Array substrate, method for preparing array substrate, and electronic paper display panel

Abstract

The present application discloses an array substrate, a method for preparing the array substrate, and an electronic paper display panel, which are used in the electronic paper display panel. The array substrate includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a passivation layer, and a pixel electrode layer, wherein the first metal layer, the first insulating layer, the second metal layer, the second insulating layer, the passivation layer, and the pixel electrode layer are sequentially stacked on the substrate; the array substrate includes a display area, a non-display area, a bonding area, and an exposed area, wherein the non-display area is arranged around the display area, the bonding area covers the entire display area and the part of the non-display area close to the display area, the bonding area is used to bond the electronic paper film, and the part of the non-display area not covered by the bonding area is defined as the exposed area; the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area. The performance of the electronic paper display panel against water vapor intrusion is improved, the failure rate of the electronic paper display panel is reduced, and the user experience is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a method for preparing the array substrate, and an electronic paper display panel. Background Art

[0002] With the development of digital technology, more and more display devices have entered people's lives, such as electronic paper (EP) display panels. Since electronic paper display panels can maintain display for a long time in the case of power failure, and have the advantages of lightness, thinness, low power consumption, and simple process, they are becoming more and more popular.

[0003] The current method of manufacturing electronic paper display panels is to directly bond the electronic paper film to the bonding area of ​​the array substrate, so only one glass substrate is needed in the array substrate. For such electronic paper display panels with a single glass substrate, display abnormalities may occur in the display area near the edge after long-term use. Summary of the invention

[0004] The purpose of the present application is to provide an array substrate, a method for preparing the array substrate and an electronic paper display panel, so as to improve the performance of the electronic paper display panel in resisting water vapor intrusion, reduce the failure rate of the electronic paper display panel and enhance the user experience.

[0005] The present application discloses an array substrate for use in an electronic paper display panel, the array substrate comprising a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a passivation layer and a pixel electrode layer, wherein the first metal layer, the first insulating layer, the second metal layer, the second insulating layer, the passivation layer and the pixel electrode layer are sequentially stacked on the substrate;

[0006] The array substrate comprises a display area, a non-display area, a bonding area and an exposed area, wherein the non-display area is arranged around the display area, the bonding area covers the entire display area and a portion of the non-display area close to the display area, the bonding area is used to bond the electronic paper film, and a portion of the non-display area not covered by the bonding area is defined as the exposed area;

[0007] The passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area.

[0008] Optionally, the array substrate further includes a protection layer, which is disposed on a side of the second insulating layer facing away from the substrate and is located in the exposed area, and a gap is disposed between the protection layer and the passivation layer.

[0009] Optionally, the protective layer includes a plurality of protective structures, the plurality of protective structures are arranged in a dotted manner, each of the protective structures is arranged at intervals, each of the protective structures is evenly arranged on a side of the second insulating layer away from the substrate and is located in the exposed area.

[0010] Optionally, the protective layer includes a plurality of strip-shaped protective structures, each of which is arranged at intervals, and the protective structures are arranged on a side of the second insulating layer away from the substrate and located in the exposed area; the extension direction of the array substrate from the inside to the outside is defined as a first direction, and the length directions of the protective structures located on two opposite sides of the exposed area are the same, and the length direction of the protective structures is the same as the first direction.

[0011] Optionally, the protective layer includes a plurality of annular protective structures, each of which is arranged at intervals, and the protective structures are arranged on a side of the second insulating layer away from the substrate and in the exposed area, and each of the protective structures is arranged around the periphery of the bonding area.

[0012] Optionally, the array substrate further includes a passivation structure, the material of the passivation structure is the same as the material of the passivation layer, and the passivation structure is arranged on a side of the protection structure away from the substrate.

[0013] Optionally, the orthographic projection of the protection structure on the substrate covers the passivation structure, and the plane where the substrate is located is defined as a first plane, and the cross-sectional area of ​​the protection structure in the direction of the first plane is greater than the cross-sectional area of ​​the passivation structure in the direction of the first plane.

[0014] The present application also discloses a method for preparing an array substrate. The method for preparing an array substrate is used to prepare an array substrate, and the steps include:

[0015] forming a first metal layer on the substrate;

[0016] forming a first insulating layer on the first metal layer;

[0017] forming a second metal layer on the first insulating layer;

[0018] forming a second insulating layer on the second metal layer;

[0019] forming the passivation layer on the second insulating layer, wherein the passivation layer covers the display area, and a boundary of the passivation layer is located within the bonding area;

[0020] A pixel electrode layer is formed on the passivation layer.

[0021] Optionally, the step of forming the passivation layer on the second insulating layer, wherein the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area, includes:

[0022] forming a protection structure on the second insulating layer, wherein the protection structure is located in the exposed area;

[0023] A passivation layer and a passivation structure are simultaneously formed on the second insulating layer, wherein the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area, and the passivation structure is arranged on the protection structure and is located on the side of the protection structure away from the substrate.

[0024] The present application also discloses an electronic paper display panel, which includes an electronic paper film and an array substrate, wherein the electronic paper film is bonded to the bonding area on the array substrate, and the electronic paper display panel also includes a frame sealing glue, which is bonded to the sides of the electronic paper film and the passivation layer.

[0025] Compared with the existing solution in which the passivation layer directly covers the second insulating layer, the present application shrinks the boundary of the passivation layer to a position within the bonding area. In this way, after the electronic paper film is bonded, the passivation layer covering the display area will not be exposed and will not come into contact with water vapor in the air, thereby improving the performance of the electronic paper display panel in resisting water vapor intrusion, reducing the failure rate of the electronic paper display panel, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0027] Figure 1 is a schematic diagram of an electronic paper display panel according to an embodiment of the present application;

[0028] Figure 2 is a schematic diagram of an array substrate according to the first embodiment of the present application;

[0029] Figure 3 is a schematic diagram of a dot-shaped protection structure of the first embodiment of the present application;

[0030] Figure 4 is a schematic diagram of a passivation structure of the first embodiment of the present application;

[0031] Figure 5is a schematic diagram of a plane of an array substrate according to the first embodiment of the present application;

[0032] Figure 6 is a schematic diagram of a protection structure of the first embodiment of the present application;

[0033] Figure 7 is a schematic diagram of a protection structure on a metal line according to the first embodiment of the present application;

[0034] Figure 8 is a schematic diagram of an array substrate according to a second embodiment of the present application;

[0035] Fig. 9 is a schematic diagram of an array substrate according to a third embodiment of the present application;

[0036] Fig.10 It is a schematic diagram of a process of preparing an array substrate according to an embodiment of the present application;

[0037] Fig.11 is a schematic diagram of a process of a method for preparing an array substrate according to an embodiment of the present application;

[0038] Fig.12 It is a schematic flow chart of a method for preparing a first protection structure and a passivation structure according to an embodiment of the present application;

[0039] Figure 13a-Figure 13c It is a schematic diagram of a process of preparing a first protection structure and a passivation structure according to an embodiment of the present application;

[0040] Fig.14 It is a schematic flow chart of a method for preparing a second protection structure and a passivation structure according to an embodiment of the present application;

[0041] Figure 15a-Figure 15b It is a schematic diagram of the process of preparing the second protection structure and passivation structure of an embodiment of the present application.

[0042] Among them, 10, electronic paper display panel; 20, electronic paper film; 30, array substrate; 31, display area; 32, non-display area; 33, bonding area; 34, exposed area; 35, encryption area; 37, data signal transmission line fan-out area; 38, scan signal transmission line fan-out area; 300, substrate; 310, first metal layer; 311, first metal wire; 320, first insulating layer; 330, second metal layer; 331, second metal wire; 340, second insulating layer; 350, protective layer; 351, protective structure; 352, connecting section; 353, first protective structure; 354, second protective structure; 360, passivation layer; 361, passivation structure; 370, pixel electrode layer. 410, common electrode layer; 421, microcapsule; 430, protective film layer; 440, frame sealant; 450, driver chip. DETAILED DESCRIPTION

[0043] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0044] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "plurality" means two or more. The term "including" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.

[0045] In addition, terms indicating orientation or positional relationships, such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside,” are described based on the orientation or relative positional relationships shown in the accompanying drawings and are merely simplified descriptions for the convenience of describing the present application. They do not indicate that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limitations on the present application.

[0046] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internally connected between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0048] Figure 1 is a schematic diagram of an electronic paper display panel according to an embodiment of the present application, such as Figure 1 As shown, the present application discloses an electronic paper display panel 10, which includes an electronic paper film 20 and an array substrate 30. Since the electronic paper display panel 10 is mostly prepared using a single substrate, that is, the electronic paper film 20 is directly bonded to the prepared array substrate 30, it is only necessary to define a bonding area 33 in advance, and then bond the electronic paper film 20 to the bonding area 33 of the array substrate 30. The electronic paper film 20 is bonded to the bonding area 33 on the array substrate 30. The electronic paper display panel 10 also includes a frame sealing glue 440, which is bonded to the sides of the electronic paper film 20 and the passivation layer 360, so as to prevent water vapor from invading the electronic paper display panel 10.

[0049] The electronic paper film 20 includes a protective film layer 430, a microcapsule 421, and a common electrode layer 410. The protective film layer 430 is arranged on the side of the common electrode layer 410 away from the array substrate 30. The microcapsule 421 is filled with electrophoretic particles. The electrophoretic particles include black electrophoretic particles and white capacitor particles. Of course, they can also include colored electrophoretic particles, such as red electrophoretic particles, blue electrophoretic particles and green electrophoretic particles. The common electrode layer 410 is located on the side of the microcapsule 421 away from the array substrate 30. An electric field is formed between the common electrode and the pixel electrode on the array substrate 30 to drive the electrophoretic particles to move to display the picture.

[0050] The present application also discloses an array substrate 30, which can be used in the electronic paper display panel 10 described above. For the array substrate 30, the present application provides the following design, which is specifically introduced through several embodiments:

[0051] Embodiment 1:

[0052] Figure 2 is a schematic diagram of an array substrate of the first embodiment of the present application, such as Figure 2 As shown, the present application discloses an array substrate 30 for use in an electronic paper display panel 10, wherein the array substrate 30 includes a substrate 300, a first metal layer 310, a first insulating layer 320, a second metal layer 330, a second insulating layer 340, a passivation layer 360 and a pixel electrode layer 370, wherein the first metal layer 310, the first insulating layer 320, the second metal layer 330, the second insulating layer 340, the passivation layer 360 and the pixel electrode layer 370 are sequentially stacked on the substrate 300.

[0053] The array substrate 30 includes a display area 31, a non-display area 32, a bonding area 33 and an exposed area 34. The non-display area 32 is arranged around the display area 31, and the bonding area 33 covers the entire display area 31 and the portion of the non-display area 32 close to the display area 31. The bonding area 33 is used to bond the electronic paper film 20, and the portion of the non-display area 32 not covered by the bonding area 33 is defined as the exposed area 34; the passivation layer 360 covers the display area 31, and the boundary of the passivation layer 360 is located within the bonding area 33.

[0054] The array substrate 30 and the electronic paper film 20 in the current electronic paper display panel 10 are prepared separately. After the electronic paper film 20 and the array substrate 30 are prepared, the electronic paper film 20 is directly bonded to the bonding area 33 of the array substrate 30. Therefore, only one glass substrate is needed in the array substrate 30. For economic purposes, the electronic paper film 20 is only bonded to the bonding area 33 of the array substrate 30. Therefore, the top passivation layer 360 in the array substrate 30 is directly exposed in the exposed area 34.

[0055] Then, after long-term use, since the passivation layer 360 absorbs water vapor in the air, the water vapor enters into the display area 31 of the array substrate 30 along the passivation layer 360, corrodes the pixel electrode layer 370, and causes display abnormalities. Especially in a high humidity environment, more water vapor enters at the edge of the display area 31, and the display abnormality problem is more serious.

[0056] Compared with the existing solution in which the passivation layer 360 directly covers the second insulating layer 340, the present application shrinks the boundary of the passivation layer 360 to a position within the bonding area 33. In this way, after the electronic paper film 20 is bonded, the passivation layer 360 covering the display area 31 will not be exposed, and thus will not be exposed to water vapor in the air, thereby improving the performance of the electronic paper display panel 10 in resisting water vapor intrusion, reducing the failure rate of the electronic paper display panel 10, and improving the user experience.

[0057] Since the boundary of the passivation layer 360 is directly shrunk to the position within the bonding area 33, some metal wires in the first metal layer 310 and the second metal layer 330 below the exposed area 34 cannot be protected by the passivation layer 360, and the wires are easily broken when squeezed or bumped. In this regard, the present application has made further improvements, which is to add a protective layer 350, as follows:

[0058] The array substrate 30 further includes a protective layer 350, which is disposed on a side of the second insulating layer 340 away from the substrate 300 and is located in the exposed area 34, and a gap is provided between the protective layer 350 and the passivation layer 360. The material of the second insulating layer 340 includes polyvinyl chloride, the material of the protective layer 350 includes polyvinyl chloride, and the material of the passivation layer 360 includes soluble polytetrafluoroethylene. The protective layer 350 can protect some metal wires in the first metal layer 310 and the second metal layer 330 below the exposed area 34 from being squeezed and broken.

[0059] The protective layer 350 may cover the entire exposed area 34 or partially cover the exposed area 34. When the protective layer 350 covers the entire exposed area 34, if a sharp object hits the protective layer 350 when holding the electronic paper display panel 10, the protective layer 350 may fall off in a large area, thereby losing the protective effect. Therefore, the present application adopts a preferred solution that the protective layer 350 partially covers the exposed area 34.

[0060] Figure 3 is a schematic diagram of a dot-shaped protection structure of the first embodiment of the present application, such as Figure 3 As shown, the protective layer 350 includes a plurality of protective structures 351, which are arranged in a dotted pattern. Each of the protective structures 351 is arranged at intervals. Each of the protective structures 351 is evenly arranged on a side of the second insulating layer 340 away from the substrate 300 and is located in the exposed area 34.

[0061] Since the protective structure 351 of the present embodiment is arranged in a dotted pattern, there is a gap between two adjacent protective structures 351. When a sharp object strikes, the protective structure 351 that strikes the sharp object will easily separate from the second insulating layer 340, so that the protective layer 350 will not fall off in a large area, and the protective effect of the protective layer 350 is greatly improved.

[0062] Figure 4 is a schematic diagram of a passivation structure of the first embodiment of the present application, such as Figure 4 As shown, further, considering that after a collision occurs, the protective structure 351 corresponding to the collision position will detach from the second insulating layer 340, so that the impacted area loses the protection of the protective structure 351, and if a collision occurs again, and it occurs at a position that has been hit once before, then the metal wire below will easily break.

[0063] Therefore, the present application sets a passivation structure 361 on the protective structure 351, that is, the array substrate 30 also includes a passivation structure 361, the material of the passivation structure 361 is the same as the material of the passivation layer 360, and the passivation structure 361 is set on the side of the protective structure 351 away from the substrate 300.

[0064] The passivation structure 361 can be a passivation structure 361 formed separately after the protective structure 351 is prepared, or the protective structure 351 can be formed before the passivation layer 360 is set, and then the passivation layer 360 and the passivation structure 361 are formed simultaneously. In the present application, the passivation structure 361 is set on the protective structure 351, which is equivalent to setting a double-layer protective structure 351. Then, when a sharp object hits, the passivation structure 361 will be detached from the protective structure 351, thereby completing the force unloading, and the protective structure 351 below the impacted position is still retained, thereby avoiding the previously impacted position from losing the function of protecting the metal wire below.

[0065] What's more important is that only one layer of protection structure 351 is left at the impacted position, while the passivation structure 361 is still retained above the protection structure 351 in the surrounding area. At this time, a sunken area is formed at the impacted position. Then, when a secondary impact occurs, it will first hit the passivation layer 360 at a higher position around the sunken area, avoiding multiple impacts at the same position, further improving the protection effect.

[0066] In addition, the present application also sets the area of ​​the passivation structure 361 to be smaller than the area of ​​the protection structure 351, and the orthographic projection of the protection structure 351 on the substrate 300 covers the passivation structure 361, and the plane where the substrate 300 is located is defined as the first plane, and the cross-sectional area of ​​the protection structure 351 in the direction of the first plane is greater than the cross-sectional area of ​​the passivation structure 361 in the direction of the first plane. It can also be understood that the orthographic projection area of ​​the protection structure 351 on the substrate 300 is greater than the orthographic projection area of ​​the passivation structure 361 on the substrate 300. Therefore, when impacted, the passivation structure 361 is more likely to fall off.

[0067] Figure 5 is a schematic diagram of a plane of an array substrate of the first embodiment of the present application, such as Figure 5 As shown, the protective layer 350 also includes a connecting section 352, the two ends of which are respectively connected to the protective structure 351, and the width of the connecting section 352 is smaller than the width of the protective structure 351. The material of the connecting section 352 is the same as that of the protective structure 351, and the connecting section 352 and the protective structure 351 are processed synchronously.

[0068] For example, when the first impact occurs, if the impact hits the passivation structure 361, the passivation structure 361 will fall off from the protective structure 351, and the lower connecting segment 352 can stabilize the protective structure 351 and prevent it from falling off during the first impact, thereby avoiding the problem of the protective structure 351 and the passivation structure 361 falling off together. However, after the first impact, the structural strength of the connecting segment 352 is reduced. If the second impact occurs at the same position, due to the reduced structural strength of the connecting segment 352 and the fact that the connecting segment 352 itself is relatively thin, the connecting segment 352 will break when the second impact occurs at the same position, thereby not affecting the surrounding protective structure 351, and thus not causing the problem of large-area protective structure 351 falling off.

[0069] The array substrate 30 also includes a data signal transmission line fan-out area 37 and a scan signal transmission line fan-out area 38. The data signal transmission line fan-out area 37 and the scan signal transmission line fan-out area 38 are both located in the non-display area 32, and are partially located in the bonding area 33 and partially located in the exposed area 34. The position where the data signal transmission line fan-out area 37 overlaps with the exposed area 34 is defined as the encryption area 35, the position where the scan signal transmission line fan-out area 38 overlaps with the exposed area 34 is also defined as the encryption area 35, and the position where the exposed area 34 does not overlap with the encryption area 35 is defined as the normal area.

[0070] The density of the protection structure 351 in the encrypted area 35 is greater than that in the normal area, and the orthographic projection area of ​​the protection structure 351 in the encrypted area 35 on the substrate 300 is smaller than that of the protection structure 351 in the normal area on the substrate 300. This ensures that after a sharp object hits, the encrypted area 35 can still retain more protection structures 351, thereby achieving a better protection effect.

[0071] Figure 6 is a schematic diagram of a protection structure of the first embodiment of the present application, such as Figure 6 As shown, the shapes of the protection structure 351 and the passivation structure 361 include prisms and cylinders. Preferably, the protection structure 351 is an inverted truncated cone, that is, the direction of the substrate 300 toward the first metal layer 310 is defined as the first direction, and the protection structure 351 and the passivation structure 361 are both truncated cones, the central axis of the protection structure 351 and the central axis of the passivation structure 361 are located on the same straight line, and the cross-sectional diameter of the protection structure 351 along the first direction gradually increases, and the cross-sectional diameter of the passivation structure 361 along the first direction gradually increases.

[0072] In this way, when an impact occurs, since the passivation structure 361 is larger at the top and smaller at the bottom, the area that can be covered and protected is larger than the area connected to the protection structure 351. The protection structure 351 is also larger at the top and smaller at the bottom, and the area that can be covered and protected is larger than the area connected to the second insulating layer 340. It is easier to fall off when an impact occurs, and the area that needs to be covered and protected will not be lost.

[0073] Figure 7 is a schematic diagram of a protection structure on a metal line in the first embodiment of the present application, such as Figure 7 As shown, the passivation structure 361 may be arranged above all the protection structures 351, or the passivation structure 361 may be arranged above some of the protection structures 351. The present application preferably takes the passivation structure 361 arranged above some of the protection structures 351 as an example, that is, the passivation structure 361 is arranged above some of the protection structures 351 in the present application, and the passivation structure 361 is not arranged above some of the protection structures 351. Specifically, the array substrate 30 includes a driving chip 450, a data line, a scan line, a data signal transmission line, and a scan signal transmission line. The data line and the scan line are located in the display area 31. The data signal transmission line connects the driving chip 450 and the data line, and the scan signal transmission line connects the scan line and the driving chip 450.

[0074] The first metal layer 310 includes a first metal wire 311, and the second metal includes a second metal wire 331. The data signal transmission line can be located entirely in the first metal layer 310, or partially in the second metal layer 330, and of course it can also be located partially in the first metal layer 310 and partially in the second metal layer 330; the scan signal transmission line can be located entirely in the first metal layer 310, or entirely in the second metal layer 330, and of course it can also be located partially in the first metal layer 310 and partially in the second metal layer 330; therefore, the first metal wire 311 includes a data signal transmission line and / or a scan signal transmission line, and the second metal wire 331 includes a data signal transmission line and / or a scan signal transmission line.

[0075] The height of each protection structure 351 is consistent, and the height of each passivation structure 361 is consistent; the protection structure 351 whose orthographic projection on the substrate 300 covers the first metal line 311 is defined as a first protection structure 353, and the protection structure 351 whose orthographic projection on the substrate 300 covers the second metal line 331 is defined as a second protection structure 354, the passivation structure 361 is arranged above the first protection structure 353, and the passivation structure 361 is not arranged above the second protection structure 354; in simple terms, the passivation structure 361 is arranged on the protection structure 351 above the first metal line 311, and the passivation structure 361 is not arranged on the protection structure 351 above the second metal line 331.

[0076] Since the first metal wire 311 is located in the first metal layer 310 and is not easily broken when being impacted or squeezed, and since the second metal wire 331 is located in the second metal layer 330 and is easily broken when being impacted or squeezed, the present application provides a passivation structure 361 on the protection structure 351 above the first metal wire 311, and no passivation structure 361 is provided on the protection structure 351 above the second metal wire 331. In this way, when an impact occurs, the passivation structure 361 on the first protection structure 354 will be impacted first, thereby squeezing the first metal wire 311, and the second metal wire 331 which is prone to breakage will not be directly squeezed, thereby reducing the risk of short lines.

[0077] Embodiment 2:

[0078] Figure 8 is a schematic diagram of an array substrate according to a second embodiment of the present application. Figure 8 As shown, different from the first embodiment, the protection structure 351 of this embodiment is strip-shaped. Specifically, the protection layer 350 includes a plurality of strip-shaped protection structures 351, each of which is arranged at intervals. The protection structure 351 is arranged on the side of the second insulating layer 340 away from the substrate 300 and is located in the exposed area 34.

[0079] The extending direction of the array substrate 30 from inside to outside is defined as a first direction, and the length directions of the protection structures 351 located on two opposite sides of the exposed area 34 are the same, and the length direction of the protection structures 351 is the same as the first direction.

[0080] Compared with the shape of the protective structure 351 of the first embodiment, the shape of the protective structure 351 of this embodiment is strip-shaped. When hit by a sharp object, the groove formed between two adjacent protective structures 351 can convert the kinetic energy of the impact into relative sliding kinetic energy, thereby achieving the effect of force release. Further, the protective structure 351 can be arranged to be a structure with a height gradually decreasing along the first direction, so as to achieve a better force release effect.

[0081] Embodiment 3:

[0082] Fig. 9 is a schematic diagram of an array substrate of the third embodiment of the present application, such as Fig. 9 As shown, different from the first embodiment, the protection structure 351 of this embodiment is annular. Specifically, the protection layer 350 includes a plurality of annular protection structures 351, each of which is arranged at intervals. The protection structures 351 are arranged on the side of the second insulating layer 340 away from the substrate 300 and are located in the exposed area 34, and each of the protection structures 351 is arranged around the periphery of the bonding area 33.

[0083] After the electronic paper film 20 is attached to the bonding area 33, it is necessary to apply a sealing glue 440 on the sides of the electronic paper film 20 and the passivation layer 360. The shape of the protective structure 351 of this embodiment is annular. Compared with the shape of the protective structure 351 of the first embodiment, the annular protective structure 351 can also block the flow of the sealing glue 440 when applying the sealing glue 440, thereby preventing the sealing glue 440 from flowing outward and causing coating failure.

[0084] Fig.10 is a schematic flow chart of a method for preparing an array substrate according to an embodiment of the present application. Fig.11 10-11, the present application further discloses a method for preparing an array substrate 30, the method for preparing the array substrate 30 is used to prepare the array substrate 30 described above, and the steps include:

[0085] S1: forming a first metal layer on the substrate;

[0086] S2: forming a first insulating layer on the first metal layer;

[0087] S3: forming a second metal layer on the first insulating layer;

[0088] S4: forming a second insulating layer on the second metal layer;

[0089] S5: forming the passivation layer on the second insulating layer, wherein the passivation layer covers the display area, and a boundary of the passivation layer is located within the bonding area;

[0090] S6: forming a pixel electrode layer on the passivation layer.

[0091] Compared with the existing solution in which the passivation layer 360 directly covers the second insulating layer 340, the present application shrinks the boundary of the passivation layer 360 to a position within the bonding area 33. In this way, after the electronic paper film 20 is bonded, the passivation layer 360 covering the display area 31 will not be exposed and will not come into contact with water vapor in the air, thereby improving the performance of the electronic paper display panel 10 in resisting water vapor intrusion, reducing the failure rate of the electronic paper display panel 10, and improving the user experience.

[0092] Fig.12 is a schematic flow chart of a method for preparing a first protection structure and a passivation structure according to an embodiment of the present application, Figure 13a-Figure 13c FIG. 1 is a schematic diagram of a process for preparing a first protective structure and a passivation structure according to an embodiment of the present application. Figure 12-13c As shown, the step S5: forming the passivation layer on the second insulating layer, the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area, and then further includes the steps of:

[0093] S7: forming a protection structure on the second insulating layer in the exposed area;

[0094] S8: forming a passivation structure on the protection structure in the exposed area;

[0095] In short, the passivation layer 360 is prepared first, and then the protective layer 350 is set on the exposed area 34, and then the protective structure 351 is formed; finally, the passivation structure 361 is formed on the protective structure 351, thereby completing the preparation of the protective structure 351 and the passivation structure 361.

[0096] By setting a passivation structure 361 on the protective structure 351, it is equivalent to setting a double-layer protective structure 351. Then, when a sharp object hits, the passivation structure 361 will be detached from the protective structure 351, thereby completing the force unloading, and the protective structure 351 below the impacted position will still be retained, thereby preventing the previously impacted position from losing the function of protecting the metal wire below.

[0097] What’s more important is that only one layer of protection structure 351 remains at the impacted position, while the passivation structure 361 is still retained above the protection structure 351 in the surrounding area. Therefore, a sunken area is formed at the impacted position. When a secondary impact occurs, it will first hit the passivation layer 360 around the sunken area, further improving the protection effect.

[0098] Fig.14 is a schematic flow chart of a method for preparing a second protective structure and a passivation structure according to an embodiment of the present application, Figure 15a-Figure 15b FIG. 1 is a schematic diagram of a process for preparing a second protective structure and a passivation structure according to an embodiment of the present application. Figure 14-15b As shown, in addition to the above-mentioned method, it is also possible to first prepare the protection structure 351, and then simultaneously prepare the passivation layer 360 and the passivation structure 361. The specific steps are as follows:

[0099] S1: forming a first metal layer on the substrate;

[0100] S2: forming a first insulating layer on the first metal layer;

[0101] S3: forming a second metal layer on the first insulating layer;

[0102] S4: forming a second insulating layer on the second metal layer;

[0103] S51: forming a protection structure on the second insulating layer, wherein the protection structure is located in the exposed area;

[0104] S52: synchronously forming a passivation layer and a passivation structure on the second insulating layer, wherein the passivation layer covers the display area, and a boundary of the passivation layer is located within the bonding area, and the passivation structure is disposed on the protection structure and is located on a side of the protection structure away from the substrate;

[0105] S6: forming a pixel electrode layer on the passivation layer.

[0106] In simple terms, before preparing the passivation layer 360, a protective structure 351 is first formed in the exposed area 34, and then the passivation structure 361 is formed on the protective structure 351 and the passivation layer 360 is formed on the second insulating layer 340 in the bonding area 33. Compared with the first scheme of preparing the protective structure 351 and the passivation structure 361, before preparing the passivation layer 360, a protective structure 351 is first formed in the exposed area 34, and then the passivation structure 361 is formed on the protective structure 351 and the passivation layer 360 is formed on the second insulating layer 340 in the bonding area 33. This method does not require the separate preparation of the passivation structure 361, which can save process.

[0107] It should be noted that the limitations on the various steps involved in this solution, without affecting the implementation of the specific solution, are not deemed to limit the order of the steps. The steps written in front can be executed first, or later, or even simultaneously. As long as this solution can be implemented, it should be deemed to fall within the scope of protection of this application.

[0108] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0109] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. An array substrate for use in an electronic paper display panel, characterized in that: The array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a passivation layer and a pixel electrode layer, wherein the first metal layer, the first insulating layer, the second metal layer, the second insulating layer, the passivation layer and the pixel electrode layer are sequentially stacked on the substrate; The array substrate comprises a display area, a non-display area, a bonding area and an exposed area, wherein the non-display area is arranged around the display area, the bonding area covers the entire display area and a portion of the non-display area close to the display area, the bonding area is used to bond the electronic paper film, and a portion of the non-display area not covered by the bonding area is defined as the exposed area; The passivation layer covers the display area, and the boundary of the passivation layer is located within the lamination area; The array substrate further comprises a protective layer, which is arranged on a side of the second insulating layer away from the substrate and is located in the exposed area, a gap is arranged between the protective layer and the passivation layer, the material of the second insulating layer comprises polyvinyl chloride, and the material of the protective layer comprises polyvinyl chloride; The array substrate also includes a passivation structure, the material of the passivation structure is the same as the material of the passivation layer, the material of the passivation layer includes soluble polytetrafluoroethylene, and the passivation structure is arranged on the side of the protective structure away from the substrate; the protective layer includes a plurality of protective structures, the orthographic projection of the protective structure on the substrate covers the passivation structure, and the plane where the substrate is located is defined as the first plane, and the cross-sectional area of ​​the protective structure in the direction of the first plane is greater than the cross-sectional area of ​​the passivation structure in the direction of the first plane. When a sharp object hits, the passivation structure will detach from the protective structure, thereby completing the force unloading, and the protective structure below the impacted position is still retained.

2. The array substrate according to claim 1, characterized in that: The plurality of protection structures are arranged in a dotted pattern, each of the protection structures is arranged at intervals, and each of the protection structures is evenly arranged on a side of the second insulating layer away from the substrate and located in the exposed area.

3. The array substrate according to claim 1, characterized in that: The protective layer includes a plurality of strip-shaped protective structures, each of which is arranged at intervals, and the protective structures are arranged on a side of the second insulating layer away from the substrate and located in the exposed area; the extension direction of the array substrate from the inside to the outside is defined as a first direction, and the length directions of the protective structures located on two opposite sides of the exposed area are the same, and the length direction of the protective structures is the same as the first direction.

4. The array substrate according to claim 1, characterized in that: The protection layer includes a plurality of annular protection structures, each of which is arranged at intervals, and is arranged on a side of the second insulating layer away from the substrate and in the exposed area, and each of which is arranged around the periphery of the bonding area.

5. A method for preparing an array substrate, characterized in that: The method for preparing the array substrate is used to prepare the array substrate as claimed in any one of claims 1 to 4, and the steps include: forming a first metal layer on the substrate; forming a first insulating layer on the first metal layer; forming a second metal layer on the first insulating layer; forming a second insulating layer on the second metal layer; forming the passivation layer on the second insulating layer, wherein the passivation layer covers the display area, and a boundary of the passivation layer is located within the bonding area; A pixel electrode layer is formed on the passivation layer.

6. The method for preparing an array substrate according to claim 5, characterized in that: The step of forming the passivation layer on the second insulating layer, wherein the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area, comprises: forming a protection structure on the second insulating layer, wherein the protection structure is located in the exposed area; A passivation layer and a passivation structure are simultaneously formed on the second insulating layer, wherein the passivation layer covers the display area, and the boundary of the passivation layer is located within the bonding area, and the passivation structure is arranged on the protection structure and is located on the side of the protection structure away from the substrate.

7. An electronic paper display panel, characterized in that: The electronic paper display panel includes an electronic paper film and an array substrate as described in any one of claims 1 to 4, wherein the electronic paper film is adhered to the bonding area on the array substrate, and the electronic paper display panel also includes a frame sealing glue, which is adhered to the sides of the electronic paper film and the passivation layer.

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