A mechanized removal device for waste circuit board components

Abstract

The present invention discloses a mechanized removal device for components of waste circuit boards, and relates to the technical field of waste circuit board processing. The mechanized removal device for components of waste circuit boards comprises an outer shell, and an inner cylinder, wherein the inner cylinder is rotatably installed in the outer shell, and the outer wall of the inner cylinder is evenly provided with first leakage holes, the outer side of the inner cylinder is evenly fixed with stirring blades, and the outer side of the inner cylinder is rotatably installed with the outer cylinder, the inner wall of the outer cylinder is an inclined structure, and the outer wall of the outer cylinder is evenly provided with second leakage holes, and the inner diameter of the second leakage hole is 1 / 4 of the inner diameter of the first leakage hole. A heated inert gas is input into the inner shell through a hot air input component to realize heating and desoldering of the circuit board. During the desoldering process, due to the presence of the inert gas, the solder liquid can be prevented from being oxidized. After the solder liquid drips onto the discharge plate, the solder liquid on the discharge plate is cooled by the cooling chamber, so that the solder liquid is solidified, which is beneficial to the collection of solder.

Description

Technical Field

[0001] The invention relates to the technical field of waste circuit board processing, in particular to a mechanized removal device for components of waste circuit boards. Background Art

[0002] Waste circuit boards refer to circuit boards disassembled from discarded electronic and electrical equipment. They are large-scale and widely used electronic waste that is easy to pollute the environment. The main components are 30% plastic (by mass fraction, the same below), 30% inert oxides and 40% metals. Since waste circuit boards contain not only a variety of metal materials, such as copper, iron, aluminum, tin, lead, etc., but also rare and precious metals such as gold and silver, they have high recycling value; they also contain many toxic and harmful substances, such as lead, bromine, benzene, hexavalent chromium, mercury, cadmium, halogen flame retardants, etc. If they are discarded or piled up at will, the heavy metals such as lead contained in them will penetrate into the soil, water and other environmental media, and then circulate through the food chain of plants, animals and humans. In order to achieve safe and harmless treatment of waste circuit boards, the above-mentioned low-level and high-pollution treatment methods must be abandoned and environmentally friendly methods must be adopted to treat waste circuit boards. For components with various models and specifications on circuit boards, it is not conducive to subsequent targeted treatment. Therefore, it is necessary to remove the electronic components on the circuit boards, remove the solder, and separate them from the substrate.

[0003] The Chinese patent with publication number CN101537522B discloses a method and equipment for disassembling electronic components of waste printed circuit boards and recycling solder. The invention has the advantages of high efficiency, low energy consumption, environmental protection and practicality. At the same time, it uses negative pressure adsorption to absorb the high temperature, odor, harmful gases, etc. generated by the tin melting furnace and the conveyor belt end, and discharges them after environmental protection treatment, which accelerates air circulation and humanely ensures the quality of the air in the operating room.

[0004] However, when using the assembly line operation method, the equipment occupies a large area and has a high recycling cost.

[0005] The Chinese patent with publication number CN103990879B discloses a disassembly device for circuit boards with components and a disassembly method thereof. The device uses a combination of electric heating and hot air to heat and desolder the circuit boards with components. The circuit boards are heated evenly, and no open flames or secondary pollution are generated during the disassembly process. A combination of three mechanisms, namely a rotating separation cylinder, a baffle and a vibrating separation screen, is used to provide the circuit boards with components with the required disassembly force and the power to move toward the discharge end, thereby ensuring efficient separation of components and solder liquid from the circuit boards and smooth discharge.

[0006] However, in actual use, electric heating has high energy consumption, and air heating is prone to cause solder oxidation, requiring subsequent reduction of the solder. In addition, due to the use of vibration separation, the edges of the circuit board after electric heating are easily shattered, resulting in an increase in the content of impurities in components and solder when they are discharged. Summary of the invention

[0007] In view of the shortcomings of the prior art, the present invention provides a mechanized removal device for components of waste circuit boards, which solves the problems raised in the background technology.

[0008] To achieve the above purpose, the present invention is implemented through the following technical solutions: a mechanized removal device for waste circuit board components, including an outer shell and an inner cylinder, the inner cylinder is rotatably installed in the outer shell, and the outer wall of the inner cylinder is evenly provided with first leakage holes, the outer side of the inner cylinder is evenly fixed with stirring blades, and the outer side of the inner cylinder is rotatably installed with the outer cylinder, the inner wall of the outer cylinder is an inclined structure, and the outer wall of the outer cylinder is evenly provided with second leakage holes; a discharge plate, the discharge plate is fixed in the outer shell near the lower end position, and a scraper is slidably installed on the discharge plate; a cooling bin, the cooling bin is arranged at the bottom of the outer shell and below the discharge plate, and the lower surface of the discharge plate is evenly provided with heat conducting plates; a transmission assembly, the transmission assembly is arranged on the back side of the outer shell, and is used to drive the inner cylinder and the outer cylinder to rotate respectively; a hot air input assembly, the hot air input assembly is arranged on the outer side of the outer shell, and is used to inject hot air into the inner cylinder to accelerate the softening of the solder on the circuit board surface.

[0009] Furthermore, the transmission assembly includes a transmission box fixed to the outside of the outer shell, a hollow shaft extending to the inside of the transmission box is fixed at one end of the inner cylinder, and a sleeve rotatably connected to the hollow shaft is fixed to the outside of the outer cylinder; one end of the sleeve extends into the transmission box and is fixedly sleeved with a driven gear, and a driven pulley is fixedly sleeved on the outside of the hollow shaft; a motor is fixed in the transmission box, a rotating shaft is installed at the output end of the motor, a driving gear meshing with the driven gear is fixedly provided on the outside of the rotating shaft, and a driving pulley is fixedly sleeved on the outside of the rotating shaft on one side of the driving gear, and a synchronous transmission belt is installed between the driving pulley and the driven pulley.

[0010] Furthermore, the hot gas input component includes an inert gas tank fixed to one side of the outer shell and a heating component arranged on the outside of the outer shell for heating the gas output from the inert gas tank; a first gas pipe is installed at the output end of the inert gas tank, the first gas pipe is connected to the input end of the heating component, the input end of the heating component is connected to a second gas pipe, the output end of the second gas pipe is installed with an air pump fixed to the back side of the transmission box, the output end of the air pump is rotatably connected to one end of the hollow shaft; one end of the hollow shaft extends to the inside of the inner cylinder to form an exhaust pipe, and pulse nozzles are evenly spaced on the exhaust pipe.

[0011] Furthermore, the heating assembly includes a heating box fixed to the outside of the outer shell, and electric heating plates are symmetrically installed in the heating box. A heating tube is provided between the two electric heating plates, and the heating tube is a zigzag structure. A first interface connected to a first gas pipe is installed on one side of the heating box, and the first interface is connected to one end of the heating tube. A second interface connected to a second gas pipe is also installed on one side of the heating box, and the second interface is connected to the other end of the heating tube.

[0012] Furthermore, control valves are installed on the outer sides of the second interface and the first interface, and pressure gauges are also installed on the second interface and the first interface.

[0013] Furthermore, a fixing frame is symmetrically fixed inside the shell, the fixing frame is rotatably connected to the outer cylinder, and an arc cover is installed between the two fixing frames. The upper end of the arc cover is provided with an exhaust gas processor that penetrates the shell, and the output end of the exhaust gas processor is installed with an exhaust gas output pipe.

[0014] Furthermore, a notch groove is provided at the lower end of the fixing frame, an electric telescopic cylinder is fixed inside the notch groove, and the telescopic end of the electric telescopic cylinder is fixedly connected to the scraper; a solder outlet adapted to the unloading plate is provided on one side of the outer shell, and a third sealing cover is hinged on the outer side of the solder outlet.

[0015] Furthermore, a circuit board input port is provided on the outer side of the shell at the position of the inner cylinder, and a second sealing cover is hinged on the circuit board input port; an electronic component unloading channel adapted to the outer cylinder is provided on the outer side of the shell below the circuit board input port, and a first sealing cover is hinged on the electronic component unloading channel.

[0016] Furthermore, a refrigerant input pipe is installed on the outer side of the shell at one side of the cooling bin, and a refrigerant output pipe is installed on the outer side of the shell at the other side of the cooling bin.

[0017] Furthermore, a heat-insulating layer is provided on the inner wall of the shell, and a temperature sensor is installed inside the shell.

[0018] The present invention has the following beneficial effects:

[0019] (1) The mechanized removal equipment for components of waste circuit boards inputs heated inert gas into the inner part of the shell through a hot gas input component to achieve heating and desoldering of the circuit boards. During the desoldering process, the presence of the inert gas can prevent the solder liquid from being oxidized. After the solder liquid drips onto the unloading plate, the solder liquid on the unloading plate is cooled by a cooling chamber, thereby solidifying the solder liquid, which is beneficial to the collection of solder. The inner cylinder and the outer cylinder are driven to rotate at different speeds through the setting of the transmission component, so that the circuit board inside the inner cylinder is subjected to centrifugal force, further causing the solder liquid and components to be thrown out from the first leakage hole, thereby achieving separation of the circuit board. Through the setting of the second leakage hole, the solder liquid mixed in the components is thrown out, and then the components are separated, ensuring efficient separation and smooth discharge of the components and the solder liquid from the circuit board.

[0020] (2) The mechanized removal equipment for components of waste circuit boards inputs inert gas into the interior of the heating tube through the inert gas tank and the first gas pipe, and heats the zigzag-shaped heating tube through the electric heating plate, thereby achieving heating of the inert gas, which is conducive to rapid heating of the inert gas. By inputting high-temperature inert gas into the interior of the shell in a pulsed manner, the desoldering effect of the circuit board can be improved, and the energy-saving efficiency can be improved.

[0021] (3) The mechanized removal equipment for components of waste circuit boards drives the inner cylinder and the outer cylinder to rotate at different speeds through the transmission assembly, so that the stirring blades stir the components inside the outer cylinder, thereby improving the separation effect of the components and the solder liquid. The equipment uses centrifugal force to separate the circuit board, the components and the solder liquid, with good separation effect, and will not damage the waste circuit board, thereby preventing the fragmentary impurities on the waste circuit board from affecting the collection of components and solder liquid.

[0022] (4) The mechanized removal equipment for waste circuit board components, through the setting of the arc cover, makes the solder liquid under the centrifugal force be thrown to the inner wall of the arc cover, and further makes the solder liquid flow down along the inner wall of the arc cover, thereby preventing the solder liquid from diffusing to the inner wall of the shell and affecting its collection. Through the setting of the exhaust gas processor, the exhaust gas inside the shell is purified to prevent the exhaust gas from being directly discharged into the air and affecting the surrounding environment.

[0023] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 For the present invention Figure 1 Another perspective of the picture;

[0026] Figure 3 It is a schematic diagram of the internal structure of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the transmission assembly in the present invention;

[0028] Figure 5 It is a schematic diagram of the installation structure of the inner cylinder in the present invention;

[0029] Figure 6 For the present invention Figure 5 The main view of

[0030] Figure 7 It is a schematic diagram of the installation structure of the outer cylinder in the present invention;

[0031] Figure 8 For the present invention Figure 7 A schematic diagram of the enlarged structure at A;

[0032] Fig. 9 It is a structural schematic diagram of the heating box in the present invention;

[0033] Fig.10 It is a schematic diagram of the installation structure of the heating tube in the present invention.

[0034] In the figure, 1, housing; 2, transmission box; 3, heating box; 4, electronic component unloading channel; 5, first sealing cover; 6, refrigerant input pipe; 7, refrigerant output pipe; 8, inert gas tank; 9, first gas pipeline; 10, second gas pipeline; 11, exhaust gas processor; 12, exhaust gas output pipe; 13, second interface; 14, first interface; 15, vacuum pump; 16, inner tube; 17, outer tube; 18, second sealing cover; 19, unloading plate ; 20. Cooling bin; 21. Heat conducting plate; 22. Fixed frame; 23. Electric telescopic cylinder; 24. Shovel; 25. Arc cover; 26. Electric heating plate; 27. Motor; 28. Rotating shaft; 29. ​​Hollow shaft; 30. Bushing; 31. Driven gear; 32. Driven pulley; 33. Driving gear; 34. Synchronous transmission belt; 35. First leakage hole; 36. Second leakage hole; 37. Stirring blade; 38. Heating tube; 39. Driving pulley. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] See also Figure 1-Figure 10 The embodiment of the present invention provides a technical solution: a mechanized removal device for components of waste circuit boards, comprising a shell 1, and an inner cylinder 16, wherein the inner cylinder 16 is rotatably installed in the shell 1, and the outer wall of the inner cylinder 16 is evenly provided with first leakage holes 35, and the first leakage holes 35 are used for filtering components and solder liquid. In addition, stirring blades 37 are fixed at equal intervals on the outer side of the inner cylinder 16, and the outer cylinder 17 is rotatably installed on the outer side of the inner cylinder 16, the inner wall of the outer cylinder 17 is an inclined structure, and the outer wall of the outer cylinder 17 is evenly provided with second leakage holes 36, and the inner diameter of the second leakage hole 36 is 1 / 4 of the inner diameter of the first leakage hole 35. Through the setting of the outer cylinder 17, the components and the solder liquid are separated again, and under the setting of the stirring blade 37, the components inside the outer cylinder 17 are stirred, thereby accelerating the separation of the solder liquid mixed in the components. In addition, since the inner wall of the outer cylinder 17 is an inclined structure, it is convenient to output the components after separation.

[0038] In this embodiment, by driving the inner cylinder 16 and the outer cylinder 17 to rotate at different speeds, the circuit board inside the inner cylinder 16 is subjected to centrifugal force, and the solder liquid and components are further thrown out from the first leakage hole 35 to achieve separation of the circuit board. By setting the second leakage hole 36, the solder liquid mixed in the components is thrown out, and then the components are separated, ensuring efficient separation and smooth discharge of the components and solder liquid from the circuit board. In addition, by utilizing centrifugal force to separate the circuit board, components and solder liquid, the separation effect is good, and the discarded circuit board will not be damaged, thereby preventing the fragmented impurities on the discarded circuit board from affecting the collection of components and solder liquid.

[0039] In addition, in order to facilitate the force on the solder liquid, the mechanized removal equipment for waste circuit board components provided in this embodiment also includes a stripping plate 19, which is fixed in the outer shell 1 near the lower end, and a scraper 24 is slidably installed on the stripping plate 19. After the solder liquid falls onto the stripping plate 19, the scraper 24 is driven to move on the stripping plate 19 so that the solder liquid on the stripping plate 19 is scraped off, so as to facilitate the later collection of the solder liquid.

[0040] In order to accelerate the solidification of the solder liquid on the unloading plate 19 to facilitate the collection of the solder liquid, the mechanized removal equipment for waste circuit board components provided in this embodiment also includes a cooling bin 20. The cooling bin 20 is arranged at the bottom of the shell 1 and below the unloading plate 19. Heat conducting plates 21 are installed at equal intervals on the lower surface of the unloading plate 19. Through the setting of the cooling bin 20, the temperature of the unloading plate 19 is accelerated, and the temperature of the solder liquid is further reduced, thereby accelerating the solidification of the solder liquid, which is convenient for the later collection of solder.

[0041] In addition, in order to drive the inner cylinder 16 and the outer cylinder 17 to rotate at different speeds, the present embodiment further includes a transmission assembly, which is disposed on the back side of the outer shell 1 and is used to drive the inner cylinder 16 and the outer cylinder 17 to rotate respectively.

[0042] In order to realize solder desoldering, the present embodiment further comprises a hot air input component, which is arranged outside the outer shell 1 and is used to inject hot air into the inner cylinder 16 to accelerate the softening of the solder on the surface of the circuit board.

[0043] like Figure 3-Figure 8 As shown, the transmission assembly provided in this embodiment includes a transmission box 2 fixed to the outside of the outer shell 1, a hollow shaft 29 extending to the inside of the transmission box 2 is fixed at one end of the inner cylinder 16, and a sleeve 30 rotatably connected to the hollow shaft 29 is fixed on the outside of the outer cylinder 17.

[0044] In this embodiment, the inner cylinder 16 is driven to rotate by the hollow shaft 29 , and the outer cylinder 17 is driven to rotate by the shaft sleeve 30 . The setting of the hollow shaft 29 is conducive to the input of high-temperature inert gas into the inner cylinder 16 at a later stage.

[0045] In addition, in order to realize the driving of the sleeve 30 and the hollow shaft 29, one end of the sleeve 30 is extended into the transmission box 2 and a driven gear 31 is fixedly sleeved thereon, a driven pulley 32 is fixedly sleeved on the outer side of the hollow shaft 29, a motor 27 is fixed in the transmission box 2, a rotating shaft 28 is installed on the output end of the motor 27, a driving gear 33 meshing with the driven gear 31 is fixedly provided on the outer side of the rotating shaft 28, and a driving pulley 39 is fixedly sleeved on the outer side of the rotating shaft 28 on one side of the driving gear 33, and a synchronous transmission belt 34 is installed between the driving pulley 39 and the driven pulley 32.

[0046] In this embodiment, the motor 27 drives the rotating shaft 28 to rotate, and the rotating shaft 28 causes the driving pulley 39 and the driving gear 33 to rotate, and the driving pulley 39 drives the driven pulley 32 to rotate through the synchronous transmission belt 34, thereby realizing the driving of the hollow shaft 29, and the shaft sleeve 30 is rotated through the engagement between the driving gear 33 and the driven gear 31. Preferably, the transmission ratio between the driving gear 33 and the driven gear 31 is 5:1, and the transmission ratio between the driving pulley 39 and the driven pulley 32 is 2:1.

[0047] like Figure 2 , Figure 3 , Figure 7 , Fig. 9 and Fig.10 As shown, the hot gas input assembly provided in this embodiment includes an inert gas tank 8 fixed to one side of the shell 1 and a heating assembly arranged on the outside of the shell 1 for heating the output gas of the inert gas tank 8.

[0048] To facilitate the delivery of inert gas, a first gas pipe 9 is installed at the output end of the inert gas tank 8. The first gas pipe 9 is connected to the input end of the heating component. The input end of the heating component is connected to the second gas pipe 10. The output end of the second gas pipe 10 is installed with an air pump 15 fixed to the back side of the transmission box 2. The output end of the air pump 15 is rotatably connected to one end of the hollow shaft 29; one end of the hollow shaft 29 extends to the inside of the inner tube 16 to form an exhaust pipe, and pulse nozzles are evenly spaced on the exhaust pipe.

[0049] In this embodiment, inert gas is input into the interior of the heating component through the inert gas tank 8 and the first gas pipe 9. The heating component realizes heating of the inert gas, which is beneficial to the rapid heating of the inert gas. By inputting high-temperature inert gas into the interior of the housing 1 in a pulsed manner, the desoldering effect of the circuit board can be improved and the energy-saving efficiency can be improved.

[0050] like Figure 2 , Figure 3 , Figure 7 , Fig. 9 and Fig.10 As shown, the heating assembly provided in this embodiment includes a heating box 3 fixed to the outside of the outer shell 1. Preferably, the inner wall of the heating box 3 is provided with an insulation layer for heat preservation inside the heating box 3. In addition, electric heating plates 26 are symmetrically installed in the heating box 3, and a heating tube 38 is provided between the two electric heating plates 26 to improve the heating effect of the heating tube 38. In addition, the heating tube 38 is a zigzag structure. Preferably, the heating tube 38 is a component made of pure copper material, which can improve the heating effect of the inert gas inside the heating tube 38. A first interface 14 connected to the first gas pipe 9 is installed on one side of the heating box 3, and the first interface 14 is connected to one end of the heating tube 38. A second interface 13 connected to the second gas pipe 10 is also installed on one side of the heating box 3, and the second interface 13 is connected to the other end of the heating tube 38.

[0051] In this embodiment, the zigzag-shaped heating tube 38 is heated by two electric heating plates 26, so as to achieve heating of the inert gas, which is beneficial for rapid temperature rise of the inert gas.

[0052] like Figure 2 , Figure 7 , Fig. 9 and Fig.10 As shown, in order to facilitate the control of the inert gas flow and pressure, control valves are installed outside the second interface 13 and the first interface 14 , and pressure gauges are also installed on the second interface 13 and the first interface 14 .

[0053] In this embodiment, the inert gas input into the heating box 3 and the inner part of the housing 1 is controlled by setting a control valve and a pressure gauge, so as to facilitate detection and operation by the staff.

[0054] like Figure 3 , Figure 5 , Figure 6 and Figure 7 As shown, in order to facilitate the fixation of the outer cylinder 17, a fixing frame 22 is symmetrically fixed inside the outer shell 1, and the fixing frame 22 is rotatably connected to the outer cylinder 17 to facilitate the rotational connection of the outer cylinder 17, and an arc cover 25 is also installed between the two fixing frames 22. Preferably, the arc cover 25 is a component made of stainless steel, and the upper end of the arc cover 25 is provided with an exhaust gas processor 11 that passes through the outer shell 1, and the output end of the exhaust gas processor 11 is installed with an exhaust gas output pipe 12.

[0055] In this embodiment, by setting the arc cover 25, the solder liquid is thrown to the inner wall of the arc cover 25 by the centrifugal force, and further flows down along the inner wall of the arc cover 25, thereby preventing the solder liquid from diffusing to the inner wall of the shell 1 and affecting its collection. By setting the exhaust gas processor 11, the exhaust gas inside the shell 1 is purified to prevent the exhaust gas from being directly discharged into the air and affecting the surrounding environment.

[0056] like Figure 3 , Figure 5 and Figure 7 As shown, in order to facilitate the driving of the scraper 24, a notch groove is provided at the lower end of the fixed frame 22, and an electric telescopic cylinder 23 is fixed inside the notch groove. The telescopic end of the electric telescopic cylinder 23 is fixedly connected to the scraper 24, and the scraper 24 is driven by the electric telescopic cylinder 23 to slide inside the notch groove, so that the scraper 24 acts on the surface of the unloading plate 19, so that the solder liquid on the unloading plate 19 is scraped off, so as to facilitate the later collection of the solder liquid.

[0057] In addition, to facilitate the recovery of solder liquid, a solder outlet adapted to the unloading plate 19 is provided on one side of the shell 1, and a third sealing cover is hinged on the outer side of the solder outlet. The setting of the third sealing cover is not only conducive to solder recovery, but also can seal the shell 1 to reduce waste gas leakage.

[0058] like Figure 1 and Figure 3 As shown, in order to facilitate the input and recovery of circuit boards, a circuit board input port is provided on the outer side of the shell 1 at the position of the inner cylinder 16, and a second sealing cover 18 is hinged on the circuit board input port. Through the setting of the second sealing cover 18, the port of the inner cylinder 16 can be opened and closed, which is beneficial to the input and output of the exhaust circuit board.

[0059] To facilitate the output of components, an electronic component unloading channel 4 adapted to the outer cylinder 17 is provided on the outer side of the shell 1 below the circuit board input port, and a first sealing cover 5 is hinged on the electronic component unloading channel 4. After the components are separated into the inner part of the outer cylinder 17, the inclined setting of the inner wall of the outer cylinder 17 allows the components to slide into the electronic component unloading channel 4, thereby facilitating the output of the components.

[0060] like Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in order to facilitate cooling of the cooling bin 20, a refrigerant input pipe 6 is installed on the outside of the shell 1 at one side of the cooling bin 20, and a refrigerant output pipe 7 is installed on the outside of the shell 1 at the other side of the cooling bin 20. Refrigerant is input into the cooling bin 20 through the refrigerant input pipe 6. Through the heat exchange between the refrigerant and the heat conduction plate 21, the cooling of the solder liquid on the unloading plate 19 is accelerated, thereby accelerating the solidification of the solder liquid to facilitate the collection of the solder.

[0061] like Figure 3 , Figure 5 and Figure 6 As shown, in order to reduce heat loss, an insulation layer is provided on the inner wall of the shell 1 , and in order to facilitate the monitoring and control of the temperature inside the shell 1 , a temperature sensor is installed inside the shell 1 .

[0062] When in use (working), open the second sealing cover 18, put the discarded circuit board into the inner tube 16, close the second sealing cover 18, start the vacuum pump 15, input the inert gas in the inert gas tank 8 into the heating box 3 through the first gas pipe 9, and heat the heating tube 38 with a zigzag structure through two electric heating plates 26, so as to achieve the heating of the inert gas, which is conducive to the rapid heating of the inert gas. The heated inert gas is input into the exhaust pipe through the second gas pipe 10. By inputting the high-temperature inert gas into the shell 1 in a pulsed manner, the desoldering effect of the circuit board can be improved, and the energy-saving efficiency can be improved. In this process, start the motor 27 to drive the rotating shaft 28 to rotate, and the rotating shaft 28 makes the driving pulley 39 and the driving gear 33 rotate, and the engagement between the driving gear 33 and the driven gear 31 makes the shaft The sleeve 30 rotates, and the active pulley 39 drives the driven pulley 32 to rotate through the synchronous transmission belt 34, thereby realizing the driving of the hollow shaft 29, so that the inner cylinder 16 and the outer cylinder 17 rotate at different speeds, and further the waste circuit boards inside the inner cylinder 16 are subjected to centrifugal force after desoldering, thereby accelerating the separation of solder and components on the surface of the waste circuit boards, and the separated solder liquid and components are input into the outer cylinder 17 through the first leakage hole 35, and the outer cylinder 17 rotates so that the solder liquid and the components are further subjected to centrifugal force, thereby separating the solder liquid from the components, and outputting the solder liquid from the second leakage hole 36. In this process, due to the different rotation speeds of the inner cylinder 16 and the outer cylinder 17, the stirring blades 37 on the inner cylinder 16 act on the components inside the outer cylinder 17, thereby accelerating the separation of the components from the solder liquid.

[0063] Furthermore, by tilting the inner wall of the outer cylinder 17, the components slide to the electronic component unloading channel 4, which is beneficial to the output of the components. By setting the arc cover 25, the solder liquid under the centrifugal force is thrown to the inner wall of the arc cover 25, and further flows down along the inner wall of the arc cover 25, thereby avoiding the solder liquid from diffusing to the inner wall of the outer shell 1 and affecting its collection. By setting the exhaust gas processor 11, the exhaust gas inside the outer shell 1 is purified to avoid the exhaust gas being directly discharged into the air and affecting the surrounding environment.

[0064] After the solder liquid falls onto the unloading plate 19, the refrigerant is input into the cooling chamber 20 from the refrigerant input pipe 6, and the heat exchange between the refrigerant and the heat conducting plate 21 accelerates the cooling of the solder liquid on the unloading plate 19, thereby accelerating the solidification of the solder liquid, so as to facilitate the collection of the solder. The electric telescopic cylinder 23 is started, and the scraper 24 is driven by the electric telescopic cylinder 23 to move on the unloading plate 19, so that the solidified solder on the unloading plate 19 is scraped off, so as to facilitate the later collection of the solder. The refrigerant is output from the refrigerant output pipe 7 after being heated, so that the unloading plate 19 can be continuously cooled. The unloading plate 19 is tilted to allow the solder to slide to the third sealing cover, which is beneficial to the recovery of the solder.

[0065] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0066] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A mechanized removal device for components of waste circuit boards, comprising a housing (1), characterized in that: Also includes: An inner cylinder (16), the inner cylinder (16) being rotatably mounted in the outer shell (1), and having an outer wall of the inner cylinder (16) being uniformly provided with first leakage holes (35), having stirring blades (37) fixed at equal intervals on the outer side of the inner cylinder (16), and having an outer cylinder (17) being rotatably mounted on the outer side of the inner cylinder (16), having an inner wall of the outer cylinder (17) being a sloped structure, and having an outer wall of the outer cylinder (17) being uniformly provided with second leakage holes (36); A discharge plate (19), the discharge plate (19) being fixed in the housing (1) near the lower end, and a scraper (24) being slidably mounted on the discharge plate (19); A cooling bin (20), the cooling bin (20) being arranged at the bottom of the outer shell (1) and below the discharge plate (19), and heat conducting plates (21) being installed at equal intervals on the lower surface of the discharge plate (19); A transmission assembly, the transmission assembly being arranged on the back side of the outer shell (1) and being used to respectively drive the inner cylinder (16) and the outer cylinder (17) to rotate; A hot air input component, the hot air input component being arranged outside the outer shell (1) and being used to inject hot air into the inner cylinder (16) to accelerate the softening of solder on the surface of the circuit board; The transmission assembly comprises a transmission box (2) fixed to the outside of the outer shell (1); a hollow shaft (29) extending into the interior of the transmission box (2) is fixed to one end of the inner cylinder (16); and a shaft sleeve (30) rotatably connected to the hollow shaft (29) is fixed to the outside of the outer cylinder (17); One end of the shaft sleeve (30) extends into the transmission box (2) and is fixedly sleeved with a driven gear (31); a driven pulley (32) is fixedly sleeved on the outer side of the hollow shaft (29); A motor (27) is fixed in the transmission box (2), a rotating shaft (28) is installed at the output end of the motor (27), a driving gear (33) meshing with a driven gear (31) is fixedly provided on the outside of the rotating shaft (28), and a driving pulley (39) is fixedly sleeved on the outside of the rotating shaft (28) and located on one side of the driving gear (33), and a synchronous transmission belt (34) is installed between the driving pulley (39) and the driven pulley (32); The hot gas input component comprises an inert gas tank (8) fixed to one side of the housing (1) and a heating component arranged outside the housing (1) and used for heating the output gas of the inert gas tank (8); The output end of the inert gas tank (8) is provided with a first gas pipe (9), the first gas pipe (9) is in communication with the input end of the heating component, the input end of the heating component is connected with a second gas pipe (10), the output end of the second gas pipe (10) is provided with an air pump (15) fixed to the back side of the transmission box (2), the output end of the air pump (15) is rotatably connected to one end of the hollow shaft (29); One end of the hollow shaft (29) extends into the interior of the inner cylinder (16) to form an exhaust pipe, and pulse nozzles are arranged at equal intervals on the exhaust pipe; The heating assembly comprises a heating box (3) fixed to the outside of the housing (1), electric heating plates (26) being symmetrically mounted in the heating box (3), a heating tube (38) being arranged between the two electric heating plates (26), the heating tube (38) being of a zigzag structure, a first interface (14) connected to a first gas pipeline (9) being mounted on one side of the heating box (3), the first interface (14) being in communication with one end of the heating tube (38), and a second interface (13) connected to a second gas pipeline (10) being mounted on one side of the heating box (3), the second interface (13) being in communication with the other end of the heating tube (38); Control valves are installed on the outside of the second interface (13) and the first interface (14), and pressure gauges are also installed on the second interface (13) and the first interface (14); A fixing frame (22) is symmetrically fixed inside the outer shell (1), the fixing frame (22) is rotatably connected to the outer cylinder (17), and an arc-shaped cover (25) is installed between the two fixing frames (22). An exhaust gas processor (11) that penetrates the outer shell (1) is provided at the upper end of the arc-shaped cover (25), and an exhaust gas output pipe (12) is installed at the output end of the exhaust gas processor (11).

2. The mechanized removal device for components of waste circuit boards according to claim 1 is characterized by: A notch groove is provided at the lower end of the fixing frame (22), an electric telescopic cylinder (23) is fixed inside the notch groove, and the telescopic end of the electric telescopic cylinder (23) is fixedly connected to the scraper (24); A solder outlet adapted to the discharge plate (19) is provided on one side of the housing (1), and a third sealing cover is hingedly connected to the outer side of the solder outlet.

3. The mechanized removal device for components of waste circuit boards according to claim 2 is characterized in that: A circuit board insertion opening is provided on the outer side of the housing (1) at the position of the inner cylinder (16), and a second sealing cover (18) is hingedly connected to the circuit board insertion opening; An electronic component unloading passage (4) adapted to the outer cylinder (17) is provided on the outer side of the housing (1) below the circuit board input port, and a first sealing cover (5) is hingedly connected to the electronic component unloading passage (4).

4. The mechanized removal device for components of waste circuit boards according to claim 3 is characterized by: A refrigerant inlet pipe (6) is installed on the outer side of the shell (1) at one side of the cooling bin (20), and a refrigerant outlet pipe (7) is installed on the outer side of the shell (1) at the other side of the cooling bin (20).

5. A mechanized removal device for waste circuit board components according to any one of claims 1 to 4, characterized in that: The inner wall of the outer shell (1) is provided with a heat-insulating layer, and a temperature sensor is installed inside the outer shell (1).

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