Integrated circuit chip packaging and processing device

Abstract

The present invention belongs to the field of chip processing technology, and in particular, relates to a packaging and processing device for integrated circuit chips, including a processing table, a manipulator and a controller, wherein the controller is fixedly arranged on the end face of the processing table, the manipulator is electrically connected to the controller, a frame hole is provided on the end face of the processing table, and a heat-insulating support plate is provided inside the frame hole, a substrate mounting groove is provided on the end face of the heat-insulating support plate, and a positioning clamping mechanism is installed on the side wall of the substrate mounting groove, a heating mechanism is installed inside the heat-insulating support plate, and a heat-insulating movable plate is provided below the mounting end of the manipulator. The present invention can reduce potential damage hazards in the packaged chip, reduce the possibility of subsequent chip damage, improve the processing quality, reduce the influence of welding thermal stress, and can make the unsoldered points break and detach in advance, improve the factory quality of the chip, and at the same time, can improve the filling quality of the resin filler during chip packaging.

Description

Technical Field

[0001] The invention belongs to the technical field of chip processing, and in particular relates to a packaging and processing device for an integrated circuit chip. Background Art

[0002] Integrated circuit chip packaging and processing technology is one of the most core steps in chip production. It not only provides physical protection for the chip to protect it from the external environment, but also realizes the electrical connection and signal transmission between the chip and the external circuit.

[0003] At present, there are many packaging technologies for chips, such as DIP packaging technology, SOP packaging technology, BGA packaging technology, etc. During packaging, the bare wafer chip needs to be welded to the substrate, and the bare wafer chip is connected to the connection points or pins on the substrate by welding. For example, an integrated circuit chip packaging processing device disclosed in patent publication number CN114023661B can improve the position accuracy of bare wafer chips during welding and installation;

[0004] For integrated circuit chips, as integrated circuits tend to be more and more miniaturized, the size of the chip is also getting smaller and smaller. Therefore, when packaging integrated circuit chips, the BGA packaging method is often used. BGA packaging refers to manufacturing circuits on a substrate and installing solder balls arranged in a grid shape on the bottom of the substrate. Multiple bumps are installed on the bare wafer chip. The bare wafer chip is soldered to the substrate using the flip-chip method, which can not only increase the number of pins, but also make the connection more reliable and the signal transmission more stable. However, in BGA packaging, since the pin bumps of the bare wafer chip cannot ensure that all the bump end faces remain on the same horizontal plane during the manufacturing process, after processing, although it will not affect the normal operation of the chip, the connection strength between the bump and the substrate may be affected due to the small bumps, and the possibility of loosening and breaking becomes greater. Secondly, if the bumps of the bare wafer chip are slightly offset from the reserved mounting points on the substrate, but the bumps are not completely separated from the reserved mounting points on the substrate, the processed chip may also maintain normal operation, but since the effective contact area of ​​the connection points between the bare wafer chip and the substrate becomes smaller, the transmission channel becomes narrower, which may affect the working performance of the chip. Summary of the invention

[0005] The object of the present invention is to provide a packaging and processing device for integrated circuit chips in view of the above problems.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical solutions: an integrated circuit chip packaging and processing device, comprising a processing table, a manipulator and a controller, the controller is fixedly arranged on the end face of the processing table, the manipulator is electrically connected to the controller, a frame hole is provided on the end face of the processing table, and a heat-insulating support plate is provided inside the frame hole, a substrate mounting groove is provided on the end face of the heat-insulating support plate, and a positioning clamping mechanism is installed on the side wall of the substrate mounting groove, a heating mechanism is installed inside the heat-insulating support plate, a heat-insulating movable plate is provided below the mounting end of the manipulator, and a pressure triggering component is installed together with the heat-insulating movable plate and the mounting end of the manipulator, a vacuum adsorption groove is provided at the bottom of the heat-insulating movable plate, and a vacuum adsorption mechanism connected to the vacuum adsorption groove is provided above the heat-insulating movable plate, a heat-conducting triggering mechanism is installed inside the vacuum adsorption groove, a vibration simulation mechanism connected to the vacuum adsorption mechanism is installed together on the processing table and the heat-insulating support plate, and a vacuum injection mechanism is installed on the heat-insulating movable plate.

[0007] Preferably, the positioning and clamping mechanism comprises a micro electric push rod fixedly plugged into four side walls of the substrate mounting groove, and a positioning and clamping plate is fixedly installed at the output end of each micro electric push rod, and each micro electric push rod is electrically connected to the controller.

[0008] Preferably, the heating mechanism includes a plurality of mounting holes opened at the bottom of the mounting groove of the substrate, and an insulating heat-conducting column is fixedly installed on the inner upper side of each mounting hole, a thermal insulation base is fixedly installed on the bottom of the thermal insulation support plate, and a plurality of heating wires are fixedly installed on the end surface of the thermal insulation base, and each heating wire is arranged inside the corresponding mounting hole.

[0009] Preferably, the pressure trigger assembly includes a groove opened at the bottom of the manipulator mounting end, and a telescopic block is slidably provided inside the groove, a pressure switch electrically connected to the controller is fixedly installed at the bottom of the groove, and the moving contact of the pressure switch is in contact with the end face of the telescopic block, a fixing frame is fixedly installed at the lower end of the telescopic block, and the fixing frame is fixedly connected to the thermal insulation movable plate.

[0010] Preferably, the vacuum adsorption mechanism includes an air pump fixedly arranged on the end surface of the fixed frame, and the suction end of the air pump is fixedly connected to an air suction pipe, the air suction pipe is fixedly connected to the vacuum adsorption tank, a one-way valve is installed inside the air suction pipe, the output end of the air pump is fixedly connected to an air supply pipe, and the air pump is electrically connected to the controller.

[0011] Preferably, the thermal conductive trigger mechanism includes a plurality of insulating heat-insulating columns fixedly plugged into the bottom of the vacuum adsorption tank, and the end face of each insulating heat-insulating column is fixedly plugged with a thermistor wire, the end face of the insulating movable plate is fixedly installed with an insulating top plate, and the end face of the insulating top plate is fixedly installed with an electromagnetic switch electrically connected to each thermistor wire, and the electromagnetic switch is electrically connected to the controller.

[0012] Preferably, the vibration simulation mechanism includes a plurality of sliding rods fixedly arranged on two opposite side walls of the heat insulation support plate, the hole wall of the frame hole is provided with a plurality of sliding grooves matching the sliding rods, a plurality of springs are fixedly arranged between the heat insulation support plate and the frame hole, an air cavity is provided inside the processing table, and a plurality of exhaust holes are provided on the cavity wall of the air cavity, each of the exhaust holes is connected with the corresponding sliding groove, a flexible sealing sleeve is provided on one side of each of the exhaust holes, and each flexible sealing sleeve is arranged between the sliding rod and the sliding groove on the same side, an air inlet pipe is fixedly inserted at the end face of the air cavity, and a connecting hose is fixedly connected between the air inlet pipe and the air delivery pipe, an air outlet is provided on the side wall of the air cavity, and pulse solenoid valves electrically connected to the controller are installed inside the air outlet and the air inlet pipe.

[0013] Preferably, the vacuum injection mechanism comprises a frame plate sleeved on the outer side of the heat-insulating movable plate, a plurality of micro-electromagnetic push rods are fixedly mounted on the side wall of the heat-insulating movable plate, and the output end of each of the micro-electromagnetic push rods is fixedly mounted with a top pressure block, and the end of each top pressure block is fixedly connected to the outer side wall of the frame plate, a filler injection cavity is provided inside the frame plate, and a filler injection hose is fixedly connected to the cavity wall of the filler injection cavity, a plurality of obliquely arranged discharge holes are provided on the inner cavity wall of the filler injection cavity, and a corresponding discharge hole position is slidably provided inside the filler injection cavity A piston plate is provided, and an elastic pad is fixedly provided between the piston plate and the filler injection cavity, a sealing soft sleeve is fixedly provided between the frame plate and the heat-insulating movable plate, a cavity is provided inside the frame plate on the side opposite to the filler injection cavity, and a plurality of air extraction holes are provided on the cavity wall, a branch suction pipe is fixedly inserted into the wall of the suction pipe, and a round tube is fixedly inserted into the wall of the branch suction pipe, a fixed hose is fixedly connected to the round tube and the cavity, a normally open solenoid valve is provided inside the branch suction pipe, a normally closed solenoid valve is installed inside the round tube, and both the normally open solenoid valve and the normally closed solenoid valve are electrically connected to the controller.

[0014] Compared with the existing technology, the advantages of an integrated circuit chip packaging and processing device are:

[0015] 1. The substrate can be installed through the cooperation of the processing table, manipulator, controller, frame hole, thermal insulation support plate, substrate installation groove, and positioning clamping mechanism, and the bare wafer chip can be installed on the substrate through the thermal insulation movable plate, vacuum adsorption groove and vacuum adsorption mechanism. The quota and the heating mechanism, pressure trigger component and thermal conduction trigger mechanism can be based on the heat transfer performance of the welding bumps of the bare wafer chip. Before the bare wafer chip is welded and fixed, the chip with too large or too small bumps can be removed in advance, and the welding and installation of the offset bare wafer chip can be stopped, so as to reduce the potential damage hidden dangers in the packaged chip, reduce the possibility of subsequent chip damage, and improve the processing quality. At the same time, the substrate can be preheated by preheating before welding to prevent the welding thermal stress from causing slight deformation of the substrate and affecting the packaging quality.

[0016] 2. Through the vibration simulation mechanism, after the bare wafer chip is welded and fixed, the vacuum adsorption gas source can be used to vibrate the chip, and the vibration force can be used to make the points that may not be welded firmly break and loosen in advance, so that the chips with hidden dangers can be removed in the subsequent packaging and testing work, and the quality of the chips before leaving the factory can be further improved.

[0017] 3. Through the vacuum injection mechanism, after the bare wafer chip is welded and fixed, the air in the gap between the bare wafer chip and the substrate can be extracted in advance by vacuum adsorption, and resin filler can be injected. The resin filler can improve the connection stability between the bare wafer chip and the substrate, and the sealing injection method can avoid filler overflow as much as possible, and avoid bubbles in the filler as much as possible, thereby improving the filling adequacy of the resin filler and improving the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an integrated circuit chip packaging and processing device provided by the present invention;

[0019] Figure 2 It is a schematic diagram of the internal structure of a heat-insulating support plate of an integrated circuit chip packaging and processing device provided by the present invention;

[0020] Figure 3 It is a schematic diagram of the internal structure of a heat-insulating movable plate of an integrated circuit chip packaging and processing device provided by the present invention;

[0021] Figure 4 The present invention provides an integrated circuit chip packaging and processing device Figure 3 A magnified view of the structure of part A;

[0022] Figure 5 It is a schematic diagram of the connection structure between a processing table and a heat-insulating support plate of an integrated circuit chip packaging processing device provided by the present invention;

[0023] Figure 6 The present invention provides an integrated circuit chip packaging and processing device Figure 3 A magnified view of the structure of part B;

[0024] Figure 7 The present invention is a schematic diagram of the internal top view structure of a frame plate of an integrated circuit chip packaging and processing device provided by the present invention.

[0025] In the figure: 1 processing table, 2 manipulator, 3 controller, 4 frame hole, 5 heat insulation support plate, 6 substrate mounting groove, 7 positioning clamping mechanism, 71 micro electric push rod, 72 positioning clamping plate, 8 heating mechanism, 81 mounting hole, 82 insulating heat conductive column, 83 insulating base, 84 electric heating wire, 9 insulating movable plate, 10 pressure trigger component, 101 groove, 102 telescopic block, 103 pressure switch, 104 fixing frame, 11 vacuum adsorption groove, 12 vacuum adsorption mechanism, 121 air pump, 122 suction pipe, 123 one-way valve, 124 air delivery pipe, 13 heat conductive trigger mechanism, 131 insulating heat insulating column, 132 thermistor wire, 133 insulation Top plate, 134 electromagnetic switch, 14 vibration simulation mechanism, 141 sliding rod, 142 sliding groove, 143 spring, 144 air cavity, 145 exhaust hole, 146 flexible sealing sleeve, 147 air inlet pipe, 148 connecting hose, 149 pulse solenoid valve, 15 vacuum injection mechanism, 151 frame plate, 152 micro electromagnetic push rod, 153 top pressure block, 154 filler injection cavity, 155 filler injection hose, 156 discharge hole, 157 piston plate, 158 elastic pad, 159 sealing soft sleeve, 16 cavity, 17 air extraction hole, 18 suction pipe, 19 round tube, 20 fixed hose, 21 normally open solenoid valve, 22 normally closed solenoid valve, 23 exhaust hole. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] like Figure 1-Figure 7As shown, a packaging and processing device for integrated circuit chips includes a processing table 1, a manipulator 2 and a controller 3. The processing table 1 is also equipped with a mechanism for attaching a heat sink to the surface of a bare wafer chip, and a cover plate mounting mechanism for covering the cover plate on the outside of the bare wafer chip, which is used for chip packaging and processing. This is an existing mature technology, so it is not described here. The controller 3 is fixedly arranged on the end face of the processing table 1, the manipulator 2 is electrically connected to the controller 3, and a frame hole 4 is opened on the end face of the processing table 1, and a heat insulation bearing is arranged inside the frame hole 4. The support plate 5 and the end surface of the heat-insulating support plate 5 are provided with a substrate mounting groove 6, and the side wall of the substrate mounting groove 6 is installed with a positioning clamping mechanism 7, the positioning clamping mechanism 7 includes a micro-electric push rod 71 fixedly inserted into the four side walls of the substrate mounting groove 6, and the output end of each micro-electric push rod 71 is fixedly installed with a positioning clamping plate 72, each micro-electric push rod 71 is electrically connected to the controller 3, and the micro-electric push rod 71 can drive the positioning clamping plate 72 to push and clamp the substrate, so that the substrate can be fixed in a specific position.

[0028] A heating mechanism 8 is installed inside the thermal insulation support plate 5, and the heating mechanism 8 includes a plurality of mounting holes 81 opened at the bottom of the substrate mounting groove 6, and an insulating heat-conducting column 82 is fixedly installed on the upper side of the inner part of each mounting hole 81, and a thermal insulation base 83 is fixedly installed on the bottom of the thermal insulation support plate 5, and a plurality of heating wires 84 are fixedly installed on the end surface of the thermal insulation base 83, and each heating wire 84 is arranged inside the corresponding mounting hole 81. When the heating wire 84 is working, the heat generated by it can be transferred to the substrate through the insulating heat-conducting column 82.

[0029] An insulating movable plate 9 is provided below the mounting end of the manipulator 2, and a pressure trigger assembly 10 is installed together with the insulating movable plate 9 and the mounting end of the manipulator 2. The pressure trigger assembly 10 includes a groove 101 opened at the bottom of the mounting end of the manipulator 2, and a telescopic block 102 is slidably provided inside the groove 101. A pressure switch 103 electrically connected to the controller 3 is fixedly installed at the bottom of the groove 101, and the moving contact of the pressure switch 103 contacts the end face of the telescopic block 102. A fixing frame 104 is fixedly installed at the lower end of the telescopic block 102, and the fixing frame 104 is fixedly connected to the insulating movable plate 9. After the pressure switch 103 is closed, a closing electrical signal can be given to the controller 3.

[0030] A vacuum adsorption groove 11 is provided at the bottom of the thermal insulation movable plate 9, and a vacuum adsorption mechanism 12 connected to the vacuum adsorption groove 11 is provided above the thermal insulation movable plate 9. The vacuum adsorption mechanism 12 includes an air pump 121 fixedly arranged on the end face of the fixed frame 104, and the suction end of the air pump 121 is fixedly connected with an air suction pipe 122, the air suction pipe 122 is fixedly connected with the vacuum adsorption groove 11, a one-way valve 123 is installed inside the air suction pipe 122, and the output end of the air pump 121 is fixedly connected with an air supply pipe 124. The air pump 121 is electrically connected to the controller 3, and an air supply pipe is inserted on the other side of the vacuum adsorption groove 11, and an electric-controlled valve electrically connected to the controller 3 is installed inside the air supply pipe for replenishing air into the vacuum adsorption groove 11 to facilitate the separation of the bare wafer chip from the thermal insulation movable plate 9.

[0031] A heat-conducting trigger mechanism 13 is installed inside the vacuum adsorption groove 11. The heat-conducting trigger mechanism 13 includes a plurality of insulating heat-insulating columns 131 fixedly plugged into the bottom of the vacuum adsorption groove 11, and the end face of each insulating heat-insulating column 131 is fixedly plugged with a thermistor wire 132. The end face of the insulating movable plate 9 is fixedly installed with an insulating top plate 133, and the end face of the insulating top plate 133 is fixedly installed with an electromagnetic switch 134 electrically connected to each thermistor wire 132. The electromagnetic switch 134 is electrically connected to the controller 3. When the temperature of the thermistor wire 132 increases, its own resistance decreases.

[0032] The processing table 1 and the heat-insulating support plate 5 are jointly equipped with a vibration simulation mechanism 14 connected to the vacuum adsorption mechanism 12. The vibration simulation mechanism 14 includes a plurality of slide bars 141 fixedly arranged on two opposite side walls of the heat-insulating support plate 5. The hole wall of the frame hole 4 is provided with a plurality of slide grooves 142 matching the slide bars 141. A plurality of springs 143 are fixedly arranged between the heat-insulating support plate 5 and the frame hole 4. An air cavity 144 is provided inside the processing table 1, and a plurality of exhaust holes 145 are provided on the wall of the air cavity 144. Each exhaust hole 145 is connected to the corresponding slide groove 142. Each exhaust hole 14 5 is provided with a flexible sealing sleeve 146 on one side, and each flexible sealing sleeve 146 is arranged between the sliding rod 141 and the sliding groove 142 on the same side, an air inlet pipe 147 is fixedly inserted at the end face of the air cavity 144, and a connecting hose 148 is fixedly connected between the air inlet pipe 147 and the air delivery pipe 124, an air outlet hole 23 is opened on the side wall of the air cavity 144, and a pulse solenoid valve 149 electrically connected to the controller 3 is installed inside the air outlet hole 23 and the air inlet pipe 147, and the pulse solenoid valve 149 can be intermittently powered on to open and close, which is an existing mature technology, so it will not be described here.

[0033] The heat-insulating movable plate 9 is provided with a vacuum injection mechanism 15, which includes a frame plate 151 sleeved on the outer side of the heat-insulating movable plate 9, a plurality of micro electromagnetic push rods 152 are fixedly installed on the side wall of the heat-insulating movable plate 9, and the output end of each micro electromagnetic push rod 152 is fixedly installed with a top pressure block 153, and the end of each top pressure block 153 is fixedly connected to the outer side wall of the frame plate 151, a filler injection cavity 154 is provided inside the frame plate 151, and the cavity wall of the filler injection cavity 154 is fixedly connected with a filler injection hose 155, a plurality of obliquely arranged discharge holes 156 are provided on the inner cavity wall of the filler injection cavity 154, a piston plate 157 corresponding to the position of the discharge hole 156 is slidably provided inside the filler injection cavity 154, and the piston plate 157 is connected to the filler injection cavity 154. An elastic pad 158 is fixedly provided between the frame plate 151 and the heat-insulating movable plate 9, a sealing soft sleeve 159 is fixedly provided between the frame plate 151 and the insulating movable plate 9, a cavity 16 is opened inside the frame plate 151 on the side opposite to the filler injection cavity 154, and a plurality of exhaust holes 17 are opened on the wall of the cavity 16, a branch suction pipe 18 is fixedly inserted into the wall of the suction pipe 122, and a round tube 19 is fixedly inserted into the wall of the branch suction pipe 18, the round tube 19 and the cavity 16 are fixedly connected with a fixed hose 20, a normally open solenoid valve 21 is provided inside the branch suction pipe 18, a normally closed solenoid valve 22 is installed inside the round tube 19, both the normally open solenoid valve 21 and the normally closed solenoid valve 22 are electrically connected to the controller 3, the filler injection hose 155 is connected to the output end of an external resin filler supply device, and the external resin filler supply device is controlled by the controller 3.

[0034] The operating principle of the present invention is described as follows: the substrate is placed in the substrate mounting groove 6, and then the controller 3 is started to start the chip packaging process;

[0035] After the controller 3 is started, it will immediately control the four micro electric push rods 71 ​​to work for a timed 2 seconds. The micro electric push rods 71 ​​can drive the positioning clamping plate 72 to move, thereby pushing the substrate to move and fix the substrate in a specific position. Then the controller 3 will start the manipulator 2, and the manipulator 2 will move to the position of the bare wafer chip according to the preset program, and make the insulation movable plate 9 contact with the bare wafer chip. Then, the controller 3 controls the air pump 121 and the normally open solenoid valve 21 inside the suction pipe 18 to work for a timed 3 seconds. At this time, the air pump 121 can vacuum the wafer through the suction pipe 122. The air inside the adsorption groove 11 is extracted, so that the inside and outside of the vacuum adsorption groove 11 form an internal and external pressure difference. Under the action of the internal and external pressure difference, the bare wafer chip is stably adsorbed on the heat-insulating movable plate 9. Then, the manipulator 2 drives the bare wafer chip to move to the end surface of the substrate according to the preset program. When the bare wafer chip contacts the substrate, due to the obstruction of the substrate, the heat-insulating movable plate 9 will press and close the moving contact of the pressure switch 103 through the telescopic block 102. At this time, the controller 3 will receive the closing electrical signal of the pressure switch 103. Then, the controller 3 controls the manipulator 2 to stop working;

[0036] When the controller 3 receives the closing electrical signal of the pressure switch 103, the controller 3 will immediately control each heating wire 84 to work for 1 minute. At this time, the heat generated by the heating wire 84 will be transferred to each thermistor wire 132 through the soldering bumps on the substrate and the bare wafer chip. If the soldering bumps of the bare wafer chip are aligned with the positions of the connection points on the substrate, and the soldering bumps on the bare wafer chip maintain a good coplanar state, the heat generated by the heating wire 84 can be transferred to each thermistor wire 132 through the soldering bumps in time. If the bare wafer chip is displaced when being adsorbed by the heat-insulating movable plate 9, or the coplanarity of the soldering bumps on the bare wafer chip is not good, the positions of the soldering bumps and the heating wires 84 will be misaligned. At this time, less heat can be transferred to the thermistor wire 132 through the soldering bumps within the same time. After the timing operation of the heating wire 84 is completed, the controller 3 will supply power to the connection circuit between the electromagnetic switch 134 and the thermistor wire 132 for 2 seconds. When the soldering bumps of the bare wafer chip are aligned with the substrate and the coplanarity is good, Since the heat transferred to each thermistor wire 132 is large enough, the resistance of each thermistor wire 132 decreases greatly. At this time, the current passing into the electromagnetic switch 134 is large, so the electromagnetic switch 134 will be immediately magnetically closed. Therefore, when the controller 3 supplies power to the connection circuit between the electromagnetic switch 134 and the thermistor wire 132, the controller 3 can receive the closing electrical signal of the electromagnetic switch 134. On the contrary, if the soldering bumps of the bare wafer chip are not aligned with the soldering points of the substrate, or the coplanarity is not good, the heat transferred to the thermistor wire 132 Insufficient, so the resistance of each thermistor wire 132 decreases less, and the current passing into the electromagnetic switch 134 is small at this time, so the electromagnetic switch 134 cannot be magnetically closed, so the controller 3 cannot receive the closing electrical signal of the electromagnetic switch 134. If the controller 3 does not receive the closing electrical signal of the electromagnetic switch 134, the controller 3 will control the robot 2 to work according to the preset program, so that the robot 2 moves the bare wafer chip to the designated area (such as the defective area) and puts it down. Then, the controller 3 controls the robot 2 to re-execute the packaging work of a new bare wafer chip;

[0037] If the controller 3 receives the closing electrical signal of the electromagnetic switch 134, the controller 3 controls each heating wire 84 to work again, the temperature of the heating wire 84 continues to rise, and after the heat is transferred to each welding bump on the bare wafer chip, each welding bump melts and is welded together with the substrate. After the heating wire 84 works for 20 seconds, the controller 3 controls the heating wire 84 to stop working, and the controller 3 controls the manipulator 2 to separate from the bare wafer chip. After waiting for 10 seconds, the controller 3 controls the air pump 121 to work again, and at the same time controls the air inlet pipe 147 and the pulse solenoid valve 149 inside the air outlet 23 to work alternately. At this time, the suction end of the air pump 121 inhales external air through the suction pipe 122 and the branch suction pipe 18, and delivers air to the inside of the air cavity 144 through the air supply pipe 124, the connecting hose 148 and the air inlet pipe 147. When the pulse solenoid valve 149 inside the air inlet pipe 147 works, air enters the inside of the air cavity 144. At this time, the air pressure inside the air cavity 144 increases, so that Under the action of the flexible sealing sleeve 146 on the same side, the sliding rod 141 on the same side is pushed to move outward, thereby pushing the heat insulation support plate 5 to move. When the pulse electromagnetic valve 149 inside the air outlet 23 works, the excess air inside the air cavity 144 will be discharged through the air outlet 23. Through the alternating work of the pulse electromagnetic valve 149 inside the air outlet 23 and the air inlet pipe 147, and under the action of the spring 143, the heat insulation support plate 5 can be reciprocated, thereby generating high-frequency vibration. Under the action of vibration, if the welding point is not firm, it will break or detach, thereby exposing the welding point that may not be firm in advance, so as to timely test the possible hidden defects in the subsequent packaging test, and improve the factory quality of the chip. After the controller 3 controls the air pump 121 to work again for 1 minute, the controller 3 controls the air pump 121 and the pulse electromagnetic valve 149 to stop working. Then, the controller 3 controls the installation end of the manipulator 2 to move back again to abut against the top of the bare wafer chip.

[0038] After the mounting end of the manipulator 2 contacts the bare wafer chip again, the controller 3 controls each micro electromagnetic push rod 152 to work. At this time, each micro electromagnetic push rod 152 can drive the frame plate 151 to move down and abut against the substrate through the top pressure block 153. Then, the controller 3 air pump 121 works again and controls the normally closed solenoid valve 22 and the normally open solenoid valve 21 to work regularly at the same time. At this time, the air pump 121 can suck out the air inside the cavity 16 through the suction pipe 122, the branch suction pipe 18, the round pipe 19 and the fixed hose 20, so that the inside of the frame plate 151 can be kept in a high vacuum state through the suction hole 17. Then, the controller 3 controls the air pump 121, the normally open solenoid valve 21 and the normally closed solenoid valve 22. Stop working, and then control the external supply device for supplying resin filler to work regularly. At this time, the external supply device can supply resin filler to the filler injection cavity 154 through the filler injection hose 155. Under the action of pressure, the piston plate 157 is pushed down, and then the resin filler is discharged into the gap between the bare wafer chip and the substrate through each discharge hole 156. Since the air is extracted in advance, it is not easy to generate bubbles inside the resin filler, which improves the supporting and protective effect of the resin filler on the bare wafer chip. After the supply device finishes working regularly, the micro electromagnetic push rod 152 delays 20 seconds to cut off the power. At this time, the frame plate 151 moves back and resets. At this point, the welding and filler filling packaging work of a single chip is completed;

[0039] In order to reduce the impact of external ambient temperature, this device needs to work in a temperature-controlled room, where the temperature is usually maintained at 25°C ± 0.1°C.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit chip packaging processing device, comprising a processing table (1), a robot (2) and a controller (3), characterized in that: The controller (3) is fixedly arranged on the end surface of the processing table (1), the manipulator (2) is electrically connected to the controller (3), the end surface of the processing table (1) is provided with a frame hole (4), and a heat insulation support plate (5) is arranged inside the frame hole (4), the end surface of the heat insulation support plate (5) is provided with a substrate installation groove (6), and a positioning clamping mechanism (7) is installed on the side wall of the substrate installation groove (6), a heating mechanism (8) is installed inside the heat insulation support plate (5), and a heat insulation movable plate (9) is arranged below the installation end of the manipulator (2), and the heat insulation movable plate (9) is connected to the heat insulation movable plate (8). A pressure trigger assembly (10) is installed at the mounting end of the manipulator (2); a vacuum adsorption groove (11) is provided at the bottom of the heat-insulating movable plate (9); a vacuum adsorption mechanism (12) connected to the vacuum adsorption groove (11) is provided above the heat-insulating movable plate (9); a heat-conducting trigger mechanism (13) is installed inside the vacuum adsorption groove (11); a vibration simulation mechanism (14) connected to the vacuum adsorption mechanism (12) is installed on the processing table (1) and the heat-insulating support plate (5); and a vacuum injection mechanism (15) is installed on the heat-insulating movable plate (9).

2. The integrated circuit chip packaging and processing device according to claim 1, characterized in that: The positioning clamping mechanism (7) comprises a micro electric push rod (71) fixedly plugged into four side walls of the base plate mounting groove (6), and a positioning clamping plate (72) is fixedly mounted on the output end of each micro electric push rod (71), and each micro electric push rod (71) is electrically connected to the controller (3).

3. The integrated circuit chip packaging and processing device according to claim 1, characterized in that: The heating mechanism (8) comprises a plurality of mounting holes (81) formed at the bottom of the base plate mounting groove (6), and an insulating heat-conducting column (82) is fixedly mounted on the upper side of each mounting hole (81); a heat-insulating base (83) is fixedly mounted on the bottom of the heat-insulating support plate (5), and a plurality of electric heating wires (84) are fixedly mounted on the end surface of the heat-insulating base (83), and each electric heating wire (84) is arranged inside a corresponding mounting hole (81).

4. The integrated circuit chip packaging and processing device according to claim 1, characterized in that: The pressure trigger assembly (10) comprises a groove (101) formed at the bottom of the mounting end of the manipulator (2), and a telescopic block (102) is slidably disposed inside the groove (101), a pressure switch (103) electrically connected to the controller (3) is fixedly mounted at the bottom of the groove (101), and a moving contact of the pressure switch (103) contacts an end surface of the telescopic block (102), a fixing frame (104) is fixedly mounted at the lower end of the telescopic block (102), and the fixing frame (104) is fixedly connected to the heat-insulating movable plate (9).

5. The integrated circuit chip packaging and processing device according to claim 4, characterized in that: The vacuum adsorption mechanism (12) comprises an air pump (121) fixedly arranged on the end surface of the fixing frame (104), and the suction end of the air pump (121) is fixedly connected to an air suction pipe (122), the air suction pipe (122) is fixedly connected to the vacuum adsorption tank (11), a one-way valve (123) is installed inside the air suction pipe (122), the output end of the air pump (121) is fixedly connected to an air delivery pipe (124), and the air pump (121) is electrically connected to the controller (3).

6. The integrated circuit chip packaging and processing device according to claim 2, characterized in that: The heat-conducting trigger mechanism (13) comprises a plurality of insulating heat-insulating columns (131) fixedly plugged into the bottom of the vacuum adsorption groove (11), and the end surface of each insulating heat-insulating column (131) is fixedly plugged with a thermistor wire (132), the end surface of the insulating movable plate (9) is fixedly mounted with a thermal insulation top plate (133), and the end surface of the thermal insulation top plate (133) is fixedly mounted with an electromagnetic switch (134) electrically connected to each thermistor wire (132), and the electromagnetic switch (134) is electrically connected to the controller (3).

7. The integrated circuit chip packaging and processing device according to claim 5, characterized in that: The vibration simulation mechanism (14) comprises a plurality of slide bars (141) fixedly arranged on two opposite side walls of the heat insulation support plate (5); a plurality of slide grooves (142) matching the slide bars (141) are provided on the hole wall of the frame hole (4); a plurality of springs (143) are fixedly arranged between the heat insulation support plate (5) and the frame hole (4); an air cavity (144) is provided inside the processing table (1); and a plurality of exhaust holes (145) are provided on the cavity wall of the air cavity (144); each exhaust hole (145) is connected to a corresponding slide groove (142); and each exhaust hole (145) is connected to a corresponding exhaust hole (142). A flexible sealing sleeve (146) is provided on one side of the hole (145), and each flexible sealing sleeve (146) is arranged between the sliding rod (141) and the sliding groove (142) on the same side. An air inlet pipe (147) is fixedly inserted into the end surface of the air cavity (144), and a connecting hose (148) is fixedly connected between the air inlet pipe (147) and the air delivery pipe (124). An air outlet hole (23) is opened on the side wall of the air cavity (144), and a pulse solenoid valve (149) electrically connected to the controller (3) is installed inside the air outlet hole (23) and the air inlet pipe (147).

8. The integrated circuit chip packaging and processing device according to claim 5, characterized in that: The vacuum injection mechanism (15) comprises a frame plate (151) sleeved on the outside of the heat-insulating movable plate (9); a plurality of micro electromagnetic push rods (152) are fixedly mounted on the side wall of the heat-insulating movable plate (9); an output end of each of the micro electromagnetic push rods (152) is fixedly mounted with a top pressure block (153); an end of each top pressure block (153) is fixedly connected to the outer wall of the frame plate (151); a filler injection cavity (154) is provided inside the frame plate (151); a cavity wall of the filler injection cavity (154) is fixedly connected to a filler injection hose (155); a plurality of obliquely arranged discharge holes (156) are provided on the inner cavity wall of the filler injection cavity (154); a piston plate (157) corresponding to the position of the discharge hole (156) is slidably arranged inside the filler injection cavity (154); and the piston plate (157) An elastic pad (158) is fixedly provided between the frame plate (151) and the filler injection cavity (154); a sealing soft sleeve (159) is fixedly provided between the frame plate (151) and the heat-insulating movable plate (9); a cavity (16) is provided inside the frame plate (151) on the side opposite to the filler injection cavity (154); and a plurality of air extraction holes (17) are provided on the cavity wall of the cavity (16); a branch suction pipe (18) is fixedly plugged into the wall of the suction pipe (122); and a round tube (19) is fixedly plugged into the wall of the branch suction pipe (18); a fixed hose (20) is fixedly connected to the round tube (19) and the cavity (16); a normally open solenoid valve (21) is provided inside the branch suction pipe (18); and a normally closed solenoid valve (22) is installed inside the round tube (19); and both the normally open solenoid valve (21) and the normally closed solenoid valve (22) are electrically connected to the controller (3).

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