A heat sink, a power module, and an uninterruptible power supply

Abstract

The application provides a radiator, a power module and an uninterruptible power supply, the radiator having two substrates and corresponding first fin groups, and a concentrated heat conduction part and corresponding second fin groups connecting the two substrates. Through the design of the structure, in addition to the heat conduction path of the first fin group, the heat of the heat generating device can be first conducted to the concentrated heat conduction part with large heat capacity and small thermal resistance and temporarily collected, and then conducted out through the second fin group, avoiding the defect that the conventional radiator is prone to cause heat accumulation when bearing the instantaneous high heat generating device, and enabling the fin to be more easily processed, and the radiator to have a larger heat exchange area.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and in particular to a heat sink, a power module, and an uninterruptible power supply. Background Technology

[0002] A heat sink is a component used to help heat-generating devices dissipate heat in a timely manner, preventing the devices from overheating and being damaged. Heat sinks are divided into active cooling and passive cooling, and there are also combinations of active and passive cooling. Active cooling is exemplified by air-cooled heat sinks, while passive cooling is exemplified by heat sink fins.

[0003] Currently, electrical equipment such as power modules typically uses a separate heat sink for each heat-generating component. Furthermore, to meet the heat dissipation requirements of each component under extreme conditions (especially harsh operating conditions), the heat sinks within these devices are often made large, resulting in a less compact design. In actual operation, electrical equipment often operates in different modes, and the heat-generating components are not always working. This leads to wasted heat sink capacity and low overall heat dissipation efficiency.

[0004] In addition, some electrical equipment may experience situations where heat-generating components generate a large amount of heat instantaneously. Conventional heat sinks cannot cope with this instantaneous high heat generation, which can easily lead to heat accumulation and affect the heat dissipation capacity of the power module. Summary of the Invention

[0005] This invention provides a heat sink, a power module, and an uninterruptible power supply. By optimizing the structure of the heat sink, it is able to cope with the instantaneous high heat generation of heat-generating devices.

[0006] This invention provides a heat sink, including a substrate with opposing first and second sides, the first side being connected to a heat-generating device; wherein the substrate includes a first substrate and a second substrate, the first sides of the first and second substrates being used to connect to the heat-generating device; a concentrated heat-conducting section connected to the second sides of the first and second substrates, and used to concentrate and conduct a portion of the heat conducted to the first and second substrates outwards; a first heat sink group having a plurality of first heat sinks; the first heat sink group being connected to the second sides of both the first and second substrates to dissipate a portion of the heat from the first and second substrates; and a second heat sink group having a plurality of second heat sinks; the second heat sinks of the second heat sink group being connected to the concentrated heat-conducting section to dissipate the heat conducted from the first and second substrates to the concentrated heat-conducting section.

[0007] Furthermore, the centralized heat-conducting part is configured to correspond to the position of the core heat-generating part of the heat-generating device on the first substrate and the second substrate.

[0008] Furthermore, the first substrate, the second substrate, the centralized heat-conducting part, the first heat sink assembly, and the second heat sink assembly are integrally formed.

[0009] Furthermore, the first substrate and the second substrate are perpendicularly connected to each other; the concentrated heat-conducting part has a triangular structure, the extension direction of each second heat sink is parallel to the extension direction of each first heat sink, and the extension direction of each second heat sink is perpendicular to the first connecting surface, the first connecting surface being the plane formed by the connection position of the second heat sink and the concentrated heat-conducting part.

[0010] Furthermore, some of the first heat sinks are connected to the second side of the first substrate, and the remaining first heat sinks are connected to the second side of the second substrate; a plurality of first heat sinks in the first heat sink group extend in the same direction and are spaced apart from each other, each first heat sink having a first end and a second end in the extending direction, the first end of the first heat sink being connected to the second side of the first substrate or the second substrate, and the second end of the first heat sink extending away from the first substrate and the second substrate; a plurality of second heat sinks in the second heat sink group extend in the same direction and are spaced apart from each other, each second heat sink having a first end and a second end in the extending direction, the first end of the second heat sink being connected to the concentrated heat-conducting part, and the second end of the second heat sink extending away from the concentrated heat-conducting part; the extending direction of each first heat sink and each second heat sink forms an angle with both the first substrate and the second substrate.

[0011] Furthermore, the second ends of the first heat sink and the second heat sink are flush with the end face of the first substrate or the end face of the second substrate.

[0012] This invention also provides a power module, comprising: a heat-generating device, including a first power device and a second power device; the first power device is adapted to work in conjunction with the second power device, the second power device including a first sub-power device and a second sub-power device that work alternately with each other; and a plurality of heat sinks as described in any of the foregoing technical solutions, wherein a first substrate of the heat sink is used to connect the first power device, and a second substrate of the heat sink is used to connect the first sub-power device and / or the second sub-power device in the second power device.

[0013] Furthermore, it also includes a circuit board assembly, comprising a first PCB board and a second PCB board arranged parallel to each other and respectively used for electrically connecting the first power device and the second power device, wherein each heat sink is fixedly disposed between the first PCB board and the second PCB board; the first substrate is parallel to the first PCB board and the second PCB board, and the second substrate is perpendicular to the first PCB board and the second PCB board.

[0014] Furthermore, there are multiple heat sinks, which are spaced apart along the length of the second PCB board, and the length is perpendicular to the plane on the first side of the second substrate; both the first PCB board and the second PCB board are connected to multiple sets of bus capacitors, which are located between the first PCB board and the second PCB board, with each set of bus capacitors close to one of the heat sinks.

[0015] This invention also provides an uninterruptible power supply, including a power module as described in any of the foregoing technical solutions; wherein the first power device is an inverter power transistor, the second power device is a rectifier power transistor; the first sub-power device is an AC power device, and the second sub-power device is a battery power device.

[0016] This invention provides a heat sink, a power module, and an uninterruptible power supply. The heat sink structure has a concentrated heat-conducting section connecting two substrates and a corresponding second heat sink assembly. The presence of the concentrated heat-conducting section increases the cross-sectional path of heat conduction, reduces the thermal resistance of the heat-generating device, and has a larger heat capacity. This allows the instantaneous high heat emitted by the heat-generating device to be first conducted to the concentrated heat-conducting section with a large heat capacity and low thermal resistance, where it is temporarily collected, and then discharged through the second heat sink assembly. This avoids the defect of conventional heat sinks where the thin substrate supports instantaneous high-heat-generating devices, which is prone to heat accumulation due to high thermal resistance and low heat capacity. In addition, the presence of the concentrated heat-conducting section can shorten the length of the second heat sink to a certain extent, making the heat sink easier to manufacture, with smaller and denser spacing between the heat sinks, allowing the heat sink to have a larger heat exchange area.

[0017] Furthermore, in the power module, the first and second sub-power devices in the second power device work alternately, while the first and second power devices work together. That is to say, there is a mode in which the first power device works with either the first or second sub-power device. In this case, the first and second power devices are both placed on the same heat sink, so that the heat sink is suitable for dissipating heat for both the first and second power devices. In actual operation, since there are always working power devices on the heat sink, its heat dissipation capacity can always be utilized. Thus, by sharing a heat sink with two types of power devices, the volume occupied by the heat sink can be reduced, and the heat dissipation capacity of the heat sink can be fully utilized and utilized, optimizing the heat dissipation method in the power module and improving the overall heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 A schematic diagram of a heat sink provided for implementation of the present invention;

[0019] Figure 2 A schematic diagram of the heat sink from another perspective provided for the implementation of the present invention;

[0020] Figure 3 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0021] Figure 4 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0022] Figure 5 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0023] Figure 6 A schematic diagram showing the connection between the heat sink, the inverter power transistor, and the rectifier power transistor for the purpose of implementing the present invention;

[0024] Figure 7 A schematic diagram of the structure of a power module provided for the implementation of this invention;

[0025] Figure 8 An exploded structural diagram of a power module provided for implementation of the present invention;

[0026] Explanation of reference numerals in the attached figures

[0027] 10. Rectifier-inverter device; 100. Heat sink; 110. Substrate; 111. First side; 1111. First side of first substrate; 1112. Second side of first substrate; 112. Second side; 1121. First side of second substrate; 1122. Second side of second substrate; 113. First substrate; 1131. End face of first substrate; 114. Second substrate; 1141. End face of second substrate; 120. First heat sink assembly; 121. First heat sink; 1211. First end; 1212. Second end; 130. Centralized heat conduction part; 131. First connecting surface; 140. Second heat sink assembly; 141. Second heat sink; 200. Heat-generating device; 300. Inverter board; 310. Inverter power transistor; 400. Rectifier board; 410. Rectifier power transistor; 500. Bus capacitor; α1. First preset angle; α2. Second preset angle. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0029] The specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the specific technical features in this invention will not be described separately.

[0030] In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate that the objects have the sameness or relationship. It should be understood that the directional descriptions "above," "below," "outside," and "inside" refer to the directions under normal use, while "left" and "right" directions refer to the left and right directions shown in the corresponding diagrams, which may or may not be the left and right directions under normal use.

[0031] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one…" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. The term "connection," unless otherwise specified, includes both direct and indirect connections.

[0032] In specific embodiments, the heat sink is suitable for heat dissipation in any electronic product. For example, it is suitable for heat dissipation of the motherboard in an electronic product; for example, it is suitable for heat dissipation of an uninterruptible power supply (UPS); for example, it is also suitable for heat dissipation of the power supply in a dual-circuit or dual-switch electrical product. For ease of explanation, the following description uses the application of the heat sink to uninterruptible power supply heat dissipation as an example.

[0033] Currently, most heat dissipation methods involve separate heat dissipation designs for each functional heat-generating component, meaning that the heat dissipation path for each component is independent. When some heat-generating components are not operating or are operating at low power, the utilization rate of the heat dissipation equipment is low, resulting in wasted resources. Furthermore, separate heat dissipation designs require significant space, potentially leading to wasted space utilization. Some structures, in an effort to save space, concentrate heat-generating components on the same substrate of the heat sink, which may cause excessive heat concentration and hinder timely heat dissipation. Additionally, the long heat transfer path results in poor heat dissipation. To address these issues, this application provides a heat sink to overcome these problems.

[0034] In some embodiments, such as Figures 1 to 5 As shown, the heat sink 100 includes a substrate 110 and a first heat sink assembly 120. The substrate 110 has a first side 111 and a second side 112 opposite to each other. The first side 111 is connected to the heat-generating device 200. The first heat sink assembly 120 has a plurality of first heat sinks 121, and the first heat sinks 121 are connected to the second side 112 of the substrate 110.

[0035] First, the heat sink 100 is a structure used to dissipate heat from the heat-generating device 200. The heat-generating device 200 includes power devices of various functions, such as rectifier power transistors of rectifier power devices, inverter power transistors of inverter power devices, etc. The specific types are not limited, and any power device that needs to be dissipated is acceptable.

[0036] The heat sink 100 itself includes a substrate 110, which is used to fix the heat-generating device 200 and achieve heat conduction. The heat-generating device 200 is fixedly connected to the substrate 110. The specific connection method can be determined according to the actual situation. For example, the heat-generating device 200 is bonded to the substrate 110. The heat generated by the heat-generating device 200 is transferred to the substrate 110 and then transferred from the substrate 110 to the heat sink for heat dissipation.

[0037] In order to shorten the heat transfer path of the substrate 110 and accelerate the heat dissipation efficiency, the substrate 110 has a first side 111 and a second side 112 opposite to each other in the thickness direction. The first side 111 is connected to the heat-generating device 200; the second side 112 is connected to the first heat sink 121. The heat generated by the heat-generating device 200 only needs to pass through the thickness of the substrate 110 to be dissipated through the first heat sink 121, which greatly reduces the heat transfer path.

[0038] To avoid excessive heat concentration and to distribute the heat-generating devices 200 as much as possible, the substrate 110 of the heat sink 100 may include multiple parts. The substrate 110 includes at least a first substrate 113 and a second substrate 114. The first side 111 includes the first side 1111 of the first substrate and the first side 1121 of the second substrate. The second side 112 includes the second side 1112 of the first substrate and the second side 1122 of the second substrate. The first side 1111 of the first substrate and the first side 1121 of the second substrate are respectively connected to different heat-generating devices 200. It should be noted that different heat-generating devices 200 include the same heat-generating component and different heat-generating components. Specifically, it can be understood that, firstly, the same heat-generating component has multiple heat-generating ends, and different heat-generating ends are connected to different substrates, that is, the first substrate 113 and the second substrate 114 together conduct heat for the same heat-generating component; secondly, two completely different heat-generating components are respectively connected to different substrates, that is, the first substrate 113 and the second substrate 114 conduct heat for different heat-generating components. The first heat sink assembly 120 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The first heat sink assembly 120 can conduct heat out of the first substrate 113 and the second substrate 114.

[0039] For example, the heat sink 100 has a cubic structure with 6 faces. The substrate 110 of the heat sink 100 includes two parts, namely a first substrate 113 and a second substrate 114. The first substrate 113 and the second substrate 114 occupy 2 of the 6 faces of the cube respectively. The first substrate 113 and the second substrate 114 can be arranged adjacently or oppositely, depending on the actual heat dissipation requirements.

[0040] For example, such as Figure 4 As shown, a first substrate 113 and a second substrate 114 are arranged opposite to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. In this structure, the first substrate first side 1111 and the first substrate first side 1121 are arranged back to back. The first substrate first side 1111 and the first substrate first side 1121 are respectively connected to different heat-generating devices 200. The first substrate second side 1112 and the second substrate second side 1122 are arranged opposite to each other. One end of the first heat sink 121 is connected to the first substrate second side 1112, and the other end of the first heat sink 121 is connected to the second substrate second side 1122, so that the first heat sink 121 is simultaneously connected to the first substrate second side 1112 and the second substrate second side 1122. In this way, different heat-generating devices 200 transfer heat to the first heat sink 121 in the middle through the first substrate 113 and the second substrate 114 on both sides of the heat sink 100, and jointly use the same first heat sink 121 for heat dissipation.

[0041] For example, such as Figure 2As shown, the first substrate 113 and the second substrate 114 are arranged adjacent to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. The first substrate 113 and the second substrate 114 are connected. In this structure, the first substrate first side 1111 and the second substrate first side 1121 form a first preset angle, defined as α1. For a cubic structure like the heat sink 100, the first preset angle α1 is 90 degrees. Depending on the structure, the first substrate... The first side 1111 of the first substrate and the first side 1121 of the second substrate form a first preset angle α1, which also varies accordingly. The first side 1111 of the first substrate and the first side 1121 of the second substrate are arranged adjacent to each other. The first side 1111 of the first substrate and the first side 1121 of the second substrate are respectively connected to different heat-generating devices 200. The second side 1112 of the first substrate and the second side 1122 of the second substrate are also arranged adjacent to each other. Considering the convenience of processing, some of the first heat sinks 121 can be connected to the second side 1112 of the first substrate, and the remaining first heat sinks 121 are connected to the second side 1122 of the second substrate. In this structure, the first heat sinks 121 connected to the first substrate 113 and the second substrate 114 are different. The heat-generating device 200 connected to the first substrate 113 mainly relies on the first heat sink 121 connected to the first substrate 113 for heat dissipation, while the heat-generating device 200 connected to the second substrate 114 mainly relies on the first heat sink 121 connected to the second substrate 114 for heat dissipation.

[0042] For example, such as Figure 5 As shown, the heat sink 100 has a cubic structure with 6 faces. The base plate 110 of the heat sink 100 includes three parts: a first base plate 113, a second base plate 114, and a third base plate 115. The first base plate 113, the second base plate 114, and the third base plate 115 each occupy 3 of the 6 faces of the cube. The first base plate 113, the second base plate 114, and the third base plate 115 can be arranged in pairs or in sequence, depending on the actual heat dissipation requirements.

[0043] For example, the first substrate 113, the second substrate 114 and the third substrate 115 are adjacent to each other, and any two of the first heat sinks 121 in the heat sink 100 can be connected. The first heat sink 121 is connected to the first substrate 113 and the second substrate 114 respectively, the first heat sink 121 is connected to the second substrate 114 and the third substrate 115 respectively, and the first heat sink 121 is connected to the first substrate 113 and the third substrate 115 respectively.

[0044] For example, in order to achieve a good ventilation channel, the first substrate 113, the second substrate 114 and the third substrate 115 can be connected in sequence. Similarly, the first heat sink 121 can be connected to any one of the first substrate 113, the second substrate 114 and the third substrate 115, or any two of them.

[0045] It should be noted that, as Figure 2 As shown, multiple first heat sinks 121 in the first heat sink group 120 extend in the same direction and are spaced apart from each other. The spacing includes uniform spacing and non-uniform spacing. When multiple first heat sinks 121 are arranged in parallel spacing, the distance between two adjacent first heat sinks 121 is the tooth gap B, and the distance from the connection position to the other end away from the connection position of the first heat sink 121 is the tooth height H. When manufacturing the radiator 100 using processing technology such as aluminum extrusion or die casting, the higher the H / B ratio, the greater the processing difficulty, the lower the service life of the corresponding mold, and the higher the defect rate of the manufactured radiator 100. However, the heat dissipation area of ​​the radiator 100 per unit volume is limited, and the increase of the tooth gap B will also lead to a lower wind speed and thus a lower heat transfer coefficient. Therefore, it is necessary to comprehensively consider the magnitude of the tooth height H and the tooth gap B and their corresponding ratio.

[0046] The heat sink provided by the present invention includes a substrate and a first heat sink assembly. The substrate has a first side and a second side facing each other. The first heat sink assembly has a plurality of first heat sinks. The first side is connected to a heat-generating device, thereby conducting the heat generated by the heat-generating device to the substrate. The second side is connected to the first heat sinks, thereby quickly dissipating the heat introduced into the substrate through the first heat sinks. The arrangement on both sides effectively shortens the heat conduction path of the substrate, improves the heat dissipation efficiency, and also increases the contact area between the first heat sink and the air. This avoids the situation where some circulating air does not contact the heat sink due to the heat-generating device and the first heat sink being arranged on the same side, thus preventing air leakage and reducing the heat dissipation efficiency. Furthermore, the substrate includes at least a first substrate and a second substrate. The first side includes a first side of the first substrate and a first side of the second substrate, and the second side includes a second side of the first substrate and a second side of the second substrate. By connecting the first side of the first substrate and the first side of the second substrate to different heat-generating devices, and connecting the first heat sink group to the second side of the first substrate and the second side of the second substrate respectively, the problem of excessive heat concentration and low heat dissipation efficiency caused by concentrating multiple heat-generating devices on the same substrate surface can be effectively avoided. At the same time, the multiple parts of the substrate are connected to the same set of heat sinks, which improves the utilization rate of the heat sink, saves the space occupied by the heat sink, and also improves the heat dissipation efficiency of the heat sink.

[0047] In some embodiments, such as Figure 2As shown, the first heat sink 121 has a first end 1211 and a second end 1212 in its extending direction. The first end 1211 is connected to the first substrate 113 or the second substrate 114, and the second end 1212 extends away from the first substrate 113 and the second substrate 114. The extending direction of the first heat sink 121 forms a second preset angle with the second side 1112 of the first substrate, that is, the spacing direction of each first heat sink 121 forms an angle with both substrates. Specifically, considering that the first substrate 113 and the second substrate 114 are arranged adjacently, the first side 1111 of the first substrate and the first side 1121 of the second substrate form a first preset angle α1, for example, the first preset angle α1 is 90 degrees. The first substrate 113 and the second substrate 114 are arranged in an L-shaped structure. The first end 1211 and the second end 1212 of the first heat sink 121 can be selected to be connected to one of the first substrate 113 or the second substrate 114, thereby realizing that each substrate is individually connected to the first heat sink 121, which can effectively improve the heat dissipation efficiency. Considering that dust may accumulate on the first heat sink 121, potentially reducing its heat dissipation efficiency, the first heat sink 121 can be arranged at an angle to minimize dust accumulation. Specifically, when the heat sink 100 is placed horizontally, the first substrate 113 is located at the top of the heat sink 100, and the second substrate 114 is located on the side of the heat sink 100. The first end 1211 of the first heat sink 121 is connected to either the first substrate 113 or the second substrate 114, and the extending direction of the first heat sink 121 forms a second pre-angle with the second side 1112 of the first substrate. Let α2 be the included angle. When the first preset included angle α1 is 90 degrees, the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate is complementary to the second preset included angle α2. The specific size of the second preset included angle α2 is not limited. The larger the included angle α2 is, the larger the tilt angle of the first heat sink 121 is, and the lower the probability of dust accumulation. The larger the included angle α2 is, the smaller the included angle between the first heat sink 121 and the second substrate 114 is, which may cause inconvenience to the manufacturing and processing of the heat sink 100. Therefore, a comprehensive consideration is required. For example, if the second preset included angle α2 is 45 degrees, then the angle between the extension direction of the first heat sink 121 and the second side 1112 of the first substrate, as well as the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate, are both 45 degrees. When the first substrate 113 and the second substrate 114 have the same shape and size, the first heat sink 121 is evenly distributed on the first substrate 113 and the second substrate 114, half of the first heat sink 121 is connected to the first substrate 113, and the other half of the first heat sink 121 is connected to the second substrate 114.

[0048] In some embodiments, such as Figure 2 and Figure 3As shown, the heat sink 100 further includes a concentrated heat-conducting section 130 and a second heat sink assembly 140. The concentrated heat-conducting section 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively, for concentrating and conducting a portion of the heat conducted to the first substrate 113 and the second substrate 114 outwards. The second heat sink assembly 140 includes a plurality of second heat sinks 141, which are connected to the concentrated heat-conducting section 130 to dissipate the heat conducted from the first substrate 113 and the second substrate 114 to the concentrated heat-conducting section 130. Specifically, the first side 1121 of the second substrate 114 is connected to the heat-generating device 200, and the second side 1122 of the second substrate 114 is connected to the first heat sink 121. The heat-generating device 200 only occupies a part of the first side 1121 of the second substrate, and the entire second side 1122 of the second substrate is connected to the first heat sink 121. The temperature of the connection position occupied by the heat-generating device 200 is necessarily higher than that of other areas not connected to the heat-generating device 200. The heat is quickly transferred through the second substrate 114 to the nearest first heat sink 121, which may cause the temperature of some of the first heat sink 121 to be too high, resulting in untimely heat dissipation and some of the first heat sink 121 not fully exerting its heat dissipation function. To address heat dissipation efficiency, and to ensure faster and more uniform heat dissipation for each heat sink, thereby improving the utilization efficiency of individual heat sinks and preventing excessive heat concentration on certain heat sinks, a concentrated heat-conducting section 130 is provided on the heat sink 100. The concentrated heat-conducting section 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The heat sink 100 also includes a second heat sink 141, which is connected to the concentrated heat-conducting section 130. It should be noted that the second heat sink 141 has the same structural performance as the first heat sink 121; however, due to their different connection positions, they are referred to as the first heat sink 121 and the second heat sink 141 for ease of distinction. By setting the centralized heat conduction part 130, the thickness of the substrate can be increased, the heat transfer path is wider, and the heat capacity of the heating device 200 on the first substrate 113 and the heating device 200 on the second substrate 114 can be effectively increased in the corresponding area of ​​the substrate. The core heat-generating part of the heating device (such as the chip part of the IGBT power transistor) can be aligned with the centralized heat conduction part, which can effectively deal with the instantaneous high heat generation and high loss of the heating device. At the same time, the larger the thickness of the heat conduction part, the smaller the corresponding thermal resistance. The centralized heat conduction part 130 can reduce the thermal resistance of heat transfer to its central area. Not only can the instantaneous high heat generation of the heating device be temporarily concentrated in the centralized heat conduction part, but it can also make the temperature uniformity of the first heat sink 121 and the second heat sink 141 better and the heat dissipation more uniform. In addition, the centralized heat conduction part 130 can also reduce the tooth height of the second heat sink 141, which is convenient for the processing and manufacturing of the heat sink 100, thereby facilitating the realization of a denser heat dissipation tooth array and thus achieving a larger heat exchange area.

[0049] The specific shape of the centralized heat-conducting part 130 is not limited, and the entire heat sink 100 can be a one-piece molded structure. In this embodiment, the first substrate 113, the second substrate 114, the centralized heat-conducting part 130, the first heat sink assembly, and the second heat sink assembly are all integrally molded by aluminum extrusion or die casting processes.

[0050] In some embodiments, such as Figure 3 As shown, the concentrated heat-conducting part 130 has a cubic structure. The concentrated heat-conducting part 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The second heat sink 141 is connected to the two sides of the concentrated heat-conducting part 130.

[0051] In some embodiments, such as Figure 2 As shown, multiple second heat sinks 141 in the second heat sink group extend in the same direction and are spaced apart from each other. Each second heat sink also has a first end and a second end in its extending direction. The first end of each second heat sink 141 is connected to the centralized heat conduction part 130, and the second end of each second heat sink 141 extends away from the centralized heat conduction part 130. It can be seen that the extending direction of the second heat sink 141 is parallel to the extending direction of the first heat sink 121, and the extending direction of the second heat sink 141 is perpendicular to the first connecting surface 131, which is the plane formed by the connection point between the second heat sink 141 and the centralized heat conduction part 130. Specifically, the concentrated heat-conducting part 130 is a right-angled triangular prism structure (triangular construction). The two right-angled faces of the right-angled triangular prism are connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The other face of the right-angled triangular prism is the first connecting surface 131. The second heat sink 141 is connected to the first connecting surface 131, and the extension direction of the second heat sink 141 is perpendicular to the first connecting surface 131.

[0052] In some embodiments, such as Figure 2 As shown, considering the space utilization of the heat sink 100 and minimizing space waste, the first end 1211 of the first heat sink 121 is connected to the first substrate 113 or the second substrate 114, and the second end 1212 of the first heat sink 121 extends away from the first substrate 113 and the second substrate 114, and the second end 1212 of the first heat sink 121 is flush with the end face 1131 of the first substrate or the end face 1141 of the second substrate. If the heat sink 100 also includes a concentrated heat conduction part 130 and a second heat sink 141, one end of the second heat sink 141 is connected to the concentrated heat conduction part 130, and the second end of the second heat sink 141 also extends away from the first substrate 113 and the second substrate 114, and the second end of the second heat sink 141 is also flush with the end face of the first substrate 113 or the end face of the second substrate 114.

[0053] This application also provides a power module 10. In this embodiment, it is described using an uninterruptible power supply as an example. It is constructed as a power module in a modular uninterruptible power supply, namely, a rectifier-inverter device 10, such as... Figures 6 to 8 As shown, the rectifier-inverter device 10 includes a heat sink 100, a heat-generating device 200, an inverter board 300, and a rectifier board 400. The inverter board 300 can be understood as a first PCB board, on which a first power device, namely an inverter power transistor 310, is electrically connected. The inverter power transistor 310 is connected to the first substrate 113. The rectifier board 400 can also be understood as a second PCB board, on which a second power device, namely a rectifier power transistor 410, is electrically connected. The rectifier power transistor 410 is connected to the second substrate 114. The heat-generating device 200 includes both the first and second power devices. Specifically, by interconnecting multiple power modules (rectifier-inverter devices 10), an uninterruptible power supply (UPS) further provided by the present invention is formed, thereby realizing UPS technology.

[0054] To facilitate understanding, let's first briefly explain uninterruptible power supply (UPS) technology. A UPS is a type of uninterruptible power supply containing energy storage devices, primarily used to provide uninterrupted power to equipment with high power stability requirements. When the mains input is normal, the UPS stabilizes the mains voltage and supplies it to the load. In this state, the UPS acts as an AC voltage regulator, simultaneously charging its internal battery. When the mains power is interrupted, the UPS immediately switches from the battery's DC power to the load via an inverter, continuing to supply 220V AC power, ensuring the load maintains normal operation and protecting its hardware and software from damage. UPS devices typically provide protection against both overvoltage and undervoltage. Uninterruptible power supplies (UPS) are widely used in: mining, aerospace, industry, communications, defense, hospitals, computer terminals, network servers, network equipment, data storage devices, emergency lighting systems, railways, shipping, transportation, power plants, substations, nuclear power plants, fire safety alarm systems, wireless communication systems, program-controlled exchanges, mobile communications, solar energy storage and conversion equipment, control equipment and their emergency protection systems, personal computers, and other fields. For electrical equipment with dual circuits or dual switches, there are also scenarios similar to the alternating operation of rectifier and battery modes in UPS systems.

[0055] Uninterruptible power supplies (UPS) have multiple operating states, and the losses of different power devices vary in different operating states. They typically operate in an alternating manner, mainly divided into a bypass section and a power section. The power section includes heat-generating devices 200, such as inverter power transistors 310 and rectifier power transistors 410. The power section is further divided into mains power state and battery power state. In mains power state, battery-related power devices in the rectifier circuit, such as IGBTs, diodes, and inductors, are temporarily not operating, while the mains power devices in the rectifier circuit and the power devices in the inverter circuit operate continuously. In battery power state, the battery-related power devices in the rectifier circuit and the power devices in the inverter circuit operate continuously, while the mains power devices in the rectifier circuit are temporarily not operating. In other words, the second power device includes a first sub-power device and a second sub-power device that operate alternately, meaning that the rectifier power transistor 410 includes mains-powered power devices and battery-powered power devices. The first power device can work in conjunction with the second power device. In mains-powered mode, the inverter power transistor 310 works in conjunction with the mains-powered power devices in the rectifier power transistor 410; in battery-powered mode, the inverter power transistor 310 works in conjunction with the battery-powered power devices in the rectifier power transistor 410. Even in both mains-powered and battery-powered modes, the power devices in the inverter circuit continuously operate, and their losses under different operating conditions vary. By connecting the inverter power transistor 310 on the inverter board 300 to the first substrate 113, and the rectifier power transistor 410 on the rectifier board 400 to the second substrate 114, the inverter power transistor 310 and the rectifier power transistor 410 are prevented from being concentrated on the same substrate surface, thus avoiding excessive heat concentration. Simultaneously, using the same heat sink 100 for both the inverter power transistor 310 and the rectifier power transistor 410 improves the utilization rate of the heat sink. Even when the power transistors operate in alternating states, there is no waste of the heat sink 100's performance. It is understood that the aforementioned alternating operation is not limited to the situation where one device is on and the other is off; it can also cover the situation where one device operates at relatively high power and the other at relatively low power.

[0056] In some embodiments, such as Figure 7As shown, the rectifier-inverter device 10 includes an inverter board 300 and a rectifier board 400. The inverter board 300 and the rectifier board 400 are arranged vertically at intervals and parallel to each other. The specific form is not limited. It is acceptable for the inverter board 300 to be above the rectifier board 400 or for the rectifier board 400 to be above the inverter board 300. The following description will take the case where the inverter board 300 is above the rectifier board 400 as an example. After installation, the extension direction of the inverter board 300 and the rectifier board 400 is parallel to the horizontal. Taking a parallel plane as an example, the heat sink 100 is located between the inverter board 300 and the rectifier board 400. Its specific fixing position can be determined according to the actual situation. For example, the heat sink 100 can be fixed on the PCB board with the rectifier power tube 410, that is, on the rectifier board 400. Its specific fixing method can also be determined according to the requirements. For example, the heat sink 100 is soldered to the rectifier board 400, or the heat sink 100 is fixed to the rectifier board 400 by screws. The first substrate 113 and the second substrate 114 of the heat sink 100 are arranged adjacently and connected. The first preset included angle α1 between the first side 1111 of the first substrate and the first side 1121 of the second substrate is 90 degrees. The first substrate 113 and the second substrate 114 are arranged in an L-shaped structure. After placement, the specific structure is that the first substrate 113 is parallel to the horizontal plane and the second substrate 114 is parallel to the vertical direction, that is, the extension direction of the second substrate 114 is perpendicular to the extension direction of the inverter board 300. The first substrate 113 of the heat sink 100 is connected to the inverter power transistor 310, and the second substrate 114 of the heat sink 100 is connected to the rectifier power transistor 410. This effectively saves the space occupied by the rectifier-inverter device 10 in the height direction and improves space utilization. At the same time, the heat sink 100 includes a first heat sink 121 and a second heat sink 141. The first heat sink 121 and the second heat sink 141 are parallel, and the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate is 45 degrees, which facilitates the heat dissipation of the inverter power transistor 310 and the rectifier power transistor 410.

[0057] In some embodiments, to further improve the heat dissipation efficiency of the heat sink, the rectifier-inverter device 10 also includes a fan. The specific arrangement of the fan can be determined according to the actual situation. It should be noted that, in order to ensure that the airflow generated by the fan can better contact the first heat sink 121 and the second heat sink 141 for heat exchange, the direction of the airflow generated by the fan is approximately parallel to the plane where the second side 112 of the substrate 110 is located. Specifically, it can be understood that the direction of the airflow is parallel to the width direction of the rectifier-inverter device 10 (e.g., ...). Figure 8(As indicated by the middle arrow), the inverter board 300 and rectifier board 400 are arranged vertically in the height direction, the multiple heat sinks 100 are arranged sequentially in the length direction, and the direction perpendicular to both the length and height directions is the width direction. In the width direction, airflow enters from one end of the heat sink 100 and fully exchanges heat with the first heat sink 121 and the second heat sink 141, and then exits from the other end of the heat sink 100. In some embodiments, such as Figure 7 and Figure 8 As shown, there are multiple heat sinks 100, which are spaced apart along the length of the rectifier plate 400. The length direction is perpendicular to the plane of the first side 1121 of the second substrate. Multiple sets of bus capacitors 500 are connected to both the inverter plate 300 and the rectifier plate 400 of the rectifier-inverter device 10. To further optimize the layout and improve the structural compactness, the bus capacitors 500 are located between the inverter plate 300 and the rectifier plate 400, and are arranged side by side with the heat sinks 100 to save space in the height direction of the rectifier-inverter device 10. Based on the number of bus capacitors 500 and heat sinks 100, the bus capacitors 500 and heat sinks 100 are arranged adjacent to each other, with one set of bus capacitors 500 close to one heat sink 100. To improve the heat dissipation effect, bus capacitors 500 are located on both sides of the heat sink 100, and heat sinks 100 are located on both sides of the bus capacitors 500. This structure can effectively avoid heat concentration between two adjacent heat sinks 100 and accelerate the heat dissipation efficiency.

[0058] In some embodiments, the power devices in the inverter circuit operate continuously, regardless of whether it is in mains power mode or battery mode, meaning that the inverter power transistor 310 continuously generates heat. Considering that the rectifier power transistor 410 includes mains power devices and battery power devices, in mains power mode, the mains power devices in the rectifier power transistor 410 operate and generate heat, while the battery power devices in the rectifier power transistor 410 stop operating and do not generate heat; in battery mode, the battery power devices in the rectifier power transistor 410 operate and generate heat, while the mains power devices in the rectifier power transistor 410 stop operating and do not generate heat. Therefore, the mains power devices and battery power devices in the rectifier power transistor 410 operate alternately.

[0059] Regarding the connection between the second substrate 114 and the second power device, the embodiments of the present invention include two main connection methods. The first method is to connect the second substrate of the same heat sink to either the first sub-power device or the second sub-power device. The second method is to connect the second substrate of the same heat sink to both the first sub-power device and the second sub-power device.

[0060] For example, the first substrate 113 of the heat sink 100 is connected to the inverter power transistor 310, and the second substrate 114 of the heat sink 100 is connected to both the mains-powered and battery-powered power devices in the rectifier power transistor 410. Regardless of the state, the inverter power transistor 310 on the first substrate 113 continuously generates heat, while the mains-powered and battery-powered power devices on the second substrate 114 alternately generate heat. This can be simply understood as the first substrate 113 and the second substrate 114 constantly generating heat. This structure also facilitates installation, as the installation method for each heat sink 100 is identical, improving installation efficiency.

[0061] For example, the first substrate 113 of the heat sink 100 is connected to the inverter power transistor 310, and the second substrate 114 of the heat sink 100 is connected to one of the mains-powered power devices and the battery-powered power devices in the rectifier power transistor 410. That is, the mains-powered power devices and the battery-powered power devices are respectively connected to the second substrate 114 of different heat sinks 100. For example, if the first substrate 113 of the same heat sink 100 is connected to the inverter power transistor 310, and its second substrate 114 is connected to the mains-powered power device, in the mains-powered state, both the first substrate 113 and the second substrate 114 generate heat, while in the battery-powered state, only the first substrate 113 generates heat. In another heat sink 100, the first substrate 113 is connected to the inverter power transistor 310, and its second substrate 114 is connected to the battery-powered power device. In the mains-powered state, only the first substrate 113 generates heat, while in the battery-powered state, both the first substrate 113 and the second substrate 114 generate heat.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A heat sink, characterized by, The heat sink comprises: a substrate having opposite first and second sides, the first side being connected with a heat generating device; wherein the substrate comprises a first substrate and a second substrate, the first sides of the first and second substrates are both used to connect the heat generating device; the first substrate and the second substrate are connected with each other perpendicularly; a concentrated heat conduction part connected with the second sides of the first and second substrates and used to concentrate and conduct outwardly part of the heat conducted to the first and second substrates; a first fin group having a plurality of first fins; the first fin group is connected with the second sides of the first and second substrates to conduct part of the heat of the first and second substrates; and a second fin group having a plurality of second fins; the second fins of the second fin group are connected with the concentrated heat conduction part to conduct the heat conducted to the concentrated heat conduction part by the first and second substrates; the extension directions of the second fins are parallel to the extension directions of the first fins; wherein part of the first fins are connected with the second side of the first substrate and the rest of the first fins are connected with the second side of the second substrate; the first fins in the first fin group extend in the same direction and are arranged at intervals, the first fins have first ends and second ends in the extension direction, the first ends of the first fins are connected with the second sides of the first and second substrates, and the second ends of the first fins extend away from the first and second substrates; the second fins in the second fin group extend in the same direction and are arranged at intervals, the second fins have first ends and second ends in the extension direction, the first ends of the second fins are connected with the concentrated heat conduction part, and the second ends of the second fins extend away from the concentrated heat conduction part; the extension directions of the first and second fins are both at an angle to the first and second substrates.

2. The heat spreader of claim 1, wherein: The concentrated heat conduction part is configured to correspond to the positions of the core heat generating parts of the heat generating devices on the first and second substrates.

3. The heat spreader of claim 2, wherein: The first substrate, the second substrate, the concentrated heat conduction part, the first fin group and the second fin group are integrally formed.

4. The heat sink of claim 3, wherein: the concentrated heat conduction part is triangular in structure, the extension directions of the second fins are perpendicular to the first connecting surfaces, and the first connecting surfaces are planes formed by the connecting positions of the second fins and the concentrated heat conduction part.

5. The heat spreader of claim 4, wherein: The second ends of the first and second fins are flush with the end surfaces of the first substrate or the end surfaces of the second substrate.

6. A power module, characterized by The heat sink comprises: a heat generating device comprising a first power device and a second power device; the first power device is adapted to work cooperatively with the second power device, and the second power device comprises first and second sub-power devices working alternately with each other; and A plurality of heat sinks as claimed in any one of claims 1-5, the first substrate of the heat sink being configured to connect the first power device, and the second substrate of the heat sink being configured to connect a first sub-power device and / or a second sub-power device of the second power device.

7. The power module of claim 6, wherein, Further comprising: a circuit board member comprising a first PCB board and a second PCB board arranged parallel to each other and configured to electrically connect the first power device and the second power device, respectively, each of the heat sinks being fixedly arranged between the first PCB board and the second PCB board; the first substrate being parallel to the first PCB board and the second PCB board, and the second substrate being perpendicular to the first PCB board and the second PCB board.

8. The power module of claim 7, wherein: a plurality of the heat sinks are arranged at intervals along a length direction of the second PCB board, the length direction being perpendicular to a plane in which the first side of the second substrate lies; the first PCB board and the second PCB board are each connected to a plurality of groups of bus capacitors, the bus capacitors being located between the first PCB board and the second PCB board, and one group of the bus capacitors being located close to one of the heat sinks.

9. An uninterruptible power supply, characterized by: comprising the power module as claimed in any one of claims 6-8; wherein the first power device is an inverter power tube, and the second power device is a rectifier power tube; the first sub-power device is a mains power device, and the second sub-power device is a battery power device.

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