A multi-channel parallel heat exchange device for semiconductors

Abstract

A multi-channel parallel heat exchange device for semiconductors, characterized in that it comprises an internal flow channel body (1) and a heat conducting plate (2), a refrigeration plate (4), a multi-channel microchannel heat sink (5), a microchannel guide plate (6) and a microchannel cover plate (7) symmetrically mounted on both sides of the internal flow channel body (1); a plurality of flow channel areas (8) are symmetrically arranged on both sides of the internal flow channel body (1), and a plurality of corrosive liquid flow cavities are formed between each flow channel area (8) and the heat conducting plate (2) mounted closely; the refrigeration plate (4) is mounted on the heat conducting plate (2), a multi-channel microchannel heat sink (5) is mounted on the outer side of the refrigeration plate (4), a microchannel guide plate (6) is covered on the multi-channel microchannel heat sink (5), and a microchannel cover plate (7) is mounted on the outer side of the microchannel guide plate (6). The present invention adopts multi-channel parallel flow channels for simultaneous control, so the temperature is more stable and uniform, the real-time temperature control accuracy reaches 0.1°C, and the energy consumption is reduced by 30%.

Description

Technical Field

[0001] The invention relates to a semiconductor technology, in particular to a corrosion liquid heating technology used in semiconductor processing, specifically to a multi-path parallel heat exchange device for semiconductors. Background Art

[0002] In the semiconductor manufacturing process, etching liquid is needed to remove unwanted materials, such as oxides and metal impurities on the surface of semiconductor materials. It can also be used to remove tiny defects and damage. In addition, etching liquid can also be used in processes such as cleaning and degumming. The semiconductor etching liquid needs to be cooled or heated to adjust its temperature to maintain the stability of the etching process, protect the surface of the semiconductor material, and prevent the corrosive agent from volatilizing or decomposing.

[0003] Most existing technologies use a series heat exchange method and design left and right unidirectional flow channels. The flow channels are long and the fluid movement trajectory is chaotic. Due to uneven temperature and pressure, the heat dissipation effect is poor, the cooling and heating capacity is reduced, the energy consumption is high, and the service life of the device is shortened, thus affecting the chip quality.

[0004] Chinese Patent 2021105429899 discloses a semiconductor refrigeration temperature control device, which uses a semiconductor refrigeration chip to cool or heat the corrosion liquid tank as a whole. It has slow speed, low efficiency and low control accuracy.

[0005] Chinese Patent 2008100894051 discloses a temperature regulating device for a chemical solution, which also uses a semiconductor refrigeration chip to heat or cool the corrosive liquid tank as a whole. Its working principle and effect are similar to those of Chinese Patent 2021105429899.

[0006] In summary, existing semiconductor etching liquid temperature control devices generally have problems such as low heat exchange uniformity, low efficiency and high energy consumption, which must be improved. Summary of the invention

[0007] The purpose of the present invention is to design a multi-path parallel heat exchange device for semiconductors in view of the problems of low efficiency and poor uniformity of the existing semiconductor etching liquid temperature regulating device.

[0008] The technical solution of the present invention is:

[0009] A multi-channel parallel heat exchange device for semiconductors, characterized in that it includes an internal flow channel body and heat conducting plates, cooling plates, multi-channel microchannel heat sinks, microchannel guide plates and microchannel cover plates symmetrically installed on both sides of the internal flow channel body; multiple flow channel areas are symmetrically arranged on both sides of the internal flow channel body, and multiple corrosive liquid flow chambers are formed between each flow channel area and the heat conducting plates installed closely, and each corrosive liquid flow chamber is provided with a corrosive liquid partition, and the corrosive liquid partitions are alternately installed on the cavity wall of the corrosive liquid flow chamber so that the corrosive liquid flows in an S shape; each corrosive liquid flow chamber is provided with a liquid inlet and a liquid outlet, each liquid inlet is connected to a liquid inlet pipe through an internal cavity, and each liquid outlet is also connected to the internal cavity through an internal cavity. The cavity is connected with the liquid outlet pipe; the refrigeration plate is installed on the heat conduction plate, and a multi-channel microchannel heat sink is installed on the outer side of the refrigeration plate. A plurality of cooling water flow chambers are arranged on the side of the multi-channel microchannel heat sink that is not in contact with the refrigeration plate, and a cooling water baffle is arranged in the cooling water flow chamber. A microchannel guide plate is covered on the side of the multi-channel microchannel heat sink that is provided with the cooling water flow chamber. The cooling water enters the microchannel guide plate from the water inlet at the upper part of the microchannel guide plate and is distributed to each cooling water flow chamber through the water inlet channel inside the microchannel guide plate, and then flows out through the water outlet channel inside the microchannel guide plate and is finally discharged from the water outlet at the lower part of the microchannel guide plate; a microchannel cover plate is installed on the outer side of the microchannel guide plate.

[0010] An energy storage plate is installed between the heat conducting plate and the refrigeration plate. The energy storage plate 3 stores the heat energy or cold energy of the refrigeration plate to accelerate the transfer of the heat energy or cold energy.

[0011] Both sides of the corrosive liquid partition are provided with partition blocks which play the role of slowing down the flow rate and stirring and mixing.

[0012] The spacer is in a polygonal structure, with a triangular structure being the best, with the corner tip of the triangle pointing to the side with a low flow rate.

[0013] The number of the spacers on both sides of the corrosive liquid partition is at least two, and three is optimal. The three (triangular) spacers are arranged in a triangle, two of which are arranged side by side at a position with high flow rate, and the other is arranged at a position with low flow rate.

[0014] There are at least two cooling water baffles in each cooling water flow cavity, and their function is to make the cooling water entering the cooling water flow cavity flow in an S shape to increase the heat dissipation effect.

[0015] Beneficial effects of the present invention:

[0016] The present invention adopts multiple parallel flow channels, which correspond one to one and control simultaneously, making the temperature more stable and uniform, increasing the temperature deviation of the refrigeration plate, increasing the energy storage of the heat transfer block, improving the fluid heat exchange efficiency, achieving a real-time temperature control accuracy of 0.1°C, and reducing energy consumption by 30%. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure decomposition of the present invention.

[0018] Figure 2 It is a structural schematic diagram of the internal flow channel body of the present invention.

[0019] Figure 3 It is a structural schematic diagram of the multi-channel microchannel heat sink of the present invention.

[0020] Figure 4 It is a structural schematic diagram of the microchannel guide plate of the present invention.

[0021] In the figure: 21 is the upper baffle of the internal flow channel body 1, 22 is the lower baffle of the internal flow channel body 1, 23 is a U-shaped connecting pipe connecting the left and right cooling water inlets, and 24 is a bolt hole for installing the connecting bolts that connect the multi-channel heat sink, microchannel guide plate and microchannel cover plate into one. DETAILED DESCRIPTION

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and so on quoted in this specification are only for the convenience of description, and are not used to limit the scope of implementation. The change or adjustment of their relative relationship should also be regarded as the scope of implementation of the present invention without substantially changing the technical content.

[0024] like Figure 1-Figure 4 As shown, a multi-channel parallel heat exchange device for semiconductors includes an internal flow channel body 1 and a heat conducting plate 2, an energy storage plate 3, a cooling plate 4, a multi-channel microchannel heat sink 5, a microchannel guide plate 6 and a microchannel cover plate 7 symmetrically installed on both sides of the internal flow channel body 1, as shown in FIG. Figure 1 As shown; the energy storage plate 3 is installed between the heat conducting plate 2 and the cooling plate 4. The energy storage plate 3 can store the heat energy or cold energy of the cooling plate 4 so that more heat energy or cold energy can be released when accelerated cooling or heating is needed to make up for the lack of cooling plate power. A plurality of flow channel areas 8 are symmetrically arranged on both sides of the internal flow channel body 1, such as Figure 2 As shown, a plurality of corrosion liquid flow chambers are formed between each flow channel area 8 and the heat conducting plate 2 installed closely. Figure 2There are 6 flow channel areas 8 in the middle, which can form 6 corrosion liquid flow chambers. The number of them can be designed according to the needs during the specific implementation. A sealing ring is installed on the side of the heat conducting plate 2 that is combined with the internal flow channel body 1 to prevent the corrosion liquid from leaking. Each corrosion liquid flow chamber is provided with a corrosion liquid partition 13, which is alternately installed on the wall of the corrosion liquid flow chamber so that the corrosion liquid flows in an S shape. In order to reduce the flow rate and increase the mixing effect of the corrosion flow, a partition block 14 that slows down the flow rate and stirs and mixes can be set on both sides of the corrosion liquid partition 13. The partition block 14 can be a polygonal structure, among which the isosceles triangle structure is the best, and the corner tip of the isosceles triangle points to the side with low flow rate. The number of the partition blocks 14 on both sides of the corrosion liquid partition 13 is at least two, among which three is the best. The three partition blocks are arranged in a triangle, two of which are arranged side by side at a high flow rate, and the other is arranged at a low flow rate. Each corrosive liquid flow cavity is provided with a liquid inlet 9 and a liquid outlet 10, each liquid inlet 9 is connected to a liquid inlet pipe 11 through an internal cavity, and each liquid outlet 10 is also connected to a liquid outlet pipe 12 through an internal cavity; the cooling plate 4 can be directly mounted on the heat conducting plate 2, or an energy storage plate 3 can be installed between the two, and the energy storage plate 3 can store heat or cold energy in advance so as to achieve faster cooling or heating when used. A multi-channel microchannel heat sink 5 is installed on the outer side of the cooling plate 4, such as Figure 3 As shown, a plurality of cooling water flow chambers 15 are provided on one side of the multi-channel microchannel heat sink 5 that is not in contact with the cooling plate. A cooling water baffle 16 is provided in the cooling water flow chamber 15. The number of cooling water baffles 16 in each cooling water flow chamber 15 is at least two, and the function of the baffles 16 is to make the cooling water entering the cooling water flow chamber 15 flow in an S shape to increase the heat dissipation effect. A microchannel guide plate 6 is covered on one side of the multi-channel microchannel heat sink 5 with the cooling water flow chamber 15, as shown in FIG. Figure 4 As shown, cooling water enters the microchannel guide plate 6 from the water inlet 17 on the microchannel guide plate 6 and is distributed to each cooling water flow cavity 15 through the water inlet channel 19 inside the microchannel guide plate 6, and then flows out through the water outlet channel 20 inside the microchannel guide plate 6 and is finally discharged from the water outlet 18 of the microchannel guide plate 6; a microchannel cover plate 7 is installed on the outer side of the microchannel guide plate 6, and the multi-channel channel heat sink, microchannel guide plate and microchannel cover plate are connected into a closed whole by connecting bolts passing through corresponding bolt holes 24.

[0025] The present invention adopts multiple parallel flow channels. Figure 2 The medium-corrosive liquid is cooled or heated in six parallel circuits, with one left and one right corresponding to each other and controlled at the same time. The temperature is more stable and uniform, the temperature deviation of the refrigeration plate is increased, the energy storage plate is added to store energy, the fluid heat exchange efficiency is improved, the real-time temperature control accuracy can reach 0.1°C, and the energy consumption is reduced by 30%.

[0026] The present invention adopts multi-path heat dissipation, which can quickly dissipate the heat generated by the refrigeration plate and realize rapid temperature regulation. Figure 3 It adopts 12-way water temperature regulation, the regulating effect is very obvious, and the overall heat dissipation effect is significantly better than the existing technology.

[0027] The above embodiments are only preferred implementation modes of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and equivalent substitutions without departing from the principles of the present invention. These technical solutions after improvements and equivalent substitutions to the claims of the present invention all fall within the protection scope of the present invention.

[0028] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

Claims

1. A multi-way parallel heat exchange device for semiconductors, characterized in that It comprises an internal flow channel body (1) and heat conducting plates (2), cooling plates (4), multi-flow channel microchannel heat dissipation plates (5), microchannel guide plates (6) and microchannel cover plates (7) symmetrically mounted on both sides of the internal flow channel body (1); a plurality of flow channel areas (8) are symmetrically arranged on both sides of the internal flow channel body (1); a plurality of corrosive liquid flow cavities are formed between each flow channel area (8) and the heat conducting plates (2) mounted closely thereto; a corrosive liquid partition plate (13) is arranged in each flow channel area (8); The corrosive liquid partitions (13) are alternately installed on the opposite flow channel walls of the flow channel area (8) so that the corrosive liquid flows in an S shape; each corrosive liquid flow cavity is provided with a liquid inlet (9) and a liquid outlet (10), each liquid inlet (9) is connected to a liquid inlet pipe (11) through an internal cavity, and each liquid outlet (10) is also connected to a liquid outlet pipe (12) through an internal cavity; the cooling plate (4) is installed on the heat conducting plate (2), and a multi-channel microchannel heat sink is installed on the outer side of the cooling plate (4) (5), a multi-channel microchannel heat sink (5) is provided with a plurality of cooling water flow chambers (15) on a side not in contact with the refrigeration plate, a cooling water baffle (16) is provided in the cooling water flow chamber (15), and a microchannel guide plate (6) is covered on a side of the multi-channel microchannel heat sink (5) provided with the cooling water flow chamber (15), and cooling water enters the microchannel guide plate (6) from a water inlet (17) on an upper part of the microchannel guide plate (6) and passes through a water inlet channel (19) inside the microchannel guide plate (6). The cooling water is distributed to each cooling water flow cavity (15), then flows out through the outlet flow channel (20) inside the microchannel guide plate (6) and is finally discharged from the outlet (18) at the bottom of the microchannel guide plate (6); a microchannel cover plate (7) is installed on the outside of the microchannel guide plate (6); an energy storage plate (3) is installed between the heat conduction plate (2) and the refrigeration plate (4), and the energy storage plate (3) stores the heat energy or cold energy of the refrigeration plate (4) to accelerate the transfer of heat energy or cold energy.

2. The semiconductor multi-way parallel heat exchange device according to claim 1, characterized in that Both sides of the corrosive liquid partition (13) are provided with partition blocks (14) for slowing down the flow rate and stirring and mixing.

3. The semiconductor multi-way parallel heat exchange device according to claim 2, characterized in that The spacer (14) has a polygonal structure.

4. The semiconductor multi-way parallel heat exchange device according to claim 3, characterized in that The spacer (14) has a triangular structure.

5. The semiconductor multi-way parallel heat exchange device according to claim 2, characterized in that The number of the spacers (14) on both sides of the corrosive liquid partition (13) is at least two.

6. The semiconductor multi-way parallel heat exchange device according to claim 5, characterized in that The number of the spacers (14) on both sides of the corrosive liquid partition (13) is three, and the three spacers are arranged in a triangle, two of which are arranged side by side at a position with a high flow rate, and the other is arranged at a position with a low flow rate.

7. The semiconductor multi-way parallel heat exchange device according to claim 1, characterized in that The number of cooling water baffles (16) in each cooling water flow cavity (15) is at least two, and their function is to make the cooling water entering the cooling water flow cavity (15) flow in an S shape to increase the heat dissipation effect.

8. The semiconductor multi-way parallel heat exchange device according to claim 1, characterized in that Sealing rings for preventing the corrosion liquid from leaking are correspondingly provided on the heat conducting plates (2) on both sides of the internal flow channel body.

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