A nanopore detection system and a heat dissipation method for a nanopore detector

Abstract

The present invention belongs to the field of biological detection technology, and specifically relates to a nanopore detection system and a heat dissipation method for a nanopore detector, wherein the detection system includes a detection body, a lower shell detachably connected to the detection body, and an upper cover rotatably arranged on the detection body; the detection body includes a mounting plate, a first surface of the mounting plate is provided with a mounting position for installing a chip, a first adapter plate and a second adapter plate are symmetrically arranged on both sides of the mounting position, the first adapter plate and the second adapter plate are connected to the chip through connector springs, a main control board is detachably arranged on the second surface of the mounting plate through a connecting plate, at least two first connectors are arranged on the second surface of the mounting plate, and at least two second connectors corresponding to the first connectors are arranged on the main control board; this scheme adopts a "reverse installation" structure, which effectively improves the production and assembly efficiency while reducing the production cost.

Description

Technical Field

[0001] The invention belongs to the technical field of biological detection, and in particular relates to a nanopore detection system and a heat dissipation method of a nanopore detector. Background Art

[0002] Nanopore detector is an advanced biomedical engineering application that uses nanopore technology for gene sequencing and single-molecule detection. Nanopore detectors are mainly divided into two types: biological nanopores and solid-state nanopores. Through its unique technology and applications, it plays an important role in gene sequencing, single-molecule detection and other fields, and provides new tools and methods for life science research and clinical medicine.

[0003] When using the nanopore detector, the chip needs to be placed on the detection instrument and fixed before the detection can be carried out. However, most of the current chip fixing devices only apply unidirectional force to the clamping devices when fixing, which makes the reliability of fixing and sealing low, affecting the accuracy of the experiment. A few clamping devices connected by bolts do not have positioning devices, and the bolts are likely to be misaligned during installation, causing the solution in the liquid pool to flow out from between the two liquid pools after the device is fixed. At the same time, the inconvenience of bolt installation is also a major problem.

[0004] There are two known ways to place the chip in sequencers: one is to build the chip into the entire instrument, which can effectively shield the signal but is inconvenient to operate; the other is to raise the chip above the operating platform, which may cause interference to a certain extent.

[0005] In addition, in order to pursue a small size while being able to detect high-throughput chips, the nanopore detector in the prior art will use a highly integrated main control chip for data acquisition and data processing. However, the high-integration main control chip is expensive, making the cost of the entire device as high as tens of millions. For example, Chinese invention patent application number 201510378422.7 discloses a high-throughput gene sequencing dynamic scheduling control method and system device. Since high-throughput gene sequencing has high precision requirements in the entire sequencing process, the equipment in this solution will also be more complex and costly.

[0006] However, for small businesses and public service testing and medical institutions, the cost is too high, and the number of channels of chips used by small businesses and public service testing and medical institutions is usually around three hundred, and there is no need to design too many testing chips with a higher number of channels. Therefore, there is a need to provide a low-cost testing device that is more suitable for small businesses and public service institutions. Summary of the invention

[0007] The purpose of the present invention is to provide a nanopore detection system and a heat dissipation method for a nanopore detector to partially alleviate or solve at least one of the above-mentioned problems, and to provide a low-cost detection device that is more suitable for small enterprises and public service agencies, and has high production efficiency and is convenient for later debugging and maintenance of the detector.

[0008] In order to solve the above-mentioned technical problems, the present invention specifically adopts the following technical solutions:

[0009] A first aspect of the present invention is to provide a nanopore detection system, including a nanopore detector, wherein the nanopore detector includes a detection body, a lower shell detachably connected to the detection body, and an upper cover rotatably arranged on the detection body; the detection body includes a mounting plate, a first surface of the mounting plate is provided with a mounting position for mounting a chip, a first adapter plate and a second adapter plate are symmetrically arranged on both sides of the mounting position, and the first adapter plate and the second adapter plate are connected to the chip through a connector spring. The main control board is detachably provided on the second surface of the mounting plate through a connecting plate with a concave cross-section, and at least two first connectors are symmetrically provided on the second surface of the mounting plate about the mounting position, and at least two second connectors corresponding to the first connector are provided on the main control board; when the pins on the bottom sides of multiple PCB boards are respectively inserted into the second connectors to be electrically connected to the main control board, the connecting plate is installed on the mounting plate so that the pins on the top side of the PCB board are inserted into the first connector; an air inlet is provided on the front side wall of the lower shell body in an area corresponding to the main control board, and at least two air outlets are provided on the rear side wall of the lower shell body in an area corresponding to the PCB board, the horizontal plane position of the air outlet is higher than the horizontal plane position of the air inlet, and a fan for extracting hot air in the shell body is provided at the air outlet. ; The nanopore detection system also includes: a user interaction module that communicates data with the main control board, for allowing the user to select a working mode and input the number of channels of the sequencing chip currently undergoing batch testing; wherein the main control board includes: a database for storing the channel number groupings and their corresponding heat dissipation schemes obtained in advance through preliminary experiments; the control strategies corresponding to the heating stage and the target constant temperature stage, as well as the start timing of the corresponding control strategy in the heating stage, and the adjustment timing of switching from the control strategy in the heating stage to the control strategy in the target constant temperature stage; a heat dissipation scheme matching module, for matching the corresponding channel number groupings and their corresponding heat dissipation schemes in the database according to the number of channels input by the user after the user selects the batch test working mode; a fan control module for controlling the operation of two fans according to the matched heat dissipation scheme.

[0010] As an improvement, a fixing plate is further provided on the first surface of the mounting plate, the first adapter plate and the second adapter plate are located between the fixing plate and the mounting plate, and the fixing plate is provided with through holes corresponding to the mounting positions.

[0011] As an improvement, a locking mechanism is provided on the fixed plate, and the locking mechanism includes a pressing piece, a first side of the pressing piece is rotatably provided on the fixed plate via a first rotating shaft, a second side of the pressing piece is movably provided with a buckling piece via a second rotating shaft, and a first end of the buckling piece is fixed to the pressing piece via an elastic piece; correspondingly, a fixing buckle cooperating with the buckling piece is provided on the fixed plate; when the locking mechanism is in a closed state, the pressing piece and the mounting position jointly form a clamping structure for clamping the chip, and at the same time the buckling piece hooks the fixing buckle; when the first end of the buckling piece is pressed, the second end of the buckling piece rotates around the second rotating shaft, and then disengages from the fixing buckle, so that the locking mechanism can be opened.

[0012] As an improvement, a torsion spring is also provided on the first rotating shaft, and the two ends of the torsion spring are respectively fixed to the clamping member; when the locking mechanism is in a closed state, the torsion spring is in a compressed state; when the first end of the buckle is pressed, the buckle is disengaged from the fixing buckle, and the torsion spring returns to its initial state, thereby driving the clamping member back to an open state.

[0013] As an improvement, a spring pin is provided on the clamping member, and the locking mechanism, the spring pin and the fixing plate are all made of metal; when the locking mechanism is in a closed state, the free end of the spring pin abuts against the fixing buckle, so that a conductor is formed between the locking mechanism and the fixing plate.

[0014] As an improvement, the height of the mounting position is smaller than the thickness of the chip, so that when the locking mechanism is in a locked state, the first surface of the pressing member abuts against the first surface of the chip.

[0015] As an improvement, a first magnetic block is disposed on the upper cover, and a magnetic metal piece cooperating with the first magnetic block is disposed on the fixing plate.

[0016] A second aspect of the present invention is to provide a heat dissipation method for a nanopore detector, wherein the nanopore detector is the nanopore detector in the above-mentioned nanopore detection system, and the heat dissipation method specifically comprises the steps of:

[0017] S101 obtains the number of channels of the sequencing chips for batch detection in the current batch input by the user; S102 matches the corresponding channel number group and its corresponding heat dissipation scheme in the database according to the channel number, and controls the operation of two fans in the nanopore detector according to the matched heat dissipation scheme; wherein the channel number group and its corresponding heat dissipation scheme are obtained in advance through preliminary experiments, specifically, including the steps of:

[0018] S201 inputs the number of channels i for the first batch of batch testing according to the preset batch testing plan; S202 monitors the temperatures T11, T12, T13, T14 of the four PCB boards and the temperature T2 of the main board in the nanopore detector in real time; S203 determines whether the maximum temperature value Tmax{T11, T12, T13, T14, T2} among the five temperature values ​​is greater than or equal to the preset minimum temperature threshold T0i of the heating stage, if so, executes step S204; otherwise, executes step S202; S204 starts the fan for cooling, and controls the fan operation according to the preset control strategy, and records the minimum temperature threshold T0 of the corresponding heating stage. i at the first moment t1, execute step S205; S205 determines whether the maximum temperature value Tmax{T11, T12, T13, T14, T2} of the five temperature values ​​monitored in real time tends to be stable, if so, it is determined that the current target constant temperature stage is reached, and execute step S206; otherwise, continue to monitor and execute step S205 until it is determined that the target constant temperature stage is reached; S206 obtains the current control strategy, and records the second moment t2 when the minimum temperature threshold T0i' of the target constant temperature stage is reached; S207 repeats the above steps S201 to S206 until the corresponding working temperature curve and the corresponding heat dissipation scheme for batch testing of sequencing chips of each channel number are obtained; the heat dissipation scheme includes the control strategy of the heating stage and the minimum temperature threshold T0i' i, and the control strategy for the target constant temperature stage and the second moment t2 corresponding to the minimum temperature threshold T0i'; S208 arranges the first moments t1 corresponding to the sequencing chips with different numbers of channels in order from large to small; S209 groups multiple first moments t1 according to a preset interval threshold to obtain multiple groups; S210 uses the smallest first moment t1 in each group as the timing for turning on the fan corresponding to the heating stage when the sequencing chips with all the channels in the corresponding group are batch tested, and uses the control strategy with the smallest time interval between the first moment t1 and the second moment t2 in the corresponding group as the control strategy corresponding to the heating stage when the sequencing chips with all the channels in the corresponding group are batch tested.

[0019] As an improvement, after executing step S204, the step is also included: S301 real-time judgment on whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the first preset temperature difference threshold value, and if so, increase the rotation speed of the two fans.

[0020] As an improvement, after executing step S206, the step is also included: S302 real-time judgment on whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the second preset temperature difference threshold value, and if so, increase the rotation speed of the two fans.

[0021] The third aspect of the present invention is to provide a nanopore detector, comprising a detection body, a lower shell detachably connected to the detection body, and an upper cover rotatably set on the detection body; the detection body comprises a mounting plate, the first surface of the mounting plate is provided with a mounting position for mounting a sequencing chip, and the first adapter plate and the second adapter plate are symmetrically arranged on both sides of the mounting position, and the first adapter plate and the second adapter plate are connected to the chip through connector springs; the second surface of the mounting plate is detachably provided with a main control board through a connecting plate with a concave cross-section, the second surface of the mounting plate is symmetrically provided with at least two first connectors about the mounting position, and at least two second connectors corresponding to the first connectors are arranged on the main control board; when the pins on the bottom side of multiple PCB boards are respectively inserted into the second connectors to be electrically connected to the main control board, the connecting plate is installed on the mounting board so that the pins on the top side of the PCB board are inserted into the first connector.

[0022] In some embodiments, an air inlet is provided in the area corresponding to the main control board on the front side wall of the lower shell, and an air outlet is provided in the area corresponding to the PCB board on the rear side wall of the lower shell, the horizontal plane position of the air outlet is higher than the horizontal plane position of the air inlet, and a fan for extracting hot air in the shell is provided at the air outlet. In some embodiments, the number of the PCB boards is four, and two are in a group, and the two groups are symmetrically arranged between the mounting plate and the main control board. In some embodiments, a fixing plate is also provided on the first surface of the mounting plate, the first adapter plate and the second adapter plate are located between the fixing plate and the mounting plate, and the fixing plate is provided with through holes corresponding to the mounting positions. In some embodiments, a locking mechanism is provided on the fixed plate, and the locking mechanism includes a pressing piece, a first side of the pressing piece is rotatably provided on the fixed plate via a first rotating shaft, a second side of the pressing piece is rotatably provided with a fastening piece via a second rotating shaft, and a first end of the fastening piece is fixed to the pressing piece via an elastic piece; correspondingly, a fixing buckle cooperating with the fastening piece is provided on the fixed plate; when the locking mechanism is in a locking state, the pressing piece and the mounting position jointly form a clamping structure for clamping the chip, and at the same time the fastening piece hooks the fixing buckle; when the first end of the fastening piece is pressed, the second end of the fastening piece rotates around the second rotating shaft, and then disengages from the fixing buckle, so that the locking mechanism can be opened. In some embodiments, a torsion spring is further provided on the first rotating shaft, and the two ends of the torsion spring are respectively fixed to the pressing member; when the locking mechanism is in a locked state, the torsion spring is in a compressed state; when the first end of the buckle is pressed, the buckle is disengaged from the fixing buckle, and the torsion spring returns to an initial state, thereby driving the pressing member back to an open state. In some embodiments, a spring pin is provided on the pressing member, and the locking mechanism, the spring pin and the fixing plate are all made of metal; when the locking mechanism is in a locked state, the free end of the spring pin abuts against the fixing buckle, so that a conductor is formed between the locking mechanism and the fixing plate. In some embodiments, the height of the mounting position is less than the thickness of the chip, so that when the locking mechanism is in a locked state, the first surface of the pressing member abuts against the first surface of the chip. In some embodiments, a first magnetic block is provided on the upper cover, and a magnetic metal member cooperating with the first magnetic block is provided on the fixing plate. In some embodiments, the main control board is horizontally arranged on the connecting plate.

[0023] A fourth aspect of the present invention is to provide a locking mechanism for a nanopore detector, wherein the detector comprises a fixing plate, a through hole corresponding to the chip mounting position of the detector is provided on the fixing plate, and a fixing buckle is also provided on the fixing plate; the locking mechanism comprises a pressing member, a first side of the pressing member is rotatably provided on the fixing plate via a first rotating shaft, a fastening member is movably provided on the second side of the pressing member via a second rotating shaft, a first end of the fastening member is fixed to the pressing member via an elastic member, and a groove for accommodating the second end of the fastening member is provided on the fixing buckle; when the pressing member is pressed, the fixing buckle is pressed against the fixing buckle and the fixing buckle is pressed against the fixing buckle. The pressing member rotates around the first rotating shaft, and makes the second end of the fastening member contact the side wall of the groove and rotate under the guidance thereof, and the elastic member is compressed at the same time; when the pressing member is pressed into place, the elastic member resets, driving the fastening member to reset, and the second end of the fastening member abuts against the inner wall of the groove, so that the pressing member and the mounting position together form a clamping structure for clamping the chip; when the first end of the fastening member is pressed, the elastic member is compressed, and the fastening member rotates around the second rotating shaft, so that the fastening member can be separated from the fixing buckle. In some embodiments, a torsion spring is sleeved on the first rotating shaft, and the two ends of the torsion spring are respectively fixed to the pressing member; when the locking mechanism is in a locked state, the torsion spring is in a compressed state; when the first end of the fastening member is pressed, the fastening member is separated from the fixing buckle, and the torsion spring returns to an initial state, thereby driving the pressing member back to an open state. In some embodiments, a spring pin is provided on the pressing member. In some embodiments, the locking mechanism, the spring pin and the fixing plate are all made of metal; when the locking mechanism is in a closed state, the free end of the spring pin abuts against the fixing buckle, so that a conductor is formed between the locking mechanism and the fixing plate. In some embodiments, the cross-section of the fastening piece is a lock hook shape that is approximately "C-shaped", and the second end of the fastening piece and the contact portion of the fixing buckle are designed as an inclined surface. In some embodiments, the groove includes a first groove arranged along the height direction of the sequencer, and a second groove formed by extending the first groove in the width direction of the sequencer, and an opening is arranged at the first end of the first groove. In some embodiments, the rotation angle range of the pressing member is 0°-90°. In some embodiments, the fastening member and the fixing buckle are made of stainless steel. In some embodiments, a shock-absorbing foam is arranged on the fixing plate, and the shock-absorbing foam is located at the first rotating shaft. In some embodiments, the height of the mounting position is less than the thickness of the chip, so that when the locking mechanism is in a locked state, the first surface of the pressing member abuts against the first surface of the chip.

[0024] The principle and beneficial effect of the present invention are: in order to meet the detection needs of small enterprises and public service agencies, this scheme proposes a low-cost detection system. This scheme adopts a "reverse installation" structure, so that during the assembly process, the PCB board is first inserted into the second connector to connect with the main control board, and then fixed to the mounting plate through the connecting plate, and connected to the first connector to form a pre-installed state, and then after the test and adjustment are completed, it is assembled with the lower shell to complete the assembly of the whole machine, which can greatly facilitate the production line work during production. On the premise of meeting its functions, it effectively improves the production assembly efficiency and reduces the production cost. At the same time, in the subsequent maintenance or overhaul process, it only needs to remove the lower shell, the equipment is simple, and it is convenient and quick to use.

[0025] In the prior art, since a highly integrated main control board is used for data collection and data processing, a cooling fan is usually set up separately for the highly integrated main control board. However, in the present application, since multiple independent PCB boards are used for data collection, a main control board is set up for data processing, and multiple PCB boards are vertically installed above the main control board, if a fan is set up separately for each PCB board and the main control board, it is not only costly, but also unnecessary (for example, when the detection system performs a single or several detections, there is no need to start the fan at all). Therefore, a specific airflow channel is designed in the present application for cooling, for example, the cold air inlet is set on the front side of the horizontally installed main control board, and two fans are respectively set up on the upper rear side of the vertically installed PCB board, so that a low-input and high-output airflow channel is formed in the device, which can not only take into account the main control board installed at the bottom, but also take into account the vertically installed PCB board.

[0026] Further, a targeted heat dissipation scheme is proposed. Specifically, as mentioned above, in the prior art, a fan is set for a high-integration main control board to dissipate heat, while in the present application, heat is dissipated for multiple PCB boards and the main control board. If the multiple PCB boards and the main control board are simply regarded as a whole, for example, a heat dissipation scheme is formulated based only on the overall temperature in the chassis, there will be errors. On the other hand, if only one test is performed, due to the short test time and small workload, it is usually not necessary to start the fan for heat dissipation. However, when batch testing of sequencing chips with different numbers of channels is performed, due to long-term work, it is necessary to start the fan for heat dissipation. If the control strategy of the fan is automatically adjusted based on real-time temperature changes, or a heat dissipation scheme is set separately for batch testing of each number of channels, it is inevitable that the data processing volume and control complexity of the main control board will be increased, thereby increasing the performance requirements of the main control board and increasing the burden on the main control board; and in actual work, batch testing of one number of channels is usually performed at a time. In view of this, in this application, through preliminary experiments, the operating temperature curve for batch detection of each channel is first found based on the temperatures of each PCB board and the main control board monitored in real time, and then the channels are grouped based on the interval between the minimum temperature thresholds in the heating stage of the operating temperature curve (the smaller the interval, the more similar the operating temperature curves may be), so that multiple channels with similar operating temperature curves share a heat dissipation solution, which greatly reduces the complexity of the control solution and reduces the performance requirements of the main control board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale. Obviously, the drawings described below are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without paying creative labor.

[0028] Figure 1 A schematic diagram of the three-dimensional structure of a nanopore detector in a sequencing state according to an exemplary embodiment of the present invention;

[0029] Figure 2 A schematic diagram of the three-dimensional structure of a nanopore detector in an open state (not working) according to an exemplary embodiment of the present invention;

[0030] Figure 3 It is a schematic diagram of a partial structure of a locking mechanism when rotating in an exemplary embodiment of the present invention;

[0031] Figure 4A schematic diagram of a locking mechanism in an open state according to an exemplary embodiment of the present invention;

[0032] Figure 5 is a schematic diagram of another angle when the locking mechanism of an exemplary embodiment of the present invention is in an open state;

[0033] Figure 6 It is an enlarged structural schematic diagram of a locking mechanism of an exemplary embodiment of the present invention when it is in an open state;

[0034] Figure 7 is a schematic diagram of a locking mechanism in a closed state according to an exemplary embodiment of the present invention;

[0035] Figure 8 It is a schematic diagram of an enlarged mechanism when the locking mechanism of an exemplary embodiment of the present invention is in a closed state;

[0036] Fig. 9 A schematic diagram of the placement of a detector chip in the prior art;

[0037] Fig.10 It is a schematic diagram of another detector chip placement position in the prior art;

[0038] Fig.11 A schematic diagram of the three-dimensional structure of a nanopore detector according to an exemplary embodiment of the present invention from another angle;

[0039] Fig.12 A schematic diagram of the bottom structure of a nanopore detector according to an exemplary embodiment of the present invention;

[0040] Fig.13 A schematic diagram of the internal structure of a nanopore detector according to an exemplary embodiment of the present invention;

[0041] Fig.14 It is a schematic diagram of the three-dimensional structure of a detection body according to an exemplary embodiment of the present invention;

[0042] Fig.15 It is a schematic diagram of the three-dimensional structure of the detection body from another angle according to an exemplary embodiment of the present invention;

[0043] Fig.16 It is a schematic diagram of a three-dimensional structure after the detection body and the upper cover are assembled according to an exemplary embodiment of the present invention;

[0044] Fig.17 It is a schematic diagram of the three-dimensional structure of the lower shell of an exemplary embodiment of the present invention;

[0045] Fig.18 This is a schematic diagram of the front structure of a sequencing chip according to an exemplary embodiment of the present invention;

[0046] Fig.19This is a schematic diagram of the back structure of a sequencing chip according to an exemplary embodiment of the present invention;

[0047] Fig. 20 A schematic diagram of the air duct flow direction of a detector according to an exemplary embodiment of the present invention;

[0048] Fig.21 A schematic diagram of the air duct flow direction at another angle of a detector according to an exemplary embodiment of the present invention;

[0049] Fig. 22 A schematic diagram of the air duct flow direction at another angle of the detector of an exemplary embodiment of the present invention

[0050] Fig.23 It is a flow chart of the working temperature curve and heat dissipation scheme of the detector when batch detection is performed on sequencing chips with different numbers of channels obtained through preliminary experiments in the present invention;

[0051] Fig.24 It is a flow chart of an embodiment of the heat dissipation method of the detector in the present invention;

[0052] Fig.25 It is a schematic diagram reflecting the heating stage and the target constant temperature stage in the working temperature curve.

[0053] Markings in the figure: 1. Detection body; 21. Installation plate; 211. Installation position; 22. Main control board; 231. First adapter board; 232. Second adapter board; 24. Fixed board; 25. Connector spring; 26. Connecting board; 27. PCB board; 28. First connector; 29. ​​Second connector; 2. Upper cover; 3. Lower shell; 31. Bottom cover; 4. Locking mechanism; 41. Pressing member; 42. Fastening member; 43. First rotating shaft; 44. Second rotating shaft; 45. Fixed buckle; 46. Elastic member; 47. Torsion spring; 48. Spring pin; 49. Articulated seat; 5. USB interface; 6. Compound switch; 7. Air outlet; 11. Chip; 111. Observation window; 112. Liquid filling port; 113 Knob switch; 114. Spring contact area. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0055] Herein, the suffixes such as "module", "component" or "unit" used to represent elements are used only to facilitate the description of the present invention and have no specific meaning in themselves. Therefore, "module", "component" or "unit" can be used in a mixed manner. Herein, the orientation or position relationship indicated by the terms "upper", "lower", "inner", "outer", "front", "back", "one end", "the other end" and the like are based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance. Herein, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected" and the like should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, an indirect connection through an intermediate medium, or a communication between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances. Herein, "and / or" includes any and all combinations of one or more of the listed related items. Herein, "plurality" means two or more, that is, it includes two, three, four, five, etc.

[0056] Embodiment 1: This embodiment is basically as follows Figure 1-Figure 22 As shown:

[0057] like Figure 1 and Figure 2 The present invention provides a nanopore detector, comprising a detection body, a lower shell detachably connected to the detection body, and an upper cover rotatably arranged on the detection body; wherein the structures of the detection body 1 and the upper cover 2 can be seen in Fig.16 The structure of the lower shell 3 can be seen in Fig.17 .

[0058] like Fig.13 and Fig.14 As shown, the detection body includes a mounting plate 21, a first surface of the mounting plate 21 is provided with a mounting position for mounting a chip, a first adapter plate 231 and a second adapter plate 232 are symmetrically provided on both sides of the mounting position, the first adapter plate 231 and the second adapter plate 232 are connected to the chip through a connector spring 25, and a fixing plate is also provided on the first surface of the mounting plate 21, the first adapter plate 231 and the second adapter plate 232 are located between the fixing plate and the mounting plate 21, and a through hole corresponding to the mounting position is provided on the fixing plate;

[0059] The second surface of the mounting plate is detachably provided with the main control board 22 through a connecting plate 26 with a concave cross section. For example, the main control board 22 is fixed on the connecting plate 26, and then the connecting plate 26 is fixed on the mounting plate 21 through bolts. The second surface of the mounting plate 21 is symmetrically provided with at least two first connectors 28 about the mounting position, and the main control board is provided with at least two second connectors 29 corresponding to the first connectors 28; so that when the PCB board is installed on a corresponding set of the first connectors 28 and the second connectors 29, the PCB board is in a vertical state, that is, the PCB board is parallel to two side walls of the lower shell;

[0060] When the connecting plate 26 is installed on the mounting plate 21, the mounting plate 21, the connecting plate 26 and the main control board 22 together enclose an installation space for installing the PCB board, and the two opposite sides of the PCB board can be respectively inserted into a corresponding set of first connectors 28 and second connectors 29 for fixation; specifically, after the pins on the bottom sides of multiple PCB boards are respectively inserted into the second connectors to be electrically connected to the main control board, the connecting plate is installed on the mounting plate so that the pins on the top side of the PCB board are inserted into the first connector.

[0061] In some embodiments, Fig.10 The main control board is also provided with a USB interface 5 and a multiple switch 6.

[0062] In some embodiments, four first connectors are provided, and correspondingly, four second connectors are also provided, so as to install four PCB boards, and the four PCB boards are arranged in groups of two symmetrically about the installation position.

[0063] An air inlet is provided on the front side wall of the lower housing in the area corresponding to the main control board, such as Fig.11 Air outlets 7 are respectively arranged on the rear side wall of the lower shell corresponding to the area of ​​the PCB board. The horizontal plane position of the air outlet 7 is higher than the horizontal plane position of the air inlet, and a fan for extracting hot air in the shell is arranged at the air outlet.

[0064] like Fig.12 A bottom sealing plate 31 is provided at the bottom of the lower shell.

[0065] like Figure 20-Figure 22 The air inlet is located at the front end of the detector, an air inlet net is provided at the air inlet, the air outlet is located at the rear end of the detector, and a fan is provided at the rear end of the detector. The external air is sucked from the air inlet to the air outlet through the fan and discharged. In this scheme, the air outlet and the air inlet are set high and low, so that the wind can fully cover the surface of the PCB board during the flow process, thereby achieving comprehensive cooling.

[0066] When assembling the nanopore detector in the present application, first insert one side of the PCB board into the first connector, then make the second connector on the main control board correspond to the other side of the PCB board, insert the PCB board into the second connector, and then install the connecting board onto the mounting board, fix the PCB board and the main control board to form a detection body, which is the pre-installation structure mentioned in this article, to facilitate the subsequent combination with the lower shell.

[0067] In some embodiments, a locking mechanism is provided on the fixing plate, as shown in FIG. Figure 4-Figure 8 As shown, the locking mechanism includes a clamping member 41, a first side of the clamping member 41 is rotatably arranged on the fixed plate 24 through a first rotating shaft 43, a second side of the clamping member 41 is movably provided with a buckling member 42 through a second rotating shaft 44, and a first end of the buckling member 42 is fixed to the clamping member 41 through an elastic member 46; correspondingly, a fixing buckle 45 cooperating with the buckling member 42 is arranged on the fixed plate 24; when the locking mechanism is in a locked state, the clamping member and the mounting position jointly form a clamping structure for clamping the chip, and the buckling member hooks the fixing buckle; when the first end of the buckling member is pressed, the second end of the buckling member rotates around the second rotating shaft, and then disengages from the fixing buckle, so that the locking mechanism can be opened. For example, in some embodiments, the elastic member is a spring, and both ends of the spring are respectively fixed to the clamping member and the fastening member, the cross-section of the fastening member is approximately a "C-shaped" lock hook, and the second end of the fastening member and the fixed buckle contact portion are designed as an inclined surface; when the fastening member contacts the side wall of the groove, the first end of the inclined surface portion of the fastening member first contacts the side wall of the groove, and during the rotation of the fastening member, the inclined surface portion of the fastening member moves along the side wall of the groove, so that the second end of the fastening member enters the interior of the groove, and at this time, its inclined surface design can play a guiding role, making the process of the fastening member entering the groove smoother.

[0068] In some embodiments, a groove for accommodating the second end of the fastening member is provided in the fixing buckle, and an opening for the fastening member to extend into the groove is provided on the fixing buckle. When the pressing member is pressed, the pressing member rotates around the first rotation axis, and the second end of the fastening member contacts the side wall of the groove and rotates under its guidance, and the elastic member is compressed at the same time; when the pressing member is pressed into place, the elastic member resets, driving the fastening member to reset, and the second end of the fastening member abuts against the inner wall of the groove, so that the pressing member and the mounting position together form a clamping structure for clamping the chip; when the first end of the fastening member is pressed, the elastic member is compressed, and the fastening member rotates around the second rotation axis, so that the fastening member can be separated from the fixing buckle.

[0069] In some embodiments, see Fig.18 and Fig.19 The front side of the chip is provided with a knob switch 113, a liquid filling port 112 and an observation window 111, and the back side of the chip is symmetrically provided with two spring contact areas.

[0070] In some embodiments, the groove includes a first groove arranged along the height direction of the sequencer, and a second groove formed by extending the first groove in the width direction of the sequencer, and the first end of the first groove is provided with an opening. When the pressing member is pressed to lock, the fastener is first pushed open along the side wall of the opening (at this time, the fastener rotates around the second rotating shaft, and the elastic member contracts), and the second end of the fastener extends into the first groove. When the inclined surface portion of the fastener completely enters the first groove, the fastener is no longer subjected to the force of the groove side wall (such as the side wall of the opening), and the fastener is reset, enters the second groove and hooks the inner wall of the second groove to achieve locking. In specific use, when the chip needs to be pressed and fixed, the chip is placed in the installation position, and the second side of the pressing member is pressed to make the pressing member rotate around the first rotating shaft. Since the end of the buckle member that contacts the fixed buckle adopts a bevel design, when the buckle member contacts the fixed buckle, the buckle member rotates clockwise around the second rotating shaft, and the spring is compressed at this time; when the pressing member is pressed into place, the second end of the buckle member is located inside the groove, and the spring reset will drive the buckle member to rotate counterclockwise and reset, and finally the second end of the buckle member hooks the fixed member to complete the entire locking action. In some embodiments, a hinge seat is fixed on the fixed plate, and the first rotating shaft is rotatably arranged on the hinge seat.

[0071] In some embodiments, Figure 5 The first rotating shaft is also provided with (specifically, it can be sleeved with) a torsion spring 47, and the two ends of the torsion spring 47 are respectively fixed to the two parts of the pressing member 41; when the locking mechanism is in the locked state, the torsion spring 47 is in a compressed state; when the first end of the buckle 42 is pressed, the buckle 42 is separated from the fixing buckle 45, and the torsion spring 47 returns to the initial state, thereby driving the pressing member 41 back to the open state. By providing a torsion spring, the pressing member can automatically rebound after the locking mechanism is opened, and remain in the position after rebounding without falling.

[0072] In some embodiments, the rotation angle range of the pressing member is 0°-90°, wherein when the pressing member is in an open state, the angle between the pressing member and the plane where the fixing plate is located is 60°-90°.

[0073] In some embodiments, Figure 4 and Figure 5 A spring pin 48 is provided on the pressing member, and the locking mechanism, the spring pin and the fixing plate are all made of metal. When the locking mechanism is in the locking state, the free end of the spring pin abuts against the fixing buckle. On the one hand, the spring pin can generate a buffering elastic force on the pressing member and the fixing plate when they are in contact, so as to reduce wear. On the other hand, a conductor can be formed between the locking mechanism and the fixing plate, thereby shielding some interference signals to a certain extent and improving the detection accuracy of the detector.

[0074] In some embodiments, the fasteners and fixing buckles are made of stainless steel to ensure their strength requirements and prevent them from rapid wear and deformation during frequent locking and tightening. In addition, the remaining structures of the nanopore detector are made of aluminum alloy, which makes it lighter and has better electromagnetic shielding effect.

[0075] In some embodiments, a shock-absorbing foam is disposed on the fixed plate and is located at the first rotating shaft to prevent the pressing member from colliding with the fixed plate during rotation, thereby playing a role of buffering and silencing.

[0076] In some embodiments, the height of the mounting position is less than the thickness of the chip, so that when the locking mechanism is in a locked state, the first surface of the pressing member abuts against the first surface of the chip. Fig. 9 and Fig.10 Two chip installation methods are listed. One is to build the chip into the entire instrument. Although it can shield the signal, it is inconvenient to operate; the other chip is higher than the operating platform, which will cause certain interference. The test body in this scheme adopts a sunken design (setting a mounting position on the mounting plate), so that the first surface of the chip and the first surface of the fixing plate are on the same horizontal plane, which effectively avoids the above problems.

[0077] With the locking mechanism, no matter in the locking process or the unlocking process, you only need to press lightly (press the pressing member when locking, and press the first end of the buckle member when unlocking), which is convenient and quick to use.

[0078] In some embodiments, a first magnetic block is disposed on the upper cover, and a magnetic metal piece that cooperates with the first magnetic block is disposed on the fixed plate. For example, the magnetic metal piece can be an iron block, and the specific material is Q235 with chrome plating on the surface; the upper cover is opened and closed by magnetic attraction, which is convenient and quick, and the sealing effect in the detection body is good.

[0079] In summary, the present application provides a "reverse installation" type low-cost detector, in which the detection main body is pre-installed into a whole, and then assembled with the lower shell, which greatly reduces the production cost and facilitates subsequent debugging and maintenance.

[0080] Embodiment 2: Based on the above nanopore detector, the present invention also provides a heat dissipation method for the nanopore detector, see Fig.23 and Fig.24 , the heat dissipation method comprises the following steps:

[0081] S101 obtains the number of channels of the sequencing chips for batch testing in the current batch input by the user. In some embodiments, the number of channels of the sequencing chips for batch testing in the current batch can be input through a human-machine interaction module (or input module) such as a touch screen or input keys electrically connected to the main control board, and fed back to the main control board for data processing.

[0082] S102 matches the corresponding channel number group and its corresponding heat dissipation scheme in the database according to the number of channels, and controls the operation of two fans in the nanopore detector according to the matched heat dissipation scheme. In some embodiments, the main control board automatically matches the corresponding heat dissipation scheme in the database according to the number of channels input by the user in step S101, and controls the operation of the fans for heat dissipation according to the matched heat dissipation scheme. In some embodiments, the heat dissipation scheme includes: the control strategies corresponding to the heating stage and the target constant temperature stage, the start timing of the corresponding control strategy in the heating stage, and the adjustment timing of switching from the control strategy in the heating stage to the control strategy in the target constant temperature stage.

[0083] In some embodiments, the channel number grouping in the database and the corresponding heat dissipation solution are obtained in advance through preliminary experiments, specifically, including the steps of:

[0084] S201 inputs the number of channels i for the first batch of batch testing according to the preset batch testing plan. Preferably, the number of channels i=1,2,3...386. S202 monitors the temperatures T11, T12, T13, T14 of the four PCB boards and the temperature T2 of the main control board in the nanopore detector in real time. In some embodiments, each PCB board and the main control board are each provided with a temperature sensor to monitor their temperature in real time. Since the four PCB boards are mainly responsible for data acquisition, and the main control board is mainly responsible for data processing, generally speaking, in the initial stage of batch testing, the temperature of the main control board will be higher than the temperature of the PCB board. However, since the cold air inlet is arranged on one side of the main control board, and multiple PCB boards are installed vertically, in actual application, especially with the increase of time, the temperature of the PCB board may gradually be higher than the temperature of the main control board. That is, in the whole process from the beginning to the end of the batch test, the temperature of the four PCB boards and the temperature of the main control board are not only changing, but also, the temperature of the main control board may be the highest for a period of time, and the temperature of a certain PCB board may be the highest for a period of time. Therefore, if the normal operation of the entire device is to be guaranteed, it is necessary to cool it down. Therefore, in order to ensure the normal operation of the entire device during the batch testing process, the temperatures of the PCB board and the main control board are collected separately. It only needs to be that any one of them is greater than the preset minimum temperature threshold T0 of the heating stage, that is, the fan is controlled to be turned on for cooling. S203 determines whether the maximum temperature value Tmax {T11, T12, T13, T14, T2} among the five temperature values ​​is greater than or equal to the minimum temperature threshold value T0 of the preset heating stage. If so, execute step S204; otherwise, execute step S202. In some embodiments, each PCB board, main control board, or the entire chassis has its own temperature working curve (that is, as long as the temperature of the PCB board / the main control board is on the temperature working curve, it can work normally). Specifically, see Fig.25 The temperature working curve includes a heating stage and a constant temperature stage, wherein the heating stage means that when the temperature reaches a certain value (i.e., the minimum temperature value T0 of the heating stage), it is necessary to start cooling measures (for example, turning on the fan for cooling), but because it is in a working state, even under cooling measures, its temperature will continue to rise, but under the action of cooling measures, its temperature will eventually stabilize within a certain range, that is, it reaches the constant temperature stage, and accordingly, the minimum temperature value T0' in the target constant temperature stage is also the maximum temperature value of the heating stage.

[0085] However, as mentioned above, the detection system in this embodiment includes multiple vertically mounted PCB boards and a horizontally mounted main control board. During the batch detection process, if only a temperature sensor is set in the chassis to monitor the chassis temperature, and the fan is controlled to execute the corresponding heat dissipation solution according to the chassis temperature, while ignoring the differences between each board and the dynamic changes in the temperature difference between each other, errors are inevitable. For example, the temperature of a certain board is higher than the chassis temperature, resulting in a jammed operation, that is, the problem of poor heat dissipation effect.

[0086] In view of this, in this embodiment, the working temperature curves of sequencing chips with different numbers of channels for batch testing are determined by preliminary tests, and then grouped, for example, those with similar working temperature curves are grouped together, and then this group shares a control strategy. Specifically, the maximum temperature values ​​Tmax{T11, T12, T13, T14, T2} in each PCB board and main control board monitored in real time are compared with the preset minimum temperature threshold value T0 in the heating stage, so as to determine the timing of starting the fan. Preferably, the preset minimum temperature threshold value T0 in the heating stage is the smallest of the minimum temperature values ​​in the heating stage corresponding to each PCB board and the main control board.

[0087] S204 starts the fan to cool down, and controls the fan operation according to the preset control strategy, and records the minimum temperature threshold T0 of the corresponding heating stage. i In some embodiments, when the temperature value of any PCB board or main control board reaches a preset minimum temperature threshold value T0 i When the temperature of any PCB board or main control board reaches the preset minimum temperature threshold value T0, the fan is started to cool down. In some embodiments, the above control strategy includes the speed of the fan. iTherefore, it will be assumed that the current temperature is in the heating stage, that is, as the batch detection proceeds, the temperature of each board may begin to rise continuously, and accordingly, the fan speed will be adjusted in real time, for example, the wind speed is increased, that is, the fan speed in the heating stage is dynamically changed (for example, within a range), which is a conventional technical means in this field and will not be repeated here. S205 determines whether the maximum temperature value Tmax{T11, T12, T13, T14, T2} among the five temperature values ​​monitored in real time is gradually stabilizing. If so, it is determined that the target constant temperature stage has been reached, and step S206 is executed; otherwise, continue to monitor and execute step S205 until it is determined that the maximum temperature value Tmax{T11, T12, T13, T14, T2} among the five temperature values ​​is gradually stabilizing. In some embodiments, stabilization means that according to the temperature values ​​of each PCB board and the main control board monitored in real time, when the maximum temperature value Tmax among the five temperature values ​​almost no longer changes from a certain moment, or the temperature difference between the upper and lower values ​​is within a preset range, it means that the current temperature is in the constant temperature stage. Therefore, it is necessary to record the aforementioned moment and its corresponding fan control strategy. When entering the constant temperature stage, even if the real-time temperature of each board is dynamically changing, it is always stabilizing, and will not have a large change like the heating stage. As for the five boards, in this embodiment, it is not necessary for all boards to enter their respective constant temperature stages before determining that the entire system has entered the constant temperature stage. Instead, it is only necessary for the maximum value of the temperature values ​​of the five boards to gradually stabilize (of course, if the maximum value of the temperature values ​​of the five boards has not stabilized for a long time, the manual may be faulty), and it can be determined as the constant temperature stage. This can simplify the control method on the one hand, and reduce costs on the other hand. S206 obtains the current control strategy and records the minimum temperature threshold T0 for reaching the target constant temperature stage. i ' at the second moment t2. S207 repeats the above steps S201 to S206 until the corresponding working temperature curve and the corresponding heat dissipation scheme for batch testing of sequencing chips of each channel number are obtained. In some embodiments, the working temperature curve of the detection system is drawn based on the maximum value of the five temperature values ​​monitored in real time during the heating stage and the maximum value of the five temperature values ​​monitored in real time during the target constant temperature stage. In some embodiments, the heat dissipation scheme corresponding to the working curve includes the control strategy of the heating stage and the minimum temperature threshold T0 i The corresponding first moment t1, the control strategy of the target constant temperature stage and the minimum temperature threshold T0 i' corresponds to the second moment t2; wherein t1 is actually the time to turn on the fan. S208 arranges the first moments t1 corresponding to the sequencing chips with different numbers of channels in order from large to small. S209 groups multiple first moments t1 according to a preset interval threshold to obtain multiple groups. In some embodiments, grouping multiple first moments t1 according to a preset interval threshold means comparing whether the time difference between the two adjacent first moments t1 is less than or equal to the preset interval threshold, and if so, dividing them into one group. Since they are all the same four PCB boards and main control board, if the t1 moments are relatively close, it actually means that their operating temperature curves are relatively similar, so the same control strategy can be used to control the fan for heat dissipation. Of course, in other embodiments, even if the t1 moments are relatively close, the t2 moments are quite different. For example, after the second moments t2 corresponding to the sequencing chips with different numbers of channels are arranged in order from large to small, if the time difference between the two adjacent second moments t2 is greater than the corresponding preset interval threshold, they will be removed from the group. S210 uses the smallest first moment t1 in each group as the time to turn on the fan corresponding to the heating stage when batch testing is performed on sequencing chips with all the channels in the corresponding group, and uses the control strategy with the smallest time interval between the first moment t1 and the second moment t2 in the corresponding group as the control strategy corresponding to the heating stage when batch testing is performed on sequencing chips with all the channels in the corresponding group. In some embodiments, the control strategy with the smallest time interval between the first moment t1 and the second moment t2 indicates that the control strategy may have the best heat dissipation effect in the group, so the group adopts the control strategy.

[0088] In other embodiments, after step S204, the step is also included: S301 determines in real time whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the first preset temperature difference threshold. If so, adjust the control strategy, for example, increase the rotation speed of the two fans; otherwise, maintain the current control strategy.

[0089] Similarly, after step S206, the step is also included: S302 is to determine in real time whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the second preset temperature difference threshold. If so, adjust the control strategy, for example, increase the rotation speed of the two fans; otherwise, maintain the current control strategy.

[0090] Of course, in other embodiments, the working temperature curve of the sequencing chip during batch detection can also be obtained based on the number of channels monitored in real time in the preliminary experiment (the entire curve is drawn based on the real-time data of the maximum temperature value Tmax'{T11, T12, T13, T14, T2} of the PCB board and the main board), and then, the similarity between the various working temperature curves is calculated using the image data processing method, and the curves whose similarity meets the preset threshold are divided into a group, and the same group shares a heat dissipation solution (preferably, a heat dissipation solution with the smallest interval between t1 and t2 is selected).

[0091] Embodiment 3: Based on the above-mentioned nanopore detector and heat dissipation method, the present invention also provides a nanopore detection system, which includes the nanopore detector of the above-mentioned embodiment 1, and also includes a user interaction module for data communication with the main control board in the nanopore detector, for allowing the user to select a working mode and input the number of channels of the sequencing chip currently undergoing batch detection; wherein the main control board includes: a database for storing the channel number groupings and their corresponding heat dissipation schemes obtained in advance through preliminary experiments; the heat dissipation scheme includes: the control strategies corresponding to the heating stage and the target constant temperature stage, the start timing of the corresponding control strategy in the heating stage, and the adjustment timing of switching from the control strategy in the heating stage to the control strategy in the target constant temperature stage; wherein the method of obtaining the channel number groupings and their corresponding heat dissipation schemes through preliminary experiments is as described in the above-mentioned embodiment 2; a heat dissipation scheme matching module for matching the corresponding channel number groupings and their corresponding heat dissipation schemes in the database according to the number of channels input by the user after the user selects the batch test working mode; a fan control module for controlling the fan operation according to the matched heat dissipation scheme.

[0092] In some embodiments, the main control board also includes: a pre-experimental data processing module, which is used to determine whether the maximum temperature value Tmax{T11, T12, T13, T14} among the temperatures T11, T12, T13, T14 of the four PCB boards and the temperature T2 of the main board monitored in real time is greater than or equal to the minimum temperature threshold T0 of the preset heating stage. If so, the fan control module is triggered to start the fan for cooling, and the fan operation is controlled according to the preset control strategy, and the minimum temperature threshold T0 of the corresponding heating stage is recorded. i or, determine whether the maximum temperature value Tmax{T11, T12, T13, T14, T2} among the four PCB board temperatures T11, T12, T13, T14 and the mainboard temperature T2 monitored in real time gradually tends to be stable. If so, determine that the target constant temperature stage is reached, obtain the current control strategy, and record the minimum temperature threshold value T0 of the target constant temperature stage. i'The second moment t2; repeat until the operating temperature curve and the corresponding heat dissipation scheme corresponding to the batch test of the sequencing chip with each channel number are obtained; preferably, the batch test of each channel number is tested multiple times, and then the data is fitted to obtain the operating temperature curve corresponding to the batch test of the sequencing inquiry with the number of channels;

[0093] A grouping module is used to arrange the first moments t1 corresponding to sequencing chips with different numbers of channels in order from large to small, and group multiple first moments t1 according to a preset interval threshold to obtain multiple groups, and use the smallest first moment t1 in each group as the timing for turning on the fan corresponding to the heating stage when batch testing is performed on sequencing chips with all the numbers of channels in the corresponding group, and use the control strategy with the smallest time interval between the first moment t1 and the second moment t2 in the corresponding group as the control strategy corresponding to the heating stage when batch testing is performed on sequencing chips with all the numbers of channels in the corresponding group, and finally enter it into the above-mentioned database.

[0094] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0095] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, which all fall within the protection of the present invention.

Claims

1. A nanopore detection system, characterized in that: The nanopore detector comprises a detection body, a lower shell detachably connected to the detection body, and an upper cover rotatably arranged on the detection body; The detection body includes a mounting plate, a first surface of the mounting plate is provided with a mounting position for mounting a chip, a first adapter plate and a second adapter plate are symmetrically provided on both sides of the mounting position, and the first adapter plate and the second adapter plate are connected to the chip through a connector spring. The second surface of the mounting plate is detachably provided with a main control board through a connecting plate with a concave cross section, the second surface of the mounting plate is symmetrically provided with at least two first connectors about the mounting position, and the main control board is provided with at least two second connectors corresponding to the first connectors; after the pins on the bottom side of a plurality of PCB boards are respectively inserted into the second connectors to be electrically connected with the main control board, the connecting plate is installed on the mounting plate so that the pins on the top side of the PCB board are inserted into the first connectors; An air inlet is provided on the front side wall of the lower shell in an area corresponding to the main control board, and at least two air outlets are provided on the rear side wall of the lower shell in an area corresponding to the PCB board, the horizontal plane position of the air outlets is higher than the horizontal plane position of the air inlet, and a fan for extracting hot air in the shell is provided at the air outlets; The nanopore detection system further includes: a user interaction module for data communication with the main control board, for allowing the user to select a working mode and input the number of channels of the sequencing chip currently undergoing batch detection; wherein the main control board includes: A database is used to store the channel number groups obtained in advance through preliminary experiments and their corresponding heat dissipation solutions; the heat dissipation solutions include: the control strategies corresponding to the temperature rise stage and the target constant temperature stage, the start timing of the control strategy corresponding to the temperature rise stage, and the adjustment timing of switching from the control strategy of the temperature rise stage to the control strategy of the target constant temperature stage; A heat dissipation scheme matching module is used to match the corresponding channel number group and its corresponding heat dissipation scheme in the database according to the number of channels input by the user after the user selects the batch test working mode; The fan control module is used to control the operation of the fan according to the matched heat dissipation solution.

2. A nanopore detection system according to claim 1, characterized in that: A fixing plate is also disposed on the first surface of the mounting plate, the first adapter plate and the second adapter plate are located between the fixing plate and the mounting plate, and the fixing plate is provided with through holes corresponding to the mounting positions.

3. A nanopore detection system according to claim 2, characterized in that: The fixing plate is provided with a locking mechanism, the locking mechanism comprising a pressing member, a first side of the pressing member is rotatably provided on the fixing plate via a first rotating shaft, a second side of the pressing member is movably provided with a buckling member via a second rotating shaft, a first end of the buckling member is fixed to the pressing member via an elastic member; correspondingly, a fixing buckle matched with the buckling member is provided on the fixing plate; When the locking mechanism is in a closed state, the pressing member and the mounting position together form a clamping structure for clamping the chip, and the buckling member hooks the fixing buckle; When the first end of the buckling member is pressed, the second end of the buckling member rotates around the second rotating shaft and then disengages from the fixing buckle, thereby opening the locking mechanism.

4. A nanopore detection system according to claim 3, characterized in that: The first rotating shaft is also provided with a torsion spring, and both ends of the torsion spring are respectively fixed to the pressing member; When the locking mechanism is in a closed state, the torsion spring is in a compressed state; when the first end of the buckle is pressed, the buckle is disengaged from the fixing buckle, and the torsion spring returns to its initial state, thereby driving the clamping member back to an open state.

5. A nanopore detection system according to claim 4, characterized in that: The pressing member is provided with a spring pin, and the locking mechanism, the spring pin and the fixing plate are all made of metal; When the locking mechanism is in a closed state, the free end of the spring pin abuts against the fixing buckle, so that a conductor is formed between the locking mechanism and the fixing plate.

6. A nanopore detection system according to claim 3, characterized in that: The height of the mounting position is smaller than the thickness of the chip, so that when the locking mechanism is in a locked state, the first surface of the pressing member abuts against the first surface of the chip.

7. A nanopore detection system according to any one of claims 2 to 6, characterized in that: The upper cover is provided with a first magnetic block, and the fixing plate is provided with a magnetic metal piece matched with the first magnetic block.

8. A heat dissipation method for a nanopore detector, characterized in that: The nanopore detector is a nanopore detector in a nanopore detection system according to any one of claims 1 to 7, and the heat dissipation method specifically comprises the steps of: S101 obtains the number of channels of the sequencing chip for batch detection in the current batch input by the user; S102 matches the corresponding channel number group and its corresponding heat dissipation solution in the database according to the number of channels, and controls the operation of two fans in the nanopore detector according to the matched heat dissipation solution; The channel number grouping and the corresponding heat dissipation solution are obtained in advance through preliminary experiments, specifically, including the steps of: S201 inputs the number of channels i for the first batch of batch testing according to the preset batch testing plan; S202 monitors in real time the temperatures T11, T12, T13, T14 of four PCB boards and the temperature T2 of the main control board in the nanopore detector; S203 determines whether the maximum temperature value Tmax {T11, T12, T13, T14, T2} among the five temperature values ​​is greater than or equal to the minimum temperature threshold value T0 of the preset heating stage. i , if yes, go to step S204; otherwise go to step S202; S204 starts the fan to cool down, and controls the fan operation according to the preset control strategy, and records the minimum temperature threshold T0 of the corresponding heating stage. i At the first moment t1, execute step S205; S205 determines whether the maximum temperature value Tmax{T11, T12, T13, T14, T2} among the five temperature values ​​monitored in real time tends to be stable. If so, it is determined that the target constant temperature stage is currently reached, and step S206 is executed; otherwise, the monitoring is continued and step S205 is executed until it is determined that the target constant temperature stage is reached; S206 obtains the current control strategy and records the minimum temperature threshold T0 of the target constant temperature stage. i 'The second moment t2; S207 Repeat the above steps S201 to S206 until the corresponding working temperature curve and the corresponding heat dissipation scheme for batch testing of sequencing chips with each number of channels are obtained; the heat dissipation scheme includes the control strategy of the heating stage and the minimum temperature threshold T0 i The corresponding first moment t1, the control strategy of the target constant temperature stage and the minimum temperature threshold T0 i 'The corresponding second moment t2; S208 arranges the first moments t1 corresponding to sequencing chips with different numbers of channels in descending order; S209 groups the multiple first moments t1 according to a preset interval threshold to obtain multiple groups; S210 uses the smallest first moment t1 in each group as the timing for turning on the fan during the heating phase when batch testing the sequencing chips of all the channels in the corresponding group is performed, and uses the control strategy with the smallest time interval between the first moment t1 and the second moment t2 in the corresponding group as the control strategy during the heating phase when batch testing the sequencing chips of all the channels in the corresponding group is performed.

9. The heat dissipation method of a nanopore detector according to claim 8, characterized in that: After executing step S204, the step also includes: S301 real-time judgment whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the first preset temperature difference threshold. If so, increase the rotation speed of the two fans.

10. The heat dissipation method of a nanopore detector according to claim 8, characterized in that: After executing step S206, the process also includes step: S302, determining in real time whether the temperature difference between the maximum temperature value Tmax'{T11, T12, T13, T14} of the four PCB boards and the temperature T2 of the mainboard is greater than or equal to the second preset temperature difference threshold value; if so, increasing the rotation speed of the two fans.

Images