A direct writing lithography machine for producing small-size semiconductor chips

Abstract

The invention relates to the field of semiconductor lithography, and discloses a direct writing lithography machine for producing small-size semiconductor chips, including a cross slide mechanism, the cross slide mechanism including a guide rail and a linear module four, a base is slidably mounted on the guide rail, the linear module four includes a lower bracket, a lead screw parallel to the guide rail and a motor for driving the lead screw to rotate are mounted on the lower bracket, a threaded lug threadedly connected to the lead screw is provided at the bottom of the base, a supporting assembly is provided on the lead screw, the supporting assembly is provided with two groups of supporting assemblies and respectively located on both sides of the threaded lug, the supporting assembly includes a slide seat slidably connected to the guide rail and the lead screw, a plurality of slide seats are arranged in an array along the extension direction of the guide rail, two slide seats located at the head and tail of the array direction are respectively fixed to the lower bracket and the threaded lug, a connecting component is provided between two adjacent slide seats, the connecting component includes two connecting rods which are cross-arranged and hingedly connected, and the corresponding ends of the connecting rods in the two adjacent groups of connecting components are hingedly connected.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production, in particular to the field of semiconductor lithography, and in particular to a direct writing lithography machine for producing small-size semiconductor chips. Background Art

[0002] Photolithography technology is widely used in the fields of semiconductor and PCB production. It is one of the process steps in manufacturing semiconductor devices, chips, PCB boards and other products. It requires a photolithography machine, which is divided into mask photolithography machines and direct writing photolithography machines.

[0003] When the photolithography machine is in use, a cross slide is needed to move the silicon wafer. In the prior art, the cross slide commonly uses a lead screw linear motion technology. For example, the Chinese invention patent with application publication number CN116253157A discloses a photolithography plate shockproof moving mechanism for a semiconductor photolithography machine, which uses a lead screw linear motion to pull the photolithography plate (i.e., silicon wafer) to move, and positions the photolithography plate around the first positioning frame and the second positioning frame to prevent vibration and displacement, and ensures the stability of the photolithography plate through the positioning plate and the support plate. However, it still has some shortcomings: in the lead screw linear motion technology, when the lead screw rotates, it is affected by the lead screw slenderness ratio and the lead screw is prone to jitter, resulting in the movement accuracy of the silicon wafer being affected. This is the lead screw linear motion technology. The defects that exist in it, especially when producing small-sized semiconductor chips, have very strict requirements on the movement accuracy of the silicon wafer. Based on this defect, after searching, it was found that the Chinese invention patent with application publication number CN117989289A discloses a slender screw anti-shake structure and its use method. Through the automatic positioning and coordination of the first screw support seat and the second screw support seat, the suspended length of the screw is reduced, and the shaking problem of the slender screw during operation is effectively reduced. Its essence is that through the coordination of the two screw support seats, when the working slide moves, there is always a screw support seat located near the middle position of the screw stroke and supports the screw. However, when the screw is long, simply adding a support in the middle position is difficult to effectively solve the shaking problem, and needs to be improved.

[0004] Based on the above, the present invention proposes a direct-write lithography machine for producing small-size semiconductor chips. Summary of the invention

[0005] In order to solve the problems mentioned in the above background, the present invention provides a direct writing lithography machine for producing small-sized semiconductor chips.

[0006] In order to achieve the above technical objectives, the technical solution adopted by the present invention is as follows.

[0007] A direct writing lithography machine for producing small-size semiconductor chips, comprising a silicon wafer transmission system, the silicon wafer transmission system comprising a cross slide mechanism and an output mechanism, the cross slide mechanism comprising a guide rail and a linear module four, a base is slidably mounted on the guide rail, the linear module four comprises a lower bracket, a lead screw parallel to the guide rail and a motor for driving the lead screw to rotate are mounted on the lower bracket, a threaded lug connected to the lead screw thread is arranged at the bottom of the base, a supporting assembly is arranged on the lead screw, two groups of the supporting assembly are arranged and are respectively located on both sides of the threaded lug, the supporting assembly comprises a guide rail and a linear module four, a base is slidably mounted on the guide rail, the linear module four comprises a lower bracket, a lead screw parallel to the guide rail and a motor for driving the lead screw to rotate are mounted on the lower bracket, a threaded lug connected to the lead screw thread is arranged at the bottom of the base, and the support assembly comprises a support assembly connected to the guide rail and a support assembly connected to the guide rail. A sliding seat of dynamic connection, a sliding hole is arranged through the sliding seat, the aperture of the sliding hole is equal to the outer diameter of the lead screw, the sliding seat is slidably connected with the lead screw through the sliding hole, a plurality of sliding seats are arranged in an array along the extension direction of the guide rail, the two sliding seats located at the head and tail of the array direction are respectively fixedly connected with the lower bracket and the threaded lug, the two adjacent sliding seats are connected by a connecting component, the connecting component includes two connecting rods arranged in a cross manner, and the two connecting rods are hinged, and the hinge is located at the middle position of the connecting rod, and the corresponding ends of the connecting rods in the two adjacent groups of connecting components are hingedly connected.

[0008] Furthermore, a supporting platform is slidably mounted on the base in a direction perpendicular to the guide rail, and the supporting platform is driven to move by a linear module arranged on the base.

[0009] Furthermore, it also includes a working platform located above the linear module four, and the supporting platform includes a lower section slidably connected to the base, an upper section located above the working platform, and a side section used to connect the lower section and the upper section.

[0010] Furthermore, the interior of the supporting platform is hollow and an avoidance hole is opened on the upper end surface. A receiving assembly for placing silicon wafers is arranged in the supporting platform. The receiving assembly includes receiving parts, and several groups of receiving parts are arranged in an array along the circumferential direction of the avoidance hole.

[0011] Furthermore, the receiving component includes a horizontally arranged adsorption head and a fixed shaft vertically arranged in the supporting platform. A sleeve hole is arranged through the adsorption head, and the adsorption head is movably sleeved on the outside of the fixed shaft through the sleeve hole. A connecting hole is arranged on the outer cylindrical surface of the fixed shaft. The connecting hole includes an upper vertical section, a lower vertical section and an arc section for connecting the upper vertical section and the lower vertical section. A convex pin is extended from the hole wall of the sleeve. Initially, the end of the convex pin is slidably located in the upper vertical section of the connecting hole. The adsorption head is distributed radially along the avoidance hole. The upper end face of the adsorption head is provided with an adsorption hole. A nozzle is provided on the side of the adsorption head. The nozzle and the adsorption hole are connected through a connecting channel, and the end of the nozzle is connected to the negative pressure pump.

[0012] Furthermore, an inner bracket is slidably installed in the support platform along the vertical direction, the inner bracket is movably connected to the adsorption head, a spring is arranged under the inner bracket, a slope one is arranged on the inner bracket, and the distance between the slope one and the axis line of the avoidance hole decreases from bottom to top, a pressure block and a linear module two for driving the pressure block to move radially along the avoidance hole are installed in the support platform, a slope two is arranged on the pressure block, and the slope one is in contact with the slope two.

[0013] Furthermore, a blanking hole coaxial with the avoidance hole is opened on the lower surface of the support platform, and the output mechanism is located below the blanking hole. The output mechanism includes a connecting bracket and a linear module three for driving the connecting bracket to move in a vertical direction. A bracket is provided at the free end of the connecting bracket. Initially, the bracket is close to the blanking hole, and the outer diameter of the bracket is smaller than the outer diameter of the silicon wafer. A conveyor belt is installed on each side of the bracket.

[0014] Furthermore, an annular tube coaxial with the avoidance hole is arranged in the support platform, a heat dissipation hole is arranged on the upper surface of the annular tube, an air pipe is extended from the side of the annular tube, and the end of the air pipe is connected to the blower.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In this solution, two groups of supporting components are provided on the lead screw of the linear module four, which are respectively located on both sides of the threaded lug. When the motor drives the lead screw to rotate, the lead screw will drive the threaded lug and the base to move. No matter which side the base moves, one group of supporting components on both sides will extend and the other group will contract. Moreover, when extending or contracting, several slides in the supporting components are evenly distributed. Therefore, no matter which side the base moves and how much the movement distance is, the two parts of the lead screw located on both sides of the base are supported by several evenly distributed slides. Therefore, the shaking problem caused by the long lead screw can be effectively solved. In addition, the extension or contraction of the supporting component changes in real time with the movement of the base, that is, there is a follow-up effect, which does not affect the movement of the base, thereby making the movement accuracy of the silicon wafer more precise.

[0017] 2. After completing the photolithography of a silicon wafer, the cross slide mechanism needs to return to its original position to receive the next silicon wafer. During this process, the output mechanism pulls the silicon wafer that has completed the photolithography outward. In this way, after the cross slide mechanism returns to its original position, it can immediately receive the next silicon wafer without waiting, thereby improving the photolithography efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 Schematic diagram of the silicon wafer transmission system Figure 1 ;

[0020] Figure 3 Schematic diagram of the structure of the silicon wafer transmission system Figure 2 ;

[0021] Figure 4 It is a schematic diagram of the base, the supporting platform and the output mechanism;

[0022] Figure 5 It is a schematic diagram of the base and the supporting platform;

[0023] Figure 6 The interior of the support platform Figure 1 ;

[0024] Figure 7 The interior of the support platform Figure 2 ;

[0025] Figure 8 is a schematic diagram of a receiving assembly and a ring tube;

[0026] Fig. 9 An exploded view of the receiving component;

[0027] Fig.10 is a schematic diagram of the output mechanism;

[0028] Fig.11 It is a schematic diagram of the linear module 4 and the supporting platform;

[0029] Fig.12 It is a schematic diagram of the screw rod, guide rail and supporting assembly.

[0030] The reference numerals in the accompanying drawings are:

[0031] 100, working platform; 200, cross slide mechanism; 201, base; 2011, threaded lug; 202, support platform; 203, linear module one; 204, linear module two; 205, pressure block; 206, inner bracket; 207, spring; 208, fixed shaft; 2081, linkage hole; 209, adsorption head; 2091, adsorption hole; 2092, sleeve hole; 2093, convex pin; 210, ring tube; 211, air pipe; 212, lead screw; 213, motor; 214, guide rail; 215, support assembly; 2151, slide seat; 2152, connecting rod; 300, output mechanism; 301, linear module three; 302, connecting bracket; 303, bracket; 304, conveyor belt. DETAILED DESCRIPTION

[0032] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0033] In the attached drawings of this scheme, a refers to the silicon wafer to be photolithographically processed.

[0034] Reference Figure 1-Figure 12 A direct writing lithography machine for producing small-size semiconductor chips includes a silicon wafer transmission system, which includes a working platform 100, a cross slide mechanism 200 and an output mechanism 300. The cross slide mechanism 200 is used to receive and support the silicon wafer to be photolithographically processed, and to pull the silicon wafer to move in a plane coordinate system, so as to achieve alignment between the silicon wafer and the exposure system of the lithography machine and to pull the silicon wafer to move in the lithography machine. After the lithography of a silicon wafer is completed, the cross slide mechanism 200 needs to return to its original position to receive the next silicon wafer. During this process, the output mechanism 300 pulls the silicon wafer that has completed the lithography to output it outward. In this way, after the cross slide mechanism 200 returns to its original position, it can immediately receive the next silicon wafer without waiting, thereby improving the lithography efficiency.

[0035] Cross slide mechanism 200:

[0036] Reference Figure 2-Figure 5 , Fig.11 and Fig.12 The cross slide mechanism 200 includes a guide rail 214 and a linear module 4 located below the working platform 100. A base 201 is slidably installed on the guide rail 214. The base 201 is driven by the linear module 4 to move on the guide rail 214. A support platform 202 is slidably installed on the base 201 in a direction perpendicular to the guide rail 214. The support platform 202 is driven to move by a linear module 203 set on the base 201. Further, the support platform 202 includes a lower section slidably connected to the base 201, an upper section located above the working platform 100, and a side section for connecting the lower section and the upper section. In this way, the support platform 202 is U-shaped as a whole. Figure 2 and Figure 3 , so that when the cross slide mechanism 200 pulls the silicon wafer to move, the upper surface of the working platform 100 remains flat.

[0037] It should be noted that the linear modules mentioned in this solution are all existing screw linear motion technologies and will not be elaborated on. In addition, linear module four drives the base 201 to move a longer distance, so linear module four has a screw shake problem. Linear module one 203 drives the support platform 202 to move a shorter distance, so there is no screw shake problem.

[0038] Reference Fig.11 and Fig.12 The linear module four includes a lower bracket, on which a screw rod 212 parallel to the guide rail 214 and a motor 213 for driving the screw rod 212 to rotate are installed. A threaded lug 2011 is provided at the bottom of the base 201. The threaded lug 2011 is threadedly connected to the screw rod 212. The rotation of the screw rod 212 can pull the threaded lug 2011 and the base 201 to move.

[0039] A supporting assembly 215 is disposed on the screw rod 212 . There are two groups of supporting assemblies 215 , which are respectively located on two sides of the threaded lug 2011 .

[0040] The supporting assembly 215 includes a slide seat 2151 slidably connected to the guide rail 214 . A slide hole is provided through the slide seat 2151 . The diameter of the slide hole is equal to the outer diameter of the screw rod 212 . The slide seat 2151 is slidably connected to the screw rod 212 through the slide hole. Therefore, the screw rod 212 can be supported by the slide seat 2151 .

[0041] A plurality of slide seats 2151 are arranged in an array along the extension direction of the guide rail 214 , and the two slide seats 2151 located at the head and tail of the array direction are fixedly connected to the lower bracket and the threaded lug 2011 respectively.

[0042] The two adjacent slides 2151 are connected by a connecting component. Furthermore, the connecting component includes two connecting rods 2152 arranged in a cross pattern. The two connecting rods 2152 are hinged and the hinge is located at the middle position of the connecting rods 2152. The corresponding ends of the connecting rods 2152 in the two adjacent groups of connecting components are also hinged, so as to form a telescopic structure that can be extended or contracted. When the motor 213 drives the screw rod 212 to rotate, the screw rod 212 will drive the threaded lug 2011 and the base 201 to move. No matter which side the base 201 moves, the supporting components 2011 on both sides thereof are 15, one group extends and the other group contracts, and during the extension and contraction, the plurality of slides 2151 in the supporting assembly 215 are equidistantly distributed. Therefore, no matter which side the base 201 moves to or how far the movement is, the two parts of the screw rod 212 located on both sides of the base 201 are supported by the plurality of equidistantly distributed slides 2151. Therefore, the shaking problem caused by the long screw rod 212 can be effectively solved. In addition, the extension or contraction of the supporting assembly 215 changes in real time with the movement of the base 201, that is, there is a follow-up effect and does not affect the movement of the base 201.

[0043] Chip support and output:

[0044] Reference Figure 5-Figure 9 The upper section of the support platform 202 is hollow inside, and an avoidance hole is opened on the upper end surface of the upper section. The silicon wafer is moved by the existing robotic arm technology so that it is located in the avoidance hole and placed on the receiving component.

[0045] A receiving assembly for placing silicon wafers is arranged in the supporting platform 202. Furthermore, the receiving assembly includes receiving parts. The receiving parts are arranged in a plurality of groups in an array along the circumferential direction of the avoidance holes. Four groups are shown in the attached figure of this scheme.

[0046] The receiving component includes a horizontally arranged adsorption head 209 and a fixed shaft 208 vertically arranged in the upper section. A sleeve hole 2092 is penetrated through the adsorption head 209, and the adsorption head 209 is movably sleeved on the outside of the fixed shaft 208 through the sleeve hole 2092.

[0047] The outer cylindrical surface of the fixed shaft 208 is provided with a connecting hole 2081, which includes an upper vertical section, a lower vertical section and an arc section for connecting the upper vertical section and the lower vertical section. The upper vertical section does not overlap with the lower vertical section. A convex pin 2093 extends from the hole wall of the sleeve hole 2092. Initially, the end of the convex pin 2093 slides in the upper vertical section of the connecting hole 2081, and the adsorption head 209 is distributed along the radial direction of the avoidance hole.

[0048] An adsorption hole 2091 is provided on the upper end face of the adsorption head 209, and a nozzle is provided on the side of the adsorption head 209. The nozzle and the adsorption hole 2091 are connected via a connecting channel, and the end of the nozzle is connected to the negative pressure pump via a hose. When the silicon wafer is placed on the adsorption head 209 of multiple receiving components, the negative pressure pump is started to firmly adsorb the silicon wafer through negative pressure. It should be noted that the hole depth of the avoidance hole is small, which is smaller than the thickness of the silicon wafer. Therefore, the upper surface of the silicon wafer after adsorption is located above the upper section of the support table 202, and will not affect the subsequent photolithography process of the silicon wafer.

[0049] An inner bracket 206 is also slidably installed in the upper section along the vertical direction. The inner bracket 206 is movably connected to the adsorption head 209. When the inner bracket 206 moves along the vertical direction, it can move with the adsorption head 209. In addition, the adsorption head 209 can rotate around the fixed axis 208. For example, the inner bracket 206 and the adsorption head 209 are connected by a bearing.

[0050] A spring 207 is arranged below the inner bracket 206 , and an inclined plane 1 is arranged on the inner bracket 206 , and the distance between the inclined plane 1 and the axis center line of the avoidance hole decreases from bottom to top.

[0051] The upper section is provided with a pressing block 205 and a linear module 204 for driving the pressing block 205 to move along the radial direction of the avoidance hole. The pressing block 205 is provided with a second inclined plane, and the first inclined plane is in contact with the second inclined plane. When the pressing block 205 is driven to approach the avoidance hole by the linear module 204, the cooperation between the first inclined plane and the second inclined plane will push the inner bracket 206 downward, and the inner bracket 206 moves downward with the adsorption head 209, and the linkage hole 2081 and the convex pin 2093 are connected. With the cooperation of , the adsorption head 209 first moves vertically downward, then deflects while moving downward, and finally moves vertically downward. In the process of moving downward and deflecting, the adsorption head 209 will gradually deviate from the silicon wafer, thereby canceling the support for the silicon wafer, and the silicone will fall under the action of gravity; conversely, when the linear module 204 drives the pressure block 205 away from the avoidance hole, the spring 207 releases the elastic force, causing the inner bracket 206 to move upward, thereby resetting the adsorption head 209.

[0052] Reference Fig.10 The interior of the working platform 100 is hollow, an output hole is provided on the upper surface of the working platform 100, and a blanking hole coaxial with the avoidance hole is provided on the lower surface of the upper section of the supporting platform 202. Initially, the blanking hole is coaxial with the output hole.

[0053] The output mechanism 300 is disposed inside the working platform 100 .

[0054] The output mechanism 300 includes a connecting bracket 302 and a linear module 301 for driving the connecting bracket 302 to move in a vertical direction. A bracket 303 is provided at the free end of the connecting bracket 302. Initially, the bracket 303 is close to the output hole. In addition, the outer diameter of the bracket 303 is smaller than the outer diameter of the silicon wafer. A conveyor belt 304 is installed on each side of the bracket 303.

[0055] The chip support and output process is specifically as follows:

[0056] The silicon wafer is placed on a plurality of adsorption heads 209 by using existing robotic arm technology, and the silicon wafer is firmly adsorbed and fixed by negative pressure adsorption. Then, the linear module 1 203 and the linear module 4 cooperate to pull the support table 202 to move in the plane coordinate system, so that the silicon wafer and the exposure system of the photolithography machine are aligned and the silicon wafer is pulled to move in the photolithography machine.

[0057] After the photolithography is finished, the support platform 202 is pulled back to the initial position through the cooperation of the linear module 1 203 and the linear module 4. During the return process, the linear module 204 drives the pressing block 205 close to the avoidance hole. The cooperation of the inclined plane 1 and the inclined plane 2 will push the inner bracket 206 downward, and the inner bracket 206 moves down with the adsorption head 209. Under the cooperation of the linkage hole 2081 and the convex pin 2093, the adsorption head 209 first moves vertically downward, and then deflects while moving downward. When the convex pin 2093 is about to approach the bottom of the arc section of the linkage hole 2081, the linear module 204 is suspended. After the support platform 202 returns to the initial position, the linear module 204 continues to operate, so that the adsorption head 209 withdraws its support for the silicon wafer, and the silicon wafer falls onto the bracket 303 through the blanking hole and the output hole.

[0058] Then, the second linear module 204 drives the pressing block 205 away from the avoidance hole, and the spring 207 releases the elastic force to move the inner bracket 206 upward, thereby resetting the adsorption head 209. It should be noted that during the resetting process, due to the cooperation between the convex pin 2093 and the linkage hole 2081, the adsorption head 209 is deflected in the opposite direction while moving upward, and the action connection is smooth and there is no delay. Therefore, the adsorption head 209 can be reset in a short time. At the same time, the next silicon wafer is pulled toward the supporting table 202 through the existing mechanical arm technology, that is, the output of the silicon wafer that has completed the photolithography will not affect the placement of the next silicon wafer, and the photolithography process can be carried out continuously without interruption, and the efficiency is higher.

[0059] At the same time, the linear module 301 drives the bracket 303 to move downward, so that the silicon wafer falls onto the two conveyor belts 304, and the silicon wafer is pulled out by the conveyor belts 304.

[0060] In the preferred embodiment, heat is generated during silicon wafer photolithography. Figure 7 and Figure 8 An annular tube 210 coaxial with the avoidance hole is arranged inside the upper section of the support platform 202, and a heat dissipation hole is arranged on the upper surface of the annular tube 210. An air pipe 211 extends from the side of the annular tube 210. The end of the air pipe 211 is connected to the blower through a hose. During photolithography, the wind force generated by the operation of the blower flows upward through the heat dissipation hole to dissipate heat to the silicon wafer.

[0061] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A direct writing lithography machine for producing small-size semiconductor chips, comprising a silicon wafer transmission system, the silicon wafer transmission system comprising a cross slide mechanism (200) and an output mechanism (300), characterized in that: The cross slide mechanism (200) comprises a guide rail (214) and a linear module four, a base (201) is slidably mounted on the guide rail (214), the linear module four comprises a lower bracket, a screw rod (212) parallel to the guide rail (214) and a motor (213) for driving the screw rod (212) to rotate are mounted on the lower bracket, a threaded lug (2011) threadedly connected to the screw rod (212) is arranged at the bottom of the base (201), a supporting assembly (215) is arranged on the screw rod (212), two groups of the supporting assembly (215) are arranged and are respectively located on both sides of the threaded lug (2011), the supporting assembly (215) comprises a slide seat (2151) slidably connected to the guide rail (214), the slide seat (2151) A sliding hole is provided through the top, the diameter of the sliding hole is equal to the outer diameter of the screw rod (212), the sliding seat (2151) is slidably connected with the screw rod (212) through the sliding hole, a plurality of sliding seats (2151) are arranged in an array along the extension direction of the guide rail (214), the two sliding seats (2151) located at the head and tail of the array direction are respectively fixedly connected to the lower bracket and the threaded lug (2011), and the two adjacent sliding seats (2151) are connected by a connecting component, the connecting component includes two connecting rods (2152) arranged in a cross manner, and the two connecting rods (2152) are hinged, and the hinge is located at the middle position of the connecting rod (2152), and the corresponding ends of the connecting rods (2152) in two adjacent groups of connecting components are hingedly connected.

2. A direct writing lithography machine for producing small-size semiconductor chips according to claim 1, characterized in that: A support platform (202) is slidably mounted on the base (201) in a direction perpendicular to the guide rail (214), and the support platform (202) is driven to move by a linear module (203) arranged on the base (201).

3. A direct writing lithography machine for producing small-size semiconductor chips according to claim 2, characterized in that: It also includes a working platform (100) located above the linear module four, and the supporting platform (202) includes a lower section slidably connected to the base (201), an upper section located above the working platform (100), and a side section used to connect the lower section and the upper section.

4. A direct writing lithography machine for producing small-size semiconductor chips according to claim 2, characterized in that: The interior of the supporting platform (202) is hollow and an avoidance hole is opened on the upper end surface. A receiving assembly for placing silicon wafers is arranged inside the supporting platform (202). The receiving assembly includes receiving parts. A plurality of groups of receiving parts are arranged in an array along the circumferential direction of the avoidance hole.

5. A direct writing lithography machine for producing small-size semiconductor chips according to claim 4, characterized in that: The receiving component comprises a horizontally arranged adsorption head (209) and a fixed shaft (208) vertically arranged in the support platform (202), a sleeve hole (2092) is provided through the adsorption head (209), the adsorption head (209) is movably sleeved on the outside of the fixed shaft (208) through the sleeve hole (2092), and the outer circumferential surface of the fixed shaft (208) is provided with a linkage hole (2081), and the linkage hole (2081) comprises an upper vertical section, a lower vertical section and a connection hole for connecting the upper vertical section and the lower vertical section. The arc segment connected between them, the hole wall of the sleeve hole (2092) is extended with a convex pin (2093), initially, the end of the convex pin (2093) is slidably located in the upper vertical section of the linkage hole (2081), the adsorption head (209) is distributed along the radial direction of the avoidance hole, the upper end surface of the adsorption head (209) is provided with an adsorption hole (2091), the side of the adsorption head (209) is provided with a nozzle, the nozzle and the adsorption hole (2091) are connected through a connecting channel, and the end of the nozzle is connected to the negative pressure pump.

6. A direct writing lithography machine for producing small-size semiconductor chips according to claim 5, characterized in that: An inner bracket (206) is also installed in the support platform (202) in a sliding manner in the vertical direction. The inner bracket (206) is movably connected to the adsorption head (209). A spring (207) is arranged below the inner bracket (206). An inclined plane 1 is arranged on the inner bracket (206). The distance between the inclined plane 1 and the axis center line of the avoidance hole decreases from bottom to top. A pressure block (205) and a linear module 2 (204) for driving the pressure block (205) to move radially along the avoidance hole are installed in the support platform (202). An inclined plane 2 is arranged on the pressure block (205). The inclined plane 1 is in contact with the inclined plane 2.

7. A direct writing lithography machine for producing small-size semiconductor chips according to claim 5, characterized in that: A material drop hole coaxial with the avoidance hole is provided on the lower surface of the support platform (202); an output mechanism (300) is located below the material drop hole; the output mechanism (300) comprises a connecting bracket (302) and a linear module three (301) for driving the connecting bracket (302) to move in a vertical direction; a support seat (303) is provided at the free end of the connecting bracket (302); initially, the support seat (303) is close to the material drop hole; the outer diameter of the support seat (303) is smaller than the outer diameter of the silicon wafer; and a conveyor belt (304) is installed on each side of the support seat (303).

8. A direct writing lithography machine for producing small-size semiconductor chips according to claim 5, characterized in that: An annular tube (210) coaxial with the avoidance hole is arranged in the support platform (202); a heat dissipation hole is arranged on the upper surface of the annular tube (210); an air pipe (211) extends from the side of the annular tube (210); and the end of the air pipe (211) is connected to the blower.

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