Subperiosteal implant anodizing device and manufacturing method thereof

Abstract

The present invention discloses a subperiosteal implant anodizing device, comprising: a clamping mechanism; an anode; an upper cathode, whose bottom surface shape matches the upper characteristic surface; a lower cathode, whose top surface shape matches the lower characteristic surface; a connecting mechanism; and a positioning mechanism, so that the distance from the bottom surface of the upper cathode to the upper characteristic surface is equal to the distance from the top surface of the lower cathode to the lower characteristic surface. In the subperiosteal implant anodizing device of the present invention, the electron flow conducted by the upper cathode to the upper characteristic surface and the electron flow transmitted by the lower cathode to the lower characteristic surface are distributed more evenly, which greatly improves the uniformity and glossiness of the subperiosteal implant after anodizing. The present invention also discloses a method for manufacturing a subperiosteal implant anodizing device, which is used to manufacture the subperiosteal implant anodizing device as described above, and ensures that the distance from the bottom surface of the upper cathode to the upper characteristic surface is equal to the distance from the top surface of the lower cathode to the lower characteristic surface. The present invention can be applied to the field of anodizing technology.

Description

Technical Field

[0001] The invention relates to the technical field of anodizing, and in particular to a subperiosteal implant anodizing device and a manufacturing method thereof. Background Art

[0002] Subperiosteal implants are implants between the periosteum and the bone surface, and require a relatively smooth surface. Subperiosteal implants are characterized by customization, and their appearance and shape fit the surface of the patient's jawbone, so subperiosteal implants generally have irregular curved surfaces. The curved surface of subperiosteal implants varies in a complex manner, and manual polishing is inefficient. Abrasives and grinding tools are difficult to reach the corners, so anodizing polishing is used. This method is an electrochemical method, which has higher polishing efficiency and is almost unaffected by the shape of the workpiece.

[0003] The cathode of the existing anodizing device is generally an electrode rod. For subperiosteal implants with complex curved surfaces, it is difficult to obtain electron flow that is conducted from all sides of the workpiece to the middle, which affects the uniformity and glossiness after anodizing. Therefore, it is necessary to design an anodizing device specifically for subperiosteal implants. Summary of the invention

[0004] The purpose of the present invention is to provide a subperiosteal implant anodizing device and a manufacturing method thereof, so as to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0005] The technical solutions adopted to solve the above technical problems are:

[0006] A subperiosteal implant anodizing device is used to realize the anodizing of the subperiosteal implant, wherein the top surface and the bottom surface of the subperiosteal implant are respectively an upper characteristic surface and a lower characteristic surface, and the subperiosteal implant anodizing device comprises:

[0007] A clamping mechanism for connecting the subperiosteal implant;

[0008] an anode connected to the clamping mechanism or the subperiosteal implant;

[0009] An upper cathode, the bottom surface of which matches the upper characteristic surface;

[0010] A lower cathode, the top surface of which is shaped to match the lower characteristic surface;

[0011] A connecting mechanism, which connects the upper cathode and the lower cathode, and a processing space for placing the subperiosteal implant is formed between the upper cathode and the lower cathode;

[0012] A positioning mechanism is used to fix the position of the clamping mechanism relative to the upper cathode or the lower cathode so that the distance from the bottom surface of the upper cathode to the upper characteristic surface is equal to the distance from the top surface of the lower cathode to the lower characteristic surface.

[0013] The beneficial effects of the present invention are as follows: the subperiosteal implant is characterized by customization, and its appearance and shape fit the surface of the patient's jawbone. The top and bottom shapes of the subperiosteal implant need to be customized according to the surface shape of the patient's jawbone. Therefore, the subperiosteal implant is generally an irregularly changing curved surface. Therefore, the top and bottom surfaces of the subperiosteal implant are respectively set as the upper characteristic surface and the lower characteristic surface; the bottom surface shape of the upper cathode is designed according to the upper characteristic surface, and the top surface shape of the lower cathode is designed according to the lower characteristic surface. The upper cathode and the lower cathode are connected by a connecting mechanism and a processing space is formed between the two. The subperiosteal implant is fixed by a clamping mechanism. The positioning mechanism is used to fix the position of the clamping mechanism relative to the upper cathode or the lower cathode, so that the subperiosteal implant is placed in the processing space, and the distance from the upper characteristic surface to the bottom surface of the upper cathode is equal to the distance from the lower characteristic surface to the top surface of the lower cathode; therefore, when the subperiosteal implant is anodized and polished by the anode, the upper cathode, and the lower cathode, since the distance from the upper characteristic surface to the bottom surface of the upper cathode is equal to the distance from the lower characteristic surface to the top surface of the lower cathode, the electron flow conducted from the upper cathode to the upper characteristic surface and the electron flow transmitted from the lower cathode to the lower characteristic surface are more evenly distributed, which greatly improves the uniformity and glossiness of the subperiosteal implant after anodization.

[0014] As a further improvement of the above technical solution, there are multiple connecting mechanisms, and the multiple connecting mechanisms are distributed around the periphery of the processing space.

[0015] As a further improvement of the above technical solution, the thickness of the upper cathode in the up-down direction is equal to the thickness of the lower cathode in the up-down direction.

[0016] As a further improvement of the above technical solution, the positioning mechanism is made of insulating material, and the positioning mechanism is connected to the clamping mechanism and the lower cathode.

[0017] A method for manufacturing a subperiosteal implant anodizing device, used for manufacturing the subperiosteal implant anodizing device as described above, the manufacturing method comprising:

[0018] Taking the position where the clamping mechanism is connected to the subperiosteal implant as a positioning reference, designing the bottom surface of the upper cathode according to the positioning reference and the upper characteristic surface, and designing the top surface of the lower cathode according to the positioning reference and the lower characteristic surface;

[0019] Based on the positioning reference, obtaining a first positional relationship of the upper characteristic surface relative to the bottom surface of the upper cathode and obtaining a second positional relationship of the lower characteristic surface relative to the top surface of the lower cathode;

[0020] The connecting mechanism and the positioning mechanism are designed according to the first position relationship and the second position relationship.

[0021] Taking the position where the clamping mechanism connects the subperiosteal implant as the positioning reference, the bottom surface of the upper cathode and the top surface of the lower cathode are designed, and the first position relationship between the bottom surface of the upper cathode and the upper characteristic surface and the second position relationship between the top surface of the lower cathode and the lower characteristic surface are obtained according to the positioning reference. The connecting mechanism and the positioning mechanism are designed according to the first position relationship and the second position relationship, which helps to improve the assembly accuracy of the connecting mechanism, the upper cathode, the lower cathode, the positioning mechanism, the clamping mechanism, and the subperiosteal implant, thereby ensuring that the distance from the bottom surface of the upper cathode to the upper characteristic surface is equal to the distance from the top surface of the lower cathode to the lower characteristic surface.

[0022] As a further improvement of the above technical solution, the step of obtaining a first positional relationship of the upper characteristic surface relative to the bottom surface of the upper cathode and obtaining a second positional relationship of the lower characteristic surface relative to the top surface of the lower cathode based on the positioning reference includes:

[0023] Establishing a three-dimensional coordinate system with the positioning reference as the origin, setting a plurality of upper feature points on the upper feature surface, and setting a plurality of lower feature points on the lower feature surface;

[0024] Selecting a plurality of corresponding upper positioning points on the bottom surface of the upper cathode according to the plurality of upper characteristic points, and selecting a plurality of corresponding lower positioning points on the top surface of the lower cathode according to the plurality of lower characteristic points;

[0025] deriving a plurality of upper vectors according to the plurality of upper feature points and the plurality of upper positioning points, and deriving a plurality of lower vectors according to the plurality of lower feature points and the plurality of lower positioning points;

[0026] The first position relationship is obtained according to the plurality of upper vectors, and the second position relationship is obtained according to the plurality of lower vectors.

[0027] As a further improvement of the above technical solution, the connecting mechanism and the positioning mechanism are designed according to the first position relationship and the second position relationship, including:

[0028] Establishing a three-dimensional coordinate system with the positioning reference as the origin, and calculating the degree of freedom of the upper cathode relative to the lower cathode;

[0029] A corresponding number of the connecting mechanisms are designed according to the degrees of freedom.

[0030] As a further improvement of the above technical solution, the bottom surface of the upper cathode is designed according to the positioning reference and the upper characteristic surface, including:

[0031] A three-dimensional coordinate system is established with the positioning reference as the origin, and the upper characteristic surface is translated upward to obtain the bottom surface of the upper cathode.

[0032] As a further improvement of the above technical solution, the top surface of the lower cathode is designed according to the positioning reference and the lower characteristic surface, including:

[0033] A three-dimensional coordinate system is established with the positioning reference as the origin, and the lower characteristic surface is translated downward to obtain the top surface of the lower cathode.

[0034] As a further improvement of the above technical solution, the manufacturing method further includes:

[0035] The subperiosteal implant, the clamping mechanism, the upper cathode, the lower cathode, and the positioning mechanism are manufactured by a 3D printing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention will be further described below in conjunction with the accompanying drawings and embodiments;

[0037] Figure 1 This is a schematic structural diagram of an embodiment of the subperiosteal implant anodizing device provided by the present invention;

[0038] Figure 2 yes Figure 1 A is an enlarged schematic diagram;

[0039] Figure 3 This is an exploded schematic diagram of an embodiment of the subperiosteal implant anodizing device provided by the present invention;

[0040] Figure 4 The present invention provides a method for manufacturing a subperiosteal implant anodizing device, and a flowchart of steps in one embodiment thereof;

[0041] Figure 5 The present invention provides a method for manufacturing a subperiosteal implant anodizing device, and a flowchart of steps for obtaining a first position relationship and a second position relationship in one embodiment thereof;

[0042] Figure 6 The invention discloses a method for manufacturing a subperiosteal implant anodizing device, and a flowchart of the steps of designing a connecting mechanism and a positioning mechanism in one embodiment thereof.

[0043] 10. Subperiosteal implant, 11. Upper characteristic surface, 12. Lower characteristic surface, 100. Clamping mechanism, 200. Anode, 300. Upper cathode, 400. Lower cathode, 500. Connecting mechanism, 510. Processing space, 600. Electrolytic cell, 610. Base, 620. Insulating sleeve, 630. Cooling pipe. DETAILED DESCRIPTION

[0044] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0045] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0046] In the description of the present invention, if there are words such as "several", it means one or more, "more" means more than two, greater than, less than, exceed, etc. are understood as not including the number, and above, below, within, etc. are understood as including the number.

[0047] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0048] The subperiosteal implant 10 is a specially made scaffold-like structure that can adapt to the anatomical morphology of the upper and lower mandibular support areas and has a certain range of extension to provide support and retention for the restoration above. The scaffold includes a submucosal extension with or without connecting rods and pillars. The pillars are divided into peripheral, primary and secondary. The subperiosteal implant 10 can be designed to support the entire dental arch or unilateral dental arch, and can be immediately loaded.

[0049] The entire dental arch is scanned with a special CT / CBVT to create a replica (radio template) of the final denture with a resin base (containing 25% barium sulfate). Barium sulfate can act as a radiopaque agent to show the structural contours of soft tissues on three-dimensional images.

[0050] The radiographic template is worn during the scan, and the scanned data and more advanced computer modeling techniques are used to create a model of the jawbone and the overlying soft tissue.

[0051] The three-dimensional model of the jaw bone and soft tissue is used to produce a subperiosteal implant 10 and a denture for immediate functional loading.

[0052] Then the surgery is performed to expose the jawbone and place the implant, which is fixed to the jawbone with bone screws. The surgeon will fill any gap between the implant and the underlying bone surface with bone substitute materials. Different bone substitutes can be used according to the doctor's preference and guided bone regeneration technology can be used. The mucoperiosteum is closed and sutured, and the denture is connected for immediate weight bearing.

[0053] The top surface and the bottom surface of the subperiosteal implant 10 are custom-designed according to the patient's jaw shape. The top surface and the bottom surface of the subperiosteal implant 10 contain the specific features of the patient's jaw shape. Therefore, the top surface of the subperiosteal implant 10 can be set as the upper feature surface 11, and the bottom surface of the subperiosteal implant 10 can be set as the lower feature surface 12.

[0054] Reference Figures 1 to 3 The subperiosteal implant anodizing device of the present invention is made into the following embodiments:

[0055] The subperiosteal implant anodizing device is a special anodizing process for the subperiosteal implant 10 , and comprises a clamping mechanism 100 , an anode 200 , an upper cathode 300 , a lower cathode 400 , a connecting mechanism 500 , and a positioning mechanism.

[0056] The clamping mechanism 100 is connected to the subperiosteal implant 10, and the anode 200 is connected to the clamping mechanism 100 or the subperiosteal implant 10, so that the anode 200 forms an electrical connection with the subperiosteal implant 10, making the subperiosteal implant 10 a part of the anode.

[0057] The bottom surface shape of the upper cathode 300 is designed and manufactured according to the shape of the upper characteristic surface 11 , and the top surface shape of the lower cathode 400 is designed and manufactured according to the shape of the lower characteristic surface 12 .

[0058] The connecting mechanism 500 connects the upper cathode 300 and the lower cathode 400 to form a processing space 510 between the upper cathode 300 and the lower cathode 400 , so as to facilitate placing the subperiosteal implant 10 in the processing space 510 .

[0059] The connection mechanism 500 may be in various forms.

[0060] The connection mechanism 500 may be a fixing rod, and the upper cathode 300, the lower cathode 400, and the fixing rod are integrally formed to ensure the relative position of the upper cathode 300 and the lower cathode 400. Alternatively, screw holes are respectively provided on the upper cathode 300 and the lower cathode 400, and the connection mechanism 500 is a double-headed screw, and the two ends of the double-headed screw are respectively screwed into the screw holes of the upper cathode 300 and the lower cathode 400. Alternatively, buckle grooves are respectively provided on the upper cathode 300 and the lower cathode 400, and the connection mechanism 500 is a fastener, and the two ends of the fastener are respectively clamped in the buckle grooves of the upper cathode 300 and the lower cathode 400.

[0061] In this embodiment, through connection holes are respectively provided on the upper cathode 300 and the lower cathode 400, and the connection mechanism 500 includes a double-headed screw and two nuts. Two protruding steps are provided between the two threaded sections of the double-headed screw. After the two ends of the double-headed screw pass through the connection holes of the upper cathode 300 and the lower cathode 400, the two steps respectively abut against the upper cathode 300 and the lower cathode 400, and the two nuts are respectively installed at the two ends of the double-headed screw. Tightening the two nuts presses the upper cathode 300 and the lower cathode 400.

[0062] The positioning mechanism fixes the position of the clamping mechanism 100 relative to the upper cathode 300 or the lower cathode 400 , so that the upper cathode 300 and the lower cathode 400 are fixed relative to the subperiosteal implant 10 , ensuring that the subperiosteal implant 10 is fixed in position in the treatment space 510 .

[0063] There are many forms of positioning mechanisms.

[0064] For example, the positioning mechanism is divided into a first positioning member and a second positioning member, the first positioning member and the second positioning member are respectively fixed in the electrolytic cell 600 by insulating materials, the relative positions of the first positioning member and the second positioning member are fixed, the first positioning member is connected to the clamping mechanism 100, and the second positioning member is connected to the upper cathode 300 or the lower cathode 400, and the upper cathode 300 and the lower cathode 400 are connected by the connecting mechanism 500, so the positions of the upper cathode 300 and the lower cathode 400 relative to the subperiosteal implant 10 are fixed.

[0065] Alternatively, the positioning mechanism is directly connected to the clamping mechanism 100 and the lower cathode 400 , and the positioning mechanism is made of insulating material to prevent the clamping mechanism 100 and the lower cathode 400 from being electrically connected.

[0066] Furthermore, after the positioning mechanism fixes the clamping mechanism 100 and the lower cathode 400 , the distance between the bottom surface of the upper cathode 300 and the upper characteristic surface 11 is equal to the distance between the top surface of the lower cathode 400 and the lower characteristic surface 12 .

[0067] The subperiosteal implant 10 is characterized by customization, and its appearance and shape fit the surface of the patient's jawbone. The top and bottom shapes of the subperiosteal implant 10 need to be customized according to the surface shape of the patient's jawbone. Therefore, the subperiosteal implant 10 is generally an irregularly curved surface.

[0068] Therefore, the top surface and the bottom surface of the subperiosteal implant 10 are respectively referred to as an upper characteristic surface 11 and a lower characteristic surface 12 .

[0069] The bottom surface shape of the upper cathode 300 is made according to the upper characteristic surface 11, and the top surface shape of the lower cathode 400 is made according to the lower characteristic surface 12. The upper cathode 300 and the lower cathode 400 are connected by a connecting mechanism 500 to form a processing space 510 therebetween.

[0070] The subperiosteal implant 10 is fixed by the clamping mechanism 100 , and the position of the clamping mechanism 100 relative to the upper cathode 300 or the lower cathode 400 is fixed by the positioning mechanism.

[0071] The subperiosteal implant 10 is placed in the treatment space 510 , and the distance from the upper characteristic surface 11 to the bottom surface of the upper cathode 300 is equal to the distance from the lower characteristic surface 12 to the top surface of the lower cathode 400 .

[0072] Therefore, when the subperiosteal implant 10 is anodized and polished by the anode 200, the upper cathode 300, and the lower cathode 400, since the distance from the upper characteristic surface 11 to the bottom surface of the upper cathode 300 is equal to the distance from the lower characteristic surface 12 to the top surface of the lower cathode 400, the electron flow conducted from the upper cathode 300 to the upper characteristic surface 11 and the electron flow conducted from the lower cathode 400 to the lower characteristic surface 12 are distributed more evenly, which greatly improves the uniformity and glossiness of the surface of the subperiosteal implant 10.

[0073] In some embodiments, a plurality of connection mechanisms 500 are provided, and the plurality of connection mechanisms 500 are distributed at intervals around the periphery of the processing space 510 .

[0074] The relative positions of the upper cathode 300 and the lower cathode 400 are fixed by multiple connecting mechanisms 500 to ensure the distance between the upper cathode 300 and the lower cathode 400 during the anodization process, thereby ensuring that the distance from the upper characteristic surface 11 to the bottom surface of the upper cathode 300 is equal to the distance from the lower characteristic surface 12 to the top surface of the lower cathode 400.

[0075] In some embodiments, the thickness of the upper cathode 300 in the up-down direction is the same as the thickness of the lower cathode 400 in the up-down direction.

[0076] The thickness of the upper cathode 300 is the same as that of the lower cathode 400 , which reduces the volume difference between the upper cathode 300 and the lower cathode 400 , making the electron flow conducted from the upper cathode 300 to the upper characteristic surface 11 and the electron flow conducted from the lower cathode 400 to the lower characteristic surface 12 more evenly distributed.

[0077] In some embodiments, the positioning mechanism is made of insulating material, and the positioning mechanism connects the clamping mechanism 100 and the lower cathode 400 .

[0078] The clamping mechanism 100 and the lower cathode 400 are fixed by the positioning mechanism, so that the clamping mechanism 100 is prevented from conducting the lower cathode 400 , and the position of the lower cathode 400 relative to the subperiosteal implant 10 is fixed.

[0079] Specifically, refer to Figures 1 to 3As shown, the subperiosteal implant anodizing device includes a clamping mechanism 100, an anode 200, an upper cathode 300, a lower cathode 400, a plurality of connecting mechanisms 500, a positioning mechanism, an electrolytic cell 600, a base 610, an insulating sleeve 620, and a cooling pipe 630.

[0080] Reference Figure 1 As shown, the electrolytic cell 600 is used to contain electrolyte, and the base 610 is arranged at the bottom of the electrolytic cell 600. A space for accommodating a cooling pipe 630 is arranged inside the base 610. Both ends of the cooling pipe 630 extend out of the electrolytic cell 600. After the coolant flows through the cooling pipe 630, the electrolyte in the electrolytic cell 600 is cooled.

[0081] Reference Figure 1 and Figure 2 As shown, an insulating sleeve 620 extending upward is provided on the top of the base 610, and the insulating sleeve 620 is connected to the anode 200, and the anode 200 is connected to the positive pole of the power supply. An elastic clamp is provided on the top of the anode 200, and the elastic clamp is composed of a plurality of conductive springs spaced apart along the circumferential direction.

[0082] Reference Figure 2 and Figure 3 As shown, a conductive column extending downward is provided at the bottom of the clamping mechanism 100 , and the conductive column is inserted into the elastic clamp. The top of the clamping mechanism 100 is connected to the subperiosteal implant 10 , so that the subperiosteal implant 10 is electrically connected to the anode 200 .

[0083] The bottom surface shape of the upper cathode 300 is modeled and manufactured based on the shape of the upper characteristic surface 11, and the bottom surface of the upper cathode 300 is designed by translating the upper characteristic surface 11 of the subperiosteal implant 10 upward. The top surface shape of the lower cathode 400 is modeled and manufactured based on the shape of the lower characteristic surface 12, and the top surface of the lower cathode 400 is designed by translating the lower characteristic surface 12 of the subperiosteal implant 10 downward.

[0084] The upper cathode 300 and the lower cathode 400 are connected to the negative electrode of the power source.

[0085] The thickness of the upper cathode 300 in the vertical direction is the same as the thickness of the lower cathode 400 in the vertical direction.

[0086] The upper cathode 300 and the lower cathode 400 are respectively provided with three through-going connection holes.

[0087] There are three connection mechanisms 500 , and the three connection mechanisms 500 are matched with the three connection holes in a one-to-one correspondence.

[0088] Each connecting mechanism 500 includes a double-headed screw and two nuts. Two protruding steps are arranged between the two threaded sections of the double-headed screw. After the two ends of the double-headed screw pass through the connecting holes of the upper cathode 300 and the lower cathode 400, the two steps respectively abut against the upper cathode 300 and the lower cathode 400. The two nuts are respectively installed at the two ends of the double-headed screw. Tightening the two nuts presses the upper cathode 300 and the lower cathode 400.

[0089] A processing space 510 is formed between the upper cathode 300 and the lower cathode 400 .

[0090] The lower cathode 400 is provided with a positioning hole which passes through from top to bottom, and the clamping mechanism 100 is passed through the positioning hole. The positioning mechanism is an insulating member, and the positioning mechanism is arranged between the clamping mechanism 100 and the positioning hole. The positioning mechanism fixes the clamping mechanism 100 and the lower cathode 400 together, so that the subperiosteal implant 10 is fixed in the processing space 510, and the distance from the upper characteristic surface 11 to the bottom surface of the upper cathode 300 is equal to the distance from the lower characteristic surface 12 to the top surface of the lower cathode 400.

[0091] Reference Figures 4 to 6 The manufacturing method of the subperiosteal implant anodizing device of the present invention is as follows:

[0092] Reference Figure 4 As shown, the manufacturing method of the subperiosteal implant anodizing device is used to manufacture the above-mentioned subperiosteal implant anodizing device, which includes the following steps.

[0093] Step S100, determining the connection position between the clamping mechanism 100 and the subperiosteal implant 10 as a positioning reference, based on the positioning reference, determining the bottom surface shape of the upper cathode 300 by the shape of the upper characteristic surface 11, and determining the top surface shape of the lower cathode 400 by the shape of the lower characteristic surface 12;

[0094] Step S200, selecting a positioning reference, obtaining a first positional relationship of the upper characteristic surface 11 relative to the bottom surface of the upper cathode 300, and obtaining a second positional relationship of the lower characteristic surface 12 relative to the top surface of the lower cathode 400;

[0095] Step S300 , modeling the connection mechanism 500 and the positioning mechanism based on the first position relationship and the second position relationship.

[0096] In step S100, since the clamping mechanism 100 is a key component connecting the subperiosteal implant 10 and the lower cathode 400, and the upper cathode 300 and the lower cathode 400 are designed according to the subperiosteal implant 10, the position where the clamping mechanism 100 is connected to the subperiosteal implant 10 is determined as the positioning reference, which helps to ensure the position accuracy of the above components.

[0097] The bottom surface of the upper cathode 300 is designed according to the positioning reference and the upper characteristic surface 11, and the top surface of the lower cathode 400 is designed according to the positioning reference and the lower characteristic surface 12. The bottom surface of the upper cathode 300 and the top surface of the lower cathode 400 are both designed based on the positioning reference.

[0098] In step S200 , the first position relationship and the second position relationship are also obtained based on the above positioning reference, so as to avoid errors caused by switching of the positioning reference.

[0099] In step S300, the positioning mechanism and the connecting mechanism 500 need to be designed based on the first position relationship and the second position relationship to make the relative positions among the upper cathode 300, the lower cathode 400 and the subperiosteal implant 10 more accurate.

[0100] Reference Figure 5 As shown, step S200, based on the positioning reference, obtains the first position relationship of the upper characteristic surface 11 relative to the bottom surface of the upper cathode 300 and obtains the second position relationship of the lower characteristic surface 12 relative to the top surface of the lower cathode 400, including the following steps.

[0101] Step S210, setting the positioning reference as the origin, establishing a three-dimensional coordinate system, selecting a plurality of upper feature points on the upper feature surface 11, and selecting a plurality of lower feature points on the lower feature surface 12;

[0102] Step S220, selecting a plurality of upper positioning points corresponding to a plurality of upper characteristic points on the bottom surface of the upper cathode 300, and selecting a plurality of lower positioning points corresponding to a plurality of lower characteristic points on the top surface of the lower cathode 400;

[0103] Step S230, deriving a plurality of upper vectors from the relative position relationship between the plurality of upper feature points and the plurality of upper positioning points, and deriving a plurality of lower vectors from the relative position relationship between the plurality of lower feature points and the plurality of lower positioning points;

[0104] Step S240: obtaining a first position relationship from a plurality of upper vectors, and obtaining a second position relationship from a plurality of lower vectors.

[0105] In step S210 , a three-dimensional coordinate system is established with the connection position between the clamping mechanism 100 and the subperiosteal implant 10 as the origin, and then the coordinates of multiple upper feature points of the upper feature surface 11 and the coordinates of multiple lower feature points of the lower feature surface 12 are obtained.

[0106] Since the subperiosteal implant 10 is a complex curved surface structure, it is necessary to set a plurality of upper characteristic points and a plurality of lower characteristic points to accurately evaluate the shapes and positions of the upper characteristic surface 11 and the lower characteristic surface 12 .

[0107] In step S220, multiple upper feature points are translated upward to the bottom surface of the upper cathode 300 one by one to obtain the coordinates of multiple corresponding upper positioning points on the bottom surface of the upper cathode 300; multiple lower feature points are translated downward to the top surface of the lower cathode 400 one by one to obtain the coordinates of multiple corresponding lower positioning points on the top surface of the lower cathode 400.

[0108] A plurality of upper positioning points are set to accurately evaluate the shape and position of the bottom surface of the upper cathode 300 , and a plurality of lower positioning points are set to accurately evaluate the shape and position of the top surface of the lower cathode 400 .

[0109] In step S230, an upper vector is obtained based on the relative position relationship between two corresponding upper feature points and the upper positioning point; a lower vector is obtained based on the relative position relationship between two corresponding lower feature points and the lower positioning point; multiple upper vectors and multiple lower vectors can accurately determine the position relationship between the upper cathode 300 and the lower cathode 400 relative to the subperiosteal implant 10.

[0110] In step S240, a first position relationship is obtained based on multiple upper vectors, and a second position relationship is obtained based on multiple lower vectors. The position of the upper cathode 300 relative to the upper characteristic surface 11 can be determined according to the first position relationship, and the position of the lower cathode 400 relative to the lower characteristic surface 12 can be determined according to the second position relationship.

[0111] Reference Figure 6 As shown, designing the connection mechanism 500 and the positioning mechanism according to the first position relationship and the second position relationship includes the following steps.

[0112] Step S310, establishing a three-dimensional coordinate system with the positioning reference as the origin, and calculating the degree of freedom of the upper cathode 300 relative to the lower cathode 400;

[0113] Step S320, designing a corresponding number of connection mechanisms 500 according to the degrees of freedom.

[0114] After calculating the degrees of freedom of the upper cathode 300 relative to the lower cathode 400, a corresponding number of connecting mechanisms 500 are designed to avoid excessive constraints between the upper cathode 300 and the lower cathode 400, so as to avoid deformation of the upper cathode 300 or the lower cathode 400 and affecting the position of the upper cathode 300 and the lower cathode 400 relative to the subperiosteal implant 10.

[0115] In some embodiments, step S100, designing the bottom surface of the upper cathode 300 according to the positioning reference and the upper characteristic surface 11, includes the following steps.

[0116] Step S110 , establishing a three-dimensional coordinate system with the positioning reference as the origin, and translating the upper characteristic surface 11 upward to obtain the bottom surface of the upper cathode 300 .

[0117] Step S100 , designing the top surface of the lower cathode 400 according to the positioning reference and the lower characteristic surface 12 , includes the following steps.

[0118] In step S120 , a three-dimensional coordinate system is established with the positioning reference as the origin, and the lower characteristic surface 12 is translated downward to obtain the bottom surface of the lower cathode 400 .

[0119] In some embodiments, the manufacturing method further includes the following steps.

[0120] Step S400, manufacturing the subperiosteal implant 10, the clamping mechanism 100, the upper cathode 300, the lower cathode 400, and the positioning mechanism through a 3D printing process.

[0121] By manufacturing the above components through the 3D printing process, the relative position relationship of the above components is more accurate and the assembly effect of the above components is more precise.

[0122] The preferred embodiments of the present invention are specifically described above, but the invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A method for manufacturing a subperiosteal implant anodizing device, characterized in that: Used to manufacture a subperiosteal implant anodizing device, the subperiosteal implant anodizing device is used to realize the anodizing of the subperiosteal implant, the top surface and the bottom surface of the subperiosteal implant are the upper characteristic surface and the lower characteristic surface respectively, and the subperiosteal implant anodizing device comprises: A clamping mechanism for connecting the subperiosteal implant; an anode connected to the clamping mechanism or the subperiosteal implant; An upper cathode, the bottom surface of which matches the upper characteristic surface; A lower cathode, the top surface of which is shaped to match the lower characteristic surface; A connecting mechanism, which connects the upper cathode and the lower cathode, and a processing space for placing the subperiosteal implant is formed between the upper cathode and the lower cathode; A positioning mechanism, which is used to fix the position of the clamping mechanism relative to the upper cathode or the lower cathode so that the distance from the bottom surface of the upper cathode to the upper characteristic surface is equal to the distance from the top surface of the lower cathode to the lower characteristic surface; The manufacturing method comprises: Taking the position where the clamping mechanism is connected to the subperiosteal implant as a positioning reference, designing the bottom surface of the upper cathode according to the positioning reference and the upper characteristic surface, and designing the top surface of the lower cathode according to the positioning reference and the lower characteristic surface; Based on the positioning reference, obtaining a first positional relationship of the upper characteristic surface relative to the bottom surface of the upper cathode and obtaining a second positional relationship of the lower characteristic surface relative to the top surface of the lower cathode; The connecting mechanism and the positioning mechanism are designed according to the first position relationship and the second position relationship.

2. The method for manufacturing a subperiosteal implant anodizing device according to claim 1, characterized in that: The step of acquiring a first positional relationship of the upper characteristic surface relative to the bottom surface of the upper cathode and acquiring a second positional relationship of the lower characteristic surface relative to the top surface of the lower cathode based on the positioning reference comprises: Establishing a three-dimensional coordinate system with the positioning reference as the origin, setting a plurality of upper feature points on the upper feature surface, and setting a plurality of lower feature points on the lower feature surface; Selecting a plurality of corresponding upper positioning points on the bottom surface of the upper cathode according to the plurality of upper characteristic points, and selecting a plurality of corresponding lower positioning points on the top surface of the lower cathode according to the plurality of lower characteristic points; deriving a plurality of upper vectors according to the plurality of upper feature points and the plurality of upper positioning points, and deriving a plurality of lower vectors according to the plurality of lower feature points and the plurality of lower positioning points; The first position relationship is obtained according to the plurality of upper vectors, and the second position relationship is obtained according to the plurality of lower vectors.

3. The method for manufacturing a subperiosteal implant anodizing device according to claim 1, characterized in that: The designing of the connecting mechanism and the positioning mechanism according to the first position relationship and the second position relationship includes: Establishing a three-dimensional coordinate system with the positioning reference as the origin, and calculating the degree of freedom of the upper cathode relative to the lower cathode; A corresponding number of the connecting mechanisms are designed according to the degrees of freedom.

4. The method for manufacturing a subperiosteal implant anodizing device according to claim 1, characterized in that: The designing of the bottom surface of the upper cathode according to the positioning reference and the upper characteristic surface comprises: A three-dimensional coordinate system is established with the positioning reference as the origin, and the upper characteristic surface is translated upward to obtain the bottom surface of the upper cathode.

5. The method for manufacturing a subperiosteal implant anodizing device according to claim 1, characterized in that: The step of designing the top surface of the lower cathode according to the positioning reference and the lower characteristic surface comprises: A three-dimensional coordinate system is established with the positioning reference as the origin, and the lower characteristic surface is translated downward to obtain the top surface of the lower cathode.

6. The method for manufacturing a subperiosteal implant anodizing device according to claim 1, characterized in that: The manufacturing method further comprises: The subperiosteal implant, the clamping mechanism, the upper cathode, the lower cathode, and the positioning mechanism are manufactured by a 3D printing process.

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