Flexible interconnect circuit and manufacturing method thereof

Abstract

A flexible interconnect circuit assembly and a method for manufacturing the same are provided. In some examples, the flexible interconnect circuit includes a plurality of integrally integrated circuit portions. During manufacturing, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected so that smaller sheets can be used for circuit manufacturing. The portions are then unfolded into the final design configuration. In some examples, the assembly also includes an adhesive film and a temporary support film attached to the adhesive film, such that two circuit portions at least partially overlap with the adhesive film and are located between the adhesive film and the temporary support film. In some examples, at least some of the circuit portions extend past the boundary of the adhesive film and are coupled to a connector.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims patent rights under 35 U.S.C. §119(e) to (1) U.S. Provisional Patent Application 63 / 268,358, filed February 22, 2022, by Jean-Paul Ortiz et al., entitled “Folded Arrangements of Flexible Interconnect Circuits and Methods of Fabricated Thereof” (Attorney Docket No. CLNKP020P), (2) U.S. Provisional Patent Application 63 / 363,032, filed April 15, 2022, by Jean-Paul Ortiz et al., entitled “Flexible Interconnect Circuits with Integrated Circuit Elements” (Attorney Docket No. CLNKP021P), and (3) U.S. Provisional Patent Application 63 / 363,032, filed April 15, 2022, by Jean-Paul Ortiz et al., entitled “Flexible Interconnect Circuits with Integrated Circuit Elements” (Attorney Docket No. CLNKP021P), and (4) U.S. Provisional Patent Application 63 / 363,032, filed August 29, 2022, by Mark Terlaak et al., entitled “Molded Seal Interconnect Circuits with Integrated Circuit Elements” (Attorney Docket No. CLNKP021P).

[0013] The present invention relates to a process for the manufacture and sale of a modular, modular, and modular wire harness comprising a molded, sealed interconnect harness, which is hereby incorporated by reference in its entirety for all purposes. Background Art

[0003] Electrical power and control signals are typically transmitted to various components (e.g., in a vehicle or any other machine or system) using multiple wires bundled together in a wire harness. While flat, flexible interconnect circuits are gaining traction for such applications, forming such circuits requires large sheets of metal foil and insulation, much of which is wasted. Furthermore, transporting and installing flexible interconnect circuits can be challenging due to their large, flat arrangement.

[0004] There is a need for novel flexible interconnect circuits that are folded into specific configurations to reduce material waste during manufacturing and / or also improve installation efficiency. Summary of the Invention

[0005] A flexible interconnect circuit assembly and a method for manufacturing the same are provided. In some examples, the flexible interconnect circuit includes a plurality of integrally integrated circuit portions. During manufacturing, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected so that smaller sheets can be used for circuit manufacturing. The portions are then unfolded into the final design configuration. In some examples, the assembly also includes an adhesive film and a temporary support film attached to the adhesive film, such that two circuit portions at least partially overlap with the adhesive film and are located between the adhesive film and the temporary support film. In some examples, at least some of the circuit portions extend past the boundary of the adhesive film and are coupled to a connector.

[0006] A method for forming a flexible interconnect circuit assembly is provided. In some examples, the method includes providing a flexible interconnect circuit, the flexible interconnect circuit comprising: a first circuit portion and a second circuit portion integrally integrated with the first circuit portion. Each of the first circuit portion and the second circuit portion is an elongated structure extending parallel to a principal axis of the flexible interconnect circuit. Each of the first circuit portion and the second circuit portion comprises: a first side and a second side opposite the first side. The first side of the first circuit portion and the first side of the second circuit portion face the same direction. The method also includes folding the second circuit portion relative to the first circuit portion such that the second circuit portion is no longer parallel to the principal axis of the flexible interconnect circuit and such that the second side of the first circuit portion and the second side of the second circuit portion face opposite directions after the folding. The method also includes attaching an adhesive film to the second side of the first circuit portion and the first side of the second circuit portion, and attaching a temporary support film to the adhesive film such that the first side of the first circuit portion and the second side of the second circuit portion face the temporary support film.

[0007] In some examples, the first circuit portion terminates at a first connector. The first connector and the portion of the first circuit portion adjacent to the first connector extend beyond the boundary of the adhesive film. In some examples, the first connector and the portion of the first circuit portion adjacent to the first connector overlap the boundary of the temporary support film.

[0008] In some examples, before folding, the first circuit portion and the second circuit portion are coplanar. In the same or other examples, after folding, a portion of the first side of the first circuit portion directly abuts a portion of the first side of the second circuit portion.

[0009] In some examples, the first side of the first circuit portion and the first side of the second circuit portion are formed by a first insulating layer, the first insulating layer being monolithic. The second side of the first circuit portion and the second side of the second circuit portion are formed by a second insulating layer, the second insulating layer being monolithic and bonded to the first insulating layer. In a more specific example, each of the first circuit portion and the second circuit portion includes: one or more conductive traces, the one or more conductive traces being positioned between the first insulating layer and the second insulating layer such that the first insulating layer and the second insulating layer are bonded together around the one or more conductive traces. In some examples, providing the flexible interconnect circuit includes forming the one or more conductive traces of the first circuit portion and the second circuit portion by patterning a metal foil.

[0010] In some examples, the first circuit portion and the second circuit portion form a main circuit portion. The flexible interconnect circuit includes support tabs, each formed from at least the first insulating layer and the second insulating layer, extending from an edge of the main circuit portion and integral with the main circuit portion. Each of the support tabs includes a support tab opening for receiving a fastener when securing the flexible interconnect circuit.

[0011] In a more specific example, the flexible interconnect circuit includes a conductive trace and a support member, wherein the conductive trace and the support member are formed from the same conductive material and have the same thickness. The conductive trace is at least partially positioned between the first insulating layer and the second insulating layer in the main circuit portion. The support member is at least partially positioned between the first insulating layer and the second insulating layer in the support sheet and serves to reinforce the support sheet, thereby providing additional strength. In some examples, the support member is electrically isolated from each of the conductive traces. Alternatively, the support member is integral with at least one of the conductive traces. In some examples, the second insulating layer includes a second insulator opening that is larger and concentric with the support sheet opening. The second insulating layer at least partially exposes the support member.

[0012] In some examples, the first circuit portion and the second circuit portion extending parallel to each other are separated by a slit. In the same or other examples, the method further includes arranging the flexible interconnect circuit into a shipping configuration selected from the group consisting of a planar sheet and a roll, wherein the roll includes additional flexible interconnect circuits.

[0013] In some examples, a flexible interconnect circuit assembly includes a flexible interconnect circuit comprising: a first circuit portion and a second circuit portion integrally integrated with the first circuit portion. Each of the first circuit portion and the second circuit portion includes a first side and a second side opposite the first side. The first side of the first circuit portion and the first side of the second circuit portion are formed by a first insulating layer. The second side of the first circuit portion and the second side of the second circuit portion are formed by a second insulating layer bonded to the first insulating layer. The second circuit portion is folded relative to the first circuit portion such that the second circuit portion is not parallel to the first circuit portion and such that the first side of the first circuit portion and the first side of the second circuit portion face opposite directions. The flexible interconnect circuit assembly further includes an adhesive film attached to the second side of the first circuit portion and the first side of the second circuit portion, and a temporary support film attached to the adhesive film such that the first side of the first circuit portion and the second side of the second circuit portion face the temporary support film.

[0014] In some examples, the flexible interconnect circuit assembly further comprises a first circuit portion that terminates at a first connector. The first connector, and a portion of the first circuit portion adjacent to the first connector, extend beyond the boundary of the adhesive film. The first connector and the portion of the first circuit portion adjacent to the first connector overlap with the boundary of the temporary support film. In some examples, the first side of the first circuit portion and the first side of the second circuit portion are formed by a first insulating layer that is integral. The second side of the first circuit portion and the second side of the second circuit portion are formed by a second insulating layer that is integral and bonded to the first insulating layer. In a more specific example, each of the first circuit portion and the second circuit portion comprises one or more conductive traces positioned between the first insulating layer and the second insulating layer such that the first insulating layer and the second insulating layer are bonded together around the one or more conductive traces. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A is a schematic plan view of a flexible interconnect circuit in a pre-folded state with a first side facing upward, according to some examples.

[0016] Figure 1B It is also in pre-folded state Figure 1A Schematic plan view of a flexible interconnect circuit in FIG, with the first side facing downward.

[0017] Figure 1C It is also in pre-folded state Figure 1A Schematic cross-sectional view of a flexible interconnect circuit in FIG, with the first side facing downward.

[0018] Figure 1D It is in the expanded state Figure 1A Schematic plan view of the flexible interconnect circuit in.

[0019] Figure 1E yes Figure 1D Schematic cross-sectional view of a portion of a flexible interconnect circuit.

[0020] Figure 2A and Figure 2B According to some examples, the adhesive film is in an unfolded state. Figure 1D Schematic plan view of the flexible interconnect circuit in.

[0021] Figure 3A According to some examples, there is an adhesive film and a temporary support film in an unfolded state. Figure 1D Schematic plan view of the flexible interconnect circuit in.

[0022] Figure 3B 、 Figure 3C and Figure 3D yes Figure 3A Schematic cross-sectional views of different parts of the flexible interconnect circuit.

[0023] Figure 4A is a schematic plan view of a flexible interconnect circuit assembly including multiple flexible interconnect circuits positioned on the same temporary support film, according to some examples.

[0024] Figure 4B It is arranged in rolls according to some examples Figure 4A Schematic side view of a flexible interconnect circuit assembly in FIG.

[0025] Figure 5 is a process flow diagram corresponding to a method of manufacturing a flexible interconnect circuit assembly, according to some examples.

[0026] Figure 6 is a process flow diagram corresponding to a method of mounting a flexible interconnect circuit assembly on a substrate structure, according to some examples.

[0027] Figure 7A 、 Figure 7B and Figure 7C is a schematic diagram of the flexible interconnect circuit during mounting of the assembly on a base structure according to some examples.

[0028] Figure 8Ais a schematic plan view of a flexible interconnect circuit including a flap portion in a pre-folded state, according to some examples.

[0029] Figure 8B It is in pre-folded state Figure 8A Schematic cross-sectional view of a flexible interconnect circuit in FIG.

[0030] Figure 8C It is in folded state Figure 8A Schematic cross-sectional view of a flexible interconnect circuit in FIG.

[0031] Figure 9A is a schematic plan view of a flexible interconnect circuit including a segmented flap portion in a pre-folded state, according to some examples.

[0032] Figure 9B and Figure 9C yes Figure 9A Schematic cross-sectional views of the flexible interconnect circuit at different locations.

[0033] Figure 10A is a schematic plan view of a flexible interconnect circuit in a pre-folded state including tab portions on different sides of the circuit, according to some examples.

[0034] Figure 10B and Figure 10C In pre-folded and folded states Figure 10A Schematic cross-sectional view of a portion of a flexible interconnect circuit.

[0035] Figure 10D and Figure 10E In pre-folded and folded states Figure 10A Schematic cross-sectional view of another portion of the flexible interconnect circuit.

[0036] Figure 10F It is flipping Figure 10F Schematic cross-sectional view of the portion of the flexible interconnect circuit following the portion shown in .

[0037] Figure 11 It is in the expanded state according to some examples Figure 10A Schematic plan view of the flexible interconnect circuit in.

[0038] Figure 12 is a process flow diagram corresponding to a method of manufacturing a flexible interconnect circuit assembly according to some examples

[0039] Figure 13A is a cross-sectional side view of a flexible interconnect circuit including a connector support portion with a stiffening metal layer, according to some examples.

[0040] Figure 13B Based on some examples Figure 13A A top view of a flexible interconnect circuit in FIG. 1 showing (exposed portions of) the conductive leads and the recesses for engaging the connector.

[0041] Figure 13C is a cross-sectional side view of another example of a flexible interconnect circuit including a connector support portion having an exposed stiffening metal layer according to some examples.

[0042] Figure 14A Is the use of connectors included Figure 13A A cross-sectional side view of a flexible interconnect assembly in a flexible interconnect circuit.

[0043] Figure 14B Based on some examples Figure 14A A top cross-sectional view of the flexible interconnect assembly in FIG. 1 shows the retaining pins of the connector extending into the recesses of the flexible interconnect circuit.

[0044] Figure 15A is a schematic top view of a flexible interconnect circuit including a support sheet for attaching the flexible interconnect circuit to a support structure, according to some examples.

[0045] Figure 15B Based on some examples Figure 15A Schematic top cross-sectional view of a portion of a flexible interconnect circuit in , illustrating various components of a support sheet.

[0046] Figure 15C and Figure 15D is a schematic side cross-sectional view of a support sheet used in a flexible interconnect circuit positioned over and attached to a support structure with fasteners, according to some examples.

[0047] Figure 16A is a top view schematic diagram of a flexible interconnect circuit including contact traces with temporary support links, according to some examples.

[0048] Figure 16B Based on some examples Figure 16B A side view schematic diagram of a flexible interconnect circuit in FIG, illustrating one example of a temporary support link.

[0049] Figure 16C and Figure 16D is a schematic top view of a portion of a flexible interconnect circuit illustrating additional examples of temporary support links, according to some examples.

[0050] Figure 16E 、 Figure 16F and Figure 16GAccording to some examples, the connector is attached to Figures 16A-16B Schematic side cross-sectional views of the flexible interconnect circuit at different stages.

[0051] Figure 17A is a schematic side cross-sectional view of a flexible interconnect circuit illustrating laser welding of two conductive layers through an insulating layer positioned in a laser beam path, according to some examples.

[0052] Figure 17B is a schematic top view of a flexible interconnect circuit illustrating solder nuggets formed in two conductive layers, according to some examples.

[0053] Figure 17C is a process flow diagram corresponding to a method for laser welding two conductive layers of a flexible interconnect circuit through an insulating layer positioned in a laser beam path, according to some examples.

[0054] Figure 18A is a schematic plan view of a molded sealed flexible interconnect circuit in a pre-folded state with a first side facing upward, according to some examples.

[0055] Figure 18B Based on some examples Figure 18A Schematic cross-sectional view of a molded encapsulated flexible interconnect circuit in FIG.

[0056] Figure 19A 、 Figure 19B 、 Figure 19C 、 Figure 19D and Figure 19E Illustrated are views of a molded encapsulated flexible interconnect circuit positioned within certain components, according to some examples.

[0057] Figure 20A and Figure 20B Illustrated is a cross-sectional view of another example molded encapsulated flexible interconnect circuit positioned within certain components, according to some examples.

[0058] Figure 21A and Figure 21B Schematic plan views illustrating techniques for forming molded encapsulated flexible interconnect circuits are shown, according to some examples.

[0059] Figure 21C and Figure 21D The figure illustrates a schematic plan view of another technique for forming a molded encapsulated flexible interconnect circuit according to some examples.

[0060] Figure 21E 、 Figure 21F and Figure 21G The figure illustrates a schematic plan view of another technique for forming a molded encapsulated flexible interconnect circuit according to some examples.

[0061] Figure 22 Illustrated is a process flow diagram corresponding to an example method for forming a molded encapsulated flexible interconnect circuit according to one or more examples.

[0062] Figure 23A 、 Figure 23B and Figure 23C Schematic plan views of molded encapsulated flexible interconnect circuits are shown in various components according to some examples. DETAILED DESCRIPTION

[0063] In the following description, numerous specific details are outlined to provide a thorough understanding of the concepts presented. In some examples, the concepts presented can be practiced without some or all of these specific details. In other examples, well-known process operations are not described in detail to unnecessarily obscure the concepts described. Although some concepts will be described in conjunction with specific examples, it should be understood that these examples are not intended to be limiting.

[0064] Flexible interconnect circuits are used to deliver power and / or signals and are used in a variety of applications, such as vehicles, appliances, electronic devices, and the like. One example of such a flexible interconnect circuit is a wiring harness. As described above, conventional wiring harnesses use a set of twisted small round wires. A separate polymer casing insulates each wire, increasing the size and weight of the wiring harness. Unlike conventional wiring harnesses, the flexible interconnect circuits described herein have a thin, flat profile that is achieved by thin electrical conductors that can be positioned side by side. Each electrical conductor can have a flat, rectangular profile. In some examples, the electrical conductors (positioned adjacent to each other) are formed from the same sheet of metal (e.g., foil). For the purposes of the present invention, the term "interconnect" may be used interchangeably with "interconnect circuit," the term "conductive layer" may be used interchangeably with "conductor" or "conductor layer," and the term "insulating layer" may be used interchangeably with "insulator."

[0065] Figures 1A-4B : Example of a flexible interconnect circuit assembly

[0066] As described above, manufacturing flat, flexible interconnect circuits solves many of the problems associated with conventional wiring harnesses, but results in significant material waste. For example, the overall perimeter of an interconnect circuit can be much larger than the area occupied by the actual physical portion of the circuit (e.g., conductive traces). This limitation is caused by conventional methods of manufacturing interconnect circuits (i.e., starting with a material that extends the entire perimeter of the circuit and removing (e.g., discarding) unused portions).

[0067] The flexible interconnect circuit assembly described herein is manufactured by folding different circuit parts relative to each other. For example, the two circuit parts can initially be parallel and adjacent to each other. One circuit part can be folded so that it extends in different directions (for example, perpendicular to the other part), thereby increasing the overall footprint of the interconnect circuit assembly. It should be noted that the two circuit parts are formed by the same starting material and are therefore integrally integrated. In order to help bond the circuit assembly to various surfaces (for example, vehicle panels), the assembly can include an adhesive film and a temporary support film attached to the adhesive film so that the circuit part at least partially overlaps with the adhesive film and is positioned between the adhesive film and the temporary support film. In some examples, a portion of the first circuit part extends through the boundary of the adhesive film and is coupled to the connector. In other words, the interconnect circuit assembly includes a flexible interconnect circuit, which is initially manufactured in a pre-folded state, thereby reducing the size of the material (for example, sheet) required for manufacturing the circuit. The flexible interconnect circuit is then unfolded so that the unfolded state corresponds to the application footprint (larger than the initial manufacturing footprint of the flexible interconnect circuit). Additional component parts are added to the flexible interconnect circuit in the unfolded state to form the assembly.

[0068] Figure 1A is a schematic diagram of the flexible interconnect circuit 100 in a pre-folded state, with the first side 103 facing upward, according to some examples. Figure 1B yes Figure 1B FIG. 1 is a schematic diagram of a flexible interconnect circuit 100 in FIG. 2 , wherein the second side 104 (opposite to the first side 103 ) faces upward. Figure 1A and Figure 1B The other figures also identify a first edge 101 and a second edge 102 to provide an orientation of the flexible interconnect circuit 100 and its components in space. The pre-folded state can also be referred to as the manufactured state. This state / shape is selected to reduce material waste during the manufacture of the flexible interconnect circuit 100. Figure 1D It is in the expanded state Figure 1A and Figure 1BSchematic diagram of the flexible interconnect circuit 100 in FIG. The unfolded state is formed by folding the various components (circuit portions) of the flexible interconnect circuit 100. The unfolded state may also be referred to as the installed state to distinguish it from the manufactured state (folded state). If a rectangular boundary (e.g., representing a sheet used for circuit fabrication) is drawn around the flexible interconnect circuit 100 in a pre-folded state (which may be referred to as the pre-folded footprint) and separately around the flexible interconnect circuit 100 in the unfolded state (which may be referred to as the unfolded footprint), the area of ​​the unfolded state boundary will be much larger than the area of ​​the pre-folded state boundary (e.g., 25% larger, 50% larger, or even 100% larger). This boundary area comparison illustrates the corresponding reduction in material waste associated with manufacturing the flexible interconnect circuit 100 in the pre-folded state. In addition, folding the flexible interconnect circuit 100 allows new orientations of the conductive leads in the flexible interconnect circuit 100 (e.g., crossing of the conductive leads in the folded state). It should be noted that crossing of the conductive leads is not possible in the pre-folded state because all conductive leads in the same layer are formed from the same metal sheet, as described below with reference to FIG. Figure 1C Further described.

[0069] refer to Figure 1A and Figure 1B , the flexible interconnect circuit 100 includes a first circuit portion 111 and a second circuit portion 112. As further described below, the first circuit portion 111 and the second circuit portion 112 are integrally integrated by various shared components of the flexible interconnect circuit 100. The first circuit portion 111 and the second circuit portion 112 are identified by folding patterns (e.g., a fold line extending between the first circuit portion 111 and the second circuit portion 112). Various fold lines are Figure 1A and Figure 1B An example of a folding line between the first circuit portion 111 and the second circuit portion 112 is shown in FIG. Figure 1A and Figure 1B Rendered in the expanded view provided between. Figure 1A The folding pattern / lines shown in FIG define a first circuit portion 111, a second circuit portion 112, a third circuit portion 113, a fourth circuit portion 114, a fifth circuit portion 115, a sixth circuit portion 116, and a seventh circuit portion 117. However, one of ordinary skill in the art will understand that any folding pattern and any number of circuit portions are within the scope.

[0070] In some examples, the fold lines extend to the corners of the slits. For example, various slits can be provided in the flexible interconnect circuit 100 to facilitate folding of different circuit portions relative to each other. Specifically, Figure 1AAn example of a flexible interconnect circuit 100 is shown, comprising a first slit 105 (extending between a second circuit portion 112 and a third circuit portion 113), a second slit 106 (extending between a fourth circuit portion 114 and the combination of the third circuit portion 113 and the fifth circuit portion 115), and a third slit 107 (extending between a sixth circuit portion 116 and a seventh circuit portion 117). One skilled in the art will appreciate that the flexible interconnect circuit 100 can have any number of slits, or no slits at all. For example, a single continuous strip without slits can be folded one or more times (e.g., to change direction), as shown by the third circuit portion 113 and the fifth circuit portion 115. Slits allow for branching of circuit portions. For example, a first circuit portion 111 extends to the first slit 105, at which point the first circuit portion 111 branches into the second circuit portion 112 and the third circuit portion 113.

[0071] refer to Figure 1A-1C , the flexible interconnect circuit 100 in a pre-folded state is defined by a first side 103 and a second side 104. The first side 103 is formed by a first insulating layer 151, and the second side 104 is formed by a second insulating layer 152. In some examples, the first insulating layer 151 is continuous or more specifically, integral to the entire flexible interconnect circuit 100, and can be referred to as a first integral insulating layer. Similarly, the second insulating layer 152 can be continuous or more specifically, integral to the entire flexible interconnect circuit 100, and can be referred to as a second integral insulating layer. The first insulating layer 151 and the second insulating layer 152 are bonded together, for example, laminated together, using an adhesive. In some examples, the flexible interconnect circuit 100 includes one or more additional insulating and / or adhesive layers positioned on the first insulating layer 151 and the second insulating layer 152. Reference Figure 1C , flexible interconnect circuit 100 also includes conductive traces 150 positioned and sealed (from the environment) between first insulating layer 151 and second insulating layer 152. In some examples, each of first circuit portion 111 and second circuit portion 112 includes at least one of conductive traces 150.

[0072] Thus, each of the first circuit portion 111 and the second circuit portion 112 includes a first side 103 and a second side 104, wherein the second side 104 is opposite the first side 103. Specifically, the first side 103 of the first circuit portion 111 and the first side 103 of the second circuit portion 112 are formed by the first insulating layer 151. In some examples, the first insulating layer 151 forms the first side 103 of the entire flexible interconnect circuit 100. For example, the first side 103 of all portions of the flexible interconnect circuit 100 is formed by the first insulating layer 151. Thus, all portions of the flexible interconnect circuit 100 are integrally integrated by the various components of the flexible interconnect circuit 100 (e.g., the first insulating layer 151, the second insulating layer 152, and the conductive traces 150). The second side 104 of the first circuit portion 111 and the second side 104 of the second circuit portion 112 are formed by the second insulating layer 152.

[0073] The first insulating layer 151 and the second insulating layer 152 provide electrical isolation and mechanical support for the conductive traces 150. In some examples, the first insulating layer 151 and the second insulating layer 152 can be initially processed in sheet or roll form and can then be laminated to the conductive layer using, for example, an adhesive material. The first insulating layer 151 and the second insulating layer 152 can include (or be formed from) polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), ethyl vinyl acetate (EVA), polyethylene (PE), polyvinyl fluoride (PVF), polyamide (PA), and / or polyvinyl butyral (PVB). Additional aspects of the first insulating layer 151 and the second insulating layer 152 (e.g., thickness) are described below.

[0074] In some examples, conductive trace 150 has a uniform thickness across the entire circuit boundary. For example, conductive trace 150 can be formed from the same metal sheet. More specifically, different (non-intersecting) portions of conductive trace 150 can be formed from the same metal sheet. In some examples, all conductive traces 150 are formed from the same material, such as aluminum, copper, etc. The use of aluminum (rather than copper) can help reduce overall circuit weight and also help lower the minimum achievable fuse current rating. Specifically, aluminum has a higher resistivity and a lower melting temperature than copper. Therefore, forming the fusible link in the aluminum conductive layer can allow for more precise control of the fusible parameters (for the same size tolerances). Generally, conductive trace 150 can be formed from any conductive material that is sufficiently conductive (e.g., a conductivity greater than 10^6 S / m or even greater than 10^7 S / m) to allow current to flow through the foil with low power loss.

[0075] In some examples, the conductive trace 150 may include a surface sublayer or coating for providing low electrical contact resistance and / or improving corrosion resistance. The surface sublayer can use techniques / materials including but not limited to welding, laser welding, resistance welding, ultrasonic welding, bonding with a conductive adhesive, or mechanical pressure to help form electrical interconnections. The surface sublayer that can provide a suitable surface for these connection methods includes but is not limited to tin, lead, zinc, nickel, silver, palladium, platinum, gold, indium, tungsten, molybdenum, chromium, copper, its alloys, organic solderability preservatives (OSP), or other conductive materials. In addition, the surface sublayer can be sputtered, electroplated, cold welded, or applied via other means. In some examples, the thickness of the surface sublayer can be in the range of from 0.05 microns to 10 microns or more specifically from 0.1 microns to 2.5 microns. In addition, in some examples, adding an OSP coating on top of the surface sublayer can help prevent the surface sublayer itself from oxidizing over time. When the base sublayer of the conductive trace 150 includes aluminum or its alloy, a surface sublayer can be used. Without protection, the exposed surface of aluminum tends to form an insulating natural oxide. Oxides readily form in the presence of oxygen or moisture. In such cases, to provide a long-term stable surface, the surface sublayer may resist the inward diffusion of oxygen and / or moisture. For example, zinc, silver, tin, copper, nickel, chromium, or gold plating may be used as a surface layer on an aluminum-containing base layer.

[0076] refer to Figure 1C The conductive traces 150 can be arranged in a single layer or multiple layers. In some examples, the conductive traces 150 in different layers are interconnected within the flexible interconnect circuit 100. In addition, the conductive traces 150 in the same layer can be interconnected or even integral. It should be noted that the conductive traces 150 in the same layer can be formed from the same metal sheet.

[0077] In some examples, the circuit portion has a corresponding connector, for example, attached to the free end of the portion. For example, the first circuit portion 111 terminates at the first connector 121, the second circuit portion 112 terminates at the second connector 122, the fourth circuit portion 113 terminates at the third connector 123, the seventh circuit portion 117 terminates at the fourth connector 124, and the sixth circuit portion 116 terminates at the fifth connector 125. The conductive trace 150 in each circuit portion can be electrically coupled to the conductive lead of the corresponding connector. In addition, the conductive trace 150 of one circuit portion can extend into another circuit portion. For example, the trace can start at the first connector 121 (for example, connected to the connector terminal in the first connector 121) and extend through the first circuit portion 111, the third circuit portion 113, the fifth circuit portion 115, and the sixth circuit portion 116, ultimately ending at the fifth connector 125 (for example, connected to the connector terminal in the fifth connector 125). Therefore, the conductive trace interconnects the connector terminals in the first connector 121 and the fifth connector 125.

[0078] The relative positions of the circuit parts depend on the folded state of the flexible interconnect circuit 100. For example, Figure 1A and Figure 1B The flexible interconnect circuit 100 is illustrated in a pre-folded state. In this state / example, all of the circuit portions extend in the same direction, e.g., parallel to each other / along the major axis 108 of the flexible interconnect circuit 100. As described above, manufacturing the flexible interconnect circuit 100 in this configuration / state helps minimize material waste. However, other configurations are also within the scope in which the circuit portions (when in the pre-folded state) are not all parallel to each other. The pre-folded design is determined based on the unfolding design requirements, folding options, and other factors. In addition, all of the circuit portions can be coplanar in this pre-folded state and also not overlap and stack. Finally, in this pre-folded state, the first sides 103 of all of the circuit portions face the same direction (e.g., Figure 1A Upward and Figure 1B Similarly, in this pre-folded state, the second sides 104 of all circuit portions face the same direction (e.g., Figure 1A Downward and Figure 1B (upward in the middle).

[0079] When the interconnect circuit 100 is folded (from a pre-folded state to an unfolded state), one or more circuit portions change their respective orientations, e.g., Figure 1D. In the illustrated example, the second circuit portion 112 is folded 90° relative to the first circuit portion 111. In other words, the first circuit portion 111 is no longer parallel to the second circuit portion 112. Any folding angle greater than 0° is within this range (e.g., between 0° and 180°, or more specifically, between 20° and 160°, or even between 30° and 150°). It should be noted that during this folding, the second circuit portion 112 is also flipped relative to the first circuit portion 111. Specifically, Figure 1D The diagram shows that first side 103 of first circuit portion 111 and second side 104 of second circuit portion 112 now face upward. The remaining portions are folded similarly. For example, third circuit portion 113 is folded 90° relative to first circuit portion 111, but in a different direction than second circuit portion 112. Thus, in the unfolded state, third circuit portion 113 and second circuit portion 112 extend in different directions. Each of fourth circuit portion 114 and fifth circuit portion 115 is folded 90° relative to third circuit portion 113, but in different directions. It should be noted that because (a) third circuit portion 113 is folded relative to first circuit portion 111 and (b) each of fourth circuit portion 114 and fifth circuit portion 115 is folded relative to third circuit portion 113, first side 103 of first circuit portion 111 and first side 103 of each of fourth circuit portion 114 and fifth circuit portion 115 face the same direction (i.e., upward in FIG. 4D ). Sixth circuit portion 116 is folded 90° relative to fifth circuit portion 115. Finally, seventh circuit portion 117 is folded 90° relative to sixth circuit portion 116. The folding pattern depends on the desired routing of each circuit portion, the location of each connector, and other factors associated with the installation and application of interconnect circuit 100.

[0080] Furthermore, the folding creates a folding angle, wherein the first circuit portion 111 and the second circuit portion 112 together form a stack 109, which is Figure 1E 109 . Specifically, in this stack 109 , the second side 104 of the first circuit portion 111 and the second side 104 of the second circuit portion 112 face opposite directions. Similarly, the first side 103 of the first circuit portion 111 and the first side 103 of the second circuit portion 112 face opposite directions. Furthermore, within stack 109 , the first side 103 of the first circuit portion 111 and the first side 103 of the second circuit portion 112 face each other and may even be butted against each other (e.g., glued to each other to maintain this orientation). The same or similar corners are present at each fold.

[0081] refer to Figure 2A and Figure 2B, the flexible interconnect circuit assembly 190 includes an adhesive film 130 attached to the second side 104 of the first circuit portion 111 and the first side 103 of the second circuit portion 112. The side of each circuit portion that is attached to the adhesive film 130 depends on the folding pattern. In general, all sides facing one direction can be attached to the adhesive film 130. In some examples, all circuit portions at least partially overlap and are attached to the adhesive film 130. Alternatively, some circuit portions can be located away from the adhesive film 130 ( Figure 2A 140 ), for example, extending beyond the boundaries of the adhesive film 130. Within the flexible interconnect circuit assembly 190, the adhesive film 130 is used to support at least some of the circuit portions in the unfolded state, for example, with the additional support provided by the temporary support film 140. Later, when the flexible interconnect circuit assembly 190 is installed, the adhesive film 130 is used to support at least some of the circuit portions in the same unfolded state and attach these circuit portions to the base structure, as described below with reference to Figures 7A to 7C Further description.

[0082] In some examples, the adhesive film 130 includes a base layer and an adhesive layer. Some examples of suitable materials for the base layer include, but are not limited to, polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), ethyl vinyl acetate (EVA), polyethylene (PE), polyvinyl fluoride (PVF), polyamide (PA) and / or polyvinyl butyral (PVB). In some examples, the thickness of the adhesive film 130 is between μm and 200 μm, or more specifically, between 20 μm and 50 μm. Some examples of suitable materials for the adhesive layer include, but are not limited to, pressure sensitive adhesives. When the flexible interconnect circuit 100 is supported on a temporary support film 140 (e.g., as Figure 3B and Figure 3C ), and also when the flexible interconnect circuit 100 is supported on a base structure 199 (e.g., as shown in Figure 7C ), the adhesive film 130 may be flexible enough to conform to the shape of the flexible interconnect circuit 100 .

[0083] The adhesive layer faces the flexible interconnect circuit 100 and is bonded to the circuit portions, such as a portion of the first circuit portion 111 and a portion of the second circuit portion 112. In some examples, another portion of the first circuit portion 111 (e.g., a portion adjacent to the first connector 121) extends outside the boundary bonding film 130. In some examples, all connectors are positioned, and the portion of the circuit portion extending to these connectors extends outside the boundary bonding film 130. This feature provides some flexibility to the connectors when the flexible interconnect circuit assembly 190 is attached to a base structure.

[0084] The adhesive film 130 extends over the edge of the circuit portion, thereby forming an adhesive flap for connecting to the base structure. In some examples, the width (W1) of these adhesive flaps is between 0.5 mm and 50 mm, or more specifically, between 5 mm and 20 mm. The adhesive flap can extend over one or both edges of the circuit portion, for example, as shown in FIG. Figure 2A and Figure 2B shown.

[0085] refer to Figures 3A to 3C , the flexible interconnect circuit assembly 190 includes a temporary support film 140 attached to the adhesive film 130. The temporary support film 140 is used to support the flexible interconnect circuit 100 before the surface interconnect circuit 100 is mounted on the base structure. During this installation, the temporary support film 140 is removed and is not part of the final assembly. Some examples of suitable materials for the temporary support film 140 include, but are not limited to, polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), ethyl vinyl acetate (EVA), polyethylene (PE), polyvinyl fluoride (PVF), polyamide (PA) and / or polyvinyl butyral (PVB).

[0086] The temporary support film 140 covers the entire perimeter of the interconnect circuit 100 and may have a rectangular shape, for example, to simplify handling and storage. In some examples, the temporary support film 140 faces the interconnect circuit 100, for example, as shown in FIG. Figure 4A In addition, the flexible interconnect circuit assembly 190 can be formed into a roll, for example, as shown in FIG. Figure 4B In some examples, the flexible interconnect circuit assembly 190 can include interconnect circuits 100 having different designs.

[0087] refer to Figures 3B to 3D In the cross-sectional view in FIG, the flexible interconnect circuit 100 extends at least partially between the temporary support film 140 and the adhesive film 130. For example, Figure 3B The first side 103 of the first circuit portion 111 facing the temporary support film 140 is illustrated. Figure 3C The second side 104 of the second circuit portion 112 facing the temporary support film 140 is illustrated. Figure 3D The diagram shows a fifth circuit portion 115 forming a stack 109 having a third circuit portion 113 and another stack 109 having a sixth circuit portion 116. It should be noted that the thickness of the stack 109 is twice the thickness of each circuit portion. Thus, in some sections, the adhesive film 130 directly abuts the temporary support film 140 (e.g., away from the circuit portion), is separated by a single circuit portion thickness, or is separated by double the circuit portion thickness. The flexibility of the adhesive film 130 ensures conformal coverage and minimal gaps at the edges of the circuit portions.

[0088] like Figure 3A As shown, the first circuit portion 111 terminates at a first connector 121. The first connector 121 and a portion of the first circuit portion 111 adjacent to the first connector 121 extend beyond the boundaries of the adhesive film 130. As described above, this extension provides flexibility to the first connector 121 when the flexible interconnect circuit assembly 190 is installed. In a more specific example, the first connector 121 and the portion of the first circuit portion 111 adjacent to the first connector 121 overlap with the boundaries of the temporary support film 140. In some examples, the first connector 121 can be temporarily attached to the temporary support film 140, for example, to maintain the position of the first connector 121 during handling of the flexible interconnect circuit assembly 190 (e.g., forming a roll from the flexible interconnect circuit assembly 190).

[0089] Figure 5 : Example of forming a flexible interconnect circuit assembly

[0090] Figure 5 1 is a process flow diagram corresponding to a method 500 for forming a flexible interconnect circuit assembly 190 according to some examples. The method 500 includes (block 510) providing a flexible interconnect circuit 100 including a first circuit portion 111 and a second circuit portion 112 integrally integrated with the first circuit portion 111. The flexible interconnect circuit 100 is provided in a pre-folded state, as described above with reference to FIG. Figure 1A-1C For example, each of the first circuit portion 111 and the second circuit portion 112 is an elongated structure extending parallel to the main axis 108 of the flexible interconnect circuit 100, such as Figure 1A and Figure 1B As shown. Each of first circuit portion 111 and second circuit portion 112 includes a first side 103 and a second side 104 opposite first side 103. In this pre-folding stage, first side 103 of first circuit portion 111 and first side 103 of second circuit portion 112 face the same direction. Similarly, second side 104 of first circuit portion 111 and second side 104 of second circuit portion 112 face the same direction. In some examples, prior to folding, first circuit portion 111 and second circuit portion 112 are coplanar.

[0091] The method 500 includes (block 520) folding the second circuit portion 112 relative to the first circuit portion 111, as in Figure 1D1. In general, this folding of the various circuit portions may be referred to as folding the flexible interconnect circuit 100 into the mounting shape. After this operation is completed, the flexible interconnect circuit 100 is in the expanded state / mounted shape. More specifically, the second circuit portion 112 is no longer parallel to the major axis 108 of the flexible interconnect circuit 100. More generally, the orientation of the second circuit portion 112 relative to the first circuit portion 111 changes during this operation. Furthermore, after folding, the first side 103 of the first circuit portion 111 and the first side 103 of the second circuit portion 112 face in opposite directions, as in, for example, Figure 1E It should be noted that other circuit parts can be folded in the same operation, for example, as in Figure 1D Schematically shown in FIG.

[0092] In some examples, after folding, a portion of the first side 103 of the first circuit portion 111 directly abuts a portion of the first side 103 of the second circuit portion 112, e.g., Figure 1E Alternatively, a portion of the second side 104 of the first circuit portion 111 can directly abut a portion of the second side 104 of the second circuit portion 112 (e.g., if the second circuit portion 112 is folded in a different direction relative to the first circuit portion 111). In some examples, these abutting portions are glued to each other, for example, to maintain the fold.

[0093] The method 500 includes (block 530) attaching the adhesive film 130 to the second side 104 of the first circuit portion 111 and the first side 103 of the second circuit portion 112, as for example in Figure 2A and Figure 2B Schematically shown in FIG. For example, adhesive film 130 can be laminated to flexible interconnect circuit 100. In some examples, adhesive film 130 is initially attached as a larger component that is later cut based on the folded shape of flexible interconnect circuit 100. It should be noted that when adhesive film 130 is attached to flexible interconnect circuit 100, portions of flexible interconnect circuit 100 may extend past the boundaries of adhesive film 130. Furthermore, it should be noted that portions of adhesive film 130 extend past the boundaries of flexible interconnect circuit 100, thereby creating adhesive flaps.

[0094] The method 500 includes (block 540) attaching the temporary support film 140 to the adhesive film 130 such that the first side 103 of the first circuit portion 111 and the second side 104 of the second circuit portion 112 face the temporary support film 140, as in, for example, Figures 3A to 3DAs shown schematically in FIG. , a portion of the flexible interconnect circuit 100 is positioned between the temporary support film 140 and the adhesive film 130. Furthermore, after this operation, all adhesive tabs of the adhesive film 130 may be covered by the temporary support film 140, leaving no exposed adhesive surface. When the temporary support film 140 is removed from the flexible interconnect circuit assembly 190 in a later operation, these adhesive tabs are exposed again for bonding to various panels, for example, as described below with reference to FIG. Figure 6 Further description.

[0095] In some examples, method 500 includes (block 550) arranging the flexible interconnect circuit assembly 190 into a shipping configuration selected from the group consisting of a planar sheet and a roll. In some examples, the flexible interconnect circuit assembly (eg, formed into a roll) includes additional flexible interconnect circuits.

[0096] Figure 6 as well as Figures 7A-7C : Example of installing a flexible interconnect circuit assembly

[0097] Figure 6 is a process flow diagram corresponding to a method 600 of mounting the flexible interconnect circuit assembly 190 to the base structure 199 , according to some examples. Figures 7A-7C is a schematic illustration of different stages during method 600. Various examples of substrate structures 199 are within the scope, such as Figure 7C An automotive panel (eg, a door panel) is shown.

[0098] The method 600 may begin (block 610) by removing the temporary support film 140, thereby exposing a portion of the adhesive surface of the bonding film 130, such as Figure 7A As shown. These exposed adhesive surfaces may be referred to as adhesive flaps and are used to adhere the flexible interconnect circuit assembly 190 to the base structure 199. For example, the adhesive film 130 may include a pressure sensitive adhesive surface. Additionally, it should be noted that once removed during this operation, the temporary support film 140 may be Figure 5 Repeated use in the process described in.

[0099] The method 600 continues (block 620) by pressing the adhesive surface against the base structure 199, thereby attaching the flexible interconnect circuit assembly 190 to the base structure 199, e.g., as shown in FIG. Figure 7B . A portion of the flexible interconnect circuit 100 is positioned between the adhesive film 130 and the base structure 199 and is supported relative to the base structure 199 by the adhesive film 130. In some examples, the flexible interconnect circuit assembly 190 includes various alignment features (e.g., markings / cutouts on the adhesive film 130 and / or the flexible interconnect circuit 100) to determine the position of the flexible interconnect circuit assembly 190 relative to the base structure 199.

[0100] Figures 8A-8C 、 Figures 9A-9C 、 Figures 10A-10F as well as Figure 11 : Example of a folded flexible interconnect circuit

[0101] refer to Figures 8A-8C In some examples, the flexible interconnect circuit 100 includes a first insulating layer 151, a second insulating layer 152, and a conductive trace 150. The conductive trace 150 is located between the first insulating layer 151 and the second insulating layer 152, such that the first insulating layer 151 and the second insulating layer 152 are bonded together around the conductive trace 150. Various examples of the first insulating layer 151, the second insulating layer 152, and the conductive trace 150 are described above.

[0102] Flexible interconnect circuit 100 further includes adhesive layer 160 that abuts and covers second insulating layer 152 such that second insulating layer 152 is positioned between first insulating layers 151. First insulating layer 151, second insulating layer 152, and adhesive layer 160 form a stack 170 that includes a first stack portion 171, a second stack portion 172, and a tab portion 173. Figure 8A and Figure 8B The flexible interconnect circuit 100 is shown in a pre-folded state. In this state, the first stack portion 171, the second stack portion 172, and the flap portion 173 are coplanar. Figure 8C The flexible interconnect circuit 100 is shown in a folded state. In this state, the first stack portion 171 and the second stack portion 172 overlap each other, effectively forming a secondary stack. It should be noted that in this state, the tab portion 173 does not overlap with the first stack portion 171 or the second stack portion 172. Instead, the tab portion 173 extends away from the secondary stack (formed by the first stack portion 171 and the second stack portion 172) and can be used to bond to other structures.

[0103] refer to Figure 8C , the adhesive layer 160 in the first stack portion 171 abuts and adheres to the adhesive layer 160 in the second stack portion 172. This adhesive-adhesive interface maintains the shape of the secondary stack (formed by the first stack portion 171 and the second stack portion 172). In addition, the adhesive layer 1360 in the wing portion 173 extends through the first stack portion 171 and the second stack portion 172. This adhesive layer 160 in the wing portion 173 can be used to bond to an external structure.

[0104] refer to Figure 8CIn some examples, adhesive layer 160 of tab portion 173 is covered by temporary liner 162. Temporary liner 162 allows flexible interconnect circuit 100 to be handled and transported while preserving the surface of adhesive layer 160. When flexible interconnect circuit 100 is installed, temporary liner 162 is removed, and adhesive layer 160 of tab portion 173 is exposed.

[0105] In some examples, the wing portion 173 is free of the conductive traces 150. This feature improves the flexibility of the wing portion 173. In addition, by extending only one of the first insulating layer 151 and the second insulating layer 152 into the wing portion 173, the flexibility of the wing portion 173 can be further improved. In addition, the wing portion 173 may not have the first insulating layer 151 and the second insulating layer 152. Alternatively, the adhesive layer 160 includes its own base layer (e.g., attached to the first insulating layer 151 and the second insulating layer 152) on which the adhesive is deposited. Alternatively, the wing portion 173 includes both the first insulating layer 151 and the second insulating layer 152. In a more specific example, the wing portion 173 also includes one or more conductive traces 150 ( Figure 8C In some examples, the flexibility of the fin portion 173 is increased by providing various cutting features at the interface of the fin portion 173 and the stack 170 and / or within the fin portion 173. In some examples, the width of the fin portion 173 (in Figure 8C in the X direction in the image) between 5 mm and 70 mm, or more specifically, between 10 mm and 50 mm.

[0106] Although Figure 8A The tab portion 173 is illustrated as a continuous structure forming the entire first edge 101 of the flexible interconnect circuit 100, but other examples are within the scope. For example, Figure 9A An example of a flexible interconnect circuit 100 is shown in which the tab portion 173 is a discontinuous patch. "AA" cross section ( Figure 9B The "BB" cross section (shown in FIG) shows the portion of the flexible interconnect circuit 100 where the tab portion 173 exists. Figure 9C ) represents a portion of the flexible interconnect circuit 100 where the tab portion 173 is not present. During installation of the flexible interconnect circuit 100 onto the substrate structure, the tab "cutout" can be used to clear various features on the substrate structure.

[0107] Furthermore, the tab portions 173 may form different (opposite) edges of the flexible interconnect circuit 100, e.g., Figures 10A-10F This method allows the flexible interconnect circuit 100 to be folded during the initial folding (in Figure 10C and Figure 10E) positions adhesive layers 160 on different sides of the flexible interconnect circuit 100. When the flexible interconnect circuit 100 is later unfolded (e.g., by further folding the circuit portion, as described above with reference to FIG. Figure 1A-1E Described and by this article Figure 10E and Figure 10F Schematically shown), adhesive layer 160 is located on the same side (eg, Figure 10C and Figure 10F As shown). This expansion of the flexible interconnect circuit 100 is also Figure 11 Schematically shown in FIG, wherein the position of the adhesive layer 160 is identified. Alternatively, the adhesive layer 160 may remain positioned on different sides, for example, for mounting on complex objects / surfaces.

[0108] Figure 12 : Example of forming a folded flexible interconnect circuit

[0109] Figure 12 is a process flow diagram corresponding to a method 1200 of forming a flexible interconnect circuit 100 according to some examples. Figures 9A-11 Various examples of flexible interconnect circuit 100 are described.

[0110] In some examples, the method 1200 includes (block 1210) providing a stack 170 formed of a first insulating layer 151, a second insulating layer 152, a conductive trace 150, and an adhesive layer 1360. As described above and with reference to Figure 8A and Figure 8B As shown, conductive trace 150 is positioned between first insulating layer 151 and second insulating layer 152 such that first insulating layer 151 and second insulating layer 152 are bonded together around conductive trace 150. Adhesive layer 160 abuts against and covers second insulating layer 152 such that second insulating layer 152 is located between first insulating layer 151. Stack 170 includes first stack portion 171, second stack portion 172, and flap portion 173. At this stage, stack 170 is in a pre-folded state, such as in Figure 8A and Figure 8B In this state, the first stack portion 171, the second stack portion 172 and the fin portion 173 may be coplanar.

[0111] In some examples, method 1200 includes (block 1220) folding stack 170 such that first stack portion 171 and second stack portion 172 overlap and adhesive layer 160 in first stack portion 171 abuts and adheres to adhesive layer 160 in second stack portion 172, as in, for example, Figure 8CThe adhesive layer 160 in the flap portion 173 extends across the first stack portion 171 and the second stack portion 172 .

[0112] Figures 13A-14B :Example of connector support part

[0113] Figure 13A FIG1 is a cross-sectional side view of a flexible interconnect circuit 100 including a connector support portion 1350 according to some examples. The portion of the flexible interconnect circuit 100 without the connector support portion 1350 can be referred to as the main portion 1305. The connector support portion 1350 is attached to the main portion 1305 of the flexible interconnect circuit 100, for example, at each end of the main portion 1305 that receives a connector. When a connector is attached to that end of the main portion 1305, the connector support portion 1350 provides additional mechanical support for that end, as described below with reference to FIG1. Figure 14A and Figure 14B Further described.

[0114] The flexible interconnect circuit 100, or more specifically the main portion 1305, includes a first insulating layer 151, a second insulating layer 152, and a conductive layer 1330. The conductive layer 1330 is partially positioned between the first insulating layer 151 and the second insulating layer 152 (e.g., away from the end of the main portion 1305). The conductive layer 1330 includes one or more conductive traces 150, which may also be referred to as conductive leads. For example, Figure 13B Eight conductive traces 150 are shown. However, any number of conductive traces 150 is within the scope. In some examples, the number of conductive traces 150 extending to a particular end of main portion 1305 depends on the number of conductive elements in the connector attached to that end. In the flexible interconnect assembly, the conductive traces 150 form individual electrical connections to corresponding conductive elements of the connector attached to that end.

[0115] The thickness of one or both of first insulating layer 151 and second insulating layer 152 can be between 1 micron and 500 microns, or more specifically, between 10 microns and 125 microns. In some examples, each of first insulating layer 151 and second insulating layer 152 includes an adhesive sublayer facing conductive layer 1330, e.g., for lamination to conductive layer 1330 and also to each other. These adhesive sublayers can also be used to laminate first insulating layer 151 and second insulating layer 152 directly (beyond the conductive layer boundary), e.g., for edge sealing of flexible interconnect circuit 100. In some examples, a surface of first insulating layer 151 and / or second insulating layer 152 (e.g., the surface facing away from conductive layer 1330) includes an adhesive sublayer for bonding the insulating layer to an external structure (e.g., a support panel). First insulating layer 151 and second insulating layer 152 provide electrical isolation and mechanical support for conductive layer 1330. Additional aspects of first insulating layer 151 and second insulating layer 152 (e.g., materials) are described elsewhere in this document. Furthermore, additional aspects of the conductive traces 150, or more generally the conductive layer 1330 formed from these traces (eg, uniform thickness, materials, surface sub-layers), are described elsewhere in this document.

[0116] One or more conductive traces 150 include exposed portions 1331 extending through at least the first insulating layer 151, as in Figure 1A and Figure 1B Schematically shown in FIG. The exposed portions 1331 of the conductive traces 150 allow electrical connections to be formed between these conductive traces 150 and corresponding conductive elements of the connector. In some examples, the length (in the X direction) of the exposed portions 1331 is between 0.5 mm and 5 mm, or more specifically, between 1 mm and 3 mm.

[0117] In some examples, exposed portion 1331 includes a contact interface layer 1332 that forms an exposed surface 1333 (which directly interfaces with the conductive elements of the connector). For example, contact interface layer 1332 is formed using electroless nickel immersion gold (ENIG). Specifically, contact interface layer 1332 can be formed above a base layer of conductive trace 150, wherein the base layer is formed of copper, aluminum, or the like. Contact interface layer 1332 is used to reduce oxidation and improve the solderability of the base layer. Contact interface layer 1332 can be formed by electroless nickel plating the base layer and then immersing it in a solution including a gold salt. During this immersion process, a portion of the nickel is oxidized, while the gold ions are reduced to a metallic state and deposited on the surface. In some examples, palladium is used in addition to or instead of gold.

[0118] refer to Figure 13AIn some examples, connector support portion 1350 includes a reinforcing metal layer 1370 and is attached to second insulating layer 152. Various forms of attachment are within the scope. For example, connector support portion 1350 may include an adhesive layer 1360 that interfaces with second insulating layer 152. More specifically, adhesive layer 1360 is positioned between reinforcing metal layer 1370 and second insulating layer 152, thereby attaching connector support portion 1350 to second insulating layer 152. For example, adhesive layer 1360 includes a pressure-sensitive adhesive. In the same or another example, adhesive layer 1360 includes double-sided tape. The thickness of adhesive layer 1360 may be between 0.5 microns and 250 microns, or more specifically, between 50 microns and 200 microns.

[0119] As described above, the connector support portion 1350 includes a reinforcing metal layer 1370. The reinforcing metal layer 1370 provides mechanical reinforcement for the flexible interconnect circuit 100 when the flexible interconnect circuit 100 is attached to the connector, as described below with reference to FIG. Figure 14A and Figure 14B Further described. For example, the reinforcing metal layer 1370 can engage the connector, helping to improve the pull-out strength of the attachment between the flexible interconnect circuit 100 and the connector. The reinforcing metal layer 1370 can be in the form of a metal plate or foil. In some examples, the reinforcing metal layer 1370 includes one or more of aluminum (e.g., hardened aluminum, such as 1350-H19) and stainless steel. The thickness (T1) of the reinforcing metal layer 1370 can be between 20 microns and 200 microns, or more specifically, between 40 microns and 150 microns, or even between 50 microns and 100 microns. The combination of these features of the reinforcing metal layer 1370 helps to significantly improve (e.g., by 20%) the connector retention force compared to conventional flexible circuits (i.e., force along the X-axis).

[0120] refer to Figure 13A , the connector support portion 1350 at least partially overlaps the exposed portion 1331. More specifically, the connector support portion 1350 can completely overlap the exposed portion 1331. For the purposes of this disclosure, the term "overlap" means a corresponding alignment of the XY footprints of different components, for example, comparing the Z-axis projections of different components. These overlaps ensure support of the exposed portion 1331 relative to the rest of the flexible interconnect circuit 100, and also ensure support of the exposed portion 1331 relative to the connector to which it is attached. Specifically, the exposed portion 1331 is inserted into the connector to form an electrical connection between the conductive trace 150 and the conductive elements of the connector, as described below with reference Figure 2A and Figure 2BAs further described. Thus, connector support portion 1350 is also partially inserted into the connector. Connector support portion 1350 mechanically engages the connector. In some examples, the length (L2) of connector support portion 1350 (in the X direction) is between 5 mm and 30 mm, or more specifically, between 10 mm and 20 mm.

[0121] In some examples, the connector support portion 1350 at least partially overlaps the first insulating layer 151. The length (L1) of the overlapping portion can be between 3 mm and 25 mm, or more specifically, between 5 mm and 17 mm. In addition, the entire connector support portion 1350 can overlap the second insulating layer 152, such as in Figure 1A Schematically shown in FIG.

[0122] In some examples, the connector support portion 1350 further includes a protective layer 1375 such that the reinforcing metal layer 1370 is located between the protective layer 1375 and the second insulating layer 152. For example, when the contact interface layer 1332 is formed, the protective layer 1375 isolates the reinforcing metal layer 1370 from the environment. The protective layer 1375 may include one or more polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), ethyl vinyl acetate (EVA), polyethylene (PE), polyvinyl fluoride (PVF), polyamide (PA) and / or polyvinyl butyral (PVB). The thickness of the protective layer 1375 may be between 5 microns and 100 microns, or more specifically, between 10 microns and 50 microns. It should be noted that the protective layer 1375 is optional. In some examples, for example, as Figure 1C As shown, the connector support portion 1350 does not have a protective layer. In these examples, the reinforcement metal layer 1370 is exposed. In addition, in these examples, the contact interface layer 1332 can be formed before the connector support portion 1350 is attached to the main portion 1305 of the flexible interconnect circuit 100.

[0123] refer to Figure 13B In some examples, the flexible interconnect circuit 100 includes a notch 1340 for engaging a connector, as described below with reference to Figure 14A and Figure 14BFurther described. For example, the notch 1340 can be positioned on the side edges (e.g., the first edge 101 and the second edge 102) of the flexible interconnect circuit 100. For the purposes of this disclosure, the side edges are defined as the edges that extend to the end of the flexible interconnect circuit 100 that is inserted into the connector. The front edge 1301 extends between the two side edges and is defined as the edge that is inserted into the connector. The notch 1340 extends at least through the reinforcing metal layer 1370 of the connector support portion 1350. In some examples, the notch 1340 extends through all components (layers) of the connector support portion 1350. In addition, the notch 1340 can extend through one or more components of the main portion 1305, such as the second insulating layer 152.

[0124] As described above, the notch 1340 is used to engage the connector, or more specifically, to engage the retaining pin 1385 of the connector 1380, such as in Figure 14B Thus, the size and relative position of the notch 1340 (eg, relative to the front edge 1301) are determined by the connector specifications. Figure 13B In some examples, the depth (D0) of the notch 1340 is between about 0.2 mm and 1.5 mm, or more specifically, between 0.4 mm and 0.8 mm. The width (W0) of the notch is between about 1 mm and 5 mm, or more specifically, between 2 mm and 4 mm. In some examples, the width (W2) of the front edge inserted into the connector is between 5 mm and 50 mm, or more specifically, between 7 mm and 20 mm. It is expected that the width of the front edge can depend on the number of conductive traces 150. For example, Figure 13B Eight conductive traces 150 are shown extending to the front edge. However, any number is within this range, such as one, two, three, four, etc. In some examples, the number can be 6, 8, 10, 20, 25, 30, 35, 40, 45, 50, 55, and 60.

[0125] Figure 14A is a cross-sectional side view of a flexible interconnect assembly 190 utilizing the flexible interconnect circuit 100, various examples of which are described above with reference to Figure 1A-1C describe. Figure 14B yes Figure 14AFIG1 is a top cross-sectional view of a flexible interconnect assembly in FIG1 , illustrating additional features of flexible interconnect assembly 190. Specifically, in addition to flexible interconnect circuit 100, flexible interconnect assembly 190 also includes connector 1380. Connector 1380 includes a housing 1381 and one or more conductive elements 1382. Housing 1381 mechanically engages reinforcing metal layer 1370 of connector support portion 1350. Each of the one or more conductive elements 1382 directly interfaces with and electrically couples to a corresponding conductive trace 150 of one or more conductive traces 150. One example of connector 1380 is a zero insertion force (ZIF) connector. For example, before inserting interconnect circuit 100 into connector 1380, a lever or slider (provided in housing 1381) is moved to an unlocked position, thereby pushing all spring conductive elements 1382 apart, allowing interconnect circuit 100 to be inserted with minimal force. The lever or slider is then moved to a locked position, allowing conductive elements 1382 to close and interface with conductive traces 150 of interconnect circuit 100. In some examples, flexible interconnect circuit 100 includes notches 1340, each of which is located on side edge 102 of flexible interconnect circuit 100 and extends at least through reinforcing metal layer 1370 of connector support portion 1350. Connector 1380 includes retention pins 1385, such that each of retention pins 1385 extends into a corresponding notch in notches 1340.

[0126] Figures 15A-15D : Support sheet for attaching flexible interconnect circuits

[0127] In some examples, the flexible interconnect circuit 100 needs to be attached to a support structure. For example, the flexible interconnect circuit 100 may be an automotive wiring harness that is attached to various vehicle body panels during its installation. The flexible interconnect circuit 100 may include a support sheet 1590 for this attachment, such as in Figure 15A The number and location of these support pieces 1590 depend on the location of the attachment points.

[0128] refer to Figures 15B-15D In some examples, the flexible interconnect circuit 100 includes a first insulating layer 151 and a second insulating layer 152 stacked with the first insulating layer 151 and forming a main circuit portion 1501 and a support sheet 1590. The support sheet 1590 extends from an edge of the main circuit portion 1501, such as Figure 15B In some examples, the support sheet 1590 is integral with the main circuit portion 1501. For example, the first insulating layer 151 and the second insulating layer 152 can be a continuous sheet extending between the support sheet 1590 and the main circuit portion 1501.

[0129] refer to Figure 15B and Figure 15C, the support sheet 1590 includes a support sheet opening 1592 for receiving a fastener 1595 when securing the flexible interconnect circuit 100 to the support member 1599. Various examples of fasteners 1595 are within the scope, such as clips, screws, rivets, etc., for example, as Figure 15C and Figure 15D Some examples of support members 1599 are shown schematically in the above reference. Figure 7B and Figure 7C Description, and may also be referred to as base structure.

[0130] refer to Figures 15B-15D In some examples, the flexible interconnect circuit 100 includes conductive components (e.g., formed from the same metal sheet), which in turn include conductive traces 150 and support members 1599. The conductive traces 150 are at least partially positioned between the first insulating layer 151 and the second insulating layer 152 in the main circuit portion 1501. The support members 1599 are at least partially positioned between the first insulating layer 151 and the second insulating layer 152 in the support sheet 1590. The support members 1599 serve to reinforce the support sheet 1590, thereby providing additional strength.

[0131] In some examples, conductive trace 150 and support member 1599 are formed of the same material (e.g., copper, aluminum) and / or have the same thickness (e.g., at least 100 microns). For example, conductive trace 150 and support member 1599 can be formed by patterning the same metal sheet.

[0132] In some examples, support member 1599 is electrically isolated from each of conductive traces 150, e.g., Figure 15B As shown. For example, conductive traces 150 can be used to transmit power and / or signals between different portions of flexible interconnect circuit 100. At the same time, support member 1599 can be in electrical contact with fastener 1595 and / or support member 1599. Alternatively, support member 1599 is integral with at least one of conductive traces 150 and, for example, can operate as a ground line (not shown).

[0133] refer to Figure 15B In some examples, the conductive trace 150 extends in a first direction, at least proximate to the support tab 1590. The support tab 1590 extends from an edge of the main circuit portion 1501 in a second direction that is substantially perpendicular to the first direction.

[0134] refer to Figure 15DIn some examples, second insulating layer 152 includes a second insulator opening 1594 that is larger and concentric with support tab opening 1592. Second insulating layer 152 partially exposes the surface of support member 1599 and allows fastener 1595 to abut against the surface of support member 1599. For example, when support member 1599 and fastener 1595 are used for grounding purposes, this direct abutment can be used to form an electrical connection.

[0135] Figures 16A-16G : Attaching a connector to a circuit using traces with temporary support links

[0136] In some examples, the conductive traces 150 extend past the edges of the first insulating layer 151 and the second insulating layer 152 and can be used to form electrical connections, for example, to the conductive traces of the connector. If such conductive traces 150 are unsupported (e.g., before forming these electrical connections), then these conductive traces 150 can change their orientation (e.g., bend) and even contact each other (e.g., potentially causing an electrical short). To avoid such problems, when forming such conductive traces 150, the flexible interconnect circuit 100 can include support ends 155 from which the ends of the conductive traces 150 extend and connect, for example, as in Figure 16A Specifically, the support end 155 is a temporary portion of the flexible interconnect circuit 100 that is later removed, for example, when a connector is attached to the flexible interconnect circuit 100, for example, as in Figure 16E-16G Schematically shown in and described below. Figure 16A Each conductive trace 150 is connected to a support end 155 by a temporary support link 154, which can be integral with the conductive trace 150. For example, all conductive traces 150 (forming the same conductive layer) and all temporary support links 154 (supporting these conductive traces 150) can be formed from the same metal sheet (e.g., foil) by patterning the sheet using various techniques. However, unlike the conductive traces 150, the corresponding temporary support links 154 have a much weaker mechanical structure, resulting in the temporary support links 154 breaking when force is applied to the temporary support links 154 and / or the conductive traces 150. For example, the tensile strength of the temporary support links 154 can be less than 50%, less than 25%, or even less than 10% of the tensile strength of the conductive trace 150. This difference in tensile strength causes the temporary support links 154 to break before any conductive trace 150 breaks.

[0137] Different examples of implementing this weaker mechanical structure are Figures 16B-16D shown in . Specifically, Figure 16BTemporary support links 154 are shown as having a thickness less than that of conductive traces 150. In some examples, the thickness of temporary support links 154 may be less than 50%, less than 25%, or even less than 10% of the thickness of conductive traces 150. Various techniques (e.g., such as etching, ablation, etc.) may be used to achieve this thickness difference (i.e., forming temporary support links 154 from a portion of conductive traces 150). Figure 16C Another example is shown in which temporary support links 154 have a width that is smaller than the width of conductive trace 150. In some examples, the width of temporary support links 154 can be less than 50%, less than 25%, or even less than 10% of the width of conductive trace 150. Various patterning techniques can be used to achieve this width difference (i.e., forming temporary support links 154 from a portion of conductive trace 150). Figure 16D Yet another example is illustrated where temporary support link 154 has cuts / perforations 156 that reduce the integrity of temporary support link 154. Various cutting / patterning techniques can be used to form these cuts / perforations in a portion of conductive trace 150, thereby forming temporary support link 154.

[0138] refer to Figure 16A , the conductive traces 150 that extend past the edges of the first and second insulating layers 151, 152 to the temporary support links 154 can be referred to as contact portions 153. At this stage, these contact portions 153 are connected to and integral with the temporary support links 154, which support these contact portions 153 relative to the support ends 155. Specifically, additional portions of the conductive traces 150 can extend into the support ends 155 and be supported relative to each other by the first and second insulating layers 151, 152. The support ends 155, temporary support links 154, contact portions 153, and the remaining portions of the flexible interconnect circuit 100 can be formed by patterning three sheets (e.g., the first insulating layer 151, the second insulating layer 152, and the metal foil that form all conductive components (including the conductive traces 150 extending between the first and second insulating layers 151, 152)).

[0139] Figure 16E-16G According to some examples, the connector 1610 is attached to Figures 16A-16B 16 is a schematic diagram of different stages of the flexible interconnect circuit 100. In these examples, the connector 1610 is formed by a first connector portion 1611 and a second connector portion 1612. The first connector portion 1611 may include a connector conductive trace 1613 designed to connect to the contact portion 153 of the flexible interconnect circuit 100. Figure 16E, the first connector portion 1611 is positioned within the alignment cavity 1602 of the assembly fixture 1600. The assembly fixture 1600 may also include alignment pins 1604 that may extend through corresponding alignment features of the flexible interconnect circuit 100 to provide XY alignment of the flexible interconnect circuit 100 with the first connector portion 1611.

[0140] refer to Figure 16E At this stage, the contact portion 153 of the flexible interconnect circuit 100 extends over the connector conductive trace 1613 and is supported by the temporary support link 154. As described above, the temporary support link 154 helps maintain the alignment of the contact portion 153, for example, within the XY plane and now relative to the connector conductive trace 1613. Figure 16F When second connector portion 1612 advances to flexible interconnect circuit 100 and ultimately engages first connector portion 1611, second connector portion 1612 pushes contact portion 153 and / or temporary support link 154 and ultimately breaks temporary support link 154, thereby releasing the end of contact portion 153 from support end 155 and allowing contact portion 153 to move toward connector conductive trace 1613 and engage / mated / form an electrical connection with connector conductive trace 1613. In some examples, second connector portion 1612 may also engage / attach to first connector portion 1611 to form a connector body. Figure 16G The diagram shows a flexible interconnect circuit 100 and a Figure 16E-16G Components of connector 1690 are attached to flexible interconnect circuit 100 during the stage shown.

[0141] Figures 17A-17C : Example of laser welding a conductive layer through an insulating layer

[0142] The conductive traces 150 of the same or multiple flexible interconnect circuits 110 generally need to be electrically interconnected. At the same time, these conductive traces 150 are generally located between a first insulating layer 151 and a second insulating layer 152. If the conductive traces 150 are exposed when forming various electrical connections (e.g., by partially removing the first insulating layer 151 and the second insulating layer 152 from the connection area), additional insulators are generally required to seal the conductive traces 150, which increases processing steps and components.

[0143] Some methods of connecting conductive traces 150, such as resistance welding and ultrasonic welding, require direct contact with these components. Laser welding does not require any direct physical contact, but rather requires the laser beam to reach the surface of one conductive trace 150 to heat and partially melt the conductive trace 150 and another component located underneath to form a weld nugget. Although direct line of sight can be used between the laser welder and the top conductive component, direct line of sight is not required. However, any components positioned between the laser welder and the top conductive component should be transparent to the laser beam.

[0144] Figure 17A 1 is a schematic side cross-sectional view of flexible interconnect circuit 100 according to some examples, in which first conductive layer 1701 and second conductive layer 1702 are laser welded through first insulating layer 151 located in the path of laser beam 1709. During this laser welding, laser beam 1709 passes through first insulating layer 151 and interacts with first conductive layer 1701, causing first conductive layer 1701 to partially melt and form a weld nugget 1703 with second conductive layer 1702. Figure 17B 17 is a schematic top view of the flexible interconnect circuit 100 , illustrating a solder nugget 1703 formed in the first conductive layer 1701 and the second conductive layer 1702 and located below the first insulating layer 151 .

[0145] Figure 17C is a process flow diagram corresponding to a method 1790 for laser welding a first conductive layer 1701 and a second conductive layer 1702 of a flexible interconnect circuit 100 through a first insulating layer 151 located in a path of a laser beam 1709, according to some examples. In some examples, the method 1790 includes directing (block 1792) a laser beam 1709 from a laser welder 1708 to the flexible interconnect circuit 100 such that the laser beam 1709 passes through the first insulating layer 151 of the flexible interconnect circuit 100 and heats the first conductive layer 1701 located below the first insulating layer 151 and also heats the second conductive layer 1702 located below the first conductive layer 1701. The heating forms a weld nugget 1703 between the first conductive layer 1701 and the second conductive layer 1702, wherein the first insulating layer 151 is transparent to the first insulating layer 151.

[0146] In some examples, first conductive layer 1701 and second conductive layer 1702 include one or more materials selected from the group consisting of copper and aluminum.

[0147] In some examples, the flexible interconnect circuit 100 further includes a second insulating layer 152 such that when a laser beam 1709 is directed from the laser welder 1708 to the flexible interconnect circuit 100, the first conductive layer 1701 and the second conductive layer 1702 are stacked and sealed between the first insulating layer 151 and the second insulating layer 152, as in, for example, Figure 17A Schematically shown in FIG.

[0148] In some examples, first insulation layer 151 is at least partially melted or removed from weld nugget 1703. Alternatively, after weld nugget 1703 is formed, first insulation layer 151 seals weld nugget 1703 from the environment.

[0149] The flexible interconnect circuit 100 manufactured according to the method 1790 can be used in various applications, such as automotive seats, passenger cabin applications for low voltage wiring, etc. In these applications, exposed conductors are not desired. For example, the method 1790 can include (block 1792) directing a laser beam 1709 from the laser welding machine 1708 to the flexible interconnect circuit 100.

[0150] Figure 18A - Figure 18C: Flexible interconnect circuit

[0151] Figure 18A is a schematic plan view of a flexible interconnect circuit assembly 190 in a pre-folded state, similar to that described above with reference to FIG. Figure 1A A flexible interconnect circuit assembly is described. Figure 18B yes Figure 18A Schematic cross-sectional view of the flexible interconnect circuit assembly 190 in FIG. Figures 1A-4B In addition to the various features of the flexible interconnect circuit assembly 190 described above, the flexible interconnect circuit assembly 190 ( Figure 18A and Figure 18B ) includes molded seals 201 positioned over various portions of the flexible interconnect circuit 100. In various examples, the molded seals 201 can be overmolded onto corresponding portions of the flexible interconnect circuit 100, such as the first and second insulating layers 151 and 152. The molded seals 201 provide protection, sealing, and support to allow the flexible interconnect circuit 100 to pass through openings or gaps in a structure, or to allow the flexible interconnect circuit 100 to enter various components or assemblies (e.g., a control circuit box). In various examples, support features for the overmolded portions of the flexible circuit may also be described herein.

[0152] Molded seal 201 can be formed (for example, molding) by rubber, plastics, composite materials and / or other materials that are suitable for overmolding.The various examples of this type of material can comprise for example butyl (for example, isobutylene isoprene elastomer), nitrile, styrene-butadiene rubber (SBR), polyvinyl chloride (PVC), vulcanized rubber, ethylene propylene diene monomer rubber (EPDM) rubber and / or other such materials.Employed (one or more) materials can change based on application.For the application that needs water resistance, steam, alkali and / or other conditions, butyl can be used.Nitrile and / or SBR can provide damping and good hot tear strength and resistance to some oil, alcohol and other materials.PVC gasket, vulcanized rubber or EPDM (for example, for non-injection molding overmolding manufacturing technology, such as compression molding or transfer molding) can also be used.

[0153] The molded seal 201 can allow the flexible interconnect circuit assembly 190 to pass through various features that may not provide adequate support for the flexible interconnect circuit 100 and / or may damage the flexible interconnect circuit 100. Thus, the molded seal 201 can provide protection and / or support for portions of the flexible interconnect circuit 100, thereby allowing the flexible interconnect circuit assembly 190 to pass through various openings and / or areas (e.g., openings) without damage. The molded seal 201 can additionally or alternatively provide a seal for the opening through which the flexible interconnect circuit 100 is allowed to pass. Thus, for example, an electronic control unit (ECU) box may need to be sealed from the environment (e.g., to prevent moisture, dust, or other foreign objects from entering the ECU box). Because the opening through which the flexible interconnect circuit 100 is allowed to pass on the ECU box may not fully conform to the flexible interconnect circuit 100, the molded seal 201 can provide a compressible seal that can fill the opening and prevent foreign objects from entering the ECU box. In various other illustrative examples, the molded seal may be used to provide a seal, such as a door seal, a liftgate or tailgate seal, a seal within a vehicle interior, a seal within a vehicle engine compartment, and / or for various other applications where sealing may be desired.

[0154] The molded seal 201 can be formed by various techniques. Such techniques may include, for example, overmolding and insert molding. Molding techniques may include, for example, injection molding, compression molding, transfer molding, and / or other single or multiple molding processes. In some examples, the molded seal 201 can be molded using a process (e.g., injection) temperature that is lower than the melting point of the flexible interconnect circuit 100, or more specifically, lower than the melting points of various components (e.g., the first insulating layer 151, the second insulating layer 152, and various other adhesives and insulators used to insulate and seal the conductive traces 150). However, in examples where the overmolding temperature exceeds the acceptable temperature of these components (e.g., the injection temperature of certain types of thermoplastics may be between 180-240° C.), the protective collar 210 may be used to prevent damage to the flexible interconnect circuit 100 (e.g., by providing a thermal barrier to prevent melting and / or damage from molding pressure) and / or to hold the flexible interconnect circuit 100 in the correct position during molding. In some examples, the protective collar 210 can be nylon, a composite material, steel, aluminum, or other similar materials. When a conductive material is used, such a base material can be correspondingly insulating. Thus, before the mold seal 201 is molded around the flexible interconnect circuit 100, the protective collar 210 can be positioned around the corresponding section of the flexible interconnect circuit 100.

[0155] Figures 19A-19E : Example of a flexible interconnect circuit with a carrier

[0156] Figure 19A 、 Figure 19B 、 Figure 19C 、 Figure 19D and Figure 19E Illustrated are different views of a flexible interconnect circuit assembly 190 including a flexible interconnect circuit 100, a mold encapsulant 201, and a circuit carrier 330. Specifically, the flexible interconnect circuit 100 can be positioned within the circuit carrier 330. Figure 19B is a vertical view of assembly 190, and Figure 19A The flexible interconnect circuit assembly 190 is shown along Figure 19B A cross-sectional view of line 19A-19A.

[0157] Circuit carrier 330 can be an example of a structure that provides support for flexible interconnect circuit 100. For example, circuit carrier 330 can support flexible interconnect circuit 100 across an opening. In various examples, carrier 330 is a rigid or semi-rigid structure that provides support to flexible interconnect circuit 100 where needed (e.g., over a gap, such as across an opening). In some examples, carrier 330 also allows for some bending stiffness to allow for supported movement and protection of flexible interconnect circuit 100.

[0158] In various examples, flexible interconnect circuit 100 is positioned onto circuit carrier 330 and can be secured to circuit carrier 330 by, for example, an adhesive, such as a pressure sensitive adhesive (PSA). In various examples, other fastening techniques, such as mechanical fasteners and other techniques, can additionally or alternatively be employed to secure flexible interconnect circuit 100 to circuit carrier 330.

[0159] In various examples, circuit carrier 330 can include a cover 320 and a base structure 312. Flexible interconnect circuit 100 can be positioned between cover 320 and base structure 312. Cover 320 can be coupled to base structure 312 (e.g., according to the techniques described herein) to retain flexible interconnect circuit 100 within circuit carrier 330.

[0160] In various examples, molded seal 201 can be positioned around flexible interconnect circuit 100. Molded seal 201 is positioned between flexible interconnect circuit 100 and circuit carrier 330 and provides protection for flexible interconnect circuit 100 and / or seals an opening in circuit carrier 330 through which flexible interconnect circuit 100 passes. Molded seal 201 can be any type of molded seal as described herein.

[0161] Figure 19C-19E The diagram illustrates a technique for coupling a flexible interconnect circuit to a circuit carrier. Figure 19C 3. In the embodiment of the present invention, the flexible interconnect circuit 100, which may be overmolded with the mold seal 201, is inserted into the bottom portion 332. The bottom portion 332 may include a cavity 338 for receiving the flexible interconnect circuit 100. The cavity 338 may be at least partially defined by sides 334 and 336 configured to retain the flexible interconnect circuit 100 within the cavity 338.

[0162] exist Figure 19D 338 . In some examples, after the flexible interconnect circuit 100 has been inserted into the cavity 338, the cover portion 340 can be placed over the cavity 338. The cover portion 340 can hold the flexible interconnect circuit 100 in place within the cavity 338. In some examples, the base portion 332 and the cover portion 340 are separate individual pieces (e.g., separately attached to the base structure 312 and the cover 320, respectively, or can be all or part of the base structure 312 and the cover 320, respectively). In such examples, the cover portion 340 can be rotated into place along the hinge 342. In other examples, the base portion 332 and the cover portion 340 can be a single continuous component. In such examples, the cover portion 340 can be hingedly connected to the base portion 332 via the hinge 342.

[0163] exist Figure 19E3. In the embodiment of the present invention, the cover portion 340 can be moved to a closed position. The closed position can retain the flexible interconnect circuit 100 within the cavity 338. In some examples, when the cover portion 340 is in the closed position, the molded seal 201 can be compressed to provide protection and sealing to the flexible interconnect circuit 100.

[0164] The cover portion 340 can include a securing mechanism 344. The securing mechanism 344 can be, for example, a latch or catch that is attached to another portion of the carrier (e.g., the base portion 332) to secure the cover portion 340 in a closed position. For example, the securing mechanism 344 can include a hook or catch that can engage an insertion point on the outside of the base portion 332. An alternative configuration for the securing mechanism 344 is illustrated by securing mechanism 344-A, which can also have a hook-like configuration. The securing mechanism 344-A can be inserted into a recess located on the top side of the base portion 332.

[0165] Figure 20A and Figure 20B FIG2 illustrates a cross-sectional view of an additional example of a flexible interconnect circuit assembly 190. The flexible interconnect circuit assembly 190 includes a space 410 between the flexible interconnect circuit 100 and the cover portion 402 and the base portion 401. Figure 20A In the example shown in FIG, the flexible interconnect circuit assembly 190 does not include a molded seal. Figure 20B Another example of a flexible interconnect circuit assembly 190 is illustrated that includes a molded seal 201 positioned within a space 410. Thus, the molded seal 201 acts as a gasket for the flexible interconnect circuit 100, providing a seal and preventing unrestrained movement of the flexible interconnect circuit 100 within the space 410, and therefore preventing damage from such unrestrained movement.

[0166] Figures 21A-21G : Formation of flexible interconnect circuits

[0167] Various examples of forming molded sealed flexible interconnect circuits are described herein. For purposes of this disclosure, it should be understood that the various examples may utilize one, some, or all of the features described. Thus, for example, a molded sealed flexible interconnect circuit formed using a lower pressure molding technique (e.g., lower pressure than injection molding (such as compression molding or transfer molding)) may not include one, some, or all of the features described (e.g., a protective collar may not be used with such a forming technique).

[0168] Figure 21A and Figure 21B Illustrated are schematic plan views illustrating techniques for forming a molded encapsulated flexible interconnect circuit according to some examples. Figure 21AA forming scene 700 is illustrated for molding a seal onto a flexible interconnect circuit 100. In forming scene 700, edges 702 and 704 are edges of a cavity for forming a molded seal on the flexible interconnect circuit 100. The flexible interconnect circuit 100 also includes one or more support sheets 690 having openings 692. The support sheets 690 of forming scene 700 can be positioned within the edges 702 and 704 of a tool and, therefore, within the mold cavity of the tool during molding.

[0169] Figure 21B A forming scenario 710 is illustrated in which a portion of the flexible interconnect circuit 100 is positioned within a mold cavity 712. The molding tool for molding cavity 712 can include a pin configured to pass through opening 692. Such a pin can hold the flexible interconnect circuit 100 in place during molding, thereby preventing the flexible interconnect circuit 100 from deforming due to molding pressure. The mold cavity 712 can also include a notch 714. The notch 714 can form a depression within the mold seal, thereby allowing the mold seal, and therefore the flexible interconnect circuit 100, to be secured within the opening.

[0170] Figure 21C and Figure 21D Illustrated are schematic plan views illustrating another technique for forming a molded encapsulated flexible interconnect circuit, according to some examples. Figure 21C The diagram illustrates a forming scenario 800 including a flexible interconnect circuit 100 that includes a plurality of support sheets 690 having openings 692 that are located outside of the area defined by edges 802 and 804. Thus, the plurality of support sheets 690 are positioned proximate to the mold seal. Edges 802 and 804 are edges of a tool used to form the mold seal on the flexible interconnect circuit 100. Thus, the support sheets 690 are positioned outside of the mold cavity.

[0171] Figure 21D A forming scenario 810 is illustrated wherein a portion of the flexible interconnect circuit 100 is positioned within a mold cavity 812. A molding tool associated with the mold cavity 812 may include a pin configured to pass through the opening 692. The mold cavity 812 may also include a notch 814 for forming a depression within the mold seal.

[0172] Figure 21E 、 Figure 21F and Figure 21G Illustrated are schematic plan views illustrating another technique for forming a molded encapsulated flexible interconnect circuit, according to some examples. Figure 9A A forming scenario 900 is illustrated that includes a flexible interconnect circuit 100 including a support sheet 690 having an opening 692. The flexible interconnect circuit 100 can be configured to be positioned within a mold cavity defined by edges 902 and 904.

[0173] exist Figure 21F In forming scenario 910, a protective collar 912 is inserted around the flexible interconnect circuit 100. The protective collar 912 can provide protection for the flexible interconnect circuit 100 from pressure, temperature, or other aspects of molding. The protective collar 912 can be as described herein.

[0174] exist Figure 21G In forming scenario 920, mold cavity 914 is positioned over flexible interconnect circuit 100 and protective collar 912. Thus, a molding tool for molding cavity 914 can form a mold seal over protective collar 912. In various examples, protective collar 912 can be positioned over flexible interconnect circuit 100 and can remain positioned over flexible interconnect circuit 100 after forming the mold seal. Pins can be positioned through openings 692 to hold flexible interconnect circuit 100 in place during formation of the mold seal. Mold cavity 914 can also include notches 916 for forming a recess within the mold seal.

[0175] Figure 22 Illustrated is a process flow diagram corresponding to an example method for forming a molded encapsulated flexible interconnect circuit according to one or more examples. Figure 22 A process 1000 for forming and assembling a molded sealed flexible interconnect circuit is illustrated. At 1002, a flexible interconnect circuit is formed. Thus, for example, various layers and circuits and / or traces of the flexible interconnect circuit are formed at 1002.

[0176] In optional 1004, a protective collar is applied to one or more portions of the flexible interconnect circuit. The protective collar can be as described herein and can protect the flexible interconnect circuit from the pressure and / or temperature of molding. Certain forming techniques may not require a protective collar, and therefore, in such techniques, no protective collar can be positioned on the flexible interconnect circuit 100.

[0177] In optional 1006, the flexible interconnect circuit 100 may be assembled. Accordingly, any additional components, such as connectors, may be assembled in 1006. Additionally or alternatively, the flexible interconnect circuit may be cut and / or bent as desired.

[0178] At 1008, one or more seals can be overmolded onto the flexible interconnect circuit according to the techniques described herein. In various examples, the flexible interconnect circuit can be supported (e.g., via pins inserted into openings in the flexible interconnect circuit) and / or protected (e.g., by a protective collar) as described herein. Various other techniques can utilize molding parameters (e.g., certain pressures and / or temperatures) that do not require reinforcement or support of the flexible interconnect circuit during molding. At 1010, the finished flexible interconnect circuit is produced and assembled (e.g., to a vehicle).

[0179] Alternatively, in optional 1008, the seal may be overmolded prior to assembly and other operations used to complete the flexible interconnect circuit.

[0180] Figures 23A-23C : Example component

[0181] Figures 23A-23C Schematic plan views of molded sealed flexible interconnect circuits are shown in various components according to some examples. Figures 23A-23C As shown in , a flexible interconnect circuit with a molded seal can allow for sealing and protection when passing through various openings. Such sealing can provide inherent protection for the flexible interconnect circuit with the molded seal, and thus, may not require additional seals or other components to provide the desired sealing and / or protection. Consequently, the number of parts, accompanying logistics, and assembly time can be reduced.

[0182] Figure 23A The assembly 2300 is shown including a control unit 2302 and a flexible interconnect circuit 100. The flexible interconnect circuit 100 includes a molded seal 201 and an electrical link 233. The control unit 2302 can be, for example, an electronic control unit (ECU). The flexible interconnect circuit 100 can terminate inside the control unit 2302. Thus, for example, the electrical connection 233 can be a connector and / or electrical connection (e.g., a solder connection) coupled to various circuits within the control unit 2302.

[0183] The flexible interconnect circuit 100 can enter the control unit 2302 through the opening 2304 of the control unit 2302. The molded seal 201 can be positioned on the flexible interconnect circuit 100 at a location that will allow the molded seal 201 to provide protection and / or sealing at the location where the flexible interconnect circuit 100 passes through the opening 2304. Thus, for example, the control unit 2302 may require certain sealing characteristics (e.g., to prevent dust intrusion). Because the opening 2304 does not fully conform to the flexible interconnect circuit 100, the molded seal 201 can seal the opening 2304.

[0184] Figure 23BAn assembly 2310 is shown that includes a partition 2312 and a flexible interconnect circuit 100. In various examples, the partition 2312 can be a partition, a fire barrier, and / or another such structure. Because electrical connections may need to pass from one side of the partition 2312 to the other, the partition 2312 can include an opening 2314 that allows the flexible interconnect circuit 100 to pass from one side to the other (e.g., from one side of a vehicle to the other side of the vehicle).

[0185] The flexible interconnect circuit 100 includes a molded seal 201. Because the opening 2314 can be formed from, for example, sheet metal or machined metal and can therefore include sharp edges that could damage the circuit, the molded seal 201 can provide protection for the portion of the flexible interconnect circuit 100 that passes through the opening 2314. The molded seal 201 can also provide a seal for the opening 2314 and, therefore, seal one side of the separator 2312 from the other.

[0186] Figure 23C The assembly 2320 including the component 2390 and the flexible interconnect circuit 100 is shown. The component 2390 includes an opening 2394. The component 2390 can be, for example, a vehicle door, a dashboard, a vehicle window, a firewall, and / or another such component. The component 2390 can include sealing requirements. Figure 23C As shown, the molded seal 201 of the flexible interconnect circuit 100 can be compressible and can expand to occupy the area of ​​the opening 2394, thereby allowing sealing of the opening 2394 through which the flexible interconnect circuit 100 passes. Thus, even though portions of the flexible interconnect circuit 100 can pass from the "dry" inside of a vehicle (where liquid and dust intrusion needs to be eliminated or minimized) to the "wet" outside of the vehicle, the molded seal 201 can provide protection from the vehicle's external environment.

[0187] in conclusion

[0188] It should be understood that the above description is intended to be illustrative and not restrictive. For example, the above examples (and / or aspects thereof) can be used in combination with each other. In addition, many modifications can be made to adapt specific situations or materials to the teachings presented herein. The size, material type, orientation, and number and position of the various components described herein are intended to limit the parameters of some examples and are by no means restrictive, but merely examples. After reading the above description, many examples and modifications within the spirit and scope of the claims will be apparent to those skilled in the art.

Claims

1. A flexible interconnect circuit comprising: a first insulating layer; a second insulating layer; a plurality of conductive traces partially protruding between the first insulating layer and the second insulating layer and including a plurality of contact portions extending through the first insulating layer and the second insulating layer; as well as a support end comprising a plurality of temporary support links, the plurality of contact portions of the plurality of conductive traces extending and connected to the plurality of temporary support links, wherein: Each of the temporary support links is integral with a corresponding one of the plurality of conductive traces, and Each of the temporary support links is configured to break and separate from the corresponding one of the plurality of conductive traces when the support end is removed from the remainder of the flexible interconnect circuit.

2. The flexible interconnect circuit according to claim 1, wherein All conductive traces and all temporary support links are formed from the same sheet of metal.

3. The flexible interconnect circuit according to claim 1, wherein: The plurality of temporary support links have a weaker mechanical structure than the plurality of conductive traces such that when a force is applied to the plurality of temporary support links or the plurality of conductive traces, the plurality of temporary support links break before the plurality of conductive traces.

4. The flexible interconnect circuit according to claim 3, wherein: The tensile strength of the plurality of temporary support links is less than 50% of the tensile strength of the plurality of conductive traces.

5. The flexible interconnect circuit according to claim 3, wherein: The tensile strength of the plurality of temporary support links is less than 25% of the tensile strength of the plurality of conductive traces.

6. The flexible interconnect circuit according to claim 3, wherein: The tensile strength of the plurality of temporary support links is less than 10% of the tensile strength of the plurality of conductive traces.

7. The flexible interconnect circuit according to claim 3, wherein: The plurality of temporary support links have a smaller thickness than the plurality of conductive traces.

8. The flexible interconnect circuit according to claim 7, wherein: The thickness of the plurality of temporary support links is less than 50% of the thickness of the plurality of conductive traces.

9. The flexible interconnect circuit according to claim 7, wherein: The thickness of the plurality of temporary support links is less than 25% of the thickness of the plurality of conductive traces.

10. The flexible interconnect circuit according to claim 7, wherein: The thickness of the plurality of temporary support links is less than 10% of the thickness of the plurality of conductive traces.

11. The flexible interconnect circuit according to claim 7, wherein: The smaller thickness of the plurality of temporary support links is achieved by ablation.

12. The flexible interconnect circuit according to claim 3, wherein: The plurality of temporary support links have a smaller width than the plurality of conductive traces.

13. The flexible interconnect circuit according to claim 3, wherein: The width of the plurality of temporary support links is less than 50% of the width of the plurality of conductive traces.

14. The flexible interconnect circuit according to claim 3, wherein: The plurality of temporary support links include one or both of cutouts and perforations that form a weaker mechanical structure of the plurality of temporary support links relative to the plurality of conductive traces.

15. The flexible interconnect circuit according to claim 1, wherein The support end is formed by a portion of the first insulating layer, a portion of the second insulating layer, and a plurality of portions of the support end, and extends between the portion of the first insulating layer and the portion of the second insulating layer.

16. The flexible interconnect circuit according to claim 1, wherein The plurality of conductive traces, the plurality of contact portions, and the plurality of temporary support links are patterned from a same conductive sheet.

17. A method of attaching a connector to a flexible interconnect circuit, the method comprising: The flexible interconnect circuit is provided comprising a first insulating layer, a second insulating layer, a plurality of conductive traces, and a support end, wherein: the plurality of conductive traces partially protrude between the first insulating layer and the second insulating layer and include a plurality of contact portions extending through the first insulating layer and the second insulating layer, the support end includes a plurality of temporary support links, the plurality of contact portions of the plurality of conductive traces extend and are connected to the plurality of temporary support links, each of the temporary support links is integral with a corresponding one of the plurality of conductive traces, and each of the temporary support links is configured to break and separate from the corresponding one of the plurality of conductive traces when the support end is removed from the remainder of the flexible interconnect circuit; and a circuit comprising a first connector portion and a second connector portion. A connector with two connector parts, wherein the first connector part includes a plurality of connector conductive traces; positioning the flexible interconnect circuit above the first connector part of the connector so that the plurality of contact parts of the flexible interconnect circuit extend above and are aligned relative to the plurality of connector conductive traces while being supported by the plurality of temporary support links; and advancing the second connector part to the flexible interconnect circuit while the second connector part pushes the plurality of contact parts or the plurality of temporary support links and breaks the plurality of temporary support links, thereby releasing the plurality of contact parts from the support end, so that the plurality of contact parts move toward the plurality of connector conductive traces, dock with the plurality of connector conductive traces and form a plurality of electrical connections.

18. The method of claim 17, further comprising joining the first connector portion with the second connector portion to form a connector body.

19. The method according to claim 17, wherein Positioning the flexible interconnect circuit over the first connector portion is performed using an assembly fixture including an alignment cavity and a plurality of alignment pins.

20. The method according to claim 19, wherein Positioning the flexible interconnect circuit over the first connector portion includes projecting the plurality of alignment pins through a plurality of alignment features of the flexible interconnect circuit and positioning the first connector portion into the alignment cavity.

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