Transmission system, transmission cavity system and control method thereof

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and provides a transmission system, a transmission chamber system and a control method thereof to improve the film forming quality of a substrate. The transmission chamber system comprises: a transmission chamber, a cooling unit, a lifting unit and a manipulator; the transmission chamber comprises a bottom wall, a top wall opposite to the bottom wall and a side wall extending between the bottom wall and the top wall; the side wall is configured to be connected to the process chamber or the loading chamber; the cooling unit, the lifting unit and the manipulator are all arranged inside the transmission chamber; the cooling unit is supported in the transmission chamber, the cooling unit is configured to cool the substrate, the lifting unit is configured to place the substrate in the cooling unit or lift the substrate located in the cooling unit; the manipulator is configured to transfer the substrate between the loading chamber, the lifting unit and the process chamber.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a transmission cavity system, a transmission system and a control method of the transmission cavity system. Background Art

[0002] In order to increase the substrate processing speed, a transmission system integrating a front-end transmission module, a loading chamber (Load Lock, LL), a transmission chamber (Wafer Handling Chamber, WHC) and a processing chamber (Processing Chamber) is often used.

[0003] The substrate is transferred to the loading chamber through the front-end transfer module, and then transferred to the transfer chamber; subsequently, the robot located in the transfer chamber transfers the substrate to the processing chamber for epitaxy or other processing; after the processing is completed, the robot located in the transfer chamber transfers the substrate to the loading chamber, and then transferred to the front-end transfer module.

[0004] The inventors noticed that during the substrate processing (e.g., during the epitaxial reaction), the temperature in the processing chamber and on the substrate is relatively high (e.g., during the epitaxial reaction, the surface temperature of the substrate is close to 700° C.). When the processed substrate is transferred from the processing chamber to the transfer chamber and the loading chamber, the surface temperature of the substrate is still very high, and the moisture in the air around the substrate is very likely to react with the thin film on the substrate, resulting in reduced quality of the thin film on the substrate surface. Summary of the invention

[0005] The object of the present invention is to provide a transmission system, a transmission chamber system and a control method thereof, so as to timely cool the substrate in the transmission chamber to improve the film forming quality of the substrate.

[0006] In a first aspect, the present invention provides a transfer chamber system for transferring a substrate between a loading chamber and a process chamber, characterized in that it comprises: a transfer chamber, a cooling unit and a robot; the transfer chamber comprises a bottom wall, a top wall opposite to the bottom wall and a side wall extending between the bottom wall and the top wall; the side wall is configured to be connected to the process chamber or the loading chamber; the cooling unit and the robot are both arranged inside the transfer chamber; the cooling unit is supported in the transfer chamber, and the cooling unit is configured to cool the substrate; the robot is configured to transfer the substrate between the loading chamber and the process chamber.

[0007] Optionally, the bottom wall includes a bottom wall body and a lifting wall portion; the lifting wall portion includes a vertical surface extending between an upper surface of the bottom wall body and an upper surface of the lifting wall portion; and the upper surface of the lifting wall portion is higher than the upper surface of the bottom wall body.

[0008] Optionally, an escape space is provided in the transfer chamber, and the escape space is surrounded by at least the facade, the bottom wall and the side wall; the cooling unit is located between the escape space and the loading chamber; the space required for the robot to carry the substrate and rotate in situ for one circle is the in-situ belt rotation zone; the outline of the in-situ belt rotation zone has a shortest distance D to the inner wall surrounding the escape space, and the shortest distance D is greater than 0.

[0009] Optionally, the shortest distance D is between the rotation center of the manipulator and the center of the cooling unit.

[0010] Optionally, the shortest distance D is 8-12 mm.

[0011] Optionally, the cooling unit is mounted on the upper surface of the lifting wall portion.

[0012] Optionally, when the manipulator is extended toward the loading chamber, the distance between the lower surface of the extended portion of the manipulator and the top end area of ​​the cooling unit is 8-12 mm.

[0013] Optionally, the cooling unit includes a cooling platform, and a peripheral side surface of the cooling platform is circumscribed to the avoidance space.

[0014] Optionally, the number of the cooling units is set to at least 2; each of the cooling units includes a cooling table; and the rotation center of the manipulator is located on a perpendicular bisector of a line connecting the centers of two cooling tables.

[0015] Optionally, the two cooling platforms are respectively the first cooling platform and the second cooling platform; starting from the rotation center of the manipulator, two extension lines are extended toward the center of the first cooling platform and the center of the second cooling platform respectively, and the angle between the two extension lines is α, and the value range of α is 35° to 45°.

[0016] Optionally, the side wall includes a first side wall, a second side wall and a connecting side wall; the connecting side wall is arranged between the first side wall and the second side wall; the first side wall is connected to the loading chamber; the second side wall is connected to the process chamber; the facade, the upper surface of the bottom wall body and the second side wall enclose the avoidance space.

[0017] Optionally, the lifting unit is located between the first side wall, the connecting side wall and the cooling unit; the connecting side wall is detachably connected with an observation window; and the observation window is at least partially made of a transparent material.

[0018] Optionally, the number of the first side walls is N, and the center of each first side wall is tangent to a cylindrical surface, and the cylindrical surface has the rotation center of the manipulator as its axis.

[0019] Optionally, two first side walls are provided; each of the first side walls is connected to a loading chamber; each of the loading chambers contains a film placement space; with the rotation center of the manipulator as the starting point, extension lines are drawn to the centers of the two film placement spaces respectively; the angle between the two extension lines is β, and the value range of β is 25° to 40°.

[0020] In a second aspect, the present invention provides a transfer system, comprising a loading port, a front-end transfer module, a loading chamber, a process chamber, and a transfer chamber system as described in any one of the first aspects.

[0021] In a third aspect, the present invention provides a control method for a transfer chamber system, which is used to control the transfer chamber system as described in the first aspect, including: S1, controlling the robot to take the substrate from the loading chamber and transfer the substrate to the process chamber for processing; S2, controlling the lifting unit to rise to a first station; S3, controlling the robot to take the processed substrate out of the process chamber and place it on the lifting unit; S4, the lifting unit descends to a second station, and places the substrate on the cooling unit for cooling; S5, after the cooling of the substrate is completed, controlling the lifting unit to drive the substrate to rise to the first station; S6, after the robot takes the substrate, the lifting unit descends to the second station; S7, controlling the robot to transfer the cooled substrate to the loading chamber.

[0022] The beneficial effect of the transfer chamber system of the present invention is that in order to address the situation in which film quality problems may be caused by high temperature during the process of transferring the substrate from the process chamber to the transfer chamber and the loading chamber after high-temperature treatment, the present invention adds a cooling unit in the transfer chamber, which can quickly cool the substrate after high-temperature treatment, effectively preventing unnecessary chemical reactions between the film on the surface of the substrate and moisture in the surrounding air, thereby significantly improving the quality and stability of the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a first embodiment of the transmission system provided by the present invention;

[0024] Figure 2 A schematic diagram of a second embodiment of the transmission system provided by the present invention;

[0025] Figure 3 A schematic diagram of a third embodiment of the transmission system provided by the present invention;

[0026] Figure 4 A top cross-sectional schematic diagram of a transmission system provided by the present invention ( Figure 4 Only two process chambers are shown, and it should be understood that each second sidewall can be connected to a process chamber);

[0027] Figure 5 A schematic diagram of the structure of an avoidance space provided by the present invention;

[0028] Figure 6 A schematic diagram of a cross-sectional (longitudinal) structure of a transmission chamber provided by the present invention;

[0029] Figure 7 A schematic diagram of the structure of a cooling platform provided by the present invention with embedded support beads;

[0030] Figure 8 A partial cross-sectional schematic diagram of a transmission chamber provided with an inner sealing ring and an outer sealing ring provided by the present invention;

[0031] Fig. 9 A schematic structural diagram of a lifting unit, a transmission assembly and a cooling unit provided by the present invention;

[0032] Fig.10 The present invention provides Figure 6 The enlarged structural diagram at A in the middle;

[0033] Fig.11 A schematic flow chart of a control method for a transmission cavity system provided by the present invention (which can also be understood as a control method for a transmission system). DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0035] In view of the problems existing in the prior art, the present invention Figure 1 In the first embodiment shown, a transfer chamber system is provided for transferring a substrate 4 between a loading chamber and a process chamber.

[0036] Figure 1 A transfer system 100 is shown in the figure, which includes a loading port 101, a front-end transfer module 102, a loading chamber (801, 802), a transfer chamber system and a process chamber (corresponding to 105 in the figure).

[0037] The loading port 101 is used to place the substrate box. The first end of the front-end transmission module 102 is connected to the loading port 101, and the second end of the front-end transmission module 102 is connected to the loading chamber. A front-end manipulator (not shown in the figure) is arranged in the front-end transmission module 102, and the front-end manipulator is used to load the substrate in the substrate box into the loading chamber, or to unload the substrate in the loading chamber into the substrate box. Exemplarily, four loading ports 101 are arranged at the first end of the front-end transmission module 102. There are two loading chambers. The first loading chamber 801 and the second loading chamber 802 are connected to the front-end transmission module 102 together.

[0038] The transmission chamber system includes: a transmission chamber 104. The transmission chamber 104 is provided with a manipulator 7, a cooling unit 6 and a lifting unit ( Figure 1 The cooling unit 6 is configured to cool the substrate 4, and the robot 7 is configured to move the substrate between the loading chamber and the lifting unit ( Figure 1 ) and transferring the substrate 4 between process chambers.

[0039] The transfer chamber 104 includes a top wall (not shown), a bottom wall (not shown) opposite to the top wall, and a side wall extending between the top wall and the bottom wall. Figure 1 In the illustrated embodiment, the side wall includes a plurality of first side walls 501 (eg, 2) and a plurality of second side walls 502 (eg, 6).

[0040] The second side wall 502 has a first length, and the first side wall 501 has a second length, and the first length is greater than the second length.

[0041] exist Figure 1 In the illustrated embodiment, each first side wall 501 is connected to a loading chamber. Each loading chamber is used to load unprocessed substrates and processed substrates. Each second side wall 502 is connected to an epitaxial chamber 105 (i.e., Figure 1 In the embodiment shown, the process chamber is an epitaxial chamber. It should be understood that the epitaxial chamber is used to deposit an epitaxial layer on the surface of the substrate 4. Figure 1 In the illustrated embodiment, the transport system includes six epitaxial chambers 105. Each second sidewall 502 has a first length, which makes it possible to configure six epitaxial chambers 105 at the same time, and the transport system configured with six epitaxial chambers 105 has a large throughput and high productivity.

[0042] It should be understood that in other embodiments of the present invention, the epitaxial chamber 105 may be entirely or partially an atomic layer deposition chamber or other chemical vapor deposition chamber. Alternatively, the epitaxial chamber 105 may be entirely or partially an etching chamber.

[0043] In another specific embodiment, a first gate valve (not shown in the figure) is provided between the loading chamber and the front-end transfer module 102, and a second gate valve (not shown in the figure) is provided between the loading chamber and the transfer chamber 104. It should be understood that when the substrate 4 is transferred between the loading chamber and the front-end transfer module 102, the first gate valve is in an open state. When the substrate 4 is transferred between the loading chamber and the transfer chamber 104, the second gate valve is in an open state.

[0044] In some embodiments, when the epitaxial chamber 105 is in operation, both the transfer chamber 104 and the epitaxial chamber 105 are in a negative pressure state. The loading chamber is a transfer device for loading the substrate 4 from a normal pressure environment to a vacuum environment.

[0045] The loading of the substrate 4 from the front-end transfer module 102 to the transfer chamber 104 includes: first, the first gate valve is in an open state, and the substrate 4 is transferred to the loading chamber. Then, the first gate valve is in a closed state, and the vacuum pump connected to the loading chamber evacuates the loading chamber. When the substrate 4 needs to be loaded into the transfer chamber 104, the second gate valve is in an open state, and the robot 7 located in the transfer chamber 104 moves the substrate 4 into the transfer chamber. Then, the second gate valve is in a closed state.

[0046] like Figure 2 and Figure 3 As shown, in some embodiments of the present invention, part of the second side wall 502 in the transfer system 100 may also be connected to some auxiliary chambers (such as a pre-cleaning chamber), that is, correspondingly, the process chamber also includes a pre-cleaning chamber 103.

[0047] See Figure 2 In the second embodiment of the transmission system 100 of the present invention, the transmission chamber system is connected to a pre-cleaning chamber 103 and five epitaxial chambers 105 (that is, the corresponding transmission system 100 includes a pre-cleaning chamber 103 and five epitaxial chambers 105). The pre-cleaning chamber 103 is connected to a second side wall 502 adjacent to the first side wall 501.

[0048] See also Figure 3 In the third embodiment of the transmission system 100 of the present invention, the transmission chamber system is connected to two pre-cleaning chambers 103 and four epitaxial chambers 105 (that is, the corresponding transmission system 100 includes two pre-cleaning chambers 103 and four epitaxial chambers 105). The pre-cleaning chamber 103 is connected to the second side wall 502 adjacent to the first side wall 501.

[0049] The pre-cleaning chamber 103 is configured to clean the substrate 4 to be processed to reduce defects caused by impurities on the surface of the substrate 4 during subsequent processes. The pre-cleaning chamber 103 is integrated in the transport system, so that after the substrate 4 is cleaned, it enters the epitaxial chamber 105 (or other etching chambers, for example) through the transport chamber 104 for processing without being contaminated in the middle.

[0050] In some embodiments, the two pre-cleaning chambers 103 have a cleaning function for the same substance. In other embodiments, the two pre-cleaning chambers 103 may also have a cleaning function for different substances. For example, one of the pre-cleaning chambers, pre-clean1, uses fluorine radicals (Fradicals) to clean the surface oxides, such as silicon oxide (SiOx). The other pre-cleaning chamber, pre-clean2, uses hydrogen radicals (Hradicals) to clean the residual organic matter. This embodiment provides flexibility in pre-cleaning the surface of the substrate 4, and can support different application scenarios and different process requirements.

[0051] In some embodiments, see Figure 4 , two first side walls 501 are provided. Each first side wall 501 is connected to a loading chamber (801, 802). Each loading chamber contains a film placement space. The film placement space is used to store substrates. Taking the rotation center 701 of the robot 7 as the starting point, extension lines are made to the centers of the two film placement spaces respectively. The angle between the two extension lines is β, and the value range of β is 25° to 40°. Specifically, β takes a value of 25°, 30°, 35° or 40°. The center of the aforementioned film placement space corresponds to the center of the substrate stored there.

[0052] like Figure 1 and Figure 4 As shown, the space required for the robot 7 to carry the substrate and rotate in-situ for one circle is the in-situ strip rotation area 509. In some specific embodiments, the robot 7 is configured as a multi-stage robot arm. When the robot 7 rotates in the home position, the multi-stage robot arm is in a crouched state.

[0053] See also Figure 4 In some embodiments of the present invention, a clearance space 507 is provided in the transfer chamber 104. The in-situ belt rotation zone 509 is located in the clearance space 507, and the cooling unit 6 is located outside the clearance space 507. This makes it possible for the robot belt to rotate without interfering with the cooling unit 6, thereby enabling the robot 7 to rotate to the destination at the minimum angle without having to go around to the destination in the opposite direction, which is beneficial to improving the substrate processing efficiency of the system. The aforementioned destination may be a loading chamber or a process chamber 9. Exemplarily, the shortest path may be a clockwise rotation path or a counterclockwise rotation path.

[0054] In some embodiments, the cooling unit 6 is located between the avoidance space 507 and the loading chamber (801, 802). This arrangement can improve the working efficiency of the transfer chamber system.

[0055] In some embodiments, there is a shortest distance D between the contour of the in-situ belt rotation zone 509 and the inner wall of the avoidance space 507 . Obviously, the shortest distance is when D is greater than 0.

[0056] In some embodiments, the shortest distance D is between the rotation center 701 of the robot 7 and the center of the cooling unit 6 .

[0057] exist Figure 4 In the embodiment shown, in the circumferential direction of the avoidance space (or in the circumferential direction of the in-situ strip rotation zone 509), the shortest distance D exists within a range, which is: an extension line from the rotation center 701 of the manipulator 7 to the center of the first cooling stage 601, and an extension line from the rotation center 701 of the manipulator 7 to the center of the second cooling stage 602, and the acute angle area between the two extension lines. It should be understood that in this embodiment, the position of the shortest distance D also includes: the shortest distance D is located between the rotation center of the manipulator 7 and the center of the cooling unit 6.

[0058] In the present application, when the shortest distance D is described as being between the rotation center of the robot 7 and the center of the cooling unit 6, it means that there is a shortest distance D between the contour of the in-situ strip rotation area 509 and the inner wall enclosed by the avoidance space 507 (that is, there is a distance greater than the shortest distance D), and the shortest distance D is at least between the rotation center of the robot 7 and the center of the cooling unit 6. The center of the cooling unit 6 corresponds to the center of the substrate placed on the cooling table.

[0059] In some specific embodiments, the shortest distance is 8-12 mm. Exemplarily, the shortest distance is 8 mm. In another example, the shortest distance is 10 mm. In another example, the shortest distance is 12 mm. By setting the shortest distance D, this embodiment can effectively avoid collision when the manipulator 7 belt piece rotates, thereby improving production safety. When the shortest distance D is located between the rotation center 701 of the manipulator 7 and the center of the cooling unit 6, the structure of the avoidance space 507 is more compact.

[0060] In some other examples, the outer contour of the avoidance space 507 includes an arc-shaped cylinder. Figure 5, illustratively, the avoidance space 507 is surrounded by a first contour surface 5071, a second contour surface 5072, a third contour surface 5073 and a fourth contour surface 5074 which are arranged in a uniformly arc-shaped cylindrical surface. The two ends of the first contour surface 5071 are respectively connected to the second contour surface 5072 and the third contour surface 5073. The second contour surface 5072 and the third contour surface 5073 are both tangent to the fourth contour surface 5074. The second contour surface 5072 and the third contour surface 5073 are both used to wrap the cooling unit 6. The fourth contour surface 5074 is located on the centripetal side of the arc-shaped cylindrical surface where the first contour surface 5071 is located.

[0061] like Figure 1 and Figure 4 As shown, in some embodiments, the cooling unit 6 is configured as a cooling stage group. In the top view of the transmission system, the peripheral side of the cooling stage group is circumscribed to the avoidance space 507. Specifically, the number of cooling units 6 is set to at least 2. Each cooling stage group includes a cooling stage, and the peripheral side of the cooling stage is circumscribed to the avoidance space 507. More specifically, two cooling stages are provided in the transmission chamber 104, such as Figure 4 The first cooling stage 601 and the second cooling stage 602 in the figure. The rotation center 701 of the robot 7 is located on the vertical bisector of the center line of the first cooling stage 601 and the second cooling stage 602.

[0062] Please refer to Figure 4 In the illustrated embodiment, starting from the rotation center of the manipulator 7, two extension lines are extended toward the center of the first cooling stage 601 and the center of the second cooling stage 602 respectively, and the angle between the two extension lines is α, and the value range of α is 35° to 45°.

[0063] As described above, in some embodiments, the transfer chamber 104 includes a bottom wall, a top wall 504 opposite to the bottom wall, and a side wall extending between the bottom wall and the top wall 504. The side wall is configured to communicate with a process chamber or a loading chamber. Figure 6 and Figure 4 In some embodiments, the sidewall includes a first sidewall 501, a second sidewall 502, and a connecting sidewall 503. The connecting sidewall 503 is disposed between the first sidewall 501 and the second sidewall 502. The first sidewall 501 is connected to the loading chamber. The second sidewall 502 is connected to the process chamber.

[0064] like Figure 6 As shown, in some embodiments, the bottom wall includes a bottom wall body 505 and a raised wall portion 506. The raised wall portion 506 includes a vertical surface 515 extending between the upper surface of the bottom wall body 505 and the upper surface of the raised wall portion 506. The upper surface of the raised wall portion 506 is higher than the upper surface of the bottom wall body 505.

[0065] Specifically, the lifting wall portion 506 and the bottom wall body 505 are both located on the bottom side of the top wall 504. The vertical surface 515 extends from the upper surface of the bottom wall body 505 to the upper surface of the lifting wall portion 506, and the extension direction is perpendicular to the upper surface of the bottom wall body 505. The top surface of the lifting wall portion 506 is spaced 100mm-120mm from the top surface of the bottom wall body 505. In some examples, the top surface of the lifting wall portion 506 is spaced 100mm from the top surface of the bottom wall body 505. In other examples, the top surface of the lifting wall portion 506 is spaced 110mm from the top surface of the bottom wall body 505. In yet other examples, the top surface of the lifting wall portion 506 is spaced 120mm from the top surface of the bottom wall body 505.

[0066] In some embodiments, the cooling unit 6 is installed on the upper surface of the lifting wall 506. In this embodiment, by installing the cooling unit 6 on the upper surface of the lifting wall 506, the lifting distance of the lifting unit 1 can be shortened, which will reduce the lifting time of the lifting unit 1, and accordingly, it is beneficial to improve the substrate processing speed of the system.

[0067] In some embodiments, when the robot extends toward the loading chamber, the distance between the lower surface of the robot extension portion and the top surface of the cooling unit is 8-12 mm. For example, the distance between the lower surface of the robot extension portion and the top surface of the cooling unit is 8 mm, 10 mm or 12 mm.

[0068] In some embodiments, the facade 515 , the upper surface of the bottom wall body 505 , and the second side wall 502 enclose an escape space 507 .

[0069] In some embodiments, the connecting side wall 503 is movably connected with an observation window 508. The observation window 508 is at least partially made of a transparent material, so as to facilitate observation of the condition of the substrate on the lifting unit 1. In other embodiments, the top wall 504 is movably connected with an observation window, and the observation window on the top wall 504 corresponds to the position of the cooling stage in the transmission chamber, so as to facilitate observation of the condition of the substrate located on the cooling stage. In this embodiment, by providing an observation window, it is convenient to observe the state of the substrate in the transmission system 100 from the outside.

[0070] In a specific embodiment, the observation window 508 is detachably connected to the connecting side wall 503. In another specific embodiment, the observation window 508 is rotatably connected to the connecting side wall 503. In another specific embodiment, the observation window 508 is slidably connected to the connecting side wall 503. The various connection methods described in the foregoing paragraph are all active connections. The aforementioned active connection method makes the debugging and maintenance of the lifting unit 1 and the transmission assembly 2 simple. It is worth noting that the transparent material includes but is not limited to quartz.

[0071] Please refer to Figure 4 and Figure 6In some embodiments, the number of the first side walls 501 is N, and the center of each first side wall 501 is tangent to the cylindrical surface 510, and the cylindrical surface 510 takes the rotation center of the manipulator 7 as an axis. The aforementioned axis is perpendicular to the upper surface of the bottom wall body 505.

[0072] Specifically, the first loading chamber 801 and the second loading chamber 802 are both located outside the cylindrical surface 510. The connecting side wall 503 has a component along a radial line passing through the rotation center of the robot.

[0073] In some other specific embodiments, the first side wall 501 is perpendicular to the radial line of the cylindrical surface 510, and the radial line passes through the center of the area in the loading chamber for placing the substrate 4 (the area in the loading chamber for placing the substrate 4 corresponds to the wafer placing space mentioned above). Exemplarily, the center of the area for placing the substrate 4 is set to the center of the loading chamber.

[0074] In this embodiment, the center of the area for placing the substrate 4 in the loading chamber is on a concentric circle with the rotation center of the robot 7, so that the farthest point reached by the robot 7 coincides with the position of the area for placing the substrate 4 in the loading chamber, thereby achieving a compact structure of the transmission system 100.

[0075] It is worth noting that the cooling stage in the prior art is arranged in the loading chamber, and the loading chamber is also provided with an area for placing 1-2 substrates. The first cooling stage 601 and the second cooling stage 602 in the present embodiment are both arranged in the transmission chamber 104, and the number of substrates that can be accommodated in the loading chamber is set to multiple pieces, for example, 25 pieces. It can not only meet the cooling of the substrate, but also store multiple substrates at one time, thereby increasing the substrate throughput of the transmission system as a whole. In other embodiments of the present application, the maximum number of substrates that can be accommodated in the loading chamber can be any positive integer.

[0076] In some embodiments of the present invention, the epitaxial chamber 105 is detachably connected to the second sidewall 502. The loading chamber is detachably connected to the first sidewall 501.

[0077] In some embodiments of the present invention, the cooling stage is made of aluminum alloy material. A cooling liquid channel for circulating cooling liquid is provided in the cooling stage. Exemplarily, the temperature range of the cooling liquid is set at 15°C to 20°C. When the substrate 4 is placed on the cooling stage, the cooling stage cools the substrate 4, thereby preventing water vapor or impurities in the air from reacting on the surface of the high-temperature substrate 4 to cause surface defects of the substrate 4.

[0078] like Figure 7 As shown, in some embodiments, a plurality of support beads 605 are embedded at the top of the cooling stage 601, and the tops of the plurality of support beads 605 protrude from the top surface of the cooling stage 601. The substrate 4 is supported on the support beads 605 to reduce the contact between the substrate 4 and the cooling stage 601.

[0079] Specifically, the support beads 605 are made of ceramic, sapphire or quartz, and the number of the balls embedded on the upper surface of the cooling stage 601 is X, where X is any positive integer greater than 2. It is worth noting that the material of the balls can also be the same as that of the epitaxial layer.

[0080] like Figure 8 In the illustrated embodiment, the transmission chamber 104 is provided with an inner ring sealing ring 24 and an outer ring sealing ring 25. Specifically, the inner ring sealing ring 24 is provided on the side of the outer ring sealing ring 25 facing the cavity direction γ, and the inner ring sealing ring 24 and the outer ring sealing ring 25 are arranged concentrically. The side wall has a first groove 433 and a second groove 434. The first groove 433 and the second groove 434 are arranged concentrically. Exemplarily, the cross-sections of the first groove 433 and the second groove 434 are both trapezoidal. The inner ring sealing ring 24 is located in the first groove 433, and the outer ring sealing ring 25 is located in the second groove 434. In the illustrated embodiment, the inner ring sealing ring 24 and the outer ring sealing ring 25 are both set as O-rings.

[0081] After the top wall 504 abuts the side wall, the transfer chamber 104 is sealed. Figure 6 and Figure 8 , the bottom end surface of the top wall 504 abuts against the top end surface of the first side wall 501, and the vacuum device connected to the inside of the transfer chamber 104 can pump the inside of the chamber into a negative pressure state. The concentrically arranged inner ring sealing ring 24 and outer ring sealing ring 25 make the sealing effect of the transfer chamber 104 stronger, reduce the air leaking into the chamber, and thus, while ensuring the negative pressure environment of the chamber, it can also reduce the possibility of damage to the surface of the substrate 4 due to air contact with the high-temperature substrate 4. Thus, a higher quality film can be obtained. It should be understood that the sealing ring located between the top wall 504 and the side wall can be set as K concentrically arranged O-rings, K is any positive integer greater than 1.

[0082] like Figure 4 and Fig. 9 As shown, in other embodiments, a lifting unit 1 is further provided inside the transfer chamber 104. The lifting unit 1 is configured to place the substrate 4 on the cooling unit 6 or to lift the substrate 4 located in the cooling unit 6. In the illustrated embodiment, the lifting unit 1 is located between the first side wall 501, the connecting side wall 503 and the cooling unit 6.

[0083] Please refer to Fig. 9 In some embodiments, the lifting unit 1 includes a lifting member 110 and a plurality of supporting members 120. The lifting member 110 is arranged in a C shape. The plurality of supporting members 120 are distributed along the inner circumference of the lifting member 110 to support the substrate 4. Specifically, the lifting member 110 is arranged in a C shape with a central angle greater than 180°.

[0084] In some embodiments, the lifting unit 1 is disposed on the top side of the transmission assembly 2. The transmission assembly 2 is used to drive the lifting unit 1 to rise or fall. The transmission assembly 2 includes a top cover 204, a mounting plate 201, a lifting shaft 202, and a bellows assembly. The mounting plate 201 is detachably connected to the bottom wall. The mounting plate 201 has a through hole 54, and the through hole 54 longitudinally penetrates the mounting plate 201. The lifting shaft 202 passes through the through hole 54. The top end of the lifting shaft 202 is fixedly connected to the top cover 204. The top cover 204 is fixedly connected to the lifting unit 1. More specifically, Fig.10 In the illustrated embodiment, the upper surface of the top cover 204 is fixedly connected to the lifting unit 1. At least part of the bellows assembly is disposed in the wall hole 52 penetrating the bottom wall. The bellows assembly is fixedly connected between the top cover 204 and the mounting plate 201 to seal the wall hole 52.

[0085] It is worth noting that in this embodiment, at least part of the bellows assembly is disposed in the wall hole 52, which is disposed in the bottom wall and communicates the inside and outside of the chamber. One end of the bellows assembly is fixedly connected to the top cover 204, and the other end is fixedly connected to the mounting plate 201.

[0086] In some embodiments, the transmission assembly 2 further includes a linear drive 203. The linear drive 203 is connected to the bottom end of the lifting shaft 202. The linear drive 203 is used to drive the lifting shaft 202, the top cover 204 and the lifting unit 1 to rise or fall together, and the bellows group performs telescopic movement synchronously. Exemplarily, the linear drive 203 is set as an electric cylinder or a pneumatic cylinder.

[0087] In some embodiments, the aforementioned lifting unit 1 may not be provided in the transmission cavity system. Figure 1 As shown, the robot arm 7 is used to place the substrate 4 on the cooling unit 6 or take the substrate 4 from the cooling unit 6 .

[0088] like Fig.10 As shown, in some other specific embodiments, the wall hole 52, the top cover 204, the mounting plate 201, the lifting shaft 202 and the bellows group are coaxially arranged.

[0089] In some embodiments, the top cover 204, the bellows assembly, the mounting plate 201 and the lifting shaft 202 are integrally arranged.

[0090] In some embodiments, the bellows group includes at least one section of bellows. When the bellows are arranged in at least two sections, a guide ring is arranged between adjacent bellows. The guide ring is arranged coaxially with the bellows. The upper end of the guide ring is fixedly connected to the lower end of the bellows located on the upper side thereof, and the lower end of the guide ring is fixedly connected to the upper end of the bellows located on the lower side thereof.

[0091] In some specific embodiments, the bellows group is configured as one section of bellows.

[0092] In some other specific embodiments, the bellows is arranged into three sections from bottom to top. The bottom end of the first bellows 211 is fixedly connected to the mounting plate 201. A first guide ring 221 is provided between the first bellows 211 and the second bellows 212, the upper end of the first guide ring 221 is fixedly connected to the lower end of the second bellows 212, and the lower end of the first guide ring 221 is fixedly connected to the upper end of the first bellows 211. A second guide ring 222 is provided between the second bellows 212 and the third bellows 213. The lower end of the second guide ring 222 is fixedly connected to the upper end of the second bellows 212, and the upper end of the second guide ring 222 is fixedly connected to the lower end of the third bellows. The top end of the third bellows 213 is fixedly connected to the lower end of the top cover 204. When the lifting shaft 202 drives the top cover 204 to descend, the bellows group is folded. In some other embodiments, the guide ring can be slidably connected to the lifting shaft 202 to provide horizontal support for the bellows to prevent the bellows from contacting the wall hole 52 or the lifting shaft 202. In some other specific embodiments, the mounting plate 201 and / or the top cover 204 are provided with an annular protrusion on the side facing the bellows, and the side of the annular protrusion close to the bellows is fixedly connected to the bellows. This arrangement facilitates welding of the bellows and the mounting plate 201 / top cover 204.

[0093] In some embodiments, a first protective shell 301 and a second protective shell 302 are further included. The first protective shell 301 is fixed relative to the top cover 204. More specifically, the upper end of the first protective shell 301 is fixedly connected to the peripheral side of the top cover 204. The second protective shell 302 is fixed relative to the mounting plate 201. More specifically, the lower end of the second protective shell 302 is fixedly connected to the upper surface of the mounting plate 201. The first protective shell 301 and the second protective shell 302 are coaxially sleeved on the outside of the bellows group.

[0094] Specifically, there is always a gap between the first protective shell 301, the second protective shell 302, the lifting shaft 202 and the bellows assembly. This embodiment is conducive to reducing the wear of the bellows assembly and extending the service life of the bellows assembly. Preferably, the first protective shell 301 is sleeved on the outside of the second protective shell 302.

[0095] like Fig.11As shown, the second embodiment provides a control method for a transfer chamber system, which is used to control the transfer chamber system in the previous embodiment, including: S1, controlling the robot to take the substrate from the loading chamber and transfer the substrate to the process chamber for processing. S2, controlling the lifting unit to rise to the first station. S3, controlling the robot to take out the processed substrate from the process chamber and place it on the lifting unit. S4, after the robot leaves the lifting unit, the lifting unit descends to the second station, and places the substrate on the cooling unit for cooling. S5, after the cooling of the substrate is completed, controlling the lifting unit to drive the substrate to rise to the first station. S6, after the robot takes the substrate, the lifting unit descends to the second station. S7, controlling the robot to transfer the cooled substrate to the loading chamber.

[0096] It should be understood that, although the above description is made in the form of S1-S6, adjacent steps may be performed simultaneously or partially simultaneously without interfering with each other.

[0097] In some specific embodiments, S4 further includes: controlling the robot to take the substrate from the first process chamber and place it in the second process chamber. In other specific embodiments, before executing S1, it also includes: S0, controlling the second gate valve to open so that the transfer chamber is connected to the loading chamber.

[0098] In some specific embodiments, the number of loading chambers is set to 2, namely a first loading chamber and a second loading chamber. The substrate in the first loading chamber returns to the first loading chamber after undergoing S1-S6. The substrate in the second loading chamber returns to the second loading chamber after undergoing S1-S6.

[0099] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

[0100] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A transfer chamber system for transferring a substrate between a loading chamber and a process chamber, characterized in that: include: transfer chamber, cooling unit and manipulator; The transfer chamber comprises a bottom wall, a top wall opposite to the bottom wall, and a side wall extending between the bottom wall and the top wall; the side wall is configured to communicate with the process chamber or the loading chamber; The cooling unit and the manipulator are both arranged inside the transmission chamber; The cooling unit is supported by the transfer chamber, and the cooling unit is configured to cool the substrate; The robot is configured to transfer the substrate between the loading chamber and the process chamber; There is an escape space in the transmission chamber. The cooling unit is located between the avoidance space and the loading chamber; The space required for the robot to carry the substrate and rotate in situ for one circle is the in-situ strip rotation area; There is a shortest distance D between the contour of the in-situ belt blade rotation zone and the inner wall surrounding the avoidance space, and the shortest distance D is greater than 0.

2. The transmission cavity system according to claim 1, characterized in that: The shortest distance D is between the rotation center of the robot and the center of the cooling unit.

3. The transmission cavity system according to claim 1, characterized in that: The bottom wall comprises a bottom wall body and a lifting wall portion; The lifting wall portion includes a vertical surface extending between the upper surface of the bottom wall body and the upper surface of the lifting wall portion; the upper surface of the lifting wall portion is higher than the upper surface of the bottom wall body; The escape space is at least surrounded by the facade, the bottom wall and the side walls.

4. The transmission cavity system according to claim 1, characterized in that: The shortest distance D is 8-12 mm.

5. The transmission cavity system according to claim 3, characterized in that: The cooling unit is mounted on the upper surface of the lifting wall portion.

6. The transmission cavity system according to claim 1, characterized in that: When the manipulator is extended toward the loading chamber, the distance between the lower surface of the extended portion of the manipulator and the top surface of the cooling unit is 8-12 mm.

7. The transmission cavity system according to claim 5, characterized in that: The cooling unit includes a cooling platform, and a peripheral side surface of the cooling platform is circumscribed to the avoidance space.

8. The transmission cavity system according to any one of claims 1 to 7, characterized in that: The number of the cooling units is set to at least 2; Each of the cooling units comprises a cooling stage; The rotation center of the manipulator is located on the perpendicular bisector of the line connecting the centers of the two cooling stages.

9. The transmission cavity system according to claim 8, characterized in that: The two cooling stages are respectively a first cooling stage and a second cooling stage; Taking the rotation center of the manipulator as the starting point, two extension lines are respectively extended toward the center of the first cooling stage and the center of the second cooling stage, and the angle formed by the two extension lines is α, and the value range of α is 35°~45°.

10. The transmission cavity system according to claim 3, characterized in that: The side wall comprises a first side wall, a second side wall and a connecting side wall; The connecting side wall is disposed between the first side wall and the second side wall; the first side wall is connected to the loading chamber; The second side wall is connected to the process chamber; The vertical surface, the upper surface of the bottom wall body and the second side wall enclose the escape space.

11. The transmission cavity system according to claim 10, characterized in that: Also includes lifting unit The lifting unit is located between the first side wall, the connecting side wall and the cooling unit; The connecting side wall is movably connected with an observation window; the observation window is at least partially made of transparent material.

12. The transmission cavity system according to claim 10, characterized in that: The number of the first side walls is N, and the center of each first side wall is tangent to a cylindrical surface, and the cylindrical surface takes the rotation center of the manipulator as an axis.

13. The transmission cavity system according to claim 12, characterized in that: The first side walls are provided with two; each of the first side walls is connected to one of the loading chambers; Each of the loading chambers comprises a film placement space; Taking the rotation center of the manipulator as the starting point, extension lines are drawn toward the centers of the two sheet placing spaces respectively; the angle between the two extension lines is β, and the value range of β is 25°~40°.

14. A transmission system, characterized in that: The invention comprises a loading port, a front-end transfer module, a loading chamber, a process chamber and a transfer chamber system as claimed in any one of claims 1 to 13.

15. A method for controlling a transmission cavity system, for controlling the transmission cavity system according to any one of claims 1 to 13, characterized in that: include: S1, controlling the robot to take a substrate from the loading chamber and transfer the substrate to the process chamber for processing; S2, control the lifting unit to rise to the first working position; S3, controlling the robot to take out the processed substrate from the process chamber and place it on the lifting unit; S4, the lifting unit descends to the second station, and the substrate is placed on the cooling unit for cooling; S5, after the substrate is cooled, controlling the lifting unit to drive the substrate to rise to the first station; S6, after the robot takes the substrate, the lifting unit descends to the second station; S7, controlling the robot to transfer the cooled substrate to the loading chamber.

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