Chip package conveying and collecting device

Abstract

A chip package conveying and collecting device relates to the field of chip production, comprising: a base, with multiple partitions at one end and support frames at both sides of the other end; a bearing mechanism, including multiple temporary storage paths at one end of the partition and bearing plates respectively arranged between the partitions, multiple movable first push rods are arranged above the bearing plates, and multiple movable second push rods are arranged in the temporary storage path for pushing the chip package; a transfer mechanism, including two transfer frames respectively arranged in the support frame, multiple collection frames are arranged in the vertical direction in the transfer frame, and multiple grooves are arranged in a rectangular array in the collection frame, and a support plate is arranged in the groove for storing the chip package, and push frames and push rods are respectively arranged on the upper and lower sides of the base between the transfer frames, and the push frame moves along the width direction of the base for pushing the collection frame, and the push rod moves along the vertical direction for lifting the support plate and placing it in the temporary storage path. It can simultaneously convey and collect multiple chip packages and arrange them neatly for easy detection.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a chip package conveying and collecting device. Background Art

[0002] In the production process of the chip, especially after the chip is plastic-sealed, the plastic-sealed frame needs to be placed in a rib punching and forming device to perform a rib punching operation on it, so as to cut off the pins of the chip package, so that the chip package becomes a single state, and then the pins are bent by a foot-cutting forming device to meet the assembly needs. In the prior art, in order not to affect the efficiency of pin bending after the chip package is formed, the chip package is usually pushed away directly so that it falls directly into the collection frame. During the falling process of the chip package, the pins of the chip package may be bent due to impact, thereby causing the product quality to deteriorate; and each chip package needs to be tested after the pins are bent. If the pins of the chip package are bent again after the chip package is formed, it will cause deviations in the test of the chip package; and after the chip package falls into the collection frame, it is in a messy state. When testing it, it is necessary to pick it out one by one and place it in the testing equipment, which is not conducive to improving the detection efficiency, and when picking up the chip package, the pins of the chip package may pull each other, thereby causing pin damage. Summary of the invention

[0003] In view of the above-mentioned deficiencies of the related prior art, the present application provides a chip package conveying and collecting device, which can convey and collect multiple chip packages at the same time and arrange them neatly for easy detection, and has strong practicality.

[0004] In order to achieve the above object, the present invention adopts the following technologies:

[0005] A chip package conveying and collecting device comprises a base, a bearing mechanism and a transfer mechanism.

[0006] A plurality of partition plates are arranged on the top surface of one end of the base along its width direction, and support frames are arranged on both sides of the length direction of the other end; the bearing mechanism includes a plurality of temporary storage paths arranged at one end of the partition plates and a plurality of bearing plates respectively arranged between the partition plates and moving in the vertical direction, the length directions of the temporary storage paths and the bearing plates are parallel to the length direction of the base, a plurality of first push rods moving along the length direction are arranged above the bearing plates, which are used to push the chip package from the bearing plates to the temporary storage paths, and a plurality of second push rods moving along the length direction are arranged in the temporary storage paths along their length directions, which are used to push the chip packages and arrange them at intervals; the transfer mechanism includes two transfer frames respectively arranged in the support frames, a plurality of collection frames are arranged in the vertical direction in the transfer frames, a push plate is arranged on one of the support frames, which is used to push the collection frame to the base, a plurality of grooves are arranged in a rectangular array in the collection frame, and a support plate is arranged in the groove for storing the chip package, and a push frame and a push rod respectively located on the upper and lower sides of the base are arranged between the two transfer frames, the push frame moves along the width direction of the base, which is used to push the collection frame, and the push rod moves along the vertical direction, which is used to lift the support plate and place it in the temporary storage path.

[0007] Furthermore, the carrying plate is installed on the lifting frame, the lifting frame is slidably installed on the partition plate and moves in the vertical direction, sliding grooves are provided on both sides of the length direction of the lifting frame, guide rods are provided in the sliding grooves, support rods are sleeved on the guide rods, and rotating rods are rotatably installed between the support rods. Both ends of the rotating rods are slidably fitted in the vertical grooves of the moving rods, and the moving rods move along the length direction of the base, and the first push rod is installed on the rotating rod. The first push rod is L-shaped, and the horizontal end faces the temporary storage path.

[0008] Furthermore, offset rods are installed at both ends of the rotating rod, and protrusions are provided on both sides of the lifting frame in the length direction. The protrusions are located at the end of the lifting frame away from the temporary storage path. When used, the offset rod contacts the upper end of the protrusion.

[0009] Furthermore, the bearing mechanism also includes a mounting frame arranged above the temporary storage path and moving in the vertical direction, sliding bars are arranged on both sides of the mounting frame along its length direction, a plurality of cross bars are sleeved between the sliding bars, a second push rod is installed on the bottom surface of the cross bar, a plurality of first springs are also sleeved on the sliding bar, the first springs are respectively located between the two cross bars and are always in a compressed state, a push ring is sleeved on the sliding bar, the push ring is connected to the moving end of the telescopic rod, and is used to abut against the side of a cross bar farthest from the center of the base, the telescopic rod is installed on the mounting frame, the cross bar closest to the center of the base is also sleeved on the connecting rod, the end of the connecting rod close to the push ring is installed on the thrust plate, the thrust plate is installed on the mounting frame, the connecting rod is also sleeved with a top block, the top block is located on the side of the cross bar closest to the bearing plate away from the push ring, and is connected to the moving end of the horizontal linear mechanism for pushing the cross bar, and the horizontal linear mechanism is installed on the mounting frame.

[0010] Furthermore, a bearing frame is provided above the base, and a plurality of limiting grooves are provided along the length direction of the bearing frame, and the temporary storage path is slidably matched in the limiting grooves.

[0011] Furthermore, a lifting plate is provided in the transfer frame for supporting the collection frame. The transfer frame and the four corners of the support frame are provided with through holes that pass through from top to bottom. When in use, a top plate is passed through the through holes, and the top plate is installed on a bracket that moves in the vertical direction.

[0012] Furthermore, the push frame is L-shaped, with the short end facing the center of the base, a block is passed through the side of the long end of the push frame, the side of the block away from the center of the push frame is arc-shaped, and a first baffle is provided at the end located on the outside of the push frame, and a first support rod is provided on the side of the first baffle, the first support rod is passed through the side frame, and the side frame is installed on the outside of the push frame, and a second spring is sleeved on the first support rod, and both ends of the second spring are respectively abutted against the first baffle and the side frame, and are always in a compressed state.

[0013] Furthermore, a plurality of long grooves are provided on the top surface of the collection frame along its length and width directions, the long grooves all pass through the grooves, and the depth of the long grooves is greater than the depth of the grooves, and a connecting frame is matched in the long grooves, and the support plate is installed on the connecting frame. When used, the top rod passes through the collection frame and contacts the bottom of the connecting frame, and the top rod is installed on the bottom frame, and the bottom frame is connected to the moving end of the vertical lifting mechanism, and the vertical lifting mechanism is installed at the bottom of the base.

[0014] Furthermore, a U-shaped plate is provided above one of the support frames, screws are passed through the four corners of the U-shaped plate, a connecting plate is provided at the bottom of the screw, the connecting plate is installed on the support frame, a third spring and a nut are sleeved on the screw, the nut and the third spring are respectively located on the upper and lower sides of the U-shaped plate, and the third spring is always in a compressed state, a pressure plate is also passed through the U-shaped plate, the pressure plate is U-shaped, and the lower end abuts against the upper end of the transfer frame, protruding rods are passed through both sides of the pressure plate, the protruding rods are installed on the U-shaped plate, a retaining ring is provided on the upper end of the protruding rod, a fourth spring is sleeved on the protruding rod, and the two ends of the fourth spring respectively abut against the pressure plate and the retaining ring, and are always in a compressed state.

[0015] Furthermore, a positioning block is passed through a side of the base close to the U-shaped plate, a side of the positioning block away from the center of the base is arc-shaped, and a second baffle is provided at the lower end, a second support rod is provided on the bottom surface of the second baffle, the second support rod is passed through the U-shaped frame, the U-shaped frame is installed on the bottom surface of the base, and a fifth spring is passed through the second support rod, the two ends of the fifth spring respectively abut against the U-shaped frame and the second baffle, and are always in a compressed state.

[0016] The beneficial effects of the present invention are as follows: a collection frame with a plurality of grooves in a rectangular array can collect a plurality of chip packages at the same time and arrange them neatly, thereby avoiding disorderly stacking of the chip packages and preventing them from being damaged; and after the chip packages are arranged in a rectangular array, it is also convenient to place them directly in a detection device and detect a plurality of chip packages at the same time, thereby greatly improving the detection efficiency; the chip packages can be transformed into a state of spaced arrangement by a second push rod, thereby facilitating their transfer to the collection frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0018] Figure 1 It is a three-dimensional schematic diagram of the overall structure of an embodiment of the present application.

[0019] Figure 2 It is a three-dimensional schematic diagram of the carrying mechanism of an embodiment of the present application.

[0020] Figure 3 for Figure 2 An enlarged schematic diagram of point A.

[0021] Figure 4 This is a schematic diagram of the installation of the first push rod of an embodiment of the present application.

[0022] Figure 5 for Figure 4 An enlarged schematic diagram of point B.

[0023] Figure 6 This is a bottom perspective schematic diagram of a rotating rod of an embodiment of the present application located at one end of a supporting plate.

[0024] Figure 7 This is a schematic diagram of the installation of the second push rod of an embodiment of the present application.

[0025] Figure 8 It is a three-dimensional schematic diagram of the transfer mechanism of an embodiment of the present application.

[0026] Fig. 9 It is a three-dimensional schematic diagram from the bottom view of the transfer mechanism of an embodiment of the present application.

[0027] Fig.10 It is a three-dimensional schematic diagram of a push rack according to an embodiment of the present application.

[0028] Fig.11 It is an exploded schematic diagram of the collection frame and the support plate of the embodiment of the present application.

[0029] Fig.12 This is a schematic diagram of the installation of a U-shaped plate according to an embodiment of the present application.

[0030] Description of reference numerals: 100—base, 200—carrying mechanism, 300—transfer mechanism, 101—partition plate, 102—support frame, 103—through hole, 104—U-shaped plate, 105—screw rod, 106—connecting plate, 107—third spring, 108—pressing plate, 109—convex rod, 110—fourth spring, 111—retaining ring, 112—positioning block, 113—second baffle plate, 114—second support rod, 115—U-shaped frame, 116—fifth spring, 201—temporary storage path, 202—carrying plate, 203—first push rod, 204—second push rod, 205—lifting frame, 206—slide groove, 207—guide rod, 208—support rod, 209—rotating rod, 21 0—mounting frame, 211—sliding rod, 212—cross rod, 213—first spring, 214—push ring, 215—telescopic rod, 216—connecting rod, 217—thrust plate, 218—top block, 219—carrying frame, 220—limiting groove, 221—offset rod, 222—protrusion, 223—moving rod, 301—transfer frame, 302—collection frame, 303—groove, 304—support plate, 305—push frame, 306—top rod, 307—lifting plate, 308—top plate, 309—bracket, 310—block, 311—first baffle, 312—first support rod, 313—side frame, 314—second spring, 315—long groove, 316—connecting frame, 317—bottom frame. DETAILED DESCRIPTION

[0031] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] like Figure 1-Figure 12 As shown, an embodiment of the present application provides a chip package conveying and collecting device, including: a base 100 , a carrying mechanism 200 , and a transfer mechanism 300 .

[0033] A plurality of partition plates 101 are provided on the top surface of one end of the base 100 along its width direction, and support frames 102 are provided on both sides of the length direction of the other end; the bearing mechanism 200 includes a plurality of temporary storage paths 201 provided at one end of the partition plates 101 and a plurality of carrier plates 202 respectively provided between the partition plates 101 and moving along the vertical direction, the length directions of the temporary storage paths 201 and the carrier plates 202 are parallel to the length direction of the base 100, and are used to carry chip packages, a plurality of first push rods 203 moving along the length direction are provided above the carrier plates 202, and are used to push the chip packages from the carrier plates 202 to the temporary storage paths 201, and a plurality of second push rods 204 moving along the length direction are provided in the temporary storage paths 201, and are used to push the chip packages and arrange them at intervals; the transfer mechanism The structure 300 includes two transfer frames 301 respectively arranged in the support frame 102, and a plurality of collection frames 302 are arranged in the transfer frame 301 along the vertical direction, one of the support frames 102 is provided with a push plate for pushing the collection frame 302 onto the base 100, and a plurality of grooves 303 are arranged in a rectangular array in the collection frame 302, and a support plate 304 is arranged in the groove 303 for storing the chip package body, and a push frame 305 and a push rod 306 are respectively arranged on the upper and lower sides of the base 100 between the two transfer frames 301, and the push frame 305 moves along the width direction of the base 100, and is used to push the collection frame 302 on the base 100 to the top of the transfer frame 301, and the push rod 306 moves along the vertical direction, and is used to lift the support plate 304 and make it located in the temporary storage channel 201.

[0034] Specifically, since the carrier plate 202 carries the main body of the chip package, and the pins of the chip package are located on both sides of the carrier plate 202, in order to facilitate pushing the chip package from the carrier plate 202 to the temporary storage lane 201, the top surface of the carrier plate 202 should be higher than the bottom surface of the temporary storage lane 201, and in order to accommodate chip packages of different sizes, the height of the carrier plate 202 should be adjustable. Figure 1 , Figure 2 , Figure 4 As shown, the carrying plate 202 is installed on the lifting frame 205, and the lifting frame 205 is slidably installed on the partition plate 101 and moves in the vertical direction. The lifting frame 205 can be connected to the moving end of a vertical lifting mechanism, and the lifting frame 205 can be moved up and down by driving the vertical lifting mechanism, or the lifting frame 205 can be mounted on a screw rod, and two nuts are mounted on the screw rod, so that the two nuts are respectively located on both sides of the lifting frame 205, and the height of the carrying plate 202 can be adjusted by rotating the nuts.

[0035] More specifically, Figure 2 , Figure 4-Figure 6As shown, both sides of the lifting frame 205 in the length direction are provided with slide grooves 206, and guide rods 207 are provided in the slide grooves 206. Support rods 208 are sleeved on the guide rods 207. A rotating rod 209 is rotatably installed between the support rods 208. The two ends of the rotating rod 209 are slidably matched in the vertical grooves of the moving rods 223. When the carrier plate 202 needs to move up and down according to the size of the chip package body, the rotating rod 209 will also move in the vertical grooves of the moving rod 223 to avoid interference between the rotating rod 209 and the moving rod 223. The moving rod 223 moves along the length direction of the base 100. The movable rod 223 can be connected to the movable end of a horizontal linear mechanism, and the movable rod 223 is driven to move by the horizontal linear mechanism. The first push rod 203 is installed on the rotating rod 209. The first push rod 203 is L-shaped, and the horizontal end faces the temporary storage path 201. When the chip package on the carrier plate 202 needs to be pushed into the temporary storage path 201, the movable rod 223 is driven to move toward the temporary storage path 201 by the horizontal linear mechanism, and the rotating rod 209 is driven to move together, so that the first push rod 203 can push the chip package into the temporary storage path 201.

[0036] Specifically, Figure 4 , Figure 5 As shown, when the chip package is moved onto the carrier plate 202, the first push rod 203 will block the smooth movement of the chip package. Therefore, in order to ensure that the chip package can be smoothly moved onto the carrier plate 202, offset rods 221 are installed at both ends of the rotating rod 209, and protrusions 222 are provided on both sides of the lifting frame 205 in the length direction. The protrusion 222 is located at the end of the lifting frame 205 away from the temporary storage path 201. When the rotating rod 209 moves in a direction away from the temporary storage path 201, the offset rod 221 contacts the upper end of the protrusion 222. As the rotating rod 209 continues to move, the rotating rod 209 will rotate under the support of the protrusion 222, so that the lower end of the first push rod 203 is higher than the top surface of the carrier plate 202 by a certain distance, and the chip package can enter the carrier plate 202 from below the first push rod 203.

[0037] Specifically, Figure 2 As shown, a carrier frame 219 is provided above the base 100, and a plurality of limiting grooves 220 are provided along the length direction of the carrier frame 219. The temporary storage channel 201 is slidably fitted in the limiting grooves 220, so as to facilitate replacement of the temporary storage channel 201 according to chip packages of different sizes.

[0038] Specifically, Figure 1 , Figure 2 , Figure 7 , Fig.11As shown, the carrying mechanism 200 also includes a mounting frame 210 disposed above the temporary storage path 201 and moving in the vertical direction. The mounting frame 210 can also be connected to a moving end of a vertical lifting mechanism, and the mounting frame 210 is driven to move up and down by the vertical lifting mechanism, so as to avoid the second push rod 204 blocking the smooth movement of the chip package when it is pushed into the temporary storage path 201. Slide bars 211 are provided on both sides of the mounting frame 210 along its length direction, and a plurality of cross bars 212 are sleeved between the slide bars 211. The second push rod 204 is installed on the bottom surface of the cross bar 212. The slide bar 211 is also sleeved with a plurality of first springs 213, and the first springs 213 are respectively Located between the two cross bars 212 and always in a compressed state, the slide bar 211 is sleeved with a push ring 214, the push ring 214 is connected to the moving end of the telescopic rod 215, and is used to abut against the side of a cross bar 212 farthest from the center of the base 100, the telescopic rod 215 is installed on the mounting frame 210, the cross bar 212 closest to the center of the base 100 is also sleeved on the connecting rod 216, and the end of the connecting rod 216 close to the push ring 214 is installed on the thrust plate 217, and the thrust plate 217 is installed on the mounting frame 210. The connecting rod 216 is also sleeved with a top block 218, and the top block 218 is located away from the cross bar 212 closest to the bearing plate 202 One side of the push ring 214 is connected to the moving end of the horizontal linear mechanism, which is used to push the cross bar 212. The horizontal linear mechanism is installed on the mounting frame 210. When the chip package is already located on the temporary storage path 201, the support plate 304 is located in the temporary storage path 201, and the top surface of the support plate 304 is flush with the bottom surface inside the temporary storage path 201. At this time, the chip packages are in contact with each other, which is not convenient for transferring them to the collection frame 302. It is necessary to arrange the chip packages at intervals and evenly so that each chip package is located on a support plate 304. Then, the mounting frame 210 is driven downward by the vertical lifting mechanism to move the second push rod 204 downward. 04 enters the card slot on the surface of the chip package to push it, and then the horizontal linear mechanism drives the top block 218 to move toward the cross bar 212, thereby forcing the cross bar 212 to move until the chip package closest to the carrier plate 202 is located on the support plate 304. At this time, the cross bar will abut against the thrust plate 217, and then drive the moving end of the telescopic rod 215 to move, so that the push ring 214 moves in the direction away from the thrust plate 217 until the push ring 214 is located at one end of the slide bar 211. At this time, the cross bar 212 will move under the action of the first spring 213, thereby pushing the chip package to be located on a support plate 304 respectively.

[0039] Specifically, Figure 1 , Figure 8 , Fig. 9 , Fig.11As shown, the top surface of the collection frame 302 is provided with a plurality of long grooves 315 along its length and width directions, the long grooves 315 all pass through the grooves 303, and the depth of the long grooves 315 is greater than the depth of the grooves 303, and the long grooves 315 are matched with connecting frames 316, and the support plate 304 is installed on the connecting frames 316. When used, the top rod 306 passes through the collection frame 302 and contacts with the bottom of the connecting frames 316, and the top rod 306 is installed on the bottom frame 317, and the bottom frame 317 is connected to the moving end of the vertical lifting mechanism. The vertical lifting mechanism is installed at the bottom of the base 100, and the bottom frame 317 can be driven to move upward by the vertical lifting mechanism, so that the top rod 306 moves upward and lifts the connecting frames 316 in the long grooves 315 until the support plate 304 enters the temporary storage channel 201.

[0040] Specifically, Figure 8-Figure 9 As shown, in order to facilitate the transfer of the collection frame 302 to the base 100, and to transfer the collection frame 302 carrying the chip package body to another transfer frame 301, a lifting plate 307 is also provided in the transfer frame 301 for supporting the collection frame 302. The four corners of the transfer frame 301 and the support frame 102 are provided with through holes 103 that penetrate up and down. When the transfer frame 301 is placed on the support frame 102, a top plate 308 is penetrated in the through holes 103 of the support frame 102. The top plate 308 is installed on a bracket 309 that moves in the vertical direction, and the bracket 309 can be connected to a vertical The moving end of the straight lifting mechanism can drive the bracket 309 to move up and down, so that the top plate 308 can move upward and lift the lifting plate 307 until the collection frame 302 at the top is completely above the transfer frame 301, so that the collection frame 302 can be pushed onto the base 100 through the push plate. When the collection frame 302 on the base 100 needs to be pushed to another transfer frame 301, the lifting plate 307 in the other transfer frame 301 is made flush with the top surface of the base 100, and then the lifting plate 307 is lowered by the thickness of one collection frame 302.

[0041] Specifically, Figure 1 , Figure 8 , Fig.10As shown, in the process of using the push frame 305 to push the collection frame 302 on the base 100 to the transfer frame 301, in order to prevent the collection frame 302 from shifting, the push frame 305 is designed to be L-shaped, with the short end facing the center of the base 100, and the side of the long end of the push frame 305 is penetrated with a block 310, so as to limit the two ends of the collection frame 302. When the push frame 305 pushes the collection frame 302 on the base 100 to the top of the transfer frame 301, the lifting plate 307 moves downward, so that the collection frame 302 can be moved out of the push frame 305. At this time, the push frame 305 can be reset to carry out subsequent operations. In order to enable the collection frame 302 to smoothly enter the push frame 305, the side of the block 310 away from the center of the push frame 305 is set to an arc shape, and the end located on the outside of the push frame 305 is set There is a first baffle plate 311, and a first support rod 312 is provided on the side of the first baffle plate 311. The first support rod 312 is penetrated on the side frame 313, and the side frame 313 is installed on the outside of the push frame 305. A second spring 314 is sleeved on the first support rod 312. The two ends of the second spring 314 are respectively abutted against the first baffle plate 311 and the side frame 313, and are always in a compressed state. When the collection frame 302 is pushed from the transfer frame 301 to the base 100, the collection frame 302 will contact the arc surface of the block 310. As the collection frame 302 continues to move, the block 310 will be forced to move, and the second spring 314 will be further compressed until the collection frame 302 completely enters the push frame 305. Then, the block 310 will pop out under the action of the second spring 314, thereby limiting the collection frame 302.

[0042] Specifically, Figure 1 , Figure 8 , Fig.12As shown, in order to prevent the lifting plate 307 from moving too far upward, a U-shaped plate 104 is further provided above one of the support frames 102 for contacting the top of the collection frame 302. Screws 105 are passed through the four corners of the U-shaped plate 104. A connecting plate 106 is provided at the bottom of the screw 105. The connecting plate 106 is mounted on the support frame 102. A third spring 107 and a nut are sleeved on the screw 105. The nut and the third spring 107 are respectively located on the upper and lower sides of the U-shaped plate 104, and the third spring 107 is always in a compressed state. According to the thickness of the collection frame 302, the distance between the U-shaped plate 104 and the support frame 102 can be adjusted by turning the nut. A pressing plate 108 is also passed through the U-shaped plate 104. The pressing plate 108 8 is U-shaped, and the lower end abuts against the upper end of the transfer frame 301, which is used to limit the circumference of the collection frame 302 to prevent the collection frame 302 from shifting due to equipment vibration after it is located above the transfer frame 301. Both sides of the pressure plate 108 are penetrated by convex rods 109, and the convex rods 109 are installed on the U-shaped plate 104. A retaining ring 111 is provided on the upper end of the convex rod 109, and a fourth spring 110 is sleeved on the convex rod 109. The two ends of the fourth spring 110 respectively abut against the pressure plate 108 and the retaining ring 111, and are always in a compressed state. Under the action of the fourth spring 110, the pressure plate 108 always has a tendency to move downward, and even if the U-shaped plate 104 moves upward, it can ensure that the lower end of the pressure plate 108 is in contact with the transfer frame 301.

[0043] Specifically, Figure 3 , Figure 8 As shown, in order to further improve the transfer efficiency, when the collection frame 302 on the base 100 is transferred to the transfer frame 301, the collection frame 302 in another transfer frame 301 can be pushed onto the base 100 simultaneously. However, when the push frame 305 moves toward the base 100, the collection frame 302 on the base 100 will be pushed back. Therefore, a positioning block 112 is provided on one side of the base 100 close to the U-shaped plate 104. The side of the positioning block 112 away from the center of the base 100 is arc-shaped, and a second baffle 113 is provided at the lower end. The bottom surface of the second baffle 113 is provided with a second support rod 114. The second support rod 114 is provided on the U-shaped frame 115. The U-shaped frame 115 is installed on the bottom surface of the base 100. A fifth spring 116 is provided on the rod 114, and the two ends of the fifth spring 116 are respectively abutted against the U-shaped frame 115 and the second baffle 113, and are always in a compressed state. When the collection frame 302 in the transfer frame 301 is pushed onto the base 100, the collection frame 302 will contact the arc surface of the positioning block 112, thereby forcing the positioning block 112 to move downward until the positioning block 112 is completely located in the base 100. After the collection frame 302 has completely passed the positioning block 112, the positioning block 112 will pop out under the action of the fifth spring 116, thereby limiting the side of the collection frame 302. Even if the push frame 305 moves back, the collection frame 302 will not be pushed to move together due to the obstruction of the positioning block 112.

[0044] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention.

Claims

1. A chip package conveying and collecting device, characterized in that: include: A base (100) having a top surface at one end provided with a plurality of partition plates (101) along its width direction, and a support frame (102) provided on both sides of the other end in the length direction; The carrying mechanism (200) comprises a plurality of temporary storage paths (201) provided at one end of the partition plate (101) and a plurality of carrying plates (202) respectively provided between the partition plates (101) and movable in a vertical direction, wherein the length directions of the temporary storage paths (201) and the carrying plates (202) are parallel to the length direction of the base (100), a plurality of first push rods (203) movable in the length direction thereof are provided above the carrying plates (202) and are used to push chip packages from the carrying plates (202) into the temporary storage paths (201), and a plurality of second push rods (204) movable in the length direction thereof are provided in the temporary storage paths (201) and are used to push chip packages and arrange them at intervals; The transfer mechanism (300) comprises two transfer frames (301) respectively arranged in the support frame (102), wherein a plurality of collection frames (302) are arranged in the transfer frame (301) along the vertical direction, wherein a push plate is arranged on one of the support frames (102) for pushing the collection frame (302) onto the base (100), wherein a plurality of grooves (303) are arranged in a rectangular array in the collection frame (302), wherein a support plate (304) is arranged in the groove (303) for storing chip packages, wherein a push frame (305) and a push rod (306) are respectively arranged on the upper and lower sides of the base (100), wherein the push frame (305) is arranged to move along the width direction of the base (100) for pushing the collection frame (302), and wherein the push rod (306) is arranged to move along the vertical direction for lifting the support plate (304) and placing it in the temporary storage path (201); The bearing mechanism (200) further comprises a mounting frame (210) which is arranged above the temporary storage path (201) and moves in a vertical direction. Slide bars (211) are arranged on both sides of the mounting frame (210) along the length direction thereof. A plurality of cross bars (212) are sleeved between the slide bars (211). The second push rod (204) is mounted on the bottom surface of the cross bar (212). A first spring (213) is arranged between two adjacent cross bars (212). The first spring (213) is sleeved on the slide bar (211) and is always in a compressed state. The two outermost cross bars (212) are arranged to move along the axis of the slide bar (211).

2. The chip package conveying and collecting device according to claim 1, characterized in that: The carrying plate (202) is mounted on a lifting frame (205), and the lifting frame (205) is slidably mounted on the partition plate (101) and is arranged to move in a vertical direction. Slide grooves (206) are arranged on both sides of the length direction of the lifting frame (205), and guide rods (207) are arranged in the slide grooves (206). Support rods (208) are sleeved on the guide rods (207). A rotating rod (209) is rotatably mounted between the support rods (208). Both ends of the rotating rod (209) are slidably matched in the vertical grooves of the moving rods (223), and the moving rod (223) is arranged to move in the length direction of the base (100). The first push rod (203) is mounted on the rotating rod (209), and the first push rod (203) is L-shaped, and the horizontal end faces the temporary storage path (201).

3. The chip package conveying and collecting device according to claim 2, characterized in that: Deflection rods (221) are installed at both ends of the rotating rod (209), and protrusions (222) are provided on both sides of the lifting frame (205) in the length direction. The protrusions (222) are located at one end of the lifting frame (205) away from the temporary storage path (201). When in use, the deflection rod (221) contacts the upper end of the protrusion (222).

4. The chip package conveying and collecting device according to claim 1, characterized in that: A bearing frame (219) is provided above the base (100); the bearing frame (219) is provided with a plurality of limiting grooves (220) along its length direction; the temporary storage path (201) is slidably engaged in the limiting grooves (220).

5. The chip package conveying and collecting device according to claim 1, characterized in that: The transfer frame (301) is provided with a lifting plate (307) for supporting the collection frame (302); the transfer frame (301) and the support frame (102) are provided with through holes (103) extending vertically therethrough at four corners; when in use, a top plate (308) is passed through the through holes (103); the top plate (308) is mounted on a bracket (309) that moves in a vertical direction.

6. The chip package conveying and collecting device according to claim 1, characterized in that: The push frame (305) is L-shaped, with the short end facing the center of the base (100); a block (310) is passed through the side of the long end of the push frame (305); the side of the block (310) away from the center of the push frame (305) is arc-shaped, and a first baffle (311) is provided at one end located outside the push frame (305); a first support rod (312) is provided on the side of the first baffle (311); the first support rod (312) is passed through a side frame (313); the side frame (313) is installed on the outside of the push frame (305); a second spring (314) is sleeved on the first support rod (312); two ends of the second spring (314) are respectively abutted against the first baffle (311) and the side frame (313), and are always in a compressed state.

7. The chip package conveying and collecting device according to claim 1, characterized in that: The top surface of the collection frame (302) is provided with a plurality of long grooves (315) along its length and width directions. The long grooves (315) all pass through the grooves (303), and the depth of the long grooves (315) is greater than the depth of the grooves (303). A connecting frame (316) is matched in the long grooves (315). The support plate (304) is installed on the connecting frame (316). When in use, the top rod (306) passes through the collection frame (302) and contacts the bottom of the connecting frame (316). The top rod (306) is installed on a bottom frame (317). The bottom frame (317) is connected to the movable end of a vertical lifting mechanism. The vertical lifting mechanism is installed at the bottom of the base (100).

8. The chip package conveying and collecting device according to claim 1, characterized in that: A U-shaped plate (104) is further provided above one of the support frames (102), screw rods (105) are provided at four corners of the U-shaped plate (104), a connecting plate (106) is provided at the bottom of the screw rod (105), the connecting plate (106) is mounted on the support frame (102), a third spring (107) and a nut are sleeved on the screw rod (105), the nut and the third spring (107) are respectively located on the upper and lower sides of the U-shaped plate (104), and the third spring (107) is always in a compressed state. The U-shaped plate (104) 04), a pressure plate (108) is also provided on the pressure plate (108), the pressure plate (108) is U-shaped, and the lower end thereof abuts against the upper end of the transfer frame (301), convex rods (109) are provided on both sides of the pressure plate (108), the convex rods (109) are installed on the U-shaped plate (104), a retaining ring (111) is provided on the upper end of the convex rod (109), a fourth spring (110) is sleeved on the convex rod (109), the two ends of the fourth spring (110) respectively abut against the pressure plate (108) and the retaining ring (111), and are always in a compressed state.

9. The chip package conveying and collecting device according to claim 8, characterized in that: A positioning block (112) is provided on a side of the base (100) close to the U-shaped plate (104); a side of the positioning block (112) away from the center of the base (100) is arc-shaped, and a second baffle (113) is provided at the lower end; a second support rod (114) is provided on the bottom surface of the second baffle (113); the second support rod (114) is provided on a U-shaped frame (115); the U-shaped frame (115) is mounted on the bottom surface of the base (100); a fifth spring (116) is provided on the second support rod (114); two ends of the fifth spring (116) are respectively abutted against the U-shaped frame (115) and the second baffle (113), and are always in a compressed state.

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