Heat dissipation modules and application devices

Abstract

The present invention discloses a heat dissipation module and an application device, including a heat conduction component, a connecting pipe and a power component. The heat conduction component is provided with a liquid passage; the connecting pipe is connected to the liquid passage to cooperate to form a closed-loop medium flow path, and the medium flow path contains a metal coolant; the power component is connected to the connecting pipe and is configured to drive the metal coolant to circulate in the medium flow path; the heat conduction component includes a main body and a partition plate, and the main body is provided with a liquid passage; a plurality of partition plates are arranged side by side at intervals to separate at least part of the liquid passage to form a plurality of isolated diversion channels. The technical solution of the present invention can improve the heat dissipation effect of the heat dissipation module.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation, and in particular to a heat dissipation module and an application device using the heat dissipation module. Background Art

[0002] When the electrical components in a product or device are working, they tend to generate heat. Therefore, in order to prevent the electrical components from being damaged due to excessive heat, a heat dissipation module is usually configured to dissipate the heat. However, the heat dissipation effect of the heat dissipation module in the related art is limited when in use. Summary of the invention

[0003] The main purpose of the present invention is to provide a heat dissipation module, aiming to improve the heat dissipation effect of the heat dissipation module.

[0004] To achieve the above object, the heat dissipation module proposed by the present invention includes:

[0005] A heat-conducting component, wherein the heat-conducting component is provided with a liquid passage;

[0006] A connecting pipe, the connecting pipe is in communication with the liquid passage to cooperate with each other to form a closed-loop medium flow path, wherein the medium flow path contains metal coolant; and

[0007] a power component, the power component being connected to the connecting pipe and configured to drive the metal coolant to circulate in the medium flow path;

[0008] The heat conducting component comprises:

[0009] a main body portion, wherein the main body portion is provided with the liquid passage; and

[0010] A plurality of partition plates are arranged side by side and spaced apart to separate at least a portion of the liquid passage to form a plurality of isolated flow diversion passages.

[0011] Optionally, the metal coolant includes gallium, indium and tin.

[0012] Optionally, the percentage of gallium in the metal coolant is defined as X, the percentage of indium is defined as Y, and the percentage of tin is defined as Z, satisfying the following relationships: 0.6≤X≤0.8, 0.15≤Y≤0.25, and 0.05≤X≤0.15.

[0013] Optionally, the liquid passage comprises a main cavity and two end holes, has a first direction, and the two end holes are spaced apart along the first direction of the heat conducting component;

[0014] The main body cavity is disposed between the two end holes and communicated with the two end holes;

[0015] At least two of the partition plates are disposed in the main body cavity and are arranged side by side and spaced apart along a second direction intersecting the first direction;

[0016] One end of the connecting pipe is connected to one of the end holes, and the other end is connected to the other end hole.

[0017] Optionally, the main body cavity includes a middle cavity and two edge cavities, the two edge cavities are connected to the middle cavity; the size of the middle cavity in the third direction is larger than the size of the edge cavity in the third direction, the third direction intersects the first direction and the second direction, and at least two partition plates are arranged in the middle cavity; the liquid passage further includes two communicating holes, each communicating hole is connected to one of the end holes and the corresponding edge cavity, and the communicating hole and the corresponding end hole are located within the angle enclosed by the corresponding edge cavity and the middle cavity;

[0018] And / or, the main body comprises a first part and a second part, the first part and the second part enclose the main body cavity; the end hole is provided in the first part, and the partition plate is provided in the second part;

[0019] And / or, one end of the connecting pipe is inserted into one of the end holes, and the other end is inserted into the other end hole.

[0020] Optionally, the heat dissipation module further comprises a heat dissipation component, and the heat dissipation component comprises a contact body and heat dissipation fins;

[0021] The contact body is provided with a penetration hole, a portion of the connecting pipe is penetrated through the penetration hole, and the heat dissipation fins are arranged on the outer side of the contact body.

[0022] Optionally, the number of the penetration holes is at least two, the at least two penetration holes are arranged side by side and spaced apart, and the connecting pipes are sequentially penetrated through the at least two penetration holes;

[0023] And / or, the contact body includes two enclosing plates, the two enclosing plates enclose the through hole, and at least one of the two enclosing plates is provided with the heat dissipation fin.

[0024] Optionally, when the contact body includes an enclosing plate, at least two of the heat dissipation fins are sequentially spaced apart along the extension direction of the through hole;

[0025] The heat dissipation component further comprises a connecting plate, wherein the connecting plate and the enclosing plate are relatively spaced apart and connected to at least two of the heat dissipation fins.

[0026] Optionally, the heat dissipation module further includes a fan, and an air outlet of the fan faces the heat dissipation component.

[0027] Optionally, the heat-conducting component is provided with a mounting hole, and the mounting hole is configured to be penetrated by a fastener to connect the heat-conducting component and a heat source to be dissipated;

[0028] And / or, the power component is an electromagnetic pump.

[0029] The present invention also provides an application device, comprising the heat dissipation module as described above.

[0030] The heat dissipation module of the technical solution of the present invention uses metal coolant (i.e. liquid metal) as a cooling medium. Compared with the traditional cooling water as a cooling medium, the metal coolant has the advantages of high thermal conductivity and large specific heat capacity, and at the same time, there is no risk of volatilization failure under specific working conditions, and the heat transfer is continuous and stable. At this time, it is convenient to realize that the heat dissipation module performs efficient and stable heat dissipation on the heat source to be dissipated, which is beneficial to improve the heat dissipation effect of the heat dissipation module. Further, the heat conduction component is provided to include a main body and a partition plate, so that the liquid passage is separated by the partition plate to form a plurality of diversion channels. At this time, on the one hand, the turbulence of the metal coolant in the liquid passage can be reduced to improve the stability and smoothness of the flow of the metal coolant, which is beneficial to improve the heat dissipation effect of the heat dissipation module. On the other hand, the contact area between the metal coolant and the heat conduction component can also be increased. Then, the heat exchange effect of the two is improved, thereby improving the heat dissipation effect of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0032] Figure 1 It is a structural schematic diagram of an embodiment of a heat dissipation module of the present invention;

[0033] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the heat-conducting components and connecting pipes;

[0034] Figure 3 for Figure 2 A schematic diagram of the structure of the heat conducting component;

[0035] Figure 4 for Figure 3 A schematic diagram of an exploded structure of a heat-conducting component;

[0036] Figure 5 for Figure 4 Schematic diagram from another perspective;

[0037] Figure 6 for Figure 5 A schematic diagram of a partial structure of a heat conducting component;

[0038] Figure 7 for Figure 6 A local enlarged schematic diagram of the middle A;

[0039] Figure 8 for Figure 3 A schematic cross-sectional view of a heat conducting component;

[0040] Fig. 9 for Figure 1 A schematic diagram of the structure of the heat dissipation components and connecting pipes;

[0041] Fig.10 for Fig. 9 A schematic diagram of an explosion structure;

[0042] Fig.11 for Fig.10 A schematic diagram of a partial structure of the heat dissipation component;

[0043] Fig.12 This is a DSC test diagram of a metal coolant of an embodiment of a heat dissipation module of the present application;

[0044] Fig.13 Another DSC test diagram of the metal coolant of one embodiment of the heat dissipation module of the present application;

[0045] Fig.14 This is a physical picture of the metal coolant after 1000h reliability test of one embodiment of the heat dissipation module of the present application.

[0046] Description of Figure Numbers:

[0047]

[0048] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0051] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0052] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0053] In products or equipment, electrical components are usually indispensable. When electrical components are working, they tend to generate heat. Therefore, in order to prevent electrical components from being damaged due to excessive heat generation, a heat dissipation module is usually configured to dissipate the heat. The heat dissipation module in the related art usually uses cooling water as the cooling medium. However, the thermal conductivity and specific heat capacity of cooling water are relatively limited, and there is a risk of volatilization failure under specific working conditions, which results in limited heat dissipation effect of such heat dissipation modules.

[0054] Therefore, based on the above considerations, the present application proposes a new type of heat dissipation module, which innovatively adopts metal coolant (i.e. liquid metal) instead of traditional cooling water as the cooling medium, so as to improve the heat dissipation effect of the heat dissipation module by taking advantage of the metal coolant's high thermal conductivity and large specific heat capacity, and the advantages of no risk of volatilization failure under specific working conditions and continuous and stable heat transfer.

[0055] In addition, it should be noted that the heat dissipation module proposed in this application can be applied to electronic products, such as head-mounted display devices or smart cockpits, and of course it can also be used in vehicle equipment, or mechanical processing equipment such as lathes. It can be seen that this application does not limit the application object of the heat dissipation module, as long as there is a scene with a heat source to be dissipated.

[0056] Next, the structure of the heat dissipation module proposed in this application is explained and illustrated by an embodiment. In one embodiment of this application, please refer to Figures 1 to 5 ,as well as Figure 8 The heat dissipation module 100 proposed in the present application includes a heat conducting component 10, a connecting pipe 30 and a power component 50. The heat conducting component 10 is provided with a liquid passage 11; the connecting pipe 30 and the liquid passage 11 are connected to form a closed-loop medium flow path, and the medium flow path contains metal coolant; the power component 50 is connected to the connecting pipe 30 and is configured to drive the metal coolant to circulate in the medium flow path.

[0057] The heat-conducting component 10 can be used to contact the heat source to be dissipated to absorb the heat generated by the heat source, and at the same time, heat exchange with the metal coolant flowing through the liquid passage 11, so as to take away the heat generated by the heat source and dissipate the heat of the heat source. Among them, the heat-conducting component 10 can be made of a metal material with good thermal conductivity, such as aluminum or copper. The shape of the heat-conducting component 10 can be a cuboid, a nearly cuboid, a cube or a cylinder, etc., and the present application does not limit the shape of the heat-conducting component 10. In order to improve the contact effect between the heat-conducting component 10 and the heat source to be dissipated and improve the heat dissipation effect, the shape of the heat-conducting component 10 can be set to be the same as the shape of the heat source to be dissipated. In addition, the liquid passage 11 arranged on the heat-conducting component 10 is formed as a part of the medium flow path, so that the metal coolant flows through the heat-conducting component 10 and exchanges heat with the heat-conducting component 10. Among them, the liquid passage 11 can be a cavity structure, a hole structure, or a combination of a cavity and a hole structure. It can be seen that the present application does not limit the structural form and shape of the liquid passage 11.

[0058] The connecting pipe 30 can be connected to the liquid passage 11 at both ends, so as to realize the medium flow path of the connecting pipe 30 and the liquid passage 11 forming a closed loop. Among them, after the metal coolant in the medium flow path exchanges heat with the heat-conducting component 10 and flows out from the liquid passage 11, it can be directly heat-dissipated through the connecting pipe 30 and the outside air for heat exchange. Of course, it can also be heat-dissipated through the heat-dissipating component 70 arranged on the connecting pipe 30 as described below, or through the fan 90 arranged in conjunction. That is, it is ensured that the temperature of the metal coolant can be reduced to a low temperature before it re-enters the liquid passage 11 of the heat-conducting component 10 from the connecting pipe 30, so that it can exchange heat with the heat-conducting component 10 again to achieve heat dissipation of the heat source. In addition, in order to facilitate the heat exchange between the metal coolant in the connecting pipe 30 and the outside air or the heat-dissipating component 70 arranged on the connecting pipe 30, the connecting pipe 30 can also be made of a metal material with good thermal conductivity, such as aluminum or copper.

[0059] The power component 50 can be used to provide power to drive the metal coolant to circulate from the connecting pipe 30 into the liquid passage 11, and then flow out of the liquid passage 11 and enter the connecting pipe 30. The power component 50 can be an electromagnetic pump. At this time, since the metal coolant has conductivity, the metal coolant can be driven to circulate in the medium flow path under the action of electromagnetic force by inputting current into the electromagnetic pump by the power supply, thereby improving the convenience of the power component 50 to drive the metal coolant. At the same time, it is also convenient to control the flow rate of the metal coolant by adjusting the current of the power supply of the electromagnetic pump at different powers, so as to meet the heat dissipation requirements of each power within the peak temperature of the heat source. Of course, the present application is not limited to this. In other embodiments, the power component 50 can also be other types of pump bodies.

[0060] The heat dissipation module 100 proposed in the present application is equivalent to using metal coolant to replace the traditional cooling water as the cooling medium, so that the heat dissipation module 100 proposed in the present application has the following advantages:

[0061] (1) The metal coolant is in liquid state at room temperature. When the heat dissipation module 100 is in working state, the metal coolant in the medium flow path can be continuously circulated through the external power component 50 (for example, an electromagnetic pump). Compared with the traditional medium flow path using cooling water as the cooling medium, the use of metal coolant as the cooling medium has no risk of volatilization failure under specific working conditions, and heat transfer does not need to rely on a continuous structure in the medium flow path, and the heat transfer is continuous and stable.

[0062] (2) By adjusting the current of the external electromagnetic pump, the flow rate of the metal coolant in the medium flow path can be conveniently controlled, and the circulation frequency can be adjusted to control the heat dissipation conditions. For example: at high power, the current of the electromagnetic pump can be increased to increase the speed, thereby increasing the flow rate of the metal coolant in the medium flow path, thereby improving the heat dissipation efficiency; at low power, the current of the electromagnetic pump can be reduced to meet the heat dissipation requirements while reducing power consumption.

[0063] (3) The metal coolant has high thermal conductivity, large specific heat capacity, good fluidity and performance stability. It has better performance than cooling water and can effectively improve the performance of the heat dissipation module 100 and reduce thermal resistance.

[0064] (4) Since the density and weight of cooling water per unit volume are low, the heat dissipation module 100 may be placed in various postures and angles such as lying down or standing up in different use environments and processes, which makes the cooling water in the medium flow path susceptible to the anti-gravity / conformity force caused by the posture, thereby deteriorating the heat dissipation effect. However, due to the high density and heavy weight of the metal coolant and the fact that it can fill the medium flow path, it can avoid the influence of the placement posture and environment, thereby ensuring the heat dissipation performance of the heat dissipation module 100.

[0065] (5) Since conventional cooling water has a low thermal conductivity, it needs to be used with a larger fan 90 after taking away the heat from the heat source, resulting in a larger overall structural component size of the product. However, since metal coolant has a high thermal conductivity, it can be used with a relatively smaller fan 90, thereby reducing the volume of the heat dissipation module 100 and the overall structural component size of the heat dissipation module 100, thereby achieving lightweight and cost reduction.

[0066] In an embodiment of the present application, the metal coolant includes gallium, indium and tin.

[0067] In this embodiment, the metal coolant is set to gallium, indium and tin liquid metal, which can further improve the thermal conductivity of the metal coolant, increase the specific heat capacity of the metal coolant, and achieve non-N solidification at a lower temperature. For example, when defining the percentage of gallium in the metal coolant as X, the percentage of indium as Y, and the percentage of tin as Z, and satisfying the relationship: 0.6≤X≤0.8, 0.15≤Y≤0.25, and 0.05≤X≤0.15, please refer to Figure 12 to Figure 14After DSC testing, the cooling rate of the metal coolant was controlled at 0.5℃ / min, and the temperature dropped for 120 minutes. The conditions were harsh and the performance remained stable. After more than 1000 hours of reliability testing, the metal coolant remained liquid and stable at around minus 40℃ without solidification. Therefore, after DSC, steady-state thermal conductivity standard test and more than 1000 hours of reliability testing, it can be determined that the new gallium indium tin liquid metal has excellent performance at low temperatures, and can still meet the requirements of non-solidification and stable flow heat transfer at around minus 40 degrees, greatly improving the operating temperature range of the heat dissipation module 100, and the parameters affecting the actual wetting, such as surface tension, are stable at low temperatures, and the thermal conductivity is 25-28℃ / m`k; the density is stable at 5.4-5.6g / cm 3 . Among them, the value of X can be 0.6, 0.61, 0.62, 0.63, 0.64, 0.65, 0.66, 0.67, 0.68, 0.69, 0.7, 0.71, 0.72, 0.73, 0.74, 0.75, 0.76, 0.77, 0.78, 0.79 or 0.8, and of course it can also be any value in the above range. And the value of Y can be 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, 0.21, 0.22, 0.23, 0.24 or 0.25, and of course it can also be any value in the above range. The value of Z can be 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.11, 0.12, 0.13, 0.14 or 0.15, and of course, it can be any value in the above range. In addition, it should be noted that in some embodiments, the metal coolant can also be gallium metal liquid, indium metal liquid or tin metal liquid. It can be seen that the present application does not limit the type of metal coolant.

[0068] Please refer to Figures 3 to 8 In one embodiment of the present application, the heat-conducting component 10 includes a main body 13 and a partition plate 15, and the main body 13 is provided with a liquid passage 11; a plurality of partition plates 15 are arranged side by side and spaced apart to separate at least part of the liquid passage 11 to form a plurality of isolated diversion channels 151.

[0069] The partition plate 15 can be extended along the liquid flow direction of the liquid flow channel 11 (that is, the flow direction of the metal coolant, or the first direction described below). When the liquid flow channel 11 is extended along the linear direction, the partition plate 15 can be a linear plate; when the liquid flow channel 11 is extended along the arc direction, the partition plate 15 can be an arc plate. In addition, in the liquid flow direction of the liquid flow channel 11, the partition plate 15 can be the same size as the liquid flow channel 11, so as to separate the entire liquid flow channel 11 into a plurality of isolated shunt channels 151. Of course, the size of the partition plate 15 can also be smaller than the size of the liquid flow channel 11, so as to separate part of the liquid flow channel 11 into a plurality of isolated shunt channels 151. In addition, the partition plate 15 can be an integral structure with the heat-conducting component 10, or a split structure, and then connected to the heat-conducting component 10 by any connection method such as threaded connection or snap connection.

[0070] In this embodiment, the partition plate 15 separates the liquid passage 11, so that the metal coolant can be diverted to multiple diversion channels 151 after entering the liquid passage 11. At this time, on the one hand, the turbulence of the metal coolant in the liquid passage 11 can be reduced to improve the stability and smoothness of the flow of the metal coolant, thereby facilitating the improvement of the heat dissipation effect of the heat dissipation module 100. On the other hand, the contact area between the metal coolant and the heat-conducting component 10 can also be increased. In turn, the heat exchange effect between the two is improved, thereby improving the heat dissipation effect of the heat dissipation module 100.

[0071] Please refer to Figures 1 to 8 In one embodiment of the present application, the liquid passage 11 includes a main cavity 111 and two end holes 114, and the two end holes 114 are arranged at intervals along the first direction of the heat-conducting component 10; the main cavity 111 is arranged between the two end holes 114 and connected to the two end holes 114; at least two partition plates 15 are arranged in the main cavity 111 and are arranged side by side at intervals along a second direction intersecting the first direction to separate at least part of the main cavity 111 to form a plurality of isolated diversion channels 151; one end of the connecting pipe 30 is connected to one end hole 114, and the other end is connected to the other end hole 114.

[0072] The main body cavity 111 may be provided with two end holes 114 for accommodating the partition plate 15. The main body cavity 111 may be in the shape of a cuboid or a cube, etc., so as to allow the partition plate 15 to be regularly distributed and installed. The end holes 114 may be used to communicate with both ends of the connecting pipe 30, and one end hole 114 is for metal coolant to enter, and the other end hole 114 is for metal coolant to flow out.

[0073] In this embodiment, the liquid passage 11 is configured to include a main cavity 111 and an end hole 114 , so that the partition plate 15 can be conveniently installed through the relatively large main cavity 111 , and the end hole 114 can better adapt and connect with the connecting pipe 30 .

[0074] Please refer to Figure 8 In one embodiment of the present application, the main cavity 111 includes a middle cavity 112 and two edge cavities 113, the two edge cavities 113 are spaced apart along the first direction and are both connected to the middle cavity 112; the size of the middle cavity 112 in the third direction is larger than the size of the edge cavity 113 in the third direction, the third direction intersects the first direction and the second direction, at least two partition plates 15 are arranged in the middle cavity 112 to separate at least part of the middle cavity 112 to form a plurality of isolated diversion channels 151; the liquid passage 11 also includes two connecting holes 115, each connecting hole 115 is connected to an end hole 114 and a corresponding edge cavity 113, and the connecting hole 115 and the corresponding end hole 114 are located within the angle formed by the corresponding edge cavity 113 and the middle cavity 112.

[0075] In this embodiment, when the third direction is defined as the up-down direction, the two edge cavities 113 can be connected at the upper ends of the opposite sides of the middle cavity 112, and the depth of the edge cavity 113 in the up-down direction is less than the depth of the middle cavity 112 in the up-down direction. At this time, the corresponding edge cavity 113 and the middle cavity 112 enclose an angle, that is, the bottom of the edge cavity 113. Therefore, the connecting hole 115 and the end hole 114 are arranged below the corresponding edge cavity 113, so that the middle cavity 112, the edge cavity 113, the connecting hole 115 and the end hole 114 are distributed more compactly, so as to reduce the volume of the heat-conducting component 10. At the same time, the end hole 114 is horizontal and the connecting hole 115 is vertical, so that the metal coolant can turn between the end hole 114 and the connecting hole 115, so that the metal coolant fills the main cavity 111 and makes more sufficient contact with the heat-conducting component 10 to improve the heat dissipation effect of the heat dissipation module 100. Of course, it should be noted that, in other embodiments, the main cavity 111 may include only the middle cavity 112, and the liquid passage 11 may not include the two communication holes 115. In this case, the end hole 114 may be directly connected to the middle cavity 112. In addition, in the first direction, the size of the partition plate 15 may be the same as that of the middle cavity 112, or smaller than that of the middle cavity 112.

[0076] Please refer to Figures 3 to 5 ,as well as Figure 8In one embodiment of the present application, the main body 13 includes a first portion 131 and a second portion 133 , which enclose a main cavity 111 ; the end hole 114 is provided in the first portion 131 , and the partition plate 15 is provided in the second portion 133 .

[0077] The first part 131 may be formed with a groove. The second part 133 may be a plate body, and cover the notch of the groove of the first part 131, so as to enclose the main cavity 111 with the groove of the first part 131. Of course, the second part 133 may also be provided with a groove. In this case, the main cavity 111 may be enclosed by the groove of the second part 133 and the groove of the first part 131. The end hole 114 and the connecting hole 115 described above may be provided on the first part 131.

[0078] In this embodiment, the main body 13 is configured to include a first part 131 and a second part 133, so that the two can be manufactured separately and independently, and then assembled to form the main cavity 111. At the same time, the end hole 114 and the connecting hole 115 are also provided in the first part 131 and the second part 133 respectively. In this way, the structures of the first part 131 and the second part 133 are relatively simple, which is conducive to improving the convenience of manufacturing the heat-conducting component 10. Furthermore, the partition plate 15 and the second part 133 can be an integral structure, so that the two can be manufactured by integral molding to further improve the convenience of manufacturing.

[0079] Please refer to Figure 1 and Figure 2 In one embodiment of the present application, one end of the connecting pipe 30 is inserted into one end hole 114 , and the other end is inserted into the other end hole 114 .

[0080] In this embodiment, the end of the connecting pipe 30 is inserted into the end hole 114 , which is beneficial to improving the stability and sealing of the connection between the connecting pipe 30 and the heat conducting component 10 .

[0081] Please refer to Fig. 9 and Fig.10 In one embodiment of the present application, the heat dissipation module 100 also includes a heat dissipation component 70, and the heat dissipation component 70 includes a contact body 71 and heat dissipation fins 73; the contact body 71 is provided with a through hole 711, and a portion of the connecting pipe 30 is passed through the through hole 711, and the heat dissipation fins 73 are arranged on the outside of the contact body 71.

[0082] The heat dissipation component 70 can be made of a metal material with good thermal conductivity, such as aluminum or copper. The contact body 71 in the heat dissipation component 70 can be used to contact the connecting pipe 30 to absorb the heat transferred from the connecting pipe 30 when the metal coolant flows through it; and the heat dissipation fins 73 can be used to contact the outside air.

[0083] In this embodiment, a heat dissipation component 70 having a contact body 71 and heat dissipation fins 73 is further provided, which can increase the heat exchange area with the outside air, thereby improving the heat dissipation effect of the metal coolant with heat from the heat source and improving the heat dissipation effect of the heat dissipation module 100.

[0084] Please refer to Fig. 9 and Fig.10 In one embodiment of the present application, the number of the through holes 711 is at least two, and the at least two through holes 711 are arranged side by side and spaced apart, and the connecting pipes 30 are sequentially passed through the at least two through holes 711.

[0085] In this embodiment, the number of the through holes 711 is set to at least two, and the connecting pipe 30 is bent to form an S shape so as to pass through at least two through holes 711 in sequence back and forth in the direction of the through holes 711. This can increase the contact area between the connecting pipe 30 and the heat dissipation component 70, so as to further improve the heat dissipation effect of the metal coolant with heat from the heat source.

[0086] Please refer to Fig. 9 and Fig.10 In one embodiment of the present application, the contact body 71 includes two enclosing plates 713 , the two enclosing plates 713 enclose a through hole 711 , and at least one of the two enclosing plates 713 is provided with a heat dissipation fin 73 .

[0087] In this embodiment, the contact body 71 includes two enclosing plates 713 to enclose and form the through hole 711 , which can facilitate the formation of the through hole 711 and the installation of the connecting pipe 30 in the through hole 711 .

[0088] Please refer to Figures 9 to 11 In one embodiment of the present application, at least two heat dissipating fins 73 are arranged in sequence along the extension direction of the through hole 711; the heat dissipating component 70 also includes a connecting plate 75, the connecting plate 75 and the enclosing plate 713 are relatively spaced apart and connect at least two heat dissipating fins 73.

[0089] In this embodiment, the arrangement of the connecting plate 75 can strengthen the strength of the heat dissipation component 70, so as to improve the overall strength of the heat dissipation component 70 and increase the service life. At the same time, the contact area between the heat dissipation component 70 and the outside air can be further increased to improve the heat dissipation effect. In addition, the heat dissipation component 70 can be installed and placed through the flat surface on the connecting plate 75, thereby improving the convenience of its installation and placement and the stability of installation. Among them, the enclosure plate 713 and the heat dissipation fins 73 and the connecting plate 75 arranged thereon can be an integrated structure to improve the convenience of manufacturing and further improve the overall strength of the heat dissipation component 70.

[0090] Please refer to Figure 1 In one embodiment of the present application, the heat dissipation module 100 further includes a fan 90 , and an air outlet of the fan 90 faces the heat dissipation component 70 .

[0091] In this embodiment, the fan 90 blows air to the heat dissipation component 70 to improve the fluidity of the external air, so as to improve the heat dissipation effect of the heat dissipation component 70 and the external air.

[0092] Please refer to Figure 3 In one embodiment of the present application, the heat-conducting component 10 is provided with a mounting hole 16, and the mounting hole 16 is configured to be penetrated by a fastener to connect the heat-conducting component 10 and the heat source to be dissipated.

[0093] In this embodiment, a mounting hole 16 is provided on the heat conducting component 10 to facilitate the subsequent installation of fasteners to achieve a portable and stable connection between the heat conducting component 10 and the heat source to be dissipated. The fastener may be a screw, and the mounting hole 16 may be provided on the first portion 131 of the heat conducting component 10.

[0094] The present application also proposes an application device, which includes a heat dissipation module 100. The specific structure of the heat dissipation module 100 refers to the above-mentioned embodiment. Since the present application device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one. Among them, the application device can be a product, such as an electronic product, and an example can be a head-mounted display device or a smart cockpit. Of course, the application device can also be a vehicle equipment, or a mechanical processing equipment such as a lathe. It can be seen that the present application does not limit the type of application device, as long as it is a device that includes a heat source to be dissipated.

[0095] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the inventive concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A heat dissipation module, characterized in that: include: A heat-conducting component, wherein the heat-conducting component is provided with a liquid passage; A connecting pipe, the connecting pipe is connected to the liquid passage to cooperate with each other to form a closed-loop medium flow path, and the medium flow path contains metal coolant; as well as a power component, the power component being connected to the connecting pipe and configured to drive the metal coolant to circulate in the medium flow path; The heat-conducting component comprises a main body and a partition plate, and the main body is provided with the liquid passage; The plurality of partition plates are arranged side by side and spaced apart to separate the portion of the liquid passage to form a plurality of isolated flow diversion passages; The liquid passage comprises a main body cavity and two end holes, the two end holes are arranged at intervals along the first direction of the heat-conducting component; the main body cavity is arranged between the two end holes and is connected to the two end holes; at least two partition plates are arranged in the main body cavity and are arranged side by side at intervals along a second direction intersecting the first direction to separate the separated parts of the main body cavity into a plurality of isolated flow-dividing channels; one end of the connecting pipe is connected to one end hole, and the other end is connected to the other end hole; The main body cavity includes a middle cavity and two edge cavities, and the two edge cavities are connected to the middle cavity; The size of the middle cavity in the third direction is larger than the size of the edge cavity in the third direction, the third direction intersects the first direction and the second direction, and at least two partition plates are arranged in the middle cavity; the liquid passage further comprises two communicating holes, each communicating hole is connected to one of the end holes and the corresponding edge cavity, and the communicating hole and the corresponding end hole are located within the angle enclosed by the corresponding edge cavity and the middle cavity; And / or, the main body comprises a first part and a second part, the first part and the second part enclose the main body cavity; the end hole is provided in the first part, and the partition plate is provided in the second part; And / or, one end of the connecting pipe is inserted into one of the end holes, and the other end is inserted into the other end hole.

2. The heat dissipation module according to claim 1, characterized in that: The metal coolant includes gallium, indium and tin.

3. The heat dissipation module according to claim 2, characterized in that: The percentage of gallium in the metal coolant is defined as X, the percentage of indium is defined as Y, and the percentage of tin is defined as Z, satisfying the following relationships: 0.6≤X≤0.8, 0.15≤Y≤0.25, and 0.05≤X≤0.

15.

4. The heat dissipation module according to any one of claims 1 to 3, characterized in that: The heat dissipation module further comprises a heat dissipation component, wherein the heat dissipation component comprises a contact body and heat dissipation fins; The contact body is provided with a penetration hole, a portion of the connecting pipe is penetrated through the penetration hole, and the heat dissipation fins are arranged on the outer side of the contact body.

5. The heat dissipation module according to claim 4, characterized in that: The number of the penetration holes is at least two, at least two of the penetration holes are arranged side by side and spaced apart, and the connecting pipes are sequentially penetrated through the at least two penetration holes; And / or, the contact body includes two enclosing plates, the two enclosing plates are enclosed to form the through hole, and at least one of the two enclosing plates is provided with the heat dissipation fin.

6. The heat dissipation module according to claim 5, characterized in that: When the contact body includes an enclosing plate, at least two of the heat dissipation fins are sequentially spaced apart along the extending direction of the through hole; The heat dissipation component further comprises a connecting plate, wherein the connecting plate and the enclosing plate are relatively spaced apart and connected to at least two of the heat dissipation fins.

7. The heat dissipation module according to claim 4, characterized in that: The heat dissipation module further includes a fan, and an air outlet of the fan faces the heat dissipation component.

8. The heat dissipation module according to any one of claims 1 to 3, characterized in that: The heat-conducting component is provided with a mounting hole, and the mounting hole is configured to be penetrated by a fastener to connect the heat-conducting component and a heat source to be dissipated; And / or, the power component is an electromagnetic pump.

9. An application device, characterized in that: Comprising the heat dissipation module as described in any one of claims 1 to 8.

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