspected wafers, so that workers can distinguish the inspection progress. With the progress of the inspection, the number of uninspected wafers at the top gradually decreases, while the number of inspected wafers at the bottom increases. When all the wafers in a storage box have been inspected, the storage box is loaded and unloaded manually or by another intelligent robot.

[0004] In actual wafer testing, as the number of inspected wafers in the storage box increases and the number of uninspected wafers decreases, the height of the robot's grasping will gradually rise from the bottom of the storage box to the top of the storage box. Each wafer needs to go through the two processes of "taking out" and "putting back". In order to improve the recognition, we usually reserve one or two spaces in the storage box for the inspected and uninspected parts, which makes the robot "put back" the inspected ones, and then raise the height of one or two spaces to "take out" the uninspected ones. The frequent lifting of the robot not only increases the wear and tear of the equipment, but also wastes a lot of time in the process of "taking out" and "putting back". If this part of the working time is reduced or omitted, the efficiency of detection can be improved. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a semiconductor processing and testing tool that is easy to remove components, so as to solve the technical problems mentioned in the above background.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor processing and testing tooling that is convenient for picking up parts, comprising a workbench, a robotic arm, a testing table, a first storage box, a second storage box and a wafer, a driving mechanism is installed on the top of the workbench, and the driving mechanism includes a turntable, and a first base is fixed on the top of the turntable, a first transmission shaft is installed inside the first base through a bearing, and a first loading mechanism is installed on the top of the first transmission shaft, and a second motor is connected to the bottom of the first transmission shaft, a first gear is fixed to the outside of the first base, the first loading mechanism includes a connecting block and a first box body is fixed on the side of the connecting block, and four groups of screw rods are installed inside the first box body through bearings, the four groups of screw rods are threadedly connected to a lifting platform, and fourth gears are fixed to the bottoms of two of the groups of screw rods, and these two groups of screw rods are transmission-connected to the other two groups of screw rods by setting a second pulley assembly.

[0007] By adopting the above technical scheme, by setting the first loading mechanism, when the second motor drives the first loading mechanism to rotate, during the rotation process, the fourth gear, the first gear and the second pulley assembly at the bottom of the first box body are driven, so that the height of the lifting platform in the boxes on both sides rises and is correlated with the rotation of the first loading mechanism. The robot arm starts to take out the top wafer in the first storage box in the first box body, and then the first loading mechanism rotates 180 degrees to change the positions of the two boxes, and the detected wafer is placed in the top grid of the second storage box in the second box body. As the detection proceeds and the first loading mechanism rotates, the lifting platforms in the boxes on both sides drive the height of the storage boxes to rise grid by grid, which makes the working height of the robot arm taking out and putting back remain unchanged, thereby saving the time consumed by frequent lifting, until all the wafers in the first storage box in the first box body are moved to the second storage box in the second box body. At this time, the storage boxes in the boxes on both sides are raised to the top of the box body with the lifting platform, which is more convenient for manual picking of the storage boxes.

[0008] The present invention is further configured such that four groups of positioning blocks are fixed on the top of the lifting platform, and a first material storage box is engaged in the four groups of positioning blocks, and multiple groups of wafers are installed inside the first material storage box, and the first gear and the fourth gear are meshed with each other.

[0009] By adopting the above technical solution and arranging four groups of positioning blocks on the lifting platform, the first material storage box installed inside is made more stable.

[0010] The present invention is further configured such that the connecting block is fixed to the top of the first transmission shaft, and a second box body is fixed to the side of the connecting block, and a screw rod, a lifting platform, a positioning block, a fourth gear and a second pulley assembly are also arranged in the second box body.

[0011] By adopting the above technical solution and setting up a second box, the inspected wafers can be stored in the second storage box in the second box, ensuring that the uninspected wafers and the inspected wafers are always at the same height.

[0012] The present invention is further configured such that a second material storage box is provided in the second box body.

[0013] By adopting the above technical solution and providing a second storage box, the inspected wafers can be stored in the second storage box.

[0014] The present invention is further configured such that a second base is fixed on the top of the turntable, a second transmission shaft is installed inside the second base through a bearing, a first gear is fixed outside the second transmission shaft, and a second gear is fixed at the bottom of the second transmission shaft.

[0015] By adopting the above technical solution, the second feeding mechanism can be installed by setting up the second transmission shaft.

[0016] The present invention is further configured such that a metal rod is installed at the bottom of the turntable through a bearing, and a third gear is fixed to the outside of the metal rod, and the third gear and the second gear are meshed with each other, the metal rod and the second motor are transmission connected by setting a first pulley assembly, and a first motor is set at the bottom of the turntable.

[0017] By adopting the above technical solution, by setting the third gear, and by the third gear and the second gear meshing with each other, the motor can drive the first transmission shaft to rotate and drive the second transmission shaft in the opposite direction at the same time.

[0018] The present invention is further configured such that a second feeding mechanism is installed on the top of the second transmission shaft, and the second feeding mechanism has the same structure as the first feeding mechanism.

[0019] By adopting the above technical solution, the second feeding mechanism and the first feeding mechanism are set to be used alternately to realize double-station work, so that loading and unloading can be carried out simultaneously with detection.

[0020] The present invention is further configured such that the first material storage box and the second material storage box have the same structure.

[0021] By adopting the above technical solution and arranging the first material storage box and the second material storage box to have the same structure, the first material storage box becomes an empty box and is used as the second material storage box after detection.

[0022] The present invention is further configured such that the robotic arm consists of two robotic arms.

[0023] By adopting the above technical solution, the detection efficiency can be increased by setting the robotic arm to be a robotic arm composed of two robotic arms, one of which is responsible for loading and the other is responsible for unloading.

[0024] In summary, the present invention mainly has the following beneficial effects:

[0025] The present invention is provided with a first loading mechanism, when the second motor drives the first loading mechanism to rotate, during the rotation process, the fourth gear at the bottom of the first box body, the first gear and the second pulley assembly are driven so that the height of the lifting platforms in the boxes on both sides rises and is correlated with the rotation of the first loading mechanism, the mechanical arm starts to take out the wafer at the top of the first storage box in the first box body, and then the first loading mechanism rotates 180 degrees to change the positions of the two boxes, and the detected wafer is placed in the top grid of the second storage box in the second box body. With the progress of the detection and the rotation of the first loading mechanism, the lifting platforms in the boxes on both sides drive the height of the storage boxes to rise grid by grid, which makes the working height of the mechanical arm taking out and putting back remain unchanged, thereby saving the time consumed by frequent lifting, until the wafers in the first storage box in the first box body are all moved to the second storage box in the second box body, at this time, the storage boxes in the boxes on both sides are all raised to the top of the boxes along with the lifting platform, which is more convenient for manual picking of the storage boxes.

[0026] The present invention sets a turntable, and the turntable rotates one hundred and eighty degrees under the drive of the first motor, so that the first feeding mechanism and the second feeding mechanism can be used alternately to realize a double working position, wherein when the first feeding mechanism is detecting, the second feeding mechanism can remove the material storage box and fill a new material storage box. Because the lifting platform is in the upper position when the first feeding mechanism or the second feeding mechanism completes the detection, the second gear, the third gear and the first pulley assembly are set at the bottom of the first feeding mechanism and the second feeding mechanism to make their transmission directions opposite. When the first feeding mechanism rises to feed, the second feeding mechanism descends to collect the material, so that the equipment can continue to work and will not stop due to the replacement of the material storage box. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 It is a connection diagram of the first feeding mechanism, the second feeding mechanism and the driving mechanism of the present invention;

[0029] Figure 3 It is a schematic diagram of the driving mechanism structure of the present invention;

[0030] Figure 4It is a schematic diagram of the driving mechanism structure of the present invention;

[0031] Figure 5 It is a structural schematic diagram of the first feeding mechanism of the present invention;

[0032] Figure 6 It is a structural schematic diagram of the second feeding mechanism of the present invention;

[0033] Figure 7 It is a schematic diagram of the first box structure of the present invention;

[0034] Figure 8 This is a schematic diagram of the connection between the first box and the screw rod of the present invention;

[0035] Fig. 9 It is a schematic diagram of the connection between the first box body, the screw rod and the lifting platform of the present invention;

[0036] Fig.10 It is a schematic diagram of the connection between the lifting platform and the positioning block of the present invention;

[0037] Fig.11 It is a schematic diagram of the installation of the first material storage box and wafers of the present invention.

[0038] In the figure: 1. workbench; 2. driving mechanism; 3. first loading mechanism; 4. second loading mechanism; 5. robotic arm; 6. testing platform; 7. first storage box; 8. second storage box; 9. wafer; 201. first motor; 202. turntable; 203. first base; 204. second base; 205. first transmission shaft; 206. second transmission shaft; 207. first gear; 208. second motor; 209. second gear; 210. metal rod; 211. third gear; 212. first pulley assembly; 301. connecting block; 302. first box body; 303. second box body; 304. lead screw; 305. lifting platform; 306. positioning block; 307. fourth gear; 308. second pulley assembly. DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] The following describes an embodiment of the present invention based on its overall structure.

[0041] A semiconductor processing and testing tooling that is convenient for taking out parts, such as Figure 1-11As shown, it includes a workbench 1, a robot arm 5, a detection table 6, a first material storage box 7, a second material storage box 8 and a wafer 9. A driving mechanism 2 is installed on the top of the workbench 1. The driving mechanism 2 can provide power for the first loading mechanism 3 and the second loading mechanism 4, and the first loading mechanism 3 and the second loading mechanism 4 are rotated to be used alternately. The driving mechanism 2 includes a turntable 202, and a first base 203 is fixed on the top of the turntable 202. A first transmission shaft 205 is installed inside the first base 203 through a bearing, and the first loading mechanism 3 is installed on the top of the first transmission shaft 205. The bottom of the first transmission shaft 205 is connected to a second motor 208. The second motor 208 can be provided for The first loading mechanism 3 provides power, and a first gear 207 is fixed to the outside of the first base 203. The first loading mechanism 3 includes a connecting block 301 and a first box body 302 is fixed to the side of the connecting block 301, and four groups of screw rods 304 are installed inside the first box body 302 through bearings, and the four groups of screw rods 304 are threadedly connected to a lifting platform 305, and the bottoms of two groups of screw rods 304 are fixed with fourth gears 307, and these two groups of screw rods 304 are connected to the other two groups of screw rods 304 by setting a second pulley assembly 308. By setting the first loading mechanism 3, the wafer 9 is at the same height before and after detection, which reduces the frequent lifting of the robot arm 5 and improves work efficiency.

[0042] See also Fig.10 Four groups of positioning blocks 306 are fixed on the top of the lifting platform 305, and the first storage box 7 is engaged in the four groups of positioning blocks 306, and multiple groups of wafers 9 are installed inside the first storage box 7. The first gear 207 and the fourth gear 307 are meshed with each other. By arranging four groups of positioning blocks 306 on the lifting platform 305, the first storage box 7 installed inside is more stable.

[0043] See also Figure 5 The connecting block 301 is fixed to the top of the first transmission shaft 205, and the second box body 303 is fixed to the side of the connecting block 301, and the second box body 303 is also provided with a screw 304, a lifting platform 305, a positioning block 306, a fourth gear 307 and a second pulley assembly 308. By setting the second box body 303, the inspected wafers 9 can be stored in the second storage box 8 in the second box body 303, ensuring that the uninspected wafers 9 and the inspected wafers 9 are always at the same height.

[0044] See also Figure 5 A second material storage box 8 is provided in the second box body 303 . By providing the second material storage box 8 , the detected wafers 9 can be stored in the second material storage box 8 .

[0045] See also Figure 3 and Figure 4A second base 204 is fixed on the top of the turntable 202, and a second transmission shaft 206 is installed inside the second base 204 through a bearing, and a first gear 207 is fixed on the outside of the second transmission shaft 206, and a second gear 209 is fixed on the bottom of the second transmission shaft 206. The second transmission shaft 206 can be used to install the second feeding mechanism 4 by setting it.

[0046] See also Figure 4 A metal rod 210 is installed at the bottom of the turntable 202 through a bearing, and a third gear 211 is fixed to the outside of the metal rod 210, and the third gear 211 is meshed with the second gear 209. The metal rod 210 and the second motor 208 are connected by a first pulley assembly 212. A first motor 201 is provided at the bottom of the turntable 202. By providing the third gear 211 and meshing the third gear 211 and the second gear 209, the motor can drive the first transmission shaft 205 to rotate while driving the second transmission shaft 206 in the opposite direction.

[0047] See also Figure 2 A second feeding mechanism 4 is installed on the top of the second transmission shaft 206, and the second feeding mechanism 4 has the same structure as the first feeding mechanism 3. By arranging the second feeding mechanism 4 and the first feeding mechanism 3 for alternating use, double-station work is realized, and loading and unloading can be performed while testing.

[0048] See also Figure 2 The first material storage box 7 and the second material storage box 8 have the same structure. By setting the first material storage box 7 and the second material storage box 8 to have the same structure, the first material storage box 7 becomes an empty box and is used as the second material storage box 8 after the detection.

[0049] See also Figure 1 The robot arm 5 is composed of two manipulators. By setting the robot arm 5 as a robot arm composed of two manipulators, one of which is responsible for loading and the other is responsible for unloading, the detection efficiency can be accelerated.

[0050] The working principle of the present invention is as follows: when the wafer 9 needs to be tested, the robot arm 5 is started, and the robot arm 5 first takes the first wafer 9 from the first loading mechanism 3 from top to bottom and places it on the detection table 6 for detection, and then the second motor 208 is started to drive the first transmission shaft 205 to rotate, and then drives the connecting block 301 to rotate 360 ​​degrees, so that the fourth gear 307 and the first gear 207 at the bottom of the first box body 302 and the second box body 303 are meshed and transmitted, and the second pulley assembly 308 is used to transmit the four sets of screw rods 304 to rotate. According to the screw rod principle, when the screw rod 304 rotates, the lifting platform 305 starts to rise, and the first loading mechanism 3 rotates 360 degrees, corresponding to the lifting platforms 305 on both sides rising one grid height, and the lifting platform The height of 305 rising by one grid is the distance between the two wafers 9 in the first storage box 7. When the first storage box 7 rises by one grid along with the lifting platform 305, the height of the first storage box 7 rises, and the second wafer 9 placed from top to bottom inside it rises to the height of the original first wafer 9. At the same time, the lifting platform 305 in the second box body 303 also rises by one grid and drives the second storage box 8 to rise. When the first loading mechanism 3 rotates 360 degrees, the first box body 302 of the first loading mechanism 3 is still facing the robot arm 5. The robot arm 5 is at the same height again to pick up the second wafer 9 for testing, and then the robot arm 5 will take down the first wafer 9 that has been tested before placing the second wafer 9 on the inspection table 6. During this process, the second motor 208 is started to drive the first loading mechanism 3 to rotate 180 degrees again. During this rotation process, the first box 302 and the lifting platform 305 in the second box 303 rise together by 0.5 grids, so that the second box 303 faces the direction of the robot arm 5. At this time, the first loading mechanism 3 rotates a total of 540 degrees, and the lifting platform 305 and the second storage box 8 in the second box 303 rise a total of 1.5 grids, which is still consistent with the working height of the robot arm 5. The robot arm 5 places the first wafer 9 into the second storage box 8 in the second box 303 from top to bottom in the first grid, and the detection process continues. The first loading mechanism 3 rotates 180 degrees again to make the first box 302 face the robot arm 5. The first loading mechanism 3 rotates a total of 7 20 degrees, the lifting platform 305 in the first box 302 and the first storage box 7 rise by 2 grids, and the robot 5 takes the third wafer 9 for testing, and works in this reciprocating manner until all the wafers 9 in the first storage box 7 in the first box 302 in the first loading mechanism 3 are tested and all are moved to the second storage box 8 in the second box 303. At this time, the lifting platforms 305 in the first box 302 and the second box 303 are both risen to the top. It should be noted that there is a height difference of 1.5 grids between the starting heights of the lifting platforms 305 in the first box 302 and the second box 303. During the feeding process of the first loading mechanism 3, the robot 5 is always at the same level to work, which reduces the time of frequent rising and improves work efficiency.

[0051] At the same time, the second loading mechanism 4 is loaded and unloaded manually or by a loading robot. During the rotation of the first motor 201, the metal rod 210 and the third gear 211 are driven to rotate through the first pulley assembly 212, and then the third gear 211 drives the second gear 209 to rotate, so that the second transmission shaft 206 drives the second loading mechanism 4 to rotate, and the transmission directions of the second loading mechanism 4 and the first loading mechanism 3 are opposite. During the operation of the second motor 208, the lifting platform 305 of the second loading mechanism 4 gradually descends. When the first loading mechanism 3 completes the rising and supplying, and the second loading mechanism 4 completes the descending, the first motor 201 is driven to drive the turntable 202 to rotate 180 degrees, so that the positions of the first loading mechanism 3 and the second loading mechanism 4 are changed, so as to realize fast loading and unloading, shorten the time for equipment material replacement, and improve the detection efficiency.

[0052] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A semiconductor processing and testing tool for facilitating the retrieval of components, comprising a workbench (1), a robotic arm (5), a testing table (6), a first material storage box (7), a second material storage box (8) and a wafer (9), characterized in that: A driving mechanism (2) is installed on the top of the workbench (1), and the driving mechanism (2) comprises a turntable (202), and a first base (203) is fixed on the top of the turntable (202), a first transmission shaft (205) is installed inside the first base (203) via a bearing, a first feeding mechanism (3) is installed on the top of the first transmission shaft (205), and a second motor (208) is connected to the bottom of the first transmission shaft (205), and a first gear (207) is fixed outside the first base (203). The first feeding mechanism (3) comprises a connecting block (301) and a first box body (302) is fixed to a side of the connecting block (301), and four groups of screw rods (304) are installed inside the first box body (302) via bearings, the four groups of screw rods (304) are threadedly connected to a lifting platform (305), and fourth gears (307) are fixed to the bottoms of two groups of screw rods (304), and these two groups of screw rods (304) are transmission-connected to the other two groups of screw rods (304) by setting a second pulley assembly (308); The connecting block (301) is fixed to the top of the first transmission shaft (205), and a second box (303) is fixed to the side of the connecting block (301), and a screw rod (304), a lifting platform (305), a positioning block (306), a fourth gear (307) and a second pulley assembly (308) are also arranged in the second box (303); A second base (204) is fixed on the top of the turntable (202), a second transmission shaft (206) is installed inside the second base (204) via a bearing, a first gear (207) is fixed outside the second transmission shaft (206), and a second gear (209) is fixed at the bottom of the second transmission shaft (206); A metal rod (210) is installed at the bottom of the turntable (202) via a bearing, a third gear (211) is fixed to the outside of the metal rod (210), and the third gear (211) and the second gear (209) are meshed with each other. The metal rod (210) and the second motor (208) are connected in transmission via a first pulley assembly (212), and a first motor (201) is provided at the bottom of the turntable (202).

2. The semiconductor processing and testing tooling for facilitating the removal of components according to claim 1, characterized in that: Four groups of positioning blocks (306) are fixed on the top of the lifting platform (305), and a first material storage box (7) is engaged in the four groups of positioning blocks (306), and a plurality of groups of wafers (9) are installed inside the first material storage box (7), and the first gear (207) and the fourth gear (307) are meshed with each other.

3. The semiconductor processing and testing tooling for facilitating the removal of components according to claim 2, characterized in that: A second material storage box (8) is arranged in the second box body (303).

4. The semiconductor processing and testing tooling for facilitating the removal of components according to claim 3, characterized in that: A second feeding mechanism (4) is installed on the top of the second transmission shaft (206), and the second feeding mechanism (4) has the same structure as the first feeding mechanism (3).

5. The semiconductor processing and testing tooling for facilitating the removal of components according to claim 4, characterized in that: The first material storage box (7) and the second material storage box (8) have the same structure.

6. The semiconductor processing and testing tool for facilitating component removal according to claim 1, characterized in that: The mechanical arm (5) is composed of two mechanical arms.

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