A high density interconnection circuit board and its preparation method

Abstract

The present invention relates to a high-density interconnection circuit board and a preparation method thereof, comprising a bottom circuit board, a plurality of through holes are arranged in an array on the bottom circuit board, a first conductive layer is arranged between adjacent through holes, the first conductive layer comprises a plurality of working groups, the plurality of working groups are arranged side by side, each of the working groups is evenly spaced with a plurality of transfer points, a plurality of through holes are wrapped around the transfer points, a plurality of groups of outer circuit boards are stacked on the end surface of the bottom circuit board facing the first conductive layer, a plurality of via holes are arranged in an array on the outer circuit board, each of the transfer points corresponds to a via hole, a second conductive layer is arranged on the end surface of the outer circuit board facing away from the bottom circuit board, and the second conductive layer is connected to the outer edge of the via hole. The present invention aims to quickly produce circuit boards with stable performance.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a high-density interconnection circuit board and a preparation method thereof. Background Art

[0002] With the miniaturization and lightweight development of electronic products, high-density interconnected circuit boards are increasingly widely used. As a key electronic component carrier, it is used to achieve complex circuit connections and signal transmission in electronic products. Its main feature is that compared with traditional circuit boards, it has higher circuit density and more compact structure, which can effectively improve the performance and reliability of electronic products.

[0003] In the related art, an inner layer circuit board is provided, and a first circuit board is provided on one side of the inner layer circuit board, and a second circuit board is stacked on the other side. Vias are provided on the inner layer, first and second circuit boards, and a plurality of vias are coaxially and overlapped, and the plurality of vias are electrically connected in sequence. The circuit board includes a substrate and a conductive circuit board, and the vias on adjacent circuit boards pass through the substrate and are electrically connected to the conductive circuit board on the circuit board. However, such a circuit board structure requires additional circuit design when the conductive circuit board needs to cross the line due to the fixation of the vias, so that the conductive circuit board is electrically connected to the vias, which will lead to a reduction in production efficiency, and irregular wiring can easily lead to different thermal expansion coefficients at the connection points of different circuit boards, which can easily lead to damage to the blind holes. Summary of the invention

[0004] The main purpose of the present invention is to provide a high-density interconnection circuit board and a preparation method thereof, aiming at quickly producing a circuit board with stable performance.

[0005] To achieve the above-mentioned purpose, the present invention proposes a high-density interconnection circuit board, including a bottom circuit board, a plurality of through holes are arranged in an array on the bottom circuit board, a first conductive layer is arranged between adjacent through holes, the first conductive layer includes a plurality of working groups, the plurality of working groups are arranged side by side, each of the working groups is evenly spaced with a plurality of transfer points, a plurality of the through holes are wrapped around the transfer points, a plurality of groups of outer circuit boards are stacked on the end surface of the bottom circuit board facing the first conductive layer, a plurality of via holes are arranged in an array on the outer circuit board, each of the transfer points corresponds to a via hole, a second conductive layer is provided on the end surface of the outer circuit board facing away from the bottom circuit board, and the second conductive layer is connected to the outer edge of the via hole.

[0006] In one embodiment of the present application, the working group includes a first connection line and a second connection line:

[0007] The first connecting line comprises a plurality of first branch lines with adjacent ends, the plurality of first branch lines are arranged in a colinear manner, and first terminals are provided at both ends of the first branch line; and

[0008] The second connecting line includes a main line and a second branch line, the second branch line is connected to the main line, a plurality of second branches are provided, the plurality of second branches are evenly spaced and arranged facing between adjacent first branches, a second terminal is provided at the end of the second branch line, the second terminal and the two first terminals together constitute the transfer point.

[0009] In one embodiment of the present application, the second branch line is passed through the main line, and the second terminals and the third terminals are respectively provided at both ends of the second branch line. A working group includes a group of the first connecting lines and two groups of the second connecting lines. The second terminal and the third terminal are located on both sides of the first connecting line. The second terminal, the third terminal and the first terminal together form the transfer point, and adjacent working groups share a group of the second connecting lines.

[0010] In one embodiment of the present application, the second connecting line also includes a third branch line, and the third branch line is provided in multiple groups, and the multiple groups of third branches are evenly spaced. The second branch line and the third branch line are arranged alternately, and the third branch line is connected to the main line and is arranged facing the first branch line.

[0011] In one embodiment of the present application, the inner diameter of the via is larger than the line width of the first connecting line and the second connecting line, the inner wall of the via is covered with a conductive covering layer, the conductive covering layer is wrapped around the upper and lower end surfaces of the via, the conductive covering layer is electrically connected to the first branch line and the second branch line, and the via is filled with conductive material.

[0012] In one embodiment of the present application, a plurality of heat dissipation holes are arranged in an array on the outer circuit board, the via holes and the heat dissipation holes are arranged alternately, and a plurality of groups of the heat dissipation holes surround the outer edges of the via holes.

[0013] In one embodiment of the present application, multiple groups of the outer circuit boards are stacked together, the diameters of the vias on the outer circuit boards on the same layer are the same, and the diameters of the vias on the outer circuit boards on different layers gradually decrease from the bottom layer circuit board away from the outer circuit boards.

[0014] In one embodiment of the present application, an end of the bottom layer circuit board facing away from the outer layer circuit board is coated with insulating heat dissipation adhesive, the insulating heat dissipation adhesive fills the through hole and is connected to the outer layer circuit board.

[0015] To achieve the above object, the present invention provides a method for preparing a high-density interconnection circuit board, comprising the above-mentioned high-density interconnection circuit board, and the method for preparing the high-density interconnection circuit board comprises:

[0016] Providing a bottom circuit board, the bottom circuit board comprising an insulating substrate and a plurality of through holes arranged through the insulating substrate;

[0017] A first conductive layer is arranged on the gap of the through hole, wherein the first conductive layer includes a first connecting line and a second connecting line, wherein the second connecting line is provided with a third branch line facing the first connecting line, and the third branch line is connected to the first connecting line, so as to form the first connecting line and the second connecting line into a whole;

[0018] Remove the third branch line and build a transfer point through the terminals at the ends of the second branch line and the first branch line;

[0019] Arrange multiple groups of outer circuit boards in sequence according to the size of the vias, the insulating layer of each outer circuit board is connected to the working group of the previous circuit board, and the vias are set corresponding to the transfer points.

[0020] In one embodiment of the present application, after the bottom circuit board and the outer circuit board are installed, insulating heat dissipation glue is coated on the end surface of the bottom circuit board facing away from the outer circuit board, the insulating heat dissipation glue is penetrated through the through hole, and the outer edge of the circuit board is coated with insulating glue.

[0021] The technical solution of the present invention adopts the method of structurally dividing a high-density interconnection circuit board into multiple parts. The bottom circuit board is located at the base. A plurality of through holes are arranged in an array on the bottom circuit board. The heat dissipation effect of the circuit board can be improved through the through holes. A first conductive layer is arranged between the through holes. When the first conductive layer is arranged, it is composed of multiple working groups. The multiple working groups are arranged side by side to optimize the wiring method and reduce the workload required for wiring. A transfer point is arranged on each working group. The line can be stripped or a pad welding component can be set at the transfer point, so that the circuit board can work stably. The through holes are wrapped and transferred. Points are used to ensure the heat dissipation effect of the line points. The bottom circuit board is stacked in the direction of the first conductive layer with multiple sets of outer circuit boards. Multiple sets of vias are opened on the outer circuit boards. The vias of the outer circuit boards are set corresponding to the transfer points, and the end surface of the outer circuit board away from the bottom circuit board is also provided with a second conductive layer. The specific structure of the second conductive layer is similar to that of the first conductive layer, and the second conductive layer is arranged at the outer edge of the via. With the assistance of the vias, while the circuit boards can be stacked at a high density, it is convenient to interconnect the circuits on different layers of the circuit boards, which can effectively optimize the circuit and quickly produce circuit boards with stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1is a cross-sectional view of a high-density interconnect circuit board of the present invention;

[0024] Figure 2 It is a schematic diagram of the structure of the outer circuit board of the high-density interconnection circuit board of the present invention;

[0025] Figure 3 It is a schematic diagram of the bottom circuit board structure of the high-density interconnection circuit board of the present invention;

[0026] Figure 4 It is a schematic diagram of the working group structure of the high-density interconnection circuit board of the present invention.

[0027] Description of Figure Numbers:

[0028] 1. Bottom circuit board; 11. Through hole; 12. First conductive layer; 2. Working group; 3. First connecting line; 31. First branch line; 32. First terminal; 4. Second connecting line; 41. Main line; 42. Second branch line; 43. Second terminal; 44. Third terminal; 45. Third branch line; 5. Transfer point; 6. Outer circuit board; 61. Via hole; 611. Conductive covering layer; 62. Heat dissipation hole; 63. Second conductive layer; 7. Insulating heat dissipation glue.

[0029] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] Reference Figures 1 to 4 In one embodiment of the present invention, a high-density interconnection circuit board is proposed, including a bottom circuit board 1, a plurality of through holes 11 are arranged in an array on the bottom circuit board 1, a first conductive layer 12 is arranged between adjacent through holes 11, the first conductive layer 12 includes a plurality of working groups 2, the plurality of working groups 2 are arranged side by side, each working group 2 is evenly spaced with a plurality of transfer points 5, a plurality of through holes 11 are wrapped around the transfer points 5, a plurality of groups of outer circuit boards 6 are stacked on the end surface of the bottom circuit board 1 facing the first conductive layer 12, a plurality of via holes 61 are arranged in an array on the outer circuit board 6, each transfer point 5 corresponds to a via hole 61, a second conductive layer 63 is provided on the end surface of the outer circuit board 6 facing away from the bottom circuit board 1, and the second conductive layer 63 is connected to the outer edge of the via hole 61.

[0032] In a high-density interconnection circuit board of the present application, the high-density interconnection circuit board is structurally divided into multiple parts. The bottom circuit board 1 is at the base. A plurality of through holes 11 are arranged in an array on the bottom circuit board 1. The through holes 11 can improve the heat dissipation effect of the circuit board. A first conductive layer 12 is arranged between the through holes 11. When the first conductive layer 12 is arranged, it is composed of a plurality of working groups 2. The plurality of working groups 2 are arranged side by side to optimize the wiring method and reduce the workload required for wiring. A transfer point 5 is provided on each working group 2. The line can be striped or a pad welding component can be set at the transfer point 5, so that the circuit board can work stably. The through holes 11 surround the transfer point 5. 5, used to ensure the heat dissipation effect of the line points, the bottom circuit board 1 is stacked with multiple groups of outer circuit boards 6 facing the first conductive layer 12, and multiple groups of vias 61 are provided on the outer circuit board 6. The vias 61 of the outer circuit board 6 are arranged corresponding to the transfer points 5, and the end surface of the outer circuit board 6 facing away from the bottom circuit board 1 is also provided with a second conductive layer 63. The specific structure of the second conductive layer 63 is similar to that of the first conductive layer 12, and the second conductive layer 63 is arranged at the outer edge of the via 61. With the assistance of the via 61, while the circuit boards can be stacked at a high density, the circuits on the circuit boards of different layers can be interconnected, which can effectively optimize the circuit and quickly produce circuit boards with stable performance.

[0033] Combined with reference Figures 1 to 4 In one embodiment of the present application, the working group 2 includes a first connecting line 3 and a second connecting line 4, the first connecting line 3 includes a plurality of first branch lines 31 adjacent to each other at their ends, the plurality of first branch lines 31 are co-linearly arranged, and first terminals 32 are provided at both ends of the first branch line 31; the second connecting line 4 includes a main line 41 and a second branch line 42, the second branch line 42 is connected to the main line 41, a plurality of second branch lines 42 are provided, the plurality of second branch lines 42 are evenly spaced and arranged facing between adjacent first branch lines 31, a second terminal 43 is provided at the end of the second branch line 42, and the second terminal 43 and the two first terminals 32 together constitute a transfer point 5.

[0034] In a high-density interconnect circuit board of the present application, working group 2 includes a first connecting line 3 and a second connecting line 4. Specifically, in an embodiment of the present application, each working group 2 only includes the first connecting line 3 and the second connecting line 4. The first connecting line 3 is composed of multiple groups of collinear first branch lines 31. Each first branch line 31 is a group of line segments. At the end of the first branch line 31, there is a first terminal 32, which can be used for strip lines or connecting lines. The second connecting line 4 includes a main line 41 and second branch lines 42. The second branch lines 42 are connected to the main line 41, and there are multiple groups of second branch lines 42. The extending direction of each group of second branch lines 42 corresponds to the space between two groups of first branch lines 31. At the end of the second branch line 42, there is a second terminal 43. A group of transfer points 5 are jointly enclosed by a group of second terminals 43 and two groups of corresponding first terminals 32. At the transfer point 5, pads can be provided for soldering components, or it can assist the circuit of this layer to connect to the lower-layer circuit. Such a circuit structure is simpler and more convenient in design and layout, and the connection is stable, and it can be prepared quickly.

[0035] Referring to Figures 2 to 4 , in an embodiment of the present application, the second branch line 42 penetrates through the main line 41. At both ends of the second branch line 42, there are respectively a second terminal 43 and a third terminal 44. A working group 2 includes a group of first connecting lines 3 and two groups of second connecting lines 4. The second terminal 43 and the third terminal 44 are on both sides of the first connecting line 3. The second terminal 43, the third terminal 44, and the first terminal 32 enclose a transfer point 5. Adjacent working groups 2 share a group of second connecting lines 4.

[0036] In a high-density interconnect circuit board of the present application, in another embodiment of the present application, the second branch line 42 penetrates through the main line 41. The middle position of the second branch line 42 is vertically connected to the main line 41. The entire second connecting line 4 has a structure in the shape of a Chinese character 'feng' with multiple tails connected. At both ends of the second branch line 42, there are respectively a second terminal 43 and a third terminal 44. In this embodiment, a group of working groups 2 is composed of a group of first connecting lines 3 and two groups of second connecting lines 4. In this way, a group of transfer points 5 are jointly enclosed by a second terminal 43, a third terminal 44, and two groups of first terminals 32. Moreover, since multiple groups of working groups 2 are arranged side by side at intervals, adjacent working groups 2 can share a group of second connecting lines 4. Under such a structure, the lines on one layer of the circuit board can be more closely connected together, which is beneficial to the circuit design.

[0037] Referring to Figure 4 , in an embodiment of the present application, the second connecting line 4 further includes third branch lines 45. There are multiple groups of third branch lines 45. The multiple groups of third branch lines 45 are evenly spaced. The second branch lines 42 and the third branch lines 45 are arranged alternately. The third branch lines 45 are connected to the main line 41 and are arranged facing the first branch lines 31.

[0038] In a high-density interconnection circuit board of the present application, the second connecting line 4 also includes a third branch line 45, and the third branch line 45 is provided with a plurality of groups, and the plurality of groups of third branch lines 45 are evenly spaced, and the second branch line 42 and the third branch line 45 are arranged alternately, and one end of the third branch line 45 is connected to the main line 41, and the other end is connected to the first branch line 31, which is used to assemble the circuit into a whole before the circuit is laid on the circuit board, so that the circuit prepared in advance can be conveniently transported and transferred, and can also be conveniently assembled. After the assembly is completed, the third branch line 45 can be removed later. The main purpose of the third branch line 45 is to facilitate the production and preparation of the circuit board, which can effectively improve the preparation rate, and the assembled circuit is easier to place in a specified position, which can improve the quality of the produced circuit board.

[0039] Combined with reference Figure 1 to Figure 2 In one embodiment of the present application, the inner diameter of the via 61 is greater than the line width of the first connecting line 3 and the second connecting line 4, the inner wall of the via 61 is covered with a conductive covering layer 611, the conductive covering layer 611 is wrapped around the upper and lower end surfaces of the via 61, the conductive covering layer 611 is electrically connected to the first branch line 31 and the second branch line 42, and the via 61 is filled with conductive material.

[0040] In a high-density interconnection circuit board of the present application, the inner diameter of the via 61 is larger than the line width of the connecting line. Such a structure can facilitate the layout of the circuit, so that the corresponding lines in the first connecting line 3 and / or the second connecting line 4 can pass through the position of the via 61. Such a structure can reduce the design difficulty and processing difficulty of the circuit layer, effectively improve the yield rate, and in order to facilitate the effect of electrical connection, a conductive covering layer 611 can be provided on the inner wall of the via 61, and the conductive covering layer 611 extends to the upper and lower end surfaces of the via 61, surrounds the upper and lower end surface edges of the via 61, and the surrounding width is greater than or equal to the line width. A conductive material is provided in the via 61. Through these structures, the circuit layer lines can be assisted, or a pad can be formed, which can effectively facilitate the connection of lines of different circuit layers. In addition, at the same layer position of the via 61 and the circuit layer, the connecting line is wrapped around the via 61, and a traction line can be pulled out to the via 61 through the connecting line for connection. In this way, even if the circuit board is impacted and the connecting line is offset, the traction line can be relied on to maintain the connectivity of the circuit, which can effectively improve the performance stability of the circuit board.

[0041] Combined with reference Figure 2 In one embodiment of the present application, a plurality of heat dissipation holes 62 are arranged in an array on the outer circuit board 6 , the via holes 61 and the heat dissipation holes 62 are arranged alternately, and the plurality of heat dissipation holes 62 surround the outer edge of the via holes 61 .

[0042] In a high-density interconnection circuit board of the present application, a plurality of heat dissipation holes 62 are arranged in an array on the outer circuit board 6, and the vias 61 and the heat dissipation holes 62 are arranged alternately. In the present embodiment, the number of the heat dissipation holes 62 is greater than the vias 61. The heat dissipation holes 62 are wrapped around the vias 61 and connected to the connecting wires. The heat dissipation efficiency of the circuit board can be improved through the heat dissipation holes 62, so as to achieve the effect of slowing down the aging of the circuit.

[0043] Combined with reference Figure 1 to Figure 2 In one embodiment of the present application, multiple groups of outer circuit boards 6 are stacked together, the diameters of the vias 61 on the same layer of outer circuit boards 6 are the same, and the diameters of the vias 61 on different layers of outer circuit boards 6 gradually decrease from the bottom layer circuit board 1 away from the outer circuit board 6.

[0044] In a high-density interconnect circuit board of the present application, multiple groups of outer circuit boards 6 are stacked together, and the apertures of the vias 61 on the multiple groups of outer circuit boards 6 are smaller as the distance from the outer circuit board 6 to the bottom circuit board 1 increases. This structure can reduce the stress on the circuit board itself during use, thereby increasing the service life of the circuit board.

[0045] Combined with reference Figure 1 In one embodiment of the present application, an end of the bottom circuit board 1 facing away from the outer circuit board 6 is coated with an insulating heat dissipation adhesive 7, the insulating heat dissipation adhesive 7 is filled in the through hole 11, and is connected to the outer circuit board 6.

[0046] In a high-density interconnection circuit board of the present application, an insulating heat dissipation adhesive 7 is coated on one end of the bottom circuit board 1 facing away from the outer circuit board 6, and the insulating heat dissipation adhesive 7 is filled in the through hole 11. Through the insulating heat dissipation adhesive 7, the bottom circuit board 1 can dissipate heat to the outside. At the same time, the insulating heat dissipation adhesive 7 itself can reduce the impact on the circuit board and ensure the safe use of the circuit board.

[0047] Reference Figure 1 As shown, the present invention further proposes a method for preparing a high-density interconnection circuit board, which includes the above-mentioned high-density interconnection circuit board. The specific structure of the high-density interconnection circuit board refers to the above-mentioned embodiment. Since the preparation method of the high-density interconnection circuit board adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0048] The preparation method of the high-density interconnection circuit board proposed in the present invention includes providing a bottom circuit board 1, the bottom circuit board 1 includes an insulating substrate and a plurality of through holes 11 arranged on the insulating substrate; arranging a first conductive layer 12 on the gaps of the through holes 11, the first conductive layer 12 includes a first connecting line 3 and a second connecting line 4, the second connecting line 4 is provided with a third branch line 45 facing the first connecting line 3, the third branch line 45 is connected to the first connecting line 3, and is used to construct the first connecting line 3 and the second connecting line 4 into a whole; removing the third branch line 45, and constructing a transfer point 5 through the terminals of the second branch line 42 and the first branch line 31; arranging multiple groups of outer circuit boards 6 in sequence according to the size of the through holes 61, the insulating layer of each outer circuit board 6 is connected to the working group 2 of the previous circuit board, and the through holes 61 are arranged corresponding to the transfer points 5.

[0049] In a high-density interconnection circuit board of the present application, when preparing the circuit board, a bottom circuit board 1 is first set, and the bottom circuit board 1 is composed of an insulating substrate, a through hole 11 and a first conductive layer 12, that is, a first circuit layer. The first circuit layer can be very conveniently and quickly installed on the bottom circuit board 1 because of the existence of the third branch line 45 on the second connecting line 4. When the installation is completed, the third branch line 45 can be removed. At this time, the first connecting line 3 and the second connecting line 4 can form multiple groups of transfer points 5. The lines on the outer circuit board 6 can also be installed according to the installation method on the bottom circuit board 1. The apertures of the vias 61 of the multiple groups of outer circuit boards 6 are arranged, and the insulating layers of each group of outer circuit boards 6 are quickly docked with the corresponding docking points through the vias 61 to connect or install pads. The heat dissipation holes 62 are set corresponding to the working group 2, which can effectively improve the production efficiency and ensure the stability of the circuit.

[0050] In one embodiment of the present application, after the bottom circuit board 1 and the outer circuit board 6 are installed, an insulating heat dissipation adhesive 7 is applied to the end surface of the bottom circuit board 1 facing away from the outer circuit board 6, the insulating heat dissipation adhesive 7 is passed through the through hole 11, and the outer edge of the circuit board is coated with insulating adhesive.

[0051] In a high-density interconnection circuit board of the present application, after the bottom circuit board 1 and the outer circuit board 6 are installed, an insulating heat dissipation adhesive 7 is coated on the end surface of the bottom circuit board 1 facing away from the outer circuit board 6. The adhesive layer can be partially penetrated into the through hole 11 to increase the contact area with the bottom circuit board 1 and improve the heat dissipation efficiency. At the same time, insulating adhesive can be provided on the outer circuit board 6 farthest from the bottom circuit board 1 to ensure the stability of the circuit board, so as to achieve the effect of improving the quality of the circuit board.

[0052] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0053] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A high-density interconnect circuit board, comprising a bottom circuit board, characterized in that: The bottom circuit board is provided with a plurality of through holes in an array, a first conductive layer is provided between adjacent through holes, the first conductive layer comprises a plurality of working groups, the plurality of working groups are arranged side by side, each of the working groups is provided with a plurality of transfer points at even intervals, a plurality of the through holes are wrapped around the transfer points, a plurality of groups of outer circuit boards are stacked on the end surface of the bottom circuit board facing the first conductive layer, a plurality of via holes are provided in an array on the outer circuit board, each of the transfer points corresponds to a via hole, a second conductive layer is provided on the end surface of the outer circuit board facing away from the bottom circuit board, and the second conductive layer is connected to the outer edge of the via hole.

2. A high density interconnect circuit board according to claim 1, characterized in that: The working group includes: A first connecting line, the first connecting line comprising a plurality of first branch lines with adjacent ends, the plurality of first branch lines being arranged in a colinear manner, and first terminals being provided at both ends of the first branch line; and A second connecting line, the second connecting line includes a main line and a second branch line, the second branch line is connected to the main line, a plurality of second branches are provided, the plurality of second branches are evenly spaced and arranged facing between adjacent first branches, a second terminal is provided at the end of the second branch line, the second terminal and the two first terminals together constitute the transfer point.

3. A high density interconnect circuit board according to claim 2, characterized in that: The second branch line is passed through the main line, and the second terminals and the third terminals are respectively provided at both ends of the second branch line. A working group includes a group of the first connecting lines and two groups of the second connecting lines. The second terminal and the third terminal are located on both sides of the first connecting line. The second terminal, the third terminal and the first terminal form the transfer point. Adjacent working groups share a group of the second connecting lines.

4. A high density interconnect circuit board according to claim 3, characterized in that: The second connecting line also includes a third branch line. The third branch line is provided in multiple groups. The multiple groups of the third branch lines are evenly spaced. The second branch line and the third branch line are alternately arranged. The third branch line is connected to the main line and is arranged facing the first branch line.

5. A high density interconnect circuit board according to claim 2, characterized in that: The inner diameter of the via is larger than the line width of the first connecting line and the second connecting line. The inner wall of the via is covered with a conductive covering layer. The conductive covering layer wraps around the upper and lower end surfaces of the via. The conductive covering layer is electrically connected to the first branch line and the second branch line. The via is filled with conductive material.

6. A high density interconnect circuit board according to claim 5, characterized in that: The outer circuit board is provided with a plurality of heat dissipation holes in an array, the via holes and the heat dissipation holes are arranged alternately, and a plurality of groups of the heat dissipation holes surround the outer edges of the via holes.

7. A high density interconnect circuit board according to claim 6, characterized in that: A plurality of groups of the outer circuit boards are stacked together, the diameters of the via holes on the outer circuit boards on the same layer are the same, and the diameters of the via holes on the outer circuit boards on different layers gradually decrease from the bottom circuit board away from the outer circuit board.

8. A high density interconnect circuit board according to claim 1, characterized in that: An end of the bottom layer circuit board facing away from the outer layer circuit board is coated with insulating heat dissipation glue, and the insulating heat dissipation glue fills the through hole and is connected to the outer layer circuit board.

9. A method for preparing a high-density interconnection circuit board, comprising the high-density interconnection circuit board according to any one of claims 1 to 8, characterized in that: The method for preparing a high-density interconnection circuit board comprises: Providing a bottom circuit board, the bottom circuit board comprising an insulating substrate and a plurality of through holes arranged through the insulating substrate; A first conductive layer is arranged on the gap of the through hole, wherein the first conductive layer includes a first connecting line and a second connecting line, wherein the second connecting line is provided with a third branch line facing the first connecting line, and the third branch line is connected to the first connecting line, so as to form the first connecting line and the second connecting line into a whole; Remove the third branch line and build a transfer point through the terminals at the ends of the second branch line and the first branch line; Arrange multiple groups of outer circuit boards in sequence according to the size of the vias, the insulating layer of each outer circuit board is connected to the working group of the previous circuit board, and the vias are set corresponding to the transfer points.

10. The method for preparing a high density interconnection circuit board according to claim 9, characterized in that: After the bottom circuit board and the outer circuit board are installed, insulating heat dissipation glue is applied to the end surface of the bottom circuit board away from the outer circuit board. The insulating heat dissipation glue is passed through the through hole, and the outer edge of the circuit board is coated with insulating glue.

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